JP3754430B2 - Optical receiver and manufacturing method thereof - Google Patents

Description

  The present invention relates to an optical receiver called a so-called mold type light receiving module and a method for manufacturing the same.

Conventionally, in an optical receiver used for an optical remote control receiver or the like, a lead frame is used for miniaturization, and a light receiving element is mounted on the frame and resin molded. At this time, the light receiving element is shielded as a noise countermeasure. For example, in Patent Document 1, another frame is stacked on a lead frame to form a shield plate.
Japanese Patent Laid-Open No. 9-18025

  However, it is difficult to insert and configure a single shield plate inside the mold resin. For example, if the shield plate is tilted during assembly placement in a narrow resin volume, or if the shield plate vibrates due to the molding resin molding process, the internal circuit may be short-circuited or damaged due to contact with the light receiving element or drive element. It is inconvenient. Even if it does not lead to such damage, the shield location with respect to the light receiving surface is shifted to cover the light receiving surface or expose the circuit surface, which is disadvantageous in that the effect is halved.

Optical receiver of the present invention, as described in claim 1, in an optical receiver which is molded in place and the light-receiving element driving circuit elements in the frame resin, the frame is wider element placement portion in area in the center A plurality of lead wires are arranged above and below the projection frame, and a protruding frame that protrudes in a direction substantially orthogonal to the extending direction of the lead wires is supported by the element placement portion by a narrow support portion. The projection frame is provided with a through hole for exposing the light receiving surface of the light receiving element and a flat plate portion covering the drive circuit element, and the projection frame is bent so as to sandwich the light receiving element and fixed by the mold resin. And

According to a second aspect of the present invention, there is provided a method of manufacturing an optical receiver in which a light receiving element and a drive circuit element are arranged on a frame and molded with resin. A large-area element arrangement part is provided, and a plurality of lead wires are arranged above and below the element arrangement part, and a protruding frame that protrudes in a direction substantially perpendicular to the extending direction of the lead wire is supported by a narrow support part. The protrusion frame is bent so as to sandwich the light receiving element.

  According to the present invention, it is possible to provide an optical receiver that is easy to assemble, is robust, and has a very high shielding effect.

  FIG. 1 is a perspective view of an optical receiver according to the present invention, in which part of the broken line, whose configuration is complicated for explanation, is omitted, and the description thereof will be made with reference to other drawings. FIG. 2 is a plan view of the main part of the lead frame material used in the present invention, and FIGS. 3A and 3B are plan views of the main part for explaining the assembly. In any of the drawings, wire bond lines for wiring the elements are omitted. In this optical receiver, a light receiving element 1 and a driving circuit 2 (semiconductor element) (hereinafter referred to as a driving circuit element) are arranged on a frame 3 and molded with a resin 4.

  When the frame 3 is formed as a lead frame material, as shown in FIG. 2, an element mounting portion 31 having a relatively large surface area is provided at the center, and a plurality of frames 3 are formed toward the upper and lower sides, that is, toward the lead wire bridging portion 30. Lead wires 32 are arranged. The lead wires are illustrated as being substantially linear with two and three predetermined intervals respectively. For example, after separation of the bridging portion 30, individual parts are formed, and then some lead wire is formed, for example, When it is known that it is desired to widen the interval, the lead wire 32 may be deformed in advance so as to have a desired shape at the time of punching.

  A chip component 5 is fixed in the vicinity of the frame 3 where the light receiving element 1 is placed. This is necessary for the configuration of the drive circuit, or for resistance, coils, capacitors, etc. necessary for power supply stabilization and noise countermeasures, and is usually fixed across frames (between lead wires), When the counter electrode can be formed by a process of laminating an insulating film or the like on the frame, it may be arranged on a single frame. One or more chip components 5 may be used as necessary.

  Further, a protruding frame 6 is provided that protrudes from the vicinity of the mounting portion 31 of the frame 3 on which the light receiving element 1 is mounted. The protruding frame 6 is bent so as to sandwich the light receiving element 1 and is substantially parallel to the mounting portion 31. It is configured like this. The projection frame 6 substantially serves as a shield plate of the light receiving element 1 and has a through hole 61 that exposes the light receiving surface of the light receiving element 1 (in this case, the center of the surface), while the flat plate portion. 62 is configured to cover the drive circuit element 2.

  The difference between the case where the protruding frame 6 is provided and the case where the protruding frame 6 is not provided is as follows, for example. First, an electric field is generated in the vicinity of the optical receiver (320 cubic centimeters) with an alternating voltage modulated at 38 kHz and spaced at intervals of 600 μs, and an optical receiver is arranged in the center of the electric field. When we moved away, we measured and compared the distance at which the signal can be accurately demodulated (the farther the better the performance). When the shield plate was not provided, the transmitter could not be demodulated by placing it outside the electric field, and the signal could be demodulated only when the transmitter / receiver met and faced each other and the optical surfaces almost touched each other. When a shield plate made of metal mesh was provided outside the resin mold, demodulation was possible at a distance of 3 to 4 cm outside the electric field. However, poor reception occurred frequently when the optical axis fluctuated slightly. On the other hand, in the present invention described above, it was possible to demodulate at a location 20 cm or more outside the electric field, and to receive even if the transmission location was moved slightly concentrically so as to swing the optical axis.

  On the other hand, the protruding frame 6 protrudes in a direction substantially orthogonal to the extending direction of the lead wires 32 of the frame 3 on which the light receiving element 1 is placed, and is supported by a narrow support portion 33, and there is no support portion 33. The open end is fixed in the vicinity of the chip component 5.

  At this time, if the support portion 33 is provided in the direction in which the lead wire 32 extends, the width and interval of the lead wire 32 are reduced, or the lead wire 32 is damaged or undesirably bent during the operation of raising the protruding frame 6. Therefore, it is not preferable. Further, when the chip component 5 is fixed to one end of the protruding frame 6, it is fixed with an insulating adhesive, a conductive adhesive, solder, bumps, or the like, or such a connection to the frame in the vicinity of the chip component 5. It is good to fix with material. When an insulating adhesive is used, it is preferable because it does not cause a contact failure or a short circuit accident of a small chip component. On the other hand, when a conductive connecting material is used, the protruding frame 6 is preferably maintained at the same potential as the frame 3. However, when the support portion 33 is strong, by appropriately determining the position and direction of the resin injection gate so that the protruding frame 6 does not move due to resin injection, the molding resin 4 can be used as the resin that has flowed in between the frames. The projecting frame 6 can be fixed with.

  The structure of the protruding frame 6 will be described with reference to FIGS. 2 and 3. The light receiving element 1 and the driving circuit element 2 are mounted and fixed on the mounting surface 31 on the same surface, and chip components are also mounted. Stick. Then, after wiring (not shown), the protruding frame 6 can be bent. This is made by paying attention to the fact that the chip component is higher than or substantially equal to the height of the semiconductor wafer such as the light receiving element and the drive circuit, and that the frame member has some restoring force. Even if you do not make any effort to make it completely parallel, if you fold the tip of the protruding frame so that it contacts the chip part and then release the tool, the protruding frame will be slightly away from the chip part. stay. Moreover, when the support portion 33 is widened, there is little possibility of bending when the support portion 33 is widened, but it becomes difficult to bend. Therefore, the width is narrowed, and further, slits are provided on both sides of the support portion 33 to make it easy to bend. Is preferred.

  However, it must still not bend diagonally. Therefore, in the present invention, the projection frame can be easily positioned by folding it so that the predetermined part of the projection frame comes to the predetermined position of the chip component, etc., without shifting the positions of the through hole 61 and the flat plate part 62. Workability is good.

An optical receiver suitable for an optical remote controller can be provided.

It is a perspective view of the optical receiver of this invention. It is a principal part top view of the lead frame material used for this invention. FIGS. 4A and 4B are main part plan views for explaining assembly. FIGS.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light receiving element 2 Drive circuit (drive circuit element)
3 Frame 4 Resin 5 Chip part 6 Projection frame

Claims (2)

In the optical receiver in which the light receiving element and the drive circuit element are arranged in a frame and molded with resin, the frame has a large element arrangement portion in the center, and a plurality of lead wires are arranged above and below the element arrangement portion. A projection frame that protrudes in a direction substantially orthogonal to the direction in which the lead wire extends is supported by the element placement portion by a narrow support portion, and a through hole that exposes the light receiving surface of the light receiving element to the projection frame And a flat plate portion covering the drive circuit element, and the protruding frame is bent so as to sandwich the light receiving element and fixed by the mold resin . In a method of manufacturing an optical receiver in which a light receiving element and a drive circuit element are arranged on a frame and molded with resin, the frame has an element arrangement portion having a large area at the center, and a plurality of lead wires are arranged above and below the element arrangement portion. And a protrusion frame projecting in a direction substantially perpendicular to the extending direction of the lead wire is supported by a narrow support portion, and the protrusion frame is bent so as to sandwich the light receiving element. A method for manufacturing a receiver .

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