JP3750433B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component on a substrate.
[0002]
[Prior art]
An electronic component mounting apparatus for mounting an electronic component such as a semiconductor chip on a substrate is provided with an electronic component supply unit in which a large number of parts feeders for supplying the electronic component are provided. Picked up by the transfer head and mounted on the substrate. When there are many types and quantities of electronic components to be mounted on the same mounting stage, not only one set of electronic component supply unit and transfer head, but also multiple sets of supply units that perform mounting operations independently of each other The transfer head may be arranged on the same mounting stage. In this case, each transfer head picks up an electronic component from the supply unit and mounts it on the substrate.
[0003]
[Problems to be solved by the invention]
By the way, when mounting operations on the same substrate with a plurality of transfer heads, the mounting operation load of each transfer head is not necessarily equal, and a large mounting operation load may be generated by the transfer head on either side. is there. For this reason, the transfer head with the smaller mounting operation load completes the mounting operation before the other transfer heads. For this reason, conventionally, the transfer head on the side where the mounting operation has been completed first is in a standby state until the other transfer head completes the mounting operation, causing a waste time. This wasted time has resulted in an increase in the overall tact time.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and mounting method that can reduce the tact time by eliminating dead time.
[0005]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that picks up an electronic component from a supply unit that supplies the electronic component by a transfer head and mounts the electronic component on a substrate, and a plurality of the supply units; A plurality of transfer heads provided corresponding to these supply units and picking up electronic components from each supply unit , and a temporary placement stage for receiving electronic components from these transfer heads and holding them temporarily on the placement unit The temporary placement stage is disposed closer to the substrate conveyance path than the supply unit, and the arrangement pitch of the placement unit is equal to the arrangement pitch of the nozzles of the transfer head .
[0006]
The electronic component mounting method according to claim 2 is an electronic component mounting method for mounting an electronic component on a substrate by the electronic component mounting apparatus according to claim 1, wherein the electronic component is mounted on the substrate by one transfer head. If the mounting operation to be mounted is completed before the mounting operation by another transfer head, the electronic component for the next mounting onto the substrate newly loaded from the supply unit is picked up by the one transfer head and temporarily mounted. The operation for preparing the next mounting part to be temporarily placed on the placing stage is performed.
[0007]
According to the present invention, if the mounting operation for mounting the electronic component on the substrate by one transfer head is completed earlier than the mounting operation by the other transfer head, the next transfer head performs the next operation from the supply unit. By performing the next mounting component preparation operation of picking up the electronic components for mounting and temporarily placing them on the temporary placement stage, it is possible to effectively use the standby time and reduce the overall tact time.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus, and FIG. 3 is a sectional view of a temporary placement stage of the electronic component mounting apparatus. is there.
[0009]
First, the structure of the electronic component mounting apparatus will be described with reference to FIGS. 1 and 2, a transport path 2 is disposed in the center of the base 1 in the X direction. The conveyance path 2 conveys the board 3 and positions it at the mounting position of the electronic component. On both sides of the conveyance path 2, a plurality of electronic component supply units (first supply unit 4A and second supply unit 4B) are arranged, and each of the supply units 4A and 4B has a large number of tape feeders. 5 are arranged side by side. The tape feeder 5 accommodates electronic components held on the tape, and supplies the electronic components by pitch feeding the tape. Of course, electronic components may be supplied from another component supply device such as a tray feeder.
[0010]
Y-axis tables 6A and 6B are disposed on both ends of the upper surface of the base 1, and two X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. Transfer heads 8A and 8B are mounted on the X-axis tables 7A and 7B, respectively.
[0011]
By driving the X-axis table 6A and the Y-axis table 7A in combination, the transfer head 8A moves horizontally, picks up an electronic component from the first supply unit 4A by the nozzle 8a (see FIG. 3), and transfers it to the transport path 2. Mounting on the positioned substrate 3. Similarly, by driving the X-axis table 6B and the Y-axis table 7B in combination, the transfer head 8B picks up electronic components from the second supply unit 4B and mounts them on the substrate 3. A first recognizing device 9A and a second recognizing device 9B are disposed on the route from the first supply unit 4A and the second supply unit 4B to the conveyance path 2, respectively. These recognition devices 9A and 9B recognize the electronic components held by the transfer heads 8A and 8B from below. By this recognition operation, identification of electronic components and detection of displacement are performed.
[0012]
Temporary placement stages 10A and 10B are disposed on both sides of the transport path 2 between the first supply unit 4A and the second supply unit 4B, respectively. As shown in FIG. 3, the temporary placement stages 10A and 10B are configured by arranging three placement portions 11 on which electronic components are placed and held by vacuum suction, and the temporary placement stage 10A is a transfer head. within the movement range of 8A, temporary stage 10B is in the range of movement of the transfer head 8 B.
[0013]
As shown in FIG. 3, the three electronic components P picked up by the transfer head 8A from the first supply unit 4A can be simultaneously placed and held on the placement units 11 of the temporary placement stage 10A. it can. Here, the arrangement pitch between the placement units 11 of the temporary placement stage 10A is set equal to the nozzle arrangement pitch of the first transfer head 8A. Therefore, the electronic components P held by the three placement units 11 on the temporary placement stage 10A can be collectively picked up by the transfer head 8A by one pickup operation. The same applies to the temporary placement stage 10B on which the parts picked up from the second supply unit 4B are placed.
[0014]
The electronic component mounting apparatus is configured as described above, and the operation will be described below. First, in FIG. 2, the substrate 3 is positioned at a mounting position on the transport path 2. Thereafter, the mounting operation is started. In the mounting operation, electronic components are picked up from the first supply unit 4A by the transfer head 8A and from the second supply unit 4B by the transfer head 8B. Next, the electronic component held by the transfer head 8A is recognized by the first recognition device 9A, and the electronic component held by the transfer head 8B is recognized by the recognition device 9B, and then the predetermined information on the substrate 3 is obtained. Implemented at the implementation point.
[0015]
In the process of the mounting operation described above, if the mounting operation by one of the transfer heads 8A and 8B is completed first, for example, if the mounting operation by the transfer head 8A is completed first. The transfer head 8A picks up an electronic component for mounting on a substrate newly loaded after completion of mounting of the substrate, that is, a component for next mounting from the first supply unit 4A, and mounts it on the temporary placement stage 10A. And prepare for the next mounting. The transfer head 8B completes the predetermined component mounting operation while the transfer head 8A performs the next mounting component preparation operation.
[0016]
Thereafter, when the mounted substrate is unloaded and a new substrate to be mounted is loaded, the transfer head 8A immediately collects electronic components already prepared for next mounting on the temporary placement stage 10A. Pick up and transfer onto substrate 3. As a result, the transfer head 8A can pick up an electronic component from the temporary placement stage 10A disposed closer to the transport path 2 than the supply unit 4A , thereby reducing the number of reciprocations with the supply unit. Therefore, the overall mounting tact time can be shortened.
[0017]
As described above, the present embodiment provides a temporary placement stage for receiving electronic components from the transfer head and temporarily placing them in an electronic component mounting apparatus that mounts on the same mounting stage by a plurality of transfer heads. If one transfer head completes the mounting operation at an early stage, the preparatory operation to place the electronic component for the next mounting on the temporary placement stage is performed without placing the transfer head in the standby state. It is. Thereby, it is possible to improve the mounting efficiency by eliminating the useless waiting time that has conventionally occurred.
[0018]
In this embodiment, an example in which a temporary placement stage is provided for each transfer head has been described. However, a common temporary placement stage may be provided within a common movable range of the transfer heads 8A and 8B. Good. As a result, the electronic component picked up from the supply unit on one side can be mounted by the transfer head on the other side, and more diverse and flexible mounting operations are possible.
[0019]
【The invention's effect】
According to the present invention, if the mounting operation for mounting the electronic component on the substrate by one transfer head is completed earlier than the mounting operation by the other transfer head, the next transfer head performs the next operation from the supply unit. Since the mounting component is picked up and temporarily mounted on the temporary placement stage, the next mounting component preparation operation is performed, so the dead time is eliminated by effectively using the extra time of the transfer head that has already completed the mounting operation. In addition, the overall tact time can be shortened.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. Sectional view of temporary placement stage of electronic component mounting device
2 Transport path 3 Substrate 4A First supply unit 4B Second supply unit 5 Tape feeder 8A, 8B Transfer head 10 Temporary placement stage 11 Placement unit

Claims (2)

An electronic component mounting apparatus that picks up an electronic component from a supply unit that supplies the electronic component by a transfer head and mounts the electronic component on a substrate, the plurality of supply units, and each supply provided corresponding to these supply units A plurality of transfer heads for picking up electronic components from the unit, and a temporary placement stage for receiving the electronic components from these transfer heads and temporarily holding them on the placement unit, wherein the temporary placement stage is the supply unit The electronic component mounting apparatus is characterized in that the arrangement pitch of the placement units is equal to the arrangement pitch of the nozzles of the transfer head. An electronic component mounting method for mounting an electronic component on a substrate by the electronic component mounting apparatus according to claim 1, wherein the mounting operation for mounting the electronic component on the substrate by one transfer head is performed by another transfer head. If completed before the operation, the next mounting component preparation operation of picking up an electronic component for the next mounting on the substrate newly loaded from the supply unit by the one transfer head and temporarily placing it on the temporary placement stage is performed. An electronic component mounting method characterized in that the electronic component mounting is performed.