JP3773938B2 - Method of manufacturing micro-capacitor type ultrasonic transducer with coining technology - Google Patents

Description

  The present invention relates to a method for manufacturing a kind of ultrasonic transducer, and more particularly to a method for manufacturing a microcapacitor ultrasonic transducer, and more particularly, to a method for manufacturing a microcapacitor ultrasonic transducer using a coining technique.

  Ultrasonic detection technology began to develop in the Second World War and was used for defense military applications in the early days, and in the late 1950s it was applied in large quantities to medical detection. Among all ultrasonic detection technologies, ultrasonic transducers have played an extremely important role, and in the past decades, a great deal of research has been developed in various fields, and related technologies have also matured. The main research direction is the piezoelectric ultrasonic transducer.

The so-called piezoelectric effect includes a direct piezoelectric effect and a reverse piezoelectric effect. When the piezoelectric body is subjected to an electric field action, the electric dipole moment is stretched and the piezoelectric body is stretched along the direction of the electric field, which converts electrical energy into mechanical energy. On the other hand, when pressure is applied to the piezoelectric body, the electric dipole moment in the piezoelectric body becomes shorter due to the compression of the material, and at this time, the piezoelectric body resists such a tendency, so even if voltage is generated, Hold. Utilizing this feature, the piezoelectric ultrasonic transducer can convert the voltage signal into a sound wave signal and fire it, and can convert the received sound wave signal into a fine voltage signal, which can be used as a probe for ultrasonic detection. Can be done. Commonly used piezoelectric materials are ceramics, such as barium titanate (BaTiO ₃ ) and lead zirconate titanate (PZT), as well as single crystals such as quartz, tourmaline, tantalate, niobate. Etc. However, the manufacturing cost of such a piezoelectric ultrasonic transducer is too high, and in terms of the device characteristics, the lattice vibration of the piezoelectric material tends to cause a decrease in frequency width and sound pressure, and in particular, it is used for non-contact detection. Sometimes, the difference in sound resistance between the piezoelectric material and air is excessive, so that a mismatch situation occurs, and a situation where a large amount of sound wave signals are reflected at the contact interface occurs, and the detection efficiency tends to be lowered. In addition, it is difficult to apply to nanometer-level precision detection technology due to the limitations of the resolution and frequency width.

  For this reason, in recent years, microcapacitor-type ultrasonic transducers have been contactively studied in various fields, and patents related thereto include, for example, Patent Documents 1 to 3. The structure of the micro-capacitor type ultrasonic transducer is as shown in FIG. 1, and a plurality of support sheets 12 are formed on a substrate 11, and the vibration sheet 13 is formed above the support sheet 12. Is the upper electrode layer 14. Among them, the substrate 11 is doped with impurities and has conductivity, which forms a capacitor structure with the upper electrode layer 14. A hollow chamber 15 surrounded by the substrate 11, the support sheet 12 and the vibration thin film 13 provides a space necessary for vertical vibration when the vibration thin film 13 vibrates. Such a micro-capacitor type ultrasonic transducer has the following advantages. (1) The frequency width can be increased (2) It is easy to form an array having a high frequency (3) The circuit of the previous stage can be aligned on the same silicon wafer (4) Mass production can be performed and the cost can be reduced. The microcapacitor-type ultrasonic transducer is characterized by the design of a hollow chamber and a vibrating membrane, and various geometric features of the hollow chamber and the vibrating membrane, such as the radius and thickness of the vibrating membrane, the vertical distance between the electrodes, etc. It is related to the performance and expression of the entire micro-capacitor type ultrasonic transducer, and therefore, it is desirable that the setting of all parameters of the manufacturing process can be made to be consistent and consistent with all sizes. At present, the manufacturing method of the micro-capacitor type ultrasonic transducer is as shown in FIGS. 2 to 4. First, the supporting oxide layer 22, the vibration thin film layer 23 and the conductive layer 24 are formed on the substrate 21 in order. Further, a plurality of holes 25 penetrating the vibration thin film layer 23 and the conductive layer 24 are formed by etching lithography, and finally the supporting oxide layer 22 is etched through the holes 25. The etching selectivity of the etchant for the support oxide layer 22 and the vibration thin film layer 23 with respect to two different materials is different, and the support oxide layer 22 can be etched more than the vibration thin film layer 23. Therefore, by time control, a cylindrical hollow chamber 221 that extends outwardly around the hole 25 is formed in the support oxide layer 22 to complete a complete micro-capacitor-type ultrasonic transducer structure. However, in this manufacturing method, it is difficult to control and inspect the shape of the hollow chamber 221, and only by experience, variations in the process, such as a change in the concentration of the etching solution, can easily cause a change in the size of the hollow chamber 221. Affects device characteristics.

  In addition, the hole 25 is used as a channel for inflow of etching solution and outflow of etching by-product, but this method easily forms contamination of the hollow chamber 221 and is not easy to clean. Affects properties. Therefore, it is required to solve the above drawbacks.

  Nanometer coining lithography technology was the beginning of research on nanometer coining lithography technology in 1995 and 1996, when two research papers were published by Princeton University Electrical Research Group in the United States. Nanometer coining lithography differs from traditional lithography methods in that it does not use an energy beam with energy. Thus, the resolution of nanometer coining lithography is not limited by the effects of wave diffraction in the resist, scattering, interference and substrate echo scattering, which belongs to the physical process and not to the chemical process. In fact, coining lithography technology has already appeared in the late 1970s, research related to it has also appeared one after another, and related patents are increasing more and more, for example, Patent Documents 4-7.

  FIG. 5 to FIG. 9 are diagrams showing application of the coining lithography technique to the semiconductor process. First, the insulating layer 32 and the flexible material thin film 33 are formed in order on the substrate 31, and the flexible material thin film 33 is made into a plastic state by an appropriate method. Subsequently, a mold 34 having a concavo-convex pattern on the surface is used and is pressed onto the flexible material thin film 33 to transfer the pattern on the surface of the mold 34 to the flexible material thin film 33. During the coining process, the convex portion on the surface of the mold 34 does not contact the insulating layer 32, and the convex portion forms a relatively thin block 331 on the flexible material thin film 33. When the mold 34 is removed, a pattern whose height corresponds to the mold is formed on the flexible material thin film 33. Subsequently, the thin block 331 is removed by an etching method, and the insulating layer 321 located below the thin block 331 is exposed. Finally, if the exposed portion of the insulating layer 321 and the flexible material thin film 33 above the insulating layer 32 are removed, the insulating layer 32 forms a mask corresponding to the pattern of the mold, and this is used in subsequent semiconductor processes, for example, ion layout, etc. Used for.

Obviously, if the coining lithography technology is used in the semiconductor process, many processes can be omitted, especially the mold application can further speed up the production flow and save expensive mask fabrication maintenance costs. In addition, the mold has a high degree of applicability to orderly arranged array patterns, and therefore, if the coining lithography technology is applied to a microcapacitor type ultrasonic transducer, it will bring a huge innovation to the industry. It has the following advantages.
1. Mass production is possible.
2. Easy to manufacture.
3. Using polymer materials as the main components of vibrating membranes and hollow chambers, the selectivity is very high, and if bio-compatible materials are selected, the micro-condenser ultrasonic transducers in the biomedical world It is further advantageous for the application.
4). The height of the hollow chamber can be reduced, the overall uniformity can be easily controlled, and the sensitivity of the transducer can be increased.
5. The polymer material for manufacturing the hollow chamber can control and improve the Lamb wave effect formed by the conventional silicon substrate.
6). The hollow chamber and the vibration thin film in the traditional process have to use different materials, and their thermal expansion coefficients are different, so that the ultrasonic transducer characteristics have been modified, affecting its stability. The method of the present invention solves this known technical problem by allowing the same material to be used for the hollow chamber and the vibrating membrane.
7). The height of the hollow chamber of the micro-capacitor type ultrasonic transducer manufactured by the coining method can be controlled to a micro / nanometer size, the transducer performance can be enhanced, and application effects can be provided.

US Pat. No. 6,426,582 US Pat. No. 6,004,832 US Pat. No. 6,295,247 US Pat. No. 4,035,226 US Pat. No. 5,259,926 US Pat. No. 5,772,905 US Pat. No. 6,375,870

  The main object of the present invention is to provide a method of manufacturing a microcapacitor type ultrasonic transducer by coining technology, which is necessary for a microcapacitor type ultrasonic transducer using a mold having a specific pattern. The method is to form a hollow chamber, achieve mass production, uniform control, and achieve the effect of reducing manufacturing costs.

  The next object of the present invention is to provide a method of manufacturing a microcapacitor type ultrasonic transducer by coining technology, which is precisely in a microcapacitor type ultrasonic transducer by a method of precision machining a mold. It is a method that can control the geometric dimension of the hollow chamber, thereby reducing the distance between the electrodes as much as possible, and increasing the sensitivity of the ultrasonic transducer.

  Another object of the present invention is to provide a method of manufacturing a micro-capacitor ultrasonic transducer by coining technology, which is known in the art to remove holes from unetched and etchant flow channels. It is assumed that the method can eliminate the necessity to keep the hollow chamber clean.

The invention of claim 1
(A) providing a conductive substrate;
(B) forming a support sheet thin film layer on the substrate;
(C) forming a plurality of thin film layer concave grooves in an array arrangement on the support sheet thin film layer by a coining method;
(D) providing a polymer thin film layer having an upper surface and a lower surface;
(E) a step of forming a plurality of upper electrodes in an array arrangement on the upper surface of the polymer thin film layer, and connecting each two adjacent upper electrodes with an in-conduction wiring;
(F) The lower surface of the polymer thin film layer is adhered to the upper side of the support sheet thin film layer, and a plurality of closed hollow chambers are formed by causing the electrodes and the thin film layer concave grooves to correspond to each other. Forming a sonic transducer;
The microcapacitor-type ultrasonic transducer is manufactured by the coining technique including the steps (a) to (f).
The invention of claim 2 is a method of manufacturing a microcapacitor ultrasonic transducer by the coining technique according to claim 1, wherein the step (a) further comprises:
(A1) forming a plurality of lower electrode plates of a specific arrangement above the substrate, and connecting each of the two adjacent lower electrode plates with conductive inner wiring;
The microcapacitor-type ultrasonic transducer is manufactured by the coining technology.
According to a third aspect of the present invention, in the method of manufacturing a microcapacitor-type ultrasonic transducer using the coining technique according to the first aspect, the step (c) of forming a plurality of thin film layer concave grooves further comprises (I) a specific unevenness Providing a mold having a surface with an array pattern of the array;
(II) Using a driving device, the surface having the array pattern of the mold is press-fitted into the support sheet thin film layer, and the array pattern on the mold surface is transferred to the support sheet thin film layer. Forming a thin support sheet thin film layer in a region corresponding to the convex portion of the mold surface above the substrate so as not to contact the substrate,
(III) a step of removing the mold from the support sheet thin film layer in which the plurality of thin film layer grooves of a specific arrangement are formed,
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique, characterized by comprising the above steps.
According to a fourth aspect of the present invention, in the method for manufacturing a microcapacitor ultrasonic transducer by the coining technique according to the third aspect, after the step (III),
(IV) The process of removing the thin support sheet thin film layer by etching and conducting the bottom of the thin film layer groove to the substrate,
The microcapacitor-type ultrasonic transducer is manufactured by the coining technology.
According to a fifth aspect of the present invention, in the method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique according to the first aspect, the step of forming the plurality of thin film layer concave grooves in (c) comprises:
(I ′) providing a cylindrical mold having an outer surface having an array pattern of a specific uneven arrangement;
(II ′) Using a driving device, the cylindrical mold is pressed and rolled on the support sheet thin film layer, the array pattern on the outer surface is transferred to the support sheet thin film layer, and a plurality of specific arrays are arranged on the support sheet thin film layer. A thin support sheet thin film is formed in a region corresponding to the convex part of the cylindrical mold outer surface above the substrate so that the convex part of the cylindrical mold outer surface does not contact the substrate during the pressurizing process. Forming a layer;
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique, characterized by comprising the above steps.
The invention of claim 6 is a method of manufacturing a microcapacitor type ultrasonic transducer by the coining technique according to claim 5, and further after the step (II ′),
(III ') a step of removing the thin support sheet thin film layer by an etching method and conducting the bottom of the thin film layer groove to the substrate,
The microcapacitor-type ultrasonic transducer is manufactured by the coining technology.
The invention according to claim 7 is a method of manufacturing a microcapacitor ultrasonic transducer by the coining technique according to claim 1, wherein the coining method in the step (c) is any one of thermal coining, light auxiliary coining, and nanometer coining. In this method, a microcapacitor ultrasonic transducer is manufactured by the coining technique.
The invention of claim 8 is a method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique according to claim 1, wherein a method of forming a plurality of upper electrodes in the step (e) is:
(1) forming a metal layer above the polymer thin film layer and applying a photoresist above the metal layer;
(2) A step of forming a mask having a specific arrangement pattern on the photoresist layer using an exposure and development step;
(3) etching the metal layer, and forming an upper electrode plate by not etching the area of the metal layer having a mask above;
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique, characterized by comprising the above steps.
The invention of claim 9 is a method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique according to claim 1, wherein a method of forming a plurality of upper electrodes in the step (e) is:
(1 ′) forming a conductive layer of a polymer material above the polymer thin film layer;
(2 ′) forming a plurality of upper electrodes in an array arrangement on the conductive layer by a coining method;
The method includes the steps described above, and the method of manufacturing the microcapacitor-type ultrasonic transducer by the coining technique is characterized in that the coining method is any one of thermal coining, light auxiliary coining, and nanometer coining. .
The invention of claim 10
(A) providing a conductive substrate;
(B) forming a support sheet thin film layer on the substrate;
(C) forming a plurality of thin film layer concave grooves in an array arrangement on the support sheet thin film layer by a coining method;
(D) A polymer thin film layer is adhered above the support sheet thin film layer to form a plurality of closed hollow chambers necessary for a microcapacitor-type ultrasonic transducer in a plurality of thin film layer concave grooves, and the closed hollow chambers The upper surface of the polymer thin film layer,
(E) A plurality of upper electrodes in an array arrangement are formed on the polymer thin film layer, two adjacent upper electrodes are connected by conductive internal wiring, and the plurality of upper electrodes are paired with a plurality of closed hollow chambers. The process to correspond in one,
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique, characterized by comprising the above steps.

  The method of manufacturing a microcapacitor ultrasonic transducer using the coining technology of the present invention achieves mass production and uniform control by forming a hollow chamber necessary for a microcapacitor ultrasonic transducer using a mold with a specific pattern. As well as achieving the effect of reducing manufacturing costs.

  The method of manufacturing a microcapacitor type ultrasonic transducer with the coining technology of the present invention accurately controls the geometric dimension of the hollow chamber in the microcapacitor type ultrasonic transducer by a method of precisely machining the mold, thereby This is a method that can reduce the distance between them as much as possible and increase the sensitivity of the ultrasonic transducer.

  A method of manufacturing a micro-capacitor ultrasonic transducer using the coining technology of the present invention is a known method that eliminates the need for holes as channels for discharging non-etched material and flowing in etching solution, and can keep the hollow chamber clean. It is.

The method of manufacturing a microcapacitor type ultrasonic transducer by the coining technology of the present invention includes the following steps.
(A) providing a substrate; The substrate is conductive.
(B) A support sheet thin film layer is formed on the substrate.
(C) providing a mold; The mold has a surface with an array pattern of a specific concavo-convex arrangement.
(D) The mold is pressed, the surface having the array pattern is press-fitted into the support sheet thin film layer, and the array pattern on the mold surface is transferred to the support sheet thin film layer.
(E) The mold is removed, and a plurality of thin film layer grooves having a specific arrangement are formed on the support sheet thin film layer.
(F) providing a polymer thin film layer;
(G) A plurality of upper electrode plates arranged in an array are formed on the polymer thin film layer, and the two adjacent upper electrode plates are connected by an in-conduction wiring.
(H) The lower surface of the polymer thin film layer is bonded to the upper side of the support thin film layer to form a closed hollow chamber in the plurality of thin film layer grooves. Above the closed hollow chamber is a polymer thin film layer, on the polymer thin film layer are a plurality of electrode plates, and the plurality of upper electrode plates correspond to the plurality of closed spaces in a one-to-one relationship.

In addition, in another embodiment, a method for manufacturing a microcapacitor type ultrasonic transducer by the coining technique of the present invention includes the following steps.
(A ′) A substrate is provided. The substrate is conductive.
(B ′) A support sheet thin film layer is formed on the substrate.
(C ′) A cylindrical mold is provided. The cylindrical mold has an outer surface provided with an array pattern having a specific uneven arrangement.
(D ′) The cylindrical mold is pressed using a driving device to roll on the support sheet thin film layer, the array pattern is transferred to the support sheet thin film layer, and a specific arrangement is formed on the support sheet thin film layer. A plurality of thin film layer grooves are formed.
(E ′) A polymer thin film layer is provided.
(F ′) A plurality of upper electrode plates in an array arrangement are formed on the polymer thin film layer, and the adjacent two upper electrode plates are connected by conductive internal wiring.
(G ′) The lower surface of the polymer thin film layer is bonded to the upper side of the support thin film layer to form a hollow chamber closed in the plurality of thin film layer grooves. Above the closed hollow chamber is a polymer thin film layer, on the polymer thin film layer are a plurality of electrode plates, and the plurality of upper electrode plates correspond to the plurality of closed spaces in a one-to-one relationship.

  FIGS. 10 to 16 are views showing the first embodiment of the present invention. First, a substrate 41 is provided. The substrate 41 is doped with impurities and has a conductive ability. The substrate 41 is a lower electrode plate of a microcapacitor type ultrasonic transducer, and preferably, a plurality of conductive plates are provided on the upper surface or lower surface of the substrate, and the lower electrode plate of the microcapacitor type ultrasonic transducer is provided. Strengthened. The plurality of conductive plates are connected by an in-conduction wiring. Subsequently, a support sheet thin film layer 42 is formed on the substrate 41, and in order to combine with the coining technique, the material is a flexible polymer material, for example, PMMA, in order to increase the sensitivity of the microcapacitor ultrasonic transducer. The thickness of the support sheet thin film layer 42 is preferably as thin as possible, which is the outer wall of the hollow chamber of the microcapacitor-type ultrasonic transducer. Subsequently, the mold 51 having a specific concavo-convex array pattern 512 on the surface 511 is pressed onto the support sheet thin film layer 42 using the driving device, and the surface 511 having the array pattern 512 is pressed. Since the support sheet thin film layer 42 is a flexible material, the array pattern 512 on the surface of the mold 51 is transferred to the support sheet thin film layer 42. Subsequently, when the mold 51 is removed from the support sheet thin film layer 42, a plurality of thin film layer concave grooves 421 having a specific arrangement are formed in the support sheet thin film layer 42. In the process of pressure contact of the mold 51, the convex portion of the surface does not contact the surface of the substrate 41. In other words, the bottom portion of the thin film layer groove 421 formed by the convex portion of the mold surface does not contact the surface of the substrate 41. A thin support sheet thin film layer is reserved. Finally, the thin support sheet thin film layer is removed by an etching method to expose the substrate 41 at the bottom of the thin film layer groove 421. The advantage is that scratches or damages between the mold and the substrate formed by contact can be prevented. The method of coining may be thermal coining, laser light assisted coining, nanometer coining, or any other coining technique that can produce other coining effects.

  Subsequently, a polymer thin film layer 43 is provided on another platform, and a plurality of upper electrode plates 441 having a specific array arrangement are formed above the polymer thin film layer 43, which is necessary for a microcapacitor type ultrasonic transducer. An upper electrode plate is used, and all the upper electrode plates 441 are connected to each other by a conductive wire. Finally, the polymer thin film layer 43 is adhered onto the support sheet thin film layer 42, thus forming the closed hollow chambers 422 in all the thin film layer concave grooves 421. Among them, the polymer thin film layer 43 and the support sheet thin film layer 42 use the same material, thereby preventing the modification of the ultrasonic transducer characteristics formed by the difference in thermal expansion coefficient and the problem of the influence on the stability. . Above the closed hollow chamber 422 is a polymer thin film layer 43, above the polymer thin film layer 43 is an upper electrode plate 441, and each upper electrode plate 441 corresponds to one closed hollow chamber 422. FIG. 17 is a plan view of a micro-capacitor ultrasonic transducer completed according to the present invention. The upper electrode plate 441 is located at the center area of the corresponding hollow chamber 422, and its cross-sectional area is a cross-section of the closed hollow chamber 422. Between the two upper electrode plates 441 adjacent to each other, which is about 60 to 70% of the area, is connected by the conductive internal wiring 442.

In addition, the plurality of upper electrode plates 441 described above can be formed by traditional semiconductor development, exposure, and etching processes, which include the following processes.
1. A conductive layer 44 is formed above the polymer thin film layer 43, and a photoresist is applied above the conductive layer 44.
2. A mask having a specific arrangement pattern is formed on the photoresist layer using an exposure and development process.
3. The conductive layer 44 is etched, and the upper electrode plate 441 is formed without etching the area having the mask above the conductive layer.

This method is applied particularly when the conductive layer 44 is a solid thin film layer such as a metal or polysilicon. If the conductive layer is a flexible material, the coining technique can also be used in the manufacturing method of the upper electrode plate 441, which includes the following steps.
1 ′ A conductive layer 44 is formed above the polymer thin film layer 43.
2 'Provides the second type. A second array pattern having a specific uneven arrangement is formed on the surface.
3 'The second mold is pressed, and the surface having the second array pattern is pressed into the conductive layer 44, whereby the second array pattern on the second mold surface is transferred to the conductive layer 44.
When the 4 ′ second mold is removed, a plurality of upper electrode plates 441 having a specific arrangement are formed on the conductive layer 44.

  18 to 24 are diagrams showing another embodiment of the present invention. First, a substrate 61 is provided, and the substrate 61 is doped with impurities and has a conductive ability. The substrate 61 is a lower electrode plate of a micro-capacitor type ultrasonic transducer, and preferably, a plurality of conductive plates are provided on the upper surface or lower surface of the substrate, and the lower electrode plate of the micro-capacitor type ultrasonic transducer is provided. Strengthened. The plurality of conductive plates are connected by an in-conduction wiring. Subsequently, a support sheet thin film layer 62 is formed on the substrate 61, and in order to combine with the coining technology, the material is a flexible polymer material, for example, PMMA. The outer wall of the hollow chamber of the transducer. Subsequently, a cylindrical mold 71 is provided. An array pattern 712 having a specific uneven arrangement is formed on the outer surface 711 of the cylindrical mold 71. The cylindrical mold 71 is pressed using a driving device to roll on the support sheet thin film layer 62, the array pattern 712 on the outer surface thereof is transferred to the support sheet thin film layer 62, and directly on the support sheet thin film layer 62. A plurality of thin film layer grooves 621 having a specific arrangement are formed. Similar to the first embodiment, in the process of pressurizing the cylindrical mold 71, the convex portion on the surface thereof does not contact the surface of the substrate 61, in other words, the thin film layer concave formed by the convex portion on the surface of the cylindrical mold 71. The bottom portion of the groove 621 does not contact the surface of the substrate 51, and the thin support sheet thin film layer is retained. Further, this thin support sheet thin film layer is removed by an etching method to expose the substrate 51 at the bottom of the thin film layer groove 621.

  Subsequently, a polymer thin film layer 63 is provided on another platform, and a plurality of upper electrode plates 641 having a specific array arrangement are formed above the polymer thin film layer 63, which is necessary for a microcapacitor type ultrasonic transducer. An upper electrode plate is used, and all upper electrode plates 641 are connected to each other through in-conduction wiring. Finally, the polymer thin film layer 63 is bonded onto the support sheet thin film layer 62, thus forming the closed hollow chambers 622 in all the thin film layer concave grooves 621. Above the closed hollow chamber 622 is a polymer thin film layer 63, above the polymer thin film layer 63 is an upper electrode plate 641, and each upper electrode plate 641 corresponds to one closed hollow chamber 622. The upper electrode plate 641 is located at the center area of the corresponding hollow chamber 622, and its cross-sectional area is about 60 to 70% of the cross-sectional area of the closed hollow chamber 622, and each of the two upper electrode plates 641 adjacent to each other. They are connected by an internal conductive line 642.

  In addition, the above-described plurality of upper electrode plates 641 can be formed by the method described in the first embodiment, and if the material of the conductive layer 64 is a solid thin film layer such as metal or polysilicon, it is traditional. It can be formed by typical semiconductor development, exposure, and etching processes. If the conductive layer 64 is a flexible material, it can be formed by a coining method. In addition to the general coining method described in the first embodiment or the method using the cylindrical roller used in the present embodiment, the coining method has thermal coining, laser beam auxiliary coining, nanometer coining, or other coining effects. Can use coining technology.

  In both the first and second embodiments, the upper electrode plate can be manufactured after the polymer thin film layer is bonded to the support sheet thin film layer. In other words, the process forms a support sheet thin film layer on the substrate, further forms a plurality of concave grooves in the support sheet thin film layer by using a coining technique, and then forms a polymer thin film layer on the support sheet thin film layer. When bonded to the upper side, the plurality of concave grooves form a plurality of closed hollow chambers necessary for the microcapacitor ultrasonic transducer, and finally, an upper electrode plate corresponding to each hollow chamber is formed above the polymer thin film layer. Form.

  The above is a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any modification or alteration in detail that may be made based on the present invention shall fall within the scope of the claims of the present invention. .

It is a basic structure display figure of a micro capacitor type ultrasonic transducer. It is a manufacturing method display figure of a known microcapacitor type ultrasonic transducer. It is a manufacturing method display figure of a known microcapacitor type ultrasonic transducer. It is a manufacturing method display figure of a known microcapacitor type ultrasonic transducer. It is an application display figure to the semiconductor process of coining lithography technology. It is an application display figure to the semiconductor process of coining lithography technology. It is an application display figure to the semiconductor process of coining lithography technology. It is an application display figure to the semiconductor process of coining lithography technology. It is an application display figure to the semiconductor process of coining lithography technology. It is a 1st Example display figure of the manufacturing method of the micro capacitor type ultrasonic transducer of the present invention. It is a 1st Example display figure of the manufacturing method of the micro capacitor type ultrasonic transducer of the present invention. It is a 1st Example display figure of the manufacturing method of the micro capacitor type ultrasonic transducer of the present invention. It is a 1st Example display figure of the manufacturing method of the micro capacitor type ultrasonic transducer of the present invention. It is a 1st Example display figure of the manufacturing method of the micro capacitor type ultrasonic transducer of the present invention. It is a 1st Example display figure of the manufacturing method of the micro capacitor type ultrasonic transducer of the present invention. It is a 1st Example display figure of the manufacturing method of the micro capacitor type ultrasonic transducer of the present invention. It is a top view of the micro capacitor | condenser type | mold ultrasonic transducer manufactured in 1st Example of the manufacturing method of the micro capacitor | condenser type ultrasonic transducer of this invention. It is a 2nd Example display figure of the manufacturing method of the micro capacitor | condenser type ultrasonic transducer of this invention. It is a 2nd Example display figure of the manufacturing method of the micro capacitor | condenser type ultrasonic transducer of this invention. It is a 2nd Example display figure of the manufacturing method of the micro capacitor | condenser type ultrasonic transducer of this invention. It is a 2nd Example display figure of the manufacturing method of the micro capacitor | condenser type ultrasonic transducer of this invention. It is a 2nd Example display figure of the manufacturing method of the micro capacitor | condenser type ultrasonic transducer of this invention. It is a 2nd Example display figure of the manufacturing method of the micro capacitor | condenser type ultrasonic transducer of this invention. It is a 2nd Example display figure of the manufacturing method of the micro capacitor | condenser type ultrasonic transducer of this invention.

Explanation of symbols

11 substrate 12 support sheet 13 vibration thin film 14 upper electrode layer 15 hollow chamber 21 substrate 22 supporting oxide layer 221 hollow chamber 23 vibration thin film layer 24 conductive layer 25 hole 31 substrate 32 insulating layer 33 flexible material thin film 331 thin block 34 type 41 substrate 42 Support sheet thin film layer 421 Thin film layer groove 422 Hollow chamber 43 Polymer thin film layer 44 Conductive layer 441 Upper electrode plate 442 Conductive wiring 51 Type 511 Surface 512 Array pattern 61 Substrate 62 Support sheet thin film layer 621 Thin film layer groove 622 Hollow chamber 63 Polymer thin film layer 64 Conductive layer 641 Upper electrode plate 642 Conductive wiring 71 Cylindrical type 711 Surface 712 Array pattern

Claims (10)

(A) providing a conductive substrate;
(B) forming a support sheet thin film layer on the substrate;
(C) forming a plurality of thin film layer concave grooves in an array arrangement on the support sheet thin film layer by a coining method;
(D) providing a polymer thin film layer having an upper surface and a lower surface;
(E) a step of forming a plurality of upper electrodes in an array arrangement on the upper surface of the polymer thin film layer, and connecting each two adjacent upper electrodes with an in-conduction wiring;
(F) The lower surface of the polymer thin film layer is adhered to the upper side of the support sheet thin film layer, and a plurality of closed hollow chambers are formed by causing the electrodes and the thin film layer concave grooves to correspond to each other. Forming a sonic transducer;
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique comprising the steps (a) to (f) above. The method of manufacturing a microcapacitor-type ultrasonic transducer using the coining technology according to claim 1, wherein the step (a) further comprises:
(A1) forming a plurality of lower electrode plates in a specific arrangement above the substrate, and connecting each of the two adjacent lower electrode plates with conductive inner wiring;
A method of manufacturing a microcapacitor-type ultrasonic transducer by a coining technique. The method of manufacturing a microcapacitor-type ultrasonic transducer using the coining technology according to claim 1, wherein the step of forming a plurality of thin film layer grooves in (c) further comprises:
(I) a step of providing a mold having a surface having an array pattern of a specific uneven arrangement;
(II) Using a driving device, the surface having the array pattern of the mold is press-fitted into the support sheet thin film layer, and the array pattern on the mold surface is transferred to the support sheet thin film layer. Forming a thin support sheet thin film layer in a region corresponding to the convex portion of the mold surface above the substrate so as not to contact the substrate,
(III) a step of removing the mold from the support sheet thin film layer in which the plurality of thin film layer grooves of a specific arrangement are formed,
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique, comprising the above steps. In the method of manufacturing a microcapacitor type ultrasonic transducer by the coining technology according to claim 3, further after the step (III),
(IV) The process of removing the thin support sheet thin film layer by etching and conducting the bottom of the thin film layer groove to the substrate,
A method of manufacturing a microcapacitor-type ultrasonic transducer by a coining technique. The method for producing a microcapacitor-type ultrasonic transducer by the coining technology according to claim 1, wherein the step (c) of forming a plurality of thin film layer grooves is performed.
(I ′) providing a cylindrical mold having an outer surface having an array pattern of a specific uneven arrangement;
(II ′) Using a driving device, the cylindrical mold is pressed and rolled on the support sheet thin film layer, the array pattern on the outer surface thereof is transferred to the support sheet thin film layer, and the support sheet thin film layer has a plurality of specific arrays. A thin support sheet thin film is formed in a region corresponding to the convex part of the cylindrical mold outer surface above the substrate so that the convex part of the cylindrical mold outer surface does not contact the substrate during the pressurizing process. Forming a layer;
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique, comprising the above steps. 6. The method of manufacturing a microcapacitor type ultrasonic transducer by the coining technique according to claim 5, further comprising a step (II ′) after the step (II ′).
(III ') a step of removing the thin support sheet thin film layer by an etching method and conducting the bottom of the thin film layer groove to the substrate,
A method of manufacturing a microcapacitor-type ultrasonic transducer by a coining technique.   The method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique according to claim 1, wherein the coining method in the step (c) is any one of a thermal coining, a light auxiliary coining, and a nanometer coining. , A method of manufacturing micro-capacitor-type ultrasonic transducers with coining technology. The method for producing a microcapacitor-type ultrasonic transducer by the coining technology according to claim 1, wherein the method of forming a plurality of upper electrodes in the step (e)
(1) forming a metal layer above the polymer thin film layer and applying a photoresist above the metal layer;
(2) A step of forming a mask having a specific arrangement pattern on the photoresist layer using an exposure and development step;
(3) etching the metal layer, and forming an upper electrode plate by not etching the area of the metal layer having a mask above;
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique, comprising the above steps. The method for producing a microcapacitor-type ultrasonic transducer by the coining technology according to claim 1, wherein the method of forming a plurality of upper electrodes in the step (e)
(1 ′) forming a conductive layer of a polymer material above the polymer thin film layer;
(2 ′) forming a plurality of upper electrodes in an array arrangement on the conductive layer by a coining method;
A method of manufacturing a microcapacitor-type ultrasonic transducer by a coining technique, comprising the above steps, wherein the coining method is any one of thermal coining, light auxiliary coining, and nanometer coining. (A) providing a conductive substrate;
(B) forming a support sheet thin film layer on the substrate;
(C) forming a plurality of thin film layer concave grooves in an array arrangement on the support sheet thin film layer by a coining method;
(D) A polymer thin film layer is adhered above the support sheet thin film layer to form a plurality of closed hollow chambers necessary for a microcapacitor-type ultrasonic transducer in a plurality of thin film layer concave grooves, and the closed hollow chambers The upper surface of the polymer thin film layer,
(E) A plurality of upper electrodes in an array arrangement are formed on the polymer thin film layer, two adjacent upper electrodes are connected by conductive internal wiring, and the plurality of upper electrodes are paired with a plurality of closed hollow chambers. The process to correspond in one,
A method of manufacturing a microcapacitor-type ultrasonic transducer by the coining technique, comprising the above steps.

Images