JP3824262B2 - Semiconductor manufacturing apparatus and height adjustment method of semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention adjusts the height of, for example, a processing unit such as a developing device or a coating device provided in a semiconductor manufacturing apparatus that performs a developing process by supplying a developing solution to the surface of a substrate that has been coated with a resist and subjected to an exposure process.Technology.
[0002]
[Prior art]
In a semiconductor device manufacturing process, a resist solution is applied to a substrate such as a semiconductor wafer (hereinafter referred to as a wafer) or an LCD substrate of a liquid crystal display, the resist film is exposed using a photomask, and the resist film is developed and then developed. A photolithography technique for producing a resist pattern on a substrate is used.
[0003]
This photolithography is performed by the substrate processing system shown in the schematic diagram of FIG. In this system, for example, when processing an 8-inch semiconductor wafer (hereinafter referred to as a wafer), for example, a carrier stage 11 for loading / unloading a wafer carrier C, a processing section 1A, an interface section 1B, and an exposure apparatus 1C. The wafer W in the carrier C placed on the carrier stage 11 is carried into the processing block 1B via the delivery arm 12, and a resist film is formed in the coating unit 13 here. Thereafter, the wafer W is sent to the exposure apparatus 1C via the interface unit 1B and exposed there, and then returned to the processing block 1A and developed by the developing unit 14, and then the carrier stage 11 via the transfer arm 12. Returned to In the figure, MA is a main arm for carrying the wafer inside the processing block 1A, and 15 is provided with a heating section and a cooling section for heating and cooling the wafer, for example, before processing in the coating unit 13 and the developing unit 14 in a shelf shape. Shelf unit.
[0004]
For example, as shown in FIG. 12, the coating unit 13 and the developing unit 14 are mounted in multiple stages, and are configured so that they can be pulled out individually from the outside of the apparatus (directions indicated by arrows in FIGS. 11 and 12). For example, maintenance or the like is performed in the pulled out state. That is, the developing unit 14 will be described as an example. For example, reference numeral 16 in FIG. 13 is a square plate-like base plate on which the developing unit 14 indicated by a dotted line is placed and fixed. The base plate 16 is a guide rail (not shown). It is configured to be movable along the mechanism in the direction indicated by the arrow in the figure.
[0005]
Here, for example, when the pulled-out developing unit 14 is returned to the apparatus after the maintenance is completed, it is necessary to level the unit 14 so that the unit 14 is held horizontally. The leveling is required in this way in the development process, in which the exposed wafer is held on the spin chuck, and the nozzle is moved from one end of the wafer to the other while discharging the developer from the supply nozzle. The developer is accumulated on the surface of the wafer and allowed to stand for a predetermined time to advance the development reaction. To uniformly deposit the developer, the wafer surface and the supply nozzle This is because it is necessary to keep the distance constant and to suppress the inclination of the developer accumulated on the wafer surface.
[0006]
Here, the leveling is conventionally performed as shown in FIG. 13, for example, the base plate 16 and a support member 17A provided along the side of the base plate 16 at two positions in the left-right direction with respect to the drawing direction of the base plate 16. , 17B are fixed at the four corners of the base plate while adjusting the height by screw mechanisms 18a, 18b, 18c, 18d.
[0007]
As shown in FIG. 14, these screw mechanisms 18a to 18d are composed of a vertical screw portion 19a for height adjustment and fixing screw portions 19b and 19c provided on both sides of the vertical screw portion 19a. For example, the screw mechanism 18a, which is one of the screw mechanisms provided on the back side of the four screw mechanisms 18a to 18d, serves as an adjustment reference point, and the height of the vertical screw portion 19a is fixed. When adjusting, in the screw mechanisms 18b to 18d, first, the height of the base plate 16 is adjusted in accordance with the height position of the screw mechanism 18a by the vertical screw portion 19a for height adjustment, and then the remaining two fixing screws. The base plate 16 is fixed to the supporting members 17A and 17B at the height position by the portions 19b and 19c.
[0008]
[Problems to be solved by the invention]
By the way, in recent years, the wafer size has been increased from 8 inches to 12 inches, and there is a tendency for the thickness of the units to be reduced due to the demand for increasing the processing efficiency by multi-stage units. For example, the size is about 1 m × 1 m × 40 cm.
[0009]
Therefore, for example, if the development unit 14 is returned to the apparatus after the maintenance is completed and leveling is performed, the conventional screw mechanism 18 uses all vertical screws whose rotational directions are substantially vertical. In order to rotate, it is necessary to use the wrench in a substantially vertical state. Although the screw portions of the two screw mechanisms 18c and 18d on the front side can be rotated, the screw mechanism 18b on the back side can be rotated. Has a problem that the height cannot be adjusted because it is out of reach.
[0010]
For this reason, if the adjustment of the screw mechanism 18b on the back side is performed with the developing unit 14 pulled out, the developing unit 14 has a large weight of about 100 kg. As a result, it is difficult to level out at present.
[0011]
The present invention has been made under such circumstances, and an object thereof is to provide a technique for easily adjusting the height in a processing unit for processing a substrate of a semiconductor manufacturing apparatus.
[0012]
[Means for Solving the Problems]
  For this reason, the present inventionIn a semiconductor manufacturing apparatus that processes a substrate,
  BaseOn the boardApply the liquidIn order to perform processing, it is stacked in multiple stages in the vertical direction,Can be pulled out horizontallyA processing unit;
  A substantially horizontal for mounting and holding the processing unit.SquareA mounting plate;
  A height adjustment mechanism using a vertical screw that is provided at one corner on the back side in the pull-out direction among the four corners of the mounting plate, and that serves as a reference for height adjustment,
  A height adjustment mechanism using vertical screws provided at two corners on the near side in the pull-out direction among the four corners of the mounting plate,
  A height adjustment mechanism using horizontal screws that is provided at the other corner on the far side in the pull-out direction among the four corners of the mounting plate and is adjusted after height adjustment using the vertical screw. And comprising
  The height adjustment mechanism using the horizontal screw is
  An adjustment screw provided to extend along the side of the mounting plate and rotating about a substantially horizontal axis;
  Elevating means connected to the mounting plate and the adjusting screw and elevating by rotating the adjusting screw;Equipped,
  The raising / lowering means is raised and lowered by rotating the adjustment screw, and thereby the mounting plate
Lift and lowerMechanismIt is characterized byThe
[0013]
The adjustment screw connects a first screw and a second screw formed with a thread in the opposite direction to the first screw, and the lifting means is provided on the first screw. In addition, the first moving body that moves when the first screw is rotated and the second screw provided on the second screw moves in the opposite direction to the first moving body when the second screw is rotated. A second moving body; contact / separation means provided between the first moving body and the second moving body; and the first moving body connected to the contact / separation means and the mounting plate. And an elevating part that descends when the second moving body is separated and rises when the second moving body is close.
[0014]
Further, the elevating means is provided on the adjustment screw, which moves when the adjustment screw is rotated, a support body provided on the mounting plate, the lower surface contacting the upper surface of the movable body, The contact surface between the moving body and the support body is configured to be relatively inclined in the moving direction of the moving body, and the moving body is moved and supported by rotating the adjusting screw in a substantially horizontal direction. The mounting plate moves up and down through the body.
[0015]
  Such as the aboveUsing horizontal screwsThe height adjustment mechanism includes the processing unit.Front side of the drawer directionThe head of the adjustment screwForProvided. An example of the processing unit is a unit that performs coating processing of a coating solution on a substrate.The height adjustment method of the semiconductor manufacturing apparatus according to the present invention includes a step of positioning a processing unit provided on a substantially horizontal mounting plate on the back side in the pulling direction in the semiconductor device as described above, and then the mounting plate And adjusting the height of the height adjusting mechanism using the remaining vertical screws, with the height adjusting mechanism using the vertical screws provided on the back side in the pull-out direction as the reference height, and Adjusting the height of the height adjusting mechanism using a horizontal screw on the basis of the height adjusting mechanism using a vertical screw of the reference height, and leveling the mounting plate as described above Features.
[0016]
  In such an invention,placeAs the height adjustment mechanism on the back side when viewed from the opening where the processing unit is carried in and out, a mechanism that moves the mounting plate of the processing unit up and down by rotating the adjustment screw around a substantially horizontal axis is used. The leveling of the unit may be performed by rotating the adjusting screw about a substantially horizontal axis. For this reason, since the adjustment screw on the back side from the opening can be rotated with the wrench lying sideways, the operation becomes easy and the leveling of the processing unit can be easily performed.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
First, an outline of an example of a semiconductor manufacturing apparatus in which a processing unit having a height adjusting mechanism according to the present invention is incorporated will be described with reference to a plan view of FIG. 1 and a perspective view of FIG. In FIG. 1 and FIG. 2, reference numeral 21 denotes a cassette station for carrying in / out a cassette C in which, for example, 13 sheets of 12-inch wafers W are hermetically stored, for example, and the cassette C is loaded into the cassette station 21. A mounting unit 22 to be mounted, an opening / closing unit 23 provided on a wall surface in front of the mounting unit 22, and a delivery unit 24 for taking out the wafer W from the cassette C through the opening / closing unit 23 are provided. ing.
[0018]
A processing unit S1 surrounded by a casing is connected to the back side of the cassette station 21, and the processing unit S1 is a shelf unit 25 (multi-stage heating / cooling system unit in order from the front side). 25A, 25B, 25C) and a main transfer means 26 (26A) configured to be movable up and down, to the left and to the right and to the front and rear, and to be rotatable about a vertical axis for transferring a wafer W between liquid processing units to be described later. , 26B) are alternately arranged.
[0019]
In other words, the shelf units 25 (25A, 25B, 25C) and the main transfer means 26 (26A, 26B) are arranged in a line in the front-rear direction as viewed from the cassette station 21, and each of the connection parts G is used for transferring a wafer (not shown). Since the opening is formed, the wafer W can freely move from the shelf unit 25A on one end side to the shelf unit 25C on the other end side in the processing unit S1. The main transfer means 26 (26A, 26B) includes one surface portion on the shelf unit 25 (25A, 25B, 25C) side arranged in the front-rear direction when viewed from the cassette station 21, and one surface on the right liquid processing unit 27 side, for example. It is placed in a space surrounded by a partition wall composed of a part and a back part forming one surface on the left side.
[0020]
A portion of the main conveying means 26 (26A, 26B) to which the shelf unit 25 (25A, 25B, 25C) is not connected, for example, the right side surface portion described above, is a liquid processing unit 27 (27A, 27A, 27) having a multistage developing device and coating device. 27B). For example, as shown in FIG. 2, the liquid processing unit 27 (27A, 27B) has a configuration in which processing containers 28 in which developing devices and the like are stored are stacked in a plurality of stages, for example, five stages. A transfer port 28a is formed on the side surface on the main transfer means side so that a wafer transfer arm, which will be described later, can enter when the wafer W is loaded / unloaded. The transfer port 28a is provided with an openable / closable shutter (not shown). Yes. For the shelf unit 25 (25A, 25B, 25C), in addition to a heating unit and a cooling unit, a wafer transfer unit, a hydrophobic treatment unit, and the like are assigned, for example, in 10 stages on the upper and lower sides.
[0021]
An exposure apparatus S4 is connected to the back side of the shelf unit 25C in the processing unit S1 through the first interface unit S2 and the second interface unit S3. The first interface section S2 includes a transfer means 29 configured to be movable up and down and rotatable about a vertical axis, a peripheral exposure apparatus, an in-buffer cassette for temporarily storing a wafer carried into the exposure apparatus S4, and an exposure. A shelf unit 30A in which out buffer cassettes for temporarily storing wafers unloaded from the apparatus S4 are arranged in multiple stages, and a shelf unit 30B in which wafer transfer units and high-precision temperature control units are arranged in multiple stages. I have. The second interface unit S3 is provided with a transfer means 31 configured to be movable in a substantially horizontal direction, freely movable up and down, and rotatable about a vertical axis, whereby a transfer unit of the first interface unit S1 and Wafers are transferred to the high-precision temperature control unit and the in-stage 32 and out-stage 33 of the exposure apparatus S4. In this example, a liquid processing unit such as a developing device and a coating device, a heating unit and a cooling unit, a wafer transfer unit, and a hydrophobic treatment unit correspond to the processing unit of the present invention.
[0022]
The flow of wafers in this apparatus will be described. First, when a cassette C in which wafers W are stored from the outside is loaded into the cassette station 21, the lid of the cassette C is removed together with the opening / closing part 23, and the wafer 24 is transferred by the transfer means 24. W is taken out. Then, the wafer W is transferred from the transfer means 24 to the main transfer means 26A via a transfer unit which is one of the shelf units 25A. For example, after the resist solution is applied by a coating apparatus in the liquid processing unit 27A. The main transport means 26A → the delivery unit of the shelf unit 25B → the main transport means 26B → the delivery unit of the shelf unit 25C is sent to the first interface unit S2.
[0023]
In the first interface section S2, the in-buffer cassette of the shelf unit 30A → the peripheral exposure device of the shelf unit 30A → the high-precision temperature control unit of the shelf unit 30B is transported by the delivery means 29 and delivered to the shelf unit 30B. The wafer is transferred to the second interface S3 through the unit, and the wafer in the second interface section S3 is transferred to the exposure apparatus S4 by the transfer means 31 via the in-stage 32 of the exposure apparatus S4, and exposure is performed. Before applying a resist to a wafer, for example, a hydrophobization process and a cooling process are performed in each processing unit included in the shelf units 25A, 25B, and 25C. After applying a resist, a heating process and a cooling process are performed. Done.
[0024]
After exposure, the wafer is transported from the second interface S3 to the processing unit S1 via the first interface unit S2, and is subjected to a predetermined development process by the developing device of the liquid processing unit, thus forming a predetermined resist pattern. The Before and after the development, pre-processing and post-processing such as heat processing and cooling processing are performed in the shelf units 25A, 25B, and 25C.
[0025]
Next, an example of the height adjusting mechanism of the present invention will be described by taking as an example a configuration in which this mechanism is provided in the developing device 4 of the semiconductor manufacturing apparatus. First, an example of the developing device 4 will be described with reference to FIGS. 3 and 4. Reference numeral 41 denotes a spin chuck which is a substrate holding unit, and is configured to hold the wafer W horizontally by vacuum suction. The spin chuck 41 can be rotated about a vertical axis by a drive unit 42 including a motor and an elevating unit, and can be moved up and down. A cup 43 is provided around the spin chuck 41 so as to surround a side portion extending from the wafer W to the spin chuck 41, and an exhaust pipe 44 and a drain pipe 45 are connected to the bottom surface of the cup 43.
[0026]
On the upper side of the liquid receiving cup 43, for example, a supply nozzle 46 having a large number of supply holes arranged in the diameter direction of the wafer W is provided, and this nozzle 46 is not shown through a supply path (not shown). Connected to the developer tank. In the figure, reference numeral 47 denotes a cleaning liquid nozzle for supplying a cleaning liquid to the surface of the wafer W. These nozzles 46 and 47 are moved between the upper part of the wafer W and the outside of the cup 43 by moving mechanisms 48 and 49, respectively. It can be moved in a substantially horizontal direction with respect to the wafer W and can be moved up and down.
[0027]
In the developing apparatus configured as described above, the wafer W is loaded by the main transfer means 25 and transferred to the spin chuck 41. Then, a developer adjusted to a predetermined temperature is supplied from the nozzle 46 to the center of the wafer W, and the developer is applied onto the wafer W by rotating the spin chuck 41 half a turn at a preset rotation speed and acceleration. Is filled. In this way, development is performed while the developer is left on the wafer W for a predetermined time, and then the cleaning liquid is supplied onto the wafer W by the cleaning nozzle 47 to wash away the developer, and then a process such as spin drying is performed. Then, the development processing is completed, and the wafer W is transferred to the main transfer means and transferred to the next process.
[0028]
In the figure, reference numeral 51 denotes a support base provided with the drive unit 42, the cup 43, and the like, and this mounting base is fixed at a predetermined position on the base plate 6 forming a mounting plate via a substantially vertical support bar 52. Yes. A predetermined space is formed between the base plate 6 and the support base 51, and an exhaust outlet path 53 including the exhaust pipe 44 and the drain pipe 45 passes through the space and passes through the predetermined exhaust path 54 or drain. Connected to path 55.
[0029]
The base plate 6 can be pulled out in the direction indicated by the arrow in FIG. 2 and FIG. 3 (Y direction). That is, guide rails 56 extending substantially horizontally in the Y direction along the sides of the base plate 6 are provided at predetermined positions on the left and right sides of the base plate 6 in the drawing direction. A provided guide portion 57 (see FIG. 6) is combined with the guide rail 56. Accordingly, the base plate 6 can be moved in the Y direction by pulling the pull-out member 58 attached to the base plate 6 via the two substantially horizontal members 57a and 57b on the front side of the plate 6 in the pull-out direction. It has become. FIG. 3 shows a state in which the developing device 4 is returned to the liquid processing unit 27 and mounted at a predetermined position.
[0030]
The guide rail 56 is composed of a step portion formed inside the support member 61 (61a, 61b) extending in the Y direction along the side of the base plate 6, for example, and the outside of the step portion is configured as a flat surface portion 62. When the base plate 6 is located at the mounting position, the corresponding side of the base plate 6 is fixed to the flat surface portion 62 by adjusting the height (see FIG. 6). At this time, when the base plate 6 is located at the mounting position, the height can be adjusted downward when adjusting the height position of the base plate 6 between the base plate 6 and the flat surface portion 62 of the support member 61. Thus, a gap of about 3 mm, for example, is formed by a preset amount (see FIG. 7).
[0031]
When the base plate 6 is in the mounting position, the base plate 6 and the support member 61 are fixed in an adjusted state in the vicinity of the four corners of the base plate 6 as shown in FIG. Next, the height adjusting mechanism will be described. Of the four fixed portions (6a, 6b, 6c, 6d) of the base plate 6, two on the front side (6c, 6d) in the pulling direction and one on the back side. The same screw mechanism as the conventional one is used for the location (6a). That is, as shown in FIGS. 6 and 7, a vertical screw portion 63 for height adjustment and fixing screw portions 64 and 65 provided on both sides of the vertical screw portion 63 are provided.
[0032]
The vertical screw portion 63 for height adjustment includes a height adjustment screw 63a threaded on the entire outer surface, and the height adjustment screw 63a is adjusted with the height adjustment screw 63a. And a lock nut 63b having a thread formed on the inner surface so as to be screwed with the thread of the height adjusting screw 63a. The height adjusting screw 63a is provided so as to penetrate the base plate 6 and have a tip seated on the surface of the flat surface portion 62 of the support member 61. The base plate 6 is formed with a screw hole 6a at a predetermined position. The threaded hole 6a is threaded so that the inner surface is threadedly engaged with the threaded height adjusting screw 63a.
[0033]
When height adjustment is performed using such a vertical screw portion 63, the height adjustment screw 63a is first rotated in a predetermined direction with the lock nut 63b raised and loosened. That is, since the tip of the height adjusting screw 63a is always seated on the surface of the support member 61, the position of the tip of the height adjusting screw 63a does not move vertically. For example, when the screw 63a is rotated to the right. When the base plate 6 is raised and, for example, the screw 63a is rotated to the left, the base plate 6 is lowered, whereby the height position of the base plate 6 can be adjusted. After adjusting the height in this way, the lock nut 63b is lowered and tightened and fixed.
[0034]
The fixing screw portions 64 and 65 pass through the base plate 6 and reach the inside of the support member 61. The fixing screw portions 64 and 65, the fixing screw portions 64 and 65 of the support member 61, The corresponding region is formed with threading to be screwed respectively. Further, the depth of the screw hole 61 b of the support member 61 is formed in consideration of the height adjustment amount of the base plate 6. The depth side screw mechanism 6a serves as an adjustment reference point, and the height of the height adjustment screw 63a is fixed.
[0035]
Next, the remaining height adjustment mechanism (6b) on the back side of the base plate 6 will be described with reference to FIGS. This mechanism is a mechanism for raising and lowering the base plate 6 by the raising and lowering means by rotating a horizontal screw that rotates in a substantially horizontal direction. In the drawing, reference numeral 71 denotes a first screw portion having a lateral screw type adjusting screw extending along the side of the base plate 6 in the length direction (Y direction) of the support member 61, and 72 denotes a length direction (Y Direction) and a second screw portion provided with a lateral screw type adjusting screw extending along the side of the base plate 6, and these are threaded opposite to each other. In this example, the first screw portion 71 is a left screw portion having a left screw threading, the second screw portion 72 is a right screw portion having a right screw threading, and these screw portions 71 and 72 are For example, the left screw portion 71 is provided side by side in the length direction of the support member 61 and connected to each other so that the left screw portion 71 is on the near side in the drawing direction.
[0036]
The left screw portion 71 is screwed to the left screw 73 with a left screw (first screw) 73 made of a horizontal screw extending in the length direction of the support member 61 having a left screw threaded on the outer surface. A first moving body (left moving body) 74 having an inner surface formed with threading, and the right screw portion 71 has a length of the support member 61 with an outer surface formed with a right thread. A right screw (second screw) 75 made of a horizontal screw extending in the direction, and a second moving body (right moving body) 76 having a threaded portion that is screwed into the right screw portion 75 formed on the inner surface. Yes. The left screw 73 and the right screw 75 are connected as described above, and thereby an adjustment screw is configured. Further, the first screw may be a right screw and the second screw may be a left screw.
[0037]
The left moving body 74 and the right moving body 76 are connected by contact / separation means as shown in FIGS. 8 and 9 on the left side as viewed from the drawing direction. That is, one end of a first plate 77 and a second plate 78 is connected to the left moving body 74 and the right moving body 76, respectively, so as to be rotatable about a substantially horizontal axis. The other end side of the plate 78 is rotatably connected to a substantially horizontal shaft portion 79 extending in the X direction. The shaft portion 79 is fixed to the base plate 6 by an elevating portion 80 that also serves as a fixing member, and the left screw portion 71 and the right screw portion 72 are disposed at substantially symmetrical positions via the shaft portion 79. A left screw 73 and a right screw 74 are connected near the lower side of the shaft portion 79. In this example, the first plate 77, the second plate 78, and the shaft portion 79 constitute contact / separation means, and the contact / separation means, the left moving body 74, the right moving body 76, and the lifting / lowering section 80 move up and down. Means are configured.
[0038]
In the drawing, 81 is a bearing portion for rotatably supporting the left screw 73 on the side surface of the support member 61, and 82 is a bearing portion for rotatably supporting the right screw 75 on the side surface of the support member 61. is there. Further, the front end side of the left screw 73 (the front side in the drawing direction) is connected to a rotary shaft 83 via a bearing 81, and a screw head having a shape corresponding to, for example, a hexagonal box spanner is connected to the front end side of the rotary shaft 83. The portion 84 is formed. In the figure, reference numerals 85 and 86 denote a positioning member and a corresponding hole.
[0039]
In such a configuration, when the screw head 84 is rotated, for example, to the right by a hexagonal box spanner, the left moving body 74 and the right moving body 76 include the first and second plates 77 and 78 and the shaft portion 79. Therefore, the left moving body 74 and the right moving body 76 do not rotate in accordance with the rotation of the left screw 73 and the right screw 75, respectively. For example, as shown in FIG. In the screw portion 71, the left moving body 74 moves the left screw 73 in the right direction, and in the right screw portion 72, the right moving body 76 moves the right screw 75 in the left direction. For this reason, since the moving bodies 74 and 76 are separated from each other, the position of the shaft portion 79 is lowered, whereby the base plate 6 is lowered via the elevating portion 80.
[0040]
On the other hand, when the screw head 84 is rotated to the left side, for example, as shown in FIG. 9B, the left moving body 74 moves the left screw 73 leftward in the left screw portion 71 and the right screw portion 72 in the left screw portion 72. Since the right moving body 76 moves the right screw 75 in the right direction and the moving bodies 74 and 76 come close to each other, the position of the shaft portion 78 is thereby raised, and thus the base plate 6 is raised. In this way, the height adjustment mechanism adjusts the height of the base plate 6 by rotating the adjustment screw that rotates in a substantially horizontal direction, but each of the screws 73 of the left screw portion 71 and the right screw portion 72, The length of 75 and the lengths of the plates 77 and 78 constituting the contact / separation means are appropriately set in consideration of the height adjustment amount of the base plate 6. The contacting / separating means is not limited to an example in which two plates are combined, and may be configured by combining three or more plates.
[0041]
In such a developing device 4, the base plate 6 is leveled with the base plate 6 returned to the mounting position. At this time, first, the base plate 6 is moved along the guide rail 56 in the direction opposite to the pull-out direction. Then, the alignment member 85 is inserted into the hole 86 and positioned at the mounting position. Then, in accordance with the height of the screw mechanism 6a at the adjustment reference point, for example, in the two screw mechanisms 6c and 6d on the front side, after the height adjustment with the height adjustment screw portion 63, the fixing screw portion 64, The base plate 6 is fixed to the support member 61 at 65, and then the height is adjusted by rotating the screw head 84 about the substantially horizontal axis by the screw mechanism 6b on the back side.
[0042]
In the present embodiment, a mechanism for raising and lowering the base plate 6 by rotating an adjustment screw around a substantially horizontal axis as a height adjustment mechanism on the back side when viewed from the opening where the processing unit is carried in and out is used. Since the adjustment screw is provided so that the screw head 84 is positioned on the front side when viewed from the opening, the adjustment unit may be rotated by rotating the adjustment screw around a substantially horizontal axis when leveling the processing unit. In other words, the screw head of the adjustment screw on the back side is close to the opening so that it can be easily reached by the operator, and the screw head can be rotated with the wrench lying on its side. Compared with the case where it does, operation becomes easy and the height adjustment of a back side can be performed easily. Therefore, by using the height adjusting mechanism of the present invention, it is easy to level the processing unit having a low height and a large depth.
[0043]
Next, another embodiment of the present invention will be described with reference to FIG. In the figure, 91 is an adjustment screw that extends along the side of the support member 61 and rotates in a substantially horizontal direction, and 92 is a moving body in which a threading that is screwed with the adjustment screw 91 is formed. The upper surface is formed, for example, as an inclined surface that gradually increases toward the near side in the drawing direction. The moving body 92 is attached to, for example, the support member 61 so as not to rotate in accordance with the rotation of the adjusting screw 91, so that the moving body 92 moves along the adjusting screw 91 by rotating the adjusting screw 91. Yes.
[0044]
On the other hand, at a position corresponding to the moving body 92 of the base plate 6, for example, a rotating body 93 that forms a substantially disk-shaped support that is rotatable about a substantially horizontal axis extending in the X direction, the lower surface of the rotating body 93 is the moving body. It is attached so as to contact 92 inclined surfaces. In such a configuration, for example, as shown in FIG. 10A, by rotating the adjustment screw 91 to the right, the moving body 92 moves to the right, and thus the rotating body 93 rotates to the left. As a result, the base plate 6 is lowered. On the other hand, as shown in FIG. 10B, for example, when the adjustment screw 91 is rotated to the left, the moving body 92 moves to the left, thereby causing the rotating body 93 to move to the right. Thus, the base plate 6 is raised. At this time, the length and the inclination of the inclined surface are appropriately determined according to the height adjustment amount of the base plate 6. In this example, the moving body 92 and the rotating body 93 constitute lifting means. Further, the support is not limited to the rotating body, and the contact surface between the moving body and the supporting body may be configured to be relatively inclined in the moving direction of the moving body.
[0045]
In the present invention, in the present invention, the height adjusting mechanism provided with the raising / lowering means that moves up and down by rotating the adjusting screw in a substantially horizontal direction is not only a developing device, but also a coating device, a heating device, a cooling unit, a hydrophobic treatment unit, etc. You may make it provide in another processing unit. Further, the height adjusting mechanism provided with the raising and lowering means that moves up and down by rotating the adjusting screw in the substantially horizontal direction may be provided not only in the back side in the pulling direction of the base plate 6 but also in other places. Furthermore, the present invention can be applied as a height adjustment mechanism for a processing unit of any semiconductor manufacturing apparatus that requires leveling in addition to a semiconductor manufacturing apparatus that applies a resist and develops the exposed substrate. In addition, it can be applied to a processing unit for processing a glass substrate of a liquid crystal display.
[0046]
【The invention's effect】
According to the present invention, height adjustment can be easily performed in a processing unit of a semiconductor manufacturing apparatus.
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of a semiconductor manufacturing apparatus provided with a height adjusting mechanism of the present invention.
FIG. 2 is a perspective view showing the semiconductor manufacturing apparatus.
FIG. 3 is a perspective view showing an embodiment of a developing device provided with a height adjusting mechanism of the present invention.
FIG. 4 is a cross-sectional view showing the developing device.
FIG. 5 is a perspective view showing a base plate of the developing device.
FIG. 6 is a perspective view for explaining a conventional height adjusting mechanism of the base plate.
FIG. 7 is a cross-sectional view for explaining the height adjusting mechanism.
FIG. 8 is a perspective view showing an embodiment of the height adjusting mechanism of the present invention.
FIG. 9 is a side view for explaining the operation of the height adjusting mechanism of the present invention.
FIG. 10 is a side view showing another example of the height adjusting mechanism of the present invention.
FIG. 11 is a plan view showing a conventional semiconductor manufacturing apparatus.
FIG. 12 is a perspective view showing a developing unit of the semiconductor manufacturing apparatus.
FIG. 13 is a perspective view showing a base plate of the developing unit.
FIG. 14 is a plan view showing an example of a height adjustment mechanism of the base plate.
[Explanation of symbols]
W wafer
4 Development device
41 Spin chuck
43 cups
46 Supply nozzle
56 Guide rail
6 Base plate
61 Support member
63 Height adjustment screw
64,65 Fixing screw
71 Left-hand thread
72 Right-hand thread
73 Left-hand thread
74 Left moving body
75 right hand thread
76 Right moving body
77 First plate
78 Second plate
79 Shaft
80 Lifting part

Claims (6)

In a semiconductor manufacturing apparatus that processes a substrate,
For performing processing by applying a liquid to the board, in the longitudinal direction are stacked in multiple stages, a processing unit can be pulled out laterally,
A substantially horizontal rectangular mounting plate for mounting and holding the processing unit;
A height adjustment mechanism using a vertical screw that is provided at one corner on the back side in the pull-out direction among the four corners of the mounting plate, and that serves as a reference for height adjustment,
A height adjustment mechanism using vertical screws provided at two corners on the near side in the pull-out direction among the four corners of the mounting plate,
A height adjustment mechanism using horizontal screws that is provided at the other corner on the far side in the pull-out direction among the four corners of the mounting plate and is adjusted after height adjustment using the vertical screw. And comprising
The height adjustment mechanism using the horizontal screw is
An adjustment screw provided to extend along the side of the mounting plate and rotating about a substantially horizontal axis;
Connected to said adjusting screw and the mounting plate, anda lifting means for lifting by rotating the adjusting screw,
The adjusting screw lifting means is raised and lowered by rotating the semiconductor manufacturing equipment, characterized in that thereby a mechanism for raising and lowering the mounting plate. The adjustment screw is formed by connecting a first screw and a second screw formed with threading in a direction opposite to the first screw,
The lifting means is
A first moving body that is provided on the first screw and moves when the first screw is rotated;
A second moving body provided on the second screw, the second moving body moving in a direction opposite to the first moving body when the second screw is rotated;
Contact / separation means provided between the first moving body and the second moving body;
An elevating part connected to the contacting / separating means and the mounting plate, and descending when the first moving body and the second moving body are separated from each other and rising when approaching semiconductor manufacturing equipment according to claim 1 Symbol mounting to. The lifting means is
A moving body provided on the adjustment screw, which moves when the adjustment screw is rotated;
A support provided on the mounting plate, the lower surface contacting the upper surface of the movable body;
The contact surface between the moving body and the support is configured to be relatively inclined in the moving direction of the moving body,
Wherein by rotating in a substantially horizontal direction adjusting screw, the moving body is moved, thus the semiconductor manufacturing equipment according to claim 1, wherein the mounting plate via a support, characterized in that the lifting. Height adjusting mechanism using the horizontal screw, the front side of the drawing direction of the processing unit, of claims 1, characterized in that it is provided with a head portion of the adjusting screw toward Ke 3 according to any one semiconductor manufacturing equipment. The processing unit, the semiconductor manufacturing equipment according to any one of claims 1 to 4, characterized in that a unit for performing coating processing of the coating liquid to the substrate. In the height adjustment method in the semiconductor manufacturing apparatus according to claim 1,
A step of positioning the processing unit provided on the substantially horizontal mounting plate on the back side in the pulling direction;
  Next, a step of adjusting the height of the height adjusting mechanism using the remaining vertical screws using the height adjusting mechanism using the vertical screws provided on the mounting plate and on the back side in the pull-out direction as a reference height. When,
Subsequently, using the height adjustment mechanism using the vertical screw of the reference height as a reference, performing a height adjustment of the height adjustment mechanism using a horizontal screw,
A level adjustment method for a semiconductor manufacturing apparatus, characterized by leveling the mounting plate.

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