JP3771015B2 - Method for treating end of outer semiconductive layer of CV cable - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for treating an end portion of a free stripping type external semiconductive layer in a CV cable.
[0002]
[Prior art]
When assembling the junction box, it is necessary to peel off the end of the outer semiconductive layer having a prescribed size.
A conventional stripping method in the case of a CV cable having a free stripping type external semiconductive layer will be described with reference to FIGS.
2 and 3,
10 is the whole CV cable,
12 is the conductor,
14 is an internal semiconductive layer,
16 is a cable insulator,
Reference numeral 18 denotes an external semiconductive layer.
[0003]
The external semiconductive layer is peeled off as follows.
{Circle around (1)} As shown in FIG. 2A, a notch 180 is made in the outer semiconductive layer 18 at a predetermined position A at the end of the CV cable 10 using a dedicated tool 20.
Further, a spiral cut 182 is made in the outer semiconductive layer 18 forward from the predetermined position A.
[0004]
Note that the predetermined position A is a position where the front external semiconductive layer 18 is to be peeled off from that position, in other words, the end of the external semiconductive layer 18 remaining on the cable after the external semiconductive layer 18 is peeled off. Say the position.
[0005]
{Circle around (2)} The outer semiconductive layer 18 where the cuts 180 and 182 are made is removed to expose the cable insulator 16 as shown in FIG.
[0006]
2) Alternatively, as shown in FIG. 2C, a cut 184 parallel to the bus bar of the CV cable 10 is made, and the external semiconductive layer 18 is peeled off to make it as shown in FIG. is there.
[0007]
Here, when applying a free stripping type external semiconducting layer to CV cables of 66-77kV class or higher, considering the influence on the electrical performance of the connection part, the following end treatment of the external semiconducting layer Etc. are considered necessary.
(3) As shown in FIG. 3 (a), the end portion of the external semiconductive layer 18 is subjected to a penciling process using a glass cutting tool 22 or the like.
(4) Then, the hatched portion shown in FIG.
(5) After finishing, a semiconductive paint 24 is applied as shown in FIG.
{Circle around (6)} Finally, as shown in FIG. 6D, the ACP tape (for CH) or C tape (for JB) 26, which is a semiconductive tape, is wound.
[0008]
[Problems to be solved by the invention]
When the above-described notch 180 or the like is inserted with the tool 20, the blade 200 of the tool 20 is not inserted until it reaches the cable insulator 16 as shown in FIG. This is because the cable insulator 16 may be damaged. Therefore, a cut residue 186 is formed under the cut 180 or the like.
As a result, when the outer semiconductive layer 18 is peeled off, the portion of the cutout 186 is finally torn off.
[0009]
Therefore, in this portion, as shown in FIG. 4B, the terminal of the external semiconductive layer 18 is surely peeled off although it is slight (although it is exaggerated in the figure).
Moreover, even when performing the penciling process, there is a possibility that the peeled portion cannot be completely removed due to oversight.
Further, depending on the manner of glass shaving and sandpaper shaving, the peeling is rather increased (see FIG. 4C).
[0010]
As described above, in the case of a free stripping type external semiconductive layer, peeling occurs at the end of the external semiconductive layer. Therefore, when considering the application of the free stripping type external semiconductive layer to CV cables of 66 to 77 kV class or higher There is also a concern that the electrical performance of the connection part is greatly affected.
[0011]
[Means for Solving the Problems]
As illustrated in FIG.
{Circle around (1)} As for the portion indicated by oblique lines in FIG. 8 (b), the external semiconductive layer 18 between the predetermined position A and a suitable position C slightly behind it is subjected to a pencilling process as shown in FIG. At the same time, the front outer semiconductive layer 18 from the predetermined position A is scraped over a certain length,
{Circle around (2)} Then, as shown in FIG. 4D, the previous outer semiconductive layer 18 is peeled off from the shaved portion.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
(1) Actually, as shown in FIG. 1 (a), first, from a position B slightly ahead of the predetermined position A by a distance e (for example, about 5 to 10 mm) from the front end of the external semiconductive layer 18, A spiral notch 182 is made with the tool 20.
[0013]
(2) Next, with respect to the portion indicated by hatching in FIG. 6 (b), a predetermined distance from the rear position C by a slight distance f (for example, about 10 to 20 mm) from the predetermined position A as shown in FIG. A glass cutting tool 22 is used to perform a penciling process toward A,
At the same time, the outer semiconductive layer 18 between the predetermined position A and a distance D (for example, about 50 mm) to the front D is shaved.
At that time, as shown in FIG. 3C, the outer semiconductive layer 18 is completely scraped between the predetermined positions A and B to expose the cable insulator 16.
The outer semiconductive layer 18 between the BDs may be tapered.
[0014]
(3) Next, as shown in FIG. 3C, the external semiconductive layer 18 is peeled off from the end of the CV cable 10 to the rear, and as shown in FIG.
[0015]
(4) After that, like the conventional case, the portion corresponding to the shaded portion in FIG.
(5) Apply semiconductive paint on the finished surface (see Fig. 3 (c)),
(6) Finally, wrap the ACP tape (for CH) or C tape (for JB) (see FIG. 3D).
[0016]
【The invention's effect】
(1) In the peeling operation of the external semiconductive layer, there is no action of finally tearing off the terminal, so that the terminal of the external semiconductive layer does not peel off.
(2) Since the terminal does not peel off, there is no possibility of an electrical defect from the beginning, and external semiconductive layer free stripping to a 66 to 77 kV class or higher CV cable becomes possible.
(3) The external semiconductive layer can be penciled simultaneously, and even if the final sandpaper is removed, the external semiconductive layer terminal does not peel off.
Therefore, assembly can be performed without deteriorating the electrical properties of the junction box.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of an embodiment of the present invention.
FIG. 2 is an explanatory view of a construction method until peeling of an external semiconductive layer 18 in a conventional method for treating an end portion of an external semiconductive layer.
FIG. 3 is an explanatory diagram of a process after peeling of the external semiconductive layer 18 in a conventional method for treating the edge of the external semiconductive layer.
FIG. 4 is an explanatory diagram of a problem to be solved by the present invention.
[Explanation of symbols]
10 CV cable 12 Cable conductor 14 Inner semiconductive layer 16 Cable insulator 18 Outer semiconductive layer 180, 182, 184 Notch 186 Not remaining 20, 22 Tool 200 Blade 24 Semiconductive paint 26 Tape A Predetermined position

Claims (1)

The step of stripping the front external semiconductive layer from a predetermined position at the end of the CV cable having the free stripping type external semiconductive layer, and the end of the external semiconductive layer remaining behind from the predetermined position are penciled. In a method of processing an outer semiconductive layer end of a CV cable having a step,
From the position slightly ahead of the predetermined position to the front end of the outer semiconductive layer, a step of making a spiral cut,
The external semiconductive layer between the predetermined position and an appropriate position slightly behind it is subjected to a penciling process, and at the same time , the external semiconductive layer in front of the predetermined position is completely moved from the predetermined position to a slightly forward position. Scraping process,
And a step of stripping off the external semiconductive layer from the scraped portion. The method for treating the end of the external semiconductive layer of the CV cable.

Images