JP3859527B2 - Flexible printed wiring board layout structure - Google Patents
Flexible printed wiring board layout structure Download PDFInfo
- Publication number
- JP3859527B2 JP3859527B2 JP2002061154A JP2002061154A JP3859527B2 JP 3859527 B2 JP3859527 B2 JP 3859527B2 JP 2002061154 A JP2002061154 A JP 2002061154A JP 2002061154 A JP2002061154 A JP 2002061154A JP 3859527 B2 JP3859527 B2 JP 3859527B2
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- JP
- Japan
- Prior art keywords
- fpc
- wiring board
- printed wiring
- flexible printed
- support material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005452 bending Methods 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 description 27
- 239000004020 conductor Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- -1 polyethylene Polymers 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、フレキシブルプリント配線板(FPC)の配置構造に関するものである。特に、繰り返し曲げが加わっても導体の断線確率を低減できるFPCの配置構造に関するものである。
【0002】
【従来の技術】
近年、携帯電話の発展が目覚ましい。特に、最近では表示部の大画面化、コンパクト化、ファッション性、操作ボタンなどの保護性を考慮して、二つ折り型(シェル型)の携帯電話が主流になっており、今後もその傾向が継続すると予想される。
【0003】
図5(A)は、シェル型の携帯電話を開いた状態の模式図、同(C)は閉じた状態の模式図、同(B)は同携帯電話を開いた状態におけるFPCの模式図、同(D)は閉じた状態におけるFPCの模式図である。シェル型の携帯電話60は、操作ボタン(図示せず)の配列されたキースイッチ部61に液晶画面などの表示部62をヒンジ63で折り畳み自在に連結した構造である。キースイッチ部61と表示部62とはFPC64を介して電気的接続がとられている。
【0004】
ここで用いられるFPCは、例えば図4に示すように、両端の直線部50をS型屈曲部51でつないだオフセット型の形状をしており、S型屈曲部51を前記ヒンジ内で1巻きして、キースイッチ部と表示部を繰り返し折り曲げした際の耐折性を得ている。
【0005】
その際、ヒンジの円筒部材内にFPCの屈曲部が配置されるが、従来は1巻きされたFPCの巻き形状を保持する格別の構成が設けられていなかった。
【0006】
【発明が解決しようとする課題】
しかし、上記のようなFPCの配置構造では、表示部とキースイッチ部の開閉に伴い、FPCの巻き径が過小となる問題があった。従来のFPCの配置構造は、1巻きされたFPCの巻き形状を保持する何らの手段も設けられていない。そのため、携帯電話の開閉を繰り返すと、図5(D)に示すように、この巻き径が小さくなったり巻き形状がつぶれたりすることが起こる。その結果、導通の不良、導体の断線が起こり、場合によってはFPCの破断に至る。
【0007】
従って、本発明の主目的は、屈曲して配されたFPCにおける導体の断線やFPC自体の破断を抑制することができるFPCの配置構造を提供することにある。
【0008】
【課題を解決するための手段】
本発明は、屈曲して配されたFPCの保形手段を設けることで上記の目的を達成する。
【0009】
すなわち、本発明フレキシブルプリント配線板の配置構造は、繰り返し屈曲が作用する個所にフレキシブルプリント配線板の一部を屈曲して配したフレキシブルプリント配線板の配置構造であって、前記フレキシブルプリント配線板の屈曲個所の内側に、円筒面をもつ支持材を配したことを特徴とする。
【0010】
FPCにおける屈曲個所の内側に支持材を配することで、FPCの屈曲部のつぶれや折れを防止して、導体の断線やFPCの破断を抑制する。
【0011】
支持材の形状は円筒面を有するものであれば良い。一般にはパイプ状のものが好適である。特に、周面の一部を軸方向に切り欠いた円筒部材は支持材自体の縮径方向への弾性が得られて好ましい。
【0012】
支持材の材質はプラスチックや金属が好ましい。例えば、ポリエチレン、ポリプロピレン、ポリエチレンテレフタレートやアルミニウム、銅が利用できる。もちろん、これら材料単体ではなく、積層・複合化した材料も利用できる。
【0013】
支持材の厚みは材料にもよるが、一般的には0.2〜1.0mm程度が好ましい。
【0014】
支持材とFPCとの配置は、FPCを支持材に巻き付けたり、装着することが好ましい。そして、支持材とFPCを接着剤により固定したり、支持材に係合部を設け、この係合部にFPCを挟み込むなどして固定することが挙げられる。接着剤を用いる場合、支持材とFPCは全面接着であっても部分接着であっても良い。
【0015】
【発明の実施の形態】
以下、本発明の実施の形態を説明する。
(実施例1)
本発明配置構造に用いるFPCは、従来と同様、図4に示すように、両端の直線部をS型屈曲部でつないだオフセット型の形状をしている。一般に、このようなFPCは両端部に図示しない相手方基板との接続電極部が形成されている。接続電極部以外の導体はポリイミドなどの樹脂フィルムの間に挟み込まれ、FPCを構成している。本例では、厚さ18μmの銅箔で導体を構成し、この導体を各々厚さ12.5μmのポリイミド製上面樹脂フィルムと下面樹脂フィルムとの間に挟んでいる。
【0016】
このようなFPCと支持材を図1(A)に示す。ここでは周面の一部が軸方向に切り欠かれたポリエチレンパイプ20を支持材とした。図1(B)に示すように、このポリエチレンパイプ20の外周にFPC10を1回巻きつける。巻き付け回数は特に限定されない。ここでは単にFPCを支持材に巻き付けただけであり、接着は行っていない。
【0017】
このような支持材とFPCは、例えばシェル型携帯電話のヒンジ部内に配置することで利用される。
【0018】
このように構成したFPCと支持材を用いて繰り返し曲げ試験を行った。比較として、支持材がなくFPCのみを1回巻きした配置構造についても同様の曲げ試験を行った。試験条件は次のとおりである。
シェル型携帯電話実機に前記FPCを装着し、キースイッチ部と表示部の開閉動作を繰り返す。ここでは「全開」と「閉」との間にて前記開閉動作を2秒サイクルで繰り返した。FPCの内径は約5mmφである。
【0019】
その結果、支持材を用いたFPCの配置構造は、10万回の繰り返し屈曲に対して導体の断線やFPCの破断が見られなかった。これに対して、支持材のないFPCの配置構造は、8万回の繰り返し屈曲で導体の断線が見られた。
【0020】
(実施例2)
以上の実施例1では支持材にFPCを1回巻いたが、図2に示すように、0.5回巻くような場合であっても良い。このようにパイプ20にFPC10を0.5回巻いた配置構造でも、実施例1と同様にFPCの屈曲形状が縮小されることを防止でき、導体断線を抑制することができる。
【0021】
(実施例3)
さらに、図3に示すように、円筒状の支持部材30に波型にFPC10を沿わせる配置構造でも良い。このような配置構造でも、実施例1と同様にFPCの屈曲形状が縮小されることを防止でき、導体断線を抑制することができる。
【0022】
【発明の効果】
以上説明したように、本発明によれば、FPCの屈曲部に支持材を配することで、FPCの屈曲部を保形することができ、繰り返し曲げに対して導体の断線やFPCの破断確率を低下させることができる。
【図面の簡単な説明】
【図1】 (A)は支持材にFPCを巻きつける前の状態を示す説明図、(B)は支持材にFPCを巻きつけた後の状態を示す本発明配置構造の説明図である。
【図2】支持材にFPCを半周巻き付けた本発明配置構造の説明図である。
【図3】支持材にFPCを波型に沿わせた本発明配置構造の説明図である。
【図4】従来より用いられているFPCの模式説明図である。
【図5】携帯電話におけるFPC屈曲部の形状変化を示す説明図であり、(A)は、シェル型の携帯電話を開いた状態の模式図、(C)は閉じた状態の模式図、(B)は同携帯電話を開いた状態におけるFPCの模式図、(D)は閉じた状態におけるFPCの模式図である。
【符号の説明】
10 FPC 20 パイプ 30 支持部材 50 直線部 51 屈曲部
60 携帯電話 61 キースイッチ部 62 表示部 63 ヒンジ 64 FPC[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an arrangement structure of a flexible printed wiring board (FPC). In particular, the present invention relates to an FPC arrangement structure that can reduce the probability of conductor disconnection even when repeated bending is applied.
[0002]
[Prior art]
In recent years, the development of mobile phones has been remarkable. In particular, taking into account the increased screen size, compactness, fashionability, and protection of operation buttons, mobile phones with two-fold type (shell type) have become mainstream recently, and this trend will continue in the future. Expected to continue.
[0003]
FIG. 5 (A) is a schematic diagram of a state in which a shell-type mobile phone is opened, FIG. 5 (C) is a schematic diagram of a closed state, and FIG. 5 (B) is a schematic diagram of an FPC in a state of opening the mobile phone. (D) is a schematic diagram of the FPC in the closed state. The shell-type
[0004]
For example, as shown in FIG. 4, the FPC used here has an offset type shape in which
[0005]
At that time, the bent portion of the FPC is disposed in the cylindrical member of the hinge, but conventionally no special configuration for maintaining the wound shape of the wound FPC has been provided.
[0006]
[Problems to be solved by the invention]
However, the FPC arrangement structure as described above has a problem that the winding diameter of the FPC becomes excessively small as the display unit and the key switch unit are opened and closed. The conventional FPC arrangement structure is not provided with any means for maintaining the wound shape of the wound FPC. For this reason, when the mobile phone is repeatedly opened and closed, as shown in FIG. 5D, the winding diameter may be reduced or the winding shape may be crushed. As a result, poor conduction and disconnection of the conductor occur, and in some cases, FPC breaks.
[0007]
Accordingly, a main object of the present invention is to provide an FPC arrangement structure capable of suppressing conductor disconnection and FPC breakage in a bent FPC.
[0008]
[Means for Solving the Problems]
The present invention achieves the above object by providing a shape-retaining means for the FPC that is bent and arranged.
[0009]
That is, the arrangement structure of the flexible printed wiring board of the present invention is an arrangement structure of a flexible printed wiring board in which a part of the flexible printed wiring board is bent and arranged at a place where repeated bending acts. A support material having a cylindrical surface is arranged inside the bent portion.
[0010]
By disposing a support material inside the bent part of the FPC, the bent part of the FPC is prevented from being crushed and broken, and the conductor breakage and FPC breakage are suppressed.
[0011]
The shape of the support material only needs to have a cylindrical surface. In general, a pipe-shaped one is suitable. In particular, a cylindrical member in which a part of the peripheral surface is notched in the axial direction is preferable because elasticity in the diameter reducing direction of the support material itself is obtained.
[0012]
The material of the support material is preferably plastic or metal. For example, polyethylene, polypropylene, polyethylene terephthalate, aluminum, and copper can be used. Of course, not only these materials but also laminated and composite materials can be used.
[0013]
Although the thickness of the support material depends on the material, it is generally preferably about 0.2 to 1.0 mm.
[0014]
As for the arrangement of the support material and the FPC, the FPC is preferably wrapped around or attached to the support material. And fixing a support material and FPC with an adhesive agent, or providing an engaging part in a support material and inserting FPC in this engaging part, etc. are mentioned. When an adhesive is used, the support material and the FPC may be bonded entirely or partially.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
Example 1
As shown in FIG. 4, the FPC used in the arrangement structure of the present invention has an offset type shape in which straight portions at both ends are connected by S-shaped bent portions as shown in FIG. In general, such an FPC has connection electrode portions (not shown) connected to a counterpart substrate at both ends. Conductors other than the connection electrode portion are sandwiched between resin films such as polyimide to constitute an FPC. In this example, a conductor is composed of a copper foil having a thickness of 18 μm, and the conductor is sandwiched between a polyimide upper surface resin film and a lower surface resin film each having a thickness of 12.5 μm.
[0016]
Such an FPC and a support material are shown in FIG. Here, a
[0017]
Such a support material and FPC are used by being disposed in the hinge portion of a shell-type mobile phone, for example.
[0018]
Repeated bending tests were performed using the FPC and support material thus configured. As a comparison, the same bending test was performed on an arrangement structure in which only the FPC was wound once without a support material. The test conditions are as follows.
The FPC is mounted on the actual shell type mobile phone, and the key switch unit and the display unit are repeatedly opened and closed. Here, the opening / closing operation was repeated in a cycle of 2 seconds between “fully open” and “closed”. The inner diameter of FPC is about 5mmφ.
[0019]
As a result, in the FPC arrangement structure using the support material, no conductor breakage or FPC breakage was observed after repeated bending of 100,000 times. In contrast, the FPC arrangement structure without a support material showed conductor breakage after repeated bending of 80,000 times.
[0020]
(Example 2)
In Example 1 described above, the FPC is wound once on the support material. However, as shown in FIG. 2, it may be wound 0.5 times. Thus, even with an arrangement structure in which the
[0021]
Example 3
Further, as shown in FIG. 3, an arrangement structure may be employed in which the
[0022]
【The invention's effect】
As described above, according to the present invention, by arranging a support material at the bent portion of the FPC, the bent portion of the FPC can be retained, and the conductor disconnection and the FPC fracture probability against repeated bending. Can be reduced.
[Brief description of the drawings]
FIG. 1A is an explanatory view showing a state before an FPC is wound around a support material, and FIG. 1B is an explanatory view of the arrangement structure of the present invention showing a state after the FPC is wound around a support material.
FIG. 2 is an explanatory diagram of an arrangement according to the present invention in which FPC is wound around a support member half a turn.
FIG. 3 is an explanatory view of an arrangement structure according to the present invention in which FPC is waved on a support material.
FIG. 4 is a schematic explanatory view of a conventional FPC.
FIGS. 5A and 5B are explanatory diagrams showing changes in the shape of an FPC bent portion in a mobile phone, wherein FIG. 5A is a schematic diagram of a shell-type mobile phone opened, and FIG. 5C is a schematic diagram of a closed state; B) is a schematic diagram of the FPC in a state where the mobile phone is opened, and (D) is a schematic diagram of the FPC in a state where the mobile phone is closed.
[Explanation of symbols]
10
60
Claims (2)
周面の一部が軸方向に切り欠かれた円筒状の支持材に、前記フレキシブルプリント配線板を一回以上巻き付けて屈曲個所を形成したことを特徴とするフレキシブルプリント配線板の配置構造。It is an arrangement structure of a flexible printed wiring board in which a part of the flexible printed wiring board is bent at a place where repeated bending acts,
An arrangement structure of a flexible printed wiring board, wherein a bent portion is formed by winding the flexible printed wiring board at least once on a cylindrical support member having a part of the peripheral surface cut in the axial direction .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002061154A JP3859527B2 (en) | 2002-03-06 | 2002-03-06 | Flexible printed wiring board layout structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002061154A JP3859527B2 (en) | 2002-03-06 | 2002-03-06 | Flexible printed wiring board layout structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003258388A JP2003258388A (en) | 2003-09-12 |
| JP3859527B2 true JP3859527B2 (en) | 2006-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002061154A Expired - Fee Related JP3859527B2 (en) | 2002-03-06 | 2002-03-06 | Flexible printed wiring board layout structure |
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| JP (1) | JP3859527B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4722507B2 (en) * | 2005-02-17 | 2011-07-13 | 新日鐵化学株式会社 | Double-sided flexible circuit board for repeated bending applications |
| JP4431592B2 (en) | 2007-03-26 | 2010-03-17 | 長野計器株式会社 | Sensor and sensor manufacturing method |
| JP5048850B2 (en) * | 2011-01-24 | 2012-10-17 | 新日鐵化学株式会社 | Double-sided flexible circuit board for repeated bending applications |
| KR101719170B1 (en) * | 2016-04-14 | 2017-03-23 | 주식회사 신도리코 | Apparatus for tensioning flexible flat cable of scanner |
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2002
- 2002-03-06 JP JP2002061154A patent/JP3859527B2/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| JP2003258388A (en) | 2003-09-12 |
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