JP3756991B2 - Uncured epoxy resin release agent composition - Google Patents
Uncured epoxy resin release agent composition Download PDFInfo
- Publication number
- JP3756991B2 JP3756991B2 JP17101396A JP17101396A JP3756991B2 JP 3756991 B2 JP3756991 B2 JP 3756991B2 JP 17101396 A JP17101396 A JP 17101396A JP 17101396 A JP17101396 A JP 17101396A JP 3756991 B2 JP3756991 B2 JP 3756991B2
- Authority
- JP
- Japan
- Prior art keywords
- ethyl
- epoxy resin
- acetate
- release agent
- agent composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003795 chemical substances by application Substances 0.000 title claims description 23
- 239000003822 epoxy resin Substances 0.000 title claims description 17
- 229920000647 polyepoxide Polymers 0.000 title claims description 17
- 239000000203 mixture Substances 0.000 title claims description 13
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 18
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 16
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 13
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 9
- 229940116333 ethyl lactate Drugs 0.000 claims description 8
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 7
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 7
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 claims description 6
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 claims description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 6
- XVTQAXXMUNXFMU-UHFFFAOYSA-N methyl 2-(3-oxo-2-pyridin-2-yl-1h-pyrazol-5-yl)acetate Chemical compound N1C(CC(=O)OC)=CC(=O)N1C1=CC=CC=N1 XVTQAXXMUNXFMU-UHFFFAOYSA-N 0.000 claims description 5
- -1 3-methoxy-3-methylbutyl Chemical group 0.000 claims 1
- 150000001242 acetic acid derivatives Chemical class 0.000 claims 1
- NUKZAGXMHTUAFE-UHFFFAOYSA-N hexanoic acid methyl ester Natural products CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 claims 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Paints Or Removers (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は未硬化エポキシ樹脂の剥離剤組成物に関するものであり、さらに詳しくは各種エポキシ樹脂系の印刷用インクや、マスキング剤、接着剤、電気絶縁材料、および土木・建築用途等に使用される汎用エポキシ樹脂等を用いる分野において、未硬化部分のエポキシ樹脂を除くために用いることができる剥離剤組成物に関するものである。
【０００２】
【従来の技術】
民生用及び産業用として用いられている汎用なエポキシ樹脂は、一般的に調合後及び使用後に不要な部分を残しておくと徐々に硬化してしまうために、未硬化部分及び不要部分の剥離／洗浄を行う必要がある。
【０００３】
従来、上記の剥離／洗浄においては、ジクロロメタン、１，１，１−トリクロロエタン、トリクロロエチレン、テトラクロロエチレン等の塩素系剥離剤、トリクロロトリフルオロエタン等のフロン系剥離剤、アセトン、メチルエチルケトン、メチルイソブチルケトン、メチル−ｎ−アミルケトン等のケトン系剥離剤等が使用されている。しかしながら、塩素系の剥離剤やフロン系の剥離剤は安全性、環境汚染等の面で問題があり、また、ケトン系の剥離剤は一般的に引火点が低く、取扱いの面で危険性が高く、煩雑さを伴う。
【０００４】
【発明が解決しようとする課題】
本発明は、従来使用されている塩素系剥離剤やフロン系剥離剤及びケトン系剥離剤よりも未硬化エポキシ樹脂の剥離／洗浄性に優れるとともに、毒性が低く、環境に悪影響をおよぼさず、また取扱いの面において危険性が低く、取扱い易い未硬化エポキシ樹脂の剥離剤組成物を提供することを目的とする。
【０００５】
【問題を解決するための手段】
本発明者は前記目的を達成するために鋭意研究を重ねた結果、未硬化部分のエポキシ樹脂を除去するための剥離剤として、（Ａ）Ｎ−メチル−２−ピロリドン（以下「ＮＭＰ」と称すことがある）を必須成分として含有し、成分（Ｂ）として特定の化合物の中から選ばれる少なくとも一種の化合物を含有する剥離剤組成物が、未硬化エポキシ樹脂の剥離／洗浄性に優れ、毒性が低く、環境に悪影響をおよぼさず、また取扱いの面において危険性が低く、取扱い易い剥離剤であることを見出し本発明を成すに到った。
【０００６】
すなわち、本発明の請求項１は、（Ａ）Ｎ−メチル−２−ピロリドンを必須成分として含有し、（Ｂ）酢酸エチル、酢酸ブチル、乳酸エチル、プロピオン酸エチル、酪酸エチル、プロピレングリコールメチルエーテルアセテートおよび３−メトキシ−３−メチルブチルアセテートの中から選ばれる少なくとも一種の化合物とから成ることを特徴とする未硬化エポキシ樹脂の剥離剤組成物である。
【０００７】
本発明の請求項２は、請求項１記載の未硬化エポキシ樹脂の剥離剤組成物において、（Ａ）Ｎ−メチル−２−ピロリドンが３０重量％〜９５重量％で、（Ｂ）酢酸エチル、酢酸ブチル、乳酸エチル、プロピオン酸エチル、酪酸エチル、プロピレングリコールメチルエーテルアセテートおよび３−メトキシ−３−メチルブチルアセテートの中から選ばれる少なくとも一種の化合物が５重量％〜７０重量％であることを特徴とする。
【０００８】
本発明の請求項３は、請求項１あるいは請求項２記載の未硬化エポキシ樹脂の剥離剤組成物において、前記成分（Ｂ）が乳酸エチル、プロピレングリコールメチルエーテルアセテートおよび３−メトキシ−３−メチルブチルアセテートの中から選ばれる少なくとも一種の化合物であることを特徴とする。
【０００９】
【発明の実施の形態】
以下、本発明を詳細に説明する。
本発明の未硬化エポキシ樹脂の剥離剤組成物は、（Ａ）ＮＭＰを必須成分として含有し、成分（Ｂ）として酢酸エチル、酢酸ブチル、乳酸エチル、プロピオン酸エチル、酪酸エチル、プロピレングリコールメチルエーテルアセテートおよび３−メトキシ−３−メチルブチルアセテートの中から選ばれる少なくとも一種の化合物とから成ることが必要である。
成分（Ａ）ＮＭＰに添加して用いられる成分（Ｂ）の酢酸エチル、酢酸ブチル、乳酸エチル、プロピオン酸エチル、酪酸エチル、プロピレングリコールメチルエーテルアセテートおよび３−メトキシ−３−メチルブチルアセテートは単独で使用してもよく、また、二種以上を混合して使用してもよい。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a release agent composition for an uncured epoxy resin, and more specifically, is used for various epoxy resin-based printing inks, masking agents, adhesives, electrical insulating materials, civil engineering / architecture applications, and the like. The present invention relates to a release agent composition that can be used to remove uncured epoxy resin in the field of using general-purpose epoxy resins.
[0002]
[Prior art]
General-purpose epoxy resins used for consumer and industrial use are generally cured when an unnecessary part is left after preparation and after use. Cleaning is necessary.
[0003]
Conventionally, in the above stripping / cleaning, chlorine-based stripping agents such as dichloromethane, 1,1,1-trichloroethane, trichloroethylene, and tetrachloroethylene, Freon-based stripping agents such as trichlorotrifluoroethane, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl Ketone release agents such as -n-amyl ketone are used. However, chlorine-based release agents and CFC-based release agents have problems in terms of safety and environmental pollution, and ketone-based release agents generally have a low flash point and are dangerous in handling. High and complicated.
[0004]
[Problems to be solved by the invention]
The present invention is superior in peeling / cleaning properties of uncured epoxy resin than conventionally used chlorine-based release agents, fluorocarbon release agents and ketone-type release agents, and has low toxicity and does not adversely affect the environment. Another object of the present invention is to provide an uncured epoxy resin release agent composition that is low in handling and easy to handle.
[0005]
[Means for solving problems]
As a result of intensive studies to achieve the above object, the present inventor has (A) N-methyl-2-pyrrolidone (hereinafter referred to as “NMP”) as a release agent for removing an uncured portion of the epoxy resin. The release agent composition containing at least one compound selected from the specific compounds as component (B) is excellent in the peelability / cleanability of the uncured epoxy resin and is toxic Has been found to be a release agent that does not adversely affect the environment, has a low risk in handling, and is easy to handle.
[0006]
That is, claim 1 of the present invention contains (A) N-methyl-2-pyrrolidone as an essential component, and (B) ethyl acetate, butyl acetate, ethyl lactate, ethyl propionate, ethyl butyrate, propylene glycol methyl ether An uncured epoxy resin release agent composition comprising at least one compound selected from acetate and 3-methoxy-3-methylbutyl acetate.
[0007]
Claim 2 of the present invention is the release agent composition for uncured epoxy resin according to claim 1, wherein (A) N-methyl-2-pyrrolidone is 30 wt% to 95 wt%, (B) ethyl acetate, At least one compound selected from butyl acetate, ethyl lactate, ethyl propionate, ethyl butyrate, propylene glycol methyl ether acetate and 3-methoxy-3-methylbutyl acetate is 5 wt% to 70 wt% And
[0008]
Claim 3 of the present invention is the release agent composition for uncured epoxy resin according to claim 1 or 2, wherein the component (B) is ethyl lactate, propylene glycol methyl ether acetate and 3-methoxy-3-methyl. It is at least one compound selected from butyl acetate.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail.
The uncured epoxy resin release agent composition of the present invention contains (A) NMP as an essential component, and as component (B), ethyl acetate, butyl acetate, ethyl lactate, ethyl propionate, ethyl butyrate, propylene glycol methyl ether It is necessary to comprise at least one compound selected from acetate and 3-methoxy-3-methylbutyl acetate.
Component (A) Ethyl acetate, butyl acetate, ethyl lactate, ethyl propionate, ethyl butyrate, propylene glycol methyl ether acetate and 3-methoxy-3-methylbutyl acetate used alone in addition to NMP You may use, and may mix and use 2 or more types.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17101396A JP3756991B2 (en) | 1996-07-01 | 1996-07-01 | Uncured epoxy resin release agent composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17101396A JP3756991B2 (en) | 1996-07-01 | 1996-07-01 | Uncured epoxy resin release agent composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1017800A JPH1017800A (en) | 1998-01-20 |
| JP3756991B2 true JP3756991B2 (en) | 2006-03-22 |
Family
ID=15915487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17101396A Expired - Fee Related JP3756991B2 (en) | 1996-07-01 | 1996-07-01 | Uncured epoxy resin release agent composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3756991B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170933A (en) * | 1999-12-16 | 2001-06-26 | Japan Wavelock Co Ltd | Method and apparatus for separating and recycling heat-fusible multilayered sheet |
| KR100594815B1 (en) * | 1999-12-24 | 2006-07-03 | 삼성전자주식회사 | Thinner for photoresist rinse and processing method of photoresist film using same |
| JP5192581B1 (en) * | 2011-10-26 | 2013-05-08 | 株式会社カネコ化学 | Solvent composition for dissolving synthetic resin |
-
1996
- 1996-07-01 JP JP17101396A patent/JP3756991B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1017800A (en) | 1998-01-20 |
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