JP3803490B2 - Semiconductor device clamping mechanism - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device clamping mechanism, and more particularly to a semiconductor device clamping mechanism that can position a heat sink and a substrate with high accuracy and can cope with a difference in substrate dimensions.
[0002]
[Prior art]
Conventionally, a heat sink is mounted on the heater block, solder and flux are applied on the heater block, and after the solder is melted, a board on which electronic components and leads are mounted is mounted on the heat sink and moved in the front-rear direction. The semiconductor device was manufactured by gripping the substrate with a clamping jig and transferring it to a transfer tray and performing natural cooling. This process was performed manually.
[0003]
[Problems to be solved by the invention]
However, since the above process is performed manually, heat is radiated by the clamp jig when the clamp jig is sandwiched, and the solder is solidified.
[0004]
For this reason, there has been a problem that if the substrate is not accurately gripped by the clamping jig, the substrate is displaced and lifted. In addition, if the electronic components of the board are changed, the dimensions of the board may change. However, since the clamp jig can only position the board with a certain size, several types of clamp jigs corresponding to the board dimensions can be used. It had to be prepared and was complicated.
[0005]
Accordingly, the present invention has been made in view of the above-described problems in the prior art, and a semiconductor device clamping mechanism that can prevent occurrence of displacement and floating of the substrate and can cope with changes in the size of the substrate. The purpose is to provide.
[0006]
[Means for Solving the Problems]
The invention according to claim 1 is a semiconductor device clamping mechanism for positioning and soldering a substrate on which electronic components are mounted with respect to a heat sink, the fixing means for fixing the heat sink, and the fixing means is composed of a clamp portion for clamping the movable plate movable relative to, the substrate can be moved in the opposite direction with respect to the radial direction and the radial direction from the center portion of the movable plate relative to, the clamp portion Is a shaft having a guide roller that engages with each of a long hole extending in the radial direction in the movable plate and a long hole formed in the clamp portion guide block movable relative to the movable plate. It is characterized by being fixed to .
[0008]
The invention according to claim 2 is characterized in that the clamp part includes a stopper part capable of abutting against a side surface of the heat sink.
[0011]
According to the first aspect of the present invention, the clamp portion includes a long hole extending in the radial direction in the movable plate, and a length formed in the clamp portion guide block that is movable relative to the movable plate. The clamp part is fixed to a shaft having a guide roller that engages with each of the holes, and the clamp part guide block is moved relative to the movable plate, whereby the clamp part is radiated from the central part of the movable plate. And can be moved in the opposite direction to the radiation direction.
[0012]
According to the second aspect of the present invention, since the clamp portion includes a stopper portion that can come into contact with the heat sink, the positional relationship between the side surface of the substrate and the side surface of the heat sink can be defined to improve the dimensional accuracy. it can.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Next, a specific example of an embodiment of a semiconductor device clamping mechanism according to the present invention will be described with reference to the drawings.
[0015]
FIG. 2 is a schematic view showing a semiconductor device to which the semiconductor device clamping mechanism according to the present invention is applied. The semiconductor device 30 includes a heat sink 31, an electronic component 32, and a substrate 33. A heat sink 31 and an electronic component 32 are mounted. The semiconductor device clamping mechanism according to the present invention is used to hold the substrate 33 and solder the substrate 33 on which the electronic component 32 is mounted on the positioned heat sink 31.
[0016]
FIG. 1 is an exploded perspective view showing a semiconductor device clamping mechanism according to the present invention. The semiconductor device clamping mechanism 1 includes a heat sink positioning claw 19 as a fixing means for fixing a heat sink 31, and the heat sink positioning claw. The first plate 2 is movable relative to the first plate 2, and the clamp portion 15 is used to hold the substrate 33 that is movable in the radial direction from the center of the first plate 2 and in the opposite direction to the radial direction. Is done.
[0017]
The first plate 2 is formed in a rectangular shape, and includes first slide guides 4A and 4B in the vicinity of the upper side and the lower side, respectively.
[0018]
The first slide guide 4A includes a fixed portion 8A fixed to the first plate 2 and a slider 9A that can slide along the fixed portion 8A. Similarly, the first slide guide 4B is fixed to the fixed portion 8B. And a slider 9B.
[0019]
The clamp part guide block 6 (6A, 6B) is a rectangular plate-shaped member, and has two long holes 7 extending in the longitudinal direction. And this clamp part induction | guidance | derivation block 6A, 6B is fixed on the above-mentioned slider 9A, 9B. That is, the clamp part guide block 6A has an upper part 6A ′ fixed to the slider 9A and a lower part 6A ″ fixed to the slider 9B, and the clamp part guide block 6B is also fixed on the sliders 9A and 9B in the same manner as the clamp part guide block 6A. Thereby, the clamp part guide blocks 6A and 6B can slide along the fixed parts 8A and 8B of the first slide guide 4 together with the sliders 9A and 9B.
[0020]
The first plate 2 is formed with four long holes 10 extending from each corner toward the center.
[0021]
Further, the first plate 2 is provided with four clamp members 11. The clamp member 11 includes a first guide roller 12 attached to the shaft 14, a second guide roller 13, and a clamp portion 15 provided at the lower end portion of the shaft 14.
[0022]
The clamp member 11 is engaged with the first plate 2 such that the first guide roller 12 engages with the long hole 7 of the clamp portion guide block 6 and the second guide roller 13 engages with the long hole 10 of the first plate 2. The first guide roller 12 moves along the long hole 7 and the second guide roller 13 moves along the long hole 10 by opening and closing the clamp part guide block 6 left and right. Accordingly, the clamp portion 15 is configured to be movable from each corner portion toward the center.
[0023]
The two clamp members 11 including the clamp member 11 </ b> A are provided with a stopper portion 20 at a lower end portion of a portion extending below the clamp portion 15.
[0024]
Further, on the back side of the first plate 2, an elastic silicon rubber 16 is provided as a biasing means for biasing the substrate to the heat sink.
[0025]
On the other hand, the 2nd plate 3 is formed in the frame shape which has the opening part 3a, and the 2nd slide guide 5 (5A, 5B) is provided in the upper side and lower side vicinity, respectively.
[0026]
The second slide guide 5A includes a fixed portion 17A fixed to the second plate 3 and a slider 18A that can slide along the fixed portion 17A. Similarly, the first slide guide 5B has a fixed portion 17B. And a slider 18B. Then, by attaching the first plate 2 to the sliders 18A and 18B, the first plate 2 can move laterally along the fixing portions 17A and 17B.
[0027]
Further, the second plate 3 is provided with heat sink positioning claws 19 on the left and right rear surfaces.
[0028]
Next, the operation of the semiconductor device clamping mechanism 1 having the above configuration will be described with reference to FIGS.
[0029]
First, the heat sink 31 is fixed by the heat sink positioning claw 19 provided on the second plate 3.
[0030]
Next, when the clamp part guide block 6 fixed on the first slide guide 4 attached to the first plate 2 is opened left and right, the first guide roller 12 moves along the long hole 7 and 2 The guide roller 13 moves along the long hole 10, and the clamp part 15 moves toward each corner | angular part from the center part of the 1st plate 2 in connection with this.
[0031]
When the substrate 33 is positioned below the first plate 2 and the clamp guide block 6 is closed, the first guide roller 12 moves along the long hole 7 and the second guide roller 13 moves to the long hole 10. As shown in FIG. 3A, the clamp portion 15 moves in the X direction from each corner portion of the first plate 2 toward the center portion, and the substrate 33 is gripped by the clamp portion 15.
[0032]
The first plate 2 is moved relative to the second plate 3 while the substrate 33 is held by the clamp portion 15, and the substrate 33 is positioned with respect to the heat sink 31. At this time, since the two clamp members 11 are provided with the stopper portion 20 below the clamp portion 15, the stopper portion 20 contacts the side surface of the heat sink 31, and the side surface of the substrate 33 and the side surface of the heat sink 31. It is possible to improve the dimensional accuracy.
[0033]
When the positioning of the substrate 33 with respect to the heat sink 31 is completed, the substrate 33 is soldered to the heat sink 31 while pressing the substrate 33 against the heat sink 31 by the silicon rubber 16 provided on the back surface of the first plate 2. Thereby, the floating of the substrate 33 during soldering can be prevented.
[0034]
In addition, by opening and closing the clamp part guide block 6 fixed on the first slide guide 4 attached to the first plate 2, the clamp part 15 moves from the center part of the first plate 2 toward each corner part. Or, it moves in the opposite direction and the substrate 33 is gripped by the clamp portion 15, so that it is possible to cope with a change in the size of the substrate 33.
[0036]
【The invention's effect】
As described above , according to the first aspect of the present invention, the clamp portion is moved in the radial direction and the radial direction from the center portion of the movable plate by moving the clamp portion guide block relative to the movable plate. On the other hand, since it can be moved in the opposite direction, it is possible to provide a semiconductor device clamping mechanism capable of achieving the above-described effects with a simple configuration.
[0037]
According to invention of Claim 2, the semiconductor device clamp mechanism which can improve the dimensional accuracy between a board | substrate and a heat sink can be provided.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a semiconductor device clamping mechanism according to the present invention.
FIG. 2 is a schematic view showing a semiconductor device to which a semiconductor device clamping mechanism according to the present invention is applied.
3A and 3B are explanatory views of the operation of the semiconductor device clamping mechanism of FIG. 1, wherein FIG. 3A is a partially broken schematic plan view, and FIG. 3B is a schematic front view;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor device clamping mechanism 2 1st plate 3 2nd plate 4 1st slide guide 5 2nd slide guide 6 Clamp part guide block 7 Long hole 8 Fixing part 9 Slider 10 Long hole 11 Clamp member 12 1st guide roller 13 2nd Guide roller 14 Shaft 15 Clamp part 16 Silicon rubber 17 Fixed part 18 Slider 19 Heat sink positioning claw 20 Stopper part

Claims (2)

A semiconductor device clamping mechanism for positioning and soldering a substrate on which electronic components are mounted with respect to a heat sink,
Fixing means for fixing the heat sink;
A movable plate movable relative to the fixing means;
A clamp portion for gripping the substrate that is movable in the radial direction and in the opposite direction to the radial direction from the central portion of the movable plate;
The clamp portion engages with each of a long hole extending in the radial direction in the movable plate and a long hole formed in the clamp portion guide block movable relative to the movable plate. A semiconductor device clamping mechanism fixed to a shaft having The clamping portion, the semiconductor device clamping mechanism according to claim 1, further comprising a side surface contactable stopper portion of the heat sink.

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