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JP3770035B2 - Surface acoustic wave device and electronic apparatus, method for manufacturing surface acoustic wave device, and method for manufacturing piezoelectric material for surface acoustic wave device - Google Patents
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JP3770035B2 - Surface acoustic wave device and electronic apparatus, method for manufacturing surface acoustic wave device, and method for manufacturing piezoelectric material for surface acoustic wave device - Google Patents

Surface acoustic wave device and electronic apparatus, method for manufacturing surface acoustic wave device, and method for manufacturing piezoelectric material for surface acoustic wave device Download PDF

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JP3770035B2
JP3770035B2 JP2000054807A JP2000054807A JP3770035B2 JP 3770035 B2 JP3770035 B2 JP 3770035B2 JP 2000054807 A JP2000054807 A JP 2000054807A JP 2000054807 A JP2000054807 A JP 2000054807A JP 3770035 B2 JP3770035 B2 JP 3770035B2
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surface acoustic
acoustic wave
wave device
piezoelectric material
manufacturing
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JP2001244788A (en
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聡 宇田
隆一 小松
裕之 小田川
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、高周波特性に優れた弾性表面波デバイスと電子機器、弾性表面波デバイスの製造方法、及び弾性表面波デバイス用圧電性材料の製造方法に関する。
【0002】
【従来の技術】
情報の大容量化、過密化、端末装置の小型化等の要請により、通信の高周波化は避けられなくなっている。したがって、通信に用いられるキーデバイスである弾性表面波デバイス(Surface Acoustic Wave device:SAWデバイス)も高周波化が必要になってきている。特に、次世代通信に重要なマイクロ波帯に適するSAWデバイスが要望されている。
【0003】
SAWデバイスの周波数fは、圧電性材料で形成された基板の弾性表面波速度Vと櫛型電極の周期λとを用いて、f=V/λの関係式で表される。高周波化のためには、周波数fを大きくすれば良いので、高周波化には周期λを小さくしたり、弾性表面波速度Vの大きな材料を用いるアプローチ法が考えられる。しかし、周期λを小さくするために微細加工技術により櫛型電極幅を小さくする方法には、設備、プロセスマージンの他に電極幅、電極間隔が狭くなるために、耐電力性、耐圧等の問題が生じる。これらの問題は、SAWデバイスの信頼性、寿命に大きく影響するので、電極幅を狭くする方法には、種々の解決すべき問題がある。
【0004】
一方、弾性表面波速度Vを大きくするためには、1)高速な圧電性材料を用いる、2)リーキー波等の高速度の波を用いる、3)ダイヤモンド等の高速度基板上に圧電性薄膜を形成する、という3つの方法が知られている。従来、これらの方法のうち、上記2,3)について活発に研究が行われている。
【0005】
【発明が解決しようとする課題】
しかしながら、上記2)のリーキー波等を用いる方法では、リーキー波の他に色々なモードの波が同時に励振されてしまい、ノイズとなるスプリアス(副共振)の発生があるという問題がある。また、上記3)の高速度基板を用いる方法では、基板価格が高い、高速度基板と圧電性薄膜との境界で波の反射がある、圧電性薄膜の厚みの制御が難しく特性にばらつきが出る等の多くの問題が生じてしまう。そして、上記1)の高速な圧電性材料については、従来知られている圧電性結晶の中ではAlN(窒化アルミニウム)が最大の弾性表面波速度をもっているが、これを越える高速な材料が今まで見出されていなかった。
【0006】
本発明は、前述の課題に鑑みてなされたもので、良好な弾性表面波特性を高周波で得ることができる弾性表面波デバイスと電子機器、弾性表面波デバイスの製造方法、及び弾性表面波デバイス用圧電性材料の製造方法を提供することを目的とする。
【0007】
【課題を解決するための手段】
本発明者らは、弾性表面波デバイス用として新規な高速圧電性材料を探索研究を行ってきた結果、従来、単に非線形光学結晶として知られていたSrB47の単結晶が高速な圧電性材料であるとともに、その電気機械結合係数(電気エネルギーと機械エネルギーの相互変換効率を示す係数)も水晶程度であることを見出すことができた。したがって、本発明は、この知見に基づいた技術であり、前記課題を解決するために以下の構成を採用した。
【0008】
本発明の弾性表面波デバイスは、圧電性材料の表面上に弾性表面波を送受信する電極を形成した弾性表面波デバイスであって、前記圧電性材料は、SrB47単結晶で形成されていることを特徴とする。
この弾性表面波デバイスでは、圧電性材料がSrB47単結晶で形成されているので、SrB47単結晶が従来知られている材料よりも高速であるとともに水晶並の電気機械結合係数が得られることから、高周波領域で優れた弾性表面波特性を得ることができる。
また、本発明の電子機器は、上記本発明の弾性表面波デバイスを搭載していることを特徴とする。
この電子機器では、上記本発明の弾性表面波デバイスを搭載しているので、例えば携帯電話等において、弾性表面波デバイスを弾性表面波フィルタとして搭載すると、マイクロ波帯等の高周波領域で優れた通信特性を有することができる。
【0009】
本発明の弾性表面波デバイス用圧電性材料の製造方法は、弾性表面波デバイスに用いられる圧電性材料の製造方法であって、SrB47の原料をルツボ内に入れて加熱し融液状に融解させ、ルツボ内の融液から前記圧電性材料としてSrB47の単結晶をチョクラルスキー法により引き上げることを特徴とする。
この弾性表面波デバイス用圧電性材料の製造方法では、CZ法(チョクラルスキー法)によりSrB47の単結晶を引き上げ育成して圧電性材料とするので、欠陥が少なく高品質なSrB47単結晶で形成された圧電性材料を得ることができる。
【0010】
また、本発明の弾性表面波デバイス用圧電性材料の製造方法は、前記原料が、SrCO3とB23とから作製されることが好ましい。
さらに、本発明の弾性表面波デバイス用圧電性材料の製造方法は、前記原料が、SrCO3(炭酸ストロンチウム)とB23(ホウ酸)とを混合してペレット状に成形し焼結したものであることが好ましい。すなわち、SrCO3とB23とを混合してペレット状に成形し焼結しているので、原料融解時において速やかにSrB47の組成を持つ安定融液が得られる。
【0011】
また、本発明の弾性表面波デバイス用圧電性材料の製造方法は、白金製の前記ルツボ内の融液に白金線を浸してSrB47の種結晶を作製し、さらに該種結晶をルツボ内の融液に浸してSrB47の単結晶を引き上げることが好ましい。
この弾性表面波デバイス用圧電性材料の製造方法では、白金製のルツボ内の融液に白金線を浸してSrB47の種結晶を作製するので、SrB47単結晶の種結晶がなくても白金を種として作製したSrB47の小さな結晶(多結晶又は単結晶)を引き上げ育成用の種結晶とすることができる。
【0012】
本発明の弾性表面波デバイスの製造方法は、圧電性材料の表面上に弾性表面波を送受信する電極を形成した弾性表面波デバイスの製造方法であって、上記本発明の弾性表面波デバイス用圧電性材料の製造方法で製造されたSrB47単結晶を前記圧電性材料とすることを特徴とする。
この弾性表面波デバイスの製造方法では、上記本発明の弾性表面波デバイス用圧電性材料の製造方法で製造されたSrB47単結晶を前記圧電性材料とするので、高品質で高速なかつ水晶並の電気機械結合係数を有した圧電性材料により、高周波領域でも優れた弾性表面波特性を有する弾性表面波デバイスを製造することができる。
【0013】
【発明の実施の形態】
以下、本発明に係る弾性表面波デバイスと電子機器、弾性表面波デバイスの製造方法、及び弾性表面波デバイス用圧電性材料の製造方法の一実施形態を、図1から図4を参照しながら説明する。
【0014】
本実施形態のSAWデバイス(弾性表面波デバイス)は、SAWフィルタ(バンドパスフィルタ)であって、図1に示すように、SrB47単結晶で形成された圧電性材料の基板1の表面(研磨面)に入力用及び出力用の櫛型電極2、3が対向して形成されている。
【0015】
このSAWデバイスの製造方法について、図2を参照して説明する。
まず、SrB47の原料であるSrCO3とB23とを混合し、ペレット状に成形して焼結したものを白金製のルツボ4内にチャージし、ルツボ4の周囲からヒータ(図示略)で加熱して融解させ融液Lとする。そして、融液Lを所定温度に加熱した状態で白金線5を種として融液Lに先端を浸し、CZ法で育成を行ってSrB47の小さな結晶(多結晶又は単結晶)を作製し種結晶Sとする。次に、この種結晶Sを種として融液LからSrB47の単結晶CをCZ法により引き上げて育成を繰り返す。
【0016】
このようにして引き上げたSrB47単結晶Cのラウエ写真を、図3に示す。この写真から分かるように引き上げた結晶が単結晶であることを示すラウエ斑点が確認できる。
次に、このSrB47の単結晶Cを板状に切り出して基板1とし、その表面に研磨を施した研磨面に櫛歯電極2、3を作製することにより、上記SAWデバイスが作製される。
【0017】
このように製造されたSAWデバイスは、例えば、携帯電話(電子機器)内にアンテナに接続されたSAWフィルタとして搭載されることにより、マイクロ波帯等の高周波領域で優れた通信特性を有することができる。
【0018】
【実施例】
次に、本発明に係る弾性表面波デバイスを、実施例により具体的に説明する。
【0019】
周期λ(なお、電極間距離はλ/2)を4μmとした櫛歯電極2、3をSrB47単結晶の基板1の表面に形成したSAWデバイスにおいて、その弾性表面波特性(フィルタ通過特性)を実際に測定した結果を、図4に示す。この図からわかるように、本実施例のSAWデバイスでは、共振周波数fが1.55GHzであり、6200m/sという高速の弾性表面波速度Vが得られることがわかる。この値は、従来の最大の弾性表面波速度を有するAlN(V=約5000m/s)よりも20%もアップしている。また、そのときの電気機械結合係数は、0.1〜0.2%であり、水晶並であった。
【0020】
【発明の効果】
以上、詳細に説明したように、本発明によれば、圧電性材料がSrB47単結晶で形成されているので、SrB47単結晶が高速であるとともに水晶並の電気機械結合係数が得られることから、高周波領域でも優れた弾性表面波特性を得ることができる。したがって、本発明の弾性表面波デバイスを用いれば、各種通信手段において小型化や高周波化を図ることができる。例えば、携帯電話等のDuplexerの誘電体共振器を本発明の弾性表面波デバイスに置き換えることにより軽量化を図ることができ、また、本発明の弾性表面波デバイスを高周波領域用のフィルタとして、光通信用フィルタ(2.5〜10GHz)、高周波RFフィルタ(3〜6GHz)及びミリ波用第1IFフィルタ(1〜2GHz)等に用いることができる。
【図面の簡単な説明】
【図1】 本発明に係る一実施形態の弾性表面波デバイスを示す斜視図である。
【図2】 本発明に係る一実施形態における弾性表面波デバイスの製造方法において、CZ法による引き上げ育成を示す概略的な断面図である。
【図3】 本発明に係る一実施形態における弾性表面波デバイスの製造方法において、育成したSrB47単結晶のラウエ写真である。
【図4】 本発明に係る実施例における弾性表面波デバイスの弾性表面波特性(SAWフィルタの通過特性(周波数に対する挿入損失))を示すグラフである。
【符号の説明】
1 基板(圧電性材料)
2、3 櫛歯電極
4 白金製のルツボ
5 白金線
C SrB47単結晶
L 融液
S 種結晶
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface acoustic wave device and electronic equipment having excellent high-frequency characteristics, a method for manufacturing a surface acoustic wave device, and a method for manufacturing a piezoelectric material for a surface acoustic wave device.
[0002]
[Prior art]
Due to demands for large information capacity, overcrowding, miniaturization of terminal devices, etc., high frequency communication is inevitable. Accordingly, a surface acoustic wave device (SAW device), which is a key device used for communication, is also required to have a higher frequency. In particular, a SAW device suitable for a microwave band important for next-generation communication is desired.
[0003]
The frequency f of the SAW device is expressed by a relational expression of f = V / λ using the surface acoustic wave velocity V of the substrate formed of a piezoelectric material and the period λ of the comb-shaped electrode. In order to increase the frequency, the frequency f may be increased. Therefore, an approach method using a material having a large surface acoustic wave velocity V or a period λ may be considered for increasing the frequency. However, in order to reduce the period λ, the method of reducing the width of the comb-shaped electrode by the microfabrication technique has problems such as power durability and withstand voltage because the electrode width and the electrode interval are reduced in addition to the equipment and process margin. Occurs. Since these problems greatly affect the reliability and life of the SAW device, there are various problems to be solved in the method of narrowing the electrode width.
[0004]
On the other hand, in order to increase the surface acoustic wave velocity V, 1) a high-speed piezoelectric material is used, 2) a high-speed wave such as a leaky wave is used, and 3) a piezoelectric thin film on a high-speed substrate such as diamond. There are three known methods of forming Conventionally, among these methods, the above-mentioned 2, 3) have been actively researched.
[0005]
[Problems to be solved by the invention]
However, the above method 2) using a leaky wave or the like has a problem in that waves of various modes are simultaneously excited in addition to the leaky wave, and spurious (sub-resonance) that becomes noise occurs. Further, in the method 3) using the high-speed substrate, the substrate price is high, there is a wave reflection at the boundary between the high-speed substrate and the piezoelectric thin film, the thickness of the piezoelectric thin film is difficult to control, and the characteristics vary. Many problems will occur. As for the high-speed piezoelectric material of 1), AlN (aluminum nitride) has the maximum surface acoustic wave velocity among the conventionally known piezoelectric crystals. It was not found.
[0006]
The present invention has been made in view of the above-described problems, and a surface acoustic wave device and an electronic apparatus capable of obtaining good surface acoustic wave characteristics at a high frequency, a method for manufacturing a surface acoustic wave device, and a surface acoustic wave device. It is an object to provide a method for manufacturing a piezoelectric material for use.
[0007]
[Means for Solving the Problems]
As a result of searching for new high-speed piezoelectric materials for use in surface acoustic wave devices, the present inventors have found that a single crystal of SrB 4 O 7 , which has been conventionally known as a nonlinear optical crystal, has a high-speed piezoelectricity. In addition to being a material, it was found that the electromechanical coupling coefficient (coefficient indicating the interconversion efficiency between electric energy and mechanical energy) was of the order of quartz. Therefore, the present invention is a technique based on this finding, and the following configuration is adopted in order to solve the above problems.
[0008]
The surface acoustic wave device of the present invention is a surface acoustic wave device in which an electrode for transmitting and receiving surface acoustic waves is formed on the surface of a piezoelectric material, and the piezoelectric material is formed of a SrB 4 O 7 single crystal. It is characterized by being.
In this surface acoustic wave device, the piezoelectric material is formed by SrB 4 O 7 single crystal, the electromechanical coupling coefficient of the crystal parallel with faster than material SrB 4 O 7 single crystal is conventionally known Therefore, it is possible to obtain excellent surface acoustic wave characteristics in a high frequency region.
Further, an electronic apparatus according to the present invention includes the surface acoustic wave device according to the present invention.
In this electronic apparatus, since the surface acoustic wave device of the present invention is mounted, for example, when a surface acoustic wave device is mounted as a surface acoustic wave filter in a mobile phone or the like, excellent communication in a high frequency region such as a microwave band. Can have properties.
[0009]
The method for producing a piezoelectric material for a surface acoustic wave device according to the present invention is a method for producing a piezoelectric material used for a surface acoustic wave device, and a raw material of SrB 4 O 7 is placed in a crucible and heated to form a molten liquid. It is characterized by melting and pulling up a single crystal of SrB 4 O 7 as the piezoelectric material from the melt in the crucible by the Czochralski method.
In this method of manufacturing a surface acoustic wave device for piezoelectric material, since the piezoelectric material by pulling a single crystal is grown in SrB 4 O 7 by the CZ method (Czochralski method), SrB 4 defects is less high quality A piezoelectric material formed of O 7 single crystal can be obtained.
[0010]
In the method for producing a piezoelectric material for a surface acoustic wave device according to the present invention, the raw material is preferably produced from SrCO 3 and B 2 O 3 .
Furthermore, in the method for producing a piezoelectric material for a surface acoustic wave device according to the present invention, the raw material is mixed with SrCO 3 (strontium carbonate) and B 2 O 3 (boric acid), formed into a pellet, and sintered. It is preferable. That is, since SrCO 3 and B 2 O 3 are mixed, formed into a pellet and sintered, a stable melt having a composition of SrB 4 O 7 can be obtained quickly at the time of melting the raw material.
[0011]
In the method for producing a piezoelectric material for a surface acoustic wave device according to the present invention, a platinum wire is immersed in a melt in the platinum crucible to produce a SrB 4 O 7 seed crystal, and the seed crystal is further added to the crucible. It is preferable to pull up the SrB 4 O 7 single crystal by immersing it in the melt.
In this method of manufacturing a surface acoustic wave device for piezoelectric materials, so to prepare a seed crystal of the SrB 4 O 7 soak the platinum wire into the melt of a platinum crucible, the seed crystal of SrB 4 O 7 single crystal Even if not, a small crystal (polycrystal or single crystal) of SrB 4 O 7 prepared using platinum as a seed can be used as a seed crystal for pulling and growing.
[0012]
The surface acoustic wave device manufacturing method of the present invention is a surface acoustic wave device manufacturing method in which an electrode for transmitting and receiving surface acoustic waves is formed on the surface of a piezoelectric material, and includes the above-described surface acoustic wave device piezoelectric device of the present invention. An SrB 4 O 7 single crystal manufactured by a method for manufacturing a conductive material is used as the piezoelectric material.
In this surface acoustic wave device manufacturing method, the SrB 4 O 7 single crystal manufactured by the piezoelectric material manufacturing method for a surface acoustic wave device of the present invention is used as the piezoelectric material. A surface acoustic wave device having excellent surface acoustic wave characteristics even in a high frequency region can be manufactured by using a piezoelectric material having an ordinary electromechanical coupling coefficient.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of a surface acoustic wave device and an electronic apparatus according to the invention, a method for producing a surface acoustic wave device, and a method for producing a piezoelectric material for a surface acoustic wave device will be described with reference to FIGS. To do.
[0014]
The SAW device (surface acoustic wave device) of the present embodiment is a SAW filter (bandpass filter), and as shown in FIG. 1, the surface of the substrate 1 made of a piezoelectric material made of SrB 4 O 7 single crystal. Input and output comb-shaped electrodes 2 and 3 are formed to face each other on the (polished surface).
[0015]
A method for manufacturing the SAW device will be described with reference to FIG.
First, SrCO 3 and B 2 O 3 which are raw materials of SrB 4 O 7 are mixed, formed into pellets and sintered, charged into a platinum crucible 4, and a heater ( (Not shown) is heated and melted to obtain a melt L. Then, with the melt L heated to a predetermined temperature, the tip is immersed in the melt L using the platinum wire 5 as a seed and grown by the CZ method to produce a small crystal (polycrystal or single crystal) of SrB 4 O 7. The seed crystal S is used. Next, the seed crystal S is used as a seed and the single crystal C of SrB 4 O 7 is pulled up from the melt L by the CZ method, and the growth is repeated.
[0016]
A Laue photograph of the SrB 4 O 7 single crystal C pulled up in this way is shown in FIG. As can be seen from this photograph, Laue spots indicating that the pulled crystal is a single crystal can be confirmed.
Next, the SAW device is manufactured by cutting the single crystal C of SrB 4 O 7 into a plate shape to form the substrate 1 and forming the comb electrodes 2 and 3 on the polished surface of the surface. The
[0017]
The SAW device manufactured in this way may have excellent communication characteristics in a high frequency region such as a microwave band by being mounted as a SAW filter connected to an antenna in a mobile phone (electronic device), for example. it can.
[0018]
【Example】
Next, the surface acoustic wave device according to the present invention will be specifically described with reference to examples.
[0019]
In a SAW device in which comb electrodes 2 and 3 having a period λ (distance between electrodes λ / 2) of 4 μm are formed on the surface of a substrate 1 of SrB 4 O 7 single crystal, the surface acoustic wave characteristics (filter FIG. 4 shows the results of actual measurement of the transmission characteristics. As can be seen from this figure, in the SAW device of this example, the resonance frequency f is 1.55 GHz, and a high-speed surface acoustic wave velocity V of 6200 m / s can be obtained. This value is 20% higher than the conventional AlN having the maximum surface acoustic wave velocity (V = about 5000 m / s). Moreover, the electromechanical coupling coefficient at that time was 0.1 to 0.2%, which was equivalent to quartz.
[0020]
【The invention's effect】
As described above in detail, according to the present invention, the piezoelectric material is formed by SrB 4 O 7 single crystal, the electromechanical coupling coefficient of quartz parallel with SrB 4 O 7 single crystal is faster Therefore, excellent surface acoustic wave characteristics can be obtained even in a high frequency region. Therefore, if the surface acoustic wave device of the present invention is used, it is possible to reduce the size and the frequency of various communication means. For example, a duplexer dielectric resonator such as a cellular phone can be replaced with the surface acoustic wave device of the present invention, and the surface acoustic wave device of the present invention can be used as a filter for a high frequency region. It can be used for a communication filter (2.5 to 10 GHz), a high frequency RF filter (3 to 6 GHz), a first IF filter for millimeter waves (1 to 2 GHz), and the like.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a surface acoustic wave device according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view showing pulling growth by a CZ method in a method for manufacturing a surface acoustic wave device according to an embodiment of the present invention.
FIG. 3 is a Laue photograph of SrB 4 O 7 single crystal grown in the method for manufacturing a surface acoustic wave device according to one embodiment of the present invention.
FIG. 4 is a graph showing surface acoustic wave characteristics (passage characteristics of SAW filter (insertion loss with respect to frequency)) of a surface acoustic wave device according to an embodiment of the present invention.
[Explanation of symbols]
1 Substrate (piezoelectric material)
2, 3 Comb electrode 4 Platinum crucible 5 Platinum wire C SrB 4 O 7 single crystal L Melt S Seed crystal

Claims (7)

圧電性材料の表面上に弾性表面波を送受信する電極を形成した弾性表面波デバイスであって、
前記圧電性材料は、SrB47単結晶で形成されていることを特徴とする弾性表面波デバイス。
A surface acoustic wave device in which an electrode for transmitting and receiving surface acoustic waves is formed on the surface of a piezoelectric material,
2. The surface acoustic wave device according to claim 1, wherein the piezoelectric material is made of SrB 4 O 7 single crystal.
請求項1記載の弾性表面波デバイスを搭載していることを特徴とする電子機器。An electronic apparatus comprising the surface acoustic wave device according to claim 1. 弾性表面波デバイスに用いられる圧電性材料の製造方法であって、
SrB47の原料をルツボ内に入れて加熱し融液状に融解させ、ルツボ内の融液から前記圧電性材料としてSrB47の単結晶をチョクラルスキー法により引き上げることを特徴とする弾性表面波デバイス用圧電性材料の製造方法。
A method of manufacturing a piezoelectric material used in a surface acoustic wave device,
A raw material of SrB 4 O 7 is put in a crucible and heated to melt into a melt, and a single crystal of SrB 4 O 7 is pulled up from the melt in the crucible as the piezoelectric material by the Czochralski method. A method for producing a piezoelectric material for a surface acoustic wave device.
前記原料は、SrCO3とB23とから作製されることを特徴とする請求項3記載の弾性表面波デバイス用圧電性材料の製造方法。The raw material, SrCO 3 and B 2 O 3 Metropolitan method of manufacturing a surface acoustic wave device for piezoelectric material according to claim 3, characterized in that it is made from. 前記原料は、SrCO3とB23とを混合してペレット状に成形し焼結したものであることを特徴とする請求項4記載の弾性表面波デバイス用圧電性材料の製造方法。5. The method for producing a piezoelectric material for a surface acoustic wave device according to claim 4, wherein the raw material is a mixture of SrCO 3 and B 2 O 3 , formed into a pellet and sintered. 白金製の前記ルツボ内の融液に白金線を浸してSrB47の種結晶を作製し、さらに該種結晶をルツボ内の融液に浸してSrB47の単結晶を引き上げることを特徴とする請求項3から5のいずれかに記載の弾性表面波デバイス用圧電性材料の製造方法。A platinum wire is immersed in the melt in the platinum crucible to produce a seed crystal of SrB 4 O 7 , and the seed crystal is immersed in the melt in the crucible to pull up the single crystal of SrB 4 O 7. 6. The method for manufacturing a piezoelectric material for a surface acoustic wave device according to claim 3, wherein the piezoelectric material is a piezoelectric material. 圧電性材料の表面上に弾性表面波を送受信する電極を形成した弾性表面波デバイスの製造方法であって、
請求項3から6のいずれかに記載の弾性表面波デバイス用圧電性材料の製造方法で製造されたSrB47単結晶を前記圧電性材料とすることを特徴とする弾性表面波デバイスの製造方法。
A method of manufacturing a surface acoustic wave device in which an electrode for transmitting and receiving surface acoustic waves is formed on the surface of a piezoelectric material,
A surface acoustic wave device manufactured by using the SrB 4 O 7 single crystal manufactured by the method for manufacturing a piezoelectric material for surface acoustic wave device according to claim 3 as the piezoelectric material. Method.
JP2000054807A 2000-02-29 2000-02-29 Surface acoustic wave device and electronic apparatus, method for manufacturing surface acoustic wave device, and method for manufacturing piezoelectric material for surface acoustic wave device Expired - Fee Related JP3770035B2 (en)

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