JP3832135B2

JP3832135B2 - Circuit board processing method

Info

Publication number: JP3832135B2
Application number: JP10224999A
Authority: JP
Inventors: 隆雄久角; 武志上村; 薫志水; 嘉昭古家
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1999-04-09
Filing date: 1999-04-09
Publication date: 2006-10-11
Anticipated expiration: 2019-04-09
Also published as: JP2000288509A

Description

【０００１】
【発明の属する技術分野】
本発明は、廃棄または再生する回路基板（プリント配線基板等）の処理方法と処理装置に関し、詳しくはプリント配線基板に半田付けした各種電子部品を取り外し、半田を回収する方法と、プリント配線基板の炭化方法とその装置に関する。
【０００２】
【従来の技術】
資源の有効活用、地球環境保全を目的として廃棄テレビジョン等は、解体し構成材料毎に分別再生（リサイクル）処理される。
【０００３】
各種電子機器を構成するプリント配線基板の処理方法としては例えば特開平８−１４３８２３号公報において、回転するドラム内にプリント配線基板を収容し、該ドラムの周囲より加熱して、前記プリント配線基板より電子部品と半田を分離、回収する方法が提案されている。
【０００４】
また、搭載した各種電子部品を取り除いた後、プリント配線基板を乾留して樹脂からガスを放出させ炭化して、基板樹脂と銅箔とガラス繊維とを分別回収する方法として、例えば、特開平１０−３１４７１１号公報等が提案されている。
【０００５】
【発明が解決しようとする課題】
しかし、上記特開平８−１４３８２３号公報においてはプリント配線基板の加熱手段として電熱ヒータを用いており、半田の加熱と電子部品の取り外しに時間を要していた。また、電熱ヒータとプリント配線基板との間に空気が存在し熱伝達が悪かった。
【０００６】
さらに、上記特開平１０−３１４７１１号公報においては、プリント配線基板から各種電子部品や半田を取り除いた後、低温乾留するもので、電子部品や半田の除去工程が必要である。
なお、一般的な乾留装置はロータリーキルン型のため大量乾留処理には向くが、少量の乾留処理や異なる種類のプリント配線基板を取り扱う場合には不向きである。
さらに、窒素などの不活性ガスを併用する場合、不活性ガスの消費量が多くランニングコストが大きくなってしまう。
【０００７】
本発明はプリント配線基板と半田付け部の加熱を短時間で行い、効率よく半田または電子部品の少なくとも一方を回収することを目的とする。
また、プリント配線基板の種類に応じたロットの切換が簡単で、少量の炭化処理を可能にし、リサイクル費用の低減を図ることを目的とする。
さらに、各種電子部品を搭載したプリント配線基板等を炭化させ、搭載した部品と回路基板を構成する樹脂と銅箔とガラス繊維などを分別回収することを目的とする。
【０００８】
【課題を解決するための手段】
上記課題を解決するために本発明における回路基板の処理方法は、
１．回路基板と分離剤とを収納した二重構造の収納容器を回転させながら高周波加熱手段により２３０℃〜２９０℃に加熱し、前記回路基板から電子部品とはんだの内、少なくとも一方を分離する回路基板の処理方法とした。
２．回路基板と分離剤と半田こすり部材とを収納した二重構造の収納容器を高周波加熱手段により２３０℃〜２９０℃に加熱し、前記回路基板から電子部品とはんだの内、少なくとも一方を分離する回路基板の処理方法とした。
３．回路基板と分離剤とを収納した二重構造の収納容器を回転させながら高周波加熱手段により２５０℃〜４５０℃に加熱し、前記回路基板等を乾留する回路基板の処理方法とした。
４．回路基板と分離剤と半田こすり部材とを収納した二重構造の収納容器を高周波加熱手段により２５０℃〜４５０℃に加熱し、前記回路基板等を乾留する回路基板の処理方法とした。
５．前記分離剤を糠類、穀類の粒または粉末、豆類の粉末、種子の粒または粉末、大豆カスの粉末、落花生の殻の粉末の内から選択したいずれか一つ，またはその組合せとした。
【０００９】
上記構成において、前記糠類は米糠、ふすま、麦糠、大麦混合糠、裸麦糠、裸麦混合糠等とし、豆類の粉末は大豆、小豆、落花生、ココナッツ等とし、種子の粉末はゴマ、ヒマワリ、ヤシ、菜種、綿実等とし、前記群から選択したいずれか一つ、またはその組合せとした。
【００１０】
前記分離剤は加熱により油成分を分泌し、炭化物、ガラス繊維、銅箔等に付着し相互の分離を促進する。また、半田付け部から半田が分離するのを助長する。（フラックス作用を果たす。）
さらに、分離剤に含まれるリン（Ｐ）と前記油成分が半田等金属の酸化防止機能を果たす。前記油成分は有機酸Ｒ・（ＣＯＯＨ）ｎ成分（すなわちオレイン酸、リノール酸、パルミチン酸等）を含む。
さらに、ナトリウムＮａが分離剤に含まれる場合、Ｎａも還元剤として作用する。
【００１１】
ゴマ、粟などの比較的小さい粒の種子は自然に採れた粒状のままでよい。粉砕した分離剤の大きさは１ｍｍ程度とした。
糠などの粉末状をなす各分離剤の粒度分布は特に調製する必要はない。玄米の精白過程や，小麦粉の製造過程等で生じた粒度分布そのままでよい。（約１ｍｍ〜０．０１μｍ程度の範囲）
ちなみに、糠類の内、米糠成分の一例を記すと、
リン・・２％以下、蛋白質・・１３．４％、粗脂肪・・１７．１％、粗繊維・・７．９％、粗灰分・・１０．２％、カルシウムＣａ・・０．０６％、可消化成分（鶏、豚、牛等）・・残部大半、（他の成分記載は省略）等となる。
なお、米糠は玄米などを精白するとできる果皮、種皮、胚芽等の砕粉物からなる。
【００１２】
また、豆類の内、大豆の成分は、
可食部１００ｇ中、脂肪・・１７．５ｇ、リン・・４７０ｍｇ、ナトリウムＮａ・・３ｍｇ、カルシウムＣａ・・１９０ｍｇ、鉄・・７ｍｇ、蛋白質・・３４．３ｇ、（他の成分記載は省略）等となっている。
【００１３】
従って、米糠以外の前記各分離剤においても油成分とリン、または油成分を含んでおり、米糠と同様の機能を果たす。
特に、油脂成分の豊富な豆類の粉末（大豆、小豆、落花生、ココナッツ等）、または種子の粉末（ゴマ、ヒマワリ、ヤシ、菜種等）等が有効である。ゴマ（ｓｅｓａｍｅ）の脂肪酸はオレイン酸、リノール酸を多く含む。
なお、本発明における分離剤は１種類で構成されることの他に、２種類以上の部材を組み合わせる様にしてもよい。
７．前記はんだこすり部材を籾殻、セラミックス粒（アルミナ、ジルコニア等）、ステンレススティール粒、けい砂、鋼砂、鉄砂、土砂の内いずれか一つ，またはその組合せとした。砂や粒の大きさは約１ｍｍ程度の大きさとした。
こすり部材は回路基板または半田付け部分への熱伝達を向上させ、はんだの溶融や回路基板の炭化を促進する。また、半田付け部のはんだと接触してこすり落とす役割を果たす。その結果、はんだの回収率が向上する。
籾殻は炭化過程で密閉容器内の酸素を消費し、金属の酸化を抑制する。
【００１４】
本発明は上記構成により、はんだ等の回収率が向上し処理時間を短縮する。また、炭化した樹脂と金属、ガラス繊維との分離を容易にする。さらに、回路基板のバッチ処理を可能にする。さらに、処理装置の構成が簡単とり不活性ガスの使用量を低減する。さらに、小ロットでの回路基板リサイクルを可能とし、ロット切換を容易にする。また、リサイクル費用も小さくできる。
【００１５】
【発明の実施の形態】
本発明における第１の発明は、回路基板を収納する第２の有底容器およびその蓋体と、前記第２の有底容器を収納し，かつ回転可能な第１の有底容器およびその蓋体と、前記第１の有底容器を周囲より加熱する加熱手段と、前記第１の有底容器を回転させる容器回転手段とからなることを特徴とする回路基板の処理装置としたもので、回路基板からの電子部品とはんだ等の回収、または回路基板や電子部品を構成する樹脂部材の炭化を簡単な装置で実施できる。また、リサイクルする回路基板のロット切換、バッチ処理を容易にする。
【００１６】
本発明における第２の発明は、内部に収納した回路基板と分離剤とが自重落下可能に容器を回転させ、前記回路基板と分離剤とを周囲より２２０℃〜２９０℃に加熱して前記回路基板から電子部品とはんだの内，少なくとも一方を取り外すようにしたものであって、前記分離剤が糠類、穀類の粒または粉末、豆類の粉末、種子の粒または粉末、大豆カスの粉末、落花生の殻の粉末の内から選択したいずれか一つ，またはその組合せとしたことを特徴とする回路基板の処理方法としたもので、電子部品とはんだの分離を促進し、はんだの回収率を向上させる。
【００１７】
本発明における第３の発明は、内部に収納した回路基板と分離剤と半田こすり部材とが自重落下可能に容器を回転させ、前記回路基板と分離剤と半田こすり部材とを周囲より２２０℃〜２９０℃に加熱して前記回路基板から電子部品とはんだの内，少なくとも一方を取り外すようにしたものであって、前記分離剤が糠類、穀類の粒または粉末、豆類の粉末、種子の粒または粉末、大豆カスの粉末、落花生の殻の粉末の内から選択したいずれか一つ，またはその組合せとしたことを特徴とする回路基板の処理方法としたもので、電子部品とはんだの分離を促進し、はんだの回収率を向上させる。
【００１８】
本発明における第４の発明は、内部に収納した回路基板と分離剤とが自重落下可能に容器を回転させ、前記回路基板と分離剤とを周囲より２５０℃〜４５０℃に加熱して前記回路基板を乾留するようにしたものであって、前記分離剤が糠類、穀類の粒または粉末、豆類の粉末、種子の粒または粉末、大豆カスの粉末、落花生の殻の粉末の内から選択したいずれか一つ，またはその組合せとしたことを特徴とする回路基板の処理方法としたもので、電子部品とはんだの分離を促進し、はんだの回収率を向上させる。また、炭化物と金属、ガラス繊維との分離を容易にする。
【００１９】
本発明における第５の発明は、内部に収納した回路基板と分離剤と半田こすり部材とが自重落下可能に容器を回転させ、前記回路基板と分離剤と半田こすり部材とを周囲より２５０℃〜４５０℃に加熱して前記回路基板を乾留するようにしたものであって、前記分離剤が糠類、穀類の粒または粉末、豆類の粉末、種子の粒または粉末、大豆カスの粉末、落花生の殻の粉末の内から選択したいずれか一つ，またはその組合せとしたことを特徴とする回路基板の処理方法としたもので、電子部品とはんだの分離を促進し、はんだの回収率を向上させる。また、回路基板の炭化時間とはんだ溶融時間を短縮する。さらに、炭化物と金属、ガラス繊維との分離を容易に行える。
【００２０】
【実施例】
以下、本発明の一実施例における回路基板の処理装置と処理方法を図面とともに説明する。
【００２１】
（実施例）
図１は本発明の一実施例における回路基板から半田等を回収する装置、または回路基板を乾留する装置の概念の模式図、図２は図１を切断線ＳーＳで切断した要部断面図を示す。
図１において、符号１はドラム状の回転容器（第１の有底容器）、符号２は前記回転容器１の開口を閉蓋する蓋体、３は前記蓋体に一体的に付属し，不活性ガスたとえば窒素ガス（Ｎ↓２ガス）を供給したり、前記回転容器内の空気や回路基板から出るハロゲン物質ガス等を排出する配管、５は各種電子部品を実装した回路基板を収納する網カゴ（第２の有底容器）である。網カゴ５に収納する回路基板は各種電子部品を実装した回路基板そのままの大きさ、または数ｃｍ角の大きさに破砕した（シュレッダー処理した）ものなど任意の大きさとしてよい。
６は網カゴ５の開口を閉蓋する網蓋、７は前記回路基板を２３０〜２９０℃または２５０〜４５０℃に加熱する高周波加熱コイル、８と９は流体の流れを制御する開閉弁、１０は圧力のかかった流体を一方向にのみ通す圧力弁、１１はガス中に含まれる液体または回路基板から出る液体等を回収する液体回収装置、１２は回路基板から出たハロゲン物質ガスを回収、中和するガス回収装置、１３は前記有底容器内の空気を排出し減圧する真空ポンプ、１４は前記回転容器１に一体的に取り付き回転させる支軸、１５は回転容器１を回転駆動する駆動モータ、１６はロータリージョイント、３０は回路基板（プリント配線基板などの処理対象物）、４０は電子部品、半田などの落下物、１００は本発明の処理装置を示す。
【００２２】
本発明の一実施例における処理装置１００は、回路基板３０を収納する網カゴ５（第２の有底容器）およびその網蓋６と、前記網カゴ５を収納し，かつ回転可能な回転容器１（第１の有底容器）およびその蓋体２と、前記回転容器１を周囲より２３０〜２９０℃または２５０〜４５０℃に加熱する高周波加熱コイル７および高周波加熱用電源を含む高周波加熱手段（図示せず。）と、前記回転容器１を回転させる容器回転手段（駆動モータ１５）とからなる。
【００２３】
前記蓋体２には流体を供給、排出する配管３が一体的に付属している。また、処理装置１００は不活性ガスたとえば窒素ガス等の供給手段と、有底容器内の空気または乾留過程で回路基板３０から出てくる水分、炭酸ガス、ハロゲン物質ガス等を排出するガス排出手段も備えている。
前記ガス排出手段は有底容器１内のガス圧が高まった場合に自動的に開放される圧力弁１０と、有底容器１内のガスを強制排気し減圧する真空ポンプ１３との２つの手段を備えてなる。
【００２４】
網カゴ５はドラム状をなし回路基板から分離、滴下した半田４０等は回転容器１内に溜まる。前記網カゴ５のメッシュ開口は１ｍｍ角以下とした。網カゴ５は網（メッシュ）で形成することに代え、マトリクス状に貫通孔をプレス打ち抜き加工したパンチングメタルで形成してもよい。その場合も、前記貫通孔の寸法を直径１ｍｍ以下とした。
【００２５】
さらに、処理装置１００は加熱過程で回路基板から生じる水分、油等の液体回収装置１１と、前記排出ガスを中和処理するガス処理装置１２を備えてなる。
ガス処理装置１２はアルカリ性溶液を用いて回収したハロゲン物質ガスを中和処理する。
網カゴ５と回転容器１との間に所定の環状空間を形成するごとく、網カゴ５は複数の支承突起１７で位置決めされている。前記環状空間に溶融・分離したはんだや電子部品等が溜まる。
【００２６】
なお当然のことながら、回転容器１と蓋体２との気密はシールリング等により保たれている。（図示せず。）
次に、本発明の処理装置を用いて回路基板から実装した電子部品とはんだを分離し、かつ回路基板を乾留する回路基板の処理方法について説明する。
【００２７】
（処理方法１）
本発明における第１の処理方法は、網カゴ５内に回路基板と，分離剤たとえば胡麻と，半田こすり部材たとえば鉄砂（外形１ｍｍ程度）とを収納する工程と、閉蓋した網カゴ５を回転容器１内に収納する工程と、前記回転容器１を高周波加熱手段により２３０℃〜２９０℃に加熱しながら低速回転させ、回路基板から電子部品とはんだとを分離し、その後、続けて回路基板を回転、２５０℃〜４５０℃に加熱して回路基板等を乾留し、炭化させる工程と、加熱を停止し前記炭化物を回転容器から取り出す工程とからなる。
【００２８】
本発明における第１の処理方法は当初、有酸素状態である。即ち、回転容器１の蓋を開け回路基板等を収納した網カゴ５を配設し、再び回転容器１を閉蓋した状態では回転容器１の内部空間に空気が存在している。この状態から容器の回転と加熱処理を実施する。
処理過程では開閉弁８、９は閉じられており、空気や窒素ガスの供給は行われない。
回路基板の加熱により水分、炭酸ガス、ハロゲン物質ガスなどを生じ回転容器１の内部圧力が高まると、それらは圧力弁１０を介して容器外へ放出され液体回収装置１１、ガス回収装置１２に通じ所定に中和処理などが施される。なお、真空ポンプは停止したままである。
【００２９】
不活性ガスたとえば窒素ガス雰囲気中で処理を行う場合、開閉弁８を介して窒素ガスが常時供給されている。また、開閉弁９も常時開に設定され液体回収装置１１、ガス回収装置１２に通じている。真空ポンプは停止している。
有酸素状態で処理を実施する場合は当然のことながら、空気を開閉弁８を介して常時供給するようにすればよい。
【００３０】
上記実施例において、半田こすり部材の添加量は回転容器１の内部容積の１／３〜１／１０程度とした。分離剤の添加量は半田こすり部材体積の１／２０〜１／５０程度とした。
回転容器１の回転数は数ｒｐｍ〜数十ｒｐｍとした。回転容器１を低速回転させることにより網カゴ５内の回路基板は網カゴ５内に配設した複数のフィン１８（図１の実施例では４箇所）によって持ち上げられ頂部近傍で下方に自重落下する。回路基板の落下衝撃により実装した電子部品と溶融半田は回路基板から外れる。また、半田こすり部材によって半田付け部等、回路基板の表面全域がこすられ、はんだ回収率を高める。勿論、半田こすり部材によって回路基板の加熱効率も向上しはんだ溶融時間と乾留時間が短縮される。
【００３１】
なお、処理対象物は電子部品を半田付け実装したフェノール樹脂基板、ガラスエポキシ基板、ＨＩＣ基板等の回路基板に限るものでない。一般的な樹脂部材など任意としてよいことは言うまでもない。また、予め回路基板から電子部品や半田を取り除いておいてよいことも同様である。
また、回路基板の加熱温度についても任意で、はんだ回収だけが目的の場合は２３０℃〜２９０℃程度のままとしてよい。勿論、乾留温度の２５０℃〜４５０℃に設定したままであってもよい。
【００３２】
さらに、回転容器１の回転数についても任意である。例えば、まず数ｒｐｍ〜数十ｒｐｍの低速回転ではんだと電子部品とを分離した後、数百回転以上に回転数を上げ、回路基板、半田等が自重落下しない遠心分離状態で回路基板を乾留するようにしてもよい。
遠心分離により回路基板から分離した比重の大きい半田や金属等は網カゴ外に強制分離される。分離剤や半田こすり部材はメッシュ孔や貫通孔により篩い分けされる。
【００３３】
なお、上記回路基板の処理を不活性ガス雰囲気中で実施してよいことは言うまでもない。また、外形数ｃｍ以上の玉石や鋼球を回路基板に混入し自重落下させることにより、玉石または鋼球を回路基板に衝突させ、その際の衝撃力により半田または電子部品の離脱を促進するようにしてもよい。
【００３４】
本発明における第１の処理方法は回路基板からはんだや実装した電子部品を容易に分離でき、はんだ回収率が高い。また、回路基板を構成する樹脂部材の炭化を簡単なカートリッジ型の装置で実施でき、樹脂等の炭化物と金属、ガラス繊維との分離を容易に行える。
【００３５】
（処理方法２）
本発明における第２の処理方法は、網カゴ５内に回路基板と，分離剤たとえば胡麻と，半田こすり部材たとえば鉄砂（外形１ｍｍ程度）とを収納する工程と、閉蓋した網カゴ５を回転容器１内に収納する工程と、前記回転容器１を閉蓋し回転容器１内の空気を排出し減圧する工程と、前記回転容器１を高周波加熱手段により２３０℃〜２９０℃に加熱しながら低速回転させ、回路基板から電子部品とはんだとを分離し、その後、続けて回路基板を回転、２５０℃〜４５０℃に加熱して回路基板等を乾留し、炭化させる工程と、加熱を停止し前記炭化物を回転容器から取り出す工程とからなる。
【００３６】
本発明例における第２の処理方法は回転容器内を減圧状態にしておいて実施するが、回路基板等から生じる水分、ガス等は液体回収装置１１およびガス回収装置１２に導かれる構成とした。即ち、開閉弁８は閉状態、開閉弁９は開状態にある。また、真空ポンプは一定の減圧状態に達したのち停止させている。加熱時にも停止させている。
減圧することにより金属部材の酸化を低減し、回路基板からハロゲン物質ガス等が放出しやすくなる。なお、処理中も真空ポンプで排気、減圧するようにしてもよい。
【００３７】
【発明の効果】
以上のように本発明によれば、装置構成が小型簡単で、不活性ガスの消費量が少なくリサイクル費用の低減を図れる。また、プリント配線基板の種類に応じたロットの切換が簡単で、少量の回路基板から半田分離や炭化処理を可能にする。さらに、半田の分離、回収率等も向上し地球環境保護に役立つ。さらに、各種電子部品を搭載したプリント配線基板等を炭化させ、搭載した部品と基板樹脂と銅箔とガラス繊維などを分別回収しやすくする。
【図面の簡単な説明】
【図１】本発明の一実施例における処理装置の概念の模式図
【図２】図１を切断線Ｓ−Ｓで切断した断面図
【符号の説明】
１回転容器（第１の有底容器）
２蓋体
３配管
５網カゴ（第２の有底容器）
６網蓋
７高周波加熱コイル
８、９開閉弁
１０圧力弁
１１液体回収装置
１２ガス回収装置
１３真空ポンプ
１４支軸
１５駆動モータ
１６ロータリージョイント
１７支承突起
１８フィン
３０回路基板
４０落下物（半田等）
１００処理装置[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing method and a processing apparatus for a circuit board (printed wiring board or the like) to be discarded or recycled, and more specifically, a method for removing various electronic components soldered to the printed wiring board and collecting the solder, The present invention relates to a carbonization method and an apparatus thereof.
[0002]
[Prior art]
For the purpose of effective use of resources and global environmental conservation, waste television and the like are dismantled and separated and recycled (recycled) for each component material.
[0003]
As a processing method of a printed wiring board constituting various electronic devices, for example, in JP-A-8-143823, a printed wiring board is accommodated in a rotating drum, heated from the periphery of the drum, A method for separating and collecting electronic components and solder has been proposed.
[0004]
Further, as a method for separating and recovering a substrate resin, a copper foil, and a glass fiber by dry-distilling a printed wiring board, releasing a gas from the resin, and carbonizing the printed wiring board after removing various mounted electronic components, for example, Japanese Patent No. 314711 has been proposed.
[0005]
[Problems to be solved by the invention]
However, in the above-mentioned JP-A-8-143823, an electric heater is used as a heating means for the printed wiring board, and it takes time to heat the solder and remove the electronic components. Moreover, air was present between the electric heater and the printed wiring board, and heat transfer was poor.
[0006]
Further, in the above-mentioned Japanese Patent Application Laid-Open No. 10-314711, various electronic components and solder are removed from a printed wiring board and then subjected to low temperature dry distillation, which requires a step of removing the electronic components and solder.
A general carbonization apparatus is a rotary kiln type and is suitable for mass carbonization, but is not suitable for handling a small quantity of carbonization or different types of printed wiring boards.
Furthermore, when an inert gas such as nitrogen is used in combination, the consumption of the inert gas is large and the running cost is increased.
[0007]
It is an object of the present invention to heat a printed wiring board and a soldering portion in a short time and efficiently collect at least one of solder or electronic components.
Another object of the present invention is to make it easy to switch lots according to the type of printed wiring board, enable a small amount of carbonization, and reduce recycling costs.
It is another object of the present invention to carbonize a printed wiring board on which various electronic components are mounted, and to separately collect and recover the resin, copper foil, glass fiber, and the like constituting the mounted component and the circuit board.
[0008]
[Means for Solving the Problems]
How to process the circuit board in the present invention in order to solve the above problems,
1 . While rotating the container of dual structure housing the the circuitry board and the separating agent was heated to 230 ° C. to 290 ° C. by high-frequency heating means, among from the circuit board of the electronic component and the solder, circuit for separating at least one A substrate processing method was adopted.
2 . A circuit that separates at least one of an electronic component and solder from the circuit board by heating a storage container having a double structure containing a circuit board, a separating agent, and a solder rubbing member to 230 ° C. to 290 ° C. by high-frequency heating means. A substrate processing method was adopted.
3 . A circuit board processing method in which the circuit board and the like are dry-distilled by being heated to 250 ° C. to 450 ° C. by high-frequency heating means while rotating a container having a double structure containing a circuit board and a separating agent.
4 . A circuit board processing method for heating a circuit board, a separating agent, and a solder rubbing member to a temperature of 250 ° C. to 450 ° C. by high-frequency heating means to dry-distill the circuit board and the like.
5 . The separating agent was any one selected from potatoes, cereal grains or powder, legume powder, seed grains or powder, soy bean powder, peanut shell powder, or a combination thereof.
[0009]
In the above-mentioned configuration, the rice bran is rice bran, bran, wheat straw, barley mixed straw, bare wheat straw, bare wheat mixed straw, etc. Palm, rapeseed, cottonseed, etc., and any one selected from the above group, or a combination thereof.
[0010]
The separating agent secretes oil components by heating and adheres to carbides, glass fibers, copper foils, etc., and promotes mutual separation. It also helps the solder to separate from the soldering part. (Performs flux action.)
Furthermore, phosphorus (P) and the oil component contained in the separating agent serve to prevent the oxidation of metals such as solder. The oil component includes an organic acid R · (COOH) n component (that is, oleic acid, linoleic acid, palmitic acid, etc.).
Furthermore, when sodium Na is contained in the separating agent, Na also acts as a reducing agent.
[0011]
Seeds of relatively small grains such as sesame and persimmons may remain in a naturally harvested form. The size of the pulverized separating agent was about 1 mm.
It is not necessary to prepare the particle size distribution of each separating agent in the form of powder such as candy. The grain size distribution generated during the milling process of brown rice or the production process of wheat flour can be used as it is. (A range of about 1 mm to 0.01 μm)
By the way, if you write an example of rice bran ingredients in moss,
Phosphorus 2% or less, protein 13.4%, crude fat 17.1%, crude fiber 7.9%, crude ash 10.2%, calcium Ca 0.06% , Digestible ingredients (chicken, pigs, cattle, etc.), most of the remainder (other ingredients are omitted).
Rice bran is made of crushed material such as pericarp, seed coat, germ, etc., which can be obtained by whitening brown rice.
[0012]
Of the beans, the component of soybeans is
In 100g edible portion, fat ... 17.5g, phosphorus ... 470mg, sodium Na ... 3mg, calcium Ca ... 190mg, iron ... 7mg, protein ... 34.3g (other ingredients omitted) Etc.
[0013]
Therefore, each separating agent other than rice bran contains an oil component and phosphorus, or an oil component, and performs the same function as rice bran.
Particularly effective are powders of beans rich in oil and fat components (soybeans, red beans, peanuts, coconuts, etc.) or powders of seeds (sesame seeds, sunflower, palm, rapeseed, etc.). Sesame fatty acids are rich in oleic acid and linoleic acid.
In addition, you may make it combine 2 or more types of members other than the separating agent in this invention being comprised by 1 type.
7). The solder rub member was one of rice husk, ceramic grains (alumina, zirconia, etc.), stainless steel grains, silica sand, steel sand, iron sand, earth and sand, or a combination thereof. The size of the sand and grains was about 1 mm.
The rubbing member improves heat transfer to the circuit board or the soldered part, and promotes melting of the solder and carbonization of the circuit board. Also, it plays a role of scraping in contact with the solder of the soldering portion. As a result, the solder recovery rate is improved.
The rice husk consumes oxygen in the closed container during the carbonization process and suppresses metal oxidation.
[0014]
According to the above configuration, the present invention improves the recovery rate of solder and the like and shortens the processing time. Moreover, separation of carbonized resin from metal and glass fiber is facilitated. Furthermore, it enables batch processing of circuit boards. Furthermore, the configuration of the processing apparatus is simple and the amount of inert gas used is reduced. Furthermore, circuit boards can be recycled in small lots and lot switching is facilitated. Also, the recycling cost can be reduced.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, there is provided a second bottomed container for storing a circuit board and its lid, and a first bottomed container for storing and rotating the second bottomed container and its lid. A circuit board processing apparatus comprising: a body, a heating means for heating the first bottomed container from the surroundings, and a container rotating means for rotating the first bottomed container. Recovery of electronic components and solder from the circuit board, or carbonization of the resin member constituting the circuit board or electronic component can be performed with a simple device. It also facilitates lot switching and batch processing of circuit boards to be recycled.
[0016]
According to a second aspect of the present invention, the circuit board and the separating agent housed therein are rotated so that the weight of the circuit board and the separating agent can be dropped by themselves, and the circuit board and the separating agent are heated from 220 ° C. to 290 ° C. from the surroundings. At least one of the electronic component and the solder is removed from the substrate, and the separating agent is moss, cereal grain or powder, legume powder, seed grain or powder, soy bean powder, peanut This is a circuit board processing method characterized in that it is selected from any one of the powders of shells, or a combination thereof, which promotes the separation of electronic components and solder and improves the recovery rate of solder. Let
[0017]
According to a third aspect of the present invention, the circuit board, the separating agent, and the solder rub member housed therein are rotated so that the weight of the circuit board, the separating agent, and the solder rubbing member can be dropped, and the circuit board, the separating agent, and the solder rubbing member are Heating to 290 ° C. to remove at least one of the electronic component and the solder from the circuit board, wherein the separating agent is potatoes, grains or powder of grains, beans powder, grains of seeds or A circuit board processing method characterized in that it is selected from among powder, soy bean powder, peanut shell powder, or a combination thereof, and promotes separation of electronic components and solder. And improve the recovery rate of solder.
[0018]
According to a fourth aspect of the present invention, the circuit board and the separating agent housed therein are rotated so that the weight of the circuit board and the separating agent can be dropped by themselves, and the circuit board and the separating agent are heated to 250 ° C. to 450 ° C. from the surroundings to thereby form the circuit. The substrate is carbonized, and the separating agent is selected from among moss, grains of grains or powder, beans powder, seed grains or powder, soy bean powder, peanut shell powder The circuit board processing method is characterized by any one or a combination thereof, which promotes the separation of electronic components and solder and improves the solder recovery rate. Moreover, separation of carbide from metal and glass fiber is facilitated.
[0019]
According to a fifth aspect of the present invention, the circuit board, the separating agent and the solder rub member housed therein are rotated so that the weight of the circuit board, the separating agent and the solder rub member can be dropped by itself, and the circuit board, the separating agent and the solder rub member are moved from 250 ° C. to the surroundings. The circuit board is heated to 450 ° C. and the circuit board is dry-distilled, and the separating agent is moss, grain or powder of grains, legume powder, seed grains or powder, soy bean powder, peanut It is a processing method for circuit boards characterized in that it is selected from one of the shell powders or a combination thereof, which promotes the separation of electronic components and solder and improves the recovery rate of solder. . In addition, the carbonization time and solder melting time of the circuit board are shortened. Furthermore, separation of carbide, metal, and glass fiber can be easily performed.
[0020]
【Example】
A circuit board processing apparatus and processing method according to an embodiment of the present invention will be described below with reference to the drawings.
[0021]
(Example)
FIG. 1 is a schematic view of a concept of an apparatus for recovering solder or the like from a circuit board or an apparatus for dry distillation of a circuit board in an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the main part of FIG. 1 cut along a cutting line SS. The figure is shown.
In FIG. 1, reference numeral 1 is a drum-shaped rotating container (first bottomed container), reference numeral 2 is a lid for closing the opening of the rotating container 1, and 3 is integrally attached to the lid. A pipe for supplying an active gas such as nitrogen gas (N ↓ 2 gas) or exhausting air in the rotating container or a halogen substance gas from the circuit board, 5 is a network for storing circuit boards on which various electronic components are mounted. It is a basket (second bottomed container). The circuit board accommodated in the net basket 5 may have any size such as the size of the circuit board on which various electronic components are mounted as it is, or one that is crushed into a size of several centimeters (shredded).
6 is a mesh lid that closes the opening of the mesh cage 5, 7 is a high-frequency heating coil that heats the circuit board to 230 to 290 ° C. or 250 to 450 ° C., and 8 and 9 are on-off valves that control the flow of fluid. Is a pressure valve that allows a fluid under pressure to pass in only one direction, 11 is a liquid recovery device that recovers liquid contained in the gas or liquid that exits from the circuit board, and 12 is a halogen substance gas that has exited from the circuit board, A gas recovery device for neutralization, 13 is a vacuum pump for discharging the air in the bottomed container and depressurizing it, 14 is a support shaft for attaching and rotating integrally with the rotating container 1, and 15 is a drive for rotating the rotating container 1. A motor, 16 is a rotary joint, 30 is a circuit board (an object to be processed such as a printed wiring board), 40 is an electronic component, a fallen object such as solder, and 100 is a processing apparatus of the present invention.
[0022]
A processing apparatus 100 according to an embodiment of the present invention includes a mesh basket 5 (second bottomed container) that accommodates a circuit board 30 and a mesh lid 6 thereof, and a rotatable container that accommodates the mesh basket 5 and is rotatable. 1 (first bottomed container) and its lid 2, high-frequency heating means including a high-frequency heating coil 7 and a high-frequency heating power source for heating the rotary container 1 to 230 to 290 ° C. or 250 to 450 ° C. from the surroundings ( And a container rotating means (drive motor 15) for rotating the rotating container 1.
[0023]
A pipe 3 for supplying and discharging a fluid is integrally attached to the lid 2. In addition, the processing apparatus 100 includes a supply means for inert gas such as nitrogen gas, and a gas discharge means for discharging moisture, carbon dioxide gas, halogen substance gas, and the like coming out of the circuit board 30 in the air or dry distillation process in the bottomed container. It also has.
The gas discharge means includes two means: a pressure valve 10 that is automatically opened when the gas pressure in the bottomed container 1 increases, and a vacuum pump 13 that forcibly exhausts and decompresses the gas in the bottomed container 1. It is equipped with.
[0024]
The net cage 5 is in the form of a drum, separated from the circuit board, and the dropped solder 40 and the like is accumulated in the rotating container 1. The mesh opening of the net cage 5 was 1 mm square or less. The net cage 5 may be formed of a punching metal obtained by press punching through holes in a matrix instead of being formed of a net (mesh). Also in that case, the dimension of the through hole was set to 1 mm or less in diameter.
[0025]
Further, the processing apparatus 100 includes a liquid recovery apparatus 11 such as water and oil generated from the circuit board during the heating process, and a gas processing apparatus 12 that neutralizes the exhaust gas.
The gas treatment device 12 neutralizes the collected halogen substance gas using an alkaline solution.
The net cage 5 is positioned by the plurality of support protrusions 17 so as to form a predetermined annular space between the mesh cage 5 and the rotary container 1. Solder, electronic components, etc. that are melted and separated are accumulated in the annular space.
[0026]
As a matter of course, the airtightness between the rotary container 1 and the lid 2 is maintained by a seal ring or the like. (Not shown)
Next, a method for processing a circuit board, in which the electronic component mounted on the circuit board and the solder are separated using the processing apparatus of the present invention and the circuit board is dry-distilled, will be described.
[0027]
(Processing method 1)
In the first processing method of the present invention, a circuit board, a separating agent such as sesame, and a solder rub member such as iron sand (about 1 mm in outer diameter) are accommodated in the mesh basket 5; The step of storing in the rotating container 1 and the rotating container 1 are rotated at a low speed while being heated to 230 ° C. to 290 ° C. by high-frequency heating means to separate the electronic component and the solder from the circuit board, and then the circuit board. And heating to 250 ° C. to 450 ° C. to carbonize and carbonize the circuit board and the like, and a step of stopping heating and taking out the carbide from the rotating container.
[0028]
The first treatment method in the present invention is initially in an aerobic state. That is, air is present in the inner space of the rotating container 1 when the lid of the rotating container 1 is opened and the mesh basket 5 containing the circuit board is disposed and the rotating container 1 is closed again. From this state, the container is rotated and heated.
In the process, the on-off valves 8 and 9 are closed, and no air or nitrogen gas is supplied.
When the circuit board is heated to generate moisture, carbon dioxide gas, halogen substance gas, etc., and the internal pressure of the rotating container 1 is increased, they are discharged to the outside of the container through the pressure valve 10 and are communicated to the liquid recovery apparatus 11 and the gas recovery apparatus 12. A neutralization process etc. are given predetermined. The vacuum pump remains stopped.
[0029]
When processing is performed in an inert gas, for example, nitrogen gas atmosphere, nitrogen gas is constantly supplied via the on-off valve 8. The on-off valve 9 is also set to be normally open and communicates with the liquid recovery device 11 and the gas recovery device 12. The vacuum pump is stopped.
In the case where the treatment is performed in an aerobic state, it is a matter of course that air may be constantly supplied via the on-off valve 8.
[0030]
In the above embodiment, the amount of the solder rub member added was about 1/3 to 1/10 of the internal volume of the rotating container 1. The addition amount of the separating agent was set to about 1/20 to 1/50 of the solder rubbing member volume.
The rotation speed of the rotating container 1 was several rpm to several tens rpm. By rotating the rotating container 1 at a low speed, the circuit board in the mesh basket 5 is lifted by a plurality of fins 18 (four places in the embodiment of FIG. 1) disposed in the mesh basket 5 and falls by its own weight near the top. . The electronic component and the molten solder mounted by the drop impact of the circuit board are detached from the circuit board. In addition, the entire surface of the circuit board, such as a soldering portion, is rubbed by the solder rub member to increase the solder recovery rate. Of course, the solder rubbing member improves the heating efficiency of the circuit board and shortens the solder melting time and the dry distillation time.
[0031]
The processing object is not limited to a circuit board such as a phenol resin board, a glass epoxy board, or an HIC board on which electronic components are soldered and mounted. Needless to say, a general resin member may be arbitrarily used. Similarly, electronic components and solder may be removed from the circuit board in advance.
Further, the heating temperature of the circuit board is also arbitrary, and may be kept at about 230 ° C. to 290 ° C. when only the solder recovery is intended. Of course, the carbonization temperature may be set to 250 ° C. to 450 ° C.
[0032]
Furthermore, the rotational speed of the rotating container 1 is also arbitrary. For example, after separating solder and electronic components at a low speed of several rpm to several tens of rpm, the number of revolutions is increased to several hundred or more, and the circuit board is dry-distilled in a centrifugal state where the circuit board, solder, etc. do not fall by its own weight. You may make it do.
Solder, metal, etc. having a high specific gravity separated from the circuit board by centrifugation are forcibly separated out of the mesh basket. The separating agent and the solder rubbing member are sieved by mesh holes or through holes.
[0033]
Needless to say, the processing of the circuit board may be performed in an inert gas atmosphere. In addition, cobblestones and steel balls with an outer diameter of several centimeters or more are mixed in the circuit board and dropped by their own weight, so that the cobblestones or steel balls collide with the circuit board, and the impact force at that time promotes the detachment of solder or electronic components. It may be.
[0034]
The first treatment method of the present invention can easily separate solder and mounted electronic components from the circuit board, and has a high solder recovery rate. Further, the carbonization of the resin member constituting the circuit board can be carried out with a simple cartridge type device, and the carbide such as resin can be easily separated from the metal and the glass fiber.
[0035]
(Processing method 2)
In the second processing method of the present invention, a circuit board, a separating agent such as sesame, and a solder rub member such as iron sand (about 1 mm in outer diameter) are accommodated in the mesh basket 5; The process of storing in the rotating container 1, the process of closing the rotating container 1, discharging the air in the rotating container 1 and reducing the pressure, and heating the rotating container 1 to 230 ° C. to 290 ° C. by high frequency heating means Rotate at low speed to separate the electronic components and solder from the circuit board, then rotate the circuit board and heat to 250 ° C to 450 ° C to dry-distill the circuit board and carbonize, and stop heating A step of removing the carbide from the rotating container.
[0036]
The second processing method in the present invention example is carried out with the inside of the rotary container being in a reduced pressure state, but the structure is such that moisture, gas, etc. generated from the circuit board or the like are guided to the liquid recovery device 11 and the gas recovery device 12. That is, the on-off valve 8 is in a closed state and the on-off valve 9 is in an open state. The vacuum pump is stopped after reaching a certain pressure reduction state. It is also stopped during heating.
By reducing the pressure, the oxidation of the metal member is reduced, and the halogen substance gas or the like is easily released from the circuit board. In addition, you may make it exhaust and pressure-reduction with a vacuum pump also during a process.
[0037]
【The invention's effect】
As described above, according to the present invention, the apparatus configuration is small and simple, the consumption of inert gas is small, and the recycling cost can be reduced. In addition, lot switching according to the type of printed wiring board is easy, and solder separation and carbonization can be performed from a small amount of circuit board. In addition, solder separation and recovery rates are improved, which helps protect the global environment. Furthermore, the printed wiring board etc. which mounted various electronic components are carbonized, and it is easy to carry out separate collection | recovery of the mounted components, board | substrate resin, copper foil, glass fiber, etc.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of a concept of a processing apparatus in an embodiment of the present invention. FIG. 2 is a cross-sectional view of FIG. 1 taken along a cutting line SS.
1 Rotating container (first bottomed container)
2 Lid 3 Piping 5 Net basket (second bottomed container)
6 Net cover 7 High-frequency heating coils 8 and 9 On-off valve 10 Pressure valve 11 Liquid recovery device 12 Gas recovery device 13 Vacuum pump 14 Support shaft 15 Drive motor 16 Rotary joint 17 Support projection 18 Fin 30 Circuit board 40 Falling object (solder etc.)
100 processing equipment

Claims

Rotate the container so that the circuit board and the separating agent housed inside can fall by its own weight, and heat the circuit board and the separating agent from the surroundings to remove at least one of the electronic components and solder from the circuit board. And the separating agent is any one selected from the group consisting of moss, cereal grains or powder, legume powder, seed grains or powder, soy bean powder, peanut shell powder, or A method for processing a circuit board, characterized by combining the same.

Rotate the container so that the circuit board, separating agent and solder rubbing member housed inside can be dropped by its own weight, and heat the circuit board, separating agent and solder rubbing member from the surroundings to remove electronic components and solder from the circuit board. At least one of them is removed, and the separating agent is selected from the group consisting of moss, cereal grains or powder, legume powder, seed grains or powder, soybean sludge powder, and peanut shell powder. A method of processing a circuit board, characterized in that any one selected or a combination thereof is selected.

Rice bran, wheat bran, wheat straw, barley mixed straw, bare wheat straw, bare wheat mixed straw, or a combination thereof, beans are soybean, red beans, peanut, coconut, or a combination thereof , seed sesame, sunflower, palm, rapeseed, any one of cottonseed or processing method of the circuit board according to any one of claims 1-2, characterized in that it has a combination thereof.

Chaff solder rubbing member, ceramic particles, stainless steel particles, silica sand, steel grit, sand, any one of sand, or in any one of claims 2-3, characterized in that it has a combination thereof The processing method of the circuit board of description.

The circuit board processing method according to any one of claims 2 to 3 , wherein the inside of the container is in a reduced pressure atmosphere.

The processing method of a circuit board according to any one of claims 2 to 3 , wherein the inside of the container is an inert gas atmosphere.

A circuit board and a separating agent housed therein are rotated so that their weight can be dropped, and the circuit board and the separating agent are heated from the surroundings to dry-dry the circuit board. Is characterized by being selected from among moss, grains of grains or powder, beans powder, seed grains or powder, soybean powder, peanut shell powder, or a combination thereof Circuit board processing method.

The circuit board, separating agent and solder rub member housed inside are rotated so that the weight of the circuit board can be dropped by itself, and the circuit board, separating agent and solder rub member are heated from the surroundings to dry-dry the circuit board. The separating agent is any one selected from moss, grains of grains or powder, beans powder, grains of seed, powder of soybeans, powder of peanut shell, or A method of processing a circuit board, characterized in that it is a combination.

Processing method of the circuit board according to any one of claims 7-8, characterized in that for heating the circuit board to 250 ° C. to 450 ° C. carbide.

Processing method of the circuit board according to any one of claims 7-8 in which the vessel is characterized in that the reduced pressure atmosphere.

Processing method of the circuit board according to any one of claims 7-8, characterized in that the vessel an inert gas atmosphere.

A step of storing the circuit board, the separating agent, and the solder rubbing member in the mesh basket, a step of storing the closed mesh basket in the rotating container, and the rotating container at 230 ° C. to 290 ° C. by high-frequency heating means. Rotating at a low speed while heating, separating the electronic component and the solder from the circuit board, and subsequently rotating the circuit board, heating to 250 ° C. to 450 ° C. to dry-distill and carbonize the circuit board, etc. And the step of removing heating and removing the carbide from the rotating container, wherein the separating agent is moss, cereal grains or powder, legume powder, seed grains or powder, soy bean powder, peanut shell powder Any one of or a combination thereof selected from the above, and the solder rub member is any one of rice husk, ceramic grains, stainless steel grains, silica sand, steel sand, sand iron, earth and sand, or a combination thereof. Processing method for the circuit board, characterized in that the.

A step of storing a circuit board, a separating agent, and a solder rubbing member in the mesh basket, a step of storing the closed mesh basket in the rotating container, and the rotating container at 250 to 450 ° C. by high-frequency heating means. And rotating at a low speed while heating to separate the electronic component and the solder from the circuit board, followed by carbonizing and carbonizing the circuit board, and stopping the heating and removing the carbide from the rotating container. The separating agent is selected from among moss, cereal grains or powder, legume powder, seed grains or powder, soy bean powder, peanut shell powder, or a combination thereof, and solder A method for treating a circuit board, wherein the rubbing member is any one of rice husk, ceramic grains, stainless steel grains, silica sand, steel sand, iron sand, earth and sand, or a combination thereof.

Processing method of the circuit board according to any one of claims 1 2 to 1 3 the rotating container, characterized in that the reduced pressure atmosphere.

Processing method of the circuit board according to any one of claims 1 2 to 1 3, characterized in that the rotating container and an inert gas atmosphere.