JP3780104B2 - Coating apparatus and coating method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coating apparatus and a coating method for coating a resist on a glass substrate used, for example, in a liquid crystal display (LCD).
[0002]
[Prior art]
In the LCD manufacturing process, the same photolithography technique as that used for manufacturing semiconductor devices is used to form an ITO (Indium Tin Oxide) thin film or electrode pattern on a glass substrate for LCD. In the photolithography technique, a photoresist is applied to a substrate, exposed, and further developed.
[0003]
In general, in the resist coating process, a rotating cup type coating apparatus that rotates a cup together with a glass substrate is used.
FIG. 22 is a front view showing an example of a conventional rotating cup type coating apparatus, and FIG. 23 is a plan view thereof.
As shown in these drawings, a spin chuck 103 for holding the glass substrate G by vacuum suction is disposed in a cup 102 having a circular opening 101 for carrying the glass substrate G in and out. 102 and the spin chuck 103 rotate in synchronization.
[0004]
In this rotary cup type coating apparatus, first, the upper lid 104 is lifted upward by a lifting mechanism (not shown), and the glass substrate G is positioned above the opening 101 by a main arm (not shown) of the substrate transport mechanism. Transfer onto the chuck 103. Next, after the glass substrate G is vacuum-sucked and held on the spin chuck 103, the spin chuck 103 is lowered by an elevating mechanism (not shown) and the glass substrate G is accommodated in the cup 102 through the circular opening 101. To do. Then, the nozzle 105 is positioned above the glass substrate G, and a resist solution is dropped from the nozzle 105 onto the upper surface of the glass substrate G.
[0005]
  Thereafter, the nozzle 105 is retracted, and the upper cover 104 is covered with the cup 102 by the elevating mechanism to close the opening 101, thereby making the inside of the cup 102 an airtight processing space 106. In this state, the cup 102, the spin chuck 103, the glass substrate G, and the upper lid104And a resist coating film is formed on the upper surface of the glass substrate G by centrifugal force.
[0006]
[Problems to be solved by the invention]
However, in such a rotary cup type coating apparatus, since the resist solution is dropped from the nozzle 105 onto the stopped glass substrate G, the amount of the resist solution used may increase.
[0007]
Therefore, it has been conventionally performed that the resist solution is dropped on the glass substrate G while rotating the glass substrate G, but the resist solution dropped on the glass substrate G is scattered by centrifugal force, and mist is removed outside the cup 102. There is a problem of generating. In particular, in the case of a rectangular shape such as a glass substrate for LCD, since the four corners have strong centrifugal force, a large amount of resist solution scatters from the four corners, and these are outside the cup 102 through the opening 101. There is a problem of jumping out.
[0008]
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a coating apparatus and a coating method capable of uniformly coating a processing liquid on a substrate while preventing generation of mist. It is said.
[0009]
[Means for Solving the Problems]
  In order to solve such a problem, the coating apparatus of the present invention according to claim 1 is a coating apparatus for coating a coating liquid on a rectangular substrate, and is held rotatably and has a rectangular shape slightly larger than the substrate. A container having an opening at an upper portion thereof, and a substrate is rotatably held in the container, and the substrate is carried from the container through the opening.OutHolding member to be inserted, means for rotating the holding member until at least four corners of the substrate carried into the container are hidden from the opening, means for rotating the container together with the holding member, and the rotating container And a means for dropping the coating liquid onto the substrate held by the holding member.
[0010]
The coating apparatus of the present invention according to claim 2 is the coating apparatus according to claim 1, wherein the means for rotating the holding member rotates the holding member by approximately 90 °.
[0011]
  A coating apparatus according to a third aspect of the present invention is a coating apparatus for coating a coating liquid on a rectangular substrate, which is rotatably held, and has a rectangular opening slightly larger than the substrate. And a holding member for holding the substrate in the container and carrying the substrate in and out of the container through the opening,Provided in the vicinity of the four corners of the opening, respectively, when applying the coating liquid to the substrateFour corners of the substrate carried into the container through the openingonlyCover from the openingA movable member for releasing the covering of the four corners of the opening when the substrate is carried in and out through the opening;Means for rotating the container together with the holding member, and means for dropping the coating liquid onto the substrate held by the holding member in the rotating container.
[0012]
A coating apparatus according to a fourth aspect of the present invention is the coating apparatus according to any one of the first to third aspects, wherein the coating liquid is a resist liquid and is held by the holding member. Means for dropping the thinner through the opening is provided.
[0013]
A coating apparatus according to a fifth aspect of the present invention is the coating apparatus according to any one of the first to fourth aspects, wherein the container is covered with the holding member by covering the opening of the container. And means for rotating together.
[0014]
A coating apparatus according to a sixth aspect of the present invention is the coating apparatus according to any one of the first to fifth aspects, further comprising means for cleaning the inside of the container.
[0015]
The coating method of the present invention according to claim 7 is a coating method in which a coating solution is applied onto a rectangular substrate, and the opening of the container having a rectangular opening slightly larger than the substrate provided above. A step of carrying the substrate through the container, a step of turning the substrate until at least four corners of the substrate are hidden from the opening, and after turning the substrate, after carrying the substrate into the container, And a step of dropping the coating liquid onto the substrate through the opening while rotating the container together with the substrate.
[0016]
  The coating method of the present invention according to claim 8 is a coating method in which a coating solution is applied onto a rectangular substrate, and the opening of the container having a rectangular opening slightly larger than the substrate provided above. A step of carrying the substrate into the container via the step, and after carrying the substrate into the container,Drive the movable members provided near the four corners of the opening.A step of covering the opening until at least four corners of the substrate are hidden from the opening; and a step of dropping the coating liquid onto the substrate through the opening while rotating the container together with the substrate after covering the opening; It comprises.
[0017]
  The coating method of the present invention according to claim 9 is the coating method according to claim 7 or 8, wherein the coating solution is a resist solution, and the resist solution is dropped on the substrate before being dropped onto the substrate. The method comprises a step of dripping thinner through the opening.
  A coating apparatus according to a tenth aspect of the present invention is the coating apparatus according to any one of the first to third aspects, wherein the substrate is held by the holding member via the opening. Means for dropping a thinner; a lid that covers the opening and rotates together with the container with the opening closed; the coating solution is a resist solution; the resist solution is dropped and the thinner is added The means for dripping is a double-structured tube composed of an inner tube and an outer tube, and the tube is provided in the center of the lid via a bearing.
The coating apparatus of the present invention according to claim 11 is the coating apparatus according to claim 10, wherein the resist solution is supplied from the inner tube and the thinner is supplied from the outer tube to the substrate. It is a feature.
[0018]
In the present invention according to claims 1 and 7, the shape of the opening of the container is a rectangle slightly larger than the substrate, and the substrate is rotated until the four corners of the substrate carried into the container are hidden from the opening. The coating liquid is dropped onto the substrate through the opening while rotating the container together with the substrate in the state. Therefore, the processing liquid can be uniformly applied onto the substrate, and the processing liquid scattered from the four corners of the substrate hits the upper wall surface in the container, so that the scattered processing liquid jumps out of the container through the opening. This prevents the occurrence of mist.
[0019]
In the present invention according to claim 2, since the four corners of the substrate are farthest from the opening, the generation of mist can be more effectively prevented.
[0020]
In the present invention according to claims 3 and 8, the four corners of the substrate carried into the container are covered from the opening, and in this state, while rotating the container together with the holding member, the coating liquid is applied onto the substrate through the opening. It is dripping. Accordingly, the processing liquid can be uniformly applied onto the substrate, and the processing liquid scattered from the four corners of the substrate hits the covered portion as described above, so that the scattered processing liquid is exposed to the outside of the container through the opening. The mist is prevented from being generated.
[0021]
In the present invention according to claims 4 and 9, since thinner can be applied onto the substrate before applying the resist solution, the amount of resist applied to the substrate can be reduced.
[0022]
In the present invention according to claim 5, since the container is rotated with the holding member by covering the opening of the container, the turbulence of the air current in the container can be suppressed, and the film thickness uniformity of the resist can be reduced. Can be secured.
[0023]
In the present invention according to claim 6, since the inside of the container is cleaned, the resist solution scattered and attached to the inner wall of the container does not drop on the substrate and adversely affect the substrate.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, embodiments of the present invention will be described with reference to the drawings.
  FIG. 1 is a perspective view of a coating / development processing system according to an embodiment of the present invention.
  As shown in FIG. 1, a loader / unloader unit 2 for carrying a substrate, for example, a glass substrate G for LCD, in and out of the coating / development processing system 1 is provided in front of the coating / development processing system 1. ing. In this loader / unloader section 2, for example, a cassette mounting table 3 on which a cassette C containing 25 glass substrates G, for example, is aligned and placed at a predetermined position, and a glass substrate G to be processed are taken out from each cassette C. In addition, a loader / unloader 4 is provided for returning the glass substrate G that has been processed in the coating / development processing system 1 to each cassette C. Loader shown・The unloader 4 moves in the direction in which the cassettes C are arranged as the main body 5 travels. The unloader 4 takes out the glass substrates G from the cassettes C with the plate-like tweezers 6 mounted on the main body 5. It comes to return. Further, on both sides of the tweezers 6, substrate alignment members 7 that perform alignment while holding the four corners of the glass substrate G are provided.
[0025]
In the central part of the coating / development processing system 1, corridor-like transport paths 10, 11 arranged in the longitudinal direction are provided in a straight line via a transfer section 12, and on both sides of the transport paths 10, 11. The various processing apparatuses for performing each process with respect to the glass substrate G are arrange | positioned.
[0026]
In the illustrated coating / development processing system 1, for example, two scrubber units 16 that perform brush cleaning of the glass substrate G and cleaning with high-pressure jet water are arranged in parallel on one side of the conveyance path 10. Further, two developing devices 17 are arranged in parallel on the opposite side of the conveyance path 10, and two heating devices 18 are stacked next to each other.
[0027]
In addition, two stages of cooling devices 20 for cooling are arranged on one side of the conveyance path 11. Next to these cooling devices 20, two heating devices 22 are stacked in two rows. In addition, two resist coating devices 23 that form a resist film on the surface of the glass substrate G by coating a resist solution on the glass substrate G on the opposite side across the conveyance path 11 are arranged side by side. Although not shown, an exposure device or the like for exposing a predetermined fine pattern to the resist film formed on the glass substrate G is provided on the side of the resist coating device 23.
[0028]
  Each of the above processing apparatuses 15 to 18 and 20 to 23 is arranged on both sides of the transport paths 10 and 11 with the entrance / exit of the glass substrate G facing inward. The first transport device 25 moves on the transport path 10 to transport the glass substrate G between the loader / unloader unit 2, the processing devices 15 to 18 and the transfer unit 12, and the second transport device 26 A transport path for transporting the glass substrate G between the transfer unit 12 and the processing apparatuses 20 to 23.11It is designed to move up. Each of the transfer devices 25 and 26 has a pair of upper and lower arms 27 and 27. When accessing each of the processing devices 15 to 18 and 20 to 23, the one arm 27 performs processing from the chamber of each processing device. The glass substrate G that has already been processed is carried out, and the glass substrate G before processing is carried into the chamber by the other arm 27.
[0029]
2 is a front view of the resist coating apparatus 23 shown in FIG. 1, and FIG. 3 is a plan view thereof.
As shown in these drawings, the resist coating apparatus 23 includes a spin chuck (holding means) 28, a cup (container) 29, an upper lid 30, a first motor 31, a second motor 32, a lifting cylinder 33, a first and a second Second nozzles 34 and 35 and a CPU 36 are provided.
[0030]
A vacuum suction device 37 for holding the glass substrate G by vacuum suction is connected to the spin chuck 28. An opening 38 for taking in and out the glass substrate G is provided at the top of the cup 29. As shown in FIG. 3, the opening 38 has a rectangular shape that is slightly larger than the rectangular glass substrate G. The upper cover 30 is put on the opening 38. The upper lid 30 is movably supported by an opening / closing mechanism (not shown). When the cup 29 is covered with the upper lid 30, the spin chuck 28 and the glass substrate G are surrounded by the cup 29 and the upper lid 30 in the upper part and the vicinity of the peripheral edge.
[0031]
The first motor 31 is a drive source for rotating the spin chuck 28, and the second motor 32 is a drive source for rotating the cup 29. The lifting cylinder 33 is a drive source for lifting and lowering the spin chuck 28 in the Z-axis direction. The first nozzle 34 communicates with a resist solution supply source (not shown) having a mass flow controller (not shown), and the second nozzle 35 is a thinner solution supply source (not shown) having a mass flow controller (not shown). The supply amount of the resist solution or the thinner solution is controlled based on a command from the CPU 36. The nozzles 34 and 35 are movably supported by a rotatable arm 39, and can move between the outside of the cup 29 (home position) and the position directly above the cup 29 (dropping position) based on a command from the CPU 36. It is like that.
[0032]
  Spin chuck28A seal member 41 is attached to the outer peripheral side lower surface of the mounting portion 40. When the spin chuck 28 is lowered and the seal member 41 is brought into contact with the bottom of the cup 29, an airtight processing space 42 is formed. The seal member 41 may be attached to the bottom surface of the cup 29.
[0033]
The first motor 31 and the second motor 32 are controlled to rotate by the CPU 36. The elevating cylinder 33 is controlled to be moved up and down by the CPU 36.
[0034]
The rotating shaft 43 of the elevating cylinder 33 is slidably connected to a spline bearing 47 fitted on the circumferential surface of a rotating cylinder 46 that is rotatably mounted on the inner circumferential surface of the fixed collar 44 via a bearing 45. ing. A driven pulley 48 is attached to the spline bearing 47, and a timing belt 51 is stretched between the driven pulley 48 and a drive pulley 50 attached to a drive shaft 49 of the first motor 31.
[0035]
Therefore, the rotation shaft 43 is rotated via the timing belt 51 by the driving of the first motor 31 and the spin chuck 28 is rotated.
[0036]
The lower side of the rotary shaft 43 is disposed in a cylinder (not shown). In the cylinder, the rotary shaft 43 is moved in the Z-axis direction by driving the lifting cylinder 33 via the vacuum seal portion 52. To get.
[0037]
  The cup 29 is attached to the outer peripheral surface of the fixed collar 44 via a connecting cylinder 55 that is fixed to the upper end portion of a rotating outer cylinder 54 that is attached via a bearing 53, and is attached to the rotating outer cylinder 54.RuThe drive from the second motor 32 is transmitted to the cup 29 by the timing belt 59 spanned between the driven pulley 56 and the drive pulley 58 attached to the drive shaft 57 of the second motor 32, and the cup 29 rotates in the horizontal direction. It is configured to be.
[0038]
A hollow ring-shaped drain cup 60 is disposed on the outer peripheral side of the cup 29 so that the mist scattered from the cup 29 can be collected.
[0039]
An encoder 61 is attached to the first motor 31, and an encoder 62 is attached to the second motor 32. The detection signals detected by the encoders 61 and 62 are transmitted to the CPU 36 so that the rotation operations of the first motor 31 and the second motor 32 are controlled based on the output signals compared and calculated by the CPU 36, respectively. It has become.
[0040]
Next, the operation will be described.
FIG. 4 is a flowchart showing the flow of processing in the resist coating apparatus 23. 5 to 20 are schematic views showing the state of the resist coating apparatus 23 at each step.
In a state where the spin chuck 28 is raised above the opening 38 of the cup 29, the glass substrate G is transferred onto the spin chuck 28 from the second transport mechanism 26 and held by vacuum suction (step 401, FIG. 5).
[0041]
Next, the spin chuck 28 is lowered by driving the elevating cylinder 33, and the glass substrate G is carried into the cup 29 through the opening 38 (step 402, FIG. 6). Then, before the spin chuck 28 is lowered to the lowest position, for example, 90 ° until the four corners of the glass substrate G are hidden from the opening 38 near the middle portion of the cup 29, for example, by driving the first motor 31. G is rotated (step 403, FIG. 7).
[0042]
After that, the spin chuck 28 is lowered to the lowest position by driving the elevating cylinder 33 (step 404, FIG. 8), and the nozzles 34, 35 are rotated from the outside of the cup 29 (home position) directly above the cup 29 by the rotation of the arm 39. It is moved to (dropping position) (step 405, FIG. 9).
[0043]
The first motor 31 and the second motor 32 are rotated in synchronization with each other, so that the spin chuck 28 (glass substrate G) and the cup 29 are rotated in synchronization with each other, that is, the four corners of the glass substrate G are hidden from the opening 38. In this state, the glass substrate G is rotated, and the thinner is first dropped from the second nozzle 35 on the rotating glass substrate G, and then the resist solution is dropped from the first nozzle 34 (step 406, FIG. 10). Thereby, the resist solution is applied to the surface of the glass substrate G wetted by the thinner, and the amount of the resist solution used can be reduced.
[0044]
Thereafter, the rotation of the first motor 31 and the second motor 32 is stopped, the rotation of the glass substrate G is stopped, and the dropping of the resist solution is stopped (step 407, FIG. 11). The arm 39 is moved from directly above the cup 29 (dropping position) to the outside of the cup 29 (home position) (step 408, FIG. 12).
[0045]
Next, the upper lid 30 is lowered by the opening / closing mechanism (not shown) to cover the opening 38, and the opening 38 is closed (step 409, FIG. 13). Then, when the first motor 31 and the second motor 32 are rotated synchronously, the spin chuck 28, the cup 29, the upper lid 30 and the glass substrate G are integrally rotated (step 410, FIG. 14). Thereby, the resist solution applied on the glass substrate G is dried, and a resist film is formed on the glass substrate G.
[0046]
Thereafter, the rotation of the first motor 31 and the second motor 32 is stopped, and the integral rotation of the spin chuck 28, the cup 29, the upper lid 30 and the glass substrate G is stopped (step 411, FIG. 15), and the opening / closing mechanism. (The illustration is omitted), the upper lid 30 is raised, and the opening 38 is opened (step 412, FIG. 16).
[0047]
Next, by driving the lifting cylinder 33, the spin chuck 28 is raised to, for example, the vicinity of the middle portion of the cup 29 (step 413, FIG. 17), and the four corners of the glass substrate G are seen from the opening 38, for example, 90 °. The glass substrate G is rotated by driving the motor 31 (step 414, FIG. 18).
[0048]
Then, the spin chuck 28 is lifted by driving the elevating cylinder 33, the glass substrate G is carried out of the cup 29 through the opening 38 (step 415, FIG. 19), and the glass substrate G is second from above the spin chuck 28. (Step 416, FIG. 20).
[0049]
As described above, according to this embodiment, the shape of the opening portion 38 of the cup 29 is a rectangle slightly larger than the glass substrate G, and the four corners of the glass substrate G carried into the cup 29 are formed from the opening portion 38. Since the glass substrate G is rotated until it is hidden and the cup 29 and the glass substrate G are synchronously rotated in this state, the resist solution is dropped on the glass substrate G through the opening 38. Further, the resist solution can be uniformly applied to the glass substrate G, and the resist solution scattered from the four corners of the glass substrate G hits the upper wall surface in the cup 29 (see FIG. 10). It does not jump out of the cup 29, and mist generation is prevented. After that, the upper lid 30 is attached to the opening portion 38 to make the inside of the cup 29 an airtight processing space 42. In this state, the spin chuck 28, the cup 29, the upper lid 30 and the glass substrate G are rotated synchronously. The turbulent flow is not generated in the processing space 42, the generation of mist is prevented, and the resist solution can be applied and dried more uniformly on the glass substrate G.
[0050]
In the case where the resist solution splashed from the four corners of the glass substrate G hits and adheres to the upper wall surface in the cup 29, as shown in FIG. You may make it provide the washing | cleaning apparatus 81 which ejects a washing | cleaning liquid.
[0051]
Next, a second embodiment of the present invention will be described.
FIG. 21 is a plan view of a resist coating apparatus according to the second embodiment. In the figure, the same elements as those shown in FIG.
In the resist coating apparatus according to the first embodiment, the glass substrate G is rotated until the four corners of the glass substrate G are hidden from the opening 38 when the resist solution is applied. In the resist coating apparatus 23, movable members 71 that cover the four corners of the glass substrate G carried into the cup 29 through the opening 38 from the opening 38 are provided near the four corners of the upper surface of the cup 29, respectively. When the resist solution is applied by the driving device, the movable member 71 covers the four corners of the opening 38 of the glass substrate G. In other cases, for example, when the glass substrate G is carried in and out of the cup 29, the movable member 71 The cover by 71 is released. Other processing steps are the same as those shown in FIG.
[0052]
As described above, according to this embodiment, the four corners of the glass substrate G carried into the cup 29 are covered by the movable member 71 from the opening 38, and the cup 29 and the glass substrate G are rotated synchronously in this state. However, since the resist solution is dropped on the glass substrate G through the opening 38, the resist solution can be uniformly applied onto the glass substrate G, and the resist solution scattered from the four corners of the glass substrate G is Since it hits the movable member 71, the scattered resist solution does not jump out of the cup 29 through the opening 38, and mist is prevented from being generated. Further, according to this embodiment, the same effect can be obtained even if the shape is not a rectangle but a square or a shape close thereto.
[0053]
Next, a modified example of the present invention will be described.
In the above-described embodiment, the upper lid 30 is opened and the resist solution is dropped onto the glass substrate G from the first nozzle 34 through the opening 38. However, as shown in FIG. A first nozzle 83 may be provided at the center of 30 via a bearing 82. With this structure, even if the upper lid 30 rotates, the first nozzle 83 does not rotate. According to this example, it is possible to apply the resist solution while rotating the glass substrate G with the opening 38 being closed by the upper lid 30. When the surface of the glass substrate G is wetted using thinner, as shown in FIG. 26, the tube 91 has a double structure. For example, a resist solution is supplied from the inner tube 92 and thinner is supplied from the outer tube 93. You may do it.
[0054]
  The present invention is not limited to the embodiment described above.
  For example, in the first embodiment, the glass substrate G is rotated together with the cup 29 by synchronously rotating the first motor and the second motor. Is performed by another driving means, and one glass substrate G and one cup 29 are provided.ofYou may comprise so that it may rotate with a motor.
  In the above-described embodiment, the resist solution is described as an example of the processing solution, but the present invention can naturally be applied to other processing solutions.
  Furthermore, although the glass substrate G was demonstrated as an example as a board | substrate, the material will not be ask | required if it is a rectangular board | substrate.
[0055]
【The invention's effect】
As described above, according to the first and seventh aspects of the present invention, the processing liquid can be uniformly applied onto the substrate, and the scattered processing liquid jumps out of the container through the opening. And the occurrence of mist is prevented.
[0056]
According to the second aspect of the present invention, the generation of mist can be more effectively prevented.
[0057]
According to the third and eighth aspects of the present invention, the processing liquid can be uniformly applied onto the substrate, and the scattered processing liquid does not jump out of the container through the opening. Occurrence is prevented.
[0058]
According to the present invention according to claims 4 and 9, it is possible to improve the wettability of the substrate and apply the resist solution, and to apply the resist more uniformly.
[0059]
According to the fifth aspect of the present invention, the turbulence of the airflow in the container can be suppressed, and the uniformity of the resist film thickness can be ensured.
[0060]
According to the sixth aspect of the present invention, the resist solution scattered and adhered to the inner wall of the container does not drop on the substrate and adversely affect the substrate.
[Brief description of the drawings]
FIG. 1 is a perspective view of a coating / development processing system according to an embodiment of the present invention.
FIG. 2 is a front view of the resist coating apparatus shown in FIG.
FIG. 3 is a plan view of the resist coating apparatus shown in FIG.
4 is a resist shown in FIGS. 2 and 3. FIG.CoatingIt is a flow which shows the flow of the process in an apparatus.
FIG. 5 shows a resist in step 401 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 6 shows a resist in step 402 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 7 shows the resist in step 403 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 8 shows the resist in step 404 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 9 shows a resist in step 405 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 10 shows the resist in step 406 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 11 shows the resist in step 407 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 12 shows the resist in step 408 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 13 shows a resist in step 409 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 14 shows a resist in step 410 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 15 shows the resist in step 411 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 16 shows the resist in step 412 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 17 shows the resist in step 413 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 18 shows the resist in step 414 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 19 shows the resist in step 415 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 20 shows the resist in step 416 shown in FIG.CoatingIt is the schematic which shows the state of an apparatus.
FIG. 21 shows a resist according to a second embodiment of the present invention.CoatingIt is a top view of an apparatus.
FIG. 22 is a front view showing an example of a conventional rotating cup type coating apparatus.
FIG. 23 is a plan view of the rotating cup type coating apparatus shown in FIG.
FIG. 24 shows a resist according to a modification of the present invention.CoatingIt is a top view of an apparatus.
FIG. 25 shows a resist according to a modification of the present invention.CoatingIt is a top view of an apparatus.
FIG. 26 shows a resist according to a modification of the present invention.CoatingIt is an enlarged view of an apparatus.
[Explanation of symbols]
  23 resistCoatingapparatus
  28 Spin chuck
  29 cups
  30 Upper lid
  31 First motor
  32 Second motor
  34 First nozzle
  38 opening

Claims (11)

A coating apparatus for applying a coating solution on a rectangular substrate,
A container that is rotatably held and has a rectangular opening at the top that is slightly larger than the substrate;
A holding member that holds the substrate in the container so as to be rotatable, and carries the substrate from the container through the opening,
Means for rotating the holding member until at least four corners of the substrate carried into the container are hidden from the opening;
Means for rotating the container with the holding member;
And a means for dropping the coating liquid onto the substrate held by the holding member in the rotating container. The coating apparatus according to claim 1,
The coating apparatus, wherein the means for rotating the holding member rotates the holding member by approximately 90 °. A coating apparatus for applying a coating solution on a rectangular substrate,
A container that is rotatably held and has a rectangular opening at the top that is slightly larger than the substrate;
A holding member for holding the substrate in the container and carrying the substrate in and out of the container through the opening;
Respectively provided near four corners of the opening, the case of applying the coating solution to the substrate only have covering the opening corner of the substrate carried into the container through the opening, the substrate through the opening A movable member that releases the covering of the four corners of the opening when being carried in and out,
Means for rotating the container with the holding member;
And a means for dropping the coating liquid onto the substrate held by the holding member in the rotating container. The coating apparatus according to any one of claims 1 to 3,
The coating solution is a resist solution,
A coating apparatus comprising: means for dropping a thinner onto the substrate held by the holding member through the opening. The coating apparatus according to any one of claims 1 to 4,
An applicator comprising a means for covering the opening of the container and rotating the container together with the holding member. The coating apparatus according to any one of claims 1 to 5,
A coating apparatus comprising means for cleaning the inside of the container. A coating method for coating a coating liquid on a rectangular substrate,
A step of carrying the substrate into the container through the opening of the container provided at the top with a rectangular opening slightly larger than the substrate;
After carrying the substrate into the container, rotating the substrate until at least four corners of the substrate are hidden from the opening; and
And a step of dropping a coating solution onto the substrate through the opening while rotating the container together with the substrate after the substrate is rotated. A coating method for coating a coating liquid on a rectangular substrate,
A step of carrying the substrate into the container through the opening of the container provided at the top with a rectangular opening slightly larger than the substrate;
After carrying the substrate into the container, driving the movable members respectively provided near the four corners of the opening to cover the opening until at least four corners of the substrate are hidden from the opening;
And a step of dropping a coating solution onto the substrate through the opening while rotating the container together with the substrate after covering the opening. The coating method according to claim 7 or 8,
The coating solution is a resist solution,
A coating method comprising: a step of dropping a thinner on the substrate through the opening before dropping the resist solution on the substrate. The coating apparatus according to any one of claims 1 to 3,
Means for dripping thinner through the opening on the substrate held by the holding member;
A lid that covers the opening and rotates with the container with the opening closed;
The coating solution is a resist solution;
The means for dropping the resist solution and dropping the thinner is a double-structured tube composed of an inner tube and an outer tube,
The coating apparatus, wherein the tube is provided in the center of the lid via a bearing. The coating apparatus according to claim 10,
The coating apparatus, wherein the resist solution is supplied from the inner tube and the thinner is supplied from the outer tube to the substrate.

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