JP3776804B2 - Printed circuit board heat dissipation structure and card type structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat dissipation structure for a printed circuit board used in a card type structure, and more particularly to a connection structure between a heat pipe and a printed circuit board.
[0002]
[Prior art]
In the conventional printed circuit board 101 used in the card type structure 100 as shown in FIG. 8, the following two types of heat dissipation structures have been employed.
[0003]
The first is a heat dissipation structure that improves the thermal conductivity in the printed circuit board surface by embedding the heat pipe 102 in the printed circuit board 101, as shown in FIG.
[0004]
Second, as shown in FIG. 10, the heat dissipation plate 104 is attached to the printed circuit board 101, and the heat from the heat generating component 103 is conducted by the heat dissipation plate 104 to improve the heat conductivity in the printed circuit board surface 101. Structure.
[0005]
[Problems to be solved by the invention]
Such a card-type structure 100 is advantageous in that it is easy to insert and remove the printed circuit board from the apparatus housing, but it is difficult to fix the printed circuit board and the apparatus. Therefore, the conventional heat dissipation structure only improves the thermal conductivity in the printed circuit board surface, and has a problem that it is difficult to dissipate heat directly from the heat-generating component on the printed circuit board to the heat dissipation portion of the apparatus.
[0006]
An object of the present invention is to solve such a conventional problem and to efficiently and easily achieve heat dissipation of a printed board in a card type structure.
[0007]
[Means for Solving the Problems]
The printed circuit board heat dissipation structure of the present invention conducts heat and dissipates a plurality of heat dissipation rods,
A heat dissipating pattern composed of a print pattern that conducts heat, and a plurality of printed circuit boards having a plurality of connecting portions composed of contacts formed by dividing the heat dissipating pattern, and
Each of the plurality of heat dissipating bars is disposed so as to come into contact with a contact of a plurality of connection portions of the plurality of printed circuit boards, and heat from each of the heat radiation patterns of the plurality of printed circuit boards is passed through the contact of the plurality of connection portions. The plurality of heat dissipating bars are configured to be thermally connected.
[0008]
Further, the printed circuit board heat dissipation structure of the present invention is configured such that the connection portion is configured such that the heat dissipation pattern exposed by a hole opened on the printed circuit board is radially divided into a plurality from the central portion of the hole. Have children,
The heat radiating bar is disposed so as to pass through the hole and come into contact with the plurality of contacts, and heat from each heat radiation pattern of the plurality of printed circuit boards is thermally connected to the plurality of heat radiating bars through the plurality of contacts. It is characterized by being configured.
[0009]
Furthermore, the printed circuit board heat dissipation structure of the present invention has a contact configured such that the connection portion is formed by dividing the heat dissipation pattern exposed by a hole opened on the printed circuit board into a spiral shape from the center of the hole. And
The heat dissipating bar is disposed so as to penetrate the hole and come into contact with the contact, and heat from the heat dissipating pattern of each of the plurality of printed circuit boards is thermally connected to the plurality of heat dissipating bars through the contact. It is comprised so that it may be comprised.
[0010]
The printed circuit board heat dissipation structure of the present invention is
The printed circuit board is a heat dissipation pattern composed of each of the multilayer printed patterns;
And a plurality of connecting portions each having a contact formed by dividing the heat radiation pattern.
[0011]
Furthermore, the printed circuit board heat dissipation structure of the present invention is characterized in that the heat dissipation rod is constituted by a heat pipe.
[0012]
In the printed circuit board heat dissipation structure of the present invention, the heat dissipation rod is made of a metal material.
[0013]
Furthermore, the printed circuit board heat dissipation structure of the present invention is characterized in that the heat dissipation rod is made of super graphite.
[0014]
Moreover, the printed circuit board heat dissipation structure of the present invention is characterized in that the heat dissipation rod is composed of a heat dissipation plate.
[0015]
Furthermore, the card type structure of the present invention is
A plurality of heat dissipating bars that conduct and dissipate heat;
A plurality of printed circuit boards having a plurality of connecting portions having a plurality of contacts each having a heat radiation pattern composed of a printed pattern that conducts heat, the heat radiation pattern being divided;
A housing for mounting each of the plurality of printed circuit boards in parallel;
Each of the plurality of heat dissipating bars is disposed through the connection portion so as to come into contact with contacts of the plurality of connection portions of the plurality of printed circuit boards mounted in parallel with the housing, and each of the plurality of printed circuit boards The heat from the heat radiation pattern is configured to be thermally connected to the plurality of heat radiation rods through the contact.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Next, a first embodiment of the present invention will be described in detail with reference to the drawings.
[0017]
1 is a configuration diagram of a card type structure according to the present invention, FIG. 2 is a perspective view of a printed circuit board heat dissipation structure according to the present invention, FIG. 2A is an overall perspective view, and FIG. FIG. 3 is a cross-sectional view of the printed circuit board heat dissipation structure, FIG. 4 is a detailed view of the connection section of the heat dissipation pattern of the printed circuit board, and FIG. 5 is a case where a plurality of printed circuit boards are mounted. It is sectional drawing of a printed circuit board heat dissipation structure.
[0018]
Referring to FIG. 1, a card type structure 50 according to the present invention includes a plurality of printed circuit boards 10 having a heat dissipation structure according to the present invention, a heat pipe 30, a heat dissipation rod or a heat dissipation plate, and a housing 40. Configured.
[0019]
The housing 40 is configured in a box shape with a material having good heat conduction, and includes a plurality of guides 43 inside the box, and the plurality of printed circuit boards 10 are mounted in parallel. The side plate 42 of the box of the housing 40 has a hole 41 that penetrates the heat pipe 30.
[0020]
The heat pipe 30 has a structure in which an evaporating liquid and its vapor are sealed in a sealed pipe, and is thermally connected to the plurality of printed circuit boards 10 to provide a heat dissipation path. The heat pipe 30 has a heat dissipating arm 31 extending in parallel with the side plate 42 so as to widely contact the side plate 42 of the box of the housing 40.
[0021]
The heat dissipating rod and the heat dissipating plate are made of a material having good thermal conductivity, for example, metal or super graphite, and, like the heat pipe 30, are thermally connected to the plurality of printed circuit boards 10 to provide a heat dissipating path. The heat radiating rod and the heat radiating plate have a heat radiating arm 31 extending in parallel with the side surface plate 42 so as to widely contact the side surface plate 42 of the box of the housing 40.
[0022]
As shown in FIGS. 2 and 3, the printed board 10 has a heat radiation pattern 11 that conducts heat from a circuit component that generates heat, that is, a heat generating component 16.
[0023]
The heat radiation pattern 11 is configured by a printed pattern of an electric conductor that constitutes the printed circuit board 10, for example, a metal foil (copper-clad pattern). And the thermal radiation pattern 11 has the connection part 12 for contacting with the heat pipe 30, or a thermal radiation rod or a thermal radiation board, and connecting thermally.
The heat radiation pattern 11 is preferably made of an elastic material and a material having good heat conduction.
[0024]
The connecting portion 12 is configured such that a hole 14 is opened in an insulating material constituting the printed circuit board 10, such as a glass epoxy material, to remove the insulating material, and the heat radiation pattern 11 is exposed. As shown in FIG. 4, the connection portion 12 has a plurality of exposed heat radiation patterns 11 so that a heat pipe 30, a heat radiating rod or a heat radiating plate is inserted into the center portion and can be thermally connected. It has the contactor 13 constituted by being divided. For example, the connection part 12-1 shown in FIG. 4A has four contact elements 13-1, in which the metal foil of the heat radiation pattern 11 is radially divided from the center part into four parts. The connection part 12-2 shown in FIG. 4 (b) has eight contacts 13-2 constituted by dividing the metal foil of the heat dissipation pattern 11 radially from the center part, and FIG. The connection portion 12-3 shown in FIG. 5 includes a contact 13-3 in which the metal foil of the heat radiation pattern 11 is divided into a spiral shape from the center portion. These contacts 13 are preferably reinforced by plating.
[0025]
As shown in FIG. 2 (a), the printed circuit board heat dissipation structure according to the present invention has a heat pipe 30, or a heat dissipation rod or a heat dissipation plate, substantially perpendicular to the board surface. Is inserted and penetrated, and the contact 13 of the connecting portion 12 is configured to come into contact with the heat pipe 30, the heat radiating bar, or the heat radiating plate. That is, as shown in the enlarged view of the connection part in FIG. 2B, the contact 13 of the connection part 12 is elastically deformed by inserting the heat pipe 30 into the connection part 12 of the heat radiation pattern 11, and this The contact 13 and the heat pipe 30 are in thermal contact with each other by the elastic force from the contact 13.
[0026]
Next, a method for assembling the card type structure 50 will be described.
[0027]
With reference to FIG. 1, first, a plurality of printed circuit boards 10 having contacts 13 on the heat dissipation pattern 11 are inserted into a plurality of guides of the housing 40 and mounted on the housing 40.
[0028]
Next, the heat pipe 30 is inserted through the hole 41 of the side plate 42 of the housing 40 and penetrates. At this time, the heat pipe 30 is inserted and penetrated until the heat radiating arm 31 of the heat pipe 30 contacts the side plate 42 of the housing 40.
[0029]
When the card-type structure 50 is assembled in this manner, as shown in FIG. 5, each of the plurality of printed circuit boards 10 on which the heat generating components 16 are mounted includes the heat pipe 30 and the contact 13 of the heat radiation pattern 11. It is thermally connected through. The heat pipe 30 is thermally connected to the side plate 42 of the housing 40 via the heat radiating arm 31.
[0030]
Next, a method for inserting and removing the printed circuit board 10 for maintenance and replacement will be described.
[0031]
With reference to FIG. 1, first, the heat pipe 30 is pulled out from the housing 40.
[0032]
Next, the printed circuit board 10 to be maintained is pulled out.
[0033]
Next, the maintenance-completed printed board 10 or an alternative printed board 10 is inserted, and the heat pipe 30 is inserted into the housing 40.
[0034]
Next, the operation will be described in detail with reference to the drawings.
[0035]
First, how heat is conducted is explained.
[0036]
FIG. 3 shows a heat dissipation path on the cross section of the printed circuit board heat dissipation structure.
[0037]
With reference to FIG. 3, the heat from the heat generating component 16 flows to the printed circuit board 10, then conducts the heat radiation pattern 11 in the printed circuit board 10, and then a plurality of parts constituting the connection portion 12 of the heat radiation pattern 11. The heat flows to the contact 13, is transmitted from the contact 13 to the heat pipe 30, the heat radiating rod or the heat radiating plate, is conducted through the heat pipe 30, the heat radiating rod or the heat radiating plate, and is further transmitted to the heat radiating arm 31. To the side plate 42. Then, heat is radiated from the side plate 42 to the outside.
[0038]
Therefore, heat can be radiated efficiently.
[0039]
Next, an error absorbing operation when the heat pipe 30 changes from the correct position due to a relative error or vibration of dimensions between the printed circuit board 10, the housing 40, and the heat pipe 30 will be described. FIG. 6 is a diagram for explaining absorption of relative error and displacement.
[0040]
If the heat pipe 30 is not inserted into the central portion of the connection portion 12 of the heat radiation pattern 11 due to the relative error in dimensions among the printed circuit board 10, the housing 40, and the heat pipe 30, the contact 13 of the heat radiation pattern 11 is elastically deformed. This operation is performed to absorb this error and maintain the thermal connection with the heat pipe 30.
[0041]
Further, even when the heat pipe 30 is displaced from the center portion of the connection portion 12 of the heat radiation pattern 11 due to vibration, the contact 13 of the heat radiation pattern 11 is elastically deformed, and this displacement is absorbed to be in contact with the heat pipe 30. Operates to maintain a thermal connection.
[0042]
Therefore, it is possible to absorb a relative error due to mounting and a displacement due to vibration from the outside, and to secure a good thermal connection.
[0043]
Next, a second embodiment of the present invention will be described.
[0044]
FIG. 7 is a cross-sectional view of the printed circuit board heat dissipation structure according to the second embodiment.
[0045]
Referring to FIG. 7, the printed circuit board heat dissipation structure according to the second embodiment includes a printed circuit board 20 and a heat pipe 30, or a heat dissipation rod or a heat dissipation plate.
[0046]
The heat pipe 30, or the heat radiating rod or the heat radiating plate is the same as that used in the printed circuit board heat radiating structure according to the first embodiment, and is given the same reference numeral.
[0047]
Unlike the first embodiment, the printed circuit board 20 includes a plurality of heat radiation patterns 21-1, 21-2, to 21-N. The plurality of heat radiation patterns 21-1, 21-2,..., 21-N are composed of an electrical conductor that constitutes a printed pattern of each layer of the multilayer printed board, for example, a metal foil (copper-clad pattern).
[0048]
Each of the plurality of heat radiation patterns 21-1, 21-2,..., 21-N comes into contact with the heat pipe 30 and is connected to the connection portions 22-1, 22-2,. Each of N. The connecting portions 22-1, 22-2,..., 22-N open holes in the insulating material constituting the printed circuit board 20 to remove the insulating material, and the heat radiation patterns 21-1, 21-2,. Each of N is configured to be exposed.
[0049]
And as for each of connection part 22-1, 22-2, ..., 22-N, heat pipe 30 or a heat sink or a heat sink is inserted in the center part similarly to 1st Embodiment, and heat is added. Each of the heat radiation patterns 21-1, 21-2,..., 21-N is divided into contacts 23-1, 23-2,. Configured. As in the first embodiment, these contacts 23-1, 23-2,..., 23-N are, as shown in FIG. 4, radiating patterns 21-1, 21-2,. Each of N is divided into four parts, eight parts, or a spiral.
[0050]
In the printed circuit board heat dissipation structure according to the second embodiment, such a printed circuit board 20 is inserted into the housing 40 shown in the first embodiment, and the heat pipe 30, or the heat radiating plate or the heat radiating rod is installed in the housing. 40, the contacts 23-1, 23-2,..., 23-N of the heat radiation patterns 21-1, 21-2,. The heat pipe 30 or the heat radiating plate or the heat radiating rod is deformed and contacted by an elastic force to be thermally connected.
[0051]
The heat from the heat generating component 16 flows to the printed circuit board 20, and then conducts each of the heat radiation patterns 21-1, 21-2 to 21-N in the printed circuit board 20, and then the heat radiation pattern 21-. 1, 21-2 to 21-N contacts 23-1, 23-2 to 23-N, and these contacts 23-1, 23-2 to 23-N The heat pipe 30 or the heat radiating plate or the heat radiating rod is transmitted from each to the heat pipe 30 or the heat radiating plate or the heat radiating rod, and further transmitted to the heat radiating arm 31 to reach the side plate 42 from the heat radiating arm 31. Then, heat is radiated from the side plate 42 to the outside.
[0052]
More heat is radiated by the plurality of heat radiation patterns 21-1, 21-2 to 21-N.
[0053]
Although the embodiment described above includes one connection part on the printed circuit board and has one heat pipe, a heat radiating plate, or a heat radiating rod that is thermally connected to the connection part, it is not limited thereto. It is natural that the printed circuit board heat radiation structure according to the present invention can be configured by including a plurality of connection portions on the printed circuit board and having a plurality of heat pipes, heat radiation plates, or heat radiation rods that are thermally connected to these connection portions.
[0054]
Although the embodiment described above is configured to include the connection portion on the printed board, the present invention is not limited to this, and the present invention can also be applied to a ceramic substrate or an alumina substrate that is a substrate on which a heat generating component can be mounted instead of the printed board. Applicable.
[0055]
【The invention's effect】
As described above, the present invention is configured to be thermally connected to the heat pipe by the elastic contact provided on the printed circuit board, so that heat radiation of the printed circuit board can be achieved efficiently and easily. There is an effect of doing.
[Brief description of the drawings]
FIG. 1 is a block diagram of a card type structure according to the present invention.
FIG. 2 is a perspective view of a printed circuit board heat dissipation structure according to the present invention.
FIG. 3 is a cross-sectional view of a printed circuit board heat dissipation structure.
FIG. 4 is a detailed view of a connecting portion of a heat dissipation pattern of a printed board.
FIG. 5 is a cross-sectional view of a printed circuit board heat dissipation structure when a plurality of printed circuit boards are mounted.
FIG. 6 is a diagram for explaining absorption of relative error and displacement.
FIG. 7 is a cross-sectional view of a printed circuit board heat dissipation structure according to a second embodiment.
[Fig. 8] Conventional card type structure [Fig. 9] Conventional printed circuit board heat dissipation structure [Fig. 10] Conventional printed circuit board heat dissipation structure [Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Printed circuit board 11 Heat radiation pattern 12 Connection part 13 Contact 20 Printed circuit board 30 Heat pipe 40 Case 50 Card type structure

Claims (9)

A plurality of heat dissipating bars that conduct and dissipate heat;
A heat dissipating pattern composed of a print pattern that conducts heat, and a plurality of printed circuit boards having a plurality of connecting portions composed of contacts formed by dividing the heat dissipating pattern, and
Each of the plurality of heat dissipating bars is disposed so as to come into contact with a contact of a plurality of connection portions of the plurality of printed circuit boards, and heat from each of the heat radiation patterns of the plurality of printed circuit boards is passed through the contact of the plurality of connection portions. A printed circuit board heat dissipation structure configured to be thermally connected to the plurality of heat dissipation rods. The connecting portion has a plurality of contacts configured by radially dividing the heat dissipation pattern exposed by a hole opened on the printed circuit board from a central portion of the hole,
The heat radiating bar is disposed so as to pass through the hole and come into contact with the plurality of contacts, and heat from each heat radiation pattern of the plurality of printed circuit boards is thermally connected to the plurality of heat radiating bars through the plurality of contacts. The printed circuit board heat dissipation structure according to claim 1, wherein the printed circuit board heat dissipation structure is configured as described above. The connection portion has a contact configured by dividing the heat radiation pattern exposed by a hole opened on the printed circuit board in a spiral shape from a central portion of the hole,
The heat dissipating bar is disposed so as to penetrate the hole and come into contact with the contact, and heat from the heat dissipating pattern of each of the plurality of printed circuit boards is thermally connected to the plurality of heat dissipating bars through the contact. The printed circuit board heat dissipation structure according to claim 1, wherein the printed circuit board heat dissipation structure is configured as described above. The printed circuit board is
A heat dissipation pattern consisting of each of the multilayer printed patterns;
A plurality of connecting portions including contacts formed by dividing the heat dissipation pattern;
The printed circuit board heat dissipation structure according to any one of claims 1, 2, and 3, wherein 4. The printed circuit board heat dissipation structure according to claim 1, wherein the heat dissipating rod is formed of a heat pipe. 5. 4. The printed circuit board heat dissipation structure according to claim 1, wherein the heat dissipation rod is made of a metal material. 5. 4. The printed circuit board heat dissipation structure according to claim 1, wherein the heat dissipation rod is made of super graphite. 5. 4. The printed circuit board heat dissipation structure according to claim 1, wherein the heat dissipation rod is formed of a heat dissipation plate. 5. A plurality of heat dissipating bars that conduct and dissipate heat;
A plurality of printed circuit boards having a plurality of connecting portions having a plurality of contacts each having a heat radiation pattern composed of a printed pattern that conducts heat, the heat radiation pattern being divided;
A housing for mounting each of the plurality of printed circuit boards in parallel;
Each of the plurality of heat dissipating bars is disposed through the connection portion so as to come into contact with contacts of the plurality of connection portions of the plurality of printed circuit boards mounted in parallel with the housing, and each of the plurality of printed circuit boards A card type structure, wherein heat from the heat radiation pattern is configured to be thermally connected to the plurality of heat radiation rods through the contact.

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