JP3758311B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a lightweight, small, and thin imaging device that can be mounted on a desktop or notebook personal computer, a mobile phone, and the like, in particular, a peripheral circuit including a solid-state imaging device and a drive circuit, a signal processing circuit, a control circuit, and the like. The present invention relates to an imaging apparatus integrated with an optical system such as a lens and a diaphragm.
[0002]
[Prior art]
In recent years, in consumer video cameras, there are increasing demands for high-quality images such as faithful color reproducibility and fine detail expression, as well as miniaturization, thickness reduction, and weight reduction that are convenient to carry. In order to meet such a demand, technological development for downsizing and thinning an image pickup apparatus including a solid-state image pickup element and its peripheral circuits has been actively conducted.
[0003]
FIG. 5 is a cross-sectional view of a main part of a conventional imaging device that is small and thin. In FIG. 5, reference numeral 1 denotes a solid-state imaging device in which a solid-state imaging device (hereinafter referred to as a CCD chip) is mounted inside a ceramic package. It is mounted on the first printed circuit board 2 with a CCD). A circuit component 3 such as a resistor or a capacitor is also mounted on the first printed board 2 and is electrically connected to the CCD 1. Reference numeral 4 denotes a second printed circuit board electrically connected to the first printed circuit board 2 by a flexible cable 5, and each peripheral circuit element constituting the drive circuit section and signal processing circuit section of the CCD 1 on the upper surface thereof. 6 and circuit components 7 such as resistors and capacitors are mounted. The second printed circuit board 4 can be freely bent by the flexible cable 5 and is effective in reducing the area occupied by the imaging device.
[0004]
As shown in the figure, the conventional imaging apparatus uses two printed circuit boards 2 and 4, and the first printed circuit board 2 is mounted with a CCD 1 and a circuit component 3 mounted on a ceramic package or the like, and a second printed circuit board. 4, peripheral circuit elements 6 and circuit components 7 are mounted. The dimensions of these printed circuit boards are about 4 cm square, and the height of the two printed circuit boards superimposed is about 1 cm.
[0005]
A lens holder 8 is provided so as to cover the CCD 1, and the lens 9 is fixed at a position located at the center of the CCD 1. Reference numeral 10 denotes a case of the image pickup apparatus. A diaphragm 11 and an optical filter 12 having a small diameter are provided at a position located at the center of the lens 9, and the center of the CCD 1 and the center of the lens 9, the optical filter 12, and the diaphragm 11. Are set on the same optical axis.
[0006]
Such imaging devices are increasingly being used for imaging terminals of video cameras and electronic still cameras, or information terminals such as notebook computers and mobile phones, but these portable electronic devices are becoming smaller and lighter. However, as functions to be provided are required to be multi-functional, further miniaturization, weight reduction, and thinning of the components of these electronic devices have become essential conditions.
[0007]
[Problems to be solved by the invention]
However, in the configuration of the conventional imaging device, the solid-state imaging device and some peripheral circuit elements are modularized to be a compact design. However, the solid-state imaging device and the peripheral circuit still packaged with ceramic or plastic. Since elements are used and soldered to the printed circuit board, there is a limit to reducing the size and thickness. Further, on the printed circuit board, the wiring route becomes long, so that the wiring capacity becomes large, and unnecessary radiation due to charging / discharging of the wiring capacity becomes a problem. In addition, if the wiring is extended, a signal delay occurs, which limits the speedup of signal processing.
[0008]
Further, in the conventional imaging apparatus, the arrangement of the CCD chip and the peripheral circuit elements is not regulated, and it is usual that the CCD chip is arranged so as to be upward when the imaging apparatus is used in a vertical position. . Therefore, the inside of the imaging device is heated by the heat generated from the peripheral circuit elements integrated with high density, and a temperature difference is generated in the vertical direction in the package by convection. On the other hand, the dark current of the CCD chip is sensitive to temperature, and it is said that when a temperature difference of 8 to 10 ° C. occurs in the temperature of the surrounding environment, the dark current increases about twice, and when the dark current increases, the screen becomes dark. When shooting a scene, the image quality deteriorates, for example, a rough surface appears on the screen.
[0009]
The present invention solves such problems, modularizes each semiconductor element constituting the solid-state imaging device and the drive unit, the signal processing unit, and the control unit by mounting in a small, light and thin form, and further, a lens, an optical aperture, Imaging that can perform high-speed signal processing with excellent heat dissipation by making the electrical signal processing system parts including the CCD chip and the optical system parts into a one package module structure by configuring the optical system such as an optical filter compactly. An object is to provide an apparatus.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the present invention accommodates a solid-state imaging device and a peripheral circuit element composed of an integrated circuit in a container having a concave shape, wires the cover, and covers the upper part of the container with a face plate to seal the container. In addition, an optical filter is provided at the opening of the face plate located in front of the CCD chip, and an optical aperture having a central portion on the optical axis passing through the imaging center of the solid-state imaging device from the face plate side of the sealed package; The lens holder on which the lens is mounted is fixed so as to adjust the optical axis of the solid-state image sensor, optical filter, and lens, and because it is extremely thin, It can also be installed in mobile phones.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, there is provided a solid-state imaging device comprising a semiconductor substrate having a photoelectric conversion part on the main surface, and a peripheral circuit comprising a semiconductor substrate different from the semiconductor substrate having an integrated circuit formed on the main surface. A concave container in which an element, a solid-state image sensor and a peripheral circuit element are installed on the same surface and electrically connected to each other and stored, and fixed to the opening side of the container to make the inside of the container airtight A face plate, an opening formed in a portion of the face plate located in front of the solid-state imaging device, an optical filter fixed to the opening, and a cover from the face plate side of the package including the container and the face plate A solid-state imaging device comprising an optical aperture having a central portion on an optical axis passing through the imaging center of a solid-state imaging device and a lens holder provided with a lens. Since the electrical signal processing circuit system including the optical element and the optical system such as the lens are packaged as a single module, it is extremely thin and must be mounted in a very limited and narrow part such as a small and thin electronic device. Can do.
[0012]
The invention according to claim 2 of the present invention is the imaging apparatus according to claim 1, wherein the optical filter is one of an infrared cut filter, a crystal low-pass filter, or a phase grating, and has extremely high quality. Images can be taken.
[0013]
According to a third aspect of the present invention, there is provided an imaging apparatus according to the first aspect, wherein the area of the opening of the face plate is larger than the area of the solid-state imaging device, and the imaging of the solid-state imaging device is performed. Position adjustment between the center and the optical axis center of the opening of the face plate is facilitated.
[0014]
According to a fourth aspect of the present invention, there is provided an imaging apparatus according to the first aspect, wherein an optical filter is fixed around the opening of the face plate, and scattering of light incident from the opening is prevented. Since it is provided with a light-shielding wall, it can prevent intrusion of scattered light, which causes noise in peripheral circuit elements mounted close to the CCD chip for high-density mounting. It is effective in improving
[0015]
The invention according to claim 5 of the present invention is the imaging apparatus according to claim 1, wherein the area of the face plate is similarly smaller than the area of the upper surface of the container, and the outer periphery of the face plate is smaller than the outer periphery of the package. It is bonded so as not to go outside, and the lens holder can be easily attached to the package.
[0016]
Next, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIGS. 1, 2 and 3 show the structure of the image pickup apparatus according to the first embodiment of the present invention. As shown in FIG. 1, a CCD chip 12 and a ceramic or plastic container 11 are provided inside the container 11. A peripheral circuit element 13 made of a semiconductor chip such as VDr, CDS, DSP or the like is mounted in the vicinity of the CCD chip 12, and all of them are wiring groups formed on the bottom surface of the container 11 by wire leads 14 such as gold wires. (Not shown). Similarly, the terminals of the wiring group are connected to pin leads 15 led out of the container 11 by wire leads 14. The container 11 configured in this manner is hermetically sealed with the inside filled with an inert gas by bonding the upper surface of the container 11 with the face plate 16. At this time, since the size of the face plate 16 is smaller than the upper area of the container 11, fine adjustment of the adhesive fixing position is performed so that the central axis of the CCD chip 12 and the central axis of the opening of the face plate 16 are matched. Even if it goes, the end of the face plate 16 does not protrude from the outer peripheral portion of the container 11 so that the package size does not get out of order.
[0017]
The face plate 16 is provided with an opening 17 at a portion located just on the upper surface of the CCD chip 12, and an IR cut filter 18 for blocking infrared rays as an optical filter is fixed to the opening 17. A package 19 is constituted by the container 11 and the face plate 16.
[0018]
The area of the opening 17 provided in the face plate 16 is larger than the area of the CCD chip 12. When the face plate 16 is fixed to the container 11 while adjusting the optical axis, the mounting work is easy. This is effective in improving the yield.
[0019]
In addition to the IR cut filter 18, a face plate 16 in which a crystal low-pass filter or a phase grating is attached to the opening 17 can also be used depending on the purpose of use of the imaging device.
[0020]
Next, on the upper surface of the package 19, a lens holder 22 made of plastic or the like provided with an optical aperture 20 and a lens 21 constituting a pinhole lens for forming an image or the like on the CCD chip 12 through the IR cut filter 18 is provided. Installed. The lens holder 22 is fixed to the package 19 after fine adjustment in the XY-axis direction for optical axis adjustment. At this time, the peripheral portion of the face plate 16 having an area smaller than that of the container 11 described above, the lens holder 22, The clearance part 23 arises between. The clearance portion 23 has an important role of defining a reference plane for optical axis adjustment when the optical axis adjustment is performed by fitting the lens holder 22 to the package 19 in the one-package module structure imaging apparatus according to the present invention. To fulfill.
[0021]
Next, the package 19 is mounted on the upper surface of the printed circuit board 27 on which the other peripheral component 24, the peripheral integrated circuit element 25, the connector 26 for connection to the external circuit shown in FIG. The pin lead 15 of the package 19 is connected to a wiring terminal (not shown) of the printed wiring board 27 to complete a one-package type imaging device.
[0022]
(Embodiment 2)
Next, an imaging apparatus according to the second embodiment of the present invention will be described with reference to FIG. This embodiment is different from the first embodiment in that a light shielding wall 28 is formed on the peripheral edge of the lower surface of the opening 17 provided in the face plate 16 as shown in FIG.
[0023]
In general, in an imaging apparatus, light is naturally introduced from a lens in order to form an image on a CCD, but incident light is partially scattered around the CCD. Since the imaging device is reduced in size and thickness, its components are mounted with high density. Therefore, in the imaging device according to the present embodiment, the peripheral circuit element 13 is mounted close to the CCD chip 12. Although it becomes easy to receive the above-mentioned scattered light, the peripheral circuit may malfunction due to the scattered light. The light shielding wall 28, which is a feature of the present embodiment, can further improve the reliability by effectively preventing the scattered light. The light shielding wall 28 also serves as a jig for fixing the optical filter 18 such as an IR cut filter.
[0024]
In each of the above embodiments of the present invention, the CCD chip 12 and the peripheral circuit element 13 made of a semiconductor chip such as VDr, CDS, DSP, etc. are directly mounted on the bottom of the container 11 where the wiring is formed on the bottom, and the wire Although the example in which the leads 14 are wired has been described, the CCD chip 12 and the peripheral circuit element 13 are mounted in advance on another printed wiring board on which wiring is formed, wire-bonded, and then stored in the container 11. It is also possible to make an electrical connection to a pin lead terminal in the container 11.
[0025]
Further, the peripheral circuit element 13 can be mounted face down and bump-connected as a method of mounting and electrical connection other than wire bonding described in the embodiment of the present invention.
[0026]
【The invention's effect】
As described above, according to the present invention, the peripheral circuit element composed of the solid-state imaging device and the integrated circuit is housed and wired in the concave container, and the upper part of the container is covered with the face plate to seal the container. An optical filter is provided at the opening of the face plate located in front of the CCD chip, and an optical diaphragm and lens having a central portion on the optical axis passing through the imaging center of the solid-state imaging device from the face plate side of the sealed package. A solid-state image pickup device, an optical filter, and an optical axis of the lens are fixed so as to cover the lens holder provided, thereby fixing the image pickup apparatus to an electric signal processing system including a solid-state image pickup device and a peripheral circuit, a lens, and an optical aperture. It is possible to configure an integrated optical system as a one-package module and integrate it. Can be made very thin, so that it can be mounted on electronic devices that are thinned like a display part of a notebook computer and extremely small in a limited space or a mobile phone. It becomes possible to add a new function.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an imaging device according to a first embodiment of the present invention. FIG. 2 is a plan view of the imaging device. FIG. 3 is a rear view of the imaging device. FIG. 5 is a cross-sectional view of a conventional image pickup apparatus.
11 Container 12 CCD chip (solid-state image sensor)
13 Peripheral circuit element 16 Face plate 17 Opening 18 IR cut filter (optical filter)
19 Package 20 Optical diaphragm 21 Lens 22 Lens holder

Claims (5)

A solid-state imaging device comprising a semiconductor substrate having a photoelectric conversion part on the main surface; a peripheral circuit element comprising a semiconductor substrate different from the semiconductor substrate having an integrated circuit formed on the main surface; the solid-state imaging device and the peripheral circuit device; Are disposed on the same surface and are electrically connected to each other and stored therein, a face plate fixed to the opening side of the container to make the inside of the container airtight, and the face plate An opening formed in a portion located on the front surface of the solid-state imaging device, an optical filter fixed to the opening, and a lid mounted from the face plate side of the package including the container and the face plate, and An imaging apparatus comprising: an optical aperture having a central portion on an optical axis passing through an imaging center of a solid-state imaging device; and a lens holder provided with a lens. The imaging apparatus according to claim 1, wherein the optical filter is one of an infrared cut filter, a crystal low-pass filter, and a phase grating. The imaging apparatus according to claim 1, wherein the area of the opening of the face plate is larger than the area of the solid-state imaging device. The imaging apparatus according to claim 1, wherein an optical filter is fixed around an opening of the face plate, and a light shielding wall is provided to prevent scattering of light incident from the opening. 2. The imaging device according to claim 1, wherein the area of the face plate is similarly smaller than the area of the upper surface of the ceramic container, and the face plate is bonded so that the outer peripheral portion of the face plate does not protrude from the outer periphery of the package.

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