JP3842229B2 - Circuit module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a circuit module capable of reducing material waste and manufacturing processes, and more specifically, sealing for sealing an electronic component in a circuit module separated by a dicing apparatus while enabling mass production. The present invention relates to a shield structure for a circuit module in which an outer surface portion of a resin is covered with a shielding material such as a metal to protect an electronic component from electromagnetic fields, heat dissipation, and the like.
[0002]
[Prior art]
  Conventionally, a small circuit module in which a plurality of electronic components are mounted on a substrate has been rapidly spread. Such circuit modules include those sealed or molded with resin, such as ICs and hybrid modules, parts covered with metal caps, and those housed in metal caps (not shown). )
[0003]
  In the manufacture of the module type circuit module housed in the metal cap, after creating a substrate for each circuit module, mounting electronic components on this substrate, sealing or molding using resin A metal cap is attached.
[0004]
  As a mass production type, as shown in FIG. 29, there is a circuit module in which an electronic component is mounted on the upper surface of a collective substrate, this is covered with a sealing resin layer, and a metal layer is formed thereon (for example, , See Patent Document 1).
[0005]
  This mass production type circuit module will be described with reference to FIGS. 28 and 29. Reference numeral 10 denotes a circuit module, which includes a substrate 11 on which printed wiring is formed, and a plurality of electronic components 12 mounted on a component mounting surface of the substrate 11. A sealing resin layer (sealing resin portion) 13 formed on the upper surface of the substrate 11 so as to cover the electronic component 12, a metal layer 16 formed on the upper surface of the sealing resin layer 13, and a lower surface of the substrate 11 It comprises a plurality of mounted lead terminals 15.
[0006]
  The substrate 11 is made of, for example, a 1 mm thick ceramic substrate having a rectangular upper surface, and a component mounting land (not shown) is formed on the upper surface, and the lead terminal 15 is formed along two opposing sides on the lower surface. Three lands for connecting are formed. Here, six lands are formed, and the lead terminal 15 is connected to each. Here, the lead terminal 15 is soldered so as to protrude to the side surface side of the substrate 11 perpendicular to the side of the substrate 11. Three of the six lead terminals 15 are assigned for GND, one for power supply, one for signal input, and one for signal output.
[0007]
  The sealing resin layer 13 is made of, for example, a thermosetting resin or an ultraviolet curable resin having insulation, waterproofness, or heat resistance. The substrate 11 is not limited to a ceramic substrate, and a glass epoxy substrate, a paper epoxy substrate, a paper phenol substrate, or the like is used.
[0008]
  A collective substrate 21 (see FIG. 29) in which the substrates 11 of the plurality of circuit modules 10 are arranged in a matrix is formed. Here, 16 substrates 11 are arranged in a 4 × 4 matrix. The sealing resin layer 13 is formed on the upper surface side of the collective substrate 21, and the metal layer 16 is formed on the upper surface of the sealing resin layer 13. Next, the aggregate substrate 21 on which the metal layer 16 is formed is cut using a dicing apparatus or the like. At this time, the main body of the circuit module 10 is obtained by cutting in a matrix along the boundary line between the individual substrates 11. Thus, when it cut | disconnects using a dicing apparatus, a cut surface will become a very smooth surface and shaping, such as a deburring, can be performed simultaneously. Thereafter, the lead terminal 15 is connected to the main body of the circuit module 10 to complete the circuit module 10.
[0009]
  In this mass production type circuit module, since the metal layer 16 is formed on the upper surface of the sealing resin layer 13, an electromagnetic shielding effect can be provided, which is effective for EMC (Electro-Magnetic Compatibility) measures. It can be demonstrated.
[0010]
  Separately, a circuit component built-in module in which a circuit component electrically connected to the wiring pattern is disposed inside an electrically insulating substrate on which a wiring pattern and a ground pattern are formed, wherein the electrical insulation A circuit component in which a shield body is formed on at least one of the main surface and the inside of the conductive substrate, and the shield body is electrically connected to the ground pattern via a connection portion made of the same material as the shield body There is a built-in module (see, for example, Patent Document 2).
[0011]
  The circuit component built-in module 400 described in Patent Document 2 (see FIG. 5 of the same document) includes a thermosetting resin 401 that forms an electrically insulating substrate, and one main surface of the thermosetting resin 401 is provided on one main surface. A wiring pattern 402 and a ground pattern 403 are formed, and a conductive resin 404 as a shield body is formed on the other main surface. Inside this thermosetting resin 401, circuit components 406 connected to the patterns 402 and 403 are arranged. The conductive resin 404 is electrically connected to the ground pattern 403 through a through hole (through hole) 405 filled with the same material as the shield body.
[0012]
[Patent Document 1]
          Japanese Patent Laid-Open No. 2001-24312 (pages 7-9 and 8-9)
[Patent Document 2]
          Japanese Patent Laid-Open No. 2001-237586 (page 10-11, FIG. 5)
[0013]
[Problems to be solved by the invention]
  However, the above-mentioned module type using a metal cap for covering an electronic component can be shielded with an electromagnetic field and can protect the electronic component on the board because it is configured to wrap the electronic component with the metal cap. On the other hand, it has an excellent effect, but requires a step of attaching a metal cap to each substrate. The electromagnetic field shield of each module is formed by soldering a metal cap to the board and then dropping it to the ground through the circuit to provide the shielding effect. In order to prevent short-circuits due to contact with shield cases such as caps made of caps, a clearance of at least several hundred μm is required between the part and shield case, which limits and limits the miniaturization of the product. Costs and tacts are greatly increased by putting a shield case on each product. Furthermore, depending on the dimensional accuracy and mounting accuracy of the shield case, it is difficult to obtain the dimensional accuracy of each electronic component as a module, which has been an obstacle to reduction in manufacturing costs.
[0014]
  In addition, in the circuit component built-in module of Patent Document 2, since the shield body performs electrical connection with the ground pattern simultaneously with shielding of electromagnetic waves, the circuit component built-in module is stabilized and the number of processes is reduced. However, the conductive resin (metal layer) as the shield body is pressurized on the upper surface of the thermosetting resin that forms the electrically insulating substrate, and the through hole ( Through holes) must be filled, and such a resin filling step is required, which is problematic for mass production.
[0015]
  In order to overcome the above problems, the present inventor has earnestly tried to overcome the above-mentioned problems while maintaining the advantage of being formed as a very smooth surface that is the same as the cut surface by dicing, which is an advantage of such an aggregate substrate type. As a result of repeated efforts, we have focused on the function of the blade when dicing, and found that the problem can be solved by actively using this function.
[0016]
  The object of the present invention is the same as that of the individual module type on the premise that the configuration capable of supporting mass production is basically maintained in order to overcome the shield effect weakness in the conventional mass production type circuit module. It is an object of the present invention to provide an optimum shield structure for dealing with electromagnetic fields and the like of a mass production type circuit module capable of obtaining a certain degree of shielding effect.
[0017]
[Means for Solving the Problems]
  In order to achieve the above object, the present invention has taken the following measures.
[0018]
  According to a first aspect of the present invention, in a circuit module in which a plurality of components are arranged on a substrate, a metal post installed on the substrate, a resin layer covering the plurality of components, and an upper surface of the resin layer are formed.TheA shield layer, and is configured so that the shield layer and the ground can be connected via the metal post, the end face of the substrate, the end face of the metal post, the end face of the resin layer, and the shield layer. It is configured so that the end surface is on the same plane.TheA circuit module is proposed.
[0019]
  (Operation) With this configuration, since the shield layer and the ground can be connected via the metal post, it is possible to obtain a mass production type circuit module having a shield structure optimum for dealing with an electromagnetic field or the like. Further, since the plurality of components mounted on the substrate are covered with the resin layer, the shield layer is formed on the resin layer, so that a reliable and stable shield layer can be formed. In addition, the end face of the substrate, the end face of the metal post, the end face of the resin layer, and the end face of the shield layer can be cut so as to be located on the same plane by dicer cutting, so that a reliable shield structure of the circuit module At the same time, mass production of circuit modules can be achieved.
[0020]
  According to a second aspect of the present invention, there is provided the circuit module according to the first aspect, wherein the metal post is intermittently disposed around the plurality of parts.
[0021]
  (Operation) In addition to the operation of the circuit module according to the first aspect of the present invention, when the metal post is intermittently disposed around a plurality of parts, a side shield structure is formed on the cut surface by the dicer cut. Thus, it is possible to obtain a circuit module that has a reliable shielding property and can achieve mass production.
[0022]
  According to a third aspect of the present invention, in the circuit module in which a plurality of components are arranged on the substrate, a resin layer formed on the upper surface of the substrate so as to cover the plurality of components, and the periphery of the plurality of components on the substrate. And a shield layer formed on the upper surface of the metal post, and is configured so that the shield layer and the ground can be connected via the metal post. A circuit module is proposed in which the end face of the metal post and the end face of the shield layer are positioned on the same plane.
[0023]
  (Operation) With this configuration, since the shield layer and the ground can be connected via the metal post, it is possible to obtain a mass production type circuit module having a shield structure optimum for dealing with an electromagnetic field or the like. Furthermore, since the shield layer is formed on the metal post, a reliable and stable shield layer can be formed. In addition, the end face of the board, the end face of the metal post, and the end face of the shield layer can be cut so that they are located on the same plane by dicer cutting, so that mass production of circuit modules can be performed together with a reliable shield structure of the circuit modules. Can be achieved.
0024]
  Claim4Then, claim 1Any one of 3In this circuit module, a circuit module is proposed in which the shield layer is formed of a plate-like member.
0025]
  (Function) According to the configuration, the first aspectAny one of 3In addition to the operation of the circuit module, the shield layer forming the top plate of the circuit module is formed by the plate-like member, so that the surface can be made smooth. Thereby, the chucking at the time of conveying a component can be performed reliably and easily.
0026]
【Definition of terms】
  In the present invention, an electronic component refers to an electronic device such as a semiconductor element, a connector, a switch, a filter, a resonator, or a vibrator. In the present invention, the shield layer includes an electromagnetic shield layer for electrostatic shielding and magnetic shielding, a heat transfer layer, a metal layer, and the like provided to protect the electronic component from factors that affect the electronic component due to heat generation. The layer containing.
0027]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view showing a circuit module according to a first embodiment of the present invention, FIG. 2 is an external perspective view excluding its sealing resin layer and shield layer, and 10 is a circuit module having a predetermined thickness. A substrate 11 having a rectangular parallelepiped shape (for example, a thickness of 4 mm) on which printed wiring is formed, a plurality of electronic components 12 mounted on a component mounting surface (one main surface: upper surface) of the substrate 11, and an electronic component 12 is higher than the sealing resin layer (sealing resin portion) 13 formed on the upper surface of the substrate 11 so as to cover the electronic component and the electronic component type to be mounted, and has a head on the upper surface of the sealing resin layer 13. Terminal electrode (post lead) 14 disposed on the substrate 11 so as to be exposed, and a shield layer (electromagnetic field shield layer) 16 for shielding the influence from the electromagnetic field formed on the surface of the sealing resin layer 13. It consists of and. As long as the post lead 14 has a columnar shape, it may have any shape such as a cylinder, a tube column, a rectangular column, or a polygonal column, or may have a spherical shape. The substrate 11 is made of, for example, a 1 mm thick ceramic substrate whose upper surface is rectangular.
  The sealing resin layer 13 is made of, for example, a thermosetting resin or an ultraviolet curable resin having insulation, waterproofness, or heat resistance. Resins having chemical resistance, for example, resins having alkali resistance, acid resistance, and corrosion resistance, such as a resin that prevents chemical change due to leakage of electrolyte used in a battery, may be used. Further, for example, a resin containing a ferrite filler may be used. The substrate 11 is not limited to a ceramic substrate, and may be a glass epoxy substrate, a paper epoxy substrate, a paper phenol substrate, or the like.
0028]
  FIG. 3 is a cross-sectional view of the circuit module 10 shown in FIG. 1 taken along the line AA, showing a cross-sectional structure of the post lead 14 and the shield layer 16. The upper surface of the post lead 14 is exposed on the upper surface of the sealing resin layer 13 and is in contact with the back surface of the shield layer 16 to be conductively connected. Further, the side surfaces of the substrate 11, the sealing resin layer 13, and the shield layer 16 are formed flush with each other. Since the shield layer 16 is conductively connected to the substrate 11 via the post leads 14, the surface of the circuit module 10 is formed in a structure having a sufficient shielding effect against the outside. With this structure, the circuit module 10 having a structure suitable for mass production can be provided.
0029]
  FIG. 4 is an explanatory diagram of the manufacturing process of the circuit module 10 according to the first embodiment.
  First, an aggregate substrate 21 in which the substrates 11 of the plurality of circuit modules 10 are connected in a matrix is formed (aggregate substrate manufacturing process). Here, an aggregate substrate 21 in which 16 substrates 11 are arranged in a 4 × 4 matrix is formed.
0030]
  Next, the electronic component 12 is mounted on the upper surface of the collective substrate 21 (electronic component mounting step). Next, the post lead (terminal electrode) 14 is mounted (post lead mounting step).
0031]
  Thereafter, a backing process that is normally performed is not necessarily required. If necessary, a backing agent is coated on the upper surface of the collective substrate 21 so as to cover the electronic component 12, and at least the head (top surface) of the post lead 14. As long as the backing agent is not applied to the substrate, it may be appropriately performed.
0032]
  Next, the sealing resin layer 13 is formed on the upper surface side of the collective substrate 21 using a FAME (Film Assist Molding Equipment) method (sealing resin layer forming step). The formation of the sealing resin layer 13 by the FAME method is a resin molding method using a film. As shown in FIG. 5A, the collective substrate 21 is placed on a base 31 on which the collective substrate 21 can be fitted in a horizontal state. It is attached and defoamed by a vacuum of 5 torr (preparation step). Next, the above-described resin is supplied to the upper surface side of the collective substrate 21. In this state, a bubble-like space is often formed around the electronic component 12 on the collective substrate 21.
0033]
  Thereafter, the degree of vacuum is raised to, for example, about 150 torr to generate a differential pressure, and the resin is filled in the space around the electronic component 12 (resin filling step).
0034]
  Next, the upper surface side of the collective substrate 21 is covered with the film 30, the film 30 is sucked by suction from the suction holes 34 of the upper mold 33, and the above-described resin is supplied and cured (FAME process). After the resin is cured, the collective substrate 21 is removed from the base 31, and the sealing resin layer forming step is completed (sealing resin layer forming step). In addition, you may use the vacuum printing method (refer FIG. 5b) for formation of a sealing resin layer.
0035]
  Next, the shield layer 16 is formed on the upper surface of the sealing resin layer 13 (shield layer forming step). The material for forming the shield layer 16 may be any material having conductivity, and may be formed by pouring a conductive material such as a resin containing a metal filler into a mold in addition to a material such as a metal plate or a metal film. Alternatively, it can be formed using metallic plating.
  Here, the shield layer (metal layer) 16 was formed on the upper surface of the sealing resin layer 13 by applying and curing a resin in which a metal filler was dispersed.
0036]
  Next, the collective substrate 21 on which the sealing resin layer 13 and the shield layer 16 are formed is cut into a matrix along the boundary line of the substrate 11 using a dicing apparatus or the like (separation process). Thereby, the circuit module 10 is completed. When the collective substrate 21 is cut, the circuit module 10 in which the side surfaces of the individual substrates 11, the sealing resin layer 13, and the shield layer 16 are formed flush with each other is obtained.
0037]
  According to the manufacturing method of the first embodiment described above, the shield structure of the surface portion can be efficiently formed by a simple process, and the collective substrate 21 in which a plurality of substrates are arranged in a matrix is used. Therefore, the waste of the substrate material as in the conventional example can be greatly reduced.
0038]
  Furthermore, since the sealing resin layer 13 can be formed in the state of the collective substrate 21 and the collective substrate 21 can be separated and shaping such as deburring can be performed at the same time, using the conventional individual substrates without using the collective substrate. The number of processes is reduced compared to the case of manufacturing. In addition, when the sealing resin layer 13 is formed by using the FAME method resin molding technology known as a resin molding technology, the flash burr suppression on the substrate is unnecessary, the deburring process is unnecessary, the indentation defect reduction, the chip damage reduction, the resin There are advantages such as easy selection and no need for a release agent, which is effective for suppressing resin burrs in lead-exposed packages.
0039]
  As described above, when the sealing resin layer 13 is formed by the FAME method, the sealing resin layer 13 can be formed around the electronic component 12 without any gap, and the durability of the circuit module 10 can be improved.
0040]
  Further, since the sealing resin layer 13 is formed by the FAME method in the circuit module 10, the surface of the sealing resin layer 13 can be formed smoothly, so that the circuit module 10 can be easily adsorbed by an automatic mounting machine. Furthermore, high-density mounting is easily possible.
0041]
  Further, although the dicing apparatus is used for cutting the collective substrate, the present invention is not limited to this, and the collective substrate may be cut into each substrate with a laser, water, a wire, or the like. In this case, the substrate shape can be flexibly shaped in accordance with a round shape, a triangular shape, other polygonal shapes, or a case that houses the circuit module of the present invention.
0042]
  In this embodiment, the function of the circuit module 10 is not particularly limited, but the present invention can be applied to various circuit modules. For example, the present invention can be applied to circuit modules such as a high frequency power amplifier, an electronic volume, a DC / DC converter, an FET switch, a low power telemeter, a keyless transmitter, and an inverter.
0043]
  Next, a circuit module according to the second embodiment of the present invention will be described. FIG. 6 is an external perspective view showing a circuit module according to the second embodiment of the present invention, FIG. 7 is an external perspective view excluding its sealing resin layer and shield layer, and 10 is a circuit module having a predetermined thickness. A substrate 11 having a rectangular parallelepiped shape (for example, a thickness of 4 mm) on which printed wiring is formed, a plurality of electronic components 12 mounted on a component mounting surface (one main surface: upper surface) of the substrate 11, and an electronic component 12 is higher than the sealing resin layer (sealing resin portion) 13 formed on the upper surface of the substrate 11 so as to cover the electronic component and the electronic component type to be mounted, and has a head on the upper surface of the sealing resin layer 13. Terminal electrode (post lead) 14 disposed on the substrate 11 so as to be exposed, and a shield layer (electromagnetic field shield layer) 16 for shielding the influence from the electromagnetic field formed on the surface of the sealing resin layer 13. It consists of and. As long as the post lead 14 has a columnar shape, it may have any shape such as a cylinder, a tube column, a rectangular column, or a polygonal column, or may have a spherical shape.
0044]
  The substrate 11 is made of, for example, a 1 mm thick ceramic substrate whose upper surface is rectangular. The sealing resin layer 13 is made of, for example, a thermosetting resin or an ultraviolet curable resin having insulation, waterproofness, or heat resistance. Resins having chemical resistance, for example, resins having alkali resistance, acid resistance, and corrosion resistance, such as a resin that prevents chemical change due to leakage of electrolyte used in a battery, may be used. Further, for example, a resin containing a ferrite filler may be used. The substrate 11 is not limited to a ceramic substrate, and may be a glass epoxy substrate, a paper epoxy substrate, a paper phenol substrate, or the like.
0045]
  FIG. 8 is a cross-sectional view taken along the line B-B of the circuit module 10 shown in FIG. The upper surface of the post lead 14 is exposed on the upper surface of the sealing resin layer 13 and is in contact with the back surface of the shield layer 16 to be conductively connected. The shield layer 16 has a flat upper surface, and has a side surface extending vertically downward from a side edge around the flat surface, and the side surface is formed at a height exceeding the thickness of the flat surface portion, It is formed high enough to produce an electromagnetic shielding effect. Each side surface 16 ′ of the shield layer 16 is formed flush with the side surface of the substrate 11 and the sealing resin layer 13, and the lower end (edge) of the side surface 16 ′ is configured to reach the substrate 11. Yes. Since the lower end (edge) of the side surface 16 ′ of the shield layer 16 is formed so as to reach the substrate 11, the side surface of the circuit module is formed to be completely shielded from the outside. In this case, a circuit module for mass production having a shielding effect equivalent to that of an individual module type metal case can be provided.
0046]
  Next, the manufacturing method of the circuit module 10 described above will be described with reference to the process explanatory diagram shown in FIG. In the manufacturing process of the present embodiment, the assembly board manufacturing process, the electronic component mounting process, the post lead mounting process, and the sealing resin layer forming process shown in the drawing are the same as those in the first embodiment, and thus the description thereof is omitted. To do.
  After the sealing resin layer forming step, as shown in FIG. 10, the groove 20 is formed by cutting with a wide dicing blade 25 in a line shape in the vertical direction on the upper surface of the solidified sealing resin layer 13. Similarly, the lateral direction is cut to form grooves (groove cutting step, see FIGS. 10a and 10b). The depth to be cut here is the thickness of the sealing resin layer 13.
0047]
  Further, after cutting, a shield layer 16 is formed on the upper surface of the sealing resin layer 13 (see a shield layer forming step, see FIG. 10c). The material for forming the shield layer 16 may be any material having conductivity, and may be formed by pouring a conductive material such as a resin containing a metal filler into a mold in addition to a material such as a metal plate or a metal film. Alternatively, it can be formed using metallic plating. Here, the shield layer (metal layer) 16 was formed on the upper surface of the sealing resin layer 13 by applying and curing a resin in which a metal filler was dispersed.
0048]
  Next, the collective substrate 21 on which the shield layer 16 is formed is cut using a dicing apparatus or the like. At this time, a dicing blade 26 narrower than the dicing blade 25 used for cutting the sealing resin layer 13 is used. And the main body of the circuit module 10 is obtained by cut | disconnecting in matrix form along the said line of the boundary line between each board | substrate 11 (separation process, refer FIG. 10 d).
0049]
  When the dicing blade 26 is cut with the dicing blade narrower than the width of the groove 20 using the dicing device in this way, the shield layer 16 is exposed to the side surface after the cutting, and the sealing resin layer 13 is covered and covered. Can be formed. The cut side surface 16 ′ of the shield layer 16 can be formed flush with the side surface of the substrate 11 and the cut surface becomes a very smooth surface, so that shaping such as deburring can be performed at the same time.
  Furthermore, since the sealing resin layer 13 is waterproof, a wet cutting method can be used.
  In this way, the circuit module 10 is completed.
0050]
  According to the manufacturing method of the second embodiment described above, it is possible to efficiently form the side-surface shield structure by a simple process, and use the collective substrate 21 in which a plurality of substrates are arranged in a matrix. Therefore, the waste of the substrate material as in the conventional example can be greatly reduced.
0051]
  Furthermore, since the sealing resin layer 13 can be formed in the state of the collective substrate 21 and the collective substrate 21 can be separated and shaping such as deburring can be performed at the same time, using the conventional individual substrates without using the collective substrate. The number of processes is reduced compared to the case of manufacturing. In addition, when the sealing resin layer 13 is formed by using the FAME method resin molding technology known as a resin molding technology, the flash burr suppression on the substrate is unnecessary, the deburring process is unnecessary, the indentation defect reduction, the chip damage reduction, the resin There are advantages such as easy selection and no need for a release agent, which is effective for suppressing resin burrs in lead-exposed packages.
0052]
  As described above, when the sealing resin layer 13 is formed by the FAME method, the sealing resin layer 13 can be formed around the electronic component 12 without any gap, and the durability of the circuit module 10 can be improved.
0053]
  Further, since the sealing resin layer 13 is formed by the FAME method in the circuit module 10, the surface of the sealing resin layer 13 can be formed smoothly, so that the circuit module 10 can be easily adsorbed by an automatic mounting machine. Furthermore, high-density mounting is easily possible.
0054]
  Further, although the dicing apparatus is used for cutting the collective substrate, the present invention is not limited to this, and the collective substrate may be cut into each substrate with a laser, water, a wire, or the like. In this case, the substrate shape can be flexibly shaped in accordance with a round shape, a triangular shape, other polygonal shapes, or a case that houses the circuit module of the present invention.
0055]
  In this embodiment, the function of the circuit module 10 is not particularly limited, but the present invention can be applied to various circuit modules. For example, the present invention can be applied to circuit modules such as a high frequency power amplifier, an electronic volume, a DC / DC converter, an FET switch, a low power telemeter, a keyless transmitter, and an inverter.
0056]
  Next, a third embodiment of the present invention will be described.
  Since the structure of the circuit module 10 formed according to the third embodiment is the same as that according to the second embodiment of FIG. 6 described above, the description thereof is omitted. The difference in the manufacturing method between the third embodiment and the second embodiment is that the molding of the groove on the upper surface of the sealing resin layer 13 is performed by a mold instead of the formation by cutting. is there.
0057]
  In this embodiment, as shown in FIG. 11, the mold used for forming the sealing resin layer is a ridge arranged in a grid pattern on the molding surface of the upper mold 33 at a position corresponding to the boundary of each substrate. A mold in which 35 is formed in advance is used.
0058]
  Then, after setting the collective substrate 21 on which the electronic component 12 and the post lead (terminal electrode) 14 are mounted on the base 31, the above-described resin is supplied to the upper surface side of the collective substrate 21, and the first embodiment Similarly, the sealing resin layer 13 having the concave 20 grooves formed by the protrusions 35 is formed by the FAME method (sealing resin forming step, see FIGS. 11a, b, and c).
0059]
  Next, the sealing resin layer 13 is placed on the upper surface of the base of a mold (not shown) used for forming the shield layer with the concave groove facing upward, and the shield layer 16 is formed in the space above the conductive layer. A shielding material such as a conductive resin is supplied (shield layer forming step, see FIG. 11d). At that time, the shield material flows into the groove 20 and the shield layer 16 is formed integrally with the sealing resin layer 13. Thereafter, as in the first embodiment, the aggregate substrate 21 on which the shield layer 16 is formed is cut and separated using a dicing apparatus or the like (separation step, see FIG. 11e). At this time, as a dicing blade used for cutting such as dicing, a dicing blade 26 having a width smaller than the width of the groove 20 formed in the sealing resin layer 13 is used. Then, the main body of the circuit module 10 is obtained by cutting in a matrix along the boundary line between the individual substrates 11.
0060]
  Thus, the circuit module 10 cut by dicing or the like can be formed into a structure in which the side surface (edge) 16 ′ of the shield layer 16 is exposed by separation and cutting so as to enclose the sealing resin layer 13, and the substrate 11 can be formed flush with the side surface of the eleventh side, and the cut surface becomes very smooth, and shaping such as deburring can be performed at the same time. And since the said groove | channel etc. which become a shield surface can be formed with a metal mold | die, the manufacturing method suitable for mass production can be provided.
0061]
  Next, a fourth embodiment of the present invention will be described.
  FIG. 12 is an external perspective view showing a circuit module 60 according to the fourth embodiment. In the figure, the same components as those of the first embodiment described above are denoted by the same reference numerals and description thereof is omitted. Further, the difference between the fourth embodiment and the first embodiment is that the terminal electrode 14 is continuously arranged along the boundary of the substrate 11, and the terminal electrode 14 is disposed on the side surface portion of the sealing resin layer 13. It is configured to be exposed (see FIG. 13). Further, the shield layer 16 is formed only on a flat surface as in the first embodiment. Thus, a shield structure is formed on the side surface of the circuit module 60 so as to cover the sealing resin layer 13 with the end face 14 ′ of the terminal electrode 14 and the shield layer 16. By forming a shield surface with the shield layer 16 and the terminal electrode 14 in this way, it is possible to completely cover the electronic component and to have a strong electromagnetic shielding effect, and to take EMC (Electro-Magnetic Compatibility) measures. Can be effective.
0062]
  The circuit module 60 is manufactured as follows.
  As shown in FIGS. 14 and 15, a collective substrate 21 in which the substrates 11 of a plurality of circuit modules 60 are connected in a matrix is formed (aggregate substrate manufacturing process).
0063]
  Next, the electronic component 12 is mounted on the upper surface of the collective substrate 21 and the terminal electrode member 62 to be the terminal electrode 14 is mounted (electronic component mounting step). The terminal electrode member 62 is a columnar terminal electrode member that is formed taller than the electronic component 12 mounted on the substrate 11. Here, the terminal electrode member 62 has the same length as the thickness of the sealing resin layer 13. It has a cylindrical shape. The terminal electrode member 62 is mounted in a continuous arrangement so as to straddle the board boundary line between the boards.
0064]
  Next, the sealing resin layer 13 is formed on the upper surface side of the collective substrate 21 by the FAME method or the vacuum printing method (sealing resin layer forming step).
0065]
  Further, a metal layer (shield layer) 16 is formed on the upper surface of the sealing resin layer 13 (metal layer forming step). Here, the metal layer 16 was formed on the upper surface of the sealing resin layer 13 by applying and curing a resin in which a metal filler was dispersed.
0066]
  Next, the assembly module 21 on which the sealing resin layer 13 and the metal layer 16 are formed is cut into a matrix along the boundary line of the substrate 11 using a dicing apparatus or the like, thereby completing the circuit module 60. When the collective substrate 21 is cut, the terminal electrode member 62 is also cut, and the cut surface of the terminal electrode member 62 is exposed on the side surface of the circuit module 60. In addition, the insulating film is formed in the outer peripheral surface of each terminal electrode member 62 by backing, and the terminal electrode members are insulated.
0067]
  According to the above manufacturing method, the terminal electrode member 62 is cut into two in the step of separating the collective substrate 21 corresponding to the individual substrates 11, so that the cut surface 14 of the terminal electrode member 62 is connected to the cut surface of the sealing resin layer 13. ′ Is exposed, and the side surface of the circuit module 60 constituted by the terminal electrodes 14 functions as a shield structure.
0068]
  Therefore, the process of forming the end surface 14 ′ of the terminal electrode 14 in a plane including the side surface of the substrate 11 can be performed very easily. Thereby, the stability at the time of mounting with the side surface where end surface 14 'of terminal electrode 14 exposed facing the parent circuit board can be improved. Therefore, the side surface can effectively exhibit the function as a shield layer, and thus has an electromagnetic field shielding effect effective for electrostatic shielding and magnetic shielding against the mounted electronic component.
0069]
  The shield layer is not limited to a metal layer, and it is easy to form a layer having chemical resistance. For example, the protective layer may be formed by coding the periphery of the circuit module of the present invention with a member having alkali resistance, acid resistance or corrosion resistance. In this case, it is possible to prevent a decrease in reliability when the battery is disposed near the battery.
0070]
  The circuit module 60 having the above-described configuration can be mounted with its side face facing the parent circuit board, which enables a reduction in mounting area and high-density mounting. In addition, as described above, mounting on a parent circuit board using an automatic mounting machine can be easily performed.
0071]
  In the fourth embodiment, the terminal electrode 14 is closely arranged on the entire side surface of the substrate 11. However, the terminal electrode 14 may be arranged only on a part of the side surface of the substrate 11, and the shield. The direction can be appropriately selected depending on the direction in which the property is required.
0072]
  Next, a fifth embodiment of the present invention will be described.
  FIG. 16 is an external perspective view showing a circuit module 50 according to the fifth embodiment, and FIG. 17 is an external perspective view excluding the sealing resin layer and the shield layer. In the figure, the same components as those in the fourth embodiment described above are denoted by the same reference numerals, and the description thereof is omitted. Further, the difference between the fifth embodiment and the fourth embodiment is that the terminal electrode member 62 is disposed intermittently adjacent to the side surface of the fourth embodiment across the boundary of the substrate 11 intermittently. The terminal electrode member 52 arranged in the above is provided.
0073]
  That is, the substrate 11 ′ in which lands (not shown) for connecting terminal electrodes are formed on the upper surface (component mounting surface) of the substrate 11 in the fourth embodiment is used. One end of a cylindrically cut terminal electrode 51 is soldered to each land, and is arranged along the side of the substrate 11 ′. Furthermore, the other end surface of the terminal electrode 51 is exposed to the outside on the surface of the sealing resin layer 13.
0074]
  The circuit module 50 having the above-described configuration can be mounted with the side surface of the substrate 11 ′ or the upper surface of the shield layer 16 facing the parent circuit substrate, or by plug-in connection using a connector. In addition, as described above, mounting on a parent circuit board using an automatic mounting machine can be easily performed.
0075]
  Next, a method for manufacturing the circuit module 50 will be described with reference to a process explanatory diagram shown in FIG. Also in this embodiment, a collective substrate as shown in FIG. 19 is used. FIG. 19 shows the external appearance of the collective board 21 ′ mounted with components.
0076]
  First, a collective substrate 21 ′ in which the substrates 11 ′ of the plurality of circuit modules 50 are connected in a matrix is formed (collective substrate manufacturing process). Here, a collective substrate 21 ′ in which 16 substrates 11 ′ are arranged in a 4 × 4 matrix is formed.
0077]
  Next, the electronic component 12 is mounted on the upper surface of the collective substrate 21 ′, and the terminal electrode member 52 is mounted (electronic component mounting step). Here, the terminal electrode member 52 has a cylindrical shape. The terminal electrode member 52 is mounted by soldering so that an end surface thereof is in surface contact with a land (not shown).
0078]
  Thereafter, a backing agent is coated on the upper surface of the collective substrate 21 'so as to cover the electronic component 12 and the terminal electrode member 52 (excluding the head) (backing step).
0079]
  Next, the sealing resin layer 13 is formed on the upper surface side of the collective substrate 21 ′ using the FAME method or the vacuum printing method, and the head of the terminal electrode member 52 is exposed on the surface layer portion of the sealing resin layer 13 (sealing). Resin layer forming step).
0080]
  Further, a metal layer (shield layer) 16 is formed on the upper surface of the sealing resin layer 13 (metal layer forming step). Also here, the metal layer 16 was formed by applying and curing a resin in which a metal filler was dispersed on the upper surface of the sealing resin layer 13.
0081]
  Next, the circuit module 50 is completed by cutting the collective substrate 21 ′ together with the sealing resin layer 13 and the metal layer 16 into a matrix along the boundary line of the substrate 11 ′ using a dicing apparatus or the like.
0082]
  According to the above manufacturing method, when the collective substrate 21 ′ is cut, the terminal electrode member 52 is also cut into two, and the cut surface 14 ′ of the terminal electrode member 52 is exposed. The side surface of the circuit module 50 has a shield structure in which the side surface of the sealing resin layer 13 and the end surface 14 ′ of the terminal electrode 51 appear alternately.
0083]
  As a result, it is possible to extremely easily fix the terminal electrode 51 and process the end face.
0084]
  Further, since the terminal electrode end face 14 ′ is exposed on a surface perpendicular to the main surface of the substrate 11, the circuit module 50 is fixed to the parent circuit substrate and the terminal electrode 51 is conductively connected by soldering or the like. Can be increased. Furthermore, the terminal module 51 can be connected to the connector pin by inserting the circuit module 50 into a connector or the like.
0085]
  Next, a sixth embodiment of the present invention will be described.
  FIG. 20 is an external view showing a circuit module 70 in the sixth embodiment, and FIG. 21 is an external perspective view excluding the sealing resin portion and the shield layer (metal layer). In the figure, the same components as those of the fifth embodiment described above are denoted by the same reference numerals, and the description thereof is omitted. Further, the difference between the sixth embodiment and the second to fifth embodiments is that a shield structure is formed on the side surface of the circuit module 70 in which the terminal electrode and the heat conducting member are arranged in combination. As shown in FIG. 21, a heat generating electronic component or the like is mounted on the upper surface of the substrate 71, and a land (not shown) and the metal layer 16 are conductively connected by a terminal electrode 74 to conduct heat of the heat generating electronic component. Heat conduction to the metal layer 16 through the member 75 is enabled.
0086]
  In this sixth embodiment, metal is used as the heat conducting member 75 and the terminal electrode 74, but the present invention is not limited to this, and a member that is easy to manufacture and can efficiently exhibit the above effects is appropriately selected. It is preferable to use it. In addition, although the example which arrange | positioned the heat conductive member 75 and the terminal electrode 74 alternately was shown here, this arrangement | positioning form is selected suitably. Further, the outer peripheral surfaces of the heat conducting member 75 and the terminal electrode 74 are insulated from each other by a backing or the like.
0087]
  Thus, by encapsulating the sealing resin portion 13 in which the heat-generating electronic component is sealed with the metal layer 16, the terminal electrode 74, and the heat conducting member 75, the electromagnetic shielding effect can be further enhanced. -Magnetic Compatibility) Great effect on countermeasures. In addition, by conducting heat generated from the heat-generating electronic component to the metal layer 16, the heat dissipation effect can be enhanced according to the area of the metal layer 16. Furthermore, since the heat generated from the heat-generating electronic component can be transferred to the parent circuit board via the metal layer 16 and the terminal electrode 74, the heat dissipation effect can be further enhanced.
  The manufacturing process of the shield layer in the present example can be performed by the same process as the manufacturing process described in each of the above embodiments.
0088]
  (Modification) The following is a modification of the embodiment of the present invention.
0089]
  (Modification 1) In the second and third embodiments, as shown in FIG. 22 and FIG. 23, the aggregate substrate 81 in which grid-like protrusions 82 are formed on the upper surface of the aggregate substrate 81 along the boundaries of the individual substrates 11. The structure is as follows. After the required forming process, the substrate is separated into individual substrates by dicing. In the circuit module thus obtained, an edge 82 ′ rising upward from the side surface of the substrate is formed by cutting the protrusion 82, and a shield surface is formed by the edge 82 ′ and the edge 16 ′ of the shield layer 16. In this case, the post lead can be omitted in the structure in which the substrate 11 and both edges of the shield layer 16 are abutted.
0090]
  (Modification 2) In Modification 1 above, a communication hole for sealing resin is formed on the surface where the edge 82 ′ formed by cutting the protrusion 82 of the substrate 11 and the edge 16 ′ of the shield layer 16 are attached. In order to form the aggregate substrate 81, the aggregate substrate 81 is formed with a recess in the protrusion 82 in the process of forming the aggregate substrate 81. In this case, since the connection between the substrates is formed in the molding process of the resin layer, the bonding between the resin layers is strengthened, and the subsequent molding process becomes easy.
0091]
  (Modification 3) In the fourth and fifth embodiments, when the terminal electrodes are arranged along the boundaries of the individual substrates, the sealing resin portion may be formed only in a portion along the arrangement of the terminal electrodes. Even in this case, the circuit module can be mounted on the parent circuit board with the end face of the terminal electrode as the bottom face.
0092]
  (Modification 4) In the fourth embodiment, instead of disposing the columnar terminal electrodes (post leads) 14 along the boundaries of the individual substrates on the upper surface of the collective substrate, as shown in FIGS. Alternatively, the rod-shaped terminal electrode 24 may be used to be disposed horizontally along the side surface of the substrate 11 between the shield layer 16 and the substrate 11.
0093]
  (Modification 5) In Modification 5, as shown in FIG. 26, the arrangement of the post leads (terminal parts) 14 is slightly different from the above-described embodiment, and the post leads 14 are exposed on the end surface of the sealing resin layer 13. The shield layer 16 is configured to be in contact with the end surface of the shield layer 16 so as not to reach the ceiling surface of the shield layer 16. With this configuration, the ceiling surface of the shield layer 16 can be lowered to make the circuit module 10 a thinner structure, which can contribute to downsizing.
0094]
  (Modification 6) Modification 6 is the manufacturing method of Modification 5, and as shown in FIG. 27, when mounting the post leads (terminal parts) 14 on the collective substrate 21, they are arranged so as to straddle the separation line. Mounting, molding a sealing resin thereon, burying the post lead 14 to form a sealing resin layer 13 and solidifying it, and then dicing up to at least the surface of the collective substrate 21 along the separation line A half-cut process (see FIG. 10) for forming the groove 20 similar to that of the first embodiment by cutting with an apparatus or the like is placed, and then the sealing resin layer 13 is filled so as to fill the groove in the shield layer forming process. The shield layer 16 is formed by pouring a shield material made of a conductive resin into the substrate, and in the final separation step, the substrate is separated and cut into individual substrates with a dicing blade narrower than the width of the groove 20. Thereby, the circuit module 10 is obtained by being separated into pieces so that the shield layer 16 is also exposed at the end face. According to the manufacturing method of this modification, since the post lead 14 can be formed so as to be in contact with the shield layer 16 in a half-cut cross section, reliable conduction between the shield layer 16 and the post lead 14 can be achieved.
0095]
  (Modification) The embodiment of the present invention is not limited to the above, and may be modified as follows, for example.
0096]
  In Modification 1, a step of forming a collective substrate, a step of mounting electronic components on the collective substrate, a step of mounting terminal electrode members on the collective substrate, and sealing on the collective substrate on which the components are mounted Forming a resin part; forming a shield layer on a surface layer of the sealing resin part; and separating the collective substrate on which the sealing resin part and the shield layer are formed into individual substrates. In the step of forming the sealing resin portion, the upper end surface of the terminal electrode member is exposed in the same plane of the upper surface of the sealing resin portion without being buried in the sealing resin portion, and the shield layer forming step Then, in the method of manufacturing a circuit module comprising the step of forming the upper end surface of the terminal electrode member so as to be conductively connected in contact with the shield layer, the step of separating the aggregate substrate into individual substrates, The sealing resin The circumferential side surface of the shield layer encapsulating proposes a method of manufacturing a circuit module, wherein the cut to be exposed to the separation surface.
0097]
  According to the method for manufacturing a circuit module, a collective substrate in which a plurality of substrates are connected in a matrix is used, and finally the collective substrate is separated to obtain a circuit module. Since it is formed so as to cover the peripheral side surface of the sealing resin portion, the electronic component is shielded by the shield layer, and there is almost no influence of an electromagnetic field such as static electricity or magnetism on the electronic component. Can be prevented. And by adopting an arrangement structure in which the shield layer and the ground are connected using the terminal electrode member, the flat portion on the upper surface of the sealing resin portion can be used as a base for forming the shield layer. Therefore, the stability and certainty of the conductive connection can be achieved. Further, since the cutting is performed by the dicing apparatus, the waste of the substrate material is greatly reduced, and further, shaping of the deburring and the like can be performed simultaneously with the separation of the aggregate substrate. In addition, since the sealing resin portion is formed in the state of the collective substrate, the number of processes is reduced compared to the case of manufacturing using individual substrates without using the collective substrate. Furthermore, the electronic component is protected from the outside by the sealing resin portion and the shield layer.
0098]
  Further, in Modification 2, in the method for manufacturing a circuit module described in Modification 1, in the sealing resin portion forming step, a line-shaped groove is formed in the sealing resin portion corresponding to the cutting position in the separation step. A method of manufacturing a circuit module is proposed in which the sealing resin portion is formed using a forming mold provided with protrusions in advance so as to be formed in a lattice shape.
0099]
  According to the method of manufacturing the circuit module, the formation of the sealing resin portion can be efficiently formed with the use of a mold and the shield layer can be efficiently manufactured with high accuracy, so that the merit of mass production can be fully utilized. Thereby, the highly efficient electromagnetic field shielding effect etc. in the side part of a circuit module can be aimed at.
[0100]
  Further, in Modification 3, in the method for manufacturing a circuit module described in Modification 1, after the sealing resin portion is formed and solidified, the sealing resin portion corresponding to the cutting position in the separation step is connected to the line. A method of manufacturing a circuit module in which a groove is formed by cutting is proposed.
[0101]
  According to the method for manufacturing the circuit module, since the groove is cut and formed after the sealing resin portion is solidified, the groove can be easily processed, can be accurately processed, and is suitable for mass production. Yes.
0102]
  Moreover, in the modification 4, the manufacturing method of the circuit module described in the modification 2 proposes a manufacturing method of the circuit module in which the mold has the protrusions formed on the upper surface of the upper mold.
0103]
  According to the method for manufacturing the circuit module, the protrusion is formed on the molding surface of the mold, and the mold is used for molding the sealing resin portion, which is suitable for mass production.
0104]
  Further, in Modification 5, in the method for manufacturing a circuit module according to Modification 1, after the step of forming the groove in the sealing resin portion, the step of forming the shield layer is formed in the sealing resin layer. A circuit module that forms a shield layer by pouring a shield material so as to bury the groove, and then separates the groove into two pieces by dicing means in the step of separating corresponding to each substrate. We propose a manufacturing method.
0105]
  According to the method for manufacturing the circuit module, in forming the shield layer, a material such as a conductive resin can be easily poured into the groove after the cutting process, and mass production is sufficiently possible. In addition, the electromagnetic shielding layer, the heat dissipation layer, or the metal layer for electrostatic shielding and magnetic shielding with respect to the electronic component can be easily formed.
0106]
  Further, in Modification 6, in the method for manufacturing a circuit module according to Modification 5, the step of providing a groove in the sealing resin layer is formed by half-cutting the groove by a dicing means, and the dicing means is performed in the separation step. A method of manufacturing a circuit module is proposed in which the dicing process is performed in two stages so as to be separated into pieces by full cut.
0107]
  According to the method for manufacturing the circuit module, since the cutting of the groove performed after the sealing resin portion is solidified is processed by a half cut by a dicing device, it is not necessary to prepare a special device for cutting separately. The depth of the groove can be easily adjusted. Further, since the groove is cut to the substrate surface by half-cutting, the side surface of the circuit module exposed after separation of the aggregate substrate can be formed in a structure that is completely shielded from the outside.
0108]
  Further, in the modified example 7, in the method for manufacturing a circuit module according to the modified example 6, in the step of providing the groove in the sealing resin layer, the groove is formed with a blade wider than the blade of the dicing means used for separation. A method for manufacturing a circuit module is proposed.
0109]
  According to the method for manufacturing the circuit module, since the blade of the dicing means used for cutting the groove only needs to be replaced with the blade used in the separation step, the work can be performed efficiently and the groove width can be reduced. Adjustment of a processing dimension etc. can also be performed easily.
[0110]
  In Modification 8, the step of forming a collective substrate, the step of mounting electronic components on the collective substrate, the step of mounting terminal electrode members on the collective substrate, and the collective substrate on which the components are mounted A step of forming a sealing resin portion, a step of forming a shield layer on a surface layer of the sealing resin portion, and a step of separating the collective substrate on which the sealing resin portion and the shield layer are formed into individual substrates. And in the step of forming the sealing resin portion, the upper end surface of the terminal electrode member is exposed in the same plane of the upper surface of the sealing resin portion without being buried in the sealing resin portion, and the shield layer Forming the terminal electrode member so that the upper end surface of the terminal electrode member is in contact with and electrically connected to the shield layer, and in the mounting step of the terminal electrode member, the assembly On top of the board The terminal electrode member is mounted across the adjacent substrate so as to correspond to a fixed separation position and cross over the boundary line of the adjacent substrate, and an assembly substrate on which the sealing resin portion and the shield layer are formed A method of manufacturing a circuit module is proposed in which the terminal electrode member is cut into two parts in the step of separating corresponding to each substrate.
[0111]
  According to the method for manufacturing the circuit module, in the step of separating the collective substrate corresponding to each substrate, the terminal electrode member disposed across the adjacent substrate so as to cross the boundary line of the adjacent substrate is provided. Since it is cut and separated so as to be divided into two, the exposed surface of the terminal electrode member can be very easily formed on the cut surface of the sealing resin portion. Accordingly, the terminal electrode can be easily processed, and the side surface of the circuit module manufactured by the method, that is, the cut surface can be mounted facing the parent circuit board.
[0111]2]
  Further, in Modification 9, in the method for manufacturing a circuit module according to Modification 1 or 8, the method includes a step of mounting a heat conductive member on the collective substrate before the step of forming the sealing resin portion. In the step of forming the sealing resin portion, a method of manufacturing a circuit module is proposed in which the sealing resin portion is formed such that at least a part of the upper end surface of the heat conducting member is in contact connection with the shield layer.
[0111]3]
  According to the method for manufacturing a circuit module, a circuit module that can efficiently dissipate heat generated from the heat-generating electronic component can be easily manufactured. That is, the heat generated from the heat-generating electronic component is transmitted to the heat conducting member and efficiently dissipated from the surface portion of the shield layer.
[0111]4]
  Further, in Modification Example 10, the circuit module manufacturing method according to Modification Example 1 or 8, wherein the shield layer is a circuit module manufacturing method including at least one of a heat dissipation layer and a metal layer in contact with the heat conducting member. suggest.
[0111]5]
  According to the method for manufacturing a circuit module, a circuit module having a higher heat dissipation effect can be easily manufactured. That is, the heat transmitted through the heat conducting member is transferred to the heat dissipation layer or the metal layer, and is efficiently dissipated according to the surface area.
[0111]6]
  In addition, in Modification Example 11 in the method of manufacturing a circuit module according to Modification Example 1 or 8, in the step of forming the sealing resin portion, the entire main surface of the collective substrate is predetermined using a vacuum printing method or a FAME method. A method of manufacturing a circuit module for forming the sealing resin portion having a thickness is proposed.
[0111]7]
  According to the method for manufacturing a circuit module, since the sealing resin layer is formed by a vacuum printing method or a FAME method, the sealing resin portion can be formed around the electronic component without a gap.
[0111]8]
  Further, in Modification 12, in the method of manufacturing a circuit module according to Modification 1 or 8, in the step of forming the sealing resin portion using the FAME method, the upper mold surface or the lower mold surface is covered with a film, and the terminal A method of manufacturing a circuit module is proposed in which the other end of the electrode member is not buried in the sealing resin portion, and the conductive connection portion to the shield layer is exposed.
[0111]9]
  According to the method for manufacturing a circuit module, when a film is used so as to cover the upper surface of the terminal electrode member for forming by the FAME method, the terminal surface is protected and the resin deburring and mold release are good. Therefore, it is possible to form a conductive connection portion with good conductive connectivity with high accuracy.
[0120]
  In Modification 13, in the method for manufacturing a circuit module according to Modification 1 or 8, the step of forming the sealing resin portion includes the at least one electronic component on the main surface of the substrate and its surroundings in a vacuum state. A step of placing the resin separately from other regions in the region including the predetermined space, and then filling the resin disposed in the region into the predetermined space around the electronic component in a non-vacuum state A method of manufacturing a circuit module including a process is proposed.
[0121]
  According to the method for manufacturing a circuit module, when the resin disposed in a region including a predetermined space around the at least one electronic component in a vacuum state is changed from a vacuum state to a non-vacuum state, Even if there is a portion that is not filled with resin, the resin is pushed into this portion by the external air pressure, and the resin is filled without any gap around the electronic component.
[012]2]
  Moreover, in Modification Example 14, in the method for manufacturing a circuit module according to Modification Example 1 or 8, a step of forming at least one of an electromagnetic field shielding layer, a heat dissipation layer, and a metal layer on the surface of the sealing resin portion. A method for manufacturing a circuit module is proposed.
[012]3]
  According to the method for manufacturing the circuit module, since the electromagnetic field is shielded by the electromagnetic field shielding layer or the metal layer formed on the surface of the sealing resin portion, the electromagnetic field shielding film can be easily formed. . Further, the electromagnetic shielding film is effective for EMC countermeasures. Moreover, since the heat dissipation effect is enhanced by the heat dissipation layer or the metal layer which is a shield layer formed on the surface of the sealing resin portion, a circuit module having a high heat dissipation effect can be easily manufactured.
[012]4]
  Further, in Modification Example 15, in the method of manufacturing a circuit module according to Modification Example 14, the electromagnetic field shielding layer is formed using a resin in which at least one of a ferrite filler and a metal filler is dispersed. suggest.
[012]5]
  According to the method for manufacturing a circuit module, since the electromagnetic field shielding layer is formed using a resin in which a ferrite filler or a metal filler is dispersed, the electromagnetic field shielding layer can be easily formed.
[012]6]
  Moreover, in the modification 16, the manufacturing method of the circuit module which forms the said sealing resin part using insulating resin in the manufacturing method of the circuit module of the modification 1 or 8 is proposed.
[012]7]
  According to the method for manufacturing the circuit module, since the sealing resin portion is formed using the insulating resin, the sealing resin portion can be easily formed.
[012]8]
  Further, in Modification Example 17, in the circuit module manufacturing method according to Modification Example 1 or 8, the circuit module manufacturing method in which the sealing resin portion is formed using a resin in which at least one of a ferrite filler and a metal filler is dispersed. Propose.
[012]9]
  According to the method for manufacturing the circuit module, an electromagnetic field shielding layer can be formed by the sealing resin portion itself.
[0130]
  Further, in the modified example 18, in the circuit module manufacturing method according to the modified example 1 or 8, in the step of separating the collective substrate on which the sealing resin portion and the shield layer are formed corresponding to each substrate, a dicing apparatus We propose a method of manufacturing a circuit module that cuts a collective substrate using a chip.
[0131]
  According to the method for manufacturing the circuit module, since the collective substrate on which the sealing resin portion and the shield layer are formed is cut using a dicing apparatus, the cut surface can be cut very easily and cleanly.
[0113]2]
  Further, in Modification 19, in the method for manufacturing a circuit module according to Modification 18, the step of forming the sealing resin portion includes forming the sealing resin portion after forming the sealing resin portion using the vacuum printing method or the FAME method. A method of manufacturing a circuit module is proposed in which a sealing resin layer is further formed on either the non-vacuum state or the vacuum state on the surface of the stop resin portion.
[0113]3]
  According to the method for manufacturing the circuit module, since the sealing resin layer is further formed in a non-vacuum state or a vacuum state on the surface of the sealing resin portion formed using the vacuum printing method or the FAME method, the sealing resin layer The surface of is flattened. Thus, the manufactured circuit module can be easily mounted on the parent circuit board using an adsorption type automatic mounting machine.
[0113]4]
  Moreover, in the modification 20, the manufacturing method of the circuit module which forms the said sealing resin part in the manufacturing method of the circuit module of the modification 1 or 8 using the material which has waterproofness is proposed.
[0113]5]
  According to the method of manufacturing an electronic component, since the sealing resin portion has waterproofness, a wet cutting device can be used in the step of separating the individual substrate units.
[0113]6]
  Further, in Modification Example 21, in the method for manufacturing a circuit module according to Modification Example 1 or 8, the step of separating the collective substrate corresponding to each substrate includes the collective substrate on which the sealing resin portion is formed. Cutting in a first direction of the matrix to obtain a separation collective substrate in which two or more of the substrates are connected in the first direction; and the separation collective substrate is different from the first direction of the matrix A method of manufacturing a circuit module including a step of cutting in a second direction and separating into individual substrates is proposed.
[0113]7]
  According to the method for manufacturing the circuit module, when connecting the lead terminal electrode to the separated aggregate substrate obtained by cutting the aggregate substrate on which the sealing resin portion is formed in the first direction of the matrix, etc. In this case, the substrate can be easily fixed and the direction of the substrate can be easily confirmed.
[0113]8]
  Further, in the modified example 22, in the circuit module manufacturing method according to the modified examples 1 to 7, in the step of forming the collective substrate, a predetermined height is provided on the collective substrate at a position corresponding to the separation line of each substrate. A method of manufacturing a circuit module in which grid-like protrusions are formed in advance is proposed.
[0113]9]
  According to the method for manufacturing the circuit module, since the grid-like ridges are formed in advance on the upper surface of the collective substrate at positions corresponding to the separation lines, the formation of the ridges is easy, and the mounted electronic component Etc. can be mounted using an automatic mounting machine, so it is suitable for mass production. The height of the protrusion formed on the substrate can be appropriately selected within the range of the thickness of the sealing resin layer.
[0140]
  In Modification Example 23, in the method for manufacturing a circuit module according to Modification Example 22, in the shield layer forming step, a grid-shaped protrusion that covers the sealing resin portion at a position corresponding to the separation line is the shield. A method of manufacturing a circuit module formed in a layer is proposed.
[0141]
  According to the manufacturing method of the circuit module, since it can be separated and cut in a state of encapsulating the sealing resin portion by the above-described protrusions of the collective substrate and the protrusions formed on the shield layer, it can be accurately cut. A manufacturing method suitable for mass production can be provided.
0142]
  Further, in the modified example 24, in the method of manufacturing a circuit module according to the modified example 23, in the step of separating the collective substrate into individual substrates, cutting of the substrates covering the sealing resin portion with each other at the ridge is performed. A method of manufacturing a circuit module is proposed in which the aggregate substrate is separated into individual substrates so that the surface and the cut surface of the peripheral side surface of the shield layer are exposed in the same plane.
0143]
  According to the method for manufacturing a circuit module, in the separation step from the collective substrate, the shield layer and the collective substrate are cut at the same time. Therefore, the exposed surface serving as the side portion of the circuit module is simple and smooth, and the appearance is also beautiful. Can be cut into pieces. Thereby, the mounting to the parent circuit board and the conductive connection can be reliably performed.
0144]
  Further, in the modified example 25, a substrate, an electronic component mounted on the substrate, a sealing resin portion formed on the main surface of the substrate so as to fill a predetermined space around the electronic component, and the sealing The sealing resin portion is formed of a shield layer formed on the surface of the stop resin portion, and a columnar or spherical terminal electrode member having one end directly conductively connected between the substrate and the other end of the shield layer. Has a rectangular parallelepiped shape formed on the main surface of the substrate with a predetermined thickness, the peripheral side surface of the shield layer covers the peripheral side surface of the sealing resin portion, and the peripheral side surface of the shield layer and the substrate A circuit module is proposed in which the peripheral side surface is located in the same plane.
0145]
  According to the circuit module, since the shield layer covers the sealing resin portion and the peripheral side surface is exposed by separation and cutting, the electronic component mounted in the circuit module is completely shielded from the outside. As a result, it is possible to prevent the influence of electromagnetic fields and static electricity from being almost eliminated. In addition, since the sealing resin portion can be formed in the state of the collective substrate in this circuit module, the number of processes is reduced as compared with the case of manufacturing using individual substrates without using the collective substrate, and the substrate material Since the waste is greatly reduced, the advantage for mass production is not lost. Furthermore, the electronic component mounted by the sealing resin portion and the shield layer is protected from the outside. In addition, manufacture using a collective substrate in which a plurality of substrates in which electronic components are protected by a resin are arranged in a matrix is facilitated.
0146]
  Further, in Modification Example 26, a circuit module is proposed in which the shield layer is an electromagnetic field shield layer in the circuit module described in Modification Example 25.
0147]
  According to the circuit module, the electromagnetic field is shielded by the electromagnetic field shield layer, and the electronic components mounted inside the circuit module are protected.
0148]
  In the modified example 27, the circuit module described in the modified example 25 is proposed in which the shield layer is a heat dissipation layer or a metal layer.
0149]
  According to the circuit module, since the shield layer is a heat dissipation layer or a metal layer, heat generated from the electronic component can be efficiently dissipated.
[0150]
  Moreover, in the modification 28, the circuit module of the modification 25 WHEREIN: The circuit module in which the sealing resin part is formed in the surrounding surface area | region of the said columnar or spherical terminal electrode member is proposed.
[0151]
  According to the circuit module, since the sealing resin portion is filled in the peripheral surface of the columnar or spherical terminal electrode member, it is securely fixed in the circuit module and stable conductive connection can be achieved with respect to the shield layer and the like. .
0152]
  Further, in the modified example 29, a substrate, an electronic component mounted on the substrate, a sealing resin portion formed on the upper surface of the substrate so as to fill a predetermined space around the electronic component, and the sealing resin A shield layer formed on the surface of the portion, and a plurality of columnar or spherical terminal electrode members, one end of which is directly conductively connected between the substrate main surface and the other end of the shield layer. The resin portion has a substantially rectangular parallelepiped shape formed on the main surface of the substrate with a predetermined thickness, and at least one surface of the terminal electrode member is disposed so as to be exposed at a boundary of the side surface portion of the sealing resin portion. A circuit module is proposed in which the peripheral side surface of the shield layer and the exposed surface of the terminal electrode member are positioned in the same plane as the side surface of the substrate.
0153]
  According to the circuit module, since the terminal electrode is disposed at the side surface boundary of the circuit module, it is possible to effectively take a protection measure against the influence of an electromagnetic field or the like on the electronic component. Further, the structure in which the terminal electrode is exposed to the side surface by separating and cutting can easily perform surface mounting with the side surface facing the parent circuit board, and the mounting direction depends on the exposed position of the terminal electrode. It becomes easy to confirm.
0154]
  Further, in Modification Example 30, in the circuit module according to Modification Example 29, the terminal electrode member is embedded in the sealing resin portion, and the side surface thereof is continuously disposed adjacent to the side surface of the sealing resin portion, and A circuit module exposed in the same plane as the side surface of the substrate is proposed.
0155]
  According to the circuit module, since the terminal electrode is continuously disposed adjacent to the boundary of the side surface of the circuit module, the effect of the electromagnetic field or the like on the electronic component produces a shielding effect equivalent to that of each module type. It is possible to solve the problems of the conventional mass production type.
0156]
  Further, in the modified example 31, the circuit module according to the modified example 29, wherein the terminal electrode member is embedded in the sealing resin portion and intermittently disposed adjacent to a side surface of the sealing resin portion. suggest.
0157]
  According to the circuit module, countermeasures due to the influence of an electromagnetic field or the like on the electronic component can be performed by adjusting the number of the terminal electrodes to be intermittently disposed as appropriate.
0158]
  Further, in the modified example 32, in the circuit module according to the modified example 25 or 29, a gap is provided between the substrate and the electronic component, and the sealing resin portion includes a predetermined space around the electronic component including the gap. We propose a circuit module formed in
0159]
  According to the circuit module, since the resin is also filled in the gap between the substrate and the electronic component, the electronic component is securely fixed and has excellent durability.
[0160]
  In the modified example 33, a circuit module according to the modified example 25 or 29 is proposed in which the substrate has a rectangular parallelepiped shape with a predetermined thickness.
[0161]
  According to the circuit module, since the substrate has a rectangular parallelepiped shape with a predetermined thickness, manufacture using a matrix-like aggregate substrate is easy.
0162]
  In the modified example 34, a circuit module in which the side surface of the substrate is exposed in the circuit module described in the modified example 25 or 29 is proposed.
0163]
  According to the circuit module, since the sealing resin layer is not formed on the side surface of the substrate, waste of the material of the sealing resin layer can be eliminated.
0164]
  Further, in Modification Example 35, a circuit module is proposed in which in the circuit module described in Modification Example 25 or 29, the sealing resin portion is made of a resin in which at least one of a ferrite filler and a metal filler is dispersed.
0165]
  According to the circuit module, the sealing resin layer can be easily formed into a desired shape at the time of manufacture, and the sealing resin portion enhances a heat radiation function, an electrostatic shielding function, or a magnetic shielding function. To contribute.
0166]
  Further, in Modification 36, a circuit module according to Modification 25 or 29 is proposed in which the sealing resin portion is made of an insulating or heat-resistant resin. According to the circuit module, when an insulating resin is used for the sealing resin portion, the main surface of the substrate and the electronic component can be insulated by the sealing resin portion, and the sealing resin portion has heat resistance. When a resin is used, the electronic component can be protected from external heat.
0167]
  Moreover, in the modified example 37, the circuit module of the modified example 25 or 29 proposes a circuit module in which the sealing resin portion is made of a waterproof or chemical resistant resin.
0168]
  According to the circuit module, when a waterproof resin is used for the sealing resin portion, adhesion of moisture to the electronic component is prevented by the sealing resin portion, and a chemical-resistant resin, for example, When a resin having alkali resistance, acid resistance, or corrosion resistance is used, the electronic component is protected by the sealing resin portion when chemicals having these properties adhere to the electronic component.
0169]
  Further, in Modified Example 38, in the circuit module described in Modified Example 25 or 29, the heat generating electronic component mounted on the main surface of the substrate, the heat generating electronic component being provided in contact with the sealing resin A circuit module including a thermally conductive member partially exposed on the surface of the part is proposed.
[0170]
  According to the circuit module, heat generated from the heat-generating electronic component is transmitted to the heat conductive member and efficiently dissipated from the exposed portion of the heat conductive member to the outside.
[0171]
  Further, in Modification 39, in the circuit module according to Modification 38, at least one of a heat dissipation layer and a metal layer is formed in a predetermined region including the exposed portion of the thermal conductive member on the surface of the sealing resin portion. A circuit module is proposed.
[0173]2]
  According to the circuit module, the heat transmitted through the heat conductive member is dissipated by the heat dissipation layer or the metal layer with an efficiency corresponding to the area.
[0173]3]
  Further, in the modified example 40, in the circuit module according to the modified example 38, the terminal electrode member and the thermally conductive member are disposed on the side surface portion of the substrate, and the exposed surfaces of the side surface of the substrate and the shield layer alternately. A circuit module arranged in the same plane including the side surface is proposed.
[0173]4]
  According to the circuit module, since the terminal electrode is disposed at the boundary of the side surface of the circuit module, the effect of the electromagnetic field on the electronic component can produce a shielding effect equivalent to that of the individual module type. Thus, the above-mentioned problem of the conventional mass production type can be solved. Further, the terminal electrode member disposed on the side surface portion can achieve high-density mounting on the parent circuit board, and the heat conductive member can be quickly dissipated to realize high assurance for the electronic component.
[0173]5]
  Further, in the modified example 41, a substrate, an electronic component mounted on the substrate, a sealing resin portion formed on the substrate so as to fill a predetermined space around the electronic component, and the sealing resin A shield layer formed on the surface of the portion and a conductive member having one end directly conductively connected between the substrate and the other end of the shield layer. A side wall (edge) extending vertically upward from a side edge on the substrate main surface, and the sealing resin portion has a rectangular parallelepiped shape formed in a predetermined thickness on the main surface of the substrate, A circuit module is proposed in which the peripheral side surface covers the peripheral side surface of the sealing resin portion, and the peripheral side surface of the shield layer and the side wall (edge) of the substrate are located in the same plane. .
[0173]6]
  According to the circuit module, it is possible to realize a shield structure of the circuit module that encloses the sealing resin portion that protects the electronic component between the substrate side wall (edge) and the peripheral side surface of the shield layer, and between the mounted component and the shield layer. Short circuit can be surely prevented.
[0173]7]
  Also, in the modified example 42, a circuit module according to the modified example 41 is proposed in which the side wall (edge) of the substrate and the lower end (edge) of the side edge of the shield layer are butt-joined.
[0173]8]
  According to the circuit module, a structure in which the side part of the circuit module is completely shielded by the structure in which the side wall (edge) of the substrate and the side edge lower end part (edge) of the shield layer are joined to each other can be realized. A shield effect equivalent to that of the module type can be obtained, and since no man-hours such as soldering are required, it can be sufficiently adapted to mass production.
[0173]9]
  In the modified example 43, the substrate, the electronic component mounted on the substrate, the sealing resin portion formed on the upper surface of the substrate so as to fill a predetermined space around the electronic component, and the sealing resin A shield layer formed on the surface of the part, and one or a plurality of columnar or spherical terminal electrode members having one end directly conductively connected between the substrate main surface and the other end of the shield layer. The sealing resin portion has a substantially rectangular parallelepiped shape formed on the main surface of the substrate with a predetermined thickness, and at least one surface of the terminal electrode member is exposed at a side surface boundary in the sealing resin portion. And an electronic device in which the peripheral side surface of the shield layer is located in the same plane as the side surface of the substrate.
[0180]
  According to the electronic device, the conduction between the shield layer and the ground is an example in which the conduction with the shield layer is not necessarily required at the upper end surface of the columnar or spherical terminal electrode member, and the terminal electrode member is sealed. A structure that is exposed to the end face of the stop resin layer and that contacts the end face of the shield layer, and that it does not reach the ceiling face of the shield layer, thereby lowering the ceiling face of the shield layer and making the electronic device thinner Therefore, it can contribute to downsizing.
[0181]
【The invention's effect】
  As described above, the present invention has the following effects.
1. According to the first aspect of the present invention, in a circuit module in which a plurality of components are arranged on a substrate, a metal post disposed on the substrate and a shield layer disposed above the component via the metal post are provided. With the configuration of the provided circuit module, the shield layer and the ground can be connected via the metal post, so that it is possible to obtain a mass production type circuit module having a shield structure optimum for dealing with an electromagnetic field or the like. In addition, since a plurality of components to be mounted on the substrate are covered with a resin layer, the shield layer is formed on the resin layer, so that a reliable and stable shield layer can be formed. It is possible to obtain a circuit module capable of mass production with reliable insulation between components. Furthermore, with the substrate and metal postWith resin layerSince the end face of the shield layer can be cut so as to be positioned on the same plane by dicer cutting, it is possible to achieve mass production of the circuit module together with a reliable shield structure of the circuit module.
2. Claim2According to the present invention, in the circuit module according to claim 1, in addition to the effect of the circuit module according to claim 1, a plurality of the metal posts are intermittently arranged around the plurality of parts. Around the partsIntermittentlyWhen the metal post is disposed, a side shield structure is formed on the cut surface by dicer cutting, so that it is possible to obtain a circuit module that has reliable shielding properties and can achieve mass production.
3. In the invention of claim 3,In a circuit module in which a plurality of components are arranged on a substrate, the circuit module includes a metal post installed on the substrate and a shield layer installed above the component via the metal post. Since the shield layer and the ground can be connected via the metal post, it is possible to obtain a mass production type circuit module having a shield structure optimum for dealing with an electromagnetic field or the like. In addition, since the plurality of components mounted on the substrate are covered with the resin layer, a circuit module capable of mass production with reliable insulation between components can be obtained. Furthermore, since the substrate, the metal post, and the end face of the shield layer can be cut so as to be positioned on the same plane by dicer cutting, the circuit module can be mass-produced with a reliable shield structure. be able to.
4. Claim4In the invention of claim 1,Any one of 32. The circuit module of claim 1, wherein the shield layer is formed of a plate-like member and has a configuration of the circuit module supported by the metal post.Any one of 3In addition to the effect of the circuit module, since the shield layer is formed of a plate-like member, the surface thereof can be made smooth, so that the chucking at the time of transporting the components is reliable and easy.
[Brief description of the drawings]
FIG. 1 is an external perspective view showing a circuit module according to a first embodiment of the present invention.
FIG. 2 is an external perspective view of the circuit module according to the first embodiment of the present invention excluding the sealing resin layer and the shield layer.
FIG. 3 is a cross-sectional view taken along the line AA in FIG.
FIG. 4 is a process explanatory diagram illustrating a method for manufacturing a circuit module according to the first embodiment of the present invention.
FIG. 5 is a diagram illustrating a resin layer forming step in the first embodiment of the present invention.
FIG. 6 is an external perspective view showing a circuit module according to a second embodiment of the present invention.
FIG. 7 is an external perspective view excluding a sealing resin layer and a shield layer of a circuit module according to a second embodiment of the present invention.
8 is a cross-sectional view taken along the line BB in FIG.
FIG. 9 is a process explanatory diagram illustrating a circuit module manufacturing method according to a second embodiment of the present invention.
FIG. 10 is a process explanatory diagram illustrating the formation of a shield layer in the second embodiment of the present invention.
FIG. 11 is a process explanatory diagram illustrating a method for manufacturing a circuit module according to a third embodiment of the present invention.
FIG. 12 is an external perspective view showing a circuit module according to a fourth embodiment of the present invention.
FIG. 13 is an external perspective view of a circuit module according to a fourth embodiment of the present invention excluding a sealing resin layer and a shield layer.
FIG. 14 is an external perspective view showing a collective board on which components are mounted according to a fourth embodiment of the present invention.
FIG. 15 is a process explanatory diagram illustrating the method of manufacturing the circuit module according to the fourth embodiment of the present invention.
FIG. 16 is an external perspective view showing a circuit module according to a fifth embodiment of the present invention.
FIG. 17 is an external perspective view of a circuit module excluding a sealing resin layer and a shield layer according to a fifth embodiment of the present invention.
FIG. 18 is a process explanatory diagram illustrating the method of manufacturing the circuit module according to the fifth embodiment of the present invention.
FIG. 19 is an external perspective view showing a collective board on which components are mounted according to a fifth embodiment of the present invention.
FIG. 20 is an external view showing a circuit module according to a sixth embodiment of the present invention.
FIG. 21 is an external perspective view excluding a sealing resin portion and a shield layer in a sixth embodiment of the present invention.
FIG. 22 is a cross-sectional view of a circuit module according to a first modification of the present invention.
FIG. 23 is an external perspective view in which a shield layer is provided on an aggregate substrate of circuit modules according to Modification 1 of the present invention.
FIG. 24 is a cross-sectional explanatory diagram of a circuit module according to Modification 4 of the present invention.
FIG. 25 is an external perspective view of a circuit module excluding a sealing resin portion according to Modification 4 of the present invention.
FIG. 26 is a cross-sectional explanatory view of a circuit module according to Modification 5 of the present invention.
FIG. 27 is an explanatory diagram of the manufacturing process of the circuit module of Modification 6 of the present invention.
FIG. 28 is an external perspective view of a conventional circuit module.
FIG. 29 is a process explanatory diagram of a conventional circuit module.
[Explanation of symbols]
  10, 50, 60, 70 Circuit module
  11, 11 ', 71 substrate
  12 Electronic parts
  13 Sealing resin layer (sealing resin part)
  14, 24, 51, 74 Terminal electrode
  14 'cut surface of terminal electrode
  16 Shield layer (metal layer)
  Side of 16 'shield layer
  20 grooves
  21, 21 ', 81 Assembly board
  31 base
  25, 26 Dicing blade
  52, 62 Terminal electrode member
  75 Heat conduction member

Claims (4)

In a circuit module in which a plurality of components are arranged on a board,
A metal post installed on the substrate;
A resin layer covering the plurality of components;
A shield layer formed on the upper surface of the resin layer,
The shield layer and the ground are configured to be connected via the metal post,
Circuit module wherein the end face of the resin layer and the end face of the metal post with the end face of the substrate and the end face of the shield layer is configured to be positioned on the same plane.   The circuit module according to claim 1, wherein the metal post is intermittently disposed around the plurality of components. In a circuit module in which a plurality of components are arranged on a board,
  A resin layer formed on the upper surface of the substrate so as to cover the plurality of components;
  Metal posts continuously installed around the plurality of components on the substrate;
  A shield layer formed on the upper surface of the metal post,
  The shield layer is configured to be connected to the ground via the metal post,
  The end face of the substrate, the end face of the metal post, and the end face of the shield layer are configured to be located on the same plane.
  A circuit module characterized by that. The shield layer circuit module according to any one of claims 1 to 3, characterized in that it is formed by the plate-like member.

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