JP3800957B2 - Wire joining device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wire joining apparatus for joining a wire (insulating film conductor) in an electronic component to an electrode.
[0002]
[Prior art]
In the conventional wire rod bonding in the coil component, one side of the electrode is held on the bottom surface by a fixed chuck, and the other side electrode is held by a backup from below to perform the bonding.
[0003]
Hereinafter, a wire joining device for a coil component which is a conventional electronic component will be described with reference to the drawings. FIG. 6 is a perspective view of a conventional wire joining device for coil parts.
[0004]
As shown in FIG. 6, the side surfaces of the coil 2 formed by winding the insulating coating conductor 1 as a wire material include electrodes 26 and 27 by a chuck 28 including an opening / closing claw 21 that is rotatable by a fixed claw 23 and a shaft 22. The bottom surface of the coil 2 is held by the tip portion of the fixed claw 23.
[0005]
In the winding process, which is a pre-process of the joining process, when the insulating film conductor 1 is wound to form the coil 2, if there is a fixed holder on the entire bottom surface of the coil 2, interference with the insulating film conductor 1 occurs. Winding and installation cannot be performed.
[0006]
Therefore, the bottom surface of the coil 2 is held only by the bottom surface of the electrode 27 on one side, the heater chip 24 descends from above at the time of joining, and from below the top and bottom of the electrode 26 whose bottom surface is not retained by the fixing claw 23. The movable backup 25 is raised, and the electrodes 26 and 27 and the insulating coating conductor 1 are heated and pressure-bonded.
[0007]
[Problems to be solved by the invention]
However, in the conventional wire rod joining device, different pressures are applied to the two electrodes. That is, the pressing force applied to the electrode 26 held by the backup 25 must be set lower than the pressing force applied to the electrode 27 held by the opening / closing claw 21 and the fixed claw 23. The electrodes 26 and 27 have a problem that it is difficult to maintain the same bonding quality.
[0008]
The present invention is intended to solve the above-described problems, and an object of the present invention is to provide a wire bonding apparatus that can reliably bond an insulating coating wire and an electrode with high quality.
[0009]
[Means for Solving the Problems]
Wire bonding apparatus of the present invention to solve the above problems, a strong holding force in addition to the time of bonding weakens freely varies the holding force at the time of bonding the holding force comprising a fixed pawl and variable claws for gripping the end side of the workpiece A chuck that has a workpiece, holds the bottom of the workpiece , retreats before the heater chip moves down and returns to its original position after joining, and a pair that is movable and presses both electrodes of the workpiece independently. and a backup pin, wherein it both electrodes and wire of backup pins opposite to the work intended to thermocompression bonding by a heater chip, it is possible to join the two electrodes and the wires of the workpiece uniformly and reliably.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present invention is a chuck having a strong holding force other than at the time of joining. , a slider to return to the retracted joined ends after the original position before the mounting to the heater chip retains its bottom a workpiece is moved drops, and a backup pin pairs for pressing independently both electrodes of the movable work wherein said is both electrodes and wire of backup pins opposite to the workpiece obtained by the wire bonding apparatus for thermocompression bonding by a heater chip, as well as reliably bonded to the electrodes and wires of the workpiece, the gripping force other than during bonding There is an effect that it is possible to raise and stabilize the work holding.
[0011]
The invention described in claim 2 is the wire rod joining apparatus according to claim 1, wherein the slider is provided with a recess notch through which a backup pin is inserted at the tip, and the workpiece posture is maintained during the joining operation. It has the effect of improving.
[0012]
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a wire joining apparatus using coil components according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a side view thereof, FIG. 4 is a side view of the joint portion, and FIG. It is a perspective view of a coil component.
[0013]
In FIG. 5, as described in the prior art, reference numeral 1 denotes an insulating film conductor which is a wire, and 2 denotes a coil which is a work formed by winding the insulating film conductor 1. The electrode 15 and the electrode 16 for attachment and connection made of a conductive material are formed and joined to the insulating film conductor 1.
[0014]
1-4, 3 is a fixed claw, 11 is a movable slider which mounts the coil 2 and hold | maintains on the bottom face, and is connected and connected to the lower part of the front-end | tip of the fixed claw 3. As shown in FIG.
[0015]
Reference numeral 4 denotes an inverted L-shaped open / close claw corresponding to the fixed claw 3, and the tip of the fixed claw 3 constitutes a chuck 17 that holds the end side surface portion of the coil 2.
[0016]
The opening / closing claw 4 is pivotable about the fulcrum pin 5, pivoted and opened by the restoring force of the compression spring 9, and rotated against the restoring force of the compression spring 9 by the driving force of the cylinder 8. Closed.
[0017]
Reference numeral 6 denotes a plate on which the fixed claw 3, the cylinder 8 and the slider 11 are installed and held. The end side surface of the coil 2 is gripped by a chuck 17 formed by a fixed claw 3 and an opening / closing claw 4, the bottom surface of the coil 2 is held on the top surface of the tip of the slider 11, and the slider 11 has a pin 10 attached to the other end. It moves by driving (a driving mechanism is not shown).
[0018]
Further, the tip of the slider 11 is normally pressed by the restoring force of the compression spring 12 to move linearly, and the coil 2 is mounted and held to maintain the set posture.
[0019]
Reference numeral 7 is a pin that is connected to the cylinder 8 and is reciprocally movable. When the cylinder 8 is driven, the tip of the pin 7 is slidably brought into contact with the end of the opening / closing claw 4, and the opening / closing claw 4 is centered on the fulcrum pin 5. Rotate.
[0020]
Reference numeral 14 denotes a movable heater chip for heating and press-bonding the insulating coating conductor 1 and the electrodes 15 and 16 as a wire material, and 13 is a pair of backup pins movable at the electrode pitch of the coil 2. 2 is backed up by pressing from the bottom.
[0021]
Next, the operation of the wire joining apparatus configured as described above will be described. First, after the slider 11 that has been mounted while holding the bottom surface of the coil 2 that is the workpiece gripped by the chuck 17 is moved and retracted, the heater chip 14 is moved and lowered, and the position closest to the upper surface of the coil 2 is reached. Stop at.
[0022]
The backup pin 13 moves up to the bottom surface of the coil 2 and stops a little later than the timing when the heater chip 14 stops.
[0023]
The stop of the backup pin 13 does not directly give an impact to the coil 2, and thereafter, the movement of the backup pin 13 is further moved and the coil 2 is pressed against the heater chip 14 to regulate the movement of the workpiece and the slight vibration. And an appropriate joining operation is performed.
[0024]
Next, the backup pin 13 is further moved up and raised again, and the insulating film conductor 1 and the electrode portions 15 and 16 are heat-pressed by the heater chip 14, and the insulating film of the insulating film conductor 1 is melted and evaporated to be removed. And joining.
[0025]
After the joining is completed, the heater chip 14 is also moved up and down following the movement and lowering of the backup pin 13, and the tip of the slider 11 is returned to the original bottom surface position of the coil 2 to mount and hold the coil 2 and maintain the posture. To do.
[0026]
When the backup pin 13 moves up and presses and presses the electrodes 15 and 16 of the coil 2 against the heater chip 14, the force with which the opening / closing claw 4 closes is increased, so that the electrode 15 is held between them. The frictional force works, the coil 2 does not move, and the pressure-bonding force between the insulating film conductor 1 and the electrodes 15 and 16 becomes weak.
[0027]
On the other hand, the holding of the coil 2 becomes more stable as the holding force of the opening / closing claw 4, that is, the closing force becomes stronger. Therefore, in order to vary the opening / closing force in gripping the coil 2, the thrust (driving force) of the cylinder 8 is changed. Thus, the closing force of the opening / closing claw 4 is generated. That is, the thrust of the cylinder 8 is lowered ( reducing the holding force) at the time of joining the insulating coating wire 1 and the electrodes 15, 16, and the thrust is increased at other times, and the optimum gripping and joining operation by the holding force of the chuck 17 is performed. Is doing.
[0028]
In addition, a recess notch may be provided at the tip of the slider 11, and the recess notch may be inserted through the tip of the backup pin 13. The amount of movement of the slider 11 can be reduced and the posture of the coil 2 can be maintained. Further improved during the bonding operation.
[0029]
【The invention's effect】
As described above, the wire joining apparatus according to the present invention appropriately and reliably holds the workpiece (coil) and joins the insulation coating conductor and the electrode uniformly and reliably when joining the insulation coating conductor and the electrode as the wire. There is an effect that can be.
[Brief description of the drawings]
FIG. 1 is a perspective view of an apparatus for joining wire members in a coil component according to an embodiment of the present invention. FIG. 2 is a plan view. FIG. 3 is a side view. FIG. 6 is a perspective view of a conventional wire joining apparatus for coil parts.
1 Insulating film conductor (wire)
2 Coil (work)
3 Fixing Claw 4 Opening / Closing Claw 5 Supporting Pin 6 Plate 7 Contact Pin 8 Cylinder 9 Compression Spring 10 Pin 11 Slider 12 Compression Spring 13 Backup Pin 14 Heater Chips 15 and 16 Electrode 17 Chuck

Claims (2)

A chuck having a strong holding force in addition to the time of bonding weakening the holding force during end side freely variable holding force comprising a fixed pawl and variable claws gripping the bonding work, equipped with a work holding the bottom heater chip a slider but to return to the retracted joined ends after the original position before moving drop independently both electrodes of the movable workpiece and a backup pin pairs for pressing, and the electrodes of the backup pins facing to the workpiece A wire joining device that heat-presses a wire with a heater chip .   The wire joining apparatus according to claim 1, wherein a slider having a recess cut through which a backup pin is inserted is used at the tip.

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