JP3778583B2 - Electronic component suction nozzle and electronic component automatic mounting device - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to an electronic component comprising an adsorbing member that adsorbs an electronic component by vacuum suction from a suction hole, and a main body portion that holds the adsorbing member and communicates with the suction hole and communicates with a vacuum source. The present invention relates to an automatic mounting apparatus for electronic parts that sucks and mounts electronic components on a printed circuit board by suction nozzles and suction nozzles.
[0002]
[Prior art]
This kind of electronic component suction nozzle and electronic component automatic mounting apparatus is disclosed in Japanese Patent Application Laid-Open No. 2-113600, and the suction nozzle for sucking the electronic component is attached to the suction shaft which is the main body portion and detachably attached to the suction shaft. A suction tool, which is a member, is attached so that electronic components can be sucked. The structure in which the suction tool is attached to the suction shaft is a structure in which a pair of elastic locking tools sandwiching the suction tool from both sides is fixed to the outside of the suction shaft with screws and the suction tool is sandwiched and connected by the free end of the lower end. It has become.
[0003]
[Problems to be solved by the invention]
In the recent component mounting field, the types of electronic components to be mounted on a printed circuit board have increased in size, shape, etc., and there are many types of suction nozzles for sucking such various types of components. In order to increase the operating rate of the apparatus, it is important to make it possible to replace the nozzles in a short time according to the parts. For this reason, various methods for replacing the suction nozzle have been proposed, and the conventional technique is one of them.
[0004]
However, in the prior art, an elastic locking device is provided on the outer side of the main body, so when trying to recognize an electronic component adsorbed on the nozzle, such a component is recognized using a camera from below the nozzle. If there is a part protruding outside the nozzle to capture the image of the part, this image is also captured, and there is a drawback that the position of the part cannot be accurately recognized especially in the case of a small part.
[0005]
Accordingly, an object of the present invention is to make it possible to use nozzles corresponding to various types of parts by reducing the outer diameter of the suction nozzle as much as possible.
[0006]
[Means for Solving the Problems]
For this reason, the present invention comprises an adsorption member that adsorbs an electronic component by vacuum suction from the suction hole, and a main body portion that holds the suction member and communicates with the suction hole and has a hollow portion that communicates with a vacuum source. In the suction nozzle of the electronic component, an elastic connection member for detachably connecting the suction member and the main body portion in the hollow portion is formed in the suction member, and the suction member connection member is formed in the hollow portion. A connecting member to be engaged is formed.
[0008]
Further, the present invention provides an adsorption member comprising an adsorption member that adsorbs an electronic component by vacuum suction from the suction hole, and a main body portion that holds the adsorption member and communicates with the suction hole and that communicates with a vacuum source. In an electronic component automatic mounting apparatus that holds an electronic component by a nozzle and mounts the electronic component on a printed circuit board, an elastic connection member is formed in the suction member so that the suction member and the main body can be detachably connected in the hollow portion. And it has a suction nozzle which formed the connection member engaged with the connection member of the said suction member in the said hollow part .
[0009]
[Action]
According to the configuration of the first aspect, the adsorbing member is hollow inside the main body due to the engagement between the elastic connecting member formed on the adsorbing member with respect to the main body and the connecting member formed in the hollow of the main body. It is elastically detachably connected in the part.
[0010]
According to the configuration of the second aspect, the suction member is hollow inside the main body due to the engagement between the elastic connection member formed on the suction member with respect to the main body and the connection member formed in the hollow of the main body. An electronic component is sucked and attached to a printed circuit board by a suction nozzle that is elastically detachably connected in the unit, and when the type of the electronic component changes and the nozzle needs to be changed, the suction member is replaced.
[0011]
【Example】
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
2 and 3, reference numeral 1 denotes a Y table that moves in the Y direction by the rotation of the Y-axis motor 2. Reference numeral 3 denotes a movement in the X direction on the Y table 1 by the rotation of the X-axis motor 4. As a result, the printed circuit board 6 on which the chip-like electronic component 5 (hereinafter referred to as a chip component or a component) is mounted is fixed and mounted on a fixing means (not shown).
[0012]
Reference numeral 7 denotes a supply table, on which a number of component supply devices 8 for supplying chip components 5 are arranged. Reference numeral 9 denotes a supply stand driving motor. When the ball screw 10 is rotated, the supply stand 7 is guided by the linear guide 12 via the nut 11 fitted and fixed to the supply stand 7. Move in the direction. Reference numeral 13 denotes an intermittently rotating rotary table, and mounting heads 15 having a plurality of suction nozzles 14 as take-out nozzles are arranged at equal intervals according to the intermittent pitch on the outer edge of the table 13.
[0013]
I is a suction station that is a stop position of the mounting head 15 where the suction nozzle 14 picks up and picks up the component 5 from the supply device 8 by intermittent rotation of the rotary table 13, and the suction nozzle 14 picks up the component 5 at the suction station I. To do.
Reference numeral 16 denotes a component recognition device that recognizes the position shift of the component 5 attracted by the suction nozzle 14 by imaging the lower surface of the component 5 with a camera in a predetermined visual field range and recognizing the imaged screen. Is provided.
[0014]
The position where the mounting head 15 next to the recognition station II stops is the angle correction station III, and the angle amount for correcting the angular position deviation of the chip component 5 based on the recognition result of the recognition device 16 is set to predetermined mounting data (not shown). The head rotating device 17 rotates the mounting head 15 in the θ direction by an angle amount added to the indicated angle amount. The θ direction is a direction that rotates around the axis of the nozzle 14.
[0015]
The next stop position next to the angle correction station III is the mounting station IV, and the component 5 to be sucked by the suction nozzle 14 of the station IV is mounted on the substrate 6 by the lowering of the mounting head 15.
Reference numeral 20 denotes an elevating bar that moves up and down, and is engaged with a swing lever 21 of the component supply device 8 to swing, and a component storage tape (not shown) enclosing the chip component 5 at a predetermined interval is intermittently fed in accordance with the interval. The chip component 5 is supplied to the component suction position of the suction nozzle 14. Reference numeral 22 denotes a tape reel on which the component storage tape (not shown) is wound.
[0016]
Next, the structure of the mounting head 15 will be described with reference to FIG.
Reference numeral 24 denotes a holding body that holds the mounting head 15 so as to be rotatable in the θ direction, and is attached to a lower end of a guide shaft 25 penetrating the rotary table 13 so as to be movable up and down. It moves up and down by the vertical movement of the guide shaft 25 at the suction station I or the like. A vacuum tube 26 for vacuum suction communicates with a vacuum source (not shown) through a vacuum passage 27 that passes through the rotary table 13. A plurality of suction nozzles 14 are attached to the mounting head 15 so as to be movable up and down. The nozzle 14 is provided with an engaging body 28 at the upper end thereof, and a lever 30 that swings in the axial direction of the head 15 about the support shaft 29 engages with the lower end of the engaging body 28 as shown in FIG. Is stored in the raised storage position. In this position, the nozzle 14 is cut off from the vacuum tube 26 so that the vacuum does not leak.
[0017]
When the upper end of the lever 30 is pushed by a release member (not shown) and swings outward, the lever 30 is lowered by the biasing of the compression spring 31 to the engaging body 28 and protrudes below the head 15. The nozzle 14 selected by rotating the mounting head 15 by the head rotating device 17 is in the use position lowered in this way, and the component 5 is received from the component supply device 8 by the nozzle 14. It is taken out by vacuum suction through the vacuum tube 26. At the position where the nozzle 14 is lowered, the nozzle 14 communicates with the vacuum tube 26 and is vacuumed.
[0018]
The spring 31 is mounted on the substrate 6 so that a certain pressure is applied to the component 5 when the component 5 sucked by the suction nozzle 14 by the lowering of the mounting head 15 is mounted on the printed circuit board 6 at the mounting station IV. The head 15 is further lowered even after contact with the head, but at that time, the head 15 is compressed and absorbs the extra downward stroke and applies pressure to the component 5. The weight of the suction nozzle 14 as well as the pressure of the spring 31 is applied to the component 5 as a pressing force. Therefore, in the case of the small component 5, in order not to make the pressing force against the component 5 too strong, it is preferable that not only the spring pressure but also the weight of the suction nozzle 14 as a whole is light.
[0019]
A diffusion plate 32 is attached to the lower surface of the mounting head 15. When light is irradiated from a light source (not shown) obliquely from below in the recognition station II, the light is diffused and applied to the component 5 sucked by the suction nozzle 14. The transmitted light is picked up by the camera of the recognition device 16 and the transmitted images of the component 5 and the suction nozzle 14 are picked up. Since the nozzle 14 penetrates the diffusion plate 32, the diffusion plate 32 has an opening 36 (see FIG. 5) in a range where the nozzle 14 does not contact even if the nozzle 14 moves up and down.
[0020]
Next, a more detailed structure of the suction nozzle 14 will be described with reference to FIGS.
As shown in FIGS. 1 and 5, the suction nozzle 14 includes a suction tip 34 as a suction member that directly sucks and sucks the component 5, and a nozzle shaft 35 as a main body to which the tip 34 is connected. Yes. In FIG. 3 and FIG. 4, the nozzle 14 is drawn with the separated structure omitted for easy understanding. A suction hole 37 for sucking the component 5 passes through the suction tip 34 and communicates with a hollow portion 38 that is open in the axial direction inside the nozzle shaft 35 in a connected state as shown in FIG. The hollow portion 38 can communicate with a vacuum passage (not shown) extending from the tube 26 into the holding body 24.
[0021]
From the inner wall 39 of the nozzle shaft portion 35, an engagement pin 40 as a cylindrical connecting member is projected and stretched substantially horizontally across the hollow portion 38, and the suction tip tool 34 has a suction hole. 37 are formed by extending two pairs of connecting members and engaging plates 41 as insertion members in the axial direction from a position surrounding the opening portion on the side opposite to the component suction side of 37, and a pair of opposing members. The engagement plate 41 has a spring property so as to open and close elastically in the opposing direction. The engagement plate 41 has a dimension in the radial direction that can be inserted into the hollow portion 38 of the nozzle shaft portion 35, and the taper surface 45 formed above the engagement plate 41 after being inserted is pressed against the pin 40. The upper surface that forms the recess 44 of the engagement plate 41 at the position of FIG. 5 where the lower end surface 42 of the nozzle shaft portion 35 is expanded and further inserted and abuts against the regulating surface 43 of the suction tip 34 is above the pin 40. It closes in a state engaged with the surface, and holds and connects the suction tip 34 so as not to fall. The root portions of the pair of opposing engagement plates 41 are circularly cut to alleviate the stress concentration on the root portions when the engagement plate 41 is expanded by the pins 40 and deformed. The two pairs of engagement plates 41 are formed by forming a cylindrical portion around the suction hole 37 concentrically with the axis of the suction tip 34 and then cutting the cylindrical portion by electric discharge machining. Cuts 46 are made on both sides to make a pair. The thickness of the cylindrical portion, that is, the engagement plate 41 is as thin as about 0.2 mm, and the diameter is as small as about 3 mm, so that it is very difficult to perform cutting. The reason why the notches 45 are inserted into the two pairs of engagement plates 41 is to increase the degree of freedom in the deformation direction of the engagement plates 41 and to increase the effective cross-sectional area of the air duct inside the tube of the nozzle 14. Therefore, it is possible to connect the suction tip 34 and the nozzle shaft portion 35 detachably by being elastically deformed by the engagement with the pin 40 even if a pair of engagement plates is formed without the notch 45. Further, the engagement plate 41 is engaged at two locations of the pin 40, so that the rotation of the suction tip tool 34 in the θ direction to the nozzle shaft portion 35 is restricted.
[0022]
The material of the suction tip 34 and the nozzle shaft 35 is obtained by quenching and tempering an iron-based material. The nozzle shaft 35 has wear resistance, and the suction tip 34 has wear resistance and an engagement plate. 41 is secured.
It should be noted that the pin 40 does not span a single pin, but may protrude from the inner wall 39 by a length that allows the engagement plate 41 to be engaged, thereby increasing the effective cross-sectional area of the air duct described above. Can do.
[0023]
The operation will be described below with the above configuration.
When the operator operates an operation panel (not shown), an automatic mounting operation of the chip component 5 is performed.
That is, at the suction station I, the nozzle 14 that matches the component type supplied by the desired component supply device 8 is projected from the mounting head 15 to the use position and positioned at a predetermined rotational angle position of the mounting head 15. The component 5 is adsorbed.
[0024]
In this case, the suction hole 37 of the suction tip 34 communicates with the hollow portion 38 of the nozzle shaft portion 35, further communicates with the vacuum tube 26, communicates with a vacuum source (not shown) via the vacuum passage 27, and vacuum suction is performed. Has been made. Further, the suction tip 34 is connected to the nozzle shaft portion 35 by engaging the recess 44 of the engagement plate 41 with the engagement pin 40 and is held so as not to fall. Various suction tips 34 of the plurality of suction nozzles 14 in the head 15 are attached to various parts 5.
[0025]
The head 15 holding the component 5 is stopped at each station by intermittent rotation of the rotary table 13 and a predetermined work is performed. In the recognition station II, a transmission image of the component 5 is transmitted by the component recognition device 16. Are recognized and processed, and a positional deviation and an angular positional deviation with respect to the nozzle 14 are recognized. In this case, there is no protrusion on the outer periphery of the nozzle 14 and the outer diameter thereof is smaller than that of the component 5, so that an image of an extra object other than the component 5 is not captured and accurate recognition processing is performed.
[0026]
Next, the head 15 is rotated in the θ direction by the head rotating device 17 at the angle correction station III, and the angle is swung so that the angle position specified by the mounting data (not shown) is corrected by the recognition result. .
Next, in the mounting station IV, the component 5 is brought into contact with the printed circuit board 6 by the lowering of the mounting head 15 and the head 15 is lowered after the contact so as to obtain an appropriate pressing force. At this time, since the diameter of the nozzle 14 is inside the nozzle 14 and the engaging plate 41 is elastically engaged with the engaging pin 40, a member that elastically engages the outside of the nozzle 14 is provided. Since the nozzle 14 as a whole has a smaller diameter and can be made lighter than the case where it is mounted, even if the component 5 is small, the impact applied during mounting can be reduced, and the component 5 can be prevented from being damaged and mounted. Further, even when the suction tip 34 is subjected to a force that rotates in the θ direction with respect to the nozzle shaft portion 35 due to an impact at the time of mounting, the pair of engagement plates 41 are engaged at the two positions of the pin 40, so θ It is restricted so as not to rotate in the direction, so that no rotational deviation occurs. It is assumed that the nozzle shaft 35 itself is prevented from rotating in the θ direction with respect to the mounting head 15.
[0027]
In this manner, the components 5 are mounted on the printed circuit board 6 by the respective heads 15, but the component mounting on the board 6 of a predetermined quantity is completed, and then the components are mounted on the different types of boards 6. Suppose that
When the electronic component automatic mounting apparatus stops the automatic operation once, and the component 5 to be mounted on the next board includes a component 5 that cannot be sucked by the suction nozzle 14 attached to the current head 15, The suction tip 34 needs to be replaced.
[0028]
Therefore, the operator performs an exchange operation of the suction tip 34 for the nozzle 14 to which the suction tip 34 that is not necessary for each head 15 is attached.
That is, the suction tip 34 of the nozzle 14 to be worked is pulled by hand, but the pin 40 comes into contact with the surface of the pair of opposing engagement plates 41 where the recess 44 is formed, and the engagement plate 41 is expanded while the engagement plate 41 is being expanded. 41, that is, when the suction tip 34 moves away from the nozzle shaft 35 and the pin 40 reaches the tapered surface 45 above the recess 44, the engagement plate 41 is closed and the suction tip 34 is connected to the nozzle shaft 35. Comes off.
[0029]
Thus, the suction tip 34 is removed, and then a new suction tip 34 is attached to the nozzle shaft portion 35. This attachment operation may be performed simply by inserting the engagement plate 41 into the hollow portion 38, and when the tapered surface 45 of the pair of engagement plates 41 comes into contact with the engagement pin 40 and is further pushed, After being pushed and spread to the maximum, it is further pushed back to return due to the spring property, and the pin 40 fits into the recess 44 and the suction tip 34 is connected to the nozzle shaft portion 35 to release the hand. Even so, it won't fall.
[0030]
When the setup change is thus completed, the component 5 is mounted on the new board 6 in the same manner as described above.
In this embodiment, the nozzle 14 does not rotate in the θ direction with respect to the head 15, but the angular position of the component 5 is determined by the rotation of the nozzle 14 in the θ direction with respect to the head 15. If the holding mechanism for detachably holding the tip corresponding to the suction tip 34 is provided outside the nozzle 14, the following problems arise. That is, when the nozzle 14 is raised to the storage position, if it is raised without knowing which θ direction it is facing, the opening 36 must have a larger diameter than the maximum projecting diameter. The opening is likely to appear as an image at the time of recognition, which is disadvantageous for the recognition of the small component 5, and if it must be stored in which direction, the nozzle 14 is selected and stored after installation and a different nozzle protrudes If a structure for rotating the nozzle 14 to a predetermined position is required in advance, and the nozzle 14 is structured not to be raised from the position where the protruding holding mechanism is protruding, the nozzle 14 needs to be unnecessarily long. Cannot be removed and the machine becomes large or the suction force becomes small. The Chakusentan tool 34 can these problems is not by a structure for connecting the nozzle shaft 35.
[0031]
In this embodiment, the recognition of the component 5 has been described for the case where the transmission image is recognized. However, the position of the component 5 is recognized by the reflected light from the lead portion when light is directly applied to the component 5 from below. However, if a mechanism for holding the suction tip 34 is provided outside, the light reflected by the protruding holding mechanism enters the camera and cannot be accurately recognized, so that it is elastic inside the nozzle 14 as in this embodiment. It is desirable to provide a mechanism for holding the
[0032]
【The invention's effect】
As described above, according to the present invention, when replacing the suction member according to the part type, the suction member can be detached simply by pulling it, and the other suction members can be connected by being pushed in. Since the suction member that sucks the component inside the suction nozzle is connected to the main body, no extra protrusion or the like can be formed outside the nozzle, so that the outer diameter of the nozzle can be reduced, which is advantageous for component recognition.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a suction tip and a nozzle shaft portion of a suction nozzle to which the present invention is applied.
FIG. 2 is a plan view of an electronic component automatic mounting apparatus to which the present invention is applied.
FIG. 3 is a side view of an electronic component automatic mounting apparatus to which the present invention is applied.
FIG. 4 is a side view showing the mounting head.
FIG. 5 is a side sectional view showing a suction nozzle.
[Explanation of symbols]
5 Chip-shaped electronic component 6 Printed circuit board 14 Suction nozzle 34 Suction tip (suction member)
35 Nozzle shaft (main part)
37 Suction hole 38 Hollow part 40 Engagement pin (connection member)
41 Engagement plate (connection member) (insertion member)

Claims (2)

An electronic component suction nozzle comprising: a suction member that sucks an electronic component by vacuum suction from a suction hole; and a main body portion that holds the suction member and communicates with the suction hole and that communicates with a vacuum source. An elastic connecting member for removably connecting the suction member and the main body in the hollow portion is formed in the suction portion, and a connecting member for engaging with the connecting member of the suction member is formed in the hollow portion. A suction nozzle for electronic parts, characterized in that it is formed. An electronic component is picked up by a suction nozzle comprising a suction member that sucks an electronic component by vacuum suction from the suction hole, and a main body portion that holds the suction member and communicates with the suction hole and communicates with a vacuum source. In an electronic component automatic mounting apparatus that holds and mounts on a printed circuit board, an elastic connection member that is detachably connected in the hollow portion is formed in the suction member and the hollow portion is formed in the hollow portion. An electronic component automatic mounting apparatus comprising: a suction nozzle having a connection member that engages with the connection member of the suction member .

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