JP3768849B2 - Soldering iron - Google Patents
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- JP3768849B2 JP3768849B2 JP2001256167A JP2001256167A JP3768849B2 JP 3768849 B2 JP3768849 B2 JP 3768849B2 JP 2001256167 A JP2001256167 A JP 2001256167A JP 2001256167 A JP2001256167 A JP 2001256167A JP 3768849 B2 JP3768849 B2 JP 3768849B2
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims description 106
- 229910052742 iron Inorganic materials 0.000 title claims description 49
- 238000005476 soldering Methods 0.000 title claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 61
- 230000003628 erosive effect Effects 0.000 claims description 31
- 230000004907 flux Effects 0.000 claims description 25
- 239000012535 impurity Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 15
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000005259 measurement Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017091 Fe-Sn Inorganic materials 0.000 description 1
- 229910017142 Fe—Sn Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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Description
【０００１】
【発明の属する技術分野】
本発明は、フラックス成分を内蔵して糸状に形成された、いわゆるヤニ入り糸半田に関し、特に、半田ごてコテ先のＦｅメッキ層の溶解を抑制する半田に関する。
【０００２】
【従来の技術】
半田ごては、一般に、回路基板から電子部品を取り外したり、回路基板に電子部品を取付ける目的で使用される。かかる半田ごてで使用する半田としては、ヤニ入り糸半田が好適に用いられており、半田の組成としては、ＳｎとＰｂとを主成分とするものが一般的に用いられてきた。
【０００３】
ところが、昨今、地球環境の悪化を考慮してＰｂを含まない半田（Ｐｂフリー半田）が推奨され、半田付け性の良好な各種のＰｂフリー半田も提案されている。
【０００４】
【発明が解決しようとする課題】
しかしながら、Ｐｂフリーの半田の場合には、Ｐｂを含有する半田に比べ融点が高いので、半田ごてのコテ先温度を高く設定するしかなく、その結果、半田付け性は良好でも半田ごてのコテ先の劣化が激しいという問題がある。特に、半田ごて用の半田の場合には、ヤニ入り糸半田を用いるので、フラックス成分も作用してコテ先のＦｅメッキ層の侵食が激しく、コテ先の寿命が短いという問題がある。
【０００５】
本発明は、上記の問題点に着目してなされたものであって、ヤニ入り糸半田に好適な半田であって、半田ごてコテ先のＦｅメッキ層の侵食を抑制する半田を提供することを課題とする。
【０００６】
【課題を解決するための手段】
上記課題を解決するために、本発明者がヤニ入り糸半田について鋭意研究したところ、所定量のＦｅを含有させることで、半田付け性を劣化させることなく、半田コテ先のＦｅメッキ層の劣化を防止できることを見出し本発明に至った。
【０００７】
すなわち、本発明は、フラックス成分を内蔵して糸状に形成された半田であって、前記フラックス成分を除いて、Ｆｅ０．０１〜０．２重量％含有させることを特徴とする。Ｆｅ含有量は、好ましくは０．０１５〜０．０９重量％であり、より好ましくは０．０３〜０．０６重量％である。
【０００８】
本発明をＰｂフリー半田に適用する場合には、Ｓｎ以外の有効成分として「Ａｇ０．２〜５重量％、Ｆｅ０．０１〜０．２重量％」、「Ａｇ０．２〜５重量％、Ｃｕ０．１〜２．５重量％、Ｆｅ０．０１〜０．２重量％」、「Ｃｕ０．１〜２．５重量％、Ｆｅ０．０１〜０．２重量％」、「Ａｇ０．２〜５重量％、Ｃｕ０．１〜２．５重量％、Ｂｉ０．１〜５重量％、Ｆｅ０．０１〜０．２重量％」、「Ａｇ０．２〜５重量％、Ｂｉ０．１〜５重量％、Ｆｅ０．０１〜０．２重量％」の組合せが好適である。
【０００９】
Ａｇの含有量は、好ましくは２〜４重量％である。Ｃｕの含有量は、好ましくは０．２〜１．２重量％である。Ｂｉの含有量は、好ましくは０．２〜３重量％である。なお、上記の組合せに追加してＮｉ及び／又はＣｏを総量０．０５〜１重量％含有させると更に好適である。より好ましい数値範囲としては０．１〜０．５重量％である。
【００１０】
一方、本発明は、Ｐｂを含有する半田にも適用可能であり、フラックス成分を除く半田の組成は、Ｐｂ０．１〜６０重量％、Ｆｅ０．０１〜０．２重量％、残部がＳｎ及び不可避不純物である。Ｐｂは、好ましくは２０〜５０重量％、より好ましくは３０〜４５重量％である。また、Ｆｅ含有量は、好ましくは０．０１５〜０．０９重量％であり、より好ましくは０．０３〜０．０６重量％である。この発明においても、Ｎｉ及び／又はＣｏを総量０．０５〜１重量％含有させると更に好適である。なお、より好ましい数値範囲としては０．１〜０．５重量％である。
また、フラックス成分を除く半田の組成が、Ａｇ０．２〜５重量％、Ｎｉ０．０５〜１重量％、残部がＳｎ及び不可避不純物である場合や、Ａｇ０．２〜５重量％、Ｃｏ０．０５〜１重量％、残部がＳｎ及び不可避不純物である場合にもほぼ遜色のない効果が得られる。ここで、Ｎｉの含有量は、好ましくは０．１〜０．５重量％である。また、Ｃｏの含有量は、好ましくは０．１〜０．５重量％である。
【００１１】
【発明の実施の形態】
以下、本発明を実施例により説明するが、これらの実施例は本発明の範囲を限定するものではない。
【００１２】
【表１】
［実施例１］基礎データ（表１参照）
（１）比較例１（Ｓｎ−Ｐｂ）
Ｐｂ３７％（重量％以下同じ）、残部Ｓｎと不可避不純物とからなる半田（試料１）を半田浴槽に４５０℃で溶融させ、これに丸棒状の鉄を浸して、平均浸食量を測定した。その結果、２時間後の平均浸食量が８μｍであり（データ▲１▼）、８時間後の平均浸食量は６０μｍとなった（データ▲２▼）。
【００１４】
（２）Ｓｎ−Ｐｂ−Ｆｅの実施例
これに対して、Ｐｂ３７％、Ｆｅ０．０５％、残部Ｓｎと不可避不純物とからなる半田（試料２）について同様の実験を行ったところ、８時間後の平均浸食量は１０μｍとなった（データ▲３▼）。
【００１５】
（３）比較例２（Ｓｎ−Ａｇ）
Ａｇ３．５％、残部Ｓｎと不可避不純物とからなる半田（試料３）を半田浴槽に４５０℃で溶融させ、これに丸棒状の鉄を浸して２時間後の平均浸食量を測定すると、平均浸食量が３０μｍであった（データ▲４▼）。溶融温度を４００℃に降下させると４時間後でも平均浸食量は２５μｍに軽減された（データ▲５▼）。溶融温度を更に３５０℃に降下させると、４時間後でも平均浸食量は１５μｍであった（データ▲６▼）。
【００１６】
（４）Ｓｎ−Ａｇ−Ｆｅの実施例
これに対して、Ａｇ３．５％、Ｆｅ０．０２３％、残部Ｓｎと不可避不純物とからなる半田（試料４）を半田浴槽に４００℃で溶融させ、これに丸棒状の鉄を浸して４時間後の平均浸食量を測定すると、平均浸食量が２μｍであった（データ▲７▼）。比較例２のデータ▲５▼との対比より、Ｆｅを０．０２３％含有させると同一溶解温度（４００℃）同一浸漬時間（４時間）でも平均浸食量が２５μｍから２μｍに低減されることが明らかとなった。
【００１７】
また、Ａｇ３．５％、Ｆｅ０．０１６％、残部Ｓｎと不可避不純物とからなる半田（試料５）を半田浴槽に３５０℃で溶融させ、これに丸棒状の鉄を４時間浸した後の平均浸食量は３μｍであった（データ▲８▼）。溶融温度が低いと浸食量が少ないのは上記データ▲４▼▲５▼▲６▼の傾向から明らかであるが、データ▲７▼との比較により、溶融温度を５０度低下させた場合、Ｆｅの含有量を減らしても浸漬時間の増加に係わらず、ほぼ同程度の浸食量に軽減されることが明らかとなった。
【００１８】
［実施例２］
以上の基礎実験の結果を踏まえ、半田ゴテ用の半田としての特性実験を行った。図１は、実験装置を概略的に図示したものである。試験片ＥＸとしては、円柱棒状の銅製基体１（直径５．２ｍｍ）に２００μｍ程度の鉄メッキ層２を設け、その外周に測定部３を除いてクロムメッキ層４を設けたものを使用した。なお、測定部３は鉄メッキ層の侵食を測定する部分であり、その直径は、３．０ｍｍである。
【００１９】
一方、このような測定部３に向けて、線径１．０φのヤニ入り糸半田５送り込み侵食量を測定した。侵食量の計測においては、試験片ＥＸの軸方向に中心線に沿って切断して測定部３における上部（Ａ）中心部（Ｂ）下部（Ｃ）の三箇所について侵食量を計測した。
【００２０】
使用したヤニ入り糸半田は下記の通りである。なお、ヤニ入り糸半田とは、糸半田５の中心部６に３％程度のフラックスを含有させたものを言う。フラックスは、一般に、ロジン系のものとハロゲン系のものに分かれるが、ハロゲン系のものを使用した。そして、以下の表では、フラックス成分を除いた重量％を示している。なお、これ以外に不可避不純物を含むのは勿論である。
【００２１】
【表２】
試験片ＥＸを３００℃、３５０℃、４００℃、４５０℃に設定した状態で、上記試料（６〜１５）を測定部３に向けて、１回に５ｍｍずつ１分間に２０回送り込み、この動作を合計２０００回繰り返して測定部３の侵食量を測定した。なお、半田を図示の矢印の方向に６〜７回送り込むと、半田は自重によって落下する。
【００２３】
【表３】
表３は、測定結果の一部を図示したものであり、上部（Ａ）中央部（Ｂ）下部（Ｃ）のうち、最大値を記載している。Ｐｂ−Ｆｅ−Ｓｎの組合せである試料１５が最も侵食量が少ないことが明らかとなった。また、鉛を含まないＰｂフリー半田は融点が高いため、一般に鉄メッキの侵食量が大きいが（試料６、試料７）、微量の鉄を含有させることで（試料９他）、鉛入り半田（試料８）と遜色のない特性が得られることが確認された。
【００２５】
なお、図示省略しているが、試料１０〜１４についても、試料８と試料７の間の特性が得られた。
【００２６】
【発明の効果】
以上説明したように、本発明によれば、ヤニ入り糸半田に好適な半田であって、半田ごてコテ先のＦｅメッキ層の侵食を抑制する半田を実現できる。
【図面の簡単な説明】
【図１】実施例を説明する図面である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a so-called yarn-filled yarn solder that is formed into a thread shape with a built-in flux component, and more particularly, to a solder that suppresses dissolution of an Fe plating layer on a soldering iron tip.
[0002]
[Prior art]
The soldering iron is generally used for the purpose of removing an electronic component from a circuit board or attaching an electronic component to the circuit board. As the solder to be used in such a soldering iron, yarn-filled thread solder is preferably used, and as a solder composition, a solder composed mainly of Sn and Pb has been generally used.
[0003]
However, recently, considering the deterioration of the global environment, solder containing no Pb (Pb-free solder) is recommended, and various Pb-free solders having good solderability have also been proposed.
[0004]
[Problems to be solved by the invention]
However, in the case of Pb-free solder, the melting point is higher than that of Pb-containing solder, so the soldering iron tip temperature must be set high. As a result, even if solderability is good, There is a problem that the iron tip is severely degraded. In particular, in the case of solder for a soldering iron, yarn-filled yarn solder is used, so that there is a problem that the flux component also acts to cause erosion of the iron plating layer at the tip of the iron, resulting in a short life of the tip.
[0005]
The present invention has been made paying attention to the above-mentioned problems, and provides a solder suitable for a yarn-containing yarn solder, which suppresses erosion of the Fe plating layer on the soldering iron tip. Is an issue.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present inventor has conducted intensive research on spear-filled yarn solder. By including a predetermined amount of Fe, the deterioration of the Fe plating layer of the soldering iron tip without deteriorating the solderability. The inventors have found that this can be prevented, and have reached the present invention.
[0007]
That is, the present invention is a solder formed in a thread shape with a built-in flux component, and is characterized by containing 0.01 to 0.2% by weight of Fe excluding the flux component. Fe content becomes like this. Preferably it is 0.015-0.09 weight%, More preferably, it is 0.03-0.06 weight%.
[0008]
When the present invention is applied to Pb-free solder, “Ag 0.2 to 5% by weight, Fe 0.01 to 0.2% by weight”, “Ag 0.2 to 5% by weight, Cu 0. 1 to 2.5 wt%, Fe 0.01 to 0.2 wt% "," Cu 0.1 to 2.5 wt%, Fe 0.01 to 0.2 wt% "," Ag 0.2 to 5 wt%, Cu 0.1-2.5 wt%, Bi 0.1-5 wt%, Fe 0.01-0.2 wt% ”,“ Ag 0.2-5 wt%, Bi 0.1-5 wt%, Fe 0.01- A combination of “0.2% by weight” is preferred.
[0009]
The content of Ag is preferably 2 to 4% by weight. The Cu content is preferably 0.2 to 1.2% by weight. The Bi content is preferably 0.2 to 3% by weight. It is more preferable to add Ni and / or Co in a total amount of 0.05 to 1% by weight in addition to the above combination. A more preferable numerical range is 0.1 to 0.5% by weight.
[0010]
On the other hand, the present invention is also applicable to solder containing Pb, and the composition of the solder excluding the flux component is 0.1 to 60% by weight of Pb, 0.01 to 0.2% by weight of Fe, and the balance is Sn and inevitable. It is an impurity. Pb is preferably 20 to 50% by weight, more preferably 30 to 45% by weight. Moreover, Fe content becomes like this. Preferably it is 0.015-0.09 weight%, More preferably, it is 0.03-0.06 weight%. Also in this invention, it is more preferable to contain Ni and / or Co in a total amount of 0.05 to 1% by weight. In addition, as a more preferable numerical range, it is 0.1 to 0.5 weight%.
Also, the composition of the solder excluding the flux component is Ag 0.2-5 wt%, Ni 0.05-1 wt%, the balance is Sn and inevitable impurities, Ag 0.2-5 wt%, Co 0.05- Even when the content is 1% by weight and the balance is Sn and inevitable impurities, an almost inferior effect can be obtained. Here, the content of Ni is preferably 0.1 to 0.5% by weight. The Co content is preferably 0.1 to 0.5% by weight.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described by way of examples, but these examples do not limit the scope of the present invention.
[0012]
[Table 1]
[Example 1] Basic data (see Table 1)
(1) Comparative Example 1 (Sn—Pb)
Solder (sample 1) consisting of Pb 37% (the same as below in weight%), the remaining Sn and inevitable impurities was melted in a solder bath at 450 ° C., and a rod-like iron was immersed in this, and the average erosion amount was measured. As a result, the average erosion amount after 2 hours was 8 μm (data (1)), and the average erosion amount after 8 hours was 60 μm (data (2)).
[0014]
(2) Example of Sn-Pb-Fe On the other hand, when a similar experiment was performed on solder (sample 2) composed of Pb 37%, Fe 0.05%, remaining Sn and inevitable impurities, 8 hours later The average erosion amount was 10 μm (data (3)).
[0015]
(3) Comparative Example 2 (Sn-Ag)
When the solder (sample 3) composed of 3.5% Ag, the balance Sn and inevitable impurities is melted in a solder bath at 450 ° C., and a rod-like iron is immersed in this, the average erosion amount after 2 hours is measured. The amount was 30 μm (data (4)). When the melting temperature was lowered to 400 ° C., the average erosion amount was reduced to 25 μm even after 4 hours (data (5)). When the melting temperature was further lowered to 350 ° C., the average erosion amount was 15 μm even after 4 hours (data (6)).
[0016]
(4) Example of Sn-Ag-Fe On the other hand, solder (sample 4) composed of Ag 3.5%, Fe 0.023%, remaining Sn and inevitable impurities was melted in a solder bath at 400 ° C. When the average erosion amount after 4 hours was measured after immersing the rod-shaped iron in the sample, the average erosion amount was 2 μm (data (7)). From the comparison with data (5) of Comparative Example 2, when 0.023% of Fe is contained, the average erosion amount is reduced from 25 μm to 2 μm even at the same dissolution temperature (400 ° C.) and the same immersion time (4 hours). It became clear.
[0017]
Also, the average erosion after the solder (sample 5) consisting of Ag 3.5%, Fe 0.016%, the balance Sn and inevitable impurities was melted in a solder bath at 350 ° C., and the rod-like iron was immersed in this for 4 hours. The amount was 3 μm (data (8)). It is clear from the tendency of the above data (4), (5), and (6) that the erosion amount is small when the melting temperature is low, but in comparison with the data (7), when the melting temperature is lowered by 50 degrees, Fe It has been clarified that even if the content of is reduced, the erosion amount is reduced to approximately the same level regardless of the increase in the immersion time.
[0018]
[Example 2]
Based on the results of the above basic experiment, a characteristic experiment as a soldering iron was conducted. FIG. 1 schematically illustrates an experimental apparatus. As the test piece EX, a cylindrical bar-shaped copper base 1 (diameter: 5.2 mm) provided with an
[0019]
On the other hand, the amount of erosion of the yarn-filled
[0020]
The yarn solder containing spear used is as follows. In addition, the yarn-containing thread solder refers to a solder containing about 3% flux in the center portion 6 of the
[0021]
[Table 2]
With the test piece EX set to 300 ° C., 350 ° C., 400 ° C., and 450 ° C., the sample (6 to 15) is directed to the
[0023]
[Table 3]
Table 3 shows a part of the measurement results, and shows the maximum value among the upper part (A), the central part (B), and the lower part (C). It became clear that the sample 15 which is a combination of Pb—Fe—Sn has the least amount of erosion. In addition, Pb-free solder that does not contain lead has a high melting point, and thus the amount of erosion of iron plating is generally large (Sample 6 and Sample 7). However, by containing a small amount of iron (Sample 9 and others), lead-containing solder (sample 9) It was confirmed that characteristics comparable to those of sample 8) were obtained.
[0025]
Although not shown, the characteristics between Sample 8 and Sample 7 were also obtained for Samples 10-14.
[0026]
【The invention's effect】
As described above, according to the present invention, it is possible to realize a solder that is suitable for the yarn-containing thread solder and that suppresses the erosion of the Fe plating layer on the soldering iron tip.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an embodiment.
Claims (8)
前記フラックス成分を除く半田の組成は、Ａｇ０．２〜５重量％、Ｆｅ０．０１５〜０．０９重量％、残部がＳｎ及び不可避不純物であることを特徴とする、半田ごてコテ先のＦｅメッキ層の侵食を抑制する、半田ごて用の半田。Solder formed in a thread shape with a built-in flux component,
The solder composition excluding the flux component, Ag0.2～5 wt%, Fe from 0.015 to 0.09 wt%, and the balance being Sn and unavoidable impurities, the soldering iron tip Fe Soldering iron that suppresses erosion of the plating layer .
前記フラックス成分を除く半田の組成は、Ａｇ０．２〜５重量％、Ｃｕ０．１〜２．５重量％、Ｆｅ０．０１〜０．２重量％、残部がＳｎ及び不可避不純物であることを特徴とする、半田ごてコテ先のＦｅメッキ層の侵食を抑制する、半田ごて用の半田。Solder formed in a thread shape with a built-in flux component,
The composition of the solder excluding the flux component is characterized by Ag 0.2-5 wt%, Cu 0.1-2.5 wt%, Fe 0.01-0.2 wt%, the balance being Sn and inevitable impurities. Soldering iron for soldering iron that suppresses erosion of the iron plating layer on the tip of the soldering iron.
前記フラックス成分を除く半田の組成は、Ｃｕ０．１〜２．５重量％、Ｆｅ０．０１５〜０．０９重量％、残部がＳｎ及び不可避不純物であることを特徴とする、半田ごてコテ先のＦｅメッキ層の侵食を抑制する、半田ごて用の半田。Solder formed in a thread shape with a built-in flux component,
The soldering iron tip is characterized in that the composition of the solder excluding the flux component is 0.1 to 2.5% by weight of Cu, 0.015 to 0.09% by weight of Fe, and the balance is Sn and inevitable impurities. Soldering iron that suppresses erosion of the Fe plating layer .
前記フラックス成分を除く半田の組成は、Ａｇ０．２〜５重量％、Ｃｕ０．１〜２．５重量％、Ｂｉ０．１〜５重量％、Ｆｅ０．０１〜０．２重量％、残部がＳｎ及び不可避不純物であることを特徴とする、半田ごてコテ先のＦｅメッキ層の侵食を抑制する、半田ごて用の半田。Solder formed in a thread shape with a built-in flux component,
The composition of the solder excluding the flux component is as follows: Ag 0.2-5 wt%, Cu 0.1-2.5 wt%, Bi 0.1-5 wt%, Fe 0.01-0.2 wt%, the balance being Sn and Solder for a soldering iron, which is an inevitable impurity and suppresses erosion of the Fe plating layer on the tip of the soldering iron.
前記フラックス成分を除く半田の組成は、Ａｇ０．２〜５重量％、Ｂｉ０．１〜５重量％、Ｆｅ０．０１〜０．２重量％、残部がＳｎ及び不可避不純物であることを特徴とする、半田ごてコテ先のＦｅメッキ層の侵食を抑制する、半田ごて用の半田。Solder formed in a thread shape with a built-in flux component,
The composition of the solder excluding the flux component is characterized by Ag 0.2-5 wt%, Bi 0.1-5 wt%, Fe 0.01-0.2 wt%, the balance being Sn and inevitable impurities , Solder for the soldering iron that suppresses erosion of the Fe plating layer on the tip of the soldering iron.
前記フラックス成分を除く半田の組成は、Ｐｂ０．１〜６０重量％、Ｆｅ０．０１５〜０．０９重量％、残部がＳｎ及び不可避不純物であることを特徴とする、半田ごてコテ先のＦｅメッキ層の侵食を抑制する、半田ごて用の半田。Solder formed in a thread shape with a built-in flux component,
The solder composition excluding the flux component, Pb0.1～60 wt%, Fe from 0.015 to 0.09 wt%, and the balance being Sn and unavoidable impurities, the soldering iron tip Fe Soldering iron that suppresses erosion of the plating layer .
前記フラックス成分を除く半田の組成は、Ａｇ０．２〜５重量％、Ｎｉ０．０５〜１重量％、残部がＳｎ及び不可避不純物であることを特徴とする、半田ごてコテ先のＦｅメッキ層の侵食を抑制する、半田ごて用の半田。Solder formed in a thread shape with a built-in flux component,
The composition of the solder excluding the flux component is 0.2 to 5% by weight of Ag, 0.05 to 1% by weight of Ni, and the balance is Sn and inevitable impurities . Solder for soldering iron that suppresses erosion .
前記フラックス成分を除く半田の組成は、Ａｇ０．２〜５重量％、Ｃｏ０．０５〜１重量％、残部がＳｎ及び不可避不純物であることを特徴とする、半田ごてコテ先のＦｅメッキ層の侵食を抑制する、半田ごて用の半田。Solder formed in a thread shape with a built-in flux component,
The composition of the solder excluding the flux component is 0.2 to 5% by weight of Ag, 0.05 to 1% by weight of Co, and the balance is Sn and inevitable impurities . Solder for soldering iron that suppresses erosion .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001256167A JP3768849B2 (en) | 2001-08-27 | 2001-08-27 | Soldering iron |
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|---|---|---|---|
| JP2001256167A JP3768849B2 (en) | 2001-08-27 | 2001-08-27 | Soldering iron |
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| JP3768849B2 true JP3768849B2 (en) | 2006-04-19 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7172726B2 (en) * | 2002-10-15 | 2007-02-06 | Senju Metal Industry Co., Ltd. | Lead-free solder |
| JP4577888B2 (en) * | 2004-02-04 | 2010-11-10 | 千住金属工業株式会社 | Fe erosion prevention solder alloy and Fe erosion prevention method |
| US20150266137A1 (en) * | 2012-10-09 | 2015-09-24 | Alpha Metals, Inc. | Lead-free and antimony-free tin solder reliable at high temperatures |
| JP6082952B1 (en) | 2016-07-04 | 2017-02-22 | 株式会社弘輝 | Solder alloy, solder containing solder |
| JP6365653B2 (en) * | 2016-08-19 | 2018-08-01 | 千住金属工業株式会社 | Solder alloy, solder joint and soldering method |
| PH12018501147B1 (en) * | 2017-08-17 | 2022-07-22 | Senju Metal Industry Co | Solder alloy for preventing fe leaching, flux-cored solder, wire solder, flux-cored wire solder, flux-coated solder and solder joint |
| JP6323606B1 (en) * | 2017-10-17 | 2018-05-16 | 千住金属工業株式会社 | Wire solder, solder joint manufacturing method and soldering method |
| US11123823B2 (en) * | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
| CN111112883A (en) * | 2020-03-04 | 2020-05-08 | 程斌 | Corrosion-resistant high-strength anisotropic welding material and preparation method thereof |
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