JP3766810B2 - Photocurable resin composition - Google Patents
Photocurable resin composition Download PDFInfo
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- JP3766810B2 JP3766810B2 JP2002106286A JP2002106286A JP3766810B2 JP 3766810 B2 JP3766810 B2 JP 3766810B2 JP 2002106286 A JP2002106286 A JP 2002106286A JP 2002106286 A JP2002106286 A JP 2002106286A JP 3766810 B2 JP3766810 B2 JP 3766810B2
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- resin composition
- photocurable resin
- film
- bis
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000005062 Polybutadiene Substances 0.000 claims description 13
- 229920002857 polybutadiene Polymers 0.000 claims description 13
- 150000005846 sugar alcohols Polymers 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 24
- -1 ether compound Chemical class 0.000 description 23
- 239000010408 film Substances 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 4
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- RMVRSNDYEFQCLF-UHFFFAOYSA-O phenylsulfanium Chemical compound [SH2+]C1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-O 0.000 description 4
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000012953 triphenylsulfonium Substances 0.000 description 4
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000002075 main ingredient Substances 0.000 description 3
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229940105990 diglycerin Drugs 0.000 description 2
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- CABDEMAGSHRORS-UHFFFAOYSA-N oxirane;hydrate Chemical compound O.C1CO1 CABDEMAGSHRORS-UHFFFAOYSA-N 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- QKAIFCSOWIMRJG-UHFFFAOYSA-N (4-methylphenyl)-(4-propan-2-ylphenyl)iodanium Chemical compound C1=CC(C(C)C)=CC=C1[I+]C1=CC=C(C)C=C1 QKAIFCSOWIMRJG-UHFFFAOYSA-N 0.000 description 1
- FVCHRIQAIOHAIC-UHFFFAOYSA-N 2-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COCC1CO1 FVCHRIQAIOHAIC-UHFFFAOYSA-N 0.000 description 1
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- PFHLXMMCWCWAMA-UHFFFAOYSA-N [4-(4-diphenylsulfoniophenyl)sulfanylphenyl]-diphenylsulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC(C=C1)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 PFHLXMMCWCWAMA-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 description 1
- 229940043264 dodecyl sulfate Drugs 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000006221 furniture coating Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011968 lewis acid catalyst Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000011833 salt mixture Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、紫外線や電子線等の活性エネルギー線を照射することによって、基材に対する密着性および耐溶剤性に優れた硬化膜を与える光硬化性樹脂組成物に関するものである。さらに詳しくは、塗料、フィルムコーティング、金属コーティング、家具の塗装など種々のコーティング剤、ライニング剤、接着剤、積層板、プリント基板、レジストインキ、半導体封止剤、光造形等の用途で有用な、低光量で硬化可能な光硬化性樹脂組成物に関するものである。
【0002】
【従来の技術】
エポキシ樹脂は電気・電子分野、土木建築分野、塗料、接着剤などの分野で幅広く使用されている。この中で多価アルコール化合物ポリグリシジルエーテルは、一般にエポキシ樹脂や、他のエマルジョン系樹脂との相溶性が良好である為、反応性希釈剤、架橋剤、樹脂改質剤として広く用いられている。また最近では、光重合向けの硬化材料としても用いられることもでてきている。
【0003】
【発明が解決しようとする課題】
一般に、多価アルコール化合物ポリグリシジルエーテルを、光硬化したものは、耐水性、耐熱性、強靱性、耐溶剤性などに優れた性質を示す。しかしながら、これらを単独で用いた場合には基材に対する密着性が悪いことや、硬化収縮が比較的大きいこと、また低光量では硬化しにくいこと等の種々の問題が見られた。また、エポキシ化ポリブタジエン樹脂は、フィルムとの密着性などに優れるものの、高粘度である為、塗膜にする際の作業性が悪く、薄膜にできづらいという問題があった。このことより、これらの樹脂を印刷関係、塗料関係、電気絶縁関係などの用途において光硬化樹脂向けに用いるには困難であった。
【0004】
【課題を解決するための手段】
本発明者らは、上記の課題を解決するために鋭意検討を重ねた結果、この両者を併用して用いることにより、密着性と耐溶剤性の両方の性能を併せ持ち、硬化収縮が小さく、低光量で硬化皮膜を形成でき、さらに適度な粘度で、薄膜化しやすい光硬化性樹脂組成物が得られることを見い出し、本発明に至った。
【0005】
すなわち本発明は、(a)一般式(1)
【化1】
(ただし、R1は多価アルコール化合物よりOH基を除いた残基、R2はメチル基または水素原子、R3はグリシジル基または水素原子、l、m、nは各々整数であり、且つ2≦l+n≦6、0≦m≦2、2≦n≦6、0≦l≦5である。)で表される多価アルコール化合物のポリグリシジルエーテル15〜70重量%と、(b)エポキシ化ポリブタジエン樹脂30〜85重量%(但し、(a)成分と(b)成分の合計は100重量%)を含有する主剤成分100重量部に対して、(c)光重合開始剤0.1〜10重量部を使用した光硬化性樹脂組成物を提供するものである。以下、本発明について、さらに詳しく説明する。
【0006】
【発明の細部構成と作用】
本発明組成物における主剤成分中の(a)である多価アルコール化合物のポリグリシジルエーテルは、一般的な方法で合成でき、多価アルコールとエピクロルヒドリンを反応させることにより得ることができる。これにはトルエンやキシレンなどの不活性溶媒中で、アミン類やルイス酸などの触媒を用いて、付加反応させたのち、NaOHなどのアルカリを用いて閉環反応を経る2段階の反応方法や、エピクロルヒドリン溶媒中でアルカリを用いて直接1段階で反応させる方法を用いて合成できる。
【0007】
本発明における一般式(1)で表されるポリグリシジルエーテル化合物としては、ネオペンチルグリコール・ジグリシジルエーテル、1,6−ヘキサンジオール・ジグリシジルエーテル、ジエチレングリコール・ジグリシジルエーテル、ポリエチレングリコール・ジグリシジルエーテル、トリプロピレングリコール・ジグリシジルエーテル、ポリプロピレングリコール・ジグリシジルエーテル、トリメチロールプロパン・ポリグリシジルエーテル、グリセリン・ポリグリシジルエーテル、ジグリセリン・ポリグリシジルエーテル、ポリグリセリン・ポリグリシジルエーテルおよびトリメチロールプロパン、グリセリン、ジグリセリン、ポリグリセリンなどのアルキレンオキサイド付加体のポリグリシジルエーテルなどが使用できるが、好ましくは、グリセリン・ポリグリシジルエーテル、トリメチロールプロパン・ポリグリシジルエーテル、ポリグリセリン・ポリグリシジルエーテルであり、特に好ましくは、グリセリン・ポリグリシジルエーテル、トリメチロールプロパン・ポリグリシジルエーテルである。
【0008】
主剤成分中の上記ポリグリシジルエーテル化合物の配合量は、15〜70重量%であり、15%以下では、配合物の粘度が高く薄膜にできづらく、一方70%以上では基材に対する密着性が不充分となる。このなかでも好ましくは20〜60重量%である。
【0009】
本発明における多価アルコール化合物の水酸基に対するエピクロルヒドリンの反応当量比は、目的とする性能が得られるように任意の割合で調整することができるが、好ましくは0.5〜1.2である。
【0010】
次に、本発明組成物における主剤成分中の(b)であるエポキシ化ポリブタジエン樹脂は、通常、過酢酸などの過酸化物を用いて、ポリブタジエン中の2重結合をエポキシ化し、得ることができる。このエポキシ化ポリブタジエンの数平均分子量は500〜20,000の範囲となるものであれば直鎖状であっても分岐状であってもよい。500以下では、得られる塗膜の密着性が充分でないため好ましくない。一方20,000以上では粘度が高過ぎることから塗膜とするのが困難であるため、実使用上好ましくない。この点よりさらに好ましくは数平均分子量が500〜15,000の範囲ものもがよい。このようなポリブタジエンの具体例としては特に限定されるものではないが、出光石油化学(株)製のR−15HT、R−45HT、日本曹達(株)製のB−1000、B−2000、B−3000、G−1000、G−2000、G−3000、日本石油化学(株)製のB−700、B−1000、B−2000、B−3000などの市販されているものがあげられる。
【0011】
用いられるポリブタジエンとしては、ポリブタジエン1分子中に水酸基を複数個含有し、二重結合比が1,4−シスと1,4−トランスの合計の方が、1,2−ビニルより多く含まれているものが好ましい。
【0012】
このポリブタジエンを過酢酸などでエポキシ化したものであるエポキシ化ポリブタジエン樹脂のオキシラン酸素濃度としては、3wt%から18wt%であるものが好ましく、より好ましくは6wt%から12wt%のものである。オキシラン酸素濃度が3wt%より小さい場合は他の樹脂との相溶性が悪くなるため好ましくなく、一方18wt%より大きい場合には、得られる塗膜の耐衝撃性が十分でなくなる。このようなエポキシ化ポリブタジエン樹脂の例としては、ダイセル化学工業(株)製のエポリード PB3600があげられる。主剤成分中のエポキシ化ポリブタジエン樹脂の配合量は、30〜85重量%であり、より好ましくは40〜80重量%の範囲である。30重量%以下では、充分な密着性が得られないため好ましくなく、85重量%以上では、配合物の粘度が高過ぎることから、薄膜にできづらいため好ましくない。
【0013】
本発明の光硬化性樹脂組成物に用いられる触媒としての(c)光重合開始剤は、光カチオン重合開始物質を発生するものであれば、特に制限はなく、イオン性光発生タイプであっても良いし、非イオン性光発生タイプであっても良い。
【0014】
上記イオン性光酸発生タイプの光カチオン重合開始剤の具体例としては、特に限定されるものではないが、例えば、芳香族スルホニウム塩には、ビス[4−(ジフェニルスルホニオ)フェニル]スルフィドビスヘキサフルオロフォスフェート、ビス[4−(ジフェニルスルホニオ)フェニル]スルフィドビスヘキサフルオロアンチモネート、ビス[4−(ジフェニルスルホニオ)フェニル]スルフィドビステトラフルオロボレート、ビス[4−(ジフェニルスルホニオ)フェニル]スルフィドテトラキス(ペンタフルオロフェニル)ボレート、ジフェニル−4−(フェニルチオ)フェニルスルホニウムヘキサフルオロフォスフェート、ジフェニル−4−(フェニルチオ)フェニルスルホニウムヘキサフルオロアンチモネート、ジフェニル−4−(フェニルチオ)フェニルスルホニウムテトラフルオロボレート、ジフェニル−4−(フェニルチオ)フェニルスルホニウムテトラキス(ペンタフルオロフェニル)ボレート、トリフェニルスルホニウムヘキサフルオロフォスフェート、トリフェニルスルホニウムヘキサフルオロアンチモネート、トリフェニルスルホニウムテトラフルオロボレート、トリフェニルスルホニウムテトラキス(ペンタフルオロフェニル)ボレート、ビス[4−(ジ(4−(2−ヒドロキシエトキシ))フェニルスルホニオ)フェニル]スルフィドビスヘキサフルオロフォスフェート、ビス[4−(ジ(4−(2−ヒドロキシエトキシ))フェニルスルホニオ)フェニル]スルフィドビスヘキサフルオロアンチモネート、ビス[4−(ジ(4−(2−ヒドロキシエトキシ))フェニルスルホニオ)フェニル]スルフィドビステトラフルオロボレート、ビス[4−(ジ(4−(2−ヒドロキシエトキシ))フェニルスルホニオ)フェニル]スルフィドテトラキス(ペンタフルオロフェニル)ボレート等;芳香族ヨードニウム塩には、ジフェニルヨードニウムヘキサフルオロフォスフェート、ジフェニルヨードニウムヘキサフルオロアンチモネート、ジフェニルヨードニウムテトラフルオロボレート、ジフェニルヨードニウムテトラキス(ペンタフルオロフェニル)ボレート、ビス(ドデシルフェニル)ヨードニウムヘキサフルオロフォスフェート、ビス(ドデシルフェニル)ヨードニウムヘキサフルオロアンチモネート、ビス(ドデシルフェニル)ヨードニウムテトラフルオロボレート、ビス(ドデシルフェニル)ヨードニウムテトラキス(ペンタフルオロフェニル)ボレート、4−メチルフェニル−4−(1−メチルエチル)フェニルヨードニウムヘキサフルオロフォスフェート、4−メチルフェニル−4−(1−メチルエチル)フェニルヨードニウムヘキサフルオロアンチモネート、4−メチルフェニル−4−(1−メチルエチル)フェニルヨードニウムテトラフルオロボレート、4−メチルフェニル−4−(1−メチルエチル)フェニルヨードニウムテトラキス(ペンタフルオロフェニル)ボレート等;芳香族ジアゾニウム塩には、フェニルジアゾニウムヘキサフルオロフォスフェート、フェニルジアゾニウムヘキサフルオロアンチモネート、フェニルジアゾニウムテトラフルオロボレート、フェニルジアゾニウムテトラキス(ペンタフルオロフェニル)ボレート等、が挙げられ、これらの1種もしくは2種以上が使用される。また、2種類以上の光カチオン重合開始剤を併用する場合、有効活性波長の異なる2種類以上の光カチオン重合開始剤を用いて多段階硬化をさせても良い。
【0015】
上記光カチオン重合開始剤の配合量は特に限定されるものではないが、主剤成分100重量部に対して、0.1〜10重量部が好ましく、特に1〜5重量部が好ましい。0.1重量部以下であるとエネルギー線照射時に開始剤が発生する酸の発生量が少なすぎて充分な硬化物が得られず、また10重量部を超えると開始剤から発生する酸の量が多くなり、最終的に硬化物中に残存する不純物量が多くなることにより、硬化物周辺への腐食などの悪影響がでてくる。
【0016】
本発明の光硬化性樹脂組成物の塗布方法としては、ハケ塗り、スプレーコート、ディップコート、スピンコート、カーテンコートなどの方法が用いられる。活性エネルギー線としては、キセノン灯、メタルハライド灯、Fe系メタルハライド灯、水銀灯、高圧水銀灯などが挙げられるが、好ましくは水銀灯、特に好ましくは高圧水銀灯を用いる。
【0017】
【実施例】
以下、本発明を具体的に説明するが、本発明はこれらに限定されるものではない。なお、実施例、比較例中の「部」はすべて「重量部」を意味する。
【0018】
【実施例1〜5】
第1表のような配合に光カチオン重合開始剤としてトリアリルスルフォニウムヘキサフルオロフォスフェート塩混合物(ユニオン・カーバイド日本(株)製「UVI6990」)を添加する。この配合樹脂を次のように硬化した。すなわち、前処理としてアセトンで洗浄したPETフィルム(100μm厚)に配合樹脂を膜厚10μmとなるよう塗布した後、高圧水銀灯(コールドミラー付き、ランプ出力80W/cm)を用い、紫外線を100mJ/cm2照射した。このようにして得られた試験片の塗膜性能を測定した。
【0019】
【比較例1〜3】
第1表のようなエポキシ樹脂に実施例1〜5と同様、光カチオン重合開始剤を添加し、光硬化させた後、評価を行った。
【0020】
実施例、比較例中の測定評価は次のような方法でおこなった。
【0021】
1)密着性:硬化皮膜に1mm間隔で基材まで到達するクロスカットを入れ、1mm2の碁盤目を100個作り、その上にセロファンテープを貼り付けてから急激に剥がし、剥離した碁盤目の数により、5:剥離数…0個、4:剥離数…1〜25個、3:剥離数…25〜50個、2:剥離数…50〜75個、1:剥離数…75〜100個、により表示した。
【0022】
2)耐溶剤性:塗膜を各溶剤(エタノール,イソプロピルアルコール,テトラヒドロフラン)を染み込ませた脱脂綿で100回ラビングした後、塗膜の状態を目視により観察した。塗膜に変化のないものを○と評価し、光沢が低下したものを△と評価し、剥離または溶解したものを×と評価した。
【0023】
3)膜厚の評価方法:各配合樹脂を、バーコーターNo.3(膜厚約7μm用)を用いて塗膜を作成し、高圧水銀灯を用い硬化させた後、膜厚計にて膜厚を測定した。これを5回評価し、得られた膜厚の平均値が、7μmであるものを○と評価し、8〜12μmであるものを△と評価し、13〜25μmであるものを×と評価した。
【0024】
【表1】
【0025】
【発明の効果】
本発明の光硬化性樹脂組成物は、紫外線や電子線等の活性エネルギー線を照射することにより、密着性と耐溶剤性の両方の性能を有し、硬化収縮が小さく、さらに低光量にて硬化皮膜を形成することができる。また、本発明の光硬化性樹脂組成物は適度な粘度であり、作業性が良く薄膜化しやすいことから、塗料、フィルムコーティング、金属コーティング、家具の塗装など種々のコーティング剤、ライニング剤、接着剤、積層板、プリント基板、レジストインキ、半導体封止剤、光造形等の用途に応用可能である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a photocurable resin composition that gives a cured film excellent in adhesion to a substrate and solvent resistance by irradiation with active energy rays such as ultraviolet rays and electron beams. More specifically, it is useful for various coating agents such as paint, film coating, metal coating, furniture painting, lining agent, adhesive, laminate, printed circuit board, resist ink, semiconductor sealant, stereolithography, etc. The present invention relates to a photocurable resin composition that can be cured with a low light quantity.
[0002]
[Prior art]
Epoxy resins are widely used in fields such as electrical and electronic fields, civil engineering and building fields, paints and adhesives. Of these, polyglycidyl ethers are widely used as reactive diluents, crosslinking agents, and resin modifiers because they generally have good compatibility with epoxy resins and other emulsion resins. . Recently, it has also been used as a curing material for photopolymerization.
[0003]
[Problems to be solved by the invention]
In general, a photocured polyhydric alcohol compound polyglycidyl ether exhibits excellent properties such as water resistance, heat resistance, toughness, and solvent resistance. However, when these are used alone, various problems such as poor adhesion to the substrate, relatively large cure shrinkage, and difficulty in curing at low light intensity have been observed. In addition, although the epoxidized polybutadiene resin is excellent in adhesion to a film, etc., it has a high viscosity, so that there is a problem that workability when forming a coating film is poor and it is difficult to form a thin film. For this reason, it has been difficult to use these resins for photo-curing resins in applications such as printing, paint, and electrical insulation.
[0004]
[Means for Solving the Problems]
As a result of intensive studies to solve the above-mentioned problems, the present inventors have used both of these in combination to have both adhesion and solvent resistance performance, low curing shrinkage, low The inventors have found that a cured film can be formed with a light amount, and that a photocurable resin composition having an appropriate viscosity and easily formed into a thin film can be obtained, and the present invention has been achieved.
[0005]
That is, the present invention provides (a) the general formula (1)
[Chemical 1]
(However, R1 is a residue obtained by removing an OH group from a polyhydric alcohol compound, R2 is a methyl group or a hydrogen atom, R3 is a glycidyl group or a hydrogen atom, l, m, and n are each an integer, and 2 ≦ l + n ≦ 6, 0 ≦ m ≦ 2, 2 ≦ n ≦ 6, 0 ≦ l ≦ 5)), and (b) the epoxidized polybutadiene resin 30. (C) 0.1 to 10 parts by weight of the photopolymerization initiator with respect to 100 parts by weight of the main component containing -85% by weight (provided that the total of the components (a) and (b) is 100% by weight). The photocurable resin composition used is provided. Hereinafter, the present invention will be described in more detail.
[0006]
Detailed configuration and operation of the invention
The polyglycidyl ether of the polyhydric alcohol compound (a) in the main ingredient component in the composition of the present invention can be synthesized by a general method, and can be obtained by reacting the polyhydric alcohol with epichlorohydrin. This is a two-stage reaction method in which an addition reaction is performed using an amine or a Lewis acid catalyst in an inert solvent such as toluene or xylene, and then a ring-closing reaction is performed using an alkali such as NaOH, It can be synthesized using a method of reacting directly in one step with an alkali in an epichlorohydrin solvent.
[0007]
Examples of the polyglycidyl ether compound represented by the general formula (1) in the present invention include neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether. , Tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, trimethylolpropane polyglycidyl ether, glycerin polyglycidyl ether, diglycerin polyglycidyl ether, polyglycerin polyglycidyl ether and trimethylolpropane, glycerin, Polyglycidyl ethers of alkylene oxide adducts such as diglycerin and polyglycerin can be used but are preferred. Are glycerin polyglycidyl ether, trimethylolpropane polyglycidyl ether, a polyglycerol polyglycidyl ether, particularly preferably glycerol polyglycidyl ether, trimethylolpropane polyglycidyl ether.
[0008]
The blending amount of the polyglycidyl ether compound in the main component is 15 to 70% by weight. If it is 15% or less, the viscosity of the blend is high and it is difficult to form a thin film. It will be enough. Among these, Preferably it is 20 to 60 weight%.
[0009]
The reaction equivalent ratio of epichlorohydrin to the hydroxyl group of the polyhydric alcohol compound in the present invention can be adjusted at an arbitrary ratio so as to obtain the intended performance, but is preferably 0.5 to 1.2.
[0010]
Next, the epoxidized polybutadiene resin which is (b) in the main ingredient component in the composition of the present invention can be obtained by epoxidizing the double bond in polybutadiene using a peroxide such as peracetic acid. . The epoxidized polybutadiene may be linear or branched as long as the number average molecular weight is in the range of 500 to 20,000. If it is 500 or less, the adhesion of the resulting coating film is not sufficient, which is not preferable. On the other hand, when the viscosity is 20,000 or more, the viscosity is too high and it is difficult to obtain a coating film, which is not preferable for practical use. More preferably, the number average molecular weight is in the range of 500 to 15,000. Although it does not specifically limit as a specific example of such a polybutadiene, R-15HT, R-45HT by Idemitsu Petrochemical Co., Ltd., B-1000, B-2000, B by Nippon Soda Co., Ltd. -3000, G-1000, G-2000, G-3000, and Nippon Petrochemical Co., Ltd. B-700, B-1000, B-2000, B-3000 etc. are mentioned.
[0011]
The polybutadiene used contains a plurality of hydroxyl groups in one molecule of polybutadiene, and the total double bond ratio of 1,4-cis and 1,4-trans is greater than 1,2-vinyl. Is preferred.
[0012]
The oxirane oxygen concentration of the epoxidized polybutadiene resin obtained by epoxidizing this polybutadiene with peracetic acid or the like is preferably 3 wt% to 18 wt%, more preferably 6 wt% to 12 wt%. When the oxirane oxygen concentration is less than 3 wt%, the compatibility with other resins is deteriorated, which is not preferable. On the other hand, when it is more than 18 wt%, the resulting coating film has insufficient impact resistance. An example of such an epoxidized polybutadiene resin is Epolide PB3600 manufactured by Daicel Chemical Industries, Ltd. The blending amount of the epoxidized polybutadiene resin in the main component is 30 to 85% by weight, more preferably 40 to 80% by weight. If it is 30% by weight or less, it is not preferable because sufficient adhesion cannot be obtained, and if it is 85% by weight or more, the viscosity of the composition is too high, and it is not preferable because it is difficult to form a thin film.
[0013]
The (c) photopolymerization initiator as a catalyst used in the photocurable resin composition of the present invention is not particularly limited as long as it generates a photocationic polymerization initiator, and is an ionic light generation type. Or a non-ionic light generation type.
[0014]
Specific examples of the ionic photoacid generation type photocationic polymerization initiator are not particularly limited, but for example, aromatic sulfonium salts include bis [4- (diphenylsulfonio) phenyl] sulfide bis. Hexafluorophosphate, bis [4- (diphenylsulfonio) phenyl] sulfide bishexafluoroantimonate, bis [4- (diphenylsulfonio) phenyl] sulfide bistetrafluoroborate, bis [4- (diphenylsulfonio) phenyl ] Sulfide tetrakis (pentafluorophenyl) borate, diphenyl-4- (phenylthio) phenylsulfonium hexafluorophosphate, diphenyl-4- (phenylthio) phenylsulfonium hexafluoroantimonate, diphenyl-4 (Phenylthio) phenylsulfonium tetrafluoroborate, diphenyl-4- (phenylthio) phenylsulfonium tetrakis (pentafluorophenyl) borate, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrafluoroborate, tri Phenylsulfonium tetrakis (pentafluorophenyl) borate, bis [4- (di (4- (2-hydroxyethoxy)) phenylsulfonio) phenyl] sulfide bishexafluorophosphate, bis [4- (di (4- (2 -Hydroxyethoxy)) phenylsulfonio) phenyl] sulfide bishexafluoroantimonate, bis [4- (di (4- (2-hydroxy) Toxi)) phenylsulfonio) phenyl] sulfide bistetrafluoroborate, bis [4- (di (4- (2-hydroxyethoxy)) phenylsulfonio) phenyl] sulfidetetrakis (pentafluorophenyl) borate, etc .; aromatic iodonium Examples of salts include diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium tetrafluoroborate, diphenyliodoniumtetrakis (pentafluorophenyl) borate, bis (dodecylphenyl) iodonium hexafluorophosphate, bis (dodecylphenyl) Iodonium hexafluoroantimonate, bis (dodecylphenyl) iodonium tetrafluoroborate, bis (dodecylsulfate) Enyl) iodonium tetrakis (pentafluorophenyl) borate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium hexafluorophosphate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium hexafluoroantimonate 4-methylphenyl-4- (1-methylethyl) phenyliodonium tetrafluoroborate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium tetrakis (pentafluorophenyl) borate, etc .; aromatic diazonium salts , Phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, phenyldiazonium tetrakis (pentafur Rofeniru) borate, and the like, one or two or more of these can be used. When two or more types of photocationic polymerization initiators are used in combination, multistage curing may be performed using two or more types of photocationic polymerization initiators having different effective active wavelengths.
[0015]
Although the compounding quantity of the said photocationic polymerization initiator is not specifically limited, 0.1-10 weight part is preferable with respect to 100 weight part of main ingredient components, and 1-5 weight part is especially preferable. When the amount is 0.1 parts by weight or less, the amount of acid generated by the initiator upon irradiation with energy rays is too small to obtain a sufficient cured product. When the amount exceeds 10 parts by weight, the amount of acid generated from the initiator As the amount of impurities finally increases and the amount of impurities remaining in the cured product increases, adverse effects such as corrosion around the cured product occur.
[0016]
As a coating method of the photocurable resin composition of the present invention, methods such as brush coating, spray coating, dip coating, spin coating, and curtain coating are used. Examples of the active energy ray include a xenon lamp, a metal halide lamp, an Fe-based metal halide lamp, a mercury lamp, and a high-pressure mercury lamp, and a mercury lamp, particularly preferably a high-pressure mercury lamp is used.
[0017]
【Example】
Hereinafter, the present invention will be specifically described, but the present invention is not limited thereto. In the examples and comparative examples, “parts” means “parts by weight”.
[0018]
Examples 1-5
A triallyl sulfonium hexafluorophosphate salt mixture (“UVI 6990” manufactured by Union Carbide Japan Co., Ltd.) is added to the formulation shown in Table 1 as a photocationic polymerization initiator. This compounded resin was cured as follows. That is, as a pretreatment, a compounded resin is applied to a PET film (100 μm thick) washed with acetone so as to have a film thickness of 10 μm, and then a high-pressure mercury lamp (with a cold mirror, lamp output 80 W / cm) is used and ultraviolet rays are 100 mJ / cm. 2 irradiated. The coating film performance of the test piece thus obtained was measured.
[0019]
[Comparative Examples 1-3]
Evaluation was performed after adding a photocationic polymerization initiator to the epoxy resin as shown in Table 1 and curing it in the same manner as in Examples 1-5.
[0020]
Measurement and evaluation in Examples and Comparative Examples were performed by the following methods.
[0021]
1) Adhesiveness: Put a cross cut that reaches the substrate at 1 mm intervals in the cured film, make 100 1 mm 2 grids, apply cellophane tape on them, and then peel off rapidly, then peel off the grids Depending on the number, 5: number of peels ... 0, 4: number of peels ... 1-25, 3: number of peels ... 25-50, 2: number of peels ... 50-75, 1: number of peels ... 75-100 , Displayed.
[0022]
2) Solvent resistance: The coating film was rubbed 100 times with absorbent cotton soaked with each solvent (ethanol, isopropyl alcohol, tetrahydrofuran), and the state of the coating film was visually observed. Those with no change in the coating film were evaluated as ◯, those with decreased gloss were evaluated as △, and those peeled or dissolved were evaluated as ×.
[0023]
3) Evaluation method of film thickness: Each compounded resin was subjected to bar coater No. 3 (for a film thickness of about 7 μm) was prepared and cured using a high-pressure mercury lamp, and then the film thickness was measured with a film thickness meter. This was evaluated 5 times, and the average value of the film thickness obtained was evaluated as ◯, evaluated as △ when it was 8-12 μm, and evaluated as x when it was 13-25 μm. .
[0024]
[Table 1]
[0025]
【The invention's effect】
The photocurable resin composition of the present invention has both adhesion and solvent resistance performance by irradiating active energy rays such as ultraviolet rays and electron beams, has a small curing shrinkage, and has a low light intensity. A cured film can be formed. In addition, since the photocurable resin composition of the present invention has an appropriate viscosity and is easy to work with and has a good workability, various coating agents such as paints, film coatings, metal coatings, and furniture coatings, lining agents, and adhesives It can be applied to uses such as laminates, printed boards, resist inks, semiconductor sealants, and optical modeling.
Claims (1)
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|---|---|---|---|
| JP2002106286A JP3766810B2 (en) | 2002-04-09 | 2002-04-09 | Photocurable resin composition |
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| JP2002106286A JP3766810B2 (en) | 2002-04-09 | 2002-04-09 | Photocurable resin composition |
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| JP3766810B2 true JP3766810B2 (en) | 2006-04-19 |
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| JP3896119B2 (en) * | 2003-01-09 | 2007-03-22 | 積水化学工業株式会社 | Photocurable resin composition for display element and display element |
| JP4729908B2 (en) * | 2004-11-25 | 2011-07-20 | パナソニック電工株式会社 | Epoxy resin composition, method for producing the same, optical waveguide and electronic component |
| JP4810911B2 (en) * | 2005-07-26 | 2011-11-09 | パナソニック電工株式会社 | Epoxy resin composition, epoxy resin film, optical waveguide, optical / electrical hybrid wiring board, and electronic device |
| JP4991648B2 (en) * | 2008-06-30 | 2012-08-01 | 積水化学工業株式会社 | Organic electroluminescent device sealant |
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