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JP3770976B2 - Photodetector - Google Patents
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JP3770976B2 - Photodetector - Google Patents

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Publication number
JP3770976B2
JP3770976B2 JP25801496A JP25801496A JP3770976B2 JP 3770976 B2 JP3770976 B2 JP 3770976B2 JP 25801496 A JP25801496 A JP 25801496A JP 25801496 A JP25801496 A JP 25801496A JP 3770976 B2 JP3770976 B2 JP 3770976B2
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Japan
Prior art keywords
light
incident
thin film
incident light
metal
Prior art date
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JP25801496A
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Japanese (ja)
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JPH10104057A (en
Inventor
喜久 山本
義浩 瀧口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Japan Science and Technology Agency
National Institute of Japan Science and Technology Agency
Original Assignee
Hamamatsu Photonics KK
Japan Science and Technology Agency
National Institute of Japan Science and Technology Agency
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Priority to JP25801496A priority Critical patent/JP3770976B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、非古典的光源の計測や、その他の高い信号/雑音比を必要とする計測において重要な、高い検出効率と高い増倍率を有する非検出装置に関するものである。
【0002】
【従来の技術】
従来の光検出装置としては、大きく分けて下記に示す3つの種類があると考えられる。
【0003】
(1)半導体を検出面とし、これに吸収された光が電子とホールのペアを作り、これらが電流のキャリアとなる内部光電効果からなるもの。
【0004】
(2)アルカリ金属などをさまざまに成長させて作製する所謂光電面は、その表面から電子を抜き出すことにより、検出に有効な電流を発生させるもので、外部光電効果といわれるもの。
【0005】
(3)光を薄膜に吸収させることにより、薄膜の温度が上昇することを用いてその光計測を行うパイロメータの3つがある。
【0006】
従来の光検出装置のうち、光電子増倍管の使われていた装置全てを置き換えることが可能となるだけでなく、これまで、大変困難であった非古典的光(スクイーズド光、ナンバー状態やサブポアソン状態にある光)の検出を、その状態のもつ信号/雑音比を壊すことなく計測することができるようになるため、従来では雑音に埋もれてしまって計測することができなかった弱い信号の計測を可能とする。
【0007】
それらの特徴的な例として、重力波の検出がある。これは、ブラックホールの生成や超新星の爆発などによる大変大きな質量の変化の過程などで発する重力の波を、光を用いて検出する際には、重力波により光の場が受ける変調は大変小さいので、これを検出するには、従来の光(レーザー光など)では不可能であった。しかし、非常に高いスクイーズド状態にある光を用いて計測すると、検出したい光の位相遅れの情報を高い精度にて検出することができるために、周期的にやってくる重力波との相関から、ブラックホールや超新星の爆発や二重星の計測などが可能となる。
【0008】
【発明が解決しようとする課題】
本発明は、精度や検出の応答速度などを考慮して、上記(1)、(2)が適応の範囲となる。
【0009】
高い検出精度、効率、雑音特性、そして増幅のゲインが光検出器としての重要な要素となるが、半導体検出素子と光電面は上記した従来の技術(1)、(2)ともに善し悪しがある。すなわち、半導体検出素子は、その比較的高い量子効率があるのに、観測できるまでの信号とする際の増倍過程に、多くの電子部品を使用し、これらの個々の素子全てがノイズの原因となり、増幅ゆらぎと熱雑音を系に導入してしまう。
【0010】
これに対して、光電面は、入射した光を電子に変換していく過程のなかで、光電面の厚みが数1000Åと厚いために、内部の電子のトラップに落ち込む光電子が多いことや、表面と真空のポテンシャルを抜け出るための確率が低いことのために、最高でも30%程度の量子効率しか達成されていない。しかし、一旦、電子に変換されて、真空中に取り出すことができてしまうと、外部からの電圧印加により、その電子にエネルギーを送り込み、これが金属面などと衝突した際に発生する二次電子にそのエネルギーを配分するために、ここで効率の良い増倍を達成する。さらに、多段にこれを連続的に行うことで、さらに高い信号/雑音比を達成することが可能となる。
【0011】
ところが、現在は、両者の良い点を合わせ持つ光検出器が存在していない。
【0012】
そこで、本発明は、上記した両者の良い点を合わせ持つ、つまり、比較的高い量子効率を有し、しかも効率の良い増倍を達成可能な光検出装置を提供することを目的とする。
【0013】
【課題を解決するための手段】
本発明は、上記目的を達成するために、
〔1〕光検出装置において、入射光に対して、透明で均質な直角プリズムと、この直角プリズムの入射光が入射する辺と出射光が出射する辺の間の前記入射光が入射し、この入射光を反射する辺に均質に蒸着、または成長した前記直角プリズムの屈折率よりも低い屈折率を有する低屈折率誘電体膜と、この低屈折率誘電体膜上に金属または半導体の薄膜をする光検出部を備え、前記全反射面の近傍では近接光場が発生し、前記金属または半導体の薄膜にて散乱され、前記金属または半導体の薄膜面に吸収された光は、前記金属または半導体の薄膜面内で電子に変換され、電気信号として取り出すことを特徴とする。
【0014】
〕上記〔載の光検出装置において、入射する光の空間的形状とその偏光状態を制御する手段を有する。
【0015】
〕上記〔〕記載の光検出装置において、入射波長に依存して、偏光状態を制御する制御手段を有する。
【0016】
〕上記〔〕記載の光検出装置において、入射光により誘起された金属または半導体の薄膜内の電子を引き出し、その背後に設置した電子増倍機構または電子偏向機構に導くような電界を印加する手段を有する。
【0017】
〕上記〔〕記載の光検出装置において、前記窓材と前記低屈折率誘電体膜面との間にて反射して光電子変換されない成分の偏光面を回転してから、再びこの変換面に入射させる手段を有する。
【0018】
〕上記〔1〕から〔〕のうちいずれか1項記載の光検出装置において、入射光に対して、偏光による光分波器を通して、それぞれ直交成分に分解した後、それぞれの偏光に対して、検出装置を一つずつ配置して、検出した後、再び電気的に信号を結合した。
【0019】
【発明の実施の形態】
以下、本発明の実施の形態について図面を参照して詳細に説明する。
【0020】
図1は本発明の基本構造を示す高効率光検出装置の構成図である。
【0021】
この図に示すように、入射光1は、直角プリズム2に斜めから入射させることで、窓材としての直角プリズム2と、このプリズム2の屈折率よりも低い屈折率を有する誘電体(低屈折率誘電体)膜3の間で、100%の反射をさせることができる。この状態を、全反射(Total Reflecion)という。ここで、例えば直角プリズム2の入射光の入射する辺及び出射する辺の寸法Lは10mmである。
【0022】
この際の全反射の条件は、面の法線に対する入射角度を図2に示すようにθにすると、sinθ=n2 /n1 である。ここで、n1 とn2 は、直角プリズム2と誘電体膜3の屈折率である。この角度θ以上で入射した場合には、全反射の条件を満たすことになる。この反射面の近傍では、図2に模式的に示すような近接光場4が発生し、この到達領域は入射光1の波長程度である。この領域に、金属(金、アルミニウム)や半導体の薄膜5を挿入すると反射光の一部または全てが、散乱またはその膜内部に吸収されて、電子−ホール対または電子−イオン対を生成する。このような状態を減衰された全反射(Attenuated Total Reflection)という。この条件では、入射した光のうち、偏光方向が反対面の法線と平行な成分のみ(所謂TM成分)が近接光場4を介して、金属または半導体の薄膜5にて散乱される。法線に垂直な残りのTE成分は直角プリズム2と誘電体膜3面に反射されてしまう。
【0023】
一方、金属または半導体の薄膜5面に吸収された光は、金属または半導体の薄膜5面内で電子に変換されるが、その膜厚が十分薄い場合は、電子が高いエネルギー状態にあり、容易に真空との間のポテンシャルの壁とトンネル効果にて等価して、真空中に放出されるために、入射光1に起因したほとんどの電子を真空中に追い出すことができる。さらに、この真空場に取り出した電子を加速した後、二次光電子増倍機構や光電子偏向機構6を通過させて、さまざまな電子光学的手法を達成できる。さらに、その結果を金属板にて捕捉して電気信号として取り出すことができる。
【0024】
さて、ここで用いられる低屈折率誘電体膜は、MgF2 などの光学的に透明であり、かつ、屈折率がプリズム材料である光学ガラス(屈折率1.5程度)に比べて1.3程度と低く、その厚みも、近接光場の到達距離が精々波長程度であることを考えると、およそ、500Å程度であると考えられる。ただし、その厚さの最適化を行うことは、実験的に可能である。
【0025】
一方、誘電体膜3上に蒸着する金属または半導体の薄膜5としては、金またはアルミニウムなどの金属の薄膜や、シリコンやガリウム砒素などの半導体薄膜が考えられる。その際の、金属薄膜である場合の厚さは、50〜200Å程度となるものと推測されるが、これも、基本的に実験的に最適化するパラメーターであると考えられる。また、半導体としてのシリコンなどの薄膜も、さまざまな結晶成長の手法を用いて均一に作製することができるが、その厚さとしては、金属の場合と同様な厚みであると考えられる。
【0026】
窓材として、図1では直角プリズム2を用いた例を示したが、誘電体膜3の間に発生する近接光場4と、この近接光場4を介して、光学的に結合する金属または半導体面といった構造が重要であるため、ガラスの底が十分平坦であれば、特に、プリズム構造とする必要がなく、レンズ状であったり、楔状であっても構わない。
【0027】
次に、前記のように、近接光場4によって金属や半導体の薄膜5に結合する成分は、TM成分である。通常の光源や発光現象は、その偏光はランダムであることが多く、よって、検出面に入射する前に、予めその偏光面を制御することは、効率の良い計測法を提供することになる。
【0028】
図3は本発明の第1実施例を示す高効率光検出装置の構成図である。
【0029】
まず、入射光の空間的形状や、その偏光特性を制御するために、光源11からの光を、一旦、コリメータレンズ12などによりコリメートし、空間フィルターとしてのアパーチャー13などを通過させる。これにより、前述の、入射光が全反射になるような空間成分のみを、図1に示した光検出構造に導く。さらに、そのうちで、偏光成分のうち一方の偏光成分(例えばTM成分)のみを偏光板14により選択して、光検出部19に導くが、その際の光検出部19の配置による微妙な偏光からのずれを補正するために、波長板15などを用いることが必要となる。なお、図3において、16は直角プリズム、17は誘電体膜、18は金属や半導体の薄膜である。
【0030】
図4は本発明の第2実施例を示す高効率光検出装置の構成図である。
【0031】
この実施例では、図4に示すように、光源21からの光を可能な限り有効に検出するために、光源21からの入射光の検出効率が最も高くなるように偏光を波長板24にて設定し、さらに、全反射により検出されずにいるTE成分の光を、もう一度光検出部30に向かって反射鏡29により反射させる。
【0032】
その際、反射光が再び光検出部30のTM成分に整合するように、波長板28を用いて、微妙にその偏光成分を補正しておく。これにより、アパーチャー23を通過した光源21からの光を効率よく検出することができる。なお、図4において、22はコリメータレンズ、25は直角プリズム、26は低屈折率誘電体膜、27は金属や半導体の薄膜である。
【0033】
図5は本発明の第3実施例を示す高効率光検出装置の構成図である。
【0034】
この図に示すように、この実施例では、光源31からの光を空間的に制御した後に、偏光ビームスプリッター34により、直交する偏光成分に分割し、それぞれの成分を検出する独立した光検出部38、44を設けるようにする。
【0035】
それぞれの偏光成分の検出電気信号は、電気的ミキサー45を介して結合され、最終的には解析装置に導かれる。この際、第2実施例と同等の高い検出効率が得られるだけでなく、一旦、外部に取り出された偏光成分を反射させて光検出部に導くために、時間遅延が生じ、時間分解計測に制限を与える可能性がある。
【0036】
そこで、図5に示すような2つの光検出部38、44を用いて、これらの光学的、あるいは電気的な遅延時間差をなくすことは容易であるため、時間応答に優れた高効率光検出装置を提供することができる。図5において、32はコリメータレンズ、33はアパーチャー、35は第1の直角プリズム、36、42は低屈折率誘電体膜、37、43は金属や半導体の薄膜、41は第2の直角プリズムである。
【0037】
なお、本発明は上記実施例に限定されるものではなく、本発明の趣旨に基づいて種々の変形が可能であり、これらを本発明の範囲から排除するものではない。
【0038】
【発明の効果】
以上、詳細に説明したように、本発明によれば、比較的高い量子効率を有し、しかも効率の良い増倍を達成可能な高効率光検出装置を提供することができる。特に、高い信号/雑音比を必要とする計測において重要な、高い検出効率と高い増倍率を達成することができる。
【図面の簡単な説明】
【図1】 本発明の基本構造を示す高効率光検出装置の構成図である。
【図2】 図1の高効率光検出装置の光検出部の模式図である。
【図3】 本発明の第1実施例を示す高効率光検出装置の構成図である。
【図4】 本発明の第2実施例を示す高効率光検出装置の構成図である。
【図5】 本発明の第3実施例を示す高効率光検出装置の構成図である。
【符号の説明】
1 入射光
2,16,25,35,41 直角プリズム
3,17,26,36,42 誘電体(低屈折率誘電体)膜
4 近接光場
5,18,27,37,43 金属(金、アルミニウム)や半導体の薄膜
6 光電子増倍機構又は光電子偏向機構
11,21,31 光源
12,22,32 レンズ
13,23,33 アパーチャー
14 偏光板
15,24,28 波長板
19,30,38,44 光検出部
29 反射鏡
34 偏光ビームスプリッター
45 電気的ミキサー
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-detection apparatus having a high detection efficiency and a high multiplication factor, which is important in measurement of a non-classical light source or other measurement requiring a high signal / noise ratio.
[0002]
[Prior art]
Conventional photodetection devices can be roughly classified into the following three types.
[0003]
(1) A semiconductor is used as a detection surface, and light absorbed by the semiconductor forms a pair of electrons and holes, and these are composed of an internal photoelectric effect that becomes a carrier of current.
[0004]
(2) A so-called photocathode produced by growing various alkali metals or the like generates an electric current effective for detection by extracting electrons from the surface, and is called an external photoelectric effect.
[0005]
(3) There are three types of pyrometers that perform optical measurement using the fact that the temperature of the thin film rises by absorbing light into the thin film.
[0006]
Not only can all conventional photomultiplier tubes be used among conventional photodetection devices, but also non-classical light (squeezed light, number states, Detection of light in the sub-Poisson state can be measured without destroying the signal / noise ratio of the state, so weak signals that were previously buried in noise and could not be measured Can be measured.
[0007]
A characteristic example of these is the detection of gravity waves. This is because when a gravitational wave generated in the process of a very large mass change due to the generation of a black hole or a supernova explosion is detected using light, the modulation of the light field by the gravitational wave is very small. Therefore, it was impossible to detect this with conventional light (laser light or the like). However, if measurement is performed using light in a very high squeezed state, information on the phase delay of the light to be detected can be detected with high accuracy. Holes and supernova explosions and double star measurements are possible.
[0008]
[Problems to be solved by the invention]
In the present invention, the above (1) and (2) are applicable ranges in consideration of the accuracy and the response speed of detection.
[0009]
Although high detection accuracy, efficiency, noise characteristics, and amplification gain are important elements as a photodetector, the semiconductor detection element and the photocathode are good and bad in the conventional techniques (1) and (2) described above. That is, the semiconductor detection element has a relatively high quantum efficiency, but uses many electronic components in the multiplication process when making a signal until it can be observed, and all these individual elements cause noise. Thus, amplification fluctuation and thermal noise are introduced into the system.
[0010]
On the other hand, in the process of converting incident light into electrons, the photocathode has a photocathode thickness of several thousand mm, so that many photoelectrons fall into the internal electron trap, Because of the low probability of getting out of the vacuum potential, a quantum efficiency of only about 30% has been achieved at most. However, once converted into electrons and taken out in a vacuum, energy is sent to the electrons by applying an external voltage, and the secondary electrons generated when this collides with a metal surface, etc. In order to allocate that energy, an efficient multiplication is achieved here. Furthermore, by continuously performing this in multiple stages, it is possible to achieve a higher signal / noise ratio.
[0011]
However, there is currently no photodetector that combines the good points of both.
[0012]
SUMMARY OF THE INVENTION An object of the present invention is to provide a photodetection device that combines the above-mentioned advantages, that is, has a relatively high quantum efficiency and can achieve efficient multiplication.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides
[1] In the light detection device, the incident light between the transparent and homogeneous right-angle prism and the side where the incident light of the right-angle prism is incident and the side where the emitted light is emitted are incident on the incident light. A low-refractive-index dielectric film having a refractive index lower than the refractive index of the right-angle prism uniformly deposited or grown on a side that totally reflects incident light, and a metal or semiconductor thin film on the low-refractive-index dielectric film includes a light detection unit which have the said total reflection surface near the optical field in the vicinity of the occurs, is scattered by the metal or semiconductor thin film, light absorbed in the thin film surface of the metal or semiconductor, the metal Alternatively, it is converted into electrons within a semiconductor thin film surface and taken out as an electric signal .
[0014]
[2] The optical detection device described in [1] Symbol mounting comprises means for controlling the polarization state spatial shape of the incident light with.
[0015]
[ 3 ] The photodetector according to [ 2 ], further including a control unit that controls a polarization state depending on an incident wavelength.
[0016]
[ 4 ] In the photodetecting device according to [ 3 ], an electric field that draws electrons in a thin film of metal or semiconductor induced by incident light and guides the electrons to an electron multiplying mechanism or an electron deflecting mechanism installed behind the thin film. Means for applying.
[0017]
[ 5 ] In the light detection device according to [ 4 ] above, after rotating the polarization plane of the component which is reflected between the window material and the low refractive index dielectric film surface and is not photoelectron-converted, the conversion is performed again. Means for making incident on the surface;
[0018]
[ 6 ] In the light detection device according to any one of [1] to [ 5 ], the incident light is decomposed into orthogonal components through an optical demultiplexer by polarization, and then converted into each polarization. On the other hand, the detection devices were arranged one by one, and after detection, the signals were electrically coupled again.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0020]
FIG. 1 is a configuration diagram of a high-efficiency photodetection device showing the basic structure of the present invention.
[0021]
As shown in this figure, incident light 1 is incident on a right angle prism 2 at an angle, so that a right angle prism 2 as a window material and a dielectric (low refractive index) having a refractive index lower than the refractive index of the prism 2 are obtained. 100% reflection can be caused between the dielectric film 3. This state is called total reflection. Here, for example, the dimension L of the incident side and the outgoing side of the right-angle prism 2 is 10 mm.
[0022]
The condition of total reflection at this time is sin θ = n 2 / n 1 when the incident angle with respect to the normal of the surface is θ as shown in FIG. Here, n 1 and n 2 are the refractive indexes of the right-angle prism 2 and the dielectric film 3. In the case of incidence at this angle θ or more, the condition of total reflection is satisfied. In the vicinity of the reflecting surface, a near light field 4 as schematically shown in FIG. 2 is generated, and this reaching region is about the wavelength of the incident light 1. When a metal (gold, aluminum) or semiconductor thin film 5 is inserted into this region, part or all of the reflected light is scattered or absorbed inside the film to generate electron-hole pairs or electron-ion pairs. Such a state is called attenuated total reflection (Attenuated Total Reflection). Under this condition, only the component of the incident light whose polarization direction is parallel to the normal of the opposite surface (so-called TM component) is scattered by the metal or semiconductor thin film 5 through the near light field 4. The remaining TE component perpendicular to the normal is reflected by the right-angle prism 2 and the dielectric film 3 surface.
[0023]
On the other hand, the light absorbed on the surface of the metal or semiconductor thin film 5 is converted into electrons in the surface of the metal or semiconductor thin film 5, but if the film thickness is sufficiently thin, the electrons are in a high energy state and easy Since it is equivalent to the potential wall between the vacuum and the tunnel effect and is emitted into the vacuum, most of the electrons caused by the incident light 1 can be driven out into the vacuum. Furthermore, after accelerating the electrons taken out to the vacuum field, various electron optical techniques can be achieved by passing through the secondary photomultiplier mechanism and the photoelectron deflection mechanism 6. Furthermore, the result can be captured by a metal plate and taken out as an electrical signal.
[0024]
The low refractive index dielectric film used here is optically transparent such as MgF 2 and has a refractive index of 1.3 compared to optical glass (refractive index of about 1.5) which is a prism material. Considering that the reach distance of the near light field is at most about a wavelength, it is considered that the thickness is about 500 mm. However, it is experimentally possible to optimize the thickness.
[0025]
On the other hand, the metal or semiconductor thin film 5 deposited on the dielectric film 3 may be a metal thin film such as gold or aluminum, or a semiconductor thin film such as silicon or gallium arsenide. In this case, the thickness in the case of a metal thin film is estimated to be about 50 to 200 mm, but this is also considered to be a parameter that is basically optimized experimentally. Further, a thin film such as silicon as a semiconductor can be uniformly formed by using various crystal growth methods, but the thickness is considered to be the same as that of a metal.
[0026]
As an example of the window material, FIG. 1 shows an example in which the right-angle prism 2 is used. However, a near light field 4 generated between the dielectric films 3 and a metal optically coupled via the near light field 4 or Since a structure such as a semiconductor surface is important, if the bottom of the glass is sufficiently flat, it is not particularly necessary to have a prism structure, and it may be a lens shape or a wedge shape.
[0027]
Next, as described above, the component bonded to the metal or semiconductor thin film 5 by the near-field 4 is a TM component. In ordinary light sources and light-emitting phenomena, the polarization is often random. Therefore, controlling the polarization plane in advance before entering the detection surface provides an efficient measurement method.
[0028]
FIG. 3 is a configuration diagram of a high-efficiency photodetection device showing a first embodiment of the present invention.
[0029]
First, in order to control the spatial shape of incident light and its polarization characteristics, the light from the light source 11 is once collimated by a collimator lens 12 or the like, and passed through an aperture 13 or the like as a spatial filter. As a result, only the above-described spatial component in which the incident light is totally reflected is guided to the light detection structure shown in FIG. Furthermore, among them, only one polarization component (for example, TM component) among the polarization components is selected by the polarizing plate 14 and guided to the light detection unit 19, but from the delicate polarization due to the arrangement of the light detection unit 19 at that time. In order to correct the deviation, it is necessary to use the wave plate 15 or the like. In FIG. 3, 16 is a right-angle prism, 17 is a dielectric film, and 18 is a metal or semiconductor thin film.
[0030]
FIG. 4 is a configuration diagram of a high-efficiency photodetection device showing a second embodiment of the present invention.
[0031]
In this embodiment, as shown in FIG. 4, in order to detect the light from the light source 21 as effectively as possible, the polarized light is applied by the wave plate 24 so that the detection efficiency of the incident light from the light source 21 is the highest. Further, the TE component light that has not been detected by total reflection is reflected by the reflecting mirror 29 toward the light detection unit 30 again.
[0032]
At this time, the polarization component is subtly corrected using the wave plate 28 so that the reflected light again matches the TM component of the light detection unit 30. Thereby, the light from the light source 21 that has passed through the aperture 23 can be efficiently detected. In FIG. 4, 22 is a collimator lens, 25 is a right-angle prism, 26 is a low refractive index dielectric film, and 27 is a metal or semiconductor thin film.
[0033]
FIG. 5 is a configuration diagram of a high-efficiency photodetection device showing a third embodiment of the present invention.
[0034]
As shown in this figure, in this embodiment, after the light from the light source 31 is spatially controlled, it is divided into orthogonal polarization components by the polarization beam splitter 34, and the independent light detection unit detects each component. 38 and 44 are provided.
[0035]
The detected electric signals of the respective polarization components are combined via an electric mixer 45 and finally led to an analysis device. At this time, not only a high detection efficiency equivalent to that of the second embodiment is obtained, but also a time delay occurs because the polarized component extracted to the outside is reflected once and guided to the light detection unit. May give restrictions.
[0036]
Accordingly, since it is easy to eliminate these optical or electrical delay time differences by using two photodetecting units 38 and 44 as shown in FIG. 5, a highly efficient photodetection device excellent in time response. Can be provided. In FIG. 5, 32 is a collimator lens, 33 is an aperture, 35 is a first right-angle prism, 36 and 42 are low-refractive-index dielectric films, 37 and 43 are thin films of metal or semiconductor, and 41 is a second right-angle prism. is there.
[0037]
In addition, this invention is not limited to the said Example, A various deformation | transformation is possible based on the meaning of this invention, and these are not excluded from the scope of the present invention.
[0038]
【The invention's effect】
As described above in detail, according to the present invention, it is possible to provide a high-efficiency photodetector that has a relatively high quantum efficiency and that can achieve efficient multiplication. In particular, high detection efficiency and high multiplication factor, which are important in measurement requiring a high signal / noise ratio, can be achieved.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a high-efficiency photodetection device showing a basic structure of the present invention.
2 is a schematic diagram of a light detection unit of the high-efficiency light detection device in FIG. 1;
FIG. 3 is a configuration diagram of a high-efficiency photodetection device showing a first embodiment of the present invention.
FIG. 4 is a configuration diagram of a high-efficiency photodetection device showing a second embodiment of the present invention.
FIG. 5 is a configuration diagram of a high-efficiency photodetection device showing a third embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Incident light 2,16,25,35,41 Right angle prism 3,17,26,36,42 Dielectric (low refractive index dielectric) film | membrane 4 Near optical field 5,18,27,37,43 Metal (gold, 6) Photomultiplier mechanism or photoelectron deflector mechanism 11, 21, 31 Light source 12, 22, 32 Lens 13, 23, 33 Aperture 14 Polarizing plate 15, 24, 28 Wave plate 19, 30, 38, 44 Photodetector 29 Reflector 34 Polarizing beam splitter 45 Electric mixer

Claims (6)

入射光に対して、透明で均質な直角プリズムと、該直角プリズムの入射光が入射する辺と出射光が出射する辺の間の前記入射光が入射し、該入射光を反射する辺に均質に蒸着、または成長した前記直角プリズムの屈折率よりも低い屈折率を有する低屈折率誘電体膜と、該低屈折率誘電体膜上に金属または半導体の薄膜をする光検出部を備え、前記全反射面の近傍では近接光場が発生し、前記金属または半導体の薄膜にて散乱され、前記金属または半導体の薄膜面に吸収された光は、前記金属または半導体の薄膜面内で電子に変換され、電気信号として取り出すことを特徴とする光検出装置。With respect to the incident light, a transparent and homogeneous right-angle prism, and the incident light between the side where the incident light of the right-angle prism is incident and the side where the emitted light is emitted are incident, and the incident light is totally reflected. comprising a low-refractive-index dielectric film having a lower refractive index than homogeneously deposited or grown refractive index of the right-angle prism, the light detection unit which have a thin film of a metal or semiconductor to the low refractive index dielectric film In the vicinity of the total reflection surface, a near light field is generated, scattered by the metal or semiconductor thin film, and absorbed by the metal or semiconductor thin film surface. Photodetector characterized in that it is converted into an electric signal and extracted as an electrical signal . 請求項1記載の光検出装置において、入射する光の空間的形状とその偏光状態を制御する手段を有する光検出装置。The optical detection apparatus of claim 1 Symbol placement, optical detection device including means for controlling the polarization state spatial shape of the incident light with. 請求項記載の光検出装置において、入射波長に依存して、偏光状態を制御する制御手段を有する光検出装置。 3. The photodetector according to claim 2, further comprising a control unit that controls a polarization state depending on an incident wavelength. 請求項記載の光検出装置において、入射光により誘起された金属または半導体の薄膜内の電子を引き出し、その背後に設置した電子増倍機構または電子偏向機構に導くような電界を印加する手段を有する光検出装置。4. The light detection device according to claim 3, wherein means for applying an electric field for extracting electrons in a thin film of metal or semiconductor induced by incident light and guiding them to an electron multiplication mechanism or an electron deflection mechanism installed behind the thin film is provided. Photodetector with 請求項記載の光検出装置において、前記窓材と前記低屈折率誘電体膜面との間にて反射して光電子変換されない成分の偏光面を回転してから、再びこの変換面に入射させる手段を有する光検出装置。5. The photodetector according to claim 4 , wherein a polarization plane of a component which is reflected between the window material and the low refractive index dielectric film surface and is not photoelectron-converted is rotated and then incident on the conversion surface again. Photodetector having means. 請求項1からのうちいずれか1項記載の光検出装置において、入射光に対して、偏光による光分波器を通して、それぞれ直交成分に分解した後、それぞれの偏光に対して、検出装置を一つずつ配置して、検出した後、再び電気的に信号を結合した光検出装置。The optical detection device according to any one of claims 1 to 5, with respect to the incident light, through an optical demultiplexer according to polarization, after decomposing each quadrature component for each of the polarization, the detector Photodetectors that are arranged one by one, detected, and then electrically coupled again.
JP25801496A 1996-09-30 1996-09-30 Photodetector Expired - Fee Related JP3770976B2 (en)

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US20080197273A1 (en) * 2007-01-23 2008-08-21 Paul Andrew Mitchell Light Detection Apparatus
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