JP3817326B2

JP3817326B2 - Manufacturing method of adhesive tape for electronic parts

Info

Publication number: JP3817326B2
Application number: JP08570797A
Authority: JP
Inventors: 武司橋本; 順栃平; 文規駒形
Original assignee: Tomoegawa Paper Co Ltd
Current assignee: Tomoegawa Co Ltd
Priority date: 1997-03-19
Filing date: 1997-03-19
Publication date: 2006-09-06
Anticipated expiration: 2017-03-19
Also published as: JPH10259364A

Description

【０００１】
【産業上の利用分野】
本発明は、半導体装置を構成するリードフレーム周辺の部材間、例えば、リードピン、半導体チップ搭載用基板、放熱板、半導体チップ自身等の接着に使用するための電子部品用接着テープの製造方法に関する。
【０００２】
【従来の技術】
従来、樹脂封止型半導体装置内において使用される接着テープには、リードフレーム固定用テープ、ＴＡＢテープ等がある。例えば、リードフレーム固定用テープは、リードフレームのリードピンを固定することにより、リードフレーム自体および半導体アッセンブリ工程全体の生産性向上に資するものとして使用されている。このリードフレーム固定用テープは、耐熱性フィルムに接着剤を薄層塗工して製造されているが、近年、半導体装置が高性能化するのに伴い、高信頼性が要求される接着剤多積層型の接着テープが望まれている。従来技術による接着剤多積層型接着テープの製造方法は、基材に第１の接着剤層を塗布、乾燥した後、第２の接着剤層を塗布、乾燥することにより製造されてきた。しかしながら、従来の塗工製造方法では、接着剤層の数だけ塗工工程が必用で塗工設備、生産コスト面で大きな問題となっていた。また、接着剤をフィルム化してフィルム同士を圧着して貼り合わせる製造方法もあるが接着剤のガラス転移温度が高い場合には、圧着貼り合わせ工程での温度が高温になり、接着剤が酸化劣化する問題を有している。そのため、不活性ガス中で圧着する製造方法が提案されているが特殊な圧着貼り合わせ装置が必用となり、生産設備、生産コスト面で問題となっている。
【０００３】
【発明が解決しようとする課題】
本発明者は、従来技術における上記問題点に鑑みてなされたものである。本発明は、ガラス転移温度が高い接着剤でも、フィルム化した接着剤を比較的低温で、汎用の圧着貼り合わせ装置を使用して、安価に製造することができる電子部品用接着テープの製造方法を提供することにある。
【０００４】
【課題を解決するための手段】
本発明の第１のものは、
（１）基材の一面に第１の接着剤層を形成して接着剤フィルム（ａ）を作成する工程、
（２）基材の一面に第２の接着剤層を形成した接着剤フィルム（ｂ）を作成する工程、
（３）前記接着剤フィルム（ａ）または接着剤フィルム（ｂ）のいずれか一方の接着剤層表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｃ）を作成する工程、
（４）前記工程（３）において有機溶剤残留接着層を形成しない接着剤フィルム（ａ）の接着剤層面または前記工程（３）において有機溶剤残留接着層を形成しない接着剤フィルム（ｂ）の接着剤層面と接着剤フィルム（ｃ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程からなり、前記工程（１）における基材または前記工程（２）における基材のいずれかが剥離性フィルムであることを特徴とする電子部品用接着テープの製造方法である。
本発明の第２のものは、
（１）基材の一面に第１の接着剤層を形成して接着剤フィルム（ａ）を作成する工程、
（２）前記接着剤フィルム（ａ）の接着剤層または接着性を有する単層接着剤フィルム（ｂ）のいずれか一方の表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｃ）を作成する工程、
（３）前記工程（２）において有機溶剤残留接着層を形成しない接着剤フィルム（ａ）の接着剤層表面または前記工程（２）において有機溶剤残留接着層を形成しない単層接着剤フィルム（ｂ）の表面と接着剤フィルム（ｃ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程からなることを特徴とする電子部品用接着テープの製造方法である。
本発明の第３のものは、
（１）接着性を有する単層接着剤フィルム（ａ）または接着性を有する単層接着剤フィルム（ｂ）のいずれか一方の表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｃ）を作成する工程、
（２）前記有機溶剤残留接着層を形成しない接着剤フィルム（ａ）または（ｂ）の表面と接着剤フィルム（ｃ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程からなることを特徴とする電子部品用接着テープの製造方法である。
本発明の第４のものは、
（１）基材の一面に第１の接着剤層を形成して接着剤フィルム（ａ）を作成する工程、
（２）基材の一面に第２の接着剤層を形成した接着剤フィルム（ｂ）を作成する工程、
（３）前記接着剤フィルム（ａ）または接着剤フィルム（ｂ）のいずれか一方の接着剤層表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｃ）を作成する工程、
（４）前記工程（３）において有機溶剤残留接着層を形成しない接着剤フィルム（ａ）の接着剤層面または前記工程（３）において有機溶剤残留接着層を形成しない接着剤フィルム（ｂ）の接着剤層面と接着剤フィルム（ｃ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着し、一方の基材を剥離して接着剤フィルム（ｄ）を作成する工程、
（５）剥離性フィルムからなる基材の一面に第３の接着剤層を形成した接着剤フィルム（ｅ）を作成する工程、
（６）前記接着剤フィルム（ｄ）または接着剤フィルム（ｅ）のいずれか一方の接着剤層表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｆ）を作成する工程、
（７）前記工程（６）において有機溶剤残留接着層を形成しない接着剤フィルム（ｄ）の接着剤層面または前記工程（６）において有機溶剤残留接着層を形成しない接着剤フィルム（ｅ）の接着剤層面と接着剤フィルム（ｆ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程からなることを特徴とする電子部品用接着テープの製造方法である。
本発明の第５のものは、
（１）基材の一面に第１の接着剤層を形成して接着剤フィルム（ａ）を作成する工程、
（２）基材の一面に第２の接着剤層を形成した接着剤フィルム（ｂ）を作成する工程、
（３）前記接着剤フィルム（ａ）または（ｂ）のいずれか一方の接着剤層表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｃ）を作成する工程、
（４）前記有機溶剤残留接着層を形成しない接着剤フィルム（ａ）または（ｂ）の接着剤層面と接着剤フィルム（ｃ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着し、一方の基材を剥離して接着剤フィルム（ｄ）を作成する工程、
（５）前記接着剤フィルム（ｄ）または接着性を有する単層接着剤フィルム（ｅ）のいずれか一方の接着剤層表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｆ）を作成する工程、
（６）前記有機溶剤残留接着層を形成しない接着剤フィルム（ｄ）または（ｅ）の接着剤層面と接着剤フィルム（ｆ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程からなることを特徴とする電子部品用接着テープの製造方法である。
本発明の第６のものは、
（１）基材の一面に第１の接着剤層を形成して接着剤フィルム（ａ）を作成する工程、
（２）前記接着剤フィルム（ａ）の接着剤層または接着性を有する単層接着剤フィルム（ｂ）のいずれか一方の表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｃ）を作成する工程、
（３）前記工程（２）において有機溶剤残留接着層を形成しない接着剤フィルム（ａ）の接着剤層面または前記工程（２）において有機溶剤残留接着層を形成しない単層接着剤フィルム（ｂ）の表面と接着剤フィルム（ｃ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着して接着剤フィルム（ｄ）を作成する工程、
（４）前記接着剤フィルム（ｄ）または接着性を有する単層接着剤フィルム（ｅ）のいずれか一方の接着表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｆ）を作成する工程、
（５）前記工程（４）において有機溶剤残留接着層を形成しない接着剤フィルム（ｄ）の接着表面または前記工程（４）において有機溶剤残留接着層を形成しない単層接着剤フィルム（ｅ）の表面と接着剤フィルム（ｆ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程からなることを特徴とする電子部品用接着テープの製造方法である。
本発明の第７のものは、
（１）接着性を有する単層接着剤フィルム（ａ）または接着性を有する単層接着剤フィルム（ｂ）のいずれか一方の表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｃ）を作成する工程、
（２）前記有機溶剤残留接着層を形成しない接着剤フィルム（ａ）または（ｂ）の表面と接着剤フィルム（ｃ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程、
（３）前記接着剤フィルム（ｃ）または接着性を有する単層接着剤フィルム（ｄ）のいずれか一方の接着剤層表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｅ）を作成する工程、
（４）前記有機溶剤残留接着層を形成しない接着剤フィルム（ｃ）または（ｄ）の接着剤層面と接着剤フィルム（ｅ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程からなることを特徴とする電子部品用接着テープの製造方法である。
本発明の第８のものは、
（１）接着性を有する単層接着剤フィルム（ａ）または接着性を有する単層接着剤フィルム（ｂ）のいずれか一方の表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｃ）を作成する工程、
（２）前記工程（１）において有機溶剤残留接着層を形成しない単層接着剤フィルム（ａ）の表面または前記工程（１）において有機溶剤残留接着層を形成しない単層接着剤フィルム（ｂ）の表面と接着剤フィルム（ｃ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程、
（３）基材の一面に接着剤層を形成した接着剤フィルム（ｄ）を作成する工程、
（４）前記工程（２）で重ね合せて得た接着剤フィルムまたは接着剤フィルム（ｄ）のいずれか一方の接着表面に、有機溶剤可溶性接着剤からなる塗布液を塗布、乾燥して、有機溶剤残留接着層を形成して接着剤フィルム（ｅ）を作成する工程、
（５）前記工程（４）において有機溶剤残留接着層を形成しない工程（２）で重ね合せて得た接着剤フィルムの表面または前記工程（４）において有機溶剤残留接着層を形成しない接着剤フィルム（ｄ）の接着剤層面と接着剤フィルム（ｅ）の有機溶剤残留接着層とを対向するよう重ね合わせて圧着する工程からなることを特徴とする電子部品用接着テープの製造方法である。
【０００５】
以下、本発明について詳細に説明する。
本発明の製造工程に使用する接着剤フィルムは、剥離性のフィルム等の基材に接着剤と有機溶剤からなる塗布液を塗布、乾燥して得られる接着剤フィルムである。また、使用する基材には、剥離処理を施したポリエチレンテレフタレートからなる剥離性フィルム、ポリイミド等からなる耐熱性フィルム等がある。
接着性を有する単層接着剤フィルムには、射出成形等によりフィルム化した接着剤フィルムあるいは熱可塑性ポリイミドフィルム等がある。熱可塑性ポリイミドフィルムは、例えば三井東圧化学社から商品名：ラークＴＰＩ、宇部興産社から商品名：ユーピレックス、東レ社からカプトン等が上市されている。
【０００６】
本発明の製造方法に使用する有機溶剤可溶性接着剤は、有機溶剤に溶解することが必要で、該有機溶剤可溶性接着剤層を構成する樹脂の例としては、ポリアミド樹脂、ポリアセタール、ポリカーボネート、変性ポリフェニレンエーテル、熱可塑性ポリエステル、ポリテトラフルオロエチレン等のフッ素樹脂、ポリフェニレンスルフィド、ポリスルホン、非晶質ポリアリレート、ポリエーテルイミド、ポリエーテルスルホン、ポリエーテルケトン、液晶ポリエステル、ポリアミドイミド、ポリイミド、ポリアリルエーテルニトリル、ポリベンゾイミダゾール等がある。
また、本発明の製造方法に使用する接着剤フィルムおよび単層接着剤フィルムを構成する樹脂の例としては上記したものが使用できる。
【０００７】
前記した少なくとも２つの接着剤層を、有機溶剤残留接着層を形成しないで熱圧着する場合、圧着貼り合わせ装置の温度を、該接着剤層を構成する樹脂のガラス転移温度より１００〜１５０℃高くする必要がある。該接着剤層を構成する樹脂のガラス転移温度が１５０℃以上であると、圧着貼り合わせ時の高温により接着剤層が酸化劣化し易いため、該接着剤層を構成する樹脂のガラス転移温度が１５０℃以上の場合は本発明の製造方法を使用することが好ましい。
本発明は、該第１の接着剤層と第２の接着剤層とを、あるいはポリイミドフィルムと該接着剤層とを直接圧着しないで、有機溶剤残留接着層を介して圧着するため前記温度より低い温度で圧着することを可能にするものである。
また、圧着する少なくとも２つの接着剤層を構成する樹脂のガラス転移温度が異なる場合、圧着貼り合わせ装置の温度をガラス転移温度の高い接着剤層を構成する樹脂に合わせる必要がある。前記理由、すなわち圧着時が高温になることにより、接着剤層を構成する樹脂が酸化劣化し易いため本発明の製造方法が好ましい。特に、圧着する接着剤のガラス転移温度差が２０℃以上ある場合は、本発明の製造方法がより好ましい。
また、圧着前の１つの接着剤層の乾燥後の厚さは１０〜１００μｍが好ましく、さらに好ましくは１０〜４０μｍである。１０μｍより薄いと電気的信頼性が低下し易い、１００μｍより厚いと圧着時あるいは接着テープ打ち抜き時に接着剤のはみ出し易い問題が発生する。塗工により形成された該接着剤層は、残留する有機溶剤量を１重量％以下になるまで乾燥して用いることが好ましい。本願における「乾燥後の厚さ」は残留する有機溶剤量が１重量％以下の時の厚さを意味する。
なお、接着剤のガラス転移温度は示差走査熱量計（ＤＳＣ）により、窒素雰囲気中で１０℃／ｍｉｎの昇温条件にて測定し、吸熱開始温度を意味する。
【０００８】
本発明に使用される前記有機溶剤可溶性接着剤層を溶解させる有機溶剤は、接着剤層を構成する樹脂の化学的性質によって異なるため、目的とする接着剤の種類により有機溶剤を適宜選択する必要がある。本発明に好ましく使用される有機溶剤の例としては、Ｎ−メチル−２−ピロリドン、Ｎ，Ｎ−ジメチルアセトアミド、Ｎ，Ｎ−ジメチルホルムアミド、ジメチルスルホキシド、スルホラン、ヘキサメチルリン酸トリアミド、１，３−ジメチル−２−イミダゾリドン、ヘキサン、ベンゼン、トルエン、キシレン、メチルエチルケトン、アセトン、ジエチルエーテル、テトラヒドロフラン、ジオキサン、モノグライム、ジグライム、メチルセロソルブ、セロソルブアセテート、メタノール、エタノール、プロパノール、イソプロパノール、酢酸メチル、酢酸エチル、アセトニトリル、塩化メチレン、クロロホルム、四塩化炭素、クロロベンゼン、ジクロロベンゼン、ジクロロエタン、トリクロロエタン、等がある。
【０００９】
接着剤層上あるいはポリイミドフィルム上に、有機溶剤可溶性接着剤を塗布する方法としては、グラビアコーター、リバースコーター、ロータリースクリーン、スピンコーター、ダイコーター、コンマコーター、ボトムコーター、ナイフコーター、エアーコーター、ロールコーター、メタルベルトコーター、ワイヤーバーコーター等の方法があり、これらを適宜選択して使用する。
前記方法で塗布した有機溶剤可溶性接着剤層を乾燥機等で半乾燥し、有機溶剤残留接着層を形成させる。有機溶剤残留接着層に残留させる有機溶剤量は、５〜４０重量％が好ましい。残留する有機溶剤量が５重量％未満では、有機溶剤可溶性接着剤層表面の粘着性が低いため圧着性が不良になり、圧着時の温度を下げることができない。残留する有機溶剤量が４０重量％を超えると、圧着時の有機溶剤の滲みだし、発泡し易くなるため好ましくない。
また、該有機溶剤残留接着層は乾燥後の厚さが０．５〜５μｍが好ましい。５μｍより厚いと残留させた有機溶剤が発泡しやすくある。０．５μｍ未満では圧着性が不良になり、圧着時の温度を下げることができない。
【００１０】
前記接着剤を３層積層させた接着剤層を形成させる場合には、３層の中間となる層のガラス転移温度が最も高くなることが好ましい。
また、前記接着剤を３層以上積層させた接着剤層を形成させるには、本発明の第１〜８の製造方法に記載された接着剤層の圧着を繰り返してもよい。
また、ガラス転移温度が異なる接着剤を３層以上積層する場合、全ての接着剤層の接着剤を構成する樹脂のガラス転移温度が異なっていてもよいし、積層の連続する一部が同一の接着剤であってもかまわない。
【００１１】
該第１の接着剤フィルムと第２の接着剤フィルムとを、あるいは接着剤フィルムと接着性を有する単層接着剤フィルム等を圧着するにはラミネートロール等汎用の圧着貼り合わせ装置が使用できる。
圧着温度は接着剤層が空気中の酸素によって酸化しない温度域、例えば２５〜１５０℃の範囲が好ましく使用される。
また、圧着貼り合わせ後、有機溶剤を除去、乾燥させるために、真空乾燥、オーブン乾燥、遠赤外線乾燥等を使用することができるが、接着剤が酸化しない温度で乾燥させることが好ましい。
図１に本発明の製造方法による電子部品用接着テープの一例の断面図を示した。第１の接着剤層１の一面に第２の接着剤層と同一組成である有機溶剤残留接着層２を形成した後、第２の接着剤層３と有機溶剤残留接着層２とを向かい合わせて圧着する。圧着、乾燥して有機溶剤を揮散させた有機溶剤可溶性接着剤層４を含む２層の接着剤層を有する電子部品用接着テープを作製するものである。
【００１２】
以下、本発明を実施例に基づいてより詳細に説明する。
【実施例】
実施例１［第１の発明］
ガラス転移温度２３０℃のポリアミドイミドのＮ−メチル−２−ピロリドン（以下、ＮＭＰと略す。）溶液（東洋紡績社製ＡＴ８０２０：濃度２５重量％）を、乾燥後の厚さが２０μｍになるよう厚さ３８μｍの片面剥離処理した剥離性ポリエチレンテレフタレートフィルム（以下、剥離性フィルムと略す。）の処理面に塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留溶剤量１重量％以下の第１の接着剤層を有する接着剤フィルムを作製した。一方、これとは別に、同様にして残留溶剤量１重量％以下の第２の接着剤層を有する接着剤フィルムを作製した。
次に、該第１の接着剤層面に上記ポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する第１の接着剤層フィルムを作製した。
上記で得られた残留溶剤量１重量％以下の第２の接着剤層と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、汎用の圧着貼り合わせ装置（大成ラミネーター社製ファーストラミネーター）を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着し、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下の２層の接着剤層を有する本発明の製造方法による接着テープを得た。
【００１３】
実施例２
実施例１の有機溶剤可溶性接着剤の乾燥温度を１００℃に変更して、残留溶剤量を６重量％にした以外は、実施例１と同様にして残留溶剤量が１重量％以下で２層の接着剤層を有する本発明の製造方法による電子部品用接着テープを得た。
【００１４】
実施例３
実施例１の有機溶剤可溶性接着剤の乾燥温度を６０℃に変更して、残留溶剤量を２０重量％にした以外は、実施例１と同様にして残留溶剤量が１重量％以下で２層の接着剤層を有する本発明の製造方法による電子部品用接着テープを得た。
【００１５】
実施例４
実施例１の有機溶剤可溶性接着剤の乾燥後の厚さを５μｍにした以外は、実施例１と同様にして残留溶剤量が１重量％以下で２層の接着剤層を有する本発明の製造方法による電子部品用接着テープを得た。
【００１６】
実施例５
実施例１で使用したポリアミドイミドの代わりにガラス転移温度２８０℃のポリアミドイミドのＮＭＰ溶液（東洋紡績社製ＮＸ−１００：濃度２５％）を使用した以外は、実施例１と同様にして残留溶剤量が１重量％以下で２層の接着剤層を有する本発明の製造方法による電子部品用接着テープを得た。
【００１７】
実施例６
実施例１で使用したポリアミドイミドの代わりにガラス転移温度３００℃のポリアミドイミドのＮＭＰ溶液（東洋紡績社製Ｎ−８０２０：濃度２５％）を使用した以外は、実施例１と同様にして残留溶剤量が１重量％以下で２層の接着剤層を有する本発明の製造方法による電子部品用接着テープを得た。
【００１８】
実施例７
実施例１で使用したポリアミドイミドの代わりにガラス転移温度２２５℃のポリエーテルスルホンのジメチルホルムアミド溶液（住友化学工業社製ビクトリックスＰＥＳ：濃度３０％）を使用した以外は、実施例１と同様にして残留溶剤量が１重量％以下で２層の接着剤層を有する本発明の製造方法による電子部品用接着テープを得た。
【００１９】
実施例８［第１の発明］
実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２０μｍになるよう実施例１で使用した剥離性フィルムに塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留溶剤量１重量％以下の第１の接着剤層を有する接着剤フィルムを作製した。
一方、これとは別に、実施例５で使用したポリアミドイミドのＮＭＰ溶液を上記と同様にして残留溶剤量１重量％以下の第２の接着剤層を有する接着剤フィルムを作製した。
次に、該第１の接着剤層面に実施例５で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する第１の接着剤層フィルムを作製した。
上記で得られた残留溶剤量１重量％以下の第２の接着剤層と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着し、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下の２層の接着剤層を有する本発明の製造方法による接着テープを得た。
【００２０】
実施例９［第２の発明］
ガラス転移温度が２３０℃で厚さ２０μｍの熱可塑性ポリイミドからなる単層接着剤フィルム（三井東圧化学社製商品名ラークＴＰＩ）の一面に、実施例５で使用したポリアミドイミドのＮＭＰ溶液を乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を有するポリイミド単層接着剤フィルムを作製した。
一方、これとは別に実施例５で使用したガラス転移温度２８０℃のポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２０μｍになるよう実施例１で使用した厚さ３８μｍの剥離性フィルムの処理面に塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留溶剤量１重量％以下の接着剤層を有する接着剤フィルムを作製した。
上記接着剤フィルムと該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着し、熱風循環型乾燥機中で１８０℃２分間乾燥して接着性を有するポリイミドフィルム表面に残留溶剤量１重量％以下の接着剤層を有する本発明の製造方法による接着テープを得た。
【００２１】
実施例１０［第３の発明］
実施例９で使用した熱可塑性ポリイミドからなる単層接着剤フィルムの一面に、実施例５で使用したポリアミドイミドのＮＭＰ溶液を乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤可溶性接着剤層を有するポリイミド単層接着剤フィルムを作製した。
一方、これとは別にガラス転移温度２８０℃のポリアミドイミドを厚さが２０μｍになるよう射出成形して接着性を有する単層接着剤フィルムを作製した。
上記単層接着剤フィルムと該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着し、熱風循環型乾燥機中で１８０℃２分間乾燥して接着性を有するポリイミドフィルム表面に残留溶剤量１重量％以下の接着剤層を有する本発明の製造方法による接着テープを得た。
【００２２】
実施例１１［第４の発明］
実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２０μｍになるよう実施例１で使用した剥離性フィルムに塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留溶剤量１重量％以下の第１の接着剤層を有する接着剤フィルムを作製した。
一方、これとは別に、実施例５で使用したポリアミドイミドのＮＭＰ溶液を上記と同様にして残留溶剤量１重量％以下の第２の接着剤層を有する接着剤フィルムを作製した。
次に、該第１の接着剤層面に実施例５で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する第１の接着剤層フィルムを作製した。
上記で得られた残留溶剤量１重量％以下の第２の接着剤層と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着して第２の接着剤層の剥離性フィルムを剥離した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下の２層の接着剤層を有する接着剤フィルムを得た。
また、別に前記第１の接着剤層を有する接着剤フィルム作製と同様にして残留溶剤量１重量％以下の第３の接着剤層を有する接着剤フィルムを作製した。
次に、該第３の接着剤層面に実施例５で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する第３の接着剤フィルムを作製した。
上記で得られた残留溶剤量１重量％以下の２層の接着剤層を有する接着剤フィルムの接着剤層面と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下で本発明の製造方法による接着テープを作製した。
【００２３】
実施例１２［第５の発明］
実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２０μｍになるよう実施例１で使用した剥離性フィルムに塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留溶剤量１重量％以下の第１の接着剤層を有する接着剤フィルムを作製した。
一方、これとは別に、実施例５で使用したポリアミドイミドのＮＭＰ溶液を上記と同様にして残留溶剤量１重量％以下の第２の接着剤層を有する接着剤フィルムを作製した。
次に、該第１の接着剤層面に実施例５で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する第１の接着剤層フィルムを作製した。
上記で得られた残留溶剤量１重量％以下の第２の接着剤層と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着して第２の接着剤層の剥離性フィルムを剥離した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下の２層の接着剤層を有する接着剤フィルムを得た。
また、別にガラス転移温度２３０℃のポリアミドイミドを厚さが２０μｍになるよう射出成形して接着性を有する単層接着剤フィルムを作製した。
次に、該単層接着剤フィルム表面に実施例５で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する単層接着剤フィルムを作製した。
上記で得られた残留溶剤量１重量％以下の２層の接着剤層を有する接着剤フィルムの接着剤層面と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下で本発明の製造方法による接着テープを作製した。
【００２４】
実施例１３［第６の発明］
実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２０μｍになるよう実施例１で使用した剥離性フィルムに塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留溶剤量１重量％以下の接着剤層を有する接着剤フィルムを作製した。
次に、実施例９で使用したポリイミドからなる単層接着剤フィルム表面に実施例５で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有するポリイミド単層接着剤フィルムを作製した。
上記で得られた残留溶剤量１重量％以下の接着剤フィルムの接着剤層と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下の２層の接着剤層を有する接着剤フィルムを得た。
また、別にガラス転移温度２３０℃のポリアミドイミドを厚さが２０μｍになるよう射出成形して接着性を有する単層接着剤フィルムを作製した。
次に、該２層接着剤フィルムのポリイミド接着剤層表面に実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する単層接着剤フィルムを作製した。
上記で得られた単層接着剤フィルムと該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下で本発明の製造方法による接着テープを作製した。
【００２５】
実施例１４［第７の発明］
ガラス転移温度２３０℃のポリアミドイミドを厚さが２０μｍになるよう射出成形して接着性を有する単層接着剤フィルムを作製した。
次に、実施例９で使用したポリイミドからなる単層接着剤フィルム表面に実施例５で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有するポリイミド単層接着剤フィルムを作製した。
上記で得られた単層接着剤フィルムの接着剤層と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下の２層の接着剤層を有する接着剤フィルムを得た。
また、前記と同様にしてガラス転移温度２３０℃のポリアミドイミドを射出成形して接着性を有する単層接着剤フィルムを作製した。
次に、該２層の接着剤フィルムのポリイミド表面に実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する単層接着剤フィルムを作製した。
上記で得られた単層接着剤フィルムと該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下で本発明の製造方法による接着テープを作製した。
【００２６】
実施例１５［第８の発明］
ガラス転移温度２３０℃のポリアミドイミドを厚さが２０μｍになるよう射出成形して接着性を有する単層接着剤フィルムを作製した。
次に、実施例９で使用したポリイミドからなる単層接着剤フィルム表面に実施例５で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有するポリイミド単層接着剤フィルムを作製した。
上記で得られた単層接着剤フィルムの接着剤層と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下の２層の接着剤層を有する接着剤フィルムを得た。
また、実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２０μｍになるよう実施例１で使用した剥離性フィルムに塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留溶剤量１重量％以下の接着剤層を有する接着剤フィルムを作製した。
次に、該２層の接着剤フィルム表面に実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２μｍになるようリバースコーターを用いて塗布し、熱風循環型乾燥機中で８０℃３分間乾燥して残留溶剤量１０重量％の有機溶剤残留接着層を表面に有する接着剤フィルムを作製した。
上記で得られた残留溶剤量１重量％以下の接着剤フィルムのポリイミドからなる接着剤層面と該残留溶剤量１０重量％の有機溶剤残留接着層を向かい合うように重ね、実施例１で使用した汎用の圧着貼り合わせ装置を用いて１００℃に加熱した一対の加熱ロール間をロール速度１ｍ／ｍｉｎ．で通過させて圧着した後、熱風循環型乾燥機中で１８０℃２分間乾燥して、残留溶剤量１重量％以下で本発明の製造方法による接着テープを作製した。
【００２７】
比較例１
実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２０μｍになるよう実施例１で使用した厚さ３８μｍの剥離性フィルムの処理面に塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留有機溶剤量１重量％以下の第１の接着剤フィルムを作製した。同様にして第２の接着剤フィルムを作製した。
次に、上記塗布フィルムの第１および第２の接着剤層同士を対向するよう重ね合わせ、実施例１で使用した汎用の圧着貼り合わせ装置を用いて実施例１同条件で一対の加熱ロール間を通過させ、貼り合わせを試みた。
【００２８】
比較例２
実施例１で使用したポリアミドイミドのＮＭＰ溶液を、乾燥後の厚さが２０μｍになるよう実施例１で使用した厚さ３８μｍの剥離性フィルムの処理面に塗布して、熱風循環型乾燥機中で１８０℃５分間乾燥して残留有機溶剤量１重量％以下の接着剤フィルムを作製した。同様にして第２の接着剤フィルムを作製した。
次に、上記塗布フィルムの第１および第２の接着剤層同士を対向するよう重ね合わせ、実施例１で使用した汎用の圧着貼り合わせ装置を用いて加熱ロール温度を２５０℃にした以外は実施例１同条件で一対の加熱ロール間を通過させ、貼り合わせを試みた。
【００２９】
比較例３
実施例１の有機溶剤可溶性接着剤の乾燥温度を１２０℃に変更して、残留溶剤量を２重量％にした以外は、実施例１と同様にして２層の接着剤層を有する接着テープを得た。
【００３０】
上記実施例、比較例の方法で接着剤層を貼り合わせた結果、実施例１〜１５は貼り合わせることができて電子部品用接着テープが得られたが、比較例１〜３は貼り合わせることができなかった。
【００３１】
（電子部品用接着テープとしての実用特性）
（１）接着テープの強度評価
実施例１〜１５の接着テープを２０ｍｍ×２０ｍｍの小片にカットし、それに１０ｍｍ幅の銅箔を３００℃１秒で、銅箔と接着剤が酸化しない条件で貼り付けた後、室温での９０゜ピール強度を測定した。その結果、実施例１〜１５の接着テープは、全て５００ｇ／１０ｍｍ以上であり、本発明の接着テープの接着強度が強いことが確認された。
（２）接着テープを使用した半導体パッケージの信頼性試験
実施例１〜１５で得られた接着テープを２０ｍｍ×２０ｍｍの小片にカットし、リードフレームを３００℃１秒の条件で接着して、半導体パッケージを組み立てた。これらの半導体パッケージに対して、５Ｖ印加・１２１℃・２ａｔｍ・１００％ＲＨの条件でＰＣＢＴ（ＰｕｒｅｓｓｕｒＣｏｏｋｅｒＢｉａｓｅｄＴｅｓｔ）試験を行った。その結果、実施例１〜１５の接着テープを使用した半導体パッケージは１０００時間後でもショートが発生しなかった。
【００３２】
【発明の効果】
本発明の製造方法は、最小限の塗工設備、汎用の圧着貼り合わせ装置を用いて、高ガラス転移温度の接着剤でも、低温度で接着剤が２層以上積層した電子部品用接着テープを安価に製造することができる。
【図面の簡単な説明】
【図１】本発明の製造方法による電子部品用接着テープの一例の断面図である。
【符号の簡単な説明】
１・・・第１の接着剤層、２・・・有機溶剤残留接着層、
３・・・第２の接着剤層、４・・・有機溶剤可溶性接着剤層[0001]
[Industrial application fields]
The present invention relates to a method of manufacturing an adhesive tape for electronic components for use in bonding between members around a lead frame constituting a semiconductor device, for example, a lead pin, a semiconductor chip mounting substrate, a heat sink, and a semiconductor chip itself.
[0002]
[Prior art]
Conventionally, examples of adhesive tapes used in resin-encapsulated semiconductor devices include lead frame fixing tapes and TAB tapes. For example, a lead frame fixing tape is used to contribute to improving the productivity of the lead frame itself and the entire semiconductor assembly process by fixing lead pins of the lead frame. This lead frame fixing tape is manufactured by applying a thin layer of adhesive to a heat-resistant film. However, in recent years, as the performance of semiconductor devices has improved, many adhesives that require high reliability have been required. A laminated adhesive tape is desired. A conventional method for manufacturing an adhesive multi-layer adhesive tape has been manufactured by applying and drying a first adhesive layer on a substrate, and then applying and drying a second adhesive layer. However, in the conventional coating manufacturing method, the coating process is required by the number of the adhesive layers, which has been a big problem in terms of coating equipment and production cost. In addition, there is a manufacturing method in which the adhesive is made into a film and the films are bonded together by bonding, but when the glass transition temperature of the adhesive is high, the temperature in the bonding process becomes high, and the adhesive is oxidized and deteriorated. Have a problem to do. For this reason, a manufacturing method for pressure bonding in an inert gas has been proposed, but a special pressure bonding apparatus is necessary, which is problematic in terms of production equipment and production cost.
[0003]
[Problems to be solved by the invention]
The present inventor has been made in view of the above problems in the prior art. The present invention is a method for producing an adhesive tape for electronic parts, which can be produced at low cost using a general-purpose pressure bonding apparatus, even if the adhesive has a high glass transition temperature, at a relatively low temperature. Is to provide.
[0004]
[Means for Solving the Problems]
The first of the present invention is
(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) A step of creating an adhesive film (b) in which a second adhesive layer is formed on one surface of the substrate,
(3) the adhesive film (a) or Adhesive film A step of applying an organic solvent-soluble adhesive coating liquid on the surface of any one of the adhesive layers in (b) and drying to form an organic solvent residual adhesive layer to form an adhesive film (c);
(4) The above In step (3) Adhesive film that does not form an organic solvent residual adhesive layer (a) Adhesive layer surface Or Adhesive film that does not form an organic solvent residual adhesive layer in the step (3) The adhesive layer surface of (b) and the organic solvent residual adhesive layer of the adhesive film (c) are overlapped so as to face each other and pressure-bonded. Either the substrate in the step (1) or the substrate in the step (2) is a peelable film. It is a manufacturing method of the adhesive tape for electronic components characterized by the above-mentioned.
The second of the present invention is
(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) The adhesive film (a) Adhesive layer Or any one of the adhesive single-layer adhesive films (b) surface A step of applying an organic solvent-soluble adhesive coating liquid and drying to form an organic solvent residual adhesive layer to form an adhesive film (c);
(3) The above In step (2) Adhesive film that does not form an organic solvent residual adhesive layer (a) Adhesive layer surface Or No organic solvent residual adhesive layer is formed in step (2) Single layer adhesion Agent film (B) table It is a manufacturing method of the adhesive tape for electronic components characterized by including the process of superimposing and crimping | bonding a surface and the organic solvent residual adhesive layer of an adhesive film (c) so that it may oppose.
The third of the present invention is
(1) A coating solution composed of an organic solvent-soluble adhesive is applied to one surface of the adhesive single-layer adhesive film (a) or the adhesive single-layer adhesive film (b) and dried. And forming an adhesive film (c) by forming an organic solvent residual adhesive layer,
(2) It comprises a step of superposing and pressing the surface of the adhesive film (a) or (b) not forming the organic solvent residual adhesive layer and the organic solvent residual adhesive layer of the adhesive film (c) so as to face each other. It is a manufacturing method of the adhesive tape for electronic components characterized by the above-mentioned.
The fourth of the present invention is
(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) A step of creating an adhesive film (b) in which a second adhesive layer is formed on one surface of the substrate,
(3) the adhesive film (a) or Adhesive film A step of applying an organic solvent-soluble adhesive coating liquid on the surface of any one of the adhesive layers in (b) and drying to form an organic solvent residual adhesive layer to form an adhesive film (c);
(4) The above In step (3) Adhesive film that does not form an organic solvent residual adhesive layer (a) Adhesive layer surface Or Adhesive film that does not form an organic solvent residual adhesive layer in the step (3) A step of superposing and pressing the adhesive layer surface of (b) and the organic solvent residual adhesive layer of the adhesive film (c) so as to face each other, peeling one of the base materials, and creating an adhesive film (d);
(5) Made of peelable film Creating an adhesive film (e) having a third adhesive layer formed on one surface of the substrate;
(6) the adhesive film (d) or Adhesive film A step of applying an organic solvent-soluble adhesive coating solution to the surface of any one of the adhesive layers of (e) and drying to form an organic solvent residual adhesive layer to form an adhesive film (f);
(7) The above In step (6) Adhesive film that does not form an organic solvent residual adhesive layer (d) Adhesive layer surface Or Adhesive film that does not form an organic solvent residual adhesive layer in the step (6) (E) It is the manufacturing method of the adhesive tape for electronic components characterized by including the process of superimposing and crimping | bonding the adhesive layer surface of an adhesive film, and the organic solvent residual adhesive layer of an adhesive film (f) so that it may oppose.
The fifth of the present invention is
(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) A step of creating an adhesive film (b) in which a second adhesive layer is formed on one surface of the substrate,
(3) A coating solution composed of an organic solvent-soluble adhesive is applied to the surface of one of the adhesive layers of the adhesive film (a) or (b) and dried to form an organic solvent residual adhesive layer. Creating an adhesive film (c);
(4) The adhesive film (a) or the adhesive layer surface of the adhesive film (a) that does not form the organic solvent residual adhesive layer and the organic solvent residual adhesive layer of the adhesive film (c) are overlapped and pressure-bonded, A step of peeling one of the substrates to create an adhesive film (d),
(5) On the surface of any one of the adhesive film (d) or the adhesive single-layer adhesive film (e), an application liquid composed of an organic solvent-soluble adhesive is applied and dried. Forming an adhesive film (f) by forming an organic solvent residual adhesive layer;
(6) A step of pressure-bonding the adhesive film (d) or (e) on which the organic solvent residual adhesive layer is not formed and the organic solvent residual adhesive layer of the adhesive film (f) so as to face each other. It is a manufacturing method of the adhesive tape for electronic components characterized by comprising.
The sixth of the present invention is
(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) The adhesive film (a) Adhesive layer Or any one of the adhesive single-layer adhesive films (b) surface A step of applying an organic solvent-soluble adhesive coating liquid and drying to form an organic solvent residual adhesive layer to form an adhesive film (c);
(3) The above In step (2) Adhesive film that does not form an organic solvent residual adhesive layer (a) Adhesive layer surface Or Single layer adhesive film which does not form an organic solvent residual adhesive layer in the step (2) (B) table The surface and the organic solvent residual adhesive layer of the adhesive film (c) are stacked so as to face each other and pressure-bonded to create an adhesive film (d);
(4) Either one of the adhesive film (d) or the single-layer adhesive film (e) having adhesiveness Adhesive surface A step of applying an organic solvent-soluble adhesive coating liquid and drying to form an organic solvent residual adhesive layer to form an adhesive film (f);
(5) The above In step (4) Adhesive film that does not form an organic solvent residual adhesive layer (d) Adhesive surface of Or Single layer adhesive film which does not form an organic solvent residual adhesive layer in the step (4) (E) table A method for producing an adhesive tape for electronic parts, comprising a step of superposing and pressing the surface and the organic solvent residual adhesive layer of the adhesive film (f) so as to face each other.
The seventh aspect of the present invention is
(1) A coating solution composed of an organic solvent-soluble adhesive is applied to one surface of the adhesive single-layer adhesive film (a) or the adhesive single-layer adhesive film (b) and dried. And forming an adhesive film (c) by forming an organic solvent residual adhesive layer,
(2) A step of overlapping and pressing the surface of the adhesive film (a) or (b) not forming the organic solvent residual adhesive layer and the organic solvent residual adhesive layer of the adhesive film (c) so as to face each other,
(3) A coating liquid composed of an organic solvent-soluble adhesive is applied to the surface of any one of the adhesive film (c) and the adhesive layer (d) having adhesiveness, and dried. Forming an adhesive film (e) by forming an organic solvent residual adhesive layer;
(4) A step of bonding the pressure-sensitive adhesive layer (c) or the adhesive layer surface of the adhesive film (d) that does not form the organic solvent residual adhesive layer and the organic solvent residual adhesive layer of the adhesive film (e) so as to face each other. It is a manufacturing method of the adhesive tape for electronic components characterized by comprising.
The eighth of the present invention is
(1) A coating solution composed of an organic solvent-soluble adhesive is applied to one surface of the adhesive single-layer adhesive film (a) or the adhesive single-layer adhesive film (b) and dried. And forming an adhesive film (c) by forming an organic solvent residual adhesive layer,
(2) The above In step (1) Does not form organic solvent residual adhesive layer Single layer Adhesive film (a) Surface of Or Single layer adhesive film which does not form an organic solvent residual adhesive layer in the step (1) A step of overlapping and pressing the surface of (b) and the organic solvent residual adhesive layer of the adhesive film (c) so as to face each other;
(3) a step of creating an adhesive film (d) having an adhesive layer formed on one surface of the substrate;
(4) The above Adhesive film obtained by overlapping in step (2) Or one of the adhesive films (d) Adhesive surface A step of applying an organic solvent-soluble adhesive coating solution and drying to form an organic solvent residual adhesive layer to form an adhesive film (e);
(5) The above In step (4) Does not form organic solvent residual adhesive layer Surface of the adhesive film obtained by overlapping in step (2) Or Adhesive film that does not form an organic solvent residual adhesive layer in the step (4) (D) It is the manufacturing method of the adhesive tape for electronic components characterized by including the process of superimposing and crimping | bonding the adhesive layer surface of an adhesive film, and the organic solvent residual adhesive layer of an adhesive film (e) so that it may oppose.
[0005]
Hereinafter, the present invention will be described in detail.
The adhesive film used in the production process of the present invention is peelable. of It is an adhesive film obtained by applying and drying a coating solution comprising an adhesive and an organic solvent on a substrate such as a film. Examples of the substrate to be used include a peelable film made of polyethylene terephthalate subjected to a peeling treatment, a heat resistant film made of polyimide, and the like.
Examples of the adhesive single-layer adhesive film include an adhesive film formed by injection molding or the like, or a thermoplastic polyimide film. As for the thermoplastic polyimide film, for example, trade name: Lark TPI from Mitsui Toatsu Chemical Co., Ltd., trade name: Upilex from Ube Industries, and Kapton from Toray Industries, Inc. are marketed.
[0006]
The organic solvent-soluble adhesive used in the production method of the present invention must be dissolved in an organic solvent. Examples of the resin constituting the organic solvent-soluble adhesive layer include polyamide resin, polyacetal, polycarbonate, and modified polyphenylene. Fluorine resin such as ether, thermoplastic polyester, polytetrafluoroethylene, polyphenylene sulfide, polysulfone, amorphous polyarylate, polyetherimide, polyethersulfone, polyetherketone, liquid crystal polyester, polyamideimide, polyimide, polyallyl ether nitrile And polybenzimidazole.
Moreover, what was mentioned above can be used as an example of resin which comprises the adhesive film used for the manufacturing method of this invention, and a single layer adhesive film.
[0007]
When the above-mentioned at least two adhesive layers are thermocompression bonded without forming an organic solvent residual adhesive layer, the temperature of the pressure bonding apparatus is 100 to 150 ° C. higher than the glass transition temperature of the resin constituting the adhesive layer. There is a need to. If the glass transition temperature of the resin constituting the adhesive layer is 150 ° C. or higher, the adhesive layer is likely to be oxidized and deteriorated due to the high temperature at the time of pressure bonding, so that the glass transition temperature of the resin constituting the adhesive layer is In the case of 150 ° C. or higher, it is preferable to use the production method of the present invention.
In the present invention, since the first adhesive layer and the second adhesive layer, or the polyimide film and the adhesive layer are not directly bonded to each other through the organic solvent residual adhesive layer, the above temperature is used. It is possible to perform pressure bonding at a low temperature.
Moreover, when the glass transition temperature of resin which comprises the at least 2 adhesive layer to crimp | bond is different, it is necessary to match | combine the temperature of a crimping | bonding bonding apparatus with resin which comprises the adhesive layer with a high glass transition temperature. The manufacturing method of the present invention is preferable because the resin constituting the adhesive layer is likely to be oxidized and deteriorated due to the above-described reason, that is, when the temperature during pressure bonding becomes high. In particular, when the glass transition temperature difference of the adhesive to be pressure-bonded is 20 ° C. or more, the production method of the present invention is more preferable.
Moreover, 10-100 micrometers is preferable and, as for the thickness after drying of one adhesive bond layer before pressure bonding, More preferably, it is 10-40 micrometers. If it is thinner than 10 μm, the electrical reliability tends to be lowered, and if it is thicker than 100 μm, there is a problem that the adhesive tends to stick out at the time of pressure bonding or punching of the adhesive tape. The adhesive layer formed by coating is preferably used by drying until the amount of the remaining organic solvent is 1% by weight or less. The “thickness after drying” in the present application means the thickness when the amount of the remaining organic solvent is 1% by weight or less.
The glass transition temperature of the adhesive is measured by a differential scanning calorimeter (DSC) in a nitrogen atmosphere under a temperature rising condition of 10 ° C./min and means an endothermic start temperature.
[0008]
The organic solvent for dissolving the organic solvent-soluble adhesive layer used in the present invention varies depending on the chemical properties of the resin constituting the adhesive layer, and therefore it is necessary to appropriately select the organic solvent depending on the type of the target adhesive. There is. Examples of the organic solvent preferably used in the present invention include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethyl sulfoxide, sulfolane, hexamethylphosphoric triamide, 1,3 -Dimethyl-2-imidazolidone, hexane, benzene, toluene, xylene, methyl ethyl ketone, acetone, diethyl ether, tetrahydrofuran, dioxane, monoglyme, diglyme, methyl cellosolve, cellosolve acetate, methanol, ethanol, propanol, isopropanol, methyl acetate, ethyl acetate, There are acetonitrile, methylene chloride, chloroform, carbon tetrachloride, chlorobenzene, dichlorobenzene, dichloroethane, trichloroethane, and the like.
[0009]
Gravure coater, reverse coater, rotary coater, spin coater, die coater, comma coater, bottom coater, knife coater, air coater, roll There are methods such as a coater, a metal belt coater, and a wire bar coater, and these are selected and used as appropriate.
The organic solvent-soluble adhesive layer applied by the above method is semi-dried with a dryer or the like to form an organic solvent residual adhesive layer. The amount of the organic solvent remaining in the organic solvent residual adhesive layer is preferably 5 to 40% by weight. When the amount of the remaining organic solvent is less than 5% by weight, the pressure-sensitive adhesiveness on the surface of the organic solvent-soluble adhesive layer is low, so that the pressure-bonding property becomes poor and the temperature during pressure bonding cannot be lowered. If the amount of the remaining organic solvent exceeds 40% by weight, the organic solvent oozes out at the time of pressure bonding and is liable to foam, which is not preferable.
The organic solvent residual adhesive layer preferably has a thickness after drying of 0.5 to 5 μm. If it is thicker than 5 μm, the remaining organic solvent tends to foam. If it is less than 0.5 μm, the pressure bonding property becomes poor, and the temperature during pressure bonding cannot be lowered.
[0010]
In the case of forming an adhesive layer in which three layers of the adhesive are laminated, it is preferable that the glass transition temperature of the intermediate layer of the three layers is the highest.
Moreover, in order to form the adhesive layer which laminated | stacked the said adhesive agent 3 or more layers, you may repeat crimping | bonding of the adhesive layer described in the 1st-8th manufacturing method of this invention.
Moreover, when laminating | stacking 3 or more layers of adhesives with different glass transition temperatures, the glass transition temperatures of the resins constituting the adhesives of all the adhesive layers may be different, or the continuous part of the lamination is the same. It may be an adhesive.
[0011]
In order to crimp the first adhesive film and the second adhesive film, or a single-layer adhesive film having adhesiveness with the adhesive film, a general-purpose pressure bonding apparatus such as a laminate roll can be used.
The pressure bonding temperature is preferably a temperature range in which the adhesive layer is not oxidized by oxygen in the air, for example, a range of 25 to 150 ° C.
Moreover, in order to remove and dry the organic solvent after pressure bonding, vacuum drying, oven drying, far-infrared drying, or the like can be used, but drying is preferably performed at a temperature at which the adhesive is not oxidized.
FIG. 1 shows a cross-sectional view of an example of an adhesive tape for electronic parts according to the manufacturing method of the present invention. After forming the organic solvent residual adhesive layer 2 having the same composition as the second adhesive layer on one surface of the first adhesive layer 1, the second adhesive layer 3 and the organic solvent residual adhesive layer 2 face each other. And crimp. An adhesive tape for electronic parts having two adhesive layers including the organic solvent-soluble adhesive layer 4 which is bonded and dried to volatilize the organic solvent is produced.
[0012]
Hereinafter, the present invention will be described in more detail based on examples.
【Example】
Example 1 [first invention]
A N-methyl-2-pyrrolidone (hereinafter abbreviated as NMP) solution of polyamideimide having a glass transition temperature of 230 ° C. (AT8020 manufactured by Toyobo Co., Ltd .: concentration 25% by weight) is dried to a thickness of 20 μm. The film was applied to the treated surface of a 38 μm-side peelable polyethylene terephthalate film (hereinafter abbreviated as a peelable film) and dried in a hot air circulating drier for 5 minutes at 180 ° C. An adhesive film having the following first adhesive layer was prepared. On the other hand, separately, an adhesive film having a second adhesive layer having a residual solvent amount of 1% by weight or less was produced in the same manner.
Next, the NMP solution of polyamideimide is applied to the first adhesive layer surface using a reverse coater so that the thickness after drying is 2 μm, and dried in a hot air circulating dryer at 80 ° C. for 3 minutes. Thus, a first adhesive layer film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was prepared.
The above-obtained second adhesive layer having a residual solvent amount of 1% by weight or less and an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight are stacked so as to face each other, and a general-purpose pressure bonding apparatus (manufactured by Taisei Laminator) Between a pair of heated rolls heated to 100 ° C. using a first laminator) at a roll speed of 1 m / min. And dried in a hot air circulating dryer at 180 ° C. for 2 minutes to obtain an adhesive tape according to the production method of the present invention having two adhesive layers having a residual solvent amount of 1% by weight or less.
[0013]
Example 2
Two layers with a residual solvent amount of 1% by weight or less were obtained in the same manner as in Example 1 except that the drying temperature of the organic solvent-soluble adhesive of Example 1 was changed to 100 ° C. and the residual solvent amount was 6% by weight. The adhesive tape for electronic components by the manufacturing method of this invention which has an adhesive layer of this was obtained.
[0014]
Example 3
Two layers with a residual solvent amount of 1% by weight or less were obtained in the same manner as in Example 1 except that the drying temperature of the organic solvent-soluble adhesive of Example 1 was changed to 60 ° C. and the residual solvent amount was 20% by weight. The adhesive tape for electronic components by the manufacturing method of this invention which has an adhesive layer of this was obtained.
[0015]
Example 4
Production of the present invention having a residual solvent amount of 1% by weight or less and having two adhesive layers except that the thickness after drying of the organic solvent-soluble adhesive of Example 1 was 5 μm. An adhesive tape for electronic parts was obtained by the method.
[0016]
Example 5
Residual solvent was obtained in the same manner as in Example 1, except that an NMP solution of polyamideimide having a glass transition temperature of 280 ° C. (NX-100, concentration 25%) was used instead of the polyamideimide used in Example 1. An adhesive tape for electronic parts was obtained by the production method of the present invention having an amount of 1% by weight or less and having two adhesive layers.
[0017]
Example 6
Residual solvent was used in the same manner as in Example 1 except that an NMP solution of polyamideimide having a glass transition temperature of 300 ° C. (N-8020 manufactured by Toyobo Co., Ltd .: concentration 25%) was used instead of the polyamideimide used in Example 1. An adhesive tape for electronic parts was obtained by the production method of the present invention having an amount of 1% by weight or less and having two adhesive layers.
[0018]
Example 7
Instead of the polyamideimide used in Example 1, a dimethylformamide solution of polyethersulfone having a glass transition temperature of 225 ° C. (Victrix PES manufactured by Sumitomo Chemical Co., Ltd .: concentration 30%) was used in the same manner as in Example 1. Thus, an adhesive tape for electronic parts was obtained by the production method of the present invention having a residual solvent amount of 1% by weight or less and having two adhesive layers.
[0019]
Example 8 [First Invention]
The NMP solution of polyamideimide used in Example 1 was applied to the peelable film used in Example 1 so that the thickness after drying was 20 μm, and dried at 180 ° C. for 5 minutes in a hot air circulating dryer. Thus, an adhesive film having a first adhesive layer having a residual solvent amount of 1% by weight or less was prepared.
On the other hand, an adhesive film having a second adhesive layer having a residual solvent amount of 1 wt% or less was prepared in the same manner as described above for the polyamideimide NMP solution used in Example 5.
Next, the NMP solution of polyamideimide used in Example 5 was applied to the first adhesive layer surface by using a reverse coater so that the thickness after drying was 2 μm, and the coating was performed in a hot air circulation type dryer. A first adhesive layer film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was dried by drying at 3 ° C. for 3 minutes.
The above-obtained second adhesive layer having a residual solvent amount of 1% by weight or less and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight are stacked so as to face each other, and the general-purpose pressure bonding used in Example 1 is used. A roll speed of 1 m / min. Between a pair of heated rolls heated to 100 ° C. using an apparatus. And dried in a hot air circulating dryer at 180 ° C. for 2 minutes to obtain an adhesive tape according to the production method of the present invention having two adhesive layers having a residual solvent amount of 1% by weight or less.
[0020]
Example 9 [Second Invention]
The NMP solution of polyamideimide used in Example 5 was dried on one side of a single-layer adhesive film (trade name Lark TPI manufactured by Mitsui Toatsu Chemical Co., Ltd.) made of thermoplastic polyimide having a glass transition temperature of 230 ° C. and a thickness of 20 μm. A polyimide single layer adhesive having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight, coated with a reverse coater so as to have a subsequent thickness of 2 μm and dried in a hot air circulating dryer at 80 ° C. for 3 minutes. A film was prepared.
On the other hand, the 38 μm thick peelable film used in Example 1 was treated with the NMP solution of polyamideimide having a glass transition temperature of 280 ° C. used in Example 5 so that the thickness after drying was 20 μm. It was applied to the surface and dried in a hot air circulating dryer at 180 ° C. for 5 minutes to produce an adhesive film having an adhesive layer with a residual solvent amount of 1% by weight or less.
The adhesive film and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight are stacked so as to face each other, and between a pair of heating rolls heated to 100 ° C. using the general-purpose pressure bonding apparatus used in Example 1. Roll speed 1 m / min. Adhesive tape with the adhesive layer having a residual solvent amount of 1% by weight or less on the surface of the polyimide film having adhesiveness by drying at 180 ° C. for 2 minutes in a hot air circulating dryer. Got.
[0021]
Example 10 [Third Invention]
On one side of the single-layer adhesive film made of thermoplastic polyimide used in Example 9, the NMP solution of polyamideimide used in Example 5 was applied using a reverse coater so that the thickness after drying was 2 μm. A polyimide single-layer adhesive film having an organic solvent-soluble adhesive layer having a residual solvent amount of 10% by weight was prepared by drying at 80 ° C. for 3 minutes in a hot air circulating dryer.
On the other hand, a single layer adhesive film having adhesiveness was produced by injection molding a polyamideimide having a glass transition temperature of 280 ° C. to a thickness of 20 μm.
A pair of heating rolls, wherein the single-layer adhesive film and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight are stacked so as to face each other and heated to 100 ° C. using the general-purpose pressure bonding apparatus used in Example 1. The roll speed is 1 m / min. Adhesive tape with the adhesive layer having a residual solvent amount of 1% by weight or less on the surface of the polyimide film having adhesiveness by drying at 180 ° C. for 2 minutes in a hot air circulating dryer. Got.
[0022]
Example 11 [Fourth Invention]
The NMP solution of polyamideimide used in Example 1 was applied to the peelable film used in Example 1 so that the thickness after drying was 20 μm, and dried at 180 ° C. for 5 minutes in a hot air circulating dryer. Thus, an adhesive film having a first adhesive layer having a residual solvent amount of 1% by weight or less was prepared.
On the other hand, an adhesive film having a second adhesive layer having a residual solvent amount of 1 wt% or less was prepared in the same manner as described above for the polyamideimide NMP solution used in Example 5.
Next, the NMP solution of polyamideimide used in Example 5 was applied to the first adhesive layer surface by using a reverse coater so that the thickness after drying was 2 μm, and the coating was performed in a hot air circulation type dryer. A first adhesive layer film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was dried by drying at 3 ° C. for 3 minutes.
The above-obtained second adhesive layer having a residual solvent amount of 1% by weight or less and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight are stacked so as to face each other, and the general-purpose pressure bonding used in Example 1 is used. A roll speed of 1 m / min. Between a pair of heated rolls heated to 100 ° C. using an apparatus. 2 layers of adhesive with a residual solvent amount of 1% by weight or less after peeling off the peelable film of the second adhesive layer by passing through and dried at 180 ° C. for 2 minutes in a hot air circulating dryer. An adhesive film having a layer was obtained.
Separately, an adhesive film having a third adhesive layer having a residual solvent amount of 1% by weight or less was prepared in the same manner as in the preparation of the adhesive film having the first adhesive layer.
Next, the NMP solution of polyamideimide used in Example 5 was applied to the surface of the third adhesive layer by using a reverse coater so that the thickness after drying was 2 μm. A third adhesive film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was dried by drying at 3 ° C. for 3 minutes.
An adhesive layer surface of an adhesive film having two adhesive layers with a residual solvent amount of 1% by weight or less obtained as described above and an organic solvent residual adhesive layer with a residual solvent amount of 10% by weight are stacked to face each other. 1 between a pair of heated rolls heated to 100 ° C. using the general-purpose pressure bonding apparatus used in No. 1 and a roll speed of 1 m / min. After being passed through and pressure-bonded, it was dried in a hot air circulating dryer at 180 ° C. for 2 minutes to produce an adhesive tape according to the production method of the present invention with a residual solvent amount of 1% by weight or less.
[0023]
Example 12 [Fifth Invention]
The NMP solution of polyamideimide used in Example 1 was applied to the peelable film used in Example 1 so that the thickness after drying was 20 μm, and dried at 180 ° C. for 5 minutes in a hot air circulating dryer. Thus, an adhesive film having a first adhesive layer having a residual solvent amount of 1% by weight or less was prepared.
Separately, an adhesive film having a second adhesive layer having a residual solvent amount of 1% by weight or less was prepared in the same manner as described above for the polyamideimide NMP solution used in Example 5.
Next, the NMP solution of polyamideimide used in Example 5 was applied to the first adhesive layer surface by using a reverse coater so that the thickness after drying was 2 μm, and the coating was performed in a hot air circulation type dryer. A first adhesive layer film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was dried by drying at 3 ° C. for 3 minutes.
The above-obtained second adhesive layer having a residual solvent amount of 1% by weight or less and an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight are stacked so as to face each other, and the general-purpose pressure bonding used in Example 1 is used. A roll speed of 1 m / min. Between a pair of heated rolls heated to 100 ° C. using an apparatus. 2 layers of adhesive with a residual solvent amount of 1% by weight or less after drying at 180 ° C. for 2 minutes in a hot air circulating drier. An adhesive film having a layer was obtained.
Separately, polyamideimide having a glass transition temperature of 230 ° C. was injection-molded to a thickness of 20 μm to produce a single-layer adhesive film having adhesiveness.
Next, the NMP solution of the polyamideimide used in Example 5 was applied to the surface of the single-layer adhesive film using a reverse coater so that the thickness after drying was 2 μm, and 80 ° C. in a hot air circulating dryer. A single-layer adhesive film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was produced by drying at 3 ° C. for 3 minutes.
An adhesive layer surface of an adhesive film having two adhesive layers with a residual solvent amount of 1% by weight or less obtained as described above and an organic solvent residual adhesive layer with a residual solvent amount of 10% by weight are stacked to face each other. 1 between a pair of heated rolls heated to 100 ° C. using the general-purpose pressure bonding apparatus used in No. 1 and a roll speed of 1 m / min. After being passed through and pressure-bonded, it was dried at 180 ° C. for 2 minutes in a hot air circulating dryer, and an adhesive tape according to the production method of the present invention was produced with a residual solvent amount of 1% by weight or less.
[0024]
Example 13 [Sixth Invention]
The NMP solution of polyamideimide used in Example 1 was applied to the peelable film used in Example 1 so that the thickness after drying was 20 μm, and dried at 180 ° C. for 5 minutes in a hot air circulating dryer. An adhesive film having an adhesive layer with a residual solvent amount of 1% by weight or less was prepared.
Next, the NMP solution of polyamideimide used in Example 5 was applied to the surface of the single-layer adhesive film made of polyimide used in Example 9 using a reverse coater so that the thickness after drying was 2 μm, A polyimide single-layer adhesive film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was prepared by drying in a hot air circulating dryer at 80 ° C. for 3 minutes.
The adhesive layer of the adhesive film having the residual solvent amount of 1% by weight or less obtained above and the organic solvent residual adhesive layer having the residual solvent amount of 10% by weight are stacked to face each other, and the general-purpose pressure bonding used in Example 1 is used. A roll speed of 1 m / min. Between a pair of heated rolls heated to 100 ° C. using a bonding apparatus. Then, the film was pressure-bonded and then dried at 180 ° C. for 2 minutes in a hot air circulating dryer to obtain an adhesive film having two adhesive layers with a residual solvent amount of 1% by weight or less.
Separately, polyamideimide having a glass transition temperature of 230 ° C. was injection-molded to a thickness of 20 μm to produce a single-layer adhesive film having adhesiveness.
Next, the NMP solution of polyamideimide used in Example 1 was applied to the surface of the polyimide adhesive layer of the two-layer adhesive film using a reverse coater so that the thickness after drying was 2 μm. A single layer adhesive film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was produced by drying at 80 ° C. for 3 minutes in a dryer.
The single-layer adhesive film obtained above and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight were stacked so as to face each other, and heated to 100 ° C. using the general-purpose pressure bonding apparatus used in Example 1. Between a pair of heating rolls, a roll speed of 1 m / min. After being passed through and pressure-bonded, it was dried at 180 ° C. for 2 minutes in a hot air circulating dryer, and an adhesive tape according to the production method of the present invention was produced with a residual solvent amount of 1% by weight or less.
[0025]
Example 14 [Seventh Invention]
Polyamideimide having a glass transition temperature of 230 ° C. was injection-molded to a thickness of 20 μm to produce a single-layer adhesive film having adhesiveness.
Next, the NMP solution of polyamideimide used in Example 5 was applied to the surface of the single-layer adhesive film made of polyimide used in Example 9 using a reverse coater so that the thickness after drying was 2 μm. A polyimide single-layer adhesive film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was produced by drying in a hot air circulating dryer at 80 ° C. for 3 minutes.
The adhesive layer of the single-layer adhesive film obtained above and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight were stacked so as to face each other, and 100 using the general-purpose pressure bonding apparatus used in Example 1. A roll speed of 1 m / min. Then, the film was pressure-bonded and then dried at 180 ° C. for 2 minutes in a hot air circulating dryer to obtain an adhesive film having two adhesive layers with a residual solvent amount of 1% by weight or less.
Further, in the same manner as described above, a polyamide-imide having a glass transition temperature of 230 ° C. was injection-molded to produce a single-layer adhesive film having adhesiveness.
Next, the NMP solution of polyamideimide used in Example 1 was applied to the polyimide surface of the two-layer adhesive film using a reverse coater so that the thickness after drying was 2 μm, and a hot-air circulating dryer The film was dried at 80 ° C. for 3 minutes to prepare a single-layer adhesive film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface.
The single-layer adhesive film obtained above and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight were stacked so as to face each other, and heated to 100 ° C. using the general-purpose pressure bonding apparatus used in Example 1. Between a pair of heating rolls, a roll speed of 1 m / min. After being passed through and pressure-bonded, it was dried in a hot air circulating dryer at 180 ° C. for 2 minutes to produce an adhesive tape according to the production method of the present invention with a residual solvent amount of 1% by weight or less.
[0026]
Example 15 [Eighth Invention]
Polyamideimide having a glass transition temperature of 230 ° C. was injection-molded to a thickness of 20 μm to produce a single-layer adhesive film having adhesiveness.
Next, the NMP solution of polyamideimide used in Example 5 was applied to the surface of the single-layer adhesive film made of polyimide used in Example 9 using a reverse coater so that the thickness after drying was 2 μm, A polyimide single-layer adhesive film having an organic solvent residual adhesive layer having a residual solvent amount of 10% by weight on the surface was prepared by drying in a hot air circulating dryer at 80 ° C. for 3 minutes.
The adhesive layer of the single-layer adhesive film obtained above and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight were stacked so as to face each other, and 100 using the general-purpose pressure bonding apparatus used in Example 1. A roll speed of 1 m / min. Then, the film was pressure-bonded and then dried at 180 ° C. for 2 minutes in a hot air circulating dryer to obtain an adhesive film having two adhesive layers with a residual solvent amount of 1% by weight or less.
In addition, the NMP solution of polyamideimide used in Example 1 was applied to the peelable film used in Example 1 so that the thickness after drying was 20 μm, and was heated at 180 ° C. for 5 minutes in a hot air circulating dryer. An adhesive film having an adhesive layer with a residual solvent amount of 1% by weight or less was produced by drying.
Next, the NMP solution of polyamideimide used in Example 1 was applied to the surface of the two-layer adhesive film using a reverse coater so that the thickness after drying was 2 μm. The adhesive film which dried on 80 degreeC for 3 minute (s) and has the organic solvent residual adhesive layer of 10 weight% of residual solvent on the surface was produced.
The adhesive layer surface made of polyimide of the adhesive film having a residual solvent amount of 1% by weight or less obtained above and the organic solvent residual adhesive layer having a residual solvent amount of 10% by weight are stacked so as to face each other, and the general-purpose used in Example 1 Between a pair of heated rolls heated to 100 ° C. using a pressure bonding and bonding apparatus of 1 m / min. After being passed through and pressure-bonded, it was dried in a hot air circulating dryer at 180 ° C. for 2 minutes to produce an adhesive tape according to the production method of the present invention with a residual solvent amount of 1% by weight or less.
[0027]
Comparative Example 1
The NMP solution of polyamideimide used in Example 1 was applied to the treated surface of the 38 μm-thick peelable film used in Example 1 so that the thickness after drying was 20 μm, and in a hot-air circulating dryer And dried at 180 ° C. for 5 minutes to produce a first adhesive film having a residual organic solvent amount of 1% by weight or less. Similarly, a second adhesive film was produced.
Next, the first and second adhesive layers of the coated film are stacked so as to face each other, and a pair of heating rolls is used under the same conditions as in Example 1 using the general-purpose pressure bonding apparatus used in Example 1. And tried to paste.
[0028]
Comparative Example 2
The NMP solution of polyamideimide used in Example 1 was applied to the treated surface of the 38 μm-thick peelable film used in Example 1 so that the thickness after drying was 20 μm, and in a hot-air circulating dryer And dried at 180 ° C. for 5 minutes to produce an adhesive film having a residual organic solvent amount of 1% by weight or less. Similarly, a second adhesive film was produced.
Next, the first and second adhesive layers of the coated film were overlapped so as to face each other, and the heating roll temperature was set to 250 ° C. using the general-purpose pressure bonding apparatus used in Example 1. Example 1 A pair of heating rolls was passed under the same conditions, and bonding was attempted.
[0029]
Comparative Example 3
An adhesive tape having two adhesive layers was prepared in the same manner as in Example 1 except that the drying temperature of the organic solvent-soluble adhesive of Example 1 was changed to 120 ° C. and the residual solvent amount was 2% by weight. Obtained.
[0030]
As a result of bonding the adhesive layers by the methods of the above Examples and Comparative Examples, Examples 1 to 15 could be bonded together to obtain an adhesive tape for electronic parts, but Comparative Examples 1 to 3 were bonded together. I could not.
[0031]
(Practical characteristics as adhesive tape for electronic parts)
(1) Strength evaluation of adhesive tape
The adhesive tapes of Examples 1 to 15 were cut into small pieces of 20 mm × 20 mm, and a 10 mm wide copper foil was attached to the copper foil and the adhesive at a temperature of 1 second at 300 ° C. for 1 second, followed by 90 at room temperature. The peel strength was measured. As a result, all of the adhesive tapes of Examples 1 to 15 were 500 g / 10 mm or more, and it was confirmed that the adhesive strength of the adhesive tape of the present invention was strong.
(2) Semiconductor package reliability test using adhesive tape
The adhesive tapes obtained in Examples 1 to 15 were cut into small pieces of 20 mm × 20 mm, and the lead frame was bonded under conditions of 300 ° C. for 1 second to assemble a semiconductor package. These semiconductor packages were subjected to a PCBT (Puresur Cooker Biased Test) test under the conditions of 5 V application, 121 ° C., 2 atm, and 100% RH. As a result, the semiconductor package using the adhesive tapes of Examples 1 to 15 did not cause a short circuit even after 1000 hours.
[0032]
【The invention's effect】
The production method of the present invention uses an adhesive tape for electronic components in which two or more layers of adhesive are laminated at a low temperature even with an adhesive having a high glass transition temperature, using a minimum coating facility and a general-purpose pressure bonding apparatus. It can be manufactured at low cost.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an example of an adhesive tape for electronic parts produced by the production method of the present invention.
[Brief description of symbols]
1 ... first adhesive layer, 2 ... organic solvent residual adhesive layer,
3 ... second adhesive layer, 4 ... organic solvent soluble adhesive layer

Claims

(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) A step of creating an adhesive film (b) in which a second adhesive layer is formed on one surface of the substrate,
(3) A coating solution composed of an organic solvent-soluble adhesive is applied to the surface of either one of the adhesive film (a) or the adhesive film (b) and dried to form an organic solvent residual adhesive layer. Forming an adhesive film (c) to form,
(4) Adhesion of the step (3) the adhesive film that does not form an organic solvent residual adhesive layer (b) in the adhesive layer surface or the step of adhesive films which do not form an organic solvent residual adhesive layer (a) (3) in Ri Do the step of crimping superposed so as to face the adhesive layer surface and an organic solvent residual adhesive layer of the adhesive film (c), any of the base material in the step (1) in the base material or the step (2) adhesive tape for electronic parts manufacturing method but characterized by peelable film der Rukoto.

(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) A coating liquid composed of an organic solvent-soluble adhesive is applied to one surface of the adhesive layer of the adhesive film (a) or the single-layer adhesive film (b) having adhesiveness, and dried. A step of forming an adhesive film (c) by forming an organic solvent residual adhesive layer;
(3) the step (2) do not form an organic solvent residual adhesive layer in the adhesive layer surface or the step of adhesive films which do not form an organic solvent residual adhesive layer (a) (2) In the single-layer adhesive film (b the front surface and the adhesive film (c) adhesive tape for electronic parts manufacturing method of superposition, characterized in that it comprises the step of pressure bonding so as to face the organic solvent remaining adhesive layer of).

(1) A coating solution composed of an organic solvent-soluble adhesive is applied to one surface of the adhesive single-layer adhesive film (a) or the adhesive single-layer adhesive film (b) and dried. And forming an adhesive film (c) by forming an organic solvent residual adhesive layer,
(2) It comprises a step of superposing and pressing the surface of the adhesive film (a) or (b) not forming the organic solvent residual adhesive layer and the organic solvent residual adhesive layer of the adhesive film (c) so as to face each other. The manufacturing method of the adhesive tape for electronic components characterized by the above-mentioned.

(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) A step of creating an adhesive film (b) in which a second adhesive layer is formed on one surface of the substrate,
(3) A coating solution composed of an organic solvent-soluble adhesive is applied to the surface of either one of the adhesive film (a) or the adhesive film (b) and dried to form an organic solvent residual adhesive layer. Forming an adhesive film (c) to form,
(4) Adhesion of the step (3) the adhesive film that does not form an organic solvent residual adhesive layer (b) in the adhesive layer surface or the step of adhesive films which do not form an organic solvent residual adhesive layer (a) (3) in A step of superposing and pressure-bonding the adhesive layer surface and the organic solvent residual adhesive layer of the adhesive film (c) so as to face each other, peeling one of the base materials to create an adhesive film (d);
(5) A step of creating an adhesive film (e) in which a third adhesive layer is formed on one surface of a substrate made of a peelable film ,
(6) A coating liquid composed of an organic solvent-soluble adhesive is applied to the surface of either the adhesive film (d) or the adhesive film (e) and dried to form an organic solvent residual adhesive layer. Forming the adhesive film (f) by forming,
(7) bonding of said step adhesive films which do not form an organic solvent residual adhesive layer in the adhesive layer surface or the step (6) of the adhesive film that does not form the organic solvent remaining adhesive layer in (6) (d) (e) A method for producing an adhesive tape for electronic parts, comprising a step of superposing and pressing the adhesive layer surface and the organic solvent residual adhesive layer of the adhesive film (f) so as to face each other.

(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) A step of creating an adhesive film (b) in which a second adhesive layer is formed on one surface of the substrate,
(3) A coating solution composed of an organic solvent-soluble adhesive is applied to the surface of one of the adhesive layers of the adhesive film (a) or (b) and dried to form an organic solvent residual adhesive layer. Creating an adhesive film (c);
(4) The adhesive film (a) or the adhesive layer surface of the adhesive film (a) that does not form the organic solvent residual adhesive layer and the organic solvent residual adhesive layer of the adhesive film (c) are overlapped and pressure-bonded, A step of peeling one of the substrates to create an adhesive film (d),
(5) On the surface of any one of the adhesive film (d) or the adhesive single-layer adhesive film (e), an application liquid composed of an organic solvent-soluble adhesive is applied and dried. Forming an adhesive film (f) by forming an organic solvent residual adhesive layer;
(6) A step of pressure-bonding the adhesive film (d) or (e) on which the organic solvent residual adhesive layer is not formed and the organic solvent residual adhesive layer of the adhesive film (f) so as to face each other. The manufacturing method of the adhesive tape for electronic components characterized by these.

(1) forming an adhesive film (a) by forming a first adhesive layer on one surface of the substrate;
(2) A coating liquid composed of an organic solvent-soluble adhesive is applied to one surface of the adhesive layer of the adhesive film (a) or the single-layer adhesive film (b) having adhesiveness, and dried. A step of forming an adhesive film (c) by forming an organic solvent residual adhesive layer;
(3) the step adhesive films which do not form an organic solvent residual adhesive layer (2) an adhesive layer surface or the step in (a) (2) single-layer adhesive films which do not form an organic solvent residual adhesive layer in (b) step of preparing an adhesive film (d) the front surface of an organic solvent remaining adhesive layer of the adhesive film (c) and pressed superposed so as to face,
(4) An organic solvent-soluble adhesive solution is applied to one of the adhesive surfaces of the adhesive film (d) or the adhesive single-layer adhesive film (e) and dried to obtain an organic solvent. Forming an adhesive film (f) by forming a residual adhesive layer;
(5) adhesive surface or the step (4) does not form an organic solvent residual adhesive layer in a single layer adhesive film of the step (4) an adhesive film which does not form an organic solvent residual adhesive layer in (d) of (e) the front surface and the adhesive film (f) adhesive tape for electronic parts manufacturing method of superposition, characterized in that it comprises the step of pressure bonding so as to face the organic solvent remaining adhesive layer.

(1) A coating solution composed of an organic solvent-soluble adhesive is applied to one surface of the adhesive single-layer adhesive film (a) or the adhesive single-layer adhesive film (b) and dried. And forming an adhesive film (c) by forming an organic solvent residual adhesive layer,
(2) A step of overlapping and pressing the surface of the adhesive film (a) or (b) not forming the organic solvent residual adhesive layer and the organic solvent residual adhesive layer of the adhesive film (c) so as to face each other,
(3) A coating liquid composed of an organic solvent-soluble adhesive is applied to the surface of any one of the adhesive film (c) and the adhesive layer (d) having adhesiveness, and dried. Forming an adhesive film (e) by forming an organic solvent residual adhesive layer;
(4) A step of bonding the pressure-sensitive adhesive layer (c) or the adhesive layer surface of the adhesive film (d) that does not form the organic solvent residual adhesive layer and the organic solvent residual adhesive layer of the adhesive film (e) so as to face each other. The manufacturing method of the adhesive tape for electronic components characterized by these.

(1) A coating solution composed of an organic solvent-soluble adhesive is applied to one surface of the adhesive single-layer adhesive film (a) or the adhesive single-layer adhesive film (b) and dried. And forming an adhesive film (c) by forming an organic solvent residual adhesive layer,
(2) the step (1) an organic solvent residual surface or the step of not forming the adhesive layer monolayer adhesive film (a) (1) do not form an organic solvent residual adhesive layer in a single layer adhesive film in (b) A step of laminating and pressing the surface of the adhesive film and the organic solvent residual adhesive layer of the adhesive film (c) so as to face each other,
(3) a step of creating an adhesive film (d) having an adhesive layer formed on one surface of the substrate;
(4) A coating solution composed of an organic solvent-soluble adhesive is applied to one of the adhesive surfaces of the adhesive film or the adhesive film (d) obtained by superimposing in the step (2) , dried, and organic Forming an adhesive film (e) by forming a solvent residual adhesive layer;
(5) adhesive films that do not form an organic solvent residual adhesive layer in the step surface or the step of adhesive film obtained by superimposing the step which does not form an organic solvent residual adhesive layer (2) in (4) (4) A method for producing an adhesive tape for electronic parts, comprising the step of superposing and pressing the adhesive layer surface of (d) and the organic solvent residual adhesive layer of the adhesive film (e) so as to face each other.

The method for producing an adhesive tape for electronic parts according to claim 1, 2, 4, 5, 6 or 8, wherein the substrate is a polyethylene terephthalate film subjected to a release treatment.

The single-layer adhesive film having an adhesive property is a single-layer adhesive formed by injection molding and / or a single-layer adhesive formed of a polyimide film. The manufacturing method of the adhesive tape for electronic components of description.

The amount of the organic solvent remaining in the organic solvent-soluble adhesive layer in which the organic solvent is left is in the range of 5 to 40% by weight. Or the manufacturing method of the adhesive tape for electronic components of 8.

The thickness after drying of the organic solvent-soluble adhesive layer in which the organic solvent is left is 0.5 to 5 µm or less, 1, 2, 3, 4, 5, 6, 7 or 8 The manufacturing method of the adhesive tape for electronic components of description.

Among the first adhesive layer, the second adhesive layer and the adhesive single-layer adhesive film, the glass transition temperature of the resin forming the adhesive tape by any two has a difference of 20 ° C. or more. The method for producing an adhesive tape for electronic parts according to claim 1, 2 or 3.

The adhesive tape is formed by any three of the first adhesive layer, the second adhesive layer, and the single-layer adhesive film having adhesiveness, and the glass transition temperature of the resin serving as the three intermediate layers is the highest. The method for producing an adhesive tape for an electronic component according to claim 4, wherein the adhesive tape is high.