JP3817046B2 - Board inspection equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board inspection apparatus that takes in an image of a surface of a circuit board that has been carried in with a camera, carries out the circuit board after taking in the image, and inspects the circuit board based on the taken-in image.
[0002]
[Prior art]
In order to inspect a circuit board, in general, circuit boards are sequentially carried into the board inspection apparatus one by one, and the carried circuit boards are arranged in a direction perpendicular to the arrangement direction of the light receiving elements using, for example, a one-dimensional CCD camera. The circuit board is scanned to capture the image of the circuit board, the circuit board after the image capture is taken out from the board inspection apparatus, and pattern matching between image data representing the captured image and reference data prepared in advance is performed. As a result, the wiring pattern on the circuit board is inspected for defects such as disconnection and short circuit.
[0003]
[Problems to be solved by the invention]
In recent years, image processing technology has also advanced, and the inspection of circuit boards by pattern matching after image capture has been considerably accelerated. However, the circuit board is carried into a board inspection apparatus, and the carried circuit board is The mechanical operating speed of scanning with a CCD camera to capture an image, and unloading the circuit board after the image capture from the board inspection apparatus shortens the inspection time per circuit board, and allows a large number of circuit boards to be This is a bottleneck in increasing inspection efficiency.
[0004]
In view of the above circumstances, an object of the present invention is to provide a substrate inspection apparatus in which the inspection time is shortened.
[0005]
[Means for Solving the Problems]
The substrate inspection apparatus of the present invention that achieves the above object is
In a board inspection apparatus that takes in an image of the surface of a circuit board that has been carried in with a camera and carries out the circuit board after the image has been taken in, and inspects the circuit board based on the taken-in image,
(1) Among the carry-in position for receiving the loaded circuit boards, the inspection position for taking in the image of the circuit board surface, and the carry-out position for carrying out the circuit board after taking in the images, arranged in a predetermined first direction, A carry-in body that reciprocates between the carry-in position and the inspection position and receives the carried circuit board at the carry-in position and transports it to the inspection position. (2) A predetermined first crossing with respect to the first direction. A camera having a plurality of light receiving elements arranged in two directions, wherein the inspection body is moved in the first direction in synchronization with the movement of the carrying body in the first direction, and the inspection position is moved by the carrying body. A camera that scans the circuit board conveyed to the first direction when the carry-in body returns from the inspection position to the carry-in position and captures an image of the surface of the circuit board. (3) Movement of the carry-in body Synchronously with the inspection position and the carrying An unloading body that reciprocates between positions and receives the circuit board after image capture at the inspection position and transports it to the unloading position. (4) Board inspection for inspecting the circuit board based on the image captured by the camera. It has the part.
[0006]
The substrate inspection apparatus of the present invention has a plurality of light receiving elements arranged in a predetermined second direction intersecting with a first direction in which circuit boards are arranged, and this first direction is synchronized with the movement of the carry-in body. When the loaded body returns from the inspection position to the loading position, the camera moving to the position scans in the first direction and captures an image of the surface of the circuit board conveyed to the inspection position. That is, the camera scans the circuit board when moving the carry-in body. Thereby, the circuit board is inspected in a short time independently of the movement of the carry-in body, that is, in comparison with the case where the carry-in body waits until the carry-out body moves off the inspection position and scans with the camera.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a side view showing a schematic configuration of a substrate inspection apparatus according to the present invention, and FIG. 2 is a top view thereof.
Between the outside of the board inspection apparatus 10 and the carry-in position A for receiving the loaded circuit board, as shown in FIG. 2, two carry-in extending in the x direction are carried to the carry-in position A. A conveyor 21 is installed. The circuit board is placed on the two carry-in conveyors 21 and conveyed to the carry-in position A. As will be described later, the board inspection apparatus 10 receives a circuit board at the carry-in position A, conveys the circuit board received at the carry-in position A to an inspection position B for capturing an image of the circuit board surface, and performs this inspection. The circuit board is placed on the inspection table 23 fixed at the position B. Thereafter, an image of the surface of the circuit board placed on the inspection table 23 is captured, and the circuit board is inspected based on the captured image. In addition, the board inspection apparatus 10 conveys the circuit board after the image capture to the carry-out position C where the circuit board after the image capture is carried out. Between the carry-out position C and the outside of the board inspection apparatus 10, two carry-out conveyors 22 extending in the x direction for carrying out circuit boards from the board inspection apparatus 10 are installed as shown in FIG. When the circuit board is conveyed to the unloading position C, the circuit board is placed on the two unloading conveyors 22 and unloaded from the board inspection apparatus 10.
[0008]
Hereinafter, an operation until the circuit board carried into the board inspection apparatus 10 is carried out from the board inspection apparatus 10 will be described.
As shown in FIG. 1, the board inspection apparatus 10 includes a carry-in pad 11 and a carry-in pad vertical movement mechanism 12 that moves the carry-in pad 11 in the vertical direction (z direction shown in FIG. 1). The carry-in pad 11 and the carry-in pad vertical movement mechanism 12 move along the guide rail 24 (see FIG. 2. Note that the carry-in pad vertical movement mechanism 12 is not shown in FIG. 2. In the following, when the top view of the substrate inspection apparatus 10 is shown, the carry-in pad vertical movement mechanism 12 is not shown.) The carry-in pad 11 reciprocates between the carry-in position A and the inspection position B. Then, when the circuit board carried into the board inspection apparatus 10 is received at the carry-in position A, it is transported to the inspection position B.
[0009]
3 is a top view of the carry-in pad when the carry-in pad is viewed from the carry-in position A in the substrate inspection apparatus shown in FIGS. 1 and 2, and FIG. 4 is a view of the carry-in pad from the direction of arrow a shown in FIG. FIG.
The carry-in pad 11 has two grooves 32 extending in the x direction so as to divide the carry-in pad 11 into three. The carry-in pad 11 has four grooves 33 extending in the y direction. The groove 32 is located directly below the two carry-in conveyors 21 as shown in FIG. The grooves 32 and 33 are provided with pins 31 for adjusting the position of the circuit board conveyed to the carry-in position A. The operation of this pin 31 will be described later.
[0010]
FIG. 5 is a top view of the carry-in pad when the circuit board is conveyed to the carry-in position A by the carry-in conveyor, and FIG. 6 is a view of the carry-in pad from the direction of arrow a shown in FIG.
As shown in FIG. 5, when the circuit board 34 is conveyed to the loading position A by the carry-in conveyor 21, the rotation of the two carry-in conveyors 21 is stopped, and the carry-in pad vertical movement mechanism 12 (see FIG. 1) carries the carry-in pad. 11 rises and the carry-in pad 11 receives the circuit board 34.
[0011]
FIG. 7 is a top view showing the carry-in pad that has received the circuit board, and FIG. 8 is a view of the carry-in pad viewed from the direction of arrow a shown in FIG.
3 to 6, the pin 31 is disposed horizontally with respect to the surface of the carry-in pad 11. However, when the carry-in pad 11 receives the circuit board 34 due to the rise of the carry-in pad 11, the pin 31 is 7, get up vertically as shown in FIG. As a result, as shown in FIG. 5, even if the circuit board 34 is transported to a position slightly shifted from directly above the carry-in pad 11, the circuit board 34 is roughly positioned so as to move directly above the carry-in pad 11. .
[0012]
When the carry-in pad 11 receives the circuit board 34 as shown in FIG. 7, the carry-in pad 11 moves to the inspection position B.
Further, the substrate inspection apparatus 10 has a plurality of light receiving elements arranged in a direction perpendicular to the paper surface shown in FIG. 1 (perpendicular to the x direction shown in FIG. 1) and transported to the inspection position B. A CCD camera 14 for capturing the images is provided. The CCD camera 14 is provided with LEDs (not shown) that are arranged in a direction perpendicular to the paper surface shown in FIG. 1 and that illuminate the circuit board from above when capturing an image on the circuit board surface. Below the CCD camera 14, there are provided LEDs 15 which are arranged in a direction perpendicular to the paper surface shown in FIG. 1 and illuminate the circuit board from below when an image on the surface of the circuit board is captured. The CCD camera 14 is attached to two guide rails 24 as shown in FIG. 2, and the LED 15 is also attached to the two guide rails 24. The CCD camera 14 and the LED 15 are connected to the carry-in pad 11 in the x direction. It moves in the x direction in synchronization with the movement. The operation after the carry-in pad 11 transports the circuit board to the inspection position B until the CCD camera 14 captures an image of the surface of the circuit board will be described later.
[0013]
The substrate inspection apparatus 10 also includes a carry-out pad 16 and a carry-out pad vertical movement mechanism unit 17 that moves the carry-out pad 16 in the vertical direction (z direction shown in FIG. 1). The unloading pad 16 and the unloading pad up / down moving mechanism 17 move along the guide rail 24, and the unloading pad 16 is synchronized with the movement of the unloading pad 11 to check the inspection position B and unloading position C. The circuit board after the image capture is received at the inspection position B and is transported to the transport position C. As shown in FIG. 1, the carry-out pad 16 is located at the inspection position B when the carry-in pad 11 is located at the carry-in position A.
[0014]
FIG. 9 is a top view of the carry-out pad when the carry-out pad is viewed from the inspection position B in the board inspection apparatus shown in FIGS. 1 and 2.
The carry-out pad 16 has two grooves 41 extending in the x direction so as to divide the carry-out pad 16 into three, and the grooves 41 are located directly below the inspection table 23 as shown in FIG. ing. Further, the carry-out pad 16 is the same as the operation that the carry-in pad 11 receives the circuit board described with reference to FIGS. 3 to 8 (however, the coarse positioning of the circuit board is not performed). Receive a circuit board.
[0015]
FIG. 10 is a side view showing the board inspection apparatus when the carry-in pad receives the circuit board as shown in FIG.
When the carry-in pad 11 is raised, the carry-in conveyor 21 is arranged in the groove 32 of the carry-in pad 11 as shown in FIG. 10, and when the carry-out pad 16 is raised, the inspection table 23 is arranged in the groove 41 of the carry-out pad 16. . At this time, the carry-in pad 11 receives the circuit board 34 as shown in FIG. Thereafter, the carry-in pad 11 moves to the inspection position B.
[0016]
11 is a side view showing the substrate inspection apparatus when the carry-in pad is moved to the inspection position B, FIG. 12 is a top view thereof, and FIG. 13 is a view from the inspection position B in the substrate inspection apparatus shown in FIGS. It is a top view of a carrying-in pad when seeing a carrying-in pad.
When the carry-in pad 11 receives the circuit board at the carry-in position A, the carry-in pad 11 moves to the inspection position B, and the inspection table 23 is arranged in the groove 32 of the carry-in pad 11 as shown in FIG. When the carry-in pad 11 moves to the inspection position B, the carry-out pad 16 moves to the carry-out position C, and the carry-out conveyor 22 is disposed in the groove 41 of the carry-out pad 16 as shown in FIG. Thereafter, the carry-in pad 11 and the carry-out pad 16 are lowered.
[0017]
FIG. 14 is a view when the carry-in pad and the carry-out pad are lowered.
As shown in FIG. 14, the circuit board 34 is placed on the inspection table 23 when the carry-in pad 11 is lowered. The circuit board 34 is provided with a marker for determining how far the circuit board is placed from a predetermined position of the inspection table 23, and the circuit board is placed on the inspection table 23. When placed, the LED 13 attached to the carry-in pad vertical movement mechanism unit 12 illuminates the marker on the circuit board, and the two-dimensional camera 19 captures an image of this marker. Image data representing an image captured by the two-dimensional camera 19 is input to the board inspection unit 20 that inspects the circuit board. A method for inspecting the circuit board in the board inspection unit 20 will be described later. Further, when the circuit board is placed on the inspection table 23 by lowering the carry-in pad 11, the carry-in pad 11 returns from the inspection position B to the carry-in position A. Since the CCD camera 14 and the LED 15 move in synchronization with the movement of the carry-in pad 11 as described above, the CCD camera 14 is in the test position B when the carry-in pad 11 returns from the test position B to the carry-in position A. The LED 15 passes under the circuit board 34 and passes under the circuit board 34.
[0018]
FIG. 15 is a view when the CCD camera passes over the circuit board at the inspection position B and the LED 14 passes under the circuit board when the carry-in pad returns from the inspection position B to the carry-in position A.
As shown in FIG. 15, when the LED 15 passes under the circuit board, the circuit board is illuminated from below, and when the CCD camera 14 passes over the circuit board 34 at the inspection position B. In addition, the circuit board 34 is illuminated from above with the LEDs attached to the CCD camera 14. The circuit board 34 is illuminated in this way, and the CCD camera 14 scans the circuit board 34 in the x direction to capture an image of the circuit board 34. The image captured by the CCD camera 14 is displayed on the monitor 18, and image data representing this image is input to the substrate inspection unit 20. In this board inspection unit 20, wiring pattern reference data to be compared with the wiring pattern formed on the surface of the circuit board carried into the board inspection apparatus 10 is stored. When the image data representing the marker image captured by the two-dimensional camera 19 and the image data on the circuit board surface captured by the CCD camera 14 are input, the CCD camera 14 uses the image data representing the marker image. Image data representing the captured image of the surface of the circuit board is corrected so as to become image data when the circuit board is placed at a predetermined position of the inspection table 23, and the corrected image data is stored in advance. The circuit board is inspected by comparing the corrected reference data and detecting the difference between the corrected image data and the reference data. Thus, when the carry-in pad 11 returns from the inspection position B to the carry-in position A, the image of the circuit board is captured by the CCD camera 14 and the carry-in pad 11 returns to the carry-in position A.
[0019]
FIG. 16 is a side view of the substrate inspection apparatus when the carry-in pad returns to the carry-in position A.
When the carry-in pad 11 returns to the carry-in position A, as shown in FIG. 16, the carry-out pad 16 moves to the inspection position B, and the circuit board 35 is carried to the carry-in position A. Thereafter, the carry-in pad 11 and the carry-out pad 16 move again as described with reference to FIGS. 10, 11, and 14, and convey the circuit boards 34 and 35 to the inspection table 23 and the carry-out conveyor 22, respectively.
[0020]
FIG. 17 is a diagram in which the circuit board is conveyed to the inspection table and the carry-out conveyor.
The circuit board 34 placed on the carry-out conveyor 22 is carried out of the board inspection apparatus 10. The carry-in pad 11 returns to the carry-in position A again, and the steps described with reference to FIGS. 15 to 17 are repeated, and the circuit board carried into the board inspection apparatus 10 is inspected.
[0021]
The board inspection apparatus 10 according to the present embodiment receives the circuit board transported to the carry-in position A after the carry-in pad 11 moves to the test position B and places the circuit board on the test table 23. When returning from the inspection position B to the loading position A, an image of the circuit board at the inspection position B is captured by the CCD camera 14 that moves in synchronization with the movement of the loading pad 11. That is, simultaneously with moving the carry-in pad 11, the CCD camera 14 scans the circuit board surface. Therefore, the inspection time of the circuit board carried into the board inspection apparatus 10 can be shortened.
[0022]
The CCD camera 14 constituting the substrate inspection apparatus 10 of the present embodiment has a plurality of light receiving elements arranged in a direction perpendicular to the x direction shown in FIG. If the CCD camera 14 is installed in the direction in which the light receiving elements are arranged in this way, it is advantageous in terms of resolution and the like when the number of light receiving elements is arranged, but the CCD camera 14 is arranged in the x direction. On the other hand, even if it is installed in a direction arranged in a direction intersecting at an angle of 45 degrees, for example, it does not depart from the spirit of the present invention to capture an image by scanning in the x direction synchronized with the movement of the carry-in pad 11 in the x direction. Absent.
[0023]
Moreover, in the board | substrate inspection apparatus 10 of this embodiment, when the carrying-in pad 11 and the carrying-out pad 16 receive a circuit board, the circuit board is mounted in the carrying-in pad 11 or the carrying-out pad 16, but the carrying-in pad 11 and the carrying-out pad 16 May pick up the circuit board when receiving the circuit board.
Moreover, in the board | substrate inspection apparatus 10 of this embodiment, the carrying-in pad 11 is made into a table-like thing, and it is made to move to one direction (X direction) while moving up and down (Z direction) by the carrying pad vertical movement mechanism part 12. FIG. However, the table may be stationary, and the vertical movement mechanism 12 may be provided with a suction function and moved in one direction. Further, instead of the table-shaped carry-out pad 16, the vertical movement mechanism 17 may be provided with a suction function to serve as a carry-out pad.
[0024]
【The invention's effect】
As described above, according to the substrate inspection apparatus of the present invention, the inspection time can be shortened.
[Brief description of the drawings]
FIG. 1 is a side view showing a schematic configuration of a substrate inspection apparatus of the present invention.
FIG. 2 is a top view showing a schematic configuration of a substrate inspection apparatus according to the present invention.
3 is a top view of the carry-in pad when the carry-in pad is viewed from the carry-in position A in the substrate inspection apparatus shown in FIGS. 1 and 2. FIG.
4 is a view of the carry-in pad as viewed from the direction of arrow a shown in FIG.
FIG. 5 is a top view of the carry-in pad when the circuit board is carried to the carry-in position A by the carry-in conveyor.
6 is a view of the carry-in pad as viewed from the direction of arrow a shown in FIG.
FIG. 7 is a top view of a carry-in pad when a circuit board is received.
8 is a view of the carry-in pad as viewed from the direction of arrow a shown in FIG.
9 is a top view of the carry-out pad when the carry-out pad is viewed from the inspection position B in the substrate inspection apparatus shown in FIGS. 1 and 2. FIG.
FIG. 10 is a side view showing the board inspection apparatus when the carry-in pad receives the circuit board as shown in FIG.
11 is a side view showing the substrate inspection apparatus when the carry-in pad is moved to the inspection position B. FIG.
12 is a top view showing the substrate inspection apparatus when the carry-in pad moves to the inspection position B. FIG.
13 is a top view of the carry-in pad when the carry-in pad is viewed from the inspection position B in the substrate inspection apparatus shown in FIGS. 11 and 12. FIG.
FIG. 14 is a view when the carry-in pad 11 and the carry-out pad are lowered.
15 is a view when the CCD camera passes over the circuit board at the inspection position B and the LED 14 passes under the circuit board when the carry-in pad returns from the inspection position B to the carry-in position A. FIG.
16 is a side view of the substrate inspection apparatus when the carry-in pad returns to the carry-in position A. FIG.
FIG. 17 is a side view of the substrate inspection apparatus when the carry-in pad and the carry-out pad are lowered.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Board | substrate inspection apparatus 11 Carry-in pad 12 Carry-in pad vertical movement mechanism part 13, 15 LED
14 CCD camera 16 Unloading pad 17 Unloading pad vertical movement mechanism unit 18 Monitor 19 Two-dimensional camera 20 Board inspection unit 21 Loading conveyor 22 Unloading conveyor 23 Inspection table 31 Pins 32, 33, 41 Grooves 34, 35 Circuit board

Claims (1)

In a board inspection apparatus that takes in an image of the surface of a circuit board that has been carried in with a camera and carries out the circuit board after the image has been taken in, and inspects the circuit board based on the taken-in image,
Among the carry-in position for receiving the loaded circuit boards, the inspection position for taking in the image of the circuit board surface, and the carry-out position for carrying out the circuit board after taking the image, arranged in a predetermined first direction, A loading body that reciprocates between the inspection position and receives the circuit board that has been carried in at the loading position, and transports the circuit board to the inspection position;
A camera having a plurality of light receiving elements arranged in a predetermined second direction intersecting with the first direction, wherein the first object is synchronized with the movement of the carry-in body in the first direction. The circuit board moved in the direction and transported to the inspection position by the carry-in body is scanned in the first direction when the carry-in body returns from the inspection position to the carry-in position. Camera to capture images,
A carry-out body that reciprocates between the inspection position and the carry-out position in synchronization with the movement of the carry-in body, receives the circuit board after image capture at the inspection position, and conveys the circuit board to the carry-out position; and A board inspection apparatus comprising a board inspection section for inspecting a circuit board based on an image captured by a camera.

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