JP3853665B2 - Electronic unit - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic unit. In particular, the present invention relates to an electronic unit including a flexible substrate.
[0002]
[Prior art]
A plurality of mounting structures of an imaging device including a distance measuring device are disclosed. Japanese Patent Laid-Open No. 9-218343 discloses a flexible substrate mounting structure for a camera that is optimal for the connection of an automatic focus detection mechanism disposed at the bottom of the camera. Japanese Patent Application Laid-Open No. 11-153437 discloses an optical sensor unit having a sheet for covering so that unnecessary light does not enter the optical sensor. Japanese Patent Laid-Open No. 2001-13566 discloses a distance measuring device and a camera that can reduce the size of the entire camera.
[0003]
[Problems to be solved by the invention]
By the way, in an electronic unit including an electronic component such as a conventional distance measuring device, an external force is applied to the electronic component due to the position variation of the flexible substrate extending from the electronic component, and thus an unnecessary force may be applied to the electronic unit. there were.
[0004]
Then, an object of this invention is to provide the electronic unit which can solve said subject. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous specific examples of the present invention.
[0005]
[Means for Solving the Problems]
That is, according to the first aspect of the present invention, the electronic component, the base portion to which the electronic component is attached, the flexible substrate extending from the electronic component, the electronic component, and the relative position variation of the flexible substrate with respect to the base portion are regulated. And restricting means.
[0006]
The flexible substrate has a hole, and the restricting means is a protrusion for fixing and supporting the electronic component, and the flexible substrate may be regulated in relative position variation with respect to the base portion by being inserted into the hole. The flexible substrate may be elastically folded between the electronic component and the base portion.
[0007]
The regulating means may incorporate at least a part of an adjustment mechanism that adjusts the inclination of the electronic component.
[0008]
The above summary of the invention does not enumerate all the necessary features of the present invention, and sub-combinations of these feature groups can also be the invention.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the claimed invention, and all combinations of features described in the embodiments are the solution of the invention. It is not always essential to the means. The “ranging device” described in the detailed description of the invention is an example of the “electronic component” described in the claims. The “boss” described in the detailed description of the invention is an example of the “projection” described in the claims.
[0010]
FIG. 1 is an exploded perspective view of an electronic component unit 10 according to the present embodiment. The electronic unit 10 includes a base part 100, a flexible substrate 102, a distance measuring device 20, a screw 106, and a spring 108. The distance measuring device 20 includes a distance measuring unit 104 and a distance measuring sensor 110.
[0011]
The distance measuring unit 104 includes a lens 124, a pin 116, a support hole 128, and a housing 105. The lens 124 is attached to the front surface of the housing 105. The pin 116 is disposed at the center of the side surface of the housing 105. The support hole 128 is disposed on the upper surface of the housing 105.
[0012]
The distance measuring sensor 110 measures the distance to the object to be measured using light from the object to be measured that has passed through the lens 124. The distance measuring sensor 110 is attached to the back surface of the housing 105. The distance measuring sensor 110 is soldered with a soldering portion 118 of the flexible substrate 102 on the back surface of the surface in contact with the distance measuring unit 104.
[0013]
The flexible substrate 102 has a hole 126 and a support hole 120. The electronic unit 10 is attached to the imaging device 200 by inserting the pin 122 of the imaging device 200 into the support hole 120, for example.
[0014]
The base portion 100 has a boss 112 as an example of a protrusion on the surface.
[0015]
The boss 112 protrudes in a substantially upper surface direction with respect to the surface of the base portion 100. When the boss 112 is inserted into the hole 126 of the flexible substrate 102, the relative position fluctuation of the flexible substrate 102 with respect to the base portion 100 is restricted.
[0016]
The boss 112 has a screw hole 130. The base portion 100 has a support hole 114 on the side surface. The pin 116 of the distance measuring unit 104 is inserted into the support hole 114. Thereby, the distance measuring unit 104 is attached to the base part 100. The spring 108 is a helical spring and is disposed at a position sandwiched between the periphery of the screw hole 130 and the periphery of the support hole 128.
[0017]
Next, a method for assembling the electronic unit 10 will be described. First, the screw 106 is inserted into the support hole 128 from the upper surface of the housing 105. Next, the screw 106 is passed through the spring 108 and the hole 126 of the flexible substrate 102. Next, the screw 106 is inserted into the screw hole 130 of the base portion 100. As a result, the distance measuring unit 104, the distance measuring sensor 110, the flexible substrate 102, and the spring 108 are attached to the base portion 100.
[0018]
Therefore, when the boss 112 of the base portion 100 is inserted into the hole 126 of the flexible substrate 102, the position of the flexible substrate 102 is regulated with respect to the base portion 100. Further, since the distance measurement sensor 110 and the distance measurement unit 104 are attached to the flexible substrate 102, the position of the flexible substrate 102 is restricted with respect to the base portion 100. That is, the electronic unit 10 according to the present embodiment can regulate the positions of the distance measuring sensor 110, the flexible substrate 102, and the distance measuring unit 104 with respect to the base portion 100. For example, when the flexible substrate 102 is pulled by the imaging device 200, the flexible substrate 102, the distance measuring sensor 110, and the distance measuring unit 104 can suppress a change in relative position with respect to the base unit 100.
[0019]
As a result, the electronic unit 10 can suppress damage to the solder portion or the like between the distance measuring sensor 110 and the soldering portion 118 when an external force such as being pulled from the imaging device 200 is applied to the flexible substrate 102.
[0020]
Here, the fluctuation range of the flexible substrate 102 varies depending on the ratio of the thickness of the boss 112 to the size of the hole 126. Here, the thickness of the boss 112 may be a thickness that can be inserted into the hole 126, that is, a thickness that is thinner than the size of the hole 126. The shape of the hole 126 is not limited to a circle or an ellipse.
[0021]
FIG. 2 is a schematic cross-sectional view of the electronic unit 10. Here, the distance measuring unit 104, the distance measuring sensor 110, and the flexible substrate 102 are attached to the base portion 100. As shown in FIG. 2, the flexible substrate 102 is in an elastically deformed state, that is, elastically folded between the base portion 100 and the distance measuring unit 104. The flexible substrate 102 pushes the distance measurement unit 104 upward and pushes the distance measurement unit 104 downward between the foundation part 100 and the distance measurement unit 104.
[0022]
A spring 108 includes a screw 106 therein, and is arranged in a state of holding an elastic force between the distance measuring unit 104 and the boss 112. The screw 106 and the spring 108 are an example of an adjustment mechanism that adjusts the inclination of the housing 105 with respect to the electronic unit 10. The spring 108 extends upward to push the housing 105 upward. Here, the housing 105 rotates around the pin 116. Therefore, it tilts upward. Here, the screw 106 determines the amount of extension of the spring 108. That is, the inclination of the housing 105 can be adjusted by adjusting the position of the screw 106.
[0023]
Therefore, the electronic unit 10 can regulate the relative positions of the distance measurement unit 104 and the distance measurement sensor 110 in the vertical direction with respect to the base portion 100 by such an elastic force of the spring 108.
[0024]
FIG. 3 is a schematic cross-sectional view of an electronic unit 10 according to a modification of the present embodiment. The distance measuring unit 104, the distance measuring sensor 110, and the flexible substrate 102 are attached to the base portion 100.
[0025]
Similar to the flexible substrate 102 according to the present embodiment, the flexible substrate 102 according to the modified example is folded between the base portion 100 and the distance measuring unit 104, but the folded portion is compared with the present embodiment. Is long. That is, in FIG. 1, the position of the hole 126 of the flexible substrate 102 according to the modified example is located farther from the soldering part 118 than the position of the hole 126 according to the present embodiment.
[0026]
As a result, the flexible substrate 102 according to the modified example includes the folded portion 300, and therefore, even when the flexible substrate 102 is strongly pulled from the imaging device 200, the basic substrate 100 and the ranging unit 104 can be connected to each other. The force that pushes the unit 100 downward and the force that pushes the distance measuring unit 104 upward can always be held.
[0027]
Further, the boss 112 of the base portion 100 is inserted into the hole 126 of the flexible substrate 102, whereby the position of the flexible substrate 102 is regulated with respect to the base portion 100. Further, since the distance measurement sensor 110 and the distance measurement unit 104 are attached to the flexible substrate 102, the position of the flexible substrate 102 is restricted with respect to the base portion 100. That is, the electronic unit 10 according to the present embodiment can regulate the positions of the distance measuring sensor 110, the flexible substrate 102, and the distance measuring unit 104 with respect to the base portion 100. For example, when the flexible substrate 102 is pulled by the imaging device 200, the flexible substrate 102, the distance measuring sensor 110, and the distance measuring unit 104 can suppress a change in relative position with respect to the base unit 100.
[0028]
As a result, the electronic unit 10 can suppress damage to the solder portion or the like between the distance measuring sensor 110 and the soldering portion 118 when an external force such as being pulled from the imaging device 200 is applied to the flexible substrate 102.
[0029]
As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. Various changes or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.
[0030]
【The invention's effect】
As is clear from the above description, according to the present invention, an unnecessary force applied to the electronic unit can be suppressed.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an electronic component unit according to an embodiment.
2 is a schematic cross-sectional view of the electronic unit 10. FIG.
FIG. 3 is a schematic cross-sectional view of an electronic unit 10 according to a modification of the present embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Electronic unit 20 Ranging device 100 Base part 102 Flexible board 104 Ranging unit 105 Case 106 Screw 108 Spring 110 Ranging sensor 112 Boss 114 Support hole 116 Pin 118 Soldering part 120 Support hole 122 Pin 124 Lens 126 Hole 128 Support Hole 130 Screw hole 200 Imaging device

Claims (3)

Electronic components,
A base for mounting the electronic component;
A flexible substrate extending from the electronic component;
An electronic component unit comprising the electronic component and a restricting means for restricting relative position fluctuation of the flexible substrate with respect to the base portion ,
The flexible substrate has a hole,
The restricting means is a protrusion for fixing and supporting the electronic component, and is inserted into the hole to restrict relative position variation of the flexible substrate with respect to the base portion,
The protrusion is an electronic component unit that is a part of an adjustment mechanism that adjusts an inclination of the electronic component with respect to the base portion.   The electronic component unit according to claim 1, wherein the flexible substrate is elastically folded between the electronic component and the base portion. The electronic component unit according to claim 2, wherein the flexible substrate pushes the electronic component in the same direction as a direction in which the adjustment mechanism biases the electronic component.

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