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JP3796969B2 - Ultrasonic sensor - Google Patents
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JP3796969B2 - Ultrasonic sensor - Google Patents

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Publication number
JP3796969B2
JP3796969B2 JP18633998A JP18633998A JP3796969B2 JP 3796969 B2 JP3796969 B2 JP 3796969B2 JP 18633998 A JP18633998 A JP 18633998A JP 18633998 A JP18633998 A JP 18633998A JP 3796969 B2 JP3796969 B2 JP 3796969B2
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JP
Japan
Prior art keywords
ultrasonic sensor
case body
cable
conductive member
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP18633998A
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Japanese (ja)
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JP2000023292A (en
Inventor
潤一 越野
昭三 大寺
英俊 岩谷
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Filing date
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Priority to JP18633998A priority Critical patent/JP3796969B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は超音波センサに関する。特に、自動車のバックソナー、コーナーソナー等に使用される超音波センサに関する。
【0002】
【従来の技術】
超音波センサは、超音波を利用してセンシングを行うものであり、圧電振動素子から超音波パルス信号を間欠的に送信し、周辺に存在する障害物からの反射波を圧電振動素子で受信することにより障害物の存在を検知したり、あるいは、超音波パルス信号を送信してから受信するまでの経過時間から障害物までの距離を演算するものである。
【0003】
この様な原理に基づいて動作する超音波センサには、遠距離の検知を可能とし、かつ微弱な反射波を外乱ノイズ等に埋もれさせることなく確実に電気信号として取り出す特性が要求される。そのためには、超音波センサの送信出力音圧と受信感度特性をともに高められるよう、振動部の振動動作を阻害しない構造を採用する必要がある。具体的には、振動部に配置される圧電振動素子に直接接続される配線については、特に細く柔らかいものを用いることが広く一般に用いられてきた。
【0004】
しかし、細く柔らかい配線を超音波センサの小さな筐体内で安定的に接続配線することは極めて困難であり、生産コストの上昇要因となり、また電気的接続の信頼性が低く、センサの特性の不安定化の原因ともなっていた。
【0005】
以上の問題点を克服するために、本発明者らは特願平10―4882号において、細く柔らかい配線を用いることなく、安定した電気的接続を作業性良く得られる超音波センサの構造を、既に提案している。
【0006】
上記出願に開示された超音波センサ51は、図5に示すように、絶縁性材料からなる略筒状をしたケース本体52の前面開口部に振動部となる金属板53を設け、当該金属板53の内面に圧電振動素子54を接合させ、ケース本体52に一体形成した一対の導電部材55の一部をそれぞれ圧電振動素子54の各電極(図示せず)に導通させた構造を有している(その他の構成については説明を省略する)。
【0007】
上述の構成の超音波センサ51において、導電部材55の一端は、上述したように、ケース本体52内部において圧電振動素子54の各電極に導通されている。そして、導電部材55の他端は、外部に直接露出する状態でケース本体52から引き出された構成となっている。
【0008】
【発明が解決しようとする課題】
しかしながら、上述の超音波センサの構成は以下の問題点を有していた。
【0009】
まず、一般に導電部材55の他端には、圧電振動素子54に駆動電圧を印加するための導電ケーブル(以下、単にケーブルと略す)56が半田付け等によって取り付けられる。ところが、導電部材55の他端は上述の通り、外部に直接露出している。このため、ケーブル56の半田付け部分も外部に露出することとなり、この結果、半田付け部分の耐湿性や耐衝撃性が劣り電気的接続の信頼性が低下する懸念があった。
【0010】
ところで、超音波センサに要求される特性として、上述の遠距離の検知能力のほか近距離の検知能力を要求される場合がある。この場合、超音波パルス信号を送信した後、センサ内の残響振動(ケース本体や内部空間等の振動)を、反射波を受信するまでにすみやかに収束させる必要がある(残響特性)。しかしながら、この点に関して上述の超音波センサでは、圧電振動素子54の振動が導電部材55を伝わり、ついにはケーブル56までをも振動させることとなり、超音波センサの残響特性が劣化する懸念があった。
【0011】
従って本発明は上述の技術的問題点を解決するためになされたのものであって、導電部材とケーブルとの半田付け部分の耐湿性や耐衝撃性に優れ、かつ、残響特性に優れた構造の超音波センサを提供することにある。
【0012】
【課題を解決するための手段】
上術の目的を達成するために、本発明の超音波センサは、絶縁性材料からなる略筒状をしたケース本体の前面開口部に振動部となる金属板を設け、当該金属板の内面に圧電振動素子を接合させ、ケース本体に一体形成した一対の導電部材の一部をそれぞれ圧電振動素子の各電極に導通させ、ケース本体の後面開口部に全周にわたる凹部を形成し、当該凹部内に導電部材を露出させ、導電部材からケーブルを導出し、当該凹部を含むケース内部を絶縁性樹脂によって封止した。
【0013】
このように、ケース本体の後面開口部に凹部を形成しその凹部内に導電部材を露出させる構造としたことにより、導電部材とケーブルとの半田付け部分は凹部内に位置することになる。そして、そのうえで該凹部を含むケース内部を絶縁性樹脂によって封止することにより、半田付け部分の耐湿性や耐衝撃性を向上させることができる。
【0014】
また、ケース内部を絶縁性樹脂で封止するに際しては、導電部材から導出するケーブルをケース本体内部で引き回してから封止することが望ましい。この様にケーブルをケース本体内部で引き回した上で樹脂封止することにより、導電部材からケーブルへと伝わる圧電振動素子の振動を該封止樹脂に吸収させ、振動を抑制することが可能になるからである。
【0015】
【発明の実施の形態】
[第1実施例、図1〜図2]
以下、本発明の第1実施例の超音波センサについて、図1、図2を参照して詳細に説明する。図1は本実施例の超音波センサを示す断面図であり、図2は樹脂封止前の超音波センサを後面開口部側から見た平面図である。
【0016】
超音波センサ1は、図1に示すように、絶縁性材料からなる略筒状をしたケース本体2の前面開口部に振動部となる金属板3を設け、当該金属板3の内面に圧電振動素子4を接合させ、ケース本体2に一体形成した一対の導電部材5の一部をそれぞれ圧電振動素子4の各電極(図示せず)に導通させた構造を有している。一般に、圧電振動素子の両主面には電極が形成されており、本実施例の超音波センサ1においては、一方の導電部材の一端が圧電振動素子4の上面側の電極と、他方の導電部材の一端が金属板3を介して圧電振動素子4の下面側の電極と、それぞれ電気的に導通している。
【0017】
ケース本体2の後面開口部には部分的に凹部9が設けられており、導電部材5の圧電振動素子4と接続されない他端が該凹部9に引き出されている。そして、凹部9に引き出された導電部材5の他端には、それぞれケーブル6が半田付け等によって取り付けられている。
【0018】
ケース本体2の内部において、圧電振動素子4の上方には例えばフェルト等からなる吸音材7が挿入配置されている。そして吸音材4上には、例えばシリコンゴムやウレタンゴム、発泡性樹脂等の弾性を有する絶縁性樹脂が充填、硬化されており、上述の凹部9を含めてケース本体2の後面開口部側が樹脂封止されている。なお、導電部材5の他端に取り付けられたケーブル6は、ケース本体内部の上記封止樹脂中で引き回された後に、ケース本体2の外部に導出されている。
【0019】
本実施例の超音波センサ1では、上述のように、ケース本体2の後面開口部に凹部9を形成し、その凹部9内に導電部材5を露出させている。そして、導電部材5とケーブル6との半田付け部分も同じく凹部9内に位置することになり、そのうえで該凹部9を含むケース内部に絶縁性樹脂8が充填されている。この結果、上述の半田付け部分も絶縁性樹脂8によって封止されることになり、ケース外部に直接露出することがないので、耐湿性や耐衝撃性を向上させることができる。
【0020】
また、ケーブル6はケース本体2内部で引き回された後に、ケース本体2の外部に導出されている。この結果、導電部材5からケーブル6へと伝わる圧電振動素子4の振動は絶縁性樹脂8中に吸収され、残響振動を抑制することができる。
【0021】
[その他の実施例]
なお、本発明の超音波センサは上述の実施例に限定されるものではない。
【0022】
例えば、第1実施例の超音波センサでは、ケース本体の後面開口部に設けられる凹部は開口部の一部分であったが、これに限らず、例えば図3に示すように、後面開口部の全周にわたって凹部19を形成しても構わない。ケース本体の材質の種類によっては、全周にわたる凹部の方が、部分的な凹部よりの形成しやすい場合も考えられるからである。
【0023】
また、第1実施例の超音波センサでは、導電部材に取り付けられたケーブルはケース本体内部で引き回された後にケース本体外に導出されていたが、これに限らず、例えば図4に示すように、半田取付部直上付近からケース本体外に導出しても、半田付け部分の耐湿性や耐衝撃性を向上させることはできる。
【0024】
【発明の効果】
上述の説明からも明らかなように、本発明の超音波センサは、ケース本体の後面開口部に凹部を形成しその凹部内に導電部材を露出させる構造としたことにより、導電部材とケーブルとの半田付け部分は凹部内に位置することになる。そして、そのうえで該凹部を含むケース内部を絶縁性樹脂によって封止することにより、半田付け部分の耐湿性や耐衝撃性を向上させることができる。
【0025】
また、ケーブルをケース本体内部で引き回した上で樹脂封止する構造としたことにより、導電部材からケーブルへと伝わる圧電振動素子の振動を該封止樹脂に吸収させ、振動を抑制することができる。この結果、超音波センサの残響特性の向上を実現できる。
【0026】
さらに、ケーブルをケース本体内部で引き回した上で樹脂封止する構造としたことにより、例えば超音波センサ製造時やユーザの取付作業時にケーブルに生じる張力を封止樹脂内に分散させることができるので、ケーブルに生じる張力による接続信頼性の低下を効果的に防ぐことができる。
【図面の簡単な説明】
【図1】 本発明の第一実施例の超音波センサの構造を示す断面図である。
【図2】 樹脂封止前の第一実施例の超音波センサを、後面開口部側から見た平面図である。
【図3】 樹脂封止前のその他の実施例の超音波センサを、後面開口部側から見た平面図である。
【図4】 また別のその他の実施例の超音波センサの構造を示す断面図である。
【図5】 従来の超音波センサの構造を示す断面図である。
【符号の説明】
1 ・・・ 超音波センサ
2 ・・・ ケース本体
3 ・・・ 金属板
4 ・・・ 圧電振動素子
5 ・・・ 導電部材
6 ・・・ 導電ケーブル
7 ・・・ 吸音材
8 ・・・ 絶縁性樹脂(封止樹脂)
9 ・・・ 凹部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an ultrasonic sensor. In particular, the present invention relates to an ultrasonic sensor used for automobile back sonar and corner sonar.
[0002]
[Prior art]
The ultrasonic sensor performs sensing using ultrasonic waves, intermittently transmits ultrasonic pulse signals from the piezoelectric vibration element, and receives reflected waves from obstacles existing in the vicinity by the piezoelectric vibration element. Thus, the presence of an obstacle is detected, or the distance to the obstacle is calculated from the elapsed time from when the ultrasonic pulse signal is transmitted to when it is received.
[0003]
An ultrasonic sensor that operates based on such a principle is required to have a characteristic that enables detection of a long distance and reliably extracts a weak reflected wave as an electric signal without being buried in disturbance noise or the like. For this purpose, it is necessary to adopt a structure that does not hinder the vibration operation of the vibration part so that both the transmission output sound pressure and the reception sensitivity characteristic of the ultrasonic sensor can be enhanced. Specifically, it has been widely and generally used that the wiring directly connected to the piezoelectric vibration element disposed in the vibrating portion is particularly thin and soft.
[0004]
However, it is extremely difficult to stably connect and connect thin and soft wiring within the small casing of an ultrasonic sensor, which causes an increase in production cost, and the reliability of electrical connection is low, resulting in unstable sensor characteristics. It was also the cause of the transformation.
[0005]
In order to overcome the above-mentioned problems, the present inventors have disclosed in Japanese Patent Application No. 10-4882 a structure of an ultrasonic sensor capable of obtaining stable electrical connection with good workability without using thin and soft wiring. Already proposed.
[0006]
As shown in FIG. 5, the ultrasonic sensor 51 disclosed in the above application is provided with a metal plate 53 serving as a vibrating portion at a front opening of a substantially cylindrical case body 52 made of an insulating material, and the metal plate The piezoelectric vibration element 54 is joined to the inner surface of 53, and a part of a pair of conductive members 55 formed integrally with the case body 52 is electrically connected to each electrode (not shown) of the piezoelectric vibration element 54. (Description of other configurations is omitted).
[0007]
In the ultrasonic sensor 51 having the above-described configuration, one end of the conductive member 55 is electrically connected to each electrode of the piezoelectric vibration element 54 inside the case body 52 as described above. The other end of the conductive member 55 is drawn from the case main body 52 in a state of being directly exposed to the outside.
[0008]
[Problems to be solved by the invention]
However, the configuration of the ultrasonic sensor described above has the following problems.
[0009]
First, a conductive cable (hereinafter simply referred to as a cable) 56 for applying a drive voltage to the piezoelectric vibration element 54 is generally attached to the other end of the conductive member 55 by soldering or the like. However, the other end of the conductive member 55 is directly exposed to the outside as described above. For this reason, the soldered portion of the cable 56 is also exposed to the outside. As a result, there is a concern that the moisture resistance and impact resistance of the soldered portion are inferior and the reliability of electrical connection is lowered.
[0010]
By the way, as a characteristic required for an ultrasonic sensor, in addition to the above-described long-distance detection capability, a short-distance detection capability may be required. In this case, after transmitting the ultrasonic pulse signal, it is necessary to quickly converge the reverberation vibration (vibration of the case main body and the internal space) in the sensor before receiving the reflected wave (reverberation characteristics). However, in this respect, in the above-described ultrasonic sensor, the vibration of the piezoelectric vibration element 54 is transmitted through the conductive member 55, and finally the cable 56 is also vibrated, and there is a concern that the reverberation characteristics of the ultrasonic sensor are deteriorated. .
[0011]
Therefore, the present invention has been made to solve the above technical problems, and is excellent in the moisture resistance and impact resistance of the soldered portion between the conductive member and the cable, and has a structure having excellent reverberation characteristics. It is to provide an acoustic wave sensor.
[0012]
[Means for Solving the Problems]
In order to achieve the purpose of the above operation, the ultrasonic sensor of the present invention is provided with a metal plate serving as a vibration part at the front opening of a substantially cylindrical case body made of an insulating material, and the inner surface of the metal plate. A piezoelectric vibration element is joined, a part of a pair of conductive members formed integrally with the case body is electrically connected to each electrode of the piezoelectric vibration element, and a recess is formed around the entire periphery of the opening on the rear surface of the case body. The conductive member was exposed, the cable was led out from the conductive member, and the inside of the case including the concave portion was sealed with an insulating resin.
[0013]
Thus, by forming a recess in the rear surface opening of the case body and exposing the conductive member in the recess, the soldered portion between the conductive member and the cable is located in the recess. Further, by sealing the inside of the case including the recess with an insulating resin, the moisture resistance and impact resistance of the soldered portion can be improved.
[0014]
Further, when sealing the inside of the case with an insulating resin, it is desirable that the cable led out from the conductive member is routed inside the case body before sealing. In this way, the cable is routed inside the case body and then resin-sealed, so that the vibration of the piezoelectric vibration element transmitted from the conductive member to the cable can be absorbed by the sealing resin and the vibration can be suppressed. Because.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
[First embodiment, FIGS. 1 to 2]
Hereinafter, the ultrasonic sensor according to the first embodiment of the present invention will be described in detail with reference to FIGS. FIG. 1 is a cross-sectional view showing the ultrasonic sensor of this embodiment, and FIG. 2 is a plan view of the ultrasonic sensor before resin sealing when viewed from the rear opening side.
[0016]
As shown in FIG. 1, the ultrasonic sensor 1 is provided with a metal plate 3 serving as a vibrating portion at a front opening of a substantially cylindrical case body 2 made of an insulating material, and piezoelectric vibration is provided on the inner surface of the metal plate 3. The element 4 is joined, and a part of the pair of conductive members 5 formed integrally with the case body 2 is electrically connected to each electrode (not shown) of the piezoelectric vibration element 4. In general, electrodes are formed on both main surfaces of the piezoelectric vibration element. In the ultrasonic sensor 1 of the present embodiment, one end of one conductive member is connected to the electrode on the upper surface side of the piezoelectric vibration element 4 and the other conductivity. One end of the member is electrically connected to the electrode on the lower surface side of the piezoelectric vibration element 4 through the metal plate 3.
[0017]
A recess 9 is partially provided in the rear surface opening of the case body 2, and the other end of the conductive member 5 not connected to the piezoelectric vibration element 4 is drawn out to the recess 9. The cables 6 are attached to the other ends of the conductive members 5 drawn out to the recesses 9 by soldering or the like.
[0018]
Inside the case body 2, a sound absorbing material 7 made of felt or the like is inserted and disposed above the piezoelectric vibration element 4. The sound absorbing material 4 is filled and hardened with an insulating resin having elasticity such as silicon rubber, urethane rubber, foaming resin, etc., and the rear surface opening side of the case body 2 including the concave portion 9 is resin. It is sealed. The cable 6 attached to the other end of the conductive member 5 is led out of the case body 2 after being routed in the sealing resin inside the case body.
[0019]
In the ultrasonic sensor 1 according to the present embodiment, as described above, the recess 9 is formed in the rear surface opening of the case body 2, and the conductive member 5 is exposed in the recess 9. And the soldering part of the electrically-conductive member 5 and the cable 6 will also be located in the recessed part 9, and the inside of the case containing this recessed part 9 is filled with the insulating resin 8. As a result, the above-described soldered portion is also sealed with the insulating resin 8 and is not directly exposed to the outside of the case, so that moisture resistance and impact resistance can be improved.
[0020]
The cable 6 is led out of the case body 2 after being routed inside the case body 2. As a result, the vibration of the piezoelectric vibration element 4 transmitted from the conductive member 5 to the cable 6 is absorbed in the insulating resin 8, and reverberation vibration can be suppressed.
[0021]
[Other Examples]
The ultrasonic sensor of the present invention is not limited to the above-described embodiment.
[0022]
For example, in the ultrasonic sensor of the first embodiment, the recess provided in the rear opening of the case body is a part of the opening. However, the present invention is not limited to this, for example, as shown in FIG. The recess 19 may be formed over the circumference. This is because, depending on the type of material of the case main body, it is conceivable that the concave portion over the entire circumference is easier to form than the partial concave portion.
[0023]
In the ultrasonic sensor of the first embodiment, the cable attached to the conductive member is led out of the case main body after being routed inside the case main body. However, the present invention is not limited to this. For example, as shown in FIG. Furthermore, even if it leads out of the case main body from the vicinity immediately above the solder mounting portion, the moisture resistance and impact resistance of the soldered portion can be improved.
[0024]
【The invention's effect】
As is apparent from the above description, the ultrasonic sensor of the present invention has a structure in which a recess is formed in the rear surface opening of the case body and the conductive member is exposed in the recess, so that the conductive member and the cable are connected to each other. The soldered portion is located in the recess. Further, by sealing the inside of the case including the recess with an insulating resin, the moisture resistance and impact resistance of the soldered portion can be improved.
[0025]
Further, by adopting a structure in which the cable is routed inside the case main body and sealed with resin, the vibration of the piezoelectric vibration element transmitted from the conductive member to the cable can be absorbed by the sealing resin and vibration can be suppressed. . As a result, the reverberation characteristics of the ultrasonic sensor can be improved.
[0026]
Furthermore, since the cable is routed inside the case body and then resin-sealed, the tension generated in the cable can be dispersed in the sealing resin, for example, during ultrasonic sensor manufacturing or user installation work. It is possible to effectively prevent a decrease in connection reliability due to the tension generated in the cable.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing the structure of an ultrasonic sensor according to a first embodiment of the present invention.
FIG. 2 is a plan view of the ultrasonic sensor according to the first embodiment before resin sealing when viewed from the rear opening side.
FIG. 3 is a plan view of an ultrasonic sensor of another embodiment before resin sealing as viewed from the rear opening side.
FIG. 4 is a cross-sectional view showing the structure of an ultrasonic sensor according to another embodiment.
FIG. 5 is a cross-sectional view showing the structure of a conventional ultrasonic sensor.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ultrasonic sensor 2 ... Case main body 3 ... Metal plate 4 ... Piezoelectric vibration element 5 ... Conductive member 6 ... Conductive cable 7 ... Sound-absorbing material 8 ... Insulating property Resin (sealing resin)
9: Recess

Claims (2)

絶縁性材料からなる略筒状をしたケース本体の前面開口部に振動部となる金属板を設け、当該金属板の内面に圧電振動素子を接合させ、ケース本体に一体形成した一対の導電部材の一部をそれぞれ圧電振動素子の各電極に導通させ、ケース本体の後面開口部に全周にわたる凹部を形成し、当該凹部内に導電部材を露出させ、導電部材からケーブルを導出し、当該凹部を含むケース内部を絶縁性樹脂によって封止したことを特徴とする超音波センサ。A metal plate serving as a vibration part is provided at the front opening of a substantially cylindrical case body made of an insulating material, a piezoelectric vibration element is joined to the inner surface of the metal plate, and a pair of conductive members integrally formed on the case body. A part is electrically connected to each electrode of the piezoelectric vibration element, a recess is formed in the rear opening of the case body over the entire circumference , the conductive member is exposed in the recess, a cable is led out from the conductive member, and the recess is An ultrasonic sensor characterized in that the inside of a case is sealed with an insulating resin. 前記ケーブルが、ケース本体内部で引き回されてケース本体外に導出されていることを特徴とする超音波センサ。  An ultrasonic sensor, wherein the cable is routed inside the case body and led out of the case body.
JP18633998A 1998-07-01 1998-07-01 Ultrasonic sensor Expired - Fee Related JP3796969B2 (en)

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DE10158015B4 (en) * 2001-11-27 2010-10-14 Hydrometer Gmbh Ultrasonic transducer and flow meter
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