JP3787620B2 - 3D assembly equipment for small objects - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The invention of this application uses a probe to monitor a minute work area from multiple directions at the same time, while using a probe to capture, move, bond, sputter, etc. It is an apparatus that can perform three-dimensional assembly of minute objects with high accuracy using the same probe at the same place.
[0002]
[Prior art problems and solutions]
Miniaturization of various devices represented by mobile phones is largely due to the mounting technology of these small components in addition to the miniaturization of components and the high density integration. For this reason, technologies such as high-precision processing, assembly, and integration of micrometer-order materials and parts are necessary for manufacturing small devices. The present invention provides an apparatus for capturing and moving micrometer-order microscopic objects, accurately arranging, joining, and processing corresponding to the demand in such fields.
[0003]
As a manipulation device using a conventional probe, a gripping type micro gripper, a suction type by vacuum suction, and the like have been developed. The devices according to these methods are specialized for capturing / moving and placing fine objects, and cannot attach the minute objects to the place where they are placed. Moreover, the monitoring of the object is limited to the display of monocular images or individual monitoring images by the centralized monitoring device, and a stereoscopic monitoring image that provides a sense of distance is not provided.
[0004]
On the other hand, with respect to micro bonding, diffusion bonding at room temperature is possible by etching the surfaces of bonding objects with a high-speed charged beam or the like in a high vacuum container and activating the bonding surfaces. However, this type of device is specialized only for the joining of minute objects and is not a device that takes into account capture, operation, and assembly.
[0005]
In addition, lithography and its applied technology widely used for manufacturing semiconductors and micromachines are basically techniques that combine film formation and etching. For this reason, there existed a fault that there were fixed restrictions on the material which can be used, a process was complicated, and there were many wastes in terms of resources and energy.
[0006]
[Means for Solving the Invention]
In order to solve the above-mentioned problems, the invention of this application firstly can control the probe (5) made of a high melting point material, the probe attitude control system (1), and the probe and the substrate over a range of 5 to 20 kV. , Pc-order storage capacitors are stacked in multiple stages, and are provided with a voltage rising circuit equipped with a plurality of capacitor multi-stage layers, and the capacitor layer array for storing discharge power during discharge and a backup capacitor layer array for the capacitor layer array In the circuit, the output polarity is bipolar, the discharge start condition is glow discharge, and the pulse width, pulse pause width, pulse repetition frequency and pulse wave of the discharge waveform can be recovered quickly. High price can be controlled independently Pulse voltage control power supply (4), worktable (6) with translational and rotational degrees of freedom, centralized monitoring system (3) for three-dimensional monitoring of a minute work area of the worktable by simultaneously monitoring one point from multiple directions And a working environment control system (7), and this working environment control system (7) plays a role of preventing oxidation and improving workability during bonding and sputtering, so that the probe, the minute object subjected to the processing, and the substrate Along with work environment gas control device (7a) that shields a part with inert gas or environment control gas, pre-heating work environment gas, electric heater, and narrowed focused infrared rays to join fine objects well Or a combination of these, a working environment temperature control device for heating the joining portion to a predetermined temperature of 200 ° C. or less in advance and controlling the rate of temperature drop of the portion after joining by discharge. (7b) having a function of assembling and processing a micro object having a function of capturing a micro object of 5 μm to 1 mm by an electric field at the tip of the probe and joining and processing it by electric discharge between the probe and the substrate. (2) is provided with a plurality of monitoring devices (9), (10), and (11), and when monitoring one point from multiple directions at the same time, in order to prevent optical interference derived between the plurality of monitoring devices, they overlap each other. A micro three-dimensional assembly apparatus (Claim 1) comprising a centralized monitoring system comprising a light source that emits only a specific wavelength region that does not transmit and a monitoring device that monitors through a filter that transmits only that wavelength region. provide.
[0009]
The invention of this application is, secondly, In order to avoid external electrical and electrodynamic disturbances, the probe and the minute object can always be equipotential until immediately before the operation such as capturing and arranging the minute object. (Claims 2 ) Equipped with a small object.
[0010]
The invention of this application 3 According to the probe configuration, the probe material characteristics satisfy high melting point, high strength and low electrical resistance, for example, a probe characterized by W, WC, WSi, MoSi, TiB2, ZrB2, CrB2, and a probe of the above material Placed (claim) 3 ) Or even unavoidable probe wear due to long-term use, including electrical discharge, obtuse blunting of the tip, interruption of the work due to probe replacement work, etc. Equipped with a probe feeder that winds the same wire diameter on a reel 4 3) a minute object three-dimensional assembly apparatus.
[0011]
According to the invention of this application, since the fabrication of the three-dimensional device is basically a build-up process, it can be assembled using only a necessary amount of materials.
[0012]
In addition, since incidental operations such as capture and desorption are performed by an electrostatic method, control is easy regardless of the material of the minute object, and in addition, joining and processing are performed by discharge using a probe. Combined with the unified energy source for capturing, joining, and processing, it is possible to perform continuous and consistent work with the same probe, such as capturing, moving, joining, and processing.
[0013]
In addition, by carrying out various operations with the same probe, the process and control are simplified, and as a secondary effect of this simplification, it is possible to improve the work accuracy of the manufactured product.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
According to the invention of this application, the monitoring method adopts a monitoring method based on multi-direction and simultaneous one-point concentration and image synthesis processing to make the monitoring image a realistic stereoscopic image, so that the operator feels a sense of distance, etc. Therefore, it is possible to create a work environment with a substantial feeling, and it is possible to further prevent misrecognition and misoperation in various operation tasks. The optical interference derived from simultaneous centralized monitoring from multiple directions does not overlap the wavelength range of the illumination light provided in each monitoring device, or incident light using a filter such as a dichroic mirror. This can be prevented by controlling the wavelength range.
[0015]
Since joining, processing, and the like are performed in the air, the atmosphere and temperature of the part can be controlled by local atmosphere control using an air curtain system, electric heat, or condensed infrared rays. Along with this, the disturbance of the monitoring image due to fluctuations of the heat wave and the like derived can be minimized by locally heating the spot light obtained by narrowing the infrared ray.
[0016]
The probe material can be selected from, for example, W, WC, WSi, MoSi, TiB2, ZrB2, and CrB2 as a high melting point material that satisfies the high melting point, high strength, and low electrical resistance characteristics.
[0017]
The pulse voltage control power source can be an independent power source for the capturing power source and the joining / processing power source.
[0018]
The workbench can have translational and rotational degrees of freedom. In this case, the rotary stage (R-axis stage) that rotates the work surface of the work table is designed so that the direction perpendicular to the work surface is the rotation direction, and the center of the work table is the center of rotation. Is preferred.
[0019]
As a centralized monitoring system, a plurality of monitoring devices can be deployed to perform monitoring with different roles.
[0020]
As the work environment control system, a work environment gas control device and a work environment temperature control device can be appropriately combined.
[0021]
As a centralized monitoring system, it consists of a light source that emits only a specific wavelength range that does not overlap each other, and a monitoring device that monitors through a filter that transmits only that wavelength range, and when monitoring one point from multiple directions simultaneously, It is possible to prevent optical interference derived from a plurality of monitoring devices.
The pulse voltage control power supply can be of a bipolar type that can apply a voltage that causes discharge to glow and can select the polarity of the output polarity. It is also possible to avoid external electrical and electrodynamic disturbances.
[0022]
Equipped with a probe feeder that winds the same wire diameter on a reel, this prevents unavoidable probe wear due to long-term use, including electric discharge, consequent blunting of the tip, interruption of work due to probe replacement work, etc. It is possible to prevent the operation from being performed continuously under the same electrical conditions for a long time.
[0023]
【Example】
Example 1
FIG. 1 shows a basic configuration of a conceptual design of a minute object three-dimensional assembly apparatus based on the present invention. With reference to the drawings, the basic functions and roles of each system related to the basic configuration will be described in detail, and the basic specifications of a specific prototype three-dimensional assembly apparatus will be illustrated as an example. .
[0024]
The present invention is a device that performs fine work under mirror image monitoring. As shown in FIG. 1, the probe (5) serving as a tool in charge of sample capturing, joining, and processing is used to absorb inconsistencies in the probe posture. Probe attitude control system (1), centralized monitoring system (2) that monitors the tip of the probe that performs fine work from various angles, and a work environment for controlling the gas atmosphere and temperature of the probe and the part that performs fine work around the tip Control system (7), Pulse voltage control power supply (4) for applying voltage between probe substrates when working with materials such as capturing, joining and processing of raw materials, and centralized monitoring system (2) A workbench (6) with translational and rotational degrees of freedom for guiding it into the field of view, a monitoring mirror image display / recording system (3) for recording each work process, and centralized control for collectively managing each system Composed of system (8) That.
[0025]
The functions and roles of each system shown in the basic configuration will be described in detail.
[0026]
A set of centralized monitoring system (2) will be described. In the present invention, as shown in FIG. 6, all operations are performed using the same probe, and the tip thereof is used as a reference for position information. Therefore, in the centralized monitoring system (2), each monitoring device has the same point as the center of the arc so that the viewpoint position can be kept constant even if the depression angles of the plurality of monitoring devices having the tip as the focal position are adjusted. It is mounted on an arched guide. By combining and controlling the monitoring device of the centralized monitoring system (2) and the work table (6), it is possible to always view the work position in multiple directions as will be described later.
[0027]
An example of the arrangement of the monitoring devices of the centralized monitoring system (2) is shown in FIG. What is required of the monitoring device 1 (9) in the figure is a reference position monitoring function, that is, monitoring the distance between the probe and the raw material and between the raw material and the work table. The monitoring device 2 (10) and the monitoring device 3 (11) have a main role of monitoring for placing raw materials on the work table. Even if the orientation of the raw material is changed by using the translation of the work table and the rotation axis together, the monitoring angle between the monitoring device and the work table can be kept constant by adjusting the depression angle of the monitoring device.
[0028]
An example of the probe attitude control system (1) is shown in FIG. In this case, the probe posture mismatch absorption function is provided so that the probe posture can be changed while the probe tip position is fixed even if it becomes necessary to change the probe posture as the work progresses, even if the situation is complicated and complicated. It is based on having mounted the probe attitude control stand (12) with which it was equipped. Even if the probe posture is changed after the workpiece such as the raw material is captured by this function, the center of the visual field in the centralized monitoring system, in other words, the position of the probe tip as an initial condition does not change.
[0029]
An example of the work environment control system (7) is shown in FIG. The basic functions here are environmental temperature control that preheats work objects before joining and processing, and then gradually cools them away from the high-temperature state that accompanies discharge, and the work objects during joining and processing work. This is environmental gas control to prevent oxidation and nitridation.
[0030]
A work environment gas control device (7a) for guiding an inert gas or a shield gas from the work environment adjustment gas inlet (13) to the substrate (16) through the work environment adjustment gas guide (15) for environmental gas control. Prepare.
[0031]
Further, for the environmental temperature control, the gas temperature is adjusted through the gas temperature controller (14), and the work temperature is controlled by combining the work table temperature controller (17) and the condensing infrared ray generator (18). An environmental temperature control device (7b) is provided.
[0032]
An example of a block diagram of the pulse voltage control power supply (4) is shown in FIG.
This power source (4) is composed of two main circuits, one is a power source for capturing (19), and the other is a power source for joining and processing (20). The processing (20) is independent, and the output can be set independently for each voltage, current and output polarity, and the output is a distribution system from a single terminal. The joining / processing power source (20) applies a high voltage to cause glow discharge, and prevents arc discharge as much as possible. The capturing power source (19) is for applying a voltage of about several tens of volts in order to obtain a necessary electrostatic force without causing discharge when the probe and particles approach each other. When a metal particle on the substrate is touched, a current flows, but in reality, the contact resistance between the metal particle and the substrate and between the probe and the metal particle is quite high, and the applied voltage of the probe is hardly fluctuated and maintained. can do. The capturing power source (19) has a low voltage and a low current in order to minimize the influence of unnecessary discharge when the probe approaches the particle, and the minimum set current is set to 10 μA. In addition, the power supply unit for bonding and processing is composed of a circuit that modulates 50 Hz AC input to 50 kHz and a circuit in which capacitors and diodes in the order of pC are stacked in series in order to shorten the charge / discharge time of the booster / rectifier unit. Has been. For this reason, it has the characteristic that the degree of freedom of the condition setting parameters such as the pulse width, the pulse pause width, and the pulse repetition number at the time of discharge is wide. “Control 1” can set the voltage and current at the time of capture, and “Control 2” can set the voltage, current, pulse width, ON / OFF time ratio of the pulse waveform, and the number of pulses at the time of joining and processing.
[0033]
From the above, according to the pulse voltage control power source (4) of the present invention, (1) the initial discharge condition is a glow discharge region, and (2) the voltage is rapidly reduced, so that the discharge is performed with almost no arc discharge period. After stopping, and returning to the state where glow discharge can be resumed promptly from (3) discharge stop state, (4) At that time, pause time, pulse width, number of discharges, etc. can be controlled by a centralized control system, and (5) probe and In order to make the particles have the same potential, the output can be set to the ground potential.
[0034]
The probe tip is always fixed at the initial position regardless of the posture of the probe, and in transporting, joining and processing raw materials, the necessary area on the workbench is moved by moving the workbench. ) And move as necessary relative to the probe tip. Therefore, various operations can be performed while the probe tip and the central monitoring system monitoring device are fixed, and the center of the visual field of the central management system can always be the work area. As a result, a minute object of 5 μm to 1 mm is captured by the electric field at the probe tip, and bonded and processed by electric discharge between the probe and the substrate.
[0035]
FIG. 6 is a schematic diagram of the entire device prototyped based on the basic structure and basic functions. The device is a simultaneous and multi-view environment in a centralized monitoring system in which the monitoring device 1 (9), the monitoring device 2 (10), and the monitoring device 3 (11) are attached to an arch guide (24) centered on the probe tip. Is building.
[0036]
FIG. 7 illustrates the axis specifications of the stage in each system of the prototype device. Each (X) (Y) (Z) (R) and (T) axis stage shown here is an axis stage shown as a three-dimensional direction as a probe posture control direction in FIG. The R axis stage shown and the T axis stage as an axis for tilting the work surface of the work table are shown.
[0037]
The movement of the stage is related to the raw material size to be handled, and in the work of the probe, it is required to control the raw material just to the tip of the probe but not to pierce it. Therefore, since the movement accuracy of the translation axis of the workbench is 0.1 μm, which is 1/100 of the handling lower limit particle, the work of the probe can be sufficiently performed. The axis specification of the illustrated stage enables a fine work with a handling raw material size of 10 μm. In addition, the monitoring device 4 (25) can move the work table at any time during the installation work so that the raw material and the work object can be monitored from vertically above, so that the position information of the raw material can be obtained and the work accuracy can be confirmed.
[0038]
The operation of the micro three-dimensional assembly apparatus of the present invention is as follows.
[0039]
Hereinafter, a series of micro work procedures when the micro object is captured, transported and processed by the micro object three-dimensional assembly apparatus of the present invention will be described according to the process shown in FIG.
The probe is attached to the probe attitude control system as a preparatory work before starting the capture, transport and processing of microscopic objects first, the attitude control system is adjusted so that this probe is vertical, and the probe tip is centrally monitored. Is set as the focal position, and this position is used as a reference.
First, the focus of the monitoring device 1 (9), the monitoring device 2 (10), and the monitoring device 3 (11), which mainly plays a role of monitoring the bonding / processing work in the centralized monitoring system, is concentrated on one point, and the field of view. Confirm that a monitoring environment with a central focus is maintained, and adjust the multi-view conditions of the work environment. In this case, the shift of the focal point and the center of the visual field is adjusted while adjusting the depression angle of the monitoring device group, and each adjustment value is stored in the control device of the central control system. Next, the focus of the monitoring device 4 (25) that plays the role of obtaining the position information of the sample and checking the work accuracy is adjusted. The monitoring device 4 (25) adjusts the visual field center axis to be parallel to the probe axis, and stores the information in the control device of the central control system. The raw material (21) is placed on the raw material supply table (22), and the top surface is adjusted by the raw material supply table height adjuster (23) in order to adjust the top surface to the reference position previously determined. Similarly, the substrate is placed on a predetermined position of the work table, the upper surface of the substrate is aligned with the reference position, and the positions of the work table and the raw material supply table are initialized. Each position information such as sample capturing, joining and processing is acquired by using the monitoring device 4 (25), and the information is stored in the control device of the central control system, and all initializations such as position and posture are completed.
[0040]
This section describes the operating procedures in actual operations such as capturing, joining and processing. A voltage which is a sample capturing condition obtained in advance is stored in the pulse voltage control power source as a sample capturing set value. Whether or not the capturing operation has been performed stably is confirmed using the monitoring device 1, and if it is not an appropriate condition, the correction value is stored in the control device at this point. Similarly, voltage and current values, power application time, rest time, and number of repetitions, which are determined as joining / processing conditions, are stored in the apparatus as set values of the power source. Whether the set value is appropriate is checked using the monitoring device 1, the monitoring device 2, and the monitoring device 3, and if it is inappropriate, the correction value is stored. At the same time, the set values such as the gas type, gas temperature, gas flow rate, gas injection start time, and temperature of the work environment temperature controller that have been obtained are concentrated as incidental setting requirements during joining and processing. It is stored in the control device of the control system. With this work, all the condition settings are completed, and then the fine work starts.
[0041]
That is, when it is confirmed by the monitoring device 1 that the raw material particles have been captured and the capturing operation has been performed stably, the predetermined voltage and current values, the power application time, the rest time, and the While confirming the operation with the number of repetitions under the set value of the power source, the raw material is placed at a predetermined position on the substrate and particle bonding and processing are executed. As a result, creation / work of the minute object is started, and the work is completed when the creation of the minute object is completed.
[0042]
FIG. 9 and FIG. 10 show two examples of the microstructure manufactured as a prototype according to the above-described operation procedure by the prototype device according to the above embodiment. FIG. 9 shows an example in which letters are made by stacking Au particles having a diameter of 38 to 43 μm vertically on the Au substrate surface. This example is a prototype for verifying whether a working environment such as vertical operation, horizontal operation, oblique operation, arc operation, etc., which is indispensable for the production of minute objects, and a work environment such as joining can be established. NR in prototype characters I Includes all the directional elements of the vertical direction, the horizontal direction, the oblique direction, and the circular arc direction described above, and it is clear that there is no restriction on the outer shape when a micro structure is made as a prototype. As a result, the prototype device shown in the first embodiment has the basic configuration and the basic function shown in FIGS. 1, 2, 3, 4 and 5, the in-field work function, and the object movement / posture change function. It proves that it has a function of grasping an object, a function of absorbing misalignment of visual field, and an object capturing / joining / processing function.
[0043]
FIG. 10 shows an example of a particle pyramid prototype in which Au particles having a diameter of 38 to 43 μm and an Au substrate are used to form a base of 5 × 5 and a height of 5 layers. In this case, verification was made as to whether or not a blind spot accompanying the progress of the work such as joining occurs and whether or not the joining work can be carried out stably even in a state where minute objects are arranged in a plurality of rows and adjacent to each other. In this prototype, a quadrilateral made up of the four samples of the nearest bottom layer is bonded and fixed to the substrate surface, and the upper layer sample is bonded onto a recess formed at the center, and this is used as a basic unit for fine work. For this reason, unlike the case where the bonding area seen from the upper surface direction does not change as in the bonding state in FIG. 9, the bonding area is remarkably increased in the bonding between the lowest surface layer and the next layer. Nevertheless, FIG. 10 shows that stable joining is possible. Also in the fine work example in FIG. 10 which is higher than FIG. 9, it was verified that all of the basic functions were mounted on the prototype device.
[0044]
9 and 10, it is proved that all of the basic configuration and the basic functions exemplified in the first embodiment are already installed in the prototype device.
(Example 2)
In order to show the effectiveness of the work environment control system, nickel particles having a diameter of 90-106 μm were assembled using a prototype three-dimensional assembly apparatus.
[0045]
First, nickel particles captured on a metal plate are arranged and bonded. Furthermore, the nickel particles captured from the raw material supply table were placed on and joined to the previously joined nickel particles. The trapping voltage is 50 V, and the applied voltage at the time of bonding is 10 kV.
[0046]
When bonding was performed without using the work environment control system and controlling the atmosphere in the room temperature atmosphere, the bonding was not possible because nickel particles were oxidized.
[0047]
Next, using a working environment gas control device, nitrogen gas at room temperature was flowed in synchronism with discharge, and bonding was performed in a nitrogen atmosphere. An SEM photograph of the joint between the nickel particles in this case is shown in FIG. As can be seen from FIG. 11, although the bonding is performed, cracks indicated by arrows are recognized in the bonded portion.
[0048]
On the other hand, FIG. 12 shows the result of joining by using the working environment temperature control device together and heating the joining target part to 200 ° C. in a nitrogen gas atmosphere. In this case, no crack was observed at the joint.
[0049]
The reason why no cracks were observed in FIG. 12 was probably because rapid cooling was avoided by heating the parts to be joined, and the effectiveness of using the work environment control system was confirmed.
[0050]
【The invention's effect】
As described above, according to the invention of this application, it is possible to assemble a three-dimensional device by using only a necessary amount of materials in a build-up process.
[0051]
Capturing, desorption, etc. are performed by electrostatic methods, so control is easy regardless of the material of the minute object, and joining and processing are performed by discharge using a probe, so that an energy source for capturing, joining and processing can be obtained. Combined with the fact that it is possible to unify electricity, all operations such as capturing, moving, joining, and processing are performed by applying an electric field to the probe. It has become possible.
[0052]
By performing various operations with the same probe, it is possible to simplify the process and control and to improve the working accuracy of the manufactured product.
[0053]
The monitoring method employs a multi-directional, simultaneous single point monitoring method and combines the monitoring image of the work object with a realistic 3D image by combining the mirror image and image composition processing. It is possible to create a working environment with a sense of reality that captures the distance and the like as a sense of reality, and to strengthen the prevention of misrecognition and misoperation in various operation tasks.
[0054]
Optical interference derived from simultaneous centralized monitoring from multiple directions by controlling the illumination light that does not overlap the wavelength range and filters such as dichroic mirrors to limit the wavelength range of incident light to the monitoring device Can be prevented.
[0055]
Disturbance of the monitoring image due to fluctuations in the heat of the sun, etc., derived when local atmosphere control by the air curtain method, electric heating, or environmental control of the temperature and temperature of the relevant part is performed by focused infrared rays in order to perform bonding and processing in the air. Can be suppressed to a minimum by performing local heating using spot light obtained by narrowing down the infrared ray.
[0056]
In addition, since the device of the invention of this application is performed in the atmosphere, a special environment such as a vacuum device is not required, but the working atmosphere gas can be easily changed to an inert gas, so that the material easily oxidizes. Is also applicable.
[0057]
Furthermore, the environmental control of the relevant part for facilitating bonding, processing, etc. in the atmosphere is carried out by adopting a coaxial air curtain system in which the atmosphere control gas is jetted with the probe as the center of the axis. It is possible to prevent deterioration such as oxidation of the steel and to obtain good bonding / processing results. Further, it is possible to prevent the occurrence of joint cracks and the like that are likely to occur in the joint part by controlling the temperature drop of the part by a work table temperature controller or local heating using a narrowed focused infrared ray.
[0058]
By combining these developed technologies and the like, it became possible for the first time to create a three-dimensional microstructure by integrated work using the same probe. For this reason, there is a possibility of substituting a part of the process conventionally performed by using lithography. Also, partial repair work for existing micro structures, such as repair of fine wiring, has become possible.
[0059]
The device of the invention of this application is intended to produce and modify a three-dimensional microstructure, and can be used for practical use of a micromachine. Further, since this apparatus is used in the atmosphere, it does not require a special environment such as a vacuum apparatus, so that it can be easily combined with an existing processing apparatus, and the maintenance and installation costs are low.
[Brief description of the drawings]
FIG. 1 is a basic system configuration diagram of a minute object three-dimensional assembly device according to the present invention;
FIG. 2 is a centralized monitoring system of a minute object three-dimensional assembly apparatus according to the present invention.
FIG. 3 is a probe attitude control system of a minute object three-dimensional assembly device according to the present invention.
FIG. 4 is a work environment control system of a minute object three-dimensional assembly apparatus according to the present invention.
FIG. 5 is a pulse voltage control power supply of a micro three-dimensional assembly apparatus according to the present invention.
FIG. 6 is a schematic external view of a minute object three-dimensional assembly apparatus according to the present invention.
FIG. 7 shows the specifications of each axis stage of the micro three-dimensional assembly apparatus according to the present invention.
FIG. 8 is a flowchart of a work process of the micro three-dimensional assembly apparatus according to the present invention.
FIG. 9 is a prototype structure 1 of a minute object three-dimensional assembly apparatus according to the present invention.
FIG. 10 is a prototype structure 2 of a minute object three-dimensional assembly device according to the present invention.
FIG. 11 shows an SEM photograph of a joint obtained by joining nickel particles in a nitrogen gas atmosphere at room temperature.
FIG. 12 shows an SEM photograph of a joint obtained by heating a joining object to 200 ° C. and joining between nickel particles in a nitrogen gas atmosphere.
[Explanation of symbols]
1 Probe attitude control system
2 Centralized monitoring system
3 Monitoring mirror image display / recording system
4 Pulse voltage control power supply
5 Probe
6 Working table
7 Work environment control system
8 Central control system
9 Monitoring device 1
10 Monitoring device 2
11 Monitoring device 3
12 Probe attitude control stand
13 Gas inlet for working environment adjustment
14 Gas temperature controller
15 Gas guide for working environment adjustment
16 substrates
17 Platform temperature controller
18 Condensing infrared ray generator
19 Capture power supply
20 Power supply for joining and processing
21 Raw materials
22 Raw material supply stand
23 Raw material supply stand height adjuster
24 Arch guide
25 Monitoring device 4

Claims (4)

Probe (5) made of high melting point material, probe attitude control system (1), between probe and substrate can be controlled over 5V to 20kV, pC-order storage capacitors are stacked in multiple stages, and multiple rows of capacitors are provided. In this circuit, the capacitor layer sequence for storing discharge power and the backup capacitor layer sequence for the capacitor layer sequence are provided in the circuit, the output polarity is bipolar, and the discharge starts. Pulse voltage control power supply (4) capable of independently controlling the pulse width, pulse pause width, pulse repetition frequency and pulse peak value of the discharge waveform so that the condition is glow discharge and the condition can be quickly recovered , translation and rotation Work table with 6 degrees of freedom (6), by monitoring one point from multiple directions at the same time, the work area of the work table is three-dimensional A centralized monitoring system (2) and a work environment control system (7) for monitoring the probe, and this work environment control system (7) plays a role of preventing oxidation and improving workability during bonding and sputtering. In addition to the work environment gas control device (7a) that shields a part of the substrate subjected to the processing and a part of the substrate with an inert gas or an environment control gas, the work environment gas is preheated in order to bond the minute object well. Working environment for heating the joining part to a predetermined temperature of 200 ° C. or less in advance using an electric heater, finely focused infrared rays, or a combination thereof, and controlling the temperature drop rate of the part after joining by discharge Equipped with a minute object assembly / processing device having a temperature control device (7b), captures a minute object of 5 μm to 1 mm by the electric field at the probe tip, and discharges between the probe and the substrate The centralized monitoring system (2) includes a plurality of monitoring devices (9), (10), and (11), and when monitoring one point from multiple directions at the same time, In order to prevent optical interference derived from the above, a centralized monitoring system consisting of a light source that emits only a specific wavelength range that does not overlap each other and a monitoring device that monitors through a filter that transmits only that wavelength range is included. A three-dimensional assembly device for small objects. In order to avoid external electrical and electrodynamic disturbances , the apparatus according to claim 1 is equipped with a power source that can always make the probe and the minute object equipotential until immediately before the operation of capturing and arranging the minute object . A three-dimensional assembly apparatus for micro objects characterized by the above. In claim 1, the probe (5) made of a refractory material, the probe material properties satisfy the high melting, high strength and low electrical resistance, W, WC, _WSi, MoSi, of TiB _2, ZrB _2, CrB ₂ A three-dimensional assembly apparatus for minute objects, characterized in that it is placed as a probe made of material . 4. The probe (5) according to claim 3, wherein the probe (5) prevents inevitable probe wear due to long-term use, including discharge, blunting of the tip and interruption of the work due to probe replacement work, and the work is continued for a long time. In order to perform the same under the same electrical conditions, a micro three-dimensional assembly apparatus is equipped with a probe delivery machine in which the same wire diameter is wound on a reel, and is a sent out probe .