JP3835242B2 - Electrophoresis chip and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrophoresis chip used when analyzing a very small amount of protein, nucleic acid or the like at high speed and with high resolution, and more specifically, for capillary electrophoresis using a channel formed on a substrate as a capillary. The present invention relates to a chip and its manufacturing method.
[0002]
[Prior art]
Conventionally, as a technique for manufacturing this type of electrophoresis chip, for example, as disclosed in Japanese Patent Application Laid-Open No. 2000-310613, an injection hole for injecting a sample and a discharge hole for discharging or accumulating the sample are provided. While forming a plate-like member having a separation channel for connecting the injection hole and the discharge hole on one side by injection molding, injection molding, press molding or the like using a mold, A film using a transparent or translucent thermoplastic resin material in consideration of detecting the sealing member having the electrode corresponding to the injection hole and the discharge hole and the wiring connected to each electrode by UV absorption, fluorescence, etc. And forming the electrophoresis chip by joining the plate member and the seal member on the one surface where the separation flow path in the plate member exists. After superimposing the serial seal member, as a preferred bonding method, by thermal fusion at the sealing member somewhat while pressurizing low heat, it is joined to the plate-like member is disclosed. By joining in this way, the separation channel is sealed by a sealing member to form a capillary part, and at least one of the injection hole and the discharge hole is sealed to form a liquid reservoir part.
[0003]
[Problems to be solved by the invention]
According to the technique for manufacturing the conventional electrophoresis chip, first, the plate-like member and the seal member are separately formed in advance, and when these are joined, with respect to the means for joining, Since the plate-like member and the seal member need to be re-arranged at predetermined positions and orientations or overlapped with each other, the manufacturing process and labor of the electrophoresis chip increase, and the plate-like member In addition, since the formation of the sealing member and the joining of the two are performed in different dimensions, it takes time to manufacture them, and it is pointed out that there is a problem that they are not suitable for mass production. Further, according to the electrophoresis chip manufactured by the technique, the surface of the seal member joined to the plate member is directly exposed to the outside, and the wiring is also exposed in the same manner. There is a risk of scratching the surface of the sealing member or the surface of the wiring, such as when the chip for electrophoresis is set in an electrophoresis apparatus, or dirt may be attached. If this occurs or if dirt adheres to it, it will hinder the analysis accuracy and detection accuracy of the subsequent sample.
[0004]
However, the present invention was made to solve the above-mentioned conventional problems, and the electrophoresis chip can be manufactured rationally and in a short time, and can be adapted for mass production. Moreover, the film having the electrodes and wiring is fixedly interposed between the substrate and the bonding plate, so that the film having the electrodes and the like can be reliably prevented from being damaged or soiled. It aims at providing the chip | tip for electrophoresis.
[0005]
[Means for Solving the Problems]
[0006]
[0007]
[0008]
[0009]
To achieve the object, claim 1 of the present invention. In the method for manufacturing an electrophoresis chip, a substrate having an injection hole for injecting a sample and an exhaust hole for discharging or accumulating the sample and having a separation channel for connecting the injection hole and the discharge hole on one side is formed. Thereafter, a film having electrodes corresponding to the injection hole and the discharge hole and wiring connected to each of the electrodes is disposed on the one surface of the substrate where the separation flow path is formed. A bonding plate to be bonded to the substrate is formed between the substrate and the substrate, and is simultaneously bonded to the substrate.
[0010]
Therefore, according to this method for manufacturing an electrophoresis chip, since the film is insert-molded, the joining plate is injection-molded and simultaneously joined to the substrate, and the film is so-called sandwiched between the substrate and the joining plate. Since it can be fixed in between, the heat welding step required as a separate step like the above-mentioned conventional one is not required, and the electrophoresis chip can be manufactured in a short time, and the productivity and quality can be improved. You can plan.
[0011]
Also, Claim 2 In the method for manufacturing an electrophoresis chip, the outer dimension of the film is formed to be smaller than the outer dimension of the substrate and the joining plate, or a cutout portion penetrating from one surface side to the other surface side is formed in a part of the film. When forming and joining the said joining board to the said board | substrate, it joined in the part corresponding to the outer side of the peripheral part of the said film, or the part corresponding to the said notch part, It is characterized by the above-mentioned. Therefore, according to this method for manufacturing an electrophoresis chip, the film can be fixed in a sealed manner between the substrate and the bonding plate or closely fixed to the substrate and the bonding plate.
[0012]
Also, Claim 3 The method for manufacturing an electrophoresis chip has a pair of molds that can be clamped and opened by relative movement, and has a sample injection hole and a sample discharge hole for collecting or collecting the sample. A substrate forming die capable of forming a substrate having a separation channel for connecting the holes on one side, and a bonding plate molding capable of molding a bonding plate to be bonded to the one surface on which the separation channel is formed. A mold, the pair of molds are clamped, and the substrate molding mold molds the substrate so that the separation channel appears on the mold bonding surface side, and the molded substrate is used as one mold. The pair of molds are moved relative to each other while the substrate mold part is left, so that the bonding plate mold part of the other mold corresponds to the substrate mold part of the one mold, and one of them Mold that has been left in the mold part of the mold A film having an electrode corresponding to the injection hole and the discharge hole and a wiring connected to each electrode is disposed on the substrate, and a pair of molds are clamped in that state, and the bonding plate mold The bonding plate is formed and simultaneously bonded to the substrate.
[0013]
Therefore, according to this method for manufacturing an electrophoresis chip, following the step of forming the substrate using a single mold, the substrate is simultaneously formed with the film sandwiched therebetween. Thus, the electrophoresis chip can be continuously manufactured in the same mold in a short time, and the productivity and quality can be further improved.
[0014]
Also, Claim 4 The method for manufacturing an electrophoresis chip is characterized in that the substrate is formed by the substrate forming mold in parallel with the step of forming the bonding plate by the bonding plate forming mold and bonding the bonding plate to the substrate. Therefore, according to this method for manufacturing an electrophoresis chip, the steps of forming the first substrate and finally forming the bonding plate and bonding the substrate to the substrate in order to manufacture the electrophoresis chip. Since it can be carried out simultaneously in parallel, the productivity can be further rationalized.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an electrophoresis chip embodying the present invention and a mold used in the manufacturing method thereof will be described with reference to the drawings. First, the configuration of the electrophoresis chip targeted by the present invention will be described.
[0016]
1 to 4, a chip 1 for electrophoresis, which is shown as a back view in FIG. 1, includes a substrate 2, a bonding plate 3 bonded to one surface (lower surface) of the substrate 2, and a bonding between them. In this case, the film 4 is sandwiched and fixed between the two.
[0017]
A substrate 2 shown as a plan view in FIG. 2 is integrally formed into a rectangular shape by a thermoplastic resin material such as an acrylic resin and a styrene resin that are excellent in transparency and fluorescent properties such as polymethyl methacrylate and polystyrene. The The substrate 2 intersects with the separation channel 5 extended in the longitudinal direction at the approximate center of one surface (lower surface) thereof at a position close to one end side of the separation channel 5 at a substantially right angle. A sample introduction channel 6 having a portion communicating with the separation channel 5 is formed. At one end of the separation channel 5, an injection hole 5A for injecting a separation medium such as a separation buffer solution, a separation polymer gel, and a separation buffer solution is formed to penetrate from one surface to the other surface side. Similarly, a discharge hole 5B is formed through the other end of the flow path 5. In addition, an injection hole 6A for injecting a sample containing a charged substance such as an amino acid, a protein, or a nucleic acid is similarly formed at one end of the sample introduction channel 6, and the other end of the sample introduction channel 6 is formed. Similarly, a discharge hole 6B is formed therethrough. The thickness of the substrate 2 is set to about 1 mm to 2 mm, the width of the separation channel 5 and the sample introduction channel 6 is about 30 μm to 500 μm, and the depth is about 10 μm to 200 μm. Set to degree.
[0018]
The joining plate 3 shown in FIG. 3 is integrally formed into a rectangular shape using the same thermoplastic resin material as that of the substrate 2. The width of the joining plate 3 is formed to be approximately the same as that of the substrate 2, but the length is slightly shorter (shorter than several mm to 10 mm). Further, it is desirable that the thickness of the bonding plate 3 is set to be approximately equal to or less than the thickness of the substrate 1.
[0019]
The film 4 shown in FIG. 4 is formed into a rectangular shape integrally with a thermoplastic resin material such as an acrylic resin or a styrene resin that is excellent in terms of transparency and fluorescence characteristics, like the substrate 2 and the bonding plate 3. Molded. When the film 4 is finally made into an electrophoresis chip, its length is substantially equal to the length of the substrate 2 and its width is shorter than the substrate 2 and the bonding plate 3 ( About 5 mm to 15 mm shorter dimension). And the thickness of the film 4 is set to about 10 micrometers-about 80 micrometers.
[0020]
The film 4 corresponds to the center of each of the injection holes 5A and 6A and the discharge holes 5B and 6B of the substrate 2 in a chip state that is sandwiched and fixed between the substrate 2 and the bonding plate 3. A through hole (not shown) is provided. In these through holes, electrodes 7, 8, 9, and 10 that protrude from the lower surface side to the upper surface side are fixed. Each of the electrodes 7, 8, 9, 10 is connected to a wiring 11 that extends separately to one side of the longitudinal direction on the lower surface of the film 4. Further, electrodes 12, 13, 14, and 15 connected to the wirings 11 are provided on the lower surface of one side of the film 4. The electrodes 7, 8, 9, 10, 12, 13, 14, 15 and the wiring 11 are formed on the film 4 by a vapor deposition method such as vacuum vapor deposition, sputtering, ion plating, or a printing method. In each of the through holes, the electrodes 7, 8, 9, and 10 are watertightly fixed to the through holes so that the sample and the separation medium do not leak. Further, a large number of circular cutout holes 16 are provided in the peripheral edge of the film 4 so as to penetrate from the upper surface to the lower surface.
[0021]
As an example of manufacturing the electrophoresis chip 1, as shown in FIGS. 9A to 12A, a film connection in which two films 4 having the above-described shape and structure are connected. The body 40 was used. The film connecting body 40 is provided with circular positioning holes 40 </ b> A at three positions, one end in the longitudinal direction, the other end, and the center. By using this film connecting body 40, as will be apparent from the description of the manufacturing method of the electrophoresis chip 1 described later, two electrophoresis chips 1 having intermediate portions connected by the film connecting body 40 are manufactured simultaneously. After that, unnecessary portions of both end portions and the intermediate portion of the film connecting body 40 are cut off so that two separate electrophoresis chips 1 can be obtained. If the positioning holes 40A, electrodes, wirings, and the like can be supplied so as to correspond to the substrate 2 and the movable cavity described later in a predetermined positional relationship, the film is formed using a plurality of continuous rolls. You may make it supply to.
[0022]
Below, the metal mold | die used for the injection molding machine for manufacturing the said board | substrate 2, the joining board 3, and the chip | tip 1 for electrophoresis is demonstrated. In addition, the said film connection body 40 used as the base of the said film 4 is manufactured by a separate manufacturing means (not shown).
[0023]
FIGS. 5 and 6 show a mold that can be opened and closed used in an injection molding machine that can take two pieces by so-called two-color molding, and FIG. 5 shows the fixing as seen from the parting surface of the mold when the mold is opened. FIG. 6 is a front view showing the movable side mold plate and the movable side cavity block viewed in the same manner. First, the fixed side parting surface shown in FIG. 5 includes a rectangular fixed side mold plate 17 and a circular fixed side cavity block 18 fitted and fixed to the parting surface of the fixed side mold plate 17. The Two fixed-side substrate cavities 19 serving as substrate forming molds for forming the substrate 2 are formed on the right semicircular portion of the end surface of the fixed-side cavity block 18. Each fixed-side substrate cavity 19 is formed with a separation channel forming portion 20 and a sample introduction channel forming portion 21 that project in a cross shape to form the separation channel 5 and the sample introduction channel 6. . In addition, two fixed-side joining plate cavities 22 serving as joining plate forming molds for forming the joining plate 3 are formed in the left semicircular portion of the end face of the fixed-side cavity block 18. In the present embodiment, the parting surface of the fixed side template 17 is formed in a rectangular shape and the fixed side cavity block 18 is formed in a circular shape. However, the shape may be formed in any other shape. In addition, the fixed-side substrate cavity 19 and the fixed-side bonding plate cavity 22 may be formed by one each, or by an arbitrary number of three or more.
[0024]
Then, on the parting surface of each fixed-side cavity block, when the film connecting body 40 is insert-molded, the three addressing pins fitted to the three positioning pins provided on the movable-side cavity block described later are addressed. A positioning hole 23 is provided. In addition, four guide holes 24 are provided at the four corners of the parting surface of the fixed-side mold plate 17 so as to be fitted to guide pins provided on the movable-side mold plate, which will be described later. The fixed side template 17 and the movable side template are positioned.
[0025]
Although not shown in detail, a means for feeding and guiding the melt molding material is provided during molding. That is, a predetermined resin material in the form of granules or pellets is kneaded by a heating cylinder and a screw (not shown), heated and melted, and injected into the mold to form the substrate 2 and the joining plate 3. For the two fixed-side substrate cavities 19 and the two fixed-side joining plate cavities 22, as shown schematically in FIGS. 7 (b) to 12 (b), a runner 25 and a secondary spool, respectively. It is supplied through each set of 26 and the like. Each set including the runner 25 and the secondary spool 26 is connected to a heating cylinder. As a result, normally, the molten molding material is simultaneously injected into the fixed-side substrate cavities 19 and the fixed-side joining plate cavities 22 by screws. However, as will be apparent from the description of the molding operation described later, in this embodiment, the first injection system injects only the fixed-side substrate cavity 19 side at the first molding, and the other injection system at the last molding. The injection is controlled so as to be injected only to each fixed-side joining plate cavity 22 side.
[0026]
In the movable side shown in FIG. 6, the movable side parting surface shown in FIG. 6 is a rectangular movable side mold plate 27 and a circular movable side fitted and fixed to the parting surface of the movable side mold plate 27. And a cavity block 28. The movable side mold plate 27 can move together with the movable side cavity block 28 in the opening and closing direction of the mold, and 180 degrees each time one shot is formed around the center point of the outer circle of the movable side cavity block 28. It is configured to move. On the parting surface of the movable side cavity block 28, the two fixed sides when the fixed side cavity 18 is rotated 180 ° about the center point and the position facing the two fixed side substrate cavities 19. Four movable-side substrate cavities 29 are provided as substrate-forming dies for forming the substrate 2 in cooperation with the fixed-side substrate cavity 19 at a total of four locations facing the side bonding plate cavities 22. It is done. In each of the movable substrate cavities 29, four hole forming pins 30 for forming the injection holes 5A and 6A and the discharge holes 5B and 6B of the substrate 2 are formed to protrude.
[0027]
Further, three positioning holes 40A of the film connecting body 40 are fitted to the parting surface of the movable side cavity block 28, respectively, and positioning to three of the parting surfaces of the fixed side cavity block 18 is performed. Three positioning pins 31 that fit into the holes 23 are provided. Further, at the four corners of the parting surface of the movable side mold plate 27, there are four pieces that fit into the four guide holes 24 of the fixed side mold plate 17 when the parting surface is clamped and opened. Guide pins 32 project in parallel. In this embodiment, the parting surface of the movable side mold plate 27 is rectangular and the movable side cavity block 28 is circular. However, the shape may be formed in any other shape. In addition, an arbitrary number of the movable side substrate cavities 29 may be formed corresponding to the number and arrangement of the fixed side substrate cavities 19 and the fixed side bonding plate cavities 22.
[0028]
The present embodiment is configured as described above. Hereinafter, a method of forming the electrophoresis chip 1 using the above-described mold capable of forming two colors will be described with reference to FIGS. 7 (a, b) to 12 (a, b).
[0029]
Predetermined resin material in the form of granules or pellets is heated and melted by a heating cylinder (not shown), and the movable side mold plate 27 placed at a position separated from the fixed side mold plate 17 is moved by a driving device. It is driven to move closer to the fixed mold plate 17 side, and the four guide pins 32 are fitted into the four guide holes 24 of the fixed mold plate 17, and the movable cavity block 28 and the fixed side are fixed. The mold clamping state is such that the parting surface with the cavity block 18 is closed. In this state, the molten molding material is put into the two fixed-side substrate cavities 19 and the movable-side substrate cavities 29 clamped by one injection system via the runner 25, the secondary spool 26, and the like. Then, the substrate 2 is molded by injection filling with a screw.
[0030]
Thereafter, after cooling for an appropriate period of time, as shown in FIGS. 7A and 7B, the movable side mold plate 27 is driven by a driving device so that the parting surface between the fixed side mold plate 17 and the fixed side mold plate 17 is moved. Open the mold. Thereby, a pair of board | substrates 2 are shape | molded, and each board | substrate 2 is left in each movable side substrate cavity 29 as it is.
[0031]
Next, as shown in FIGS. 8A and 8B, the movable side mold plate 27 is rotated by 180 ° about the axis thereof by the driving device. As a result, the substrates 2 left in the pair of movable-side substrate cavities 29 are respectively arranged to face the fixed-side bonding plate cavities 22 of the fixed-side cavity block 18.
[0032]
Next, as shown in FIGS. 9 (a, b) and 10 (a, b), the film connecting body 40 is located at a position corresponding to each substrate 2 remaining in the pair of movable-side substrate cavities 29. Each of the positioning holes 40A is fitted into the three positioning pins 31 of the movable side template 27, and the film connecting body 40 is disposed on each of the substrates 2. In this case, the arrangement may be performed by an operator's operation, or as shown in FIG. 9A, the robot is used to convey the film connecting body 40 (details are not shown). The film connecting body 40 may be picked up from the stock position by the arm 33 and automatically moved to a predetermined position corresponding to each substrate 2.
[0033]
Next, in the state where the film connecting body 40 is disposed on each substrate 2 as described above, the movable side mold plate 27 is driven by the driving device, and the mold clamping is performed again. Then, each fixed-side bonding plate cavity 22 closed by the inside of each fixed-side substrate cavity 19 and the movable-side substrate cavity 29, and the surface of the film connecting body 40 and the peripheral surface of each molded substrate 2. The melt molding material is injected from each injection system by a screw and filled at the same time. As a result, the pair of substrates 2 and the pair of bonding plates 3 are simultaneously formed (see FIG. 11A). Thereafter, as shown in FIGS. 11A and 11B, the movable side mold plate 27 is driven by the driving device to perform mold opening.
[0034]
In this case, on the side where each joining plate 3 is formed, when the joining plate 3 is molded, one surface of the joining plate 3 is the surface of the film connecting body 40 and the periphery of each molded substrate 2. A portion corresponding to a large number of notches 16 provided in advance in the film connecting body 40 is also bonded to the surface of the substrate 2. In this way, the substrate 2, the bonding plate 3, and the film connecting body 40 are integrally coupled to manufacture the electrophoresis chip 1. At this time, the pair of substrates 2 molded at the same time is left in the movable substrate cavity 29 as it is for manufacturing the next electrophoresis chip 1.
[0035]
Thereafter, as shown in FIGS. 12A and 12B, mold release means (not shown) including mold release pins and the like provided on the movable side mold plate 27 corresponding to the respective movable side substrate cavities 29. As a result, the molded body in which the substrate 2, the bonding plate 3, and the film connecting body 40 are integrated is released from each movable-side substrate cavity 29 and taken out. In this case, as shown in the figure, the robot arm 33 may be automatically taken out. In this way, by repeating the above series of operations, two electrophoresis chips 1 can be manufactured simultaneously with the formation of the substrate 2.
[0036]
In the molded body thus manufactured, two unnecessary electrophoresis chips 1 are obtained by cutting off unnecessary portions of the film connecting body 40 by an appropriate cutting means.
[0037]
As obtained, the obtained electrophoresis chip 1 is set in an electrophoresis apparatus and used for analyzing a sample. That is, a separation medium such as a separation buffer solution, a separation polymer gel, and a separation buffer solution is injected from the injection hole 5A of the separation channel 5 and filled in the sample introduction channel 6; In this state, a sample containing a charged substance such as an amino acid, protein, or nucleic acid is injected from the injection hole 6A of the sample introduction channel 6. Then, a high voltage is applied to the electrodes 9 and 10 corresponding to both ends of the sample introduction flow path 6 to cause the sample to migrate toward the + electrode (10) and reach the intersection with the separation flow path 5 Then, a high voltage is applied to the electrodes 7 and 8 at both ends of the separation channel 5 to cause the sample to migrate in the separation channel 5 toward the + electrode (8). They are separated by the difference or the like, and these are detected by UV absorption, fluorescence or the like by the optical detection means.
[0038]
In the present embodiment, the width of the film 4 is made smaller than the width of the substrate 2 and the bonding plate 3. A large number of notch grooves that open in the width direction may be provided, and the substrate 2 and the bonding plate 3 may be bonded to each other through portions corresponding to the large number of notch grooves. In short, as long as the separation medium filled in the separation flow path 5 and the sample introduction flow path 6 and the sample are not leaked between the film 4 and the substrate 2, the structure corresponds to the joining portion. The shape and configuration of the film 4 can be arbitrarily set.
[0039]
【The invention's effect】
[0040]
[0041]
[0042]
As detailed above, claim 1 of the present invention. According to the method for manufacturing an electrophoresis chip, in particular, after the substrate is formed, the one surface on which the separation flow path of the substrate is formed is connected to the electrodes corresponding to the injection holes and the discharge holes and to the respective electrodes. A film having a wiring is disposed, and after that, a bonding plate to be bonded to the substrate is formed with the film interposed therebetween, and at the same time, the bonding plate is bonded to the substrate. By bonding the substrate to the substrate at the same time as forming the plate, the film can be fixed between the substrate and the bonding plate in a so-called sandwich shape, and the heat welding step required as a separate step like the conventional one is performed. This eliminates the need to manufacture the electrophoresis chip in a short time, thereby improving productivity and quality.
[0043]
Also, Claim 2 In the method for manufacturing an electrophoresis chip, the outer dimension of the film is formed to be smaller than the outer dimension of the substrate and the joining plate, or a cutout portion penetrating from one surface side to the other surface side is formed in a part of the film. When forming and joining the said joining board to the said board | substrate, it joined in the part corresponding to the outer side of the peripheral part of the said film, or the part corresponding to the said notch part, It is characterized by the above-mentioned. Therefore, according to this method for manufacturing an electrophoresis chip, the film can be fixed in a sealed manner between the substrate and the bonding plate or closely fixed to the substrate and the bonding plate.
[0044]
Also, Claim 3 According to the method for manufacturing an electrophoresis chip, a pair of molds that can be clamped and opened by relative movement has a hole for injecting a sample and a discharge hole for discharging or accumulating the sample, and the injection hole. A substrate molding die capable of molding a substrate having a separation channel connecting one surface to the discharge hole and a bonding plate capable of molding a bonding plate bonded to the one surface on which the separation channel is formed. A pair of molds, and mold the substrate so that the separation channel appears on the mold joint surface side by clamping the pair of molds. While the pair of molds are moved relative to each other while remaining in the substrate mold part of the mold, the bonding plate mold part of the other mold corresponds to the substrate mold part of the one mold, Molding left on the substrate mold part of one mold A film having electrodes corresponding to the injection holes and the discharge holes and wirings connected to the electrodes is disposed on the substrate, and a pair of molds are clamped in this state to form the joining plate mold Since the bonding plate is molded simultaneously with the substrate by using the single mold, the bonding plate is molded with the film sandwiched between the steps of molding the substrate. At the same time, the step of bonding to the substrate can be carried out, and the production of the electrophoresis chip can be carried out continuously in a short time in the same mold, and the productivity and quality can be further improved.
[0045]
Also, Claim 4 According to the method for manufacturing an electrophoresis chip, the substrate is molded by the substrate molding die in parallel with the step of molding the bonding plate by the bonding plate molding die and joining the bonding plate to the substrate. The step of forming the first substrate and the step of finally forming the bonding plate and bonding it to the substrate in order to finally produce an electrophoresis chip can be performed in parallel. Productivity can be further streamlined.
[Brief description of the drawings]
FIG. 1 is a back view of an electrophoresis chip according to an embodiment of the present invention.
FIG. 2 is a plan view of a substrate.
FIG. 3 is a plan view of a joining plate.
FIG. 4 is a rear view of the film.
FIG. 5 is a front view of a fixed side viewed from a fixed side parting surface of a mold for manufacturing an electrophoresis chip.
FIG. 6 is a front view of the movable side viewed from the movable side parting surface of the mold.
FIG. 7 is an explanatory diagram showing a manufacturing process of an electrophoresis chip.
FIG. 8 is an explanatory diagram showing a manufacturing process of an electrophoresis chip.
FIG. 9 is an explanatory view showing a manufacturing process of an electrophoresis chip.
FIG. 10 is an explanatory diagram showing a manufacturing process of an electrophoresis chip.
FIG. 11 is an explanatory diagram showing a manufacturing process of an electrophoresis chip.
FIG. 12 is an explanatory diagram showing a manufacturing process of an electrophoresis chip.
[Explanation of symbols]
1 Electrophoresis chip
2 Substrate
3 Bonding plate
4 films
5 Separation channel
5A injection hole
5B discharge hole
6 Sample introduction channel
6A injection hole
6B discharge hole
7 electrodes
8 electrodes
9 electrodes
10 electrodes
11 Wiring
16 Notch hole
18 Fixed cavity block
19 Fixed side substrate cavity
22 Fixed joint cavity
28 Movable cavity block
29 Movable substrate cavity
40 Film Concatenation

Claims (4)

After forming a substrate having an injection hole for injecting a sample and a discharge hole for discharging or accumulating the sample, and a separation channel connecting the injection hole and the discharge hole on one side,
On the one surface of the substrate where the separation channel is formed, a film having electrodes corresponding to the injection hole and the discharge hole and wiring connected to each electrode is disposed.
Thereafter, a bonding plate to be bonded to the substrate is formed with the film interposed therebetween and simultaneously bonded to the substrate. Forming the outer dimensions of the film smaller than the outer dimensions of the substrate and the joining plate, or providing a notch portion penetrating from the one surface side to the other surface side in a part of the film,
2. The electrophoresis according to claim 1 , wherein when the bonding plate is molded and bonded to the substrate, bonding is performed at a portion corresponding to the outer side of the peripheral edge of the film or a portion corresponding to the notch. Method for manufacturing chips. A pair of molds that can be clamped and opened by relative movement have an injection hole for injecting a sample and an exhaust hole for discharging or accumulating the sample, and a separation flow path that connects the injection hole and the discharge hole on one side. A substrate forming die capable of forming a substrate having a bonding plate forming die capable of forming a bonding plate bonded to the one surface on which the separation channel is formed with respect to the substrate;
Clamping the pair of molds and molding the substrate so that the separation channel appears on the mold bonding surface side by the substrate molding die,
With the molded substrate remaining in the substrate mold part of one mold, the pair of molds are moved relative to each other so that the bonding plate mold part of the other mold is molded into the substrate of the one mold. Corresponding to the mold part, on the molded substrate remaining in the mold part of one of the molds, there is an electrode corresponding to the injection hole and the discharge hole and wiring connected to each electrode. Place the film,
In this state, a pair of molds are clamped, and the bonding plate is molded by the bonding plate forming mold, and simultaneously bonded to the substrate. The electrophoresis substrate according to claim 3 , wherein the substrate is molded by the substrate molding die in parallel with the step of molding the bonding plate by the bonding plate molding die and joining the substrate to the substrate. Chip manufacturing method.

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