JP3822970B2 - Laminated body - Google Patents
Laminated body Download PDFInfo
- Publication number
- JP3822970B2 JP3822970B2 JP34682797A JP34682797A JP3822970B2 JP 3822970 B2 JP3822970 B2 JP 3822970B2 JP 34682797 A JP34682797 A JP 34682797A JP 34682797 A JP34682797 A JP 34682797A JP 3822970 B2 JP3822970 B2 JP 3822970B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- weight
- elution
- propylene
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- -1 polypropylene Polymers 0.000 claims description 66
- 239000004743 Polypropylene Substances 0.000 claims description 54
- 229920001155 polypropylene Polymers 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 40
- 238000010828 elution Methods 0.000 claims description 37
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 27
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 27
- 239000004711 α-olefin Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 238000009826 distribution Methods 0.000 claims description 15
- 229920005992 thermoplastic resin Polymers 0.000 claims description 15
- 238000005194 fractionation Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 230000000630 rising effect Effects 0.000 claims description 10
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 229920005606 polypropylene copolymer Polymers 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 2
- 230000001186 cumulative effect Effects 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920001384 propylene homopolymer Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 51
- 238000004519 manufacturing process Methods 0.000 description 50
- 238000006116 polymerization reaction Methods 0.000 description 50
- 230000000052 comparative effect Effects 0.000 description 25
- 150000001875 compounds Chemical class 0.000 description 22
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 16
- 230000000704 physical effect Effects 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 16
- 150000003609 titanium compounds Chemical class 0.000 description 14
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000010936 titanium Substances 0.000 description 12
- 230000000903 blocking effect Effects 0.000 description 11
- 239000001257 hydrogen Substances 0.000 description 11
- 229910052739 hydrogen Inorganic materials 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 230000001771 impaired effect Effects 0.000 description 9
- 239000000155 melt Substances 0.000 description 9
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 8
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- YONPGGFAJWQGJC-UHFFFAOYSA-K titanium(iii) chloride Chemical class Cl[Ti](Cl)Cl YONPGGFAJWQGJC-UHFFFAOYSA-K 0.000 description 8
- UBRWPVTUQDJKCC-UHFFFAOYSA-N 1,3-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC(C(C)(C)OOC(C)(C)C)=C1 UBRWPVTUQDJKCC-UHFFFAOYSA-N 0.000 description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 229920005604 random copolymer Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 6
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 5
- SZNWCVFYBNVQOI-UHFFFAOYSA-N [O-]CC.C(C)[Al+2].[O-]CC.[O-]CC.C(C)[Al+2] Chemical compound [O-]CC.C(C)[Al+2].[O-]CC.[O-]CC.C(C)[Al+2] SZNWCVFYBNVQOI-UHFFFAOYSA-N 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005469 granulation Methods 0.000 description 5
- 230000003179 granulation Effects 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- 150000002497 iodine compounds Chemical class 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 239000004566 building material Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- YNLAOSYQHBDIKW-UHFFFAOYSA-M diethylaluminium chloride Chemical compound CC[Al](Cl)CC YNLAOSYQHBDIKW-UHFFFAOYSA-M 0.000 description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 3
- 239000012760 heat stabilizer Substances 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- HVTICUPFWKNHNG-UHFFFAOYSA-N iodoethane Chemical compound CCI HVTICUPFWKNHNG-UHFFFAOYSA-N 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 150000002681 magnesium compounds Chemical class 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- AWHULINHLGMMED-UHFFFAOYSA-M (2,6-ditert-butylphenoxy)-diethylalumane Chemical compound CC[Al](CC)OC1=C(C(C)(C)C)C=CC=C1C(C)(C)C AWHULINHLGMMED-UHFFFAOYSA-M 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011437 continuous method Methods 0.000 description 2
- 239000002537 cosmetic Substances 0.000 description 2
- SJJCABYOVIHNPZ-UHFFFAOYSA-N cyclohexyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C1CCCCC1 SJJCABYOVIHNPZ-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- CQYBWJYIKCZXCN-UHFFFAOYSA-N diethylaluminum Chemical compound CC[Al]CC CQYBWJYIKCZXCN-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000009820 dry lamination Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- MVLVMROFTAUDAG-UHFFFAOYSA-N ethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC MVLVMROFTAUDAG-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 2
- 230000002262 irrigation Effects 0.000 description 2
- 238000003973 irrigation Methods 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- 229920006302 stretch film Polymers 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- LCZGNAAHQAITLQ-UHFFFAOYSA-M (2,4-dimethylphenoxy)-diethylalumane Chemical compound CC1=C([O-])C=CC(=C1)C.C(C)[Al+]CC LCZGNAAHQAITLQ-UHFFFAOYSA-M 0.000 description 1
- XJCVHKHUDYZCQA-UHFFFAOYSA-M (2,4-dimethylphenoxy)-dimethylalumane Chemical compound CC1=CC(=C(C=C1)O[Al](C)C)C XJCVHKHUDYZCQA-UHFFFAOYSA-M 0.000 description 1
- BTMQJRZMHISKFQ-UHFFFAOYSA-M (2,6-diphenylphenoxy)-diethylalumane Chemical compound CC[Al](CC)OC1=C(C=2C=CC=CC=2)C=CC=C1C1=CC=CC=C1 BTMQJRZMHISKFQ-UHFFFAOYSA-M 0.000 description 1
- WGYLAJGGFZDGHU-UHFFFAOYSA-M (2,6-diphenylphenoxy)-dimethylalumane Chemical compound C[Al](C)OC1=C(C=2C=CC=CC=2)C=CC=C1C1=CC=CC=C1 WGYLAJGGFZDGHU-UHFFFAOYSA-M 0.000 description 1
- AOJZSZLRKQSQKB-UHFFFAOYSA-M (2,6-ditert-butylphenoxy)-dimethylalumane Chemical compound C[Al](C)OC1=C(C(C)(C)C)C=CC=C1C(C)(C)C AOJZSZLRKQSQKB-UHFFFAOYSA-M 0.000 description 1
- GMVFDOAKMLEXQW-UHFFFAOYSA-M (2-tert-butylphenoxy)-diethylalumane Chemical compound C(C)(C)(C)C1=C([O-])C=CC=C1.C(C)[Al+]CC GMVFDOAKMLEXQW-UHFFFAOYSA-M 0.000 description 1
- 125000006701 (C1-C7) alkyl group Chemical group 0.000 description 1
- UDHAWRUAECEBHC-UHFFFAOYSA-N 1-iodo-4-methylbenzene Chemical compound CC1=CC=C(I)C=C1 UDHAWRUAECEBHC-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- WTFDMMYTNLXKCO-UHFFFAOYSA-M 2,6-ditert-butyl-4-methylphenolate;diethylalumanylium Chemical compound CC[Al](CC)OC1=C(C(C)(C)C)C=C(C)C=C1C(C)(C)C WTFDMMYTNLXKCO-UHFFFAOYSA-M 0.000 description 1
- CJWNFAKWHDOUKL-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 CJWNFAKWHDOUKL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- CMAOLVNGLTWICC-UHFFFAOYSA-N 2-fluoro-5-methylbenzonitrile Chemical compound CC1=CC=C(F)C(C#N)=C1 CMAOLVNGLTWICC-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical class O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- ZZLCFHIKESPLTH-UHFFFAOYSA-N 4-Methylbiphenyl Chemical compound C1=CC(C)=CC=C1C1=CC=CC=C1 ZZLCFHIKESPLTH-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- KXDAEFPNCMNJSK-UHFFFAOYSA-N Benzamide Chemical compound NC(=O)C1=CC=CC=C1 KXDAEFPNCMNJSK-UHFFFAOYSA-N 0.000 description 1
- BFUMCFGCVGSPKK-UHFFFAOYSA-L CCO.CC[Al](Cl)Cl Chemical compound CCO.CC[Al](Cl)Cl BFUMCFGCVGSPKK-UHFFFAOYSA-L 0.000 description 1
- KIQXNIKKGXVPHN-UHFFFAOYSA-N C[O-].C[Al+2].C[O-].C[O-].C[Al+2] Chemical compound C[O-].C[Al+2].C[O-].C[O-].C[Al+2] KIQXNIKKGXVPHN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- AQZGPSLYZOOYQP-UHFFFAOYSA-N Diisoamyl ether Chemical compound CC(C)CCOCCC(C)C AQZGPSLYZOOYQP-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- ICMAFTSLXCXHRK-UHFFFAOYSA-N Ethyl pentanoate Chemical compound CCCCC(=O)OCC ICMAFTSLXCXHRK-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 241000543375 Sideroxylon Species 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- BNJFXDLHHBGYGT-UHFFFAOYSA-M [2,6-di(propan-2-yl)phenoxy]-diethylalumane Chemical compound C(C)(C)C1=C(O[Al](CC)CC)C(=CC=C1)C(C)C BNJFXDLHHBGYGT-UHFFFAOYSA-M 0.000 description 1
- MYJYWWKSQRSJDN-UHFFFAOYSA-M [2,6-di(propan-2-yl)phenoxy]-dimethylalumane Chemical compound CC(C)C1=CC=CC(C(C)C)=C1O[Al](C)C MYJYWWKSQRSJDN-UHFFFAOYSA-M 0.000 description 1
- HPCZVEXMKSSQRF-UHFFFAOYSA-N [O-]CC.C[Al+2].[O-]CC.[O-]CC.C[Al+2] Chemical compound [O-]CC.C[Al+2].[O-]CC.[O-]CC.C[Al+2] HPCZVEXMKSSQRF-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005234 alkyl aluminium group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- YCOXTKKNXUZSKD-UHFFFAOYSA-N as-o-xylenol Natural products CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- ZPECUSGQPIKHLT-UHFFFAOYSA-N bis(ethenyl)-dimethoxysilane Chemical compound CO[Si](OC)(C=C)C=C ZPECUSGQPIKHLT-UHFFFAOYSA-N 0.000 description 1
- YLYNVLJAZMTTIQ-UHFFFAOYSA-N butoxy(diethyl)alumane Chemical compound CCCC[O-].CC[Al+]CC YLYNVLJAZMTTIQ-UHFFFAOYSA-N 0.000 description 1
- KMGBZBJJOKUPIA-UHFFFAOYSA-N butyl iodide Chemical compound CCCCI KMGBZBJJOKUPIA-UHFFFAOYSA-N 0.000 description 1
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- 238000011088 calibration curve Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- HYZXMVILOKSUKA-UHFFFAOYSA-K chloro(dimethyl)alumane;dichloro(methyl)alumane Chemical compound C[Al](C)Cl.C[Al](Cl)Cl HYZXMVILOKSUKA-UHFFFAOYSA-K 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- YYUODOUSPSBQCB-UHFFFAOYSA-N cyclohexyl-dimethoxy-(2-methylpropyl)silane Chemical compound CC(C)C[Si](OC)(OC)C1CCCCC1 YYUODOUSPSBQCB-UHFFFAOYSA-N 0.000 description 1
- QEPVYYOIYSITJK-UHFFFAOYSA-N cyclohexyl-ethyl-dimethoxysilane Chemical compound CC[Si](OC)(OC)C1CCCCC1 QEPVYYOIYSITJK-UHFFFAOYSA-N 0.000 description 1
- MUQCQZPQDMXYAA-UHFFFAOYSA-N cyclopentyl-dimethoxy-(2-methylpropyl)silane Chemical compound CC(C)C[Si](OC)(OC)C1CCCC1 MUQCQZPQDMXYAA-UHFFFAOYSA-N 0.000 description 1
- RSOZFEJGVONDHT-UHFFFAOYSA-N cyclopentyl-ethyl-dimethoxysilane Chemical compound CC[Si](OC)(OC)C1CCCC1 RSOZFEJGVONDHT-UHFFFAOYSA-N 0.000 description 1
- DFLBJDBDZMNGCW-UHFFFAOYSA-N cyclopentylmethyl(dimethoxy)silane Chemical compound CO[SiH](OC)CC1CCCC1 DFLBJDBDZMNGCW-UHFFFAOYSA-N 0.000 description 1
- ZVMRWPHIZSSUKP-UHFFFAOYSA-N dicyclohexyl(dimethoxy)silane Chemical compound C1CCCCC1[Si](OC)(OC)C1CCCCC1 ZVMRWPHIZSSUKP-UHFFFAOYSA-N 0.000 description 1
- JWCYDYZLEAQGJJ-UHFFFAOYSA-N dicyclopentyl(dimethoxy)silane Chemical compound C1CCCC1[Si](OC)(OC)C1CCCC1 JWCYDYZLEAQGJJ-UHFFFAOYSA-N 0.000 description 1
- DLRHRQTUCJTIIV-UHFFFAOYSA-N diethoxy(ethyl)alumane Chemical compound CC[O-].CC[O-].CC[Al+2] DLRHRQTUCJTIIV-UHFFFAOYSA-N 0.000 description 1
- VSYLGGHSEIWGJV-UHFFFAOYSA-N diethyl(dimethoxy)silane Chemical compound CC[Si](CC)(OC)OC VSYLGGHSEIWGJV-UHFFFAOYSA-N 0.000 description 1
- LDYLHMQUPCBROZ-UHFFFAOYSA-N diethyl(methoxy)alumane Chemical compound [O-]C.CC[Al+]CC LDYLHMQUPCBROZ-UHFFFAOYSA-N 0.000 description 1
- UWAMTZZJXXCIOH-UHFFFAOYSA-M diethyl(phenoxy)alumane Chemical compound CC[Al+]CC.[O-]C1=CC=CC=C1 UWAMTZZJXXCIOH-UHFFFAOYSA-M 0.000 description 1
- WSKIFSPWKBHPMS-UHFFFAOYSA-M diethyl-(2-methylphenoxy)alumane Chemical compound CC[Al](CC)OC1=CC=CC=C1C WSKIFSPWKBHPMS-UHFFFAOYSA-M 0.000 description 1
- GJNIEARDILHQSG-UHFFFAOYSA-M diethylalumanylium;2,4,6-trimethylphenolate Chemical compound CC[Al+]CC.CC1=CC(C)=C([O-])C(C)=C1 GJNIEARDILHQSG-UHFFFAOYSA-M 0.000 description 1
- XCJWOKHGPCYUHT-UHFFFAOYSA-M diethylalumanylium;2-(2-methylpropyl)phenolate Chemical compound CC[Al+]CC.CC(C)CC1=CC=CC=C1[O-] XCJWOKHGPCYUHT-UHFFFAOYSA-M 0.000 description 1
- JJSGABFIILQOEY-UHFFFAOYSA-M diethylalumanylium;bromide Chemical compound CC[Al](Br)CC JJSGABFIILQOEY-UHFFFAOYSA-M 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- WERMRYHPOOABQT-UHFFFAOYSA-N dimethoxy-bis(prop-2-enyl)silane Chemical compound C=CC[Si](OC)(CC=C)OC WERMRYHPOOABQT-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- HJYACKPVJCHPFH-UHFFFAOYSA-N dimethyl(propan-2-yloxy)alumane Chemical compound C[Al+]C.CC(C)[O-] HJYACKPVJCHPFH-UHFFFAOYSA-N 0.000 description 1
- PUGXESXSIDVYOL-UHFFFAOYSA-M dimethyl-(2-methylphenoxy)alumane Chemical compound C[Al](C)OC1=CC=CC=C1C PUGXESXSIDVYOL-UHFFFAOYSA-M 0.000 description 1
- FEABLQCPOBERSL-UHFFFAOYSA-M dimethylalumanylium;2,4,6-trimethylphenolate Chemical compound C[Al+]C.CC1=CC(C)=C([O-])C(C)=C1 FEABLQCPOBERSL-UHFFFAOYSA-M 0.000 description 1
- PMKRKEKEUMATJO-UHFFFAOYSA-M dimethylalumanylium;2,6-dimethylphenolate Chemical compound C[Al+]C.CC1=CC=CC(C)=C1[O-] PMKRKEKEUMATJO-UHFFFAOYSA-M 0.000 description 1
- MWNKMBHGMZHEMM-UHFFFAOYSA-N dimethylalumanylium;ethanolate Chemical compound CCO[Al](C)C MWNKMBHGMZHEMM-UHFFFAOYSA-N 0.000 description 1
- SIWKOPAOOWDWHQ-UHFFFAOYSA-M dimethylalumanylium;phenoxide Chemical compound C[Al](C)OC1=CC=CC=C1 SIWKOPAOOWDWHQ-UHFFFAOYSA-M 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- GCPCLEKQVMKXJM-UHFFFAOYSA-N ethoxy(diethyl)alumane Chemical compound CCO[Al](CC)CC GCPCLEKQVMKXJM-UHFFFAOYSA-N 0.000 description 1
- XGAIERUWZADBAO-UHFFFAOYSA-N ethoxy-bis(2-methylpropyl)alumane Chemical compound CCO[Al](CC(C)C)CC(C)C XGAIERUWZADBAO-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- YSLVSGVAVRTLAV-UHFFFAOYSA-N ethyl(dimethoxy)silane Chemical compound CC[SiH](OC)OC YSLVSGVAVRTLAV-UHFFFAOYSA-N 0.000 description 1
- UAIZDWNSWGTKFZ-UHFFFAOYSA-L ethylaluminum(2+);dichloride Chemical compound CC[Al](Cl)Cl UAIZDWNSWGTKFZ-UHFFFAOYSA-L 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- SNHMUERNLJLMHN-UHFFFAOYSA-N iodobenzene Chemical compound IC1=CC=CC=C1 SNHMUERNLJLMHN-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- BQBCXNQILNPAPX-UHFFFAOYSA-N methoxy(dimethyl)alumane Chemical compound [O-]C.C[Al+]C BQBCXNQILNPAPX-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- WVWZECQNFWFVFW-UHFFFAOYSA-N methyl 2-methylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C WVWZECQNFWFVFW-UHFFFAOYSA-N 0.000 description 1
- CXHHBNMLPJOKQD-UHFFFAOYSA-M methyl carbonate Chemical compound COC([O-])=O CXHHBNMLPJOKQD-UHFFFAOYSA-M 0.000 description 1
- DDIZAANNODHTRB-UHFFFAOYSA-N methyl p-anisate Chemical compound COC(=O)C1=CC=C(OC)C=C1 DDIZAANNODHTRB-UHFFFAOYSA-N 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- PVWOIHVRPOBWPI-UHFFFAOYSA-N n-propyl iodide Chemical compound CCCI PVWOIHVRPOBWPI-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- NETBVGNWMHLXRP-UHFFFAOYSA-N tert-butyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C(C)(C)C NETBVGNWMHLXRP-UHFFFAOYSA-N 0.000 description 1
- PSWKAZOCOHMXCW-UHFFFAOYSA-N tert-butyl-ethyl-dimethoxysilane Chemical compound CC[Si](OC)(OC)C(C)(C)C PSWKAZOCOHMXCW-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- SQBBHCOIQXKPHL-UHFFFAOYSA-N tributylalumane Chemical compound CCCC[Al](CCCC)CCCC SQBBHCOIQXKPHL-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- ORYGRKHDLWYTKX-UHFFFAOYSA-N trihexylalumane Chemical compound CCCCCC[Al](CCCCCC)CCCCCC ORYGRKHDLWYTKX-UHFFFAOYSA-N 0.000 description 1
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- LFXVBWRMVZPLFK-UHFFFAOYSA-N trioctylalumane Chemical compound CCCCCCCC[Al](CCCCCCCC)CCCCCCCC LFXVBWRMVZPLFK-UHFFFAOYSA-N 0.000 description 1
- CNWZYDSEVLFSMS-UHFFFAOYSA-N tripropylalumane Chemical compound CCC[Al](CCC)CCC CNWZYDSEVLFSMS-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、適度な柔軟性を有し、透明性、耐衝撃性、耐熱性のバランスに優れ、かつ耐ブロッキング性が良好な積層体に関する。本発明の積層体は、柔軟性のあるシートやフイルムとして好適に使用でき、例えば、自動車内装材、家電・電線材として各種絶縁シート、土木建材分野における防水シート、建材や家電製品等の化粧シート、壁紙、テーブルクロス、潅漑用ホース、化粧品包装用シート、レザー、農業用フイルム、ファスニングテープ、粘着テープ、文具、繊維包装フイルム、ラベル、ストレッチフィルム、保護フイルム、電子部品包装フイルム、食品包装フイルム等に用いることができる。
【0002】
【従来の技術】
従来、柔軟性のあるシートやフイルムとして、軟質塩化ビニル樹脂やビニロンに代表されるポリビニルアルコール系樹脂からなるシートやフイルムが多く用いられてきた。しかし、軟質塩化ビニル樹脂は、分子内に塩素を含むため、焼却時に発生する燃焼ガスが酸性雨の原因となるとして、近年その代替化の動きがある。
【0003】
また、ポリビニルアルコール系樹脂は、湿度の影響を受けやすいことや、熱溶融成形加工適性が不十分であるため、使用される用途が限られる。柔軟性のあるシートやフイルムとしてエチレン・酢酸ビニル共重合体、低密度ポリエチレン、線状低密度ポリエチレン、エチレン・プロピレンエラストマー等エチレンを主体とするものは、柔軟性や耐衝撃性が良いものの、透明性、耐熱性が軟質塩化ビニル樹脂やポリビニルアルコール系樹脂と比べ劣るという問題点がある。
【0004】
一方、ポリプロピレンは、優れた加工性、剛性及び耐熱性を有することからシート、フィルム等に広く利用されている。しかしながら、従来使用されている結晶性の高い、いわゆるアイソタクチックポリプロピレンは剛性、耐熱性に優れる反面、柔軟性、耐衝撃性、透明性に劣るという欠点があった。これらの欠点を改良する手段も多く提案されている。
【0005】
例えば、耐衝撃性を改良する為に、プロピレンと他のα−オレフィンとをランダム共重合させる方法、またはプロピレン単独重合の後にプロピレンとエチレンを共重合させ、ブロック共重合体とする方法等が知られている。しかしながら、ランダム共重合体とした場合には、耐衝撃性、透明性は改良されるものの融点が著しく低下する為に耐熱性が損なわれるといった問題があった。また、ブロック共重合体とした場合には、耐衝撃性、耐熱性には優れるが、透明性が著しく低下するといった問題があった。
【0006】
ポリプロピレンに柔軟性を付与する為に、立体規則性を低下させる方法も知られている。例えば、特開昭59−122506号公報には、分子量分布が広く、且つ、比較的高い融点を有しながらも、柔軟性を有する立体規則性の低いポリプロピレンについて提案されている。しかしながら、この方法に於いては、柔軟性と耐熱性のバランスに於いて未だ改良の余地が残されており、より柔軟なポリプロピレンについても高い耐熱性を有することが望まれていた。また、特開平6−263934号公報には、特定の粘度を有するアタクチック成分を含有させることでゴム弾性に優れたポリプロピレンが提案されているが、得られたポリプロピレンのメルトフローレイトは比較的低く、加工性に未だ改良の余地があった。
【0007】
この課題を解決する方法として、特開平7−157606号公報には重量平均分子量が100万以上の低立体規則性ポリプロピレンを有機過酸化物の存在下に溶融混練することでメルトフローレイトを調整する方法が提案されているが、得られるポリプロピレンの分子量分布が小さくなる為、シート、フィルムに成形する際の溶融張力が低下し、加工性に課題があった。
【0008】
そこで、本発明者は柔軟性、透明性、耐衝撃性、耐熱性に優れ、しかも、加工性の良好な低結晶性ポリプロピレンを提案した(特願平9−164660)。
【0009】
しかしながら、該低結晶性ポリプロピレンによって得られたシート、フイルムは、柔軟性、透明性、耐衝撃性、耐熱性に優れるものの、低結晶成分がシートやフイルムの表面にブーリードアウトし易く、かかる点において改良の余地があった。
【0010】
【発明が解決しようとする課題】
従って、本発明の目的は、適度な柔軟性を有し、透明性、耐衝撃性、耐熱性のバランスに優れ、かつ耐ブロッキング性が良好な積層体を提供することにある。
【0011】
【課題を解決するための手段】
本発明者らは、上記目的を達成すべく鋭意研究を行った結果、特定の分子量分布と結晶性分布を有する低結晶性ポリプロピレンを基材層とし、該基材層の両外層に非粘着性熱可塑性樹脂よりなる層を積層することにより上記目的を全て達成し得ることを見い出し、本発明を完成した。
【0012】
即ち、本発明は、下記1)〜4)の構成を満足する低結晶性ポリプロピレン(a)よりなる層を基材層とし、該基材層の両外層に非粘着性熱可塑性樹脂よりなる層が積層されてなる積層体である。
【0013】
低結晶性ポリプロピレン(a):
1)プロピレン単独重合体、またはプロピレン以外のα−オレフィン単位の含有量が5モル%以下のプロピレンとα−オレフィンとの共重合体
2)メルトフローレイトが0.5〜20g/10分
3)重量平均分子量(Mw)と数平均分子量(Mn)の比で表される分子量分布(Mw/Mn)が4〜15
4)昇温溶離分別法により分別された、横軸を溶出温度(℃)、縦軸を溶出成分の積算重量割合で表した溶出曲線に於いて、20℃未満での溶出成分(A成分)の量が5〜35重量%、20℃以上100℃未満での溶出成分(B成分)の量が10〜40重量%、100℃以上での溶出成分(C成分)が40〜80重量%、A成分、B成分およびC成分の合計が100重量%、B成分とA成分との重量比(B/A)が0.6以上で、且つ、C成分に於けるピークトップ温度が120℃以上。
【0014】
【発明の実施の形態】
本発明において、低結晶性ポリプロピレンは、ポリプロピレン単独重合体、またはプロピレン以外のα−オレフィン単位の含有量が5モル%以下の、プロピレンとα−オレフィンとの共重合体(以下、プロピレン−α−オレフィン共重合体という)により構成される。
【0015】
本発明において、プロピレン以外のα−オレフィンとしては、例えば、エチレン、1−ブテン、1−ペンテン、1−ヘキセン、1−ヘプテン、1−オクテン、3−メチル−1−ブテン、4−メチル−1−ペンテン等を挙げることができる。プロピレン−α−オレフィン共重合体中のα−オレフィン単位の含有量が5モル%を超える場合は、融点の低下により耐熱性が損なわれ、好ましくない。
【0016】
低結晶性ポリプロピレンにおいて、メルトフローレイトが0.5未満ではシート、フイルムの厚薄精度が低下するため好ましくない。また、メルトフローレイトが20を超える場合は溶融張力が低下し、シート、フイルムの加工性が低下するため好ましくない。特に好ましいメルトフローレイトの範囲は1〜15である。
【0017】
尚、低結晶性ポリプロピレンのメルトフローレイトはゲルパーミエーションクロマトグラフィー法(GPC)による重量平均分子量に換算すると概ね20万〜50万の範囲である。
【0018】
低結晶性ポリプロピレンは、GPCにより測定した重量平均分子量(Mw)と数平均分子量(Mn)の比で表される分子量分布(Mw/Mn)が、4〜15、好ましくは5〜15であることが、良好な加工性、柔軟性、透明性、耐衝撃性を得るため必要である。分子量分布が4未満の場合は、シート、フイルムの加工性が低下し、15を超える場合は樹脂の配向の異方性が大きくなり、シート、フイルムの柔軟性、透明性、耐衝撃性が低下するために好ましくない。
【0019】
低結晶性ポリプロピレンはGPCにより測定した重量平均分子量(Mw)における1万以下の成分の量が3重量%以下であることが、本発明の積層体において、ブロッキング防止の点から好ましい。
【0020】
本発明において、昇温溶離分別法とは、例えば、Journal of Applied Polymer Science;Applied Polymer Symposium 45,1−24(1990)に詳細に記述されている方法である。まず高温の高分子溶液を、珪藻土を充填剤として用いた充填カラムに導入し、カラム温度を徐々に低下させることにより充填剤表面に融点の高い成分から順に結晶化させ、次にカラム温度を徐々に上昇させることにより、融点の低い成分から順に溶出させて溶出ポリマー成分を分取する方法である。本発明では実施例で示したように測定装置としてセンシュー科学社製SSC−7300型を用い、溶媒:O−ジクロロベンゼン、流速:2.5ml/min、昇温速度:4℃/Hr、カラム:φ30mm×300mmの条件で測定した値を示している。
【0021】
低結晶性ポリプロピレンの20℃未満での溶出成分(A成分)は、特に本発明の積層体の柔軟性、耐熱性を発現するために必要な成分である。すなわち、A成分の量が5重量%未満では柔軟性が損なわれ、また、35重量%を超えると十分な耐熱性が得られないために好ましくない。より優れた柔軟性や耐熱性を発揮させるためには、A成分の量は、特に、10〜30重量%の範囲であることが好ましい。
【0022】
低結晶性ポリプロピレンの20℃以上100℃未満での溶出成分(B成分)は、特に本発明の積層体の透明性と柔軟性と耐熱性のバランスを発現させるために必要な成分である。即ち、B成分の量が10重量%未満ではシート、フイルムとした場合に良好な透明性、柔軟性が達成されず、また、40重量%を超える場合には耐熱性が不足する。より優れた透明性、柔軟性と耐熱性のバランスを発現させるためには、B成分の量は、特に、10〜30重量%の範囲であることが好ましい。
【0023】
低結晶性プロピレンの100℃以上での溶出成分(C成分)は、本発明の積層体の特徴である優れた耐熱性を得るために必要な成分である。すなわち、C成分の量が40重量%未満であるか、またはC成分におけるピークトップ温度が120℃未満ではシート、フイルムとした場合の耐熱性が損なわれ、またC成分の量が80重量%を超える場合には、柔軟性が損なわれるために好ましくない。柔軟性および耐熱性を勘案するとC成分の量は、特に、50重量%を越え、70重量%以下であることが好ましい。更に、より優れた耐熱性を得るためにC成分が115℃以上の溶出成分を60重量%以上有することが好ましい。 低結晶性ポリプロピレンのB成分の量とA成分の重量比(B/A)は0.6以上であり、好ましくは0.7以上である。B成分の量とA成分の重量比(B/A)が0.6未満の場合、本発明の特徴である透明性、柔軟性と耐熱性のバランスが十分発現されず本発明の目的が達成されない。
【0024】
低結晶性ポリプロピレンのA成分、B成分およびC各成分の分子量分布(Mw/Mn)はそれぞれ4〜15であることが良好な加工性を得るために好ましい。
【0025】
低結晶性ポリプロピレンは、示差走査熱量測定法(DSC)で測定された融点が、150℃以上で且つ、融解熱が100J/g以下であることが好ましい。該融点が150℃未満の場合は、十分な耐熱性が得られず、また該融解熱が100J/gを超える場合には、柔軟性が損なわれ、好ましくない。
【0026】
低結晶性ポリプロピレンは、JIS K7207に準拠した測定方法により求められる熱変形温度が50℃以上であることが好ましい。
【0027】
本発明の低結晶性ポリプロピレンの製造方法は、本発明の要件を満たす限り特に限定されるものではないが、例えば、以下の方法で得ることができる。
【0028】
下記触媒成分〔A〕、〔B〕、〔C〕
〔A〕チタン化合物
〔B〕一般式 R1 nAlX3-n
(但し、R1は炭素数1〜10の飽和炭化水素基、Xはハロゲン原子、nは0〜3の整数)で表される有機アルミニウム化合物
〔C〕一般式(I)
R2 n/2Al(OR3)3-n/2 (I)
(但し、R2、R3は同種または異種の炭素数1〜10の飽和炭化水素基、nは1〜4の整数)
または、一般式(II)
【0029】
【化1】
【0030】
(但し、R4はアルキル基、アリール基またはハロゲン原子であり、R5、R6およびR7は水素原子、アルキル基またはアリール基であり、nは0<n<3である。)
で表される有機アルコキシアルミニウム化合物の存在下に、先ず第1段階にプロピレンの単独重合、またはプロピレンと他のα−オレフィンの共重合を水素の不存在下または存在下に行い、次いで第2段階として、上記〔A〕、〔B〕、〔C〕成分の存在下に、更に電子供与体化合物〔D〕を添加して第2段階の重合を行い、第1段階に比べ第2段階の水素濃度を増加させる方法である。
【0031】
上記チタン化合物〔A〕は、オレフィンの重合に使用されることが公知のチタン化合物が何ら制限なく利用される。これらチタン化合物は担持型チタン化合物と三塩化チタン化合物とに大別される。担持型チタン化合物の製法は、公知の方法が何ら制限なく採用される。例えば、特開昭56−155206号公報、同56−136806、同57−34103、同58−8706、同58−83006、同58−138708、同58−183709、同59−206408、同59−219311、同60−81208、同60−81209、同60−186508、同60−192708、同61−211309、同61−271304、同62−15209、同62−11706、同62−72702、同62−104810等に示されている方法が採用される。
【0032】
具体的には、例えば四塩化チタンを塩化マグネシウムのようなマグネシウム化合物と共粉砕する方法、アルコール、エーテル、エステル、ケトン又はアルデヒド等の電子供与体の存在下にハロゲン化チタンとマグネシウム化合物とを共粉砕する方法、又は溶媒中でハロゲン化チタン、マグネシウム化合物及び電子供与体を接触させる方法が挙げられる。 また、三塩化チタン化合物としては公知のα、β、γまたはδ−三塩化チタンが挙げられる。これらの三塩化チタン化合物の調製方法は、例えば、特開昭47−34478号公報、同50−126590、同50−114394、同50−93888、同50−123091、同50−74594、同50−104191、同50−98489、同51−136625、同52−30888、同52−35283等に示されている方法が採用される。
【0033】
次に有機アルミニウム化合物〔B〕は、オレフィンの重合に使用されることが公知の化合物が何ら制限なく採用される。例えば、トリメチルアルミニウム、トリエチルアルミニウム、トリ−n−プロピルアルミニウム、トリ−n−ブチルアルミニウム、トリ−i−ブチルアルミニウム、トリ−n−ヘキシルアルミニウム、トリ−n−オクチルアルミニウム、トリーn−デシルアルミニウム等のトリアルキルアルミニウム類またはジエチルアルミニウムモノクロライド、ジエチルアルミニウムブロマイド等のジエチルアルミニウムモノハライド類またはメチルアルミニウムセスキクロライド、エチルアルミニウムセスキクロライド、エチルアルミニウムジクロライド等のアルキルアルミニウムハライド類などが挙げられる。 また、有機アルコキシアルミニウム化合物〔C〕は、アルキルアルミニウムまたはアルキルアルミニウムハライドとアルコール類の反応生成物であり、前記一般式(I)(II)で表される有機アルコキシアルミニウム化合物が何ら制限なく採用される。
【0034】
一般式(I)で表される有機アルコキシアルミニウム化合物としては、例えば、ジメチルアルミニウムメトキシド、ジメチルアルミニウムエトキシド、ジメチルアルミニウムイソプロポキシド、ジエチルアルミニウムメトキシド、ジエチルアルミニウムエトキシド、ジエチルアルミニウム−n−ブトキシド、メチルアルミニウムセスキメトキシド、メチルアルミニウムセスキエトキシド、エチルアルミニウムセスキエトキシド、エチルアルミニウムジエトキシド、ジイソブチルアルミニウムエトキシド、エチルアルミニウムクロライドモノエトキシド等が挙げられる。
【0035】
また、一般式(II)で表される有機アルコキシアルミニウム化合物としては、例えば、ジメチルアルミニウムフェノキシド、ジメチルアルミニウム(2−メチルフェノキシド)、ジメチルアルミニウム(2,4−ジメチルフェノキシド)、ジメチルアルミニウム(2,6−ジメチルフェノキシド)、ジメチルアルミニウム(2,4,6−トリメチルフェノキシド)、ジメチルアルミニウム(2,6−ジイソプロピルフェノキシド)、ジメチルアルミニウム(2,6−ジ−t−ブチルフェノキシド)、ジメチルアルミニウム(2,6−ジフェニルフェノキシド)、ジエチルアルミニウムフェノキシド、ジエチルアルミニウム(2−メチルフェノキシド)、ジエチルアルミニウム(2,4−ジメチルフェノキシド)、ジエチルアルミニウム(2,6−ジメチルフェノキシド)、ジエチルアルミニウム(2,4,6−トリメチルフェノキシド)、ジエチルアルミニウム(2,6−ジイソプロピルフェノキシド)、ジエチルアルミニウム(2−イソブチルフェノキシド)、ジエチルアルミニウム(2−t−ブチルフェノキシド)、ジエチルアルミニウム(2,6−ジ−t−ブチルフェノキシド)、ジエチルアルミニウム(2,6−ジ−t−ブチル−4−メチルフェノキシド)、ジエチルアルミニウム(2,6−ジフェニルフェノキシド)等が挙げられる。
【0036】
更に、電子供与体化合物〔D〕は、オレフィンの立体規則性改良に使用されることが公知の化合物が何ら制限なく採用される。例えば、メタノール、エタノール、プロパノール、ブタノール、ペンタノール、ヘキサノール、オクタノール、イソプロピルアルコール、イソアミルアルコール等のアルコール類、フェノール、クレゾール、クミルフェノール、キシレノール、ナフトール等のフェノール類、アセトン、メチルエチルケトン、アセトフェノン、ベンゾフェノン等のケトン類、アセトアルデヒド、プロピオンアルデヒド、ベンズアルデヒド等のアルデヒド類、ギ酸メチル、酢酸メチル、酢酸エチル、酢酸ブチル、酢酸ビニル、プロピオン酸メチル、プロピオン酸エチル、吉草酸エチル、ステアリン酸エチル、アクリル酸エチル、メタクリル酸メチル、安息香酸エチル、トルイル酸メチル、アニス酸メチル、フタル酸エチル、炭酸メチル、ブチロラクトン等の有機酸エステル類、メチルエーテル、エチルエーテル、イソプロピルエーテル、イソアミルエーテル、テトラヒドロフラン、アニソール、ジエチレングリコールジメチルエーテル等のエーテル類、酢酸アミド、安息香酸アミド、マレイン酸アミド等の酸アミド類、メチルアミン、エチルアミン、ピペリジン、ピリジン、アニリン等のアミン類、アセトニトリル、ベンゾニトリル等のニトリル類、ジメチルジメトキシシラン、ジエチルジメトキシシラン、ケイ酸エチル、ジビニルジメトキシシラン、ジアリルジメトキシシラン、ジフェニルジメトキシシラン、メチルフェニルジメトキシシラン、メチルトリエトキシシラン、エチルトリエトキシシラン、ビニルトリエトキシシラン、ブチルトリエトキシシラン、ペンチルトリエトキシシラン、イソプロピルトリエトキシシラン、シクロヘキシルメチルジメトキシシラン、ジt−ブチルジメトキシシラン、t−ブチルエチルジメトキシシラン、ジt−アミルジメトキシシラン、ジシクロペンチルジメトキシシラン、ジシクロヘキシルジメトキシシラン、t−ブチルメチルジメトキシシラン、t−ブチルエチルジメトキシシラン、シクロペンチルメチルジメトキシシラン、シクロペンチルエチルジメトキシシラン、シクロペンチルイソブチルジメトキシシラン、シクロヘキシルメチルジメトキシシラン、シクロヘキシルエチルジメトキシシラン、シクロヘキシルイソブチルジメトキシシラン等の有機ケイ素化合物を挙げることができる。またこれらの電子供与体化合物は複数種を同時に用いることも可能である。
【0037】
本発明で用いられるチタン化合物〔A〕、有機アルミニウム化合物〔B〕、有機アルコキシアルミニウム化合物〔C〕及び電子供与体〔D〕の組み合わせは、(1)担持型チタン化合物−トリアルキルアルミニウム−有機アルコキシアルミニウム化合物−電子供与体
(2)三塩化チタン化合物−ジエチルアルミニウムモノハライド−有機アルコキシアルミニウム化合物−電子供与体
(3)三塩化チタン化合物−トリアルキルアルミニウム−有機アルコキシアルミニウム化合物−電子供与体
および、
(4)担持型チタン化合物−三塩化チタン化合物−トリアルキルアルミニウム−有機アルコキシアルミニウム化合物−電子供与体
の組み合わせが、他の製造条件との組み合わせにおいて低結晶性ポリプロピレンの構成を満足するために特に好ましい。
【0038】
上記の各成分の存在下に行う本重合に先立ち、同成分の存在下においてプロピレンの予備重合を行うことが、得られる重合体パウダーの粒子性状を高流動性とすることができるために好適である。
【0039】
予備重合においては、前記〔A〕及び〔B〕、更に必要に応じて〔D〕を用いた系に加えて、本重合で得られる低立体規則性ポリプロピレンの低分子量成分の生成量を低減する目的で、下記一般式(I)で示されるヨウ素化合物〔E〕を添加することも可能である。
【0040】
〔E〕ヨウ素化合物
R−I (I)
(但し、Rはヨウ素原子または炭素数1〜7のアルキル基またはフェニル基である。)
これらの各成分の予備重合での使用量は、触媒の種類、重合の条件に応じて異なるため、これらの各条件に応じて最適の使用量を予め決定すればよい。一般的に好適に使用される範囲を例示すれば下記の通りである。
【0041】
即ち、予備重合に使用される有機アルミニウム化合物〔B〕の使用割合はチタン化合物〔A〕に対してAl/Ti(モル比)で0.1〜100、好ましくは0.1〜20の範囲が、また必要に応じて使用される有機アルコキシアルミニウム化合物〔C〕はチタン化合物〔A〕に対して〔C〕/Ti(モル比)で0.01〜100、好ましくは0.01〜10の範囲が、また、電子供与体化合物〔D〕の使用割合はチタン化合物〔A〕に対して〔D〕/Ti(モル比)で0.01〜100、好ましくは0.01〜10の範囲がそれぞれ好適である。また、必要に応じて使用されるヨウ素化合物〔E〕の使用割合はチタン化合物〔A〕に対してI/Ti(モル比)で0.1〜100、好ましくは0.5〜50の範囲である。
【0042】
該予備重合で好適に使用し得るヨウ素化合物を具体的に示すと次の通りである。例えば、ヨウ素、ヨウ化メチル、ヨウ化エチル、ヨウ化プロピル、ヨウ化ブチル、ヨードベンゼン、p−ヨウ化トルエン等である。特に、ヨウ化メチル、ヨウ化エチルが好適である。
【0043】
前記触媒成分の存在下にα−オレフィンを重合する予備重合量は予備重合条件によって異なるが、一般に0.1〜500g/g・Ti化合物、好ましくは1〜100g/g・Ti化合物の範囲であれば十分である。また予備重合で使用するα−オレフィンはプロピレン単独でもよく、該重合パウダーの物性に悪影響を及ぼさない範囲で、他のα−オレフィン、例えば、エチレン、1−ブテン、1−ペンテン、1−ヘキセン、4−メチルペンテン−1等をプロピレンと混合しても良い。また予備重合を多段階に行い、各段階で異なるα−オレフィンモノマーを予備重合させることもできる。各予備重合の段階で水素を共存させることも可能である。
【0044】
該予備重合は通常スラリー重合を適用させるのが好ましく、溶媒として、ヘキサン、ヘプタン、シクロヘキサン、ベンゼン、トルエンなどの飽和脂肪族炭化水素もしくは芳香族炭化水素を単独で、又はこれらの混合溶媒を用いることができる。
【0045】
該予備重合温度は、−20〜100℃、特に0〜60℃の範囲が好ましい。予備重合時間は、予備重合温度及び予備重合での重合量に応じ適宜決定すればよく、予備重合における圧力は限定されるものではないが、スラリー重合の場合は、一般に大気圧〜5kg/cm2G程度である。該予備重合は、回分、半回分、連続のいずれの方法で行ってもよい。
【0046】
前記予備重合に次いで本重合が実施される。低結晶性ポリプロピレンの本重合においては、本重合を条件の異なる2段階以上の多段重合で行うことが特定の分子量分布と結晶性分布を満足する為に好ましい。
【0047】
本重合の第1段階で使用される有機アルミニウム化合物〔B〕の使用量は、チタン化合物含有予備重合体中のチタン原子に対し、Al/Ti(モル比)で、1〜1000、好ましくは2〜500の範囲である。また、有機アルコキシアルミニウム化合物〔C〕の使用量は、上記有機アルミニウム化合物〔B〕1モルに対して0.01〜10モル、好ましくは0.1〜10モルである。更に、本重合の第2段階で使用される電子供与体〔D〕は、第1段階で使用される有機アルミニウム化合物〔B〕1モルに対して0.001〜10モル、好ましくは0.01〜1モルの範囲である。
【0048】
第1段階の重合においては、予備重合で得られたチタン化合物含有予備重合体と前記〔B〕、〔C〕の重合系への添加順序は特に限定されるものではなく、また、各成分が予め混合されたものを使用することもできる。
【0049】
第1段階でのプロピレンの重合は、プロピレン単独または本発明の要件を満足する範囲内でのプロピレンと他のα−オレフィンの混合物を供給して、水素不存在下または存在下で実施し、引き続き、電子供与体化合物〔D〕と水素を添加して第2段階の重合を実施すればよい。
【0050】
第1段階と第2段階で水素濃度の異なる条件で重合を行うことが重要である。第2段階の重合においては、第1段階よりも水素濃度を増加さることで、第1段階で重合するポリマーよりも低い分子量の成分を重合する。更に、第2段階において追配される電子供与体は第2段階で重合するポリマーの結晶性を第1段階のポリマーより増加させ、以上の効果から特定の分子量分布と結晶性分布を満足する低結晶性ポリプロピレンが得られる。
【0051】
第1段階の重合を水素の存在下に行う場合は、得られる低立体規則性ポリプロピレン重合体の流動性と低分子量成分を減少する為に、第1段階で重合するポリマーの重量平均分子量が70万以上となるように水素濃度を設定する事が好ましい。
【0052】
第1段階及び第2段階のプロピレン重合の代表的な条件を例示すると、重合温度は、80℃以下、更に20〜70℃の範囲から採用することが好適である。また、重合はプロピレン自身を溶媒とするスラリー重合、気相重合、溶液重合等の何れの方法でもよい。プロセスの簡略性及び反応速度、また生成する重合体パウダーの粒子性状を勘案するとプロピレン自身を溶媒とするスラリー重合が好ましい態様である。重合形式は回分式、半回分式、連続式のいずれの方法でもよい。
【0053】
本重合の終了後には、重合系からモノマーを蒸発させ低結晶性ポリプロピレンを得ることができる。この低結晶性ポリプロピレンは、炭素数7以下の炭化水素で公知の洗浄又は向流洗浄を行うことができる。
【0054】
低結晶性プロピレンの製造方法は上記した重合法だけでなく、本発明の要件を満足する限り、別途重合して得られた高結晶性ポリプロピレンと低結晶性ポリプロピレンをブレンドしてもよいが、良好な透明性を得るためには重合法により製造することが好ましい態様となる。
【0055】
低結晶性ポリプロピレンには、本発明の効果を損なわない限り、酸化防止剤、熱安定剤、塩素補足剤、光安定剤、滑剤、アンチブロッキング剤、核剤、帯電防止剤、顔料等の添加剤を添加できる。また、上記添加剤に加えて有機過酸化物を添加し、本発明の要件を満足する範囲で分子量の調節を行ってもよい。
【0056】
本発明の両外層に使用される非粘着性熱可塑性樹脂は、上記低結晶性ポリプロピレン(a)よりなる基材層に耐ブロッキング性を与えるため、昇温溶離分別法により分別された横軸を溶出温度(℃)縦軸を溶出成分の積算重量割合で表した溶出曲線に於いて、20℃未満での溶出成分の量(A成分)が10重量%以下であるポリオレフィン系樹脂や、その他、該低結晶性ポリプロピレン(a)と接着性が良好なポリアミドなどが使用される。
【0057】
上記A成分が10重量%以下であるポリオレフィン系樹脂としては、オレフィンの単独重合体または共重合体およびそれらの混合物が挙げられる。
【0058】
ここで、オレフィンの単独重合体としては、エチレン,プロピレン,ブテン−1,ペンテン−1,ヘキセン−1,オクテン−1,4−メチルペンテン−1,3−メチルブテン−1等のα−オレフィンの単独重合体を挙げることができる。
【0059】
本発明の目的である適度な柔軟性を有し、透明性、耐衝撃性、耐熱性のバランスに優れ、かつ耐ブロッキング性の良好な積層体を提供するため、上記A成分が10重量%以下であるポリオレフィン系樹脂のうち、特に、プロピレンと他の単量体とのランダム共重合体が好適に使用される。
【0060】
具体的には、エチレン単位の含量が1〜10モル%のプロピレン−エチレンランダム共重合体、エチレン単位の含量が1〜9モル%、ブテン−1単位の含量が1〜20モル%で、エチレン単位とブテン−1単位との総量が25モル%を越えないプロピレン−エチレン−ブテン−1三元共重合体等が挙げられる。
【0061】
また、オレフィンの共重合体としては、上記したα−オレフィン同士の共重合体の他、基材層との積層により種々の特性を付加するために、α−オレフィンと共重合可能な他の単量体とα−オレフィンとの共重合体を使用しても良い。かかる他の単量体としては、酢酸ビニル;アクリル酸メチル,アクリル酸エチル,メタクリル酸メチル,メタクリル酸エチル等のアクリル酸またはメタクリル酸エステルを挙げることができる。
【0062】
また、α−オレフィンと共重合可能な他の単量体の少なくとも一部として、反応性基を有する単量体を使用することにより、接着性をより向上することができる。上記反応性基としては具体的には、カルボキシル基,ヒドロキシ基,エポキシ基等を挙げることができる。該反応性基を有する単量体としては、例えば、アクリル酸,メタクリル酸,マレイン酸,イタコン酸,シトラコン酸,無水マレイン酸,無水イタコン酸,無水シトラコン酸等のカルボキシル基またはその無水物基を有する単量体;ビニルアルコール,2−ヒドロキシエチルメタクリレート,2−ヒドロキシプロピルメタクリレート等のヒドロキシ基を有する単量体;グリシジルメタクリレート等のエポキシ基を有する単量体を挙げることができる。
【0063】
また、本発明において、非粘着性熱可塑性樹脂には、酸化防止剤、熱安定剤、塩素補足剤、光安定剤、滑剤、アンチブロッキング剤、核剤、帯電防止剤、顔料等の添加剤を添加できる。また、耐ブロッキング性等、本発明の効果を損なわない限り、該ポリオレフイン系樹脂に、石油樹脂をブレンドしても良い。
【0064】
本発明の積層体の製膜方法は特に限定されるものではない。例えば、基材層をTダイ法やインフレーション法など公知の方法でシートやフイルムを製膜し、非粘着性熱可塑性樹脂層を押出ラミネートや、ドライラミネートして積層体とする方法や、基材層と非粘着性熱可塑性樹脂層とをTダイ法やインフレーション法など公知の方法より共押出することにより積層体とする方法などが挙げられる。
【0065】
本発明の積層体には、印刷適性を付与するため一般的に知られている表面処理方法を何ら制限なく採用することができる。例えば、空気や窒素雰囲気下でのコロナ放電処理、火炎処理、プラズマ処理、アクリル系樹脂,ウレタン系樹脂,ポリビニルアルコール等の各種表面コート処理等などが挙げられる。
【0066】
本発明の積層体は、基材層の両外層に非粘着性熱可塑性樹脂層が積層されるが、該非粘着性熱可塑性樹脂層は、本発明の効果である柔軟性・透明性・耐衝撃性・耐熱性・耐ブロッキング性が損なわれない限り両外層に一層以上積層されていても良い。
【0067】
本発明の積層体の厚みは、特に限定されないが使用用途を勘案すると10〜2000μmの範囲である。
【0068】
本発明の積層体の厚みに対して、非粘着性熱可塑性樹脂層の合計厚みの割合は、柔軟性、耐熱性および耐ブロッキング性の点から20%〜80%の範囲であることが好ましく、さらに好ましくは30%〜70%の範囲内である。
【0069】
非粘着性熱可塑性樹脂層の合計厚みの割合が20%未満であると柔軟性、耐熱性は良好となるものの、耐ブロッキング性が低下するため好ましくないばかりか、シート、フイルムに加工した場合、非粘着性熱可塑性樹脂層の肌荒れが発生しやすくなり、外観上好ましくない。一方、非粘着性熱可塑性樹脂層の合計厚みの割合が80%を超えると耐ブロッキング性は向上するものの、柔軟性、耐熱性が低下するため好ましくない。
【0070】
本発明の積層体は、コーティング、ドライラミネート、押出ラミネート、シリカ蒸着、アルミナ蒸着等の二次加工により機械的強度、ガスバリアー性、印刷特性、ヒートシール性などの機能を付与させても良い。
【0071】
【発明の効果】
本発明の積層体は、適度な柔軟性を有し、透明性、耐衝撃性、耐熱性のバランスに優れ、かつ耐ブロッキング性が良好であり、従来の熱可塑性エラストマーや軟質塩化ビニール樹脂あるいはポリビニルアルコールが用いられている種々の分野や既存のシートやフイルムにおける柔軟化等に好適に用いることができる。例えば、自動車内装材、家電・電線材として各種絶縁シート、土木建材分野における防水シート、建材や家電製品等の化粧シート、壁紙、テーブルクロス、潅漑用ホース、化粧品包装用シート、レザー、農業用フイルム、ファスニングテープ、粘着テープ、文具、繊維包装フイルム、ラベル、ストレッチフィルム、保護フイルム、電子部品包装フイルム、食品包装フイルム等に用いることができる。
【0072】
【実施例】
以下、本発明を実施例及び比較例をあげて説明するが、本発明はこれらの実施例に限定されるものではない。以下の実施例において用いた測定方法について説明する。
【0073】
(1)昇温溶離分別法
(株)センシュー科学社製、SSC−7300型を用い、以下の測定条件により行った。
【0074】
溶媒 ;O−ジクロロベンゼン
流速 ;2.5ml/min
昇温速度 ;4℃/Hr
サンプル濃度 ;0.7wt%
サンプル注入量;100ml
検出器 ;赤外検出器、波長3.41μm
カラム ;φ30mm×300mm
充填剤 ;Chromosorb P 30〜60mesh
カラム冷却速度;2.0℃/Hr
(2)メルトフローレイト(以下、MIと略す。)
ASTM D−1238に準拠した。
【0075】
(3)分子量分布
ゲルパーミューションクロマトグラフィー法(GPC)により測定した。センシュー科学社製SSC−7100によりo−ジクロロベンゼンを溶媒として135℃で行った。使用したカラムはShodex製UT807、806Mである。校正曲線は標準試料として、重量平均分子量が950、2900、1万、5万、49.8万、270万、490万のポリスチレンを用いて作成した。
【0076】
(4)溶融張力
東洋精機製作所製MT測定装置を用い、230℃に保持されたシリンダーに直径2.095mmのオリフィス、ペレットピストンを挿入し、6分間保持した後、押出速度10mm/min、巻取速度25m/minでの溶融張力を測定した。
【0077】
(5)透明性(ヘーズ値)
JIS K 6714に準じて測定した。
【0078】
(6)引張弾性率
試料を10mm幅の短冊状に切断し、測定長を20mmとして引張試験機によって引張速度20mm/分、チャート速度2000m/分でチャート紙に記録した。基点より20mmの点で垂線を引き、接線との交点の強度を読み取り、下式により引張弾性率を算出した。
【0079】
引張弾性率(MPa)=[強度(Kg)×試料長(mm)×チャート速度(mm/分)]÷[引張速度(mm/分)×20mm×フイルム厚み(mm)×フイルム幅(mm)]×9.807
(7)衝撃強度
0℃に保ったチャンバー内で東洋精機製フイルムインパクトテスターを用いて測定した。測定サンプルをホルダーに装着後、衝撃頭で打ち抜き、その強度を衝撃強度として示した。
【0080】
(8)ブロッキング強度
2枚のサンプル(12×12cm)を重ね合わせ、10Kgの荷重をかけて温度50℃の雰囲気に72時間放置後、重ね合わせ部分が3×4cmとなるようサンプルを切り出し、引張試験機(速度:100mm/min)で剪断剥離強度を測定した。
【0081】
(9)垂れ下がり時間
クランプ枠(400mm×400mm)に測定サンプルを挟んで、300℃に設定された遠赤外線ヒーターで測定サンプルを上下から加熱した。加熱開始の時点から測定サンプルの中心部が20mm垂れ下がるまでの時間を測定した。
【0082】
本発明の基材層に用いられる低結晶性ポリプロピレンについて製造例及び比較製造例を挙げて説明するが、該低結晶性ポリプロピレンはこれらの製造例に限定されるものではない。
【0083】
製造例1
(予備重合)
撹拌機を備えた内容積1リットルのガラス製オートクレーブ反応器を窒素ガスで十分に置換した後、ヘプタン400mlを装入した。反応器内温度を20℃に保ち、酢酸ブチル0.18mmol、ヨウ化エチル22.7mmol、ジエチルアルミニウムクロライド18.5mmol、及び三塩化チタン(丸紅ソルベイ化学社製)22.7mmolを加えた後、プロピレンを三塩化チタン1g当たり3gとなるように30分間連続的に反応器に導入した。なお、この間の温度は20℃に保持した。プロピレンの供給を停止した後、反応器内を窒素ガスで十分に置換し、得られたチタン含有ポリプロピレンを精製n−ヘキサンで4回洗浄した。分析の結果、三塩化チタン1g当たり2.9gのプロピレンが重合されていた。
【0084】
(本重合)
N2置換を施した300リットルの重合槽に、液体プロピレンを100kg、ジエチルアルミニウムクロライド50.56mmol、エチルアルミニウムセスキエトキシド(Et1.5Al(OEt)1.5)50.56mmolを加え、重合槽の内温を70℃に昇温した。予備重合で得られたチタン化合物含有ポリプロピレンを三塩化チタンとして6.32mmol加え、70℃で2時間のプロピレンの重合を行った(第1段階)。次に酢酸ブチル1.01mmolを加え、水素を気相中の濃度が1mol%となるように挿入し、1時間の重合を行った(第2段階)。
【0085】
未反応モノマーをパージし、ポリマーを得た。得られたポリマーは70℃で1時間減圧乾燥した。次に酸化防止剤、熱安定剤、塩素補足剤及び1,3−ビス(t−ブチルパーオキシイソプロピル)ベンゼンを0.035重量%を添加して混合した後、50mmφ押出機を用い250℃で押出してペレット状とし、物性測定に供した。結果を表1に示した。また、図1に昇温分離分別法による溶出曲線を示した。
【0086】
製造例2
製造例1の本重合において、エチルアルミニウムセスキエトキシドの添加量を25.28mmolとし、造粒時に用いる1,3−ビス(t−ブチルパーオキシイソプロピル)ベンゼンを0.01重量%とした以外は製造例1と同様の操作を行った。結果を表1に示した。
【0087】
製造例3、4
製造例1の本重合の第2段階で使用する酢酸ブチルの量を10.10mmolとし、造粒時に1,3−ビス(t−ブチルパーオキシイソプロピル)ベンゼンを0.01重量%用いた(製造例3)および1,3−ビス(t−ブチルパーオキシイソプロピル)ベンゼンを0.035重量%用いた(製造例4)以外は、製造例1と同様の操作を行った。結果を表1に示した。
【0088】
製造例5
製造例1の本重合において、エチルアルミニウムセスキエトキシドの代わりにジエチルアルミニウム(2,6−ジ−t−ブチルフェノキシド)を用いた以外は製造例1と同様の操作を行った。結果を表1に示した。
【0089】
製造例6
製造例1の本重合において、第1段階の重合時間を90分とし、第2段階で使用する酢酸ブチルの量を2.02mmolとした以外は製造例1と同様の操作を行った。結果を表1に示した。
【0090】
比較製造例1、2
製造例1の本重合第2段階において、水素を用いずに重合を行い、造粒時に1,3−ビス(t−ブチルパーオキシイソプロピル)ベンゼンを0.04重量%用いた(比較製造例1)および0.02重量%用いた(比較製造例2)以外は、製造例1と同様の操作を行った。結果を表1に示した。
【0091】
比較製造例3
製造例1の本重合において酢酸ブチルの使用量を0.56mmolとした以外は、製造例1と同様の操作を行った。結果を表1に示した。
【0092】
比較製造例4
製造例1の本重合において、第2段階の重合時間を20分とし、造粒時に1,3−ビス(t−ブチルパーオキシイソプロピル)ベンゼンを0.03重量%用いた以外は、製造例1と同様の操作を行った。結果を表1に示した。
【0093】
比較製造例5
製造例1の本重合において、第1段階の重合時に酢酸ブチルを1.01mmol使用し、造粒時に1,3−ビス(t−ブチルパーオキシイソプロピル)ベンゼンを0.02重量%用いた以外は製造例1と同様の操作を行った。結果を表1に示した。
【0094】
比較製造例6
製造例1の本重合において、エチルアルミニウムセスキエトキシドを使用せず、第1段階の重合時間を30分とし、第2段階で使用する酢酸ブチルの量を10.10mmolとした以外は製造例1と同様の操作を行った。結果を表1に示した。
【0095】
実施例1
3台の押出機を用い、製造例1で得られた低結晶性ポリプロピレンが中心層、昇温溶離分別法により分別された溶出曲線に於いて、A成分の量が1重量%であるエチレン・プロピレン・ブテン−1ランダム共重合体が両外層となるようTダイ押出機により、230℃の樹脂温度で25℃のチルロール上に押出し、引取機により引き取って、中心層が50μm、両外層が各25μmからなる全層厚み100μmの積層体を得た。得られた積層体の物性を表2に示した。
【0096】
実施例2
3台の押出機を用い、製造例2で得られた低結晶性ポリプロピレンが中心層、昇温溶離分別法により分別された溶出曲線に於いて、A成分の量が1重量%であるエチレン・プロピレン・ブテン−1ランダム共重合体が両外層となるようTダイ押出機により、230℃の樹脂温度で25℃のチルロール上に押出し、引取機により引き取って、中心層が300μm、両外層が各100μmからなる全層厚み500μmの積層体を得た。得られた積層体の物性を表2に示した。
【0097】
実施例3
積層体の厚みにおいて、中心層が70μm、両外層が各15μmからなる全層厚み100μmとした以外は、実施例1と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0098】
実施例4
昇温溶離分別法により分別された溶出曲線に於いて、A成分の量が8重量%であるエチレン・プロピレンランダム共重合体を両外層に用いた以外は、実施例1と同様にして中心層が50μm、両外層が各25μmからなる全層厚み100μmの積層体を得た。得られた積層体の物性を表2に示した。
【0099】
比較例1
製造例1で得られたポリプロピレンをTダイ押出機により、230℃の樹脂温度で25℃のチルロール上に押出し、引取機により引き取り、100μmの単層フイルムを得た。得られたフイルムの物性を表2に示した。
【0100】
比較例2
中心層を比較製造例1で得られたポリプロピレンとした以外は、実施例2と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0101】
比較例3
中心層を比較製造例2で得られたポリプロピレンとした以外は、実施例1と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0102】
比較例4
中心層を比較製造例3で得られたポリプロピレンとした以外は、実施例2と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0103】
比較例5
中心層を比較製造例4で得られたポリプロピレンとした以外は、実施例2と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0104】
比較例6
中心層を比較製造例5で得られたポリプロピレンとした以外は、実施例2と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0105】
比較例7
中心層を比較製造例6で得られたポリプロピレンとした以外は、実施例1と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0106】
比較例8
中心層を表1に示したエチレン、プロピレン、ブテン−1成分より構成されてなる軟質ポリオレフィンとした以外は、実施例1と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0107】
比較例9
中心層を表1に示したエチレン、プロピレン、ブテン−1成分より構成されてなる軟質ポリオレフィンとした以外は、実施例2と同様にして積層体を得た。得られた積層体の物性を表2に示した。
【0108】
比較例10
昇温溶離分別法により分別された溶出曲線に於いて、A成分の量が13重量%であるエチレン・プロピレンランダム共重合体を両外層に用いた以外は、実施例1と同様にして中心層が50μm、両外層が各25μmからなる全層厚み100μmの積層体を得た。得られた積層体の物性を表2に示した。
【0109】
【表1】
【0110】
【表2】
【図面の簡単な説明】
【図1】 製造例1の低結晶性ポリプロピレンの昇温溶離分別法により分別された溶出曲線である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laminate having an appropriate flexibility, an excellent balance of transparency, impact resistance and heat resistance, and good blocking resistance. The laminate of the present invention can be suitably used as a flexible sheet or film, for example, automotive interior materials, various insulating sheets as household appliances and electric wire materials, waterproof sheets in the field of civil engineering and building materials, decorative sheets for building materials, household appliances, etc. , Wallpaper, tablecloth, irrigation hose, cosmetic packaging sheet, leather, agricultural film, fastening tape, adhesive tape, stationery, textile packaging film, label, stretch film, protective film, electronic parts packaging film, food packaging film, etc. Can be used.
[0002]
[Prior art]
Conventionally, as a flexible sheet or film, a sheet or film made of a polyvinyl alcohol resin typified by a soft vinyl chloride resin or vinylon has been often used. However, since soft vinyl chloride resin contains chlorine in the molecule, there is a recent trend to replace it, assuming that combustion gas generated during incineration causes acid rain.
[0003]
Moreover, since the polyvinyl alcohol-type resin is easy to receive to the influence of humidity and its heat melt molding processability is inadequate, the use used is restricted. Flexible sheets and films such as ethylene / vinyl acetate copolymer, low-density polyethylene, linear low-density polyethylene, and ethylene / propylene elastomer, which are mainly composed of ethylene, have good flexibility and impact resistance, but are transparent And heat resistance are inferior to those of soft vinyl chloride resins and polyvinyl alcohol resins.
[0004]
On the other hand, polypropylene is widely used for sheets, films and the like because it has excellent processability, rigidity and heat resistance. However, so-called isotactic polypropylene having a high crystallinity that has been conventionally used is excellent in rigidity and heat resistance, but has disadvantages in that it is inferior in flexibility, impact resistance and transparency. Many means for improving these drawbacks have been proposed.
[0005]
For example, in order to improve impact resistance, a method of randomly copolymerizing propylene and another α-olefin, or a method of copolymerizing propylene and ethylene after propylene homopolymerization to form a block copolymer is known. It has been. However, when the random copolymer is used, although the impact resistance and transparency are improved, there is a problem that the heat resistance is impaired because the melting point is remarkably lowered. Further, when the block copolymer is used, the impact resistance and heat resistance are excellent, but there is a problem that the transparency is remarkably lowered.
[0006]
In order to impart flexibility to polypropylene, a method of reducing stereoregularity is also known. For example, Japanese Patent Laid-Open No. 59-122506 proposes a polypropylene having a wide molecular weight distribution and having a relatively high melting point but having flexibility and low stereoregularity. However, in this method, there is still room for improvement in the balance between flexibility and heat resistance, and it has been desired that more flexible polypropylene has high heat resistance. JP-A-6-263934 has proposed a polypropylene having excellent rubber elasticity by containing an atactic component having a specific viscosity, but the melt flow rate of the obtained polypropylene is relatively low, There was still room for improvement in workability.
[0007]
As a method for solving this problem, Japanese Patent Application Laid-Open No. 7-157606 discloses a melt flow rate adjusted by melt-kneading a low stereoregular polypropylene having a weight average molecular weight of 1 million or more in the presence of an organic peroxide. Although a method has been proposed, since the molecular weight distribution of the obtained polypropylene becomes small, the melt tension at the time of forming into a sheet or film is lowered, and there is a problem in workability.
[0008]
Therefore, the present inventor has proposed a low crystalline polypropylene having excellent flexibility, transparency, impact resistance, and heat resistance and good workability (Japanese Patent Application No. 9-164660).
[0009]
However, although the sheet and film obtained with the low crystalline polypropylene are excellent in flexibility, transparency, impact resistance, and heat resistance, the low crystalline component tends to bully out on the surface of the sheet or film. There was room for improvement.
[0010]
[Problems to be solved by the invention]
Accordingly, an object of the present invention is to provide a laminate having an appropriate flexibility, an excellent balance of transparency, impact resistance, and heat resistance, and good blocking resistance.
[0011]
[Means for Solving the Problems]
As a result of intensive studies to achieve the above object, the inventors of the present invention use a low crystalline polypropylene having a specific molecular weight distribution and a crystalline distribution as a base layer, and are non-adhesive to both outer layers of the base layer. It has been found that all of the above objects can be achieved by laminating layers made of thermoplastic resin, and the present invention has been completed.
[0012]
That is, in the present invention, a layer made of a low crystalline polypropylene (a) satisfying the following constitutions 1) to 4) is used as a base layer, and both outer layers of the base layer are made of a non-adhesive thermoplastic resin. Is a laminate formed by laminating.
[0013]
Low crystalline polypropylene (a):
1) Propylene homopolymer or copolymer of propylene and α-olefin having a content of α-olefin units other than propylene of 5 mol% or less
2) Melt flow rate of 0.5 to 20 g / 10 min
3) Weight average molecular weight (Mw) And number average molecular weight (Mn) Molecular weight distribution (Mw/ Mn4-15
4) Elution component (component A) below 20 ° C in the elution curve with the horizontal axis representing the elution temperature (° C) and the vertical axis representing the cumulative weight ratio of the elution component, separated by the temperature rising elution fractionation method 5 to 35% by weight, the amount of the eluted component (component B) at 20 ° C. or higher and lower than 100 ° C. is 10 to 40% by weight, the eluted component (C component) at 100 ° C. or higher is 40 to 80% by weight, The total of A component, B component and C component is 100% by weight, the weight ratio (B / A) between B component and A component is 0.6 or more, and the peak top temperature in C component is 120 ° C or more .
[0014]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, the low crystalline polypropylene is a polypropylene homopolymer or a copolymer of propylene and an α-olefin having a content of α-olefin units other than propylene of 5 mol% or less (hereinafter referred to as propylene-α-). Called olefin copolymer).
[0015]
In the present invention, examples of α-olefins other than propylene include ethylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 3-methyl-1-butene, and 4-methyl-1. -A pentene etc. can be mentioned. When the content of the α-olefin unit in the propylene-α-olefin copolymer exceeds 5 mol%, the heat resistance is impaired due to the lowering of the melting point, which is not preferable.
[0016]
In a low crystalline polypropylene, a melt flow rate of less than 0.5 is not preferable because the thickness and thinness accuracy of the sheet and film is lowered. On the other hand, when the melt flow rate exceeds 20, the melt tension is lowered and the workability of the sheet and film is lowered, which is not preferable. A particularly preferred range of the melt flow rate is 1-15.
[0017]
The melt flow rate of the low crystalline polypropylene is approximately in the range of 200,000 to 500,000 when converted to a weight average molecular weight by gel permeation chromatography (GPC).
[0018]
Low crystalline polypropylene has a weight average molecular weight (Mw) And number average molecular weight (Mn) Molecular weight distribution (Mw/ Mn) Is 4-15, preferably 5-15, in order to obtain good processability, flexibility, transparency and impact resistance. When the molecular weight distribution is less than 4, the processability of the sheet or film is lowered. When it exceeds 15, the orientation anisotropy of the resin is increased, and the flexibility, transparency and impact resistance of the sheet and film are lowered. This is not preferable.
[0019]
Low crystalline polypropylene has a weight average molecular weight (MwIn the laminate of the present invention, the amount of the 10,000 or less component is preferably 3% by weight or less from the viewpoint of preventing blocking.
[0020]
In the present invention, the temperature rising elution fractionation method is a method described in detail in, for example, Journal of Applied Polymer Science; Applied Polymer Symposium 45, 1-24 (1990). First, a high-temperature polymer solution is introduced into a packed column using diatomaceous earth as a packing material, and the column temperature is gradually lowered to cause crystallization on the packing surface in order from a component having a high melting point, and then the column temperature is gradually increased. In this method, the eluted polymer component is fractionated by elution in order from the component having the lowest melting point. In the present invention, as shown in the examples, SSC-7300 type manufactured by Senshu Scientific Co., Ltd. was used as a measuring device, solvent: O-dichlorobenzene, flow rate: 2.5 ml / min, heating rate: 4 ° C./Hr, column: The value measured under the condition of φ30 mm × 300 mm is shown.
[0021]
The elution component (component A) of the low crystalline polypropylene at a temperature of less than 20 ° C. is a component necessary particularly for expressing the flexibility and heat resistance of the laminate of the present invention. That is, if the amount of component A is less than 5% by weight, flexibility is impaired, and if it exceeds 35% by weight, sufficient heat resistance cannot be obtained, which is not preferable. In order to exhibit more excellent flexibility and heat resistance, the amount of the component A is particularly preferably in the range of 10 to 30% by weight.
[0022]
The elution component (component B) of the low crystalline polypropylene at 20 ° C. or more and less than 100 ° C. is a component necessary particularly for expressing the balance of transparency, flexibility and heat resistance of the laminate of the present invention. That is, when the amount of component B is less than 10% by weight, good transparency and flexibility cannot be achieved when a sheet or film is used, and when it exceeds 40% by weight, heat resistance is insufficient. In order to develop a more excellent balance of transparency, flexibility and heat resistance, the amount of component B is particularly preferably in the range of 10 to 30% by weight.
[0023]
The elution component (C component) of low crystalline propylene at 100 ° C. or higher is a component necessary for obtaining excellent heat resistance, which is a feature of the laminate of the present invention. That is, if the amount of the C component is less than 40% by weight, or if the peak top temperature in the C component is less than 120 ° C., the heat resistance of the sheet or film is impaired, and the amount of the C component is 80% by weight. When exceeding, since a softness | flexibility will be impaired, it is unpreferable. Considering flexibility and heat resistance, the amount of component C is particularly preferably more than 50% by weight and 70% by weight or less. Furthermore, in order to obtain more excellent heat resistance, it is preferable that the C component has 60% by weight or more of an eluted component having a temperature of 115 ° C or higher. The weight ratio (B / A) of the B component and the A component in the low crystalline polypropylene is 0.6 or more, preferably 0.7 or more. When the amount of the B component and the weight ratio of the A component (B / A) is less than 0.6, the balance of transparency, flexibility, and heat resistance, which is a feature of the present invention, is not fully expressed, and the object of the present invention is achieved. Not.
[0024]
Molecular weight distribution of component A, component B and component C of low crystalline polypropylene (Mw/ Mn) Is preferably 4 to 15 in order to obtain good processability.
[0025]
The low crystalline polypropylene preferably has a melting point measured by differential scanning calorimetry (DSC) of 150 ° C. or higher and a heat of fusion of 100 J / g or lower. When the melting point is less than 150 ° C., sufficient heat resistance cannot be obtained, and when the heat of fusion exceeds 100 J / g, flexibility is impaired, which is not preferable.
[0026]
The low crystalline polypropylene preferably has a heat distortion temperature of 50 ° C. or higher determined by a measuring method based on JIS K7207.
[0027]
Although the manufacturing method of the low crystalline polypropylene of this invention is not specifically limited as long as the requirements of this invention are satisfy | filled, For example, it can obtain with the following method.
[0028]
The following catalyst components [A], [B], [C]
[A] Titanium compound
[B] General formula R1 nAlX3-n
(However, R1Is a saturated hydrocarbon group having 1 to 10 carbon atoms, X is a halogen atom, and n is an integer of 0 to 3)
[C] General formula (I)
R2 n / 2Al (ORThree)3-n / 2 (I)
(However, R2, RThreeIs the same or different saturated hydrocarbon group having 1 to 10 carbon atoms, n is an integer of 1 to 4)
Or general formula (II)
[0029]
[Chemical 1]
[0030]
(However, RFourIs an alkyl group, an aryl group or a halogen atom, RFive, R6And R7Is a hydrogen atom, an alkyl group or an aryl group, and n is 0 <n <3. )
In the presence of the organoalkoxyaluminum compound represented by formula (1), first, propylene homopolymerization or propylene and other α-olefin copolymerization is carried out in the absence or presence of hydrogen, and then in the second step. In the presence of the above components [A], [B], and [C], an electron donor compound [D] is further added to carry out the second stage polymerization, and the second stage hydrogen is compared with the first stage. This is a method of increasing the concentration.
[0031]
As the titanium compound [A], a titanium compound known to be used for olefin polymerization is used without any limitation. These titanium compounds are roughly classified into supported titanium compounds and titanium trichloride compounds. As a method for producing the supported titanium compound, a known method is adopted without any limitation. For example, JP-A-56-155206, 56-136806, 57-34103, 58-8706, 58-83006, 58-138708, 58-183709, 59-206408, 59-19311. 60-81208, 60-81209, 60-186508, 60-192708, 6-2111309, 61-271304, 62-15209, 62-11706, 62-72702, 62-104810 Etc. are employed.
[0032]
Specifically, for example, a method in which titanium tetrachloride is co-pulverized with a magnesium compound such as magnesium chloride, titanium halide and magnesium compound are co-presented in the presence of an electron donor such as alcohol, ether, ester, ketone or aldehyde. The method of grind | pulverizing or the method of making a titanium halide, a magnesium compound, and an electron donor contact in a solvent is mentioned. Examples of the titanium trichloride compound include known α, β, γ, and δ-titanium trichloride. The preparation methods of these titanium trichloride compounds are described in, for example, JP-A-47-34478, JP-A-50-126590, JP-A-50-114394, JP-A-50-93888, JP-A-50-123091, JP-A-50-74594, JP-A-50-. 104191, 50-98489, 51-136625, 52-30888, 52-35283, etc. are employed.
[0033]
Next, as the organoaluminum compound [B], a compound known to be used for olefin polymerization is employed without any limitation. For example, trimethylaluminum, triethylaluminum, tri-n-propylaluminum, tri-n-butylaluminum, tri-i-butylaluminum, tri-n-hexylaluminum, tri-n-octylaluminum, trin-decylaluminum, etc. Examples thereof include trialkylaluminums, diethylaluminum monohalides such as diethylaluminum monochloride and diethylaluminum bromide, and alkylaluminum halides such as methylaluminum sesquichloride, ethylaluminum sesquichloride and ethylaluminum dichloride. The organic alkoxyaluminum compound [C] is a reaction product of an alkylaluminum or alkylaluminum halide and an alcohol, and the organic alkoxyaluminum compound represented by the general formulas (I) and (II) is employed without any limitation. The
[0034]
Examples of the organic alkoxyaluminum compound represented by the general formula (I) include dimethylaluminum methoxide, dimethylaluminum ethoxide, dimethylaluminum isopropoxide, diethylaluminum methoxide, diethylaluminum ethoxide, diethylaluminum-n-butoxide. , Methylaluminum sesquimethoxide, methylaluminum sesquiethoxide, ethylaluminum sesquiethoxide, ethylaluminum diethoxide, diisobutylaluminum ethoxide, ethylaluminum chloride monoethoxide, and the like.
[0035]
Examples of the organic alkoxyaluminum compound represented by the general formula (II) include dimethylaluminum phenoxide, dimethylaluminum (2-methylphenoxide), dimethylaluminum (2,4-dimethylphenoxide), and dimethylaluminum (2,6 -Dimethylphenoxide), dimethylaluminum (2,4,6-trimethylphenoxide), dimethylaluminum (2,6-diisopropylphenoxide), dimethylaluminum (2,6-di-t-butylphenoxide), dimethylaluminum (2,6 -Diphenylphenoxide), diethylaluminum phenoxide, diethylaluminum (2-methylphenoxide), diethylaluminum (2,4-dimethylphenoxide), diethylaluminum (2, -Dimethylphenoxide), diethylaluminum (2,4,6-trimethylphenoxide), diethylaluminum (2,6-diisopropylphenoxide), diethylaluminum (2-isobutylphenoxide), diethylaluminum (2-t-butylphenoxide), diethyl Aluminum (2,6-di-t-butylphenoxide), diethylaluminum (2,6-di-t-butyl-4-methylphenoxide), diethylaluminum (2,6-diphenylphenoxide) and the like can be mentioned.
[0036]
Further, as the electron donor compound [D], a compound known to be used for improving stereoregularity of olefins is adopted without any limitation. For example, alcohols such as methanol, ethanol, propanol, butanol, pentanol, hexanol, octanol, isopropyl alcohol, isoamyl alcohol, phenols such as phenol, cresol, cumylphenol, xylenol, naphthol, acetone, methyl ethyl ketone, acetophenone, benzophenone Ketones such as acetaldehyde, propionaldehyde, benzaldehyde, methyl formate, methyl acetate, ethyl acetate, butyl acetate, vinyl acetate, methyl propionate, ethyl propionate, ethyl valerate, ethyl stearate, ethyl acrylate Organics such as methyl methacrylate, ethyl benzoate, methyl toluate, methyl anisate, ethyl phthalate, methyl carbonate, butyrolactone Esters, ethers such as methyl ether, ethyl ether, isopropyl ether, isoamyl ether, tetrahydrofuran, anisole, diethylene glycol dimethyl ether, acid amides such as acetic acid amide, benzoic acid amide, maleic acid amide, methylamine, ethylamine, piperidine, pyridine , Amines such as aniline, nitriles such as acetonitrile and benzonitrile, dimethyldimethoxysilane, diethyldimethoxysilane, ethyl silicate, divinyldimethoxysilane, diallyldimethoxysilane, diphenyldimethoxysilane, methylphenyldimethoxysilane, methyltriethoxysilane, Ethyltriethoxysilane, vinyltriethoxysilane, butyltriethoxysilane, pentyltriethoxysilane, isoprene Pyrtriethoxysilane, cyclohexylmethyldimethoxysilane, dit-butyldimethoxysilane, t-butylethyldimethoxysilane, dit-amyldimethoxysilane, dicyclopentyldimethoxysilane, dicyclohexyldimethoxysilane, t-butylmethyldimethoxysilane, t-butyl Examples thereof include organic silicon compounds such as ethyldimethoxysilane, cyclopentylmethyldimethoxysilane, cyclopentylethyldimethoxysilane, cyclopentylisobutyldimethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylethyldimethoxysilane, and cyclohexylisobutyldimethoxysilane. These electron donor compounds can be used in a plurality of types at the same time.
[0037]
The combination of titanium compound [A], organoaluminum compound [B], organoalkoxyaluminum compound [C] and electron donor [D] used in the present invention is (1) supported titanium compound-trialkylaluminum-organoalkoxy. Aluminum compound-electron donor
(2) Titanium trichloride compound-diethylaluminum monohalide-organic alkoxyaluminum compound-electron donor
(3) Titanium trichloride compound-trialkylaluminum-organic alkoxyaluminum compound-electron donor
and,
(4) Supported titanium compound-titanium trichloride compound-trialkylaluminum-organic alkoxyaluminum compound-electron donor
Is particularly preferable in order to satisfy the constitution of the low crystalline polypropylene in combination with other production conditions.
[0038]
Prior to the main polymerization carried out in the presence of each of the above components, it is preferable to carry out a prepolymerization of propylene in the presence of the same component because the particle properties of the resulting polymer powder can be made highly fluid. is there.
[0039]
In the prepolymerization, in addition to the system using [A] and [B] and, if necessary, [D], the amount of low molecular weight components of the low stereoregular polypropylene obtained by the main polymerization is reduced. For the purpose, it is also possible to add an iodine compound [E] represented by the following general formula (I).
[0040]
[E] Iodine compound
R-I (I)
(However, R is an iodine atom, a C1-C7 alkyl group, or a phenyl group.)
The amount of these components used in the prepolymerization varies depending on the type of catalyst and the polymerization conditions, and the optimal amount of use may be determined in advance according to each of these conditions. Examples of ranges that are generally used preferably are as follows.
[0041]
That is, the proportion of the organoaluminum compound [B] used in the prepolymerization is 0.1 to 100, preferably 0.1 to 20 in terms of Al / Ti (molar ratio) with respect to the titanium compound [A]. In addition, the organoalkoxyaluminum compound [C] used as necessary is in the range of 0.01 to 100, preferably 0.01 to 10 in terms of [C] / Ti (molar ratio) with respect to the titanium compound [A]. However, the proportion of the electron donor compound [D] used is in the range of 0.01 to 100, preferably 0.01 to 10 in terms of [D] / Ti (molar ratio) with respect to the titanium compound [A]. Is preferred. Moreover, the usage-amount of the iodine compound [E] used as needed is 0.1-100, preferably 0.5-50 in I / Ti (molar ratio) with respect to the titanium compound [A]. is there.
[0042]
Specific examples of iodine compounds that can be suitably used in the prepolymerization are as follows. For example, iodine, methyl iodide, ethyl iodide, propyl iodide, butyl iodide, iodobenzene, p-iodo toluene and the like. In particular, methyl iodide and ethyl iodide are preferred.
[0043]
The amount of prepolymerization for polymerizing α-olefin in the presence of the catalyst component varies depending on the prepolymerization conditions, but is generally in the range of 0.1 to 500 g / g · Ti compound, preferably 1 to 100 g / g · Ti compound. It is enough. Further, the α-olefin used in the prepolymerization may be propylene alone, and other α-olefins such as ethylene, 1-butene, 1-pentene, 1-hexene, as long as the physical properties of the polymer powder are not adversely affected. 4-methylpentene-1 or the like may be mixed with propylene. Moreover, prepolymerization can be performed in multiple stages, and different α-olefin monomers can be prepolymerized in each stage. It is also possible for hydrogen to coexist in each prepolymerization stage.
[0044]
In general, slurry polymerization is preferably used for the prepolymerization, and a saturated aliphatic hydrocarbon or aromatic hydrocarbon such as hexane, heptane, cyclohexane, benzene, and toluene is used alone, or a mixed solvent thereof is used as the solvent. Can do.
[0045]
The prepolymerization temperature is preferably in the range of -20 to 100 ° C, particularly 0 to 60 ° C. The prepolymerization time may be appropriately determined according to the prepolymerization temperature and the polymerization amount in the prepolymerization, and the pressure in the prepolymerization is not limited, but in the case of slurry polymerization, generally from atmospheric pressure to 5 kg / cm.2It is about G. The prepolymerization may be carried out by any of batch, semi-batch and continuous methods.
[0046]
Subsequent to the prepolymerization, main polymerization is performed. In the main polymerization of low crystalline polypropylene, it is preferable to perform the main polymerization by two or more stages of different conditions under different conditions in order to satisfy a specific molecular weight distribution and crystallinity distribution.
[0047]
The amount of the organoaluminum compound [B] used in the first stage of the main polymerization is Al / Ti (molar ratio) with respect to titanium atoms in the titanium compound-containing prepolymer, and is 1 to 1000, preferably 2 It is in the range of ~ 500. Moreover, the usage-amount of organoalkoxy aluminum compound [C] is 0.01-10 mol with respect to 1 mol of said organoaluminum compound [B], Preferably it is 0.1-10 mol. Further, the electron donor [D] used in the second stage of the main polymerization is 0.001 to 10 moles, preferably 0.01 to 1 mole of the organoaluminum compound [B] used in the first stage. The range is ˜1 mol.
[0048]
In the first stage polymerization, the order of addition of the titanium compound-containing prepolymer obtained by the prepolymerization and the above [B] and [C] to the polymerization system is not particularly limited. Premixed materials can also be used.
[0049]
The polymerization of propylene in the first stage is carried out in the absence or presence of hydrogen, supplying propylene alone or a mixture of propylene and other α-olefins within the scope satisfying the requirements of the invention, and subsequently The second stage polymerization may be carried out by adding an electron donor compound [D] and hydrogen.
[0050]
It is important to carry out the polymerization under different conditions of hydrogen concentration in the first stage and the second stage. In the second stage polymerization, a component having a lower molecular weight than that of the polymer polymerized in the first stage is polymerized by increasing the hydrogen concentration as compared with the first stage. Furthermore, the electron donor additionally distributed in the second stage increases the crystallinity of the polymer polymerized in the second stage as compared with the polymer in the first stage, and the low molecular weight and the crystallinity distribution satisfying the specific molecular weight distribution and the crystallinity distribution from the above effects. Crystalline polypropylene is obtained.
[0051]
When the first stage polymerization is carried out in the presence of hydrogen, the weight average molecular weight of the polymer polymerized in the first stage is 70 in order to reduce the fluidity and low molecular weight component of the resulting low stereoregular polypropylene polymer. It is preferable to set the hydrogen concentration so as to be 10,000 or more.
[0052]
Illustrating typical conditions for the first stage and second stage propylene polymerizations, the polymerization temperature is preferably 80 ° C. or lower, and more preferably 20 to 70 ° C. The polymerization may be any method such as slurry polymerization, gas phase polymerization or solution polymerization using propylene itself as a solvent. Taking into consideration the simplicity and reaction rate of the process and the particle properties of the polymer powder to be produced, slurry polymerization using propylene itself as a solvent is a preferred embodiment. The polymerization method may be any of batch, semi-batch and continuous methods.
[0053]
After completion of the main polymerization, the monomer can be evaporated from the polymerization system to obtain a low crystalline polypropylene. This low crystalline polypropylene can be subjected to known washing or countercurrent washing with a hydrocarbon having 7 or less carbon atoms.
[0054]
The method for producing low crystalline propylene is not limited to the above-described polymerization method, and as long as the requirements of the present invention are satisfied, high crystalline polypropylene obtained by separately polymerizing and low crystalline polypropylene may be blended. In order to obtain high transparency, it is preferable to produce the polymer by a polymerization method.
[0055]
For low crystalline polypropylene, additives such as antioxidants, heat stabilizers, chlorine scavengers, light stabilizers, lubricants, antiblocking agents, nucleating agents, antistatic agents, pigments, etc., unless the effects of the present invention are impaired. Can be added. In addition to the above additives, an organic peroxide may be added to adjust the molecular weight within a range that satisfies the requirements of the present invention.
[0056]
The non-adhesive thermoplastic resin used for both outer layers of the present invention provides the anti-blocking property to the base layer made of the above low crystalline polypropylene (a). Elution temperature (° C.) In the elution curve in which the vertical axis represents the integrated weight ratio of the elution component, the amount of the elution component (component A) at less than 20 ° C. is 10% by weight or less, other resins, The low crystalline polypropylene (a) and polyamide having good adhesion are used.
[0057]
Examples of the polyolefin resin in which the component A is 10% by weight or less include homopolymers or copolymers of olefins and mixtures thereof.
[0058]
Here, as the homopolymer of olefin, α-olefin alone such as ethylene, propylene, butene-1, pentene-1, hexene-1, octene-1, 4-methylpentene-1, 3-methylbutene-1, etc. A polymer can be mentioned.
[0059]
In order to provide a laminate having an appropriate flexibility that is the object of the present invention, excellent in balance of transparency, impact resistance, and heat resistance, and having good blocking resistance, the component A is 10% by weight or less. In particular, random copolymers of propylene and other monomers are preferably used.
[0060]
Specifically, a propylene-ethylene random copolymer having an ethylene unit content of 1 to 10 mol%, an ethylene unit content of 1 to 9 mol%, a butene-1 unit content of 1 to 20 mol%, Examples include propylene-ethylene-butene-1 terpolymers in which the total amount of units and butene-1 units does not exceed 25 mol%.
[0061]
In addition to the above-mentioned copolymers of α-olefins, other copolymers that can be copolymerized with α-olefins are added to the olefin copolymer in order to add various properties by lamination with the base material layer. A copolymer of a monomer and an α-olefin may be used. Examples of such other monomers include vinyl acetate; acrylic acid or methacrylic acid esters such as methyl acrylate, ethyl acrylate, methyl methacrylate, and ethyl methacrylate.
[0062]
Moreover, adhesiveness can be improved more by using the monomer which has a reactive group as at least one part of the other monomer copolymerizable with an alpha olefin. Specific examples of the reactive group include a carboxyl group, a hydroxy group, and an epoxy group. Examples of the monomer having a reactive group include a carboxyl group such as acrylic acid, methacrylic acid, maleic acid, itaconic acid, citraconic acid, maleic anhydride, itaconic anhydride, citraconic anhydride, or an anhydride group thereof. A monomer having a hydroxyl group such as vinyl alcohol, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate; a monomer having an epoxy group such as glycidyl methacrylate.
[0063]
In the present invention, the non-adhesive thermoplastic resin contains additives such as an antioxidant, a heat stabilizer, a chlorine scavenger, a light stabilizer, a lubricant, an antiblocking agent, a nucleating agent, an antistatic agent, and a pigment. Can be added. Further, a petroleum resin may be blended with the polyolefin resin as long as the effects of the present invention such as blocking resistance are not impaired.
[0064]
The method for forming the laminate of the present invention is not particularly limited. For example, a base layer is formed by a known method such as a T-die method or an inflation method, and a non-adhesive thermoplastic resin layer is formed by extrusion lamination or dry lamination to form a laminate. Examples thereof include a method of forming a laminate by co-extrusion of a layer and a non-adhesive thermoplastic resin layer by a known method such as a T-die method or an inflation method.
[0065]
For the laminate of the present invention, a generally known surface treatment method for imparting printability can be used without any limitation. For example, corona discharge treatment in air or nitrogen atmosphere, flame treatment, plasma treatment, various surface coating treatments such as acrylic resin, urethane resin, polyvinyl alcohol, and the like can be mentioned.
[0066]
In the laminate of the present invention, a non-adhesive thermoplastic resin layer is laminated on both outer layers of the base material layer, and the non-adhesive thermoplastic resin layer has the flexibility, transparency, and impact resistance that are the effects of the present invention. As long as the properties, heat resistance and blocking resistance are not impaired, one or more layers may be laminated on both outer layers.
[0067]
The thickness of the laminate of the present invention is not particularly limited, but is in the range of 10 to 2000 μm in consideration of the intended use.
[0068]
The ratio of the total thickness of the non-adhesive thermoplastic resin layer to the thickness of the laminate of the present invention is preferably in the range of 20% to 80% from the viewpoint of flexibility, heat resistance and blocking resistance. More preferably, it is in the range of 30% to 70%.
[0069]
When the ratio of the total thickness of the non-adhesive thermoplastic resin layer is less than 20%, the flexibility and heat resistance are improved, but not only is not preferable because the blocking resistance is lowered, but when processed into a sheet or film, The rough surface of the non-adhesive thermoplastic resin layer tends to occur, which is not preferable in appearance. On the other hand, if the ratio of the total thickness of the non-adhesive thermoplastic resin layer exceeds 80%, the blocking resistance is improved, but the flexibility and heat resistance are lowered, which is not preferable.
[0070]
The laminate of the present invention may be provided with functions such as mechanical strength, gas barrier properties, printing properties, and heat sealability by secondary processing such as coating, dry lamination, extrusion lamination, silica deposition, and alumina deposition.
[0071]
【The invention's effect】
The laminate of the present invention has moderate flexibility, excellent balance of transparency, impact resistance and heat resistance, and good blocking resistance. Conventional thermoplastic elastomer, soft vinyl chloride resin or polyvinyl It can be suitably used for various fields where alcohol is used and for softening in existing sheets and films. For example, automotive interior materials, various insulation sheets for household appliances and electric wires, waterproof sheets in the field of civil engineering and construction materials, decorative sheets for building materials and household appliances, wallpaper, tablecloths, irrigation hoses, cosmetic packaging sheets, leather, agricultural films , Fastening tape, adhesive tape, stationery, fiber wrapping film, label, stretch film, protective film, electronic component wrapping film, food wrapping film and the like.
[0072]
【Example】
EXAMPLES Hereinafter, although an Example and a comparative example are given and this invention is demonstrated, this invention is not limited to these Examples. The measurement method used in the following examples will be described.
[0073]
(1) Elevated temperature elution fractionation method
Using SSC-7300, manufactured by Senshu Scientific Co., Ltd., the measurement was performed under the following measurement conditions.
[0074]
Solvent; O-dichlorobenzene
Flow rate: 2.5 ml / min
Temperature increase rate: 4 ° C / Hr
Sample concentration: 0.7 wt%
Sample injection volume: 100 ml
Detector: Infrared detector, wavelength 3.41 μm
Column: φ30mm × 300mm
Filler; Chromosorb P 30-60mesh
Column cooling rate: 2.0 ° C./Hr
(2) Melt flow rate (hereinafter abbreviated as MI)
According to ASTM D-1238.
[0075]
(3) Molecular weight distribution
It measured by the gel permeation chromatography method (GPC). This was performed at 135 ° C. using o-dichlorobenzene as a solvent by SSC-7100 manufactured by Senshu Scientific. The column used is UT807, 806M manufactured by Shodex. The calibration curve was prepared using polystyrene having a weight average molecular weight of 950, 2900, 10,000, 50,000, 498,000, 277,000, 4.9 million as a standard sample.
[0076]
(4) Melt tension
Using an MT measuring device manufactured by Toyo Seiki Seisakusho, insert an orifice and pellet piston with a diameter of 2.095 mm into a cylinder maintained at 230 ° C. and hold for 6 minutes, then at an extrusion speed of 10 mm / min and a winding speed of 25 m / min. The melt tension of was measured.
[0077]
(5) Transparency (haze value)
It measured according to JIS K 6714.
[0078]
(6) Tensile modulus
The sample was cut into a strip having a width of 10 mm, and the measurement length was set to 20 mm and recorded on a chart paper by a tensile tester at a tensile speed of 20 mm / min and a chart speed of 2000 m / min. A perpendicular line was drawn at a
[0079]
Tensile modulus (MPa) = [strength (Kg) × sample length (mm) × chart speed (mm / min)] ÷ [tensile speed (mm / min) × 20 mm × film thickness (mm) × film width (mm) ] X 9.807
(7) Impact strength
It measured using the Toyo Seiki film impact tester in the chamber kept at 0 degreeC. After mounting the measurement sample on the holder, it was punched out with an impact head, and the strength was shown as impact strength.
[0080]
(8) Blocking strength
Two samples (12 × 12 cm) are overlapped, and a 10 kg load is applied and left in an atmosphere at a temperature of 50 ° C. for 72 hours. Then, the sample is cut out so that the overlapped portion becomes 3 × 4 cm, and a tensile tester (speed: The shear peel strength was measured at 100 mm / min).
[0081]
(9) Sagging time
The measurement sample was sandwiched between clamp frames (400 mm × 400 mm), and the measurement sample was heated from above and below with a far infrared heater set at 300 ° C. The time from the start of heating until the center of the measurement sample hangs down by 20 mm was measured.
[0082]
Although the low crystalline polypropylene used for the base material layer of the present invention will be described with reference to production examples and comparative production examples, the low crystalline polypropylene is not limited to these production examples.
[0083]
Production Example 1
(Preliminary polymerization)
A glass autoclave reactor having an internal volume of 1 liter equipped with a stirrer was sufficiently replaced with nitrogen gas, and then 400 ml of heptane was charged. The reactor internal temperature was kept at 20 ° C., and 0.18 mmol of butyl acetate, 22.7 mmol of ethyl iodide, 18.5 mmol of diethylaluminum chloride, and 22.7 mmol of titanium trichloride (manufactured by Marubeni Solvay Chemical Co., Ltd.) were added. Was continuously introduced into the reactor for 30 minutes at 3 g per gram of titanium trichloride. The temperature during this period was kept at 20 ° C. After stopping the supply of propylene, the inside of the reactor was sufficiently replaced with nitrogen gas, and the obtained titanium-containing polypropylene was washed four times with purified n-hexane. As a result of analysis, 2.9 g of propylene was polymerized per 1 g of titanium trichloride.
[0084]
(Main polymerization)
N2In a 300-liter polymerization tank subjected to substitution, 100 kg of liquid propylene, 50.56 mmol of diethylaluminum chloride, ethylaluminum sesquiethoxide (Et1.5Al (OEt)1.550.56 mmol was added, and the internal temperature of the polymerization tank was raised to 70 ° C. 6.32 mmol of titanium compound-containing polypropylene obtained by prepolymerization was added as titanium trichloride, and propylene was polymerized at 70 ° C. for 2 hours (first stage). Next, 1.01 mmol of butyl acetate was added, and hydrogen was inserted so that the concentration in the gas phase was 1 mol%, and polymerization was performed for 1 hour (second stage).
[0085]
Unreacted monomer was purged to obtain a polymer. The obtained polymer was dried under reduced pressure at 70 ° C. for 1 hour. Next, 0.035 wt% of antioxidant, heat stabilizer, chlorine scavenger and 1,3-bis (t-butylperoxyisopropyl) benzene were added and mixed, and then at 250 ° C. using a 50 mmφ extruder. Extruded into a pellet and used for physical property measurement. The results are shown in Table 1. Further, FIG. 1 shows an elution curve obtained by the temperature rising separation fractionation method.
[0086]
Production Example 2
In the main polymerization of Production Example 1, the addition amount of ethylaluminum sesquiethoxide was 25.28 mmol, and 1,3-bis (t-butylperoxyisopropyl) benzene used for granulation was 0.01% by weight. The same operation as in Production Example 1 was performed. The results are shown in Table 1.
[0087]
Production Examples 3 and 4
The amount of butyl acetate used in the second stage of the main polymerization in Production Example 1 was 10.10 mmol, and 0.01% by weight of 1,3-bis (t-butylperoxyisopropyl) benzene was used during granulation (Production) The same operation as in Production Example 1 was carried out except that 0.035% by weight of Example 3) and 1,3-bis (t-butylperoxyisopropyl) benzene were used (Production Example 4). The results are shown in Table 1.
[0088]
Production Example 5
In the main polymerization of Production Example 1, the same operation as in Production Example 1 was performed except that diethylaluminum (2,6-di-t-butylphenoxide) was used instead of ethylaluminum sesquiethoxide. The results are shown in Table 1.
[0089]
Production Example 6
In the main polymerization of Production Example 1, the same operation as in Production Example 1 was performed except that the polymerization time of the first stage was 90 minutes and the amount of butyl acetate used in the second stage was 2.02 mmol. The results are shown in Table 1.
[0090]
Comparative production examples 1 and 2
In the second polymerization main stage of Production Example 1, polymerization was carried out without using hydrogen, and 0.04% by weight of 1,3-bis (t-butylperoxyisopropyl) benzene was used during granulation (Comparative Production Example 1). ) And 0.02% by weight (Comparative Production Example 2) The same operation as in Production Example 1 was performed. The results are shown in Table 1.
[0091]
Comparative production example 3
The same operation as in Production Example 1 was performed except that the amount of butyl acetate used was 0.56 mmol in the main polymerization of Production Example 1. The results are shown in Table 1.
[0092]
Comparative production example 4
In the main polymerization of Production Example 1, Production Example 1 except that the polymerization time of the second stage was 20 minutes and 0.03% by weight of 1,3-bis (t-butylperoxyisopropyl) benzene was used during granulation. The same operation was performed. The results are shown in Table 1.
[0093]
Comparative Production Example 5
In the main polymerization of Production Example 1, except that 1.01 mmol of butyl acetate was used during the first stage polymerization and 0.02 wt% of 1,3-bis (t-butylperoxyisopropyl) benzene was used during granulation. The same operation as in Production Example 1 was performed. The results are shown in Table 1.
[0094]
Comparative Production Example 6
Production Example 1 except that ethylaluminum sesquiethoxide was not used in the main polymerization of Production Example 1, the polymerization time in the first stage was 30 minutes, and the amount of butyl acetate used in the second stage was 10.10 mmol. The same operation was performed. The results are shown in Table 1.
[0095]
Example 1
In an elution curve in which the low crystalline polypropylene obtained in Production Example 1 was fractionated by the central layer and the temperature rising elution fractionation method using three extruders, the amount of component A was 1% by weight. The propylene / butene-1 random copolymer is extruded on a 25 ° C. chill roll at a resin temperature of 230 ° C. with a T-die extruder so that both random layers are formed on the outer layer, and taken by a take-off machine. A laminate having a total layer thickness of 100 μm consisting of 25 μm was obtained. The physical properties of the obtained laminate are shown in Table 2.
[0096]
Example 2
In an elution curve in which the low crystalline polypropylene obtained in Production Example 2 was fractionated by a central layer using a temperature rising elution fractionation method using three extruders, the amount of component A was 1% by weight. The propylene / butene-1 random copolymer is extruded on a 25 ° C. chill roll at a resin temperature of 230 ° C. with a T-die extruder so that both outer layers become both outer layers, and taken up by a take-off machine. A laminate having a total layer thickness of 500 μm consisting of 100 μm was obtained. The physical properties of the obtained laminate are shown in Table 2.
[0097]
Example 3
A laminated body was obtained in the same manner as in Example 1 except that the thickness of the laminated body was set to 100 μm in total layer thickness of 70 μm for the center layer and 15 μm for both outer layers. The physical properties of the obtained laminate are shown in Table 2.
[0098]
Example 4
In the elution curve fractionated by the temperature rising elution fractionation method, the central layer was the same as in Example 1 except that an ethylene / propylene random copolymer having an A component content of 8% by weight was used for both outer layers. A laminate having a total layer thickness of 100 μm was obtained. The physical properties of the obtained laminate are shown in Table 2.
[0099]
Comparative Example 1
The polypropylene obtained in Production Example 1 was extruded on a 25 ° C. chill roll at a resin temperature of 230 ° C. by a T-die extruder, and taken up by a take-up machine to obtain a 100 μm monolayer film. The physical properties of the obtained film are shown in Table 2.
[0100]
Comparative Example 2
A laminate was obtained in the same manner as in Example 2 except that the polypropylene obtained in Comparative Production Example 1 was used as the center layer. The physical properties of the obtained laminate are shown in Table 2.
[0101]
Comparative Example 3
A laminate was obtained in the same manner as in Example 1 except that the polypropylene obtained in Comparative Production Example 2 was used as the center layer. The physical properties of the obtained laminate are shown in Table 2.
[0102]
Comparative Example 4
A laminate was obtained in the same manner as in Example 2 except that the polypropylene obtained in Comparative Production Example 3 was used as the center layer. The physical properties of the obtained laminate are shown in Table 2.
[0103]
Comparative Example 5
A laminate was obtained in the same manner as in Example 2, except that the polypropylene obtained in Comparative Production Example 4 was used as the center layer. The physical properties of the obtained laminate are shown in Table 2.
[0104]
Comparative Example 6
A laminate was obtained in the same manner as in Example 2, except that the polypropylene obtained in Comparative Production Example 5 was used as the center layer. The physical properties of the obtained laminate are shown in Table 2.
[0105]
Comparative Example 7
A laminate was obtained in the same manner as in Example 1, except that the polypropylene obtained in Comparative Production Example 6 was used as the center layer. The physical properties of the obtained laminate are shown in Table 2.
[0106]
Comparative Example 8
A laminate was obtained in the same manner as in Example 1 except that the central layer was a soft polyolefin composed of ethylene, propylene and butene-1 components shown in Table 1. The physical properties of the obtained laminate are shown in Table 2.
[0107]
Comparative Example 9
A laminate was obtained in the same manner as in Example 2 except that the central layer was a soft polyolefin composed of ethylene, propylene and butene-1 components shown in Table 1. The physical properties of the obtained laminate are shown in Table 2.
[0108]
Comparative Example 10
In the elution curve fractionated by the temperature rising elution fractionation method, the central layer was the same as in Example 1 except that an ethylene / propylene random copolymer having an A component content of 13% by weight was used for both outer layers. A laminate having a total layer thickness of 100 μm was obtained. The physical properties of the obtained laminate are shown in Table 2.
[0109]
[Table 1]
[0110]
[Table 2]
[Brief description of the drawings]
FIG. 1 is an elution curve fractionated by the temperature rising elution fractionation method of the low crystalline polypropylene of Production Example 1.
Claims (3)
低結晶性ポリプロピレン(a):
1)プロピレン単独重合体、またはプロピレン以外のα−オレフィン単位の含有量が5モル%以下のプロピレンとα−オレフィンとの共重合体
2)メルトフローレイトが0.5〜20g/10分
3)重量平均分子量(Mw)と数平均分子量(Mn)の比で表される分子量分布(Mw/Mn)が4〜15
4)昇温溶離分別法により分別された、横軸を溶出温度(℃)、縦軸を溶出成分の積算重量割合で表した溶出曲線に於いて、20℃未満での溶出成分(A成分)の量が5〜35重量%、20℃以上100℃未満での溶出成分(B成分)の量が10〜40重量%、100℃以上での溶出成分(C成分)が40〜80重量%、A成分、B成分およびC成分の合計が100重量%、B成分とA成分との重量比(B/A)が0.6以上で、且つ、C成分に於けるピークトップ温度が120℃以上A laminate in which a layer made of a low crystalline polypropylene (a) satisfying the following constitutions 1) to 4) is used as a base material layer, and layers made of a non-adhesive thermoplastic resin are laminated on both outer layers of the base material layer body.
Low crystalline polypropylene (a):
1) Propylene homopolymer or copolymer of propylene and α-olefin having a content of α-olefin units other than propylene of 5 mol% or less 2) Melt flow rate of 0.5 to 20 g / 10 min 3) weight average molecular weight (M w) and number-average molecular weight molecular weight distribution represented by the ratio of (M n) (M w / M n) is 4 to 15
4) The elution component (component A) at less than 20 ° C in the elution curve with the horizontal axis representing the elution temperature (° C) and the vertical axis representing the cumulative weight ratio of the elution component, separated by the temperature rising elution fractionation method. 5 to 35% by weight, the amount of the eluted component (component B) at 20 ° C. or higher and lower than 100 ° C. is 10 to 40% by weight, the eluted component (C component) at 100 ° C. or higher is 40 to 80% by weight, The total of component A, component B and component C is 100% by weight, the weight ratio of component B to component A (B / A) is 0.6 or more, and the peak top temperature in component C is 120 ° C. or more
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34682797A JP3822970B2 (en) | 1997-12-16 | 1997-12-16 | Laminated body |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34682797A JP3822970B2 (en) | 1997-12-16 | 1997-12-16 | Laminated body |
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| Publication Number | Publication Date |
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| JPH11170458A JPH11170458A (en) | 1999-06-29 |
| JP3822970B2 true JP3822970B2 (en) | 2006-09-20 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001054937A (en) * | 1999-08-17 | 2001-02-27 | Tokuyama Corp | Stretch packaging film |
| JP4440404B2 (en) * | 2000-01-17 | 2010-03-24 | 大日本印刷株式会社 | Decorative sheet |
| JP7596127B2 (en) * | 2020-11-25 | 2024-12-09 | 住友化学株式会社 | Propylene polymer composition and film |
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