JP3860483B2 - Method for manufacturing RF-ID media - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing an RF-ID medium such as a non-contact type IC card capable of writing and reading information in a non-contact state.
[0002]
[Prior art]
In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed.
[0003]
In information management using such a card, a non-contact IC card equipped with an IC capable of writing and reading information in a non-contact state with respect to the card is rapidly used due to its excellent convenience. Is spreading.
[0004]
In a non-contact type IC card capable of writing and reading information in a non-contact state, an electromagnetic coupling method using mutual induction of coils by an AC magnetic field or an induced power due to dielectric flux of two coils is used. An electromagnetic induction system, a microwave system that transmits and receives data by microwaves, and a static electricity that performs communication by charging the antenna between the card side and the external information writing / reading side antenna on the capacitor principle. There are an electric coupling method, an optical method using energy modulation of light by flashing near infrared light at high speed, and the like.
[0005]
7A and 7B are diagrams showing the structure of a non-contact type IC card using an electromagnetic induction method, where FIG. 7A is a diagram showing the internal structure, and FIG. 7B is a cross-sectional view.
[0006]
In this example, as shown in FIG. 7, an IC module 511 capable of writing and reading information from the outside is mounted, and connected to the IC module 511 via a contact 513, and information writing provided outside is provided. A conductive antenna 512 is formed in a coil shape to supply current to the IC module 511 by electromagnetic induction from a reading device (not shown), and to write and read information to and from the IC module 511 in a non-contact state. Further, the inlet 510 is configured to be bonded to the surface layers 530a and 530b by the hot melt layers 520a and 520b.
[0007]
In the non-contact type IC card 501 configured as described above, a current flows to the antenna 512 by electromagnetic induction from the information writing / reading device when it is close to the information writing / reading device provided outside. A current is supplied to the IC module 511 via the contact 513, whereby information is written from the information writing / reading device to the IC module 511 in a non-contact state, or the information written in the IC module 511 is recorded in the information document. Or read by a read / write device.
[0008]
Below, the conventional manufacturing method of the non-contact type IC card mentioned above is explained.
[0009]
8 is a flowchart for explaining a manufacturing method of the non-contact type IC card 501 shown in FIG. 7, and FIG. 9 is a flowchart for explaining a manufacturing method of the non-contact type IC card 501 shown in FIG. It is a schematic diagram.
[0010]
First, the inlet sheet 610 including at least one inlet 510, the hot melt sheets 620a and 620b constituting the hot melt layers 520a and 520b, and the surface sheets 630a and 630b constituting the surface layers 530a and 530b are overlapped (step). S101) (FIG. 9A).
[0011]
Here, the inlet sheet 610, the hot melt sheets 620a and 620b, and the top sheets 630a and 630b will be described.
[0012]
FIG. 10 is a diagram illustrating a configuration of the inlet sheet 610 illustrated in FIG. 9.
[0013]
As shown in FIG. 10, the inlet sheet 610 shown in FIG. 9 is configured by arranging a plurality of inlets 510 constituting the non-contact type IC card 501 shown in FIG. 7, and is superimposed on the inlet sheet 610. The hot-melt sheets 620a and 620b and the top sheets 630a and 630b are large enough to cover all of the plurality of inlets 510 included in the inlet sheet 610.
[0014]
Next, heat is applied at a predetermined temperature while pressing the stacked inlet sheet 610, hot melt sheets 620a, 620b, and top sheets 630a, 630b (step S102), and the hot melt sheets 620a, 620b are melted. .
[0015]
Next, while maintaining the pressurized state, the stacked inlet sheet 610, hot melt sheets 620a, 620b and top sheets 630a, 630b are cooled (step S103), and the molten hot melt sheets 620a, 620b are cured, Thus, the inlet sheet 610 and the topsheets 630a and 630b are bonded (FIG. 9B).
[0016]
Thereafter, the inlet sheet 610 and the surface sheets 630a and 630b bonded to each other by the hot melt sheets 620a and 620b are cut for each inlet 510 to complete the non-contact type IC card 501 (step S104). The inlet sheet 610 and the surface sheets 630a and 630b bonded to each other by the hot melt sheets 620a and 620b are cut according to the information printed on the surface sheets 630a and 630b.
[0017]
[Problems to be solved by the invention]
In the conventional non-contact type IC card manufacturing method as described above, the hot melt sheet is melted in a pressurized state in the bonding process between the inlet sheet and the surface sheet. As a result, the inlet sheet may be displaced from the top sheet.
[0018]
Here, since the inlet sheet is cut for each inlet according to the information printed on the surface sheet bonded by the hot melt sheet, if the inlet sheet is displaced with respect to the surface sheet, the cutting position of the inlet sheet is originally set. It will be a position that should not be cut.
[0019]
For this reason, the position where the IC module is mounted on the inlet and the position where the antenna is formed are limited to positions where the IC module and the antenna are not damaged even when the inlet sheet is cut with a deviation from the surface sheet. Actually, it is impossible to mount an IC module or form an antenna near the periphery of the inlet. However, the antenna formed on the inlet preferably has a large diameter in order to increase the communication distance. As described above, if the antenna cannot be formed in the vicinity of the inlet, the communication distance is short. There is a problem of becoming.
[0020]
In addition, when a reactive adhesive that cures at room temperature is used without bonding a hot melt sheet to bond the inlet sheet and the surface sheet, as described above, the inlet sheet is bonded to the surface sheet. Although it is possible to avoid the sheet from being displaced with respect to the top sheet, it must be managed so that the reactive adhesive does not dry before the inlet sheet and the top sheet are bonded to each other, There is a problem that it is necessary to newly set a means for applying the reactive adhesive to the top sheet.
[0021]
The present invention has been made in view of the problems of the prior art as described above, and a plurality of layers constituting an RF-ID medium such as a non-contact type IC card are thermally activated like hot melt. An object of the present invention is to provide a method for producing an RF-ID medium that can suppress a shift between a plurality of layers when bonding is performed using a mold adhesive.
[0022]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides:
An IC module capable of writing and reading information; and a base substrate connected to the IC module and formed with an antenna for writing and reading information to and from the IC module in a non-contact state; A base including at least one base substrate, an RF-ID medium configured by being bonded to a surface layer configured to sandwich the base substrate via an adhesive layer made of a thermally activated adhesive A sheet, two surface sheets having a size sufficient to cover all the base substrates included in the base sheet, and constituting the surface layer, and all the base substrates included in the base sheet. A method of manufacturing an RF-ID medium, which has a size sufficient to cover and is manufactured using two adhesive sheets constituting the adhesive layer,
Superposing the two adhesive sheets on the base sheet so as to sandwich the base sheet;
Forming a through-hole in a predetermined region of the base sheet and the adhesive sheet superimposed;
Superimposing the two top sheets so as to sandwich the base sheet and the adhesive sheet in which the through holes are formed;
Fixing the two surface sheets relative to each other through the through hole;
Melting and cooling the adhesive sheet while applying pressure so as to sandwich the base sheet, the adhesive sheet and the surface sheet;
And cutting the base sheet, the adhesive sheet, and the top sheet for each base substrate.
[0023]
In addition, the two surface sheets are relatively fixed to each other by welding the two surface sheets to each other through the through holes.
[0024]
In addition, a step of embedding an embedding material made of the same material as the material constituting the surface sheet into the through hole,
The two topsheets are relatively fixed to each other by welding the two topsheets and the embedding material, respectively.
[0025]
In addition, the step of filling the through hole with an adhesive having heat resistance,
The two surface sheets are relatively fixed to each other by adhering the two surface sheets to each other via the adhesive.
[0026]
(Function)
In the present invention configured as described above, after overlapping the base sheet including the base substrate and the adhesive sheet constituting the adhesive layer, through holes are formed in the superimposed base sheet and adhesive sheet. After that, the two surface sheets constituting the surface layer are overlapped so as to sandwich the base sheet and the adhesive sheet, and the two surface sheets are relatively fixed through the through holes. For this reason, the base sheet sandwiched between the two surface sheets relatively fixed through the through holes is fixed to the surface sheet at the portion where the through holes are formed, and then the adhesive sheet. It is suppressed that it shifts with respect to the surface sheet in the process of melting the glass.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0028]
FIG. 1 is a diagram showing an embodiment of the structure of a non-contact type IC card by an electromagnetic induction method manufactured by the method for manufacturing an RF-ID medium of the present invention, (a) is a diagram showing an internal structure, (B) is sectional drawing.
[0029]
As shown in FIG. 1, in this embodiment, an IC module 11 capable of writing and reading information from the outside is mounted, and connected to the IC module 11 via a contact 13 and information writing provided outside. / A conductive antenna 12 is formed in a coil shape to supply current to the IC module 11 by electromagnetic induction from a reading device (not shown) and to write and read information to and from the IC module 11 in a non-contact state. Further, the inlet 10 as the base substrate is bonded to the surface layers 30a and 30b by the hot melt layers 20a and 20b as the adhesive layers made of the thermally activated adhesive.
[0030]
In the non-contact type IC card 1 configured as described above, when close to an information writing / reading device provided outside, a current flows through the antenna 12 by electromagnetic induction from the information writing / reading device. A current is supplied to the IC module 11 via the contact 13, whereby information is written from the information writing / reading device to the IC module 11 in a non-contact state, or the information written in the IC module 11 is changed to the information document. Or read by a read / write device.
[0031]
Hereinafter, the above-described method for manufacturing a non-contact type IC card will be described by taking a plurality of embodiments as examples.
[0032]
(First embodiment)
FIG. 2 is a flowchart for explaining the first embodiment of the manufacturing method of the non-contact type IC card 1 shown in FIG. 1, and FIG. 3 shows the non-contact type IC card 1 shown in FIG. It is a schematic diagram for demonstrating 1st Embodiment of a manufacturing method.
[0033]
First, an inlet sheet 110, which is a base sheet including at least one inlet 10, and hot melt sheets 120a, 120b, which are adhesive sheets constituting the hot melt layers 20a, 20b, are superposed (step S1) (FIG. 3 (a)). )).
[0034]
Next, a hole 140 that penetrates from the surface of the hot melt sheet 120a to the surface of the hot melt sheet 120b is formed at a predetermined position of the superimposed inlet sheet 110 and hot melt sheets 120a and 120b (step S2) (step S2). FIG. 3 (b)).
[0035]
Here, the inlet sheet 110, the hot melt sheets 120a and 120b, and the relationship between these and the holes 140 will be described.
[0036]
FIG. 4 is a diagram illustrating the configuration of the inlet sheet 110 illustrated in FIG. 3 and the relationship between the inlet sheet 110 and the holes 140.
[0037]
As shown in FIG. 4, the inlet sheet 110 shown in FIG. 3 is configured by arranging a plurality of inlets 10 constituting the non-contact type IC card 1 shown in FIG. 1, and is superimposed on the inlet sheet 110. The hot-melt sheets 120a and 120b and the top sheets 130a and 130b to be superposed on each other in the next step have a size sufficient to cover all the plurality of inlets 10 included in the inlet sheet 110.
[0038]
Moreover, the hole 140 formed in step S <b> 2 is formed in a region where the inlet 10 is not formed on the inlet sheet 110.
[0039]
Next, the surface sheets 130a and 130b constituting the surface layers 30a and 30b are overlapped so as to sandwich the inlet sheet 110 in which the holes 140 are formed and the hot melt sheets 120a and 120b (step S3) (FIG. 3C). ).
[0040]
Next, in the surface sheets 130a and 130b, the surface sheet 130a and the surface sheet 130b are welded through the holes 140 at portions where the holes 140 are formed in the superposed hot melt sheets 120a and 120b (step). S4) (FIG. 3D). The topsheets 130a and 130b are made of, for example, PVC, PET-G, or PET. When the topsheets 130a and 130b are made of PVC or PET-G, thermocompression bonding or ultrasonic waves are used. When the topsheet 130a and the topsheet 130b are welded by pressure bonding and the topsheets 130a and 130b are made of PET, the topsheet 130a and the topsheet 130b are welded by ultrasonic pressure bonding.
[0041]
Next, heat is applied at a predetermined temperature while pressing the stacked inlet sheet 110, hot melt sheets 120a, 120b, and top sheets 130a, 130b (step S5) to melt the hot melt sheets 120a, 120b. . At this time, the surface sheet 130a and the surface sheet 130b are welded to each other at the portion where the hole 140 is formed. Therefore, the inlet sheet 110 is prevented from being displaced with respect to the top sheets 130a and 130b.
[0042]
Next, while maintaining the pressurized state, the stacked inlet sheet 110, hot melt sheets 120a, 120b and top sheets 130a, 130b are cooled (step S6), and the melted hot melt sheets 120a, 120b are cured, Thus, the inlet sheet 110 and the top sheets 130a and 130b are bonded (FIG. 3E).
[0043]
Thereafter, the inlet sheet 110 and the top sheets 130a and 130b bonded to each other by the hot melt sheets 120a and 120b are cut for each inlet 10 to complete the non-contact type IC card 1 (step S7). The top sheet 130a is printed with information for cutting the inlet sheet 110 and the top sheets 130a, 130b bonded to each other for each inlet 10, and according to this information, the inlet sheet 110 and the top sheets 130a, 130b, Cut 130b.
[0044]
(Second Embodiment)
FIG. 5 is a flowchart for explaining a second embodiment of the method for manufacturing the non-contact type IC card 1 shown in FIG. 1, and FIG. 6 shows the non-contact type IC card 1 shown in FIG. It is a schematic diagram for demonstrating 2nd Embodiment of a manufacturing method.
[0045]
First, the inlet sheet 110 including at least one inlet 10 and the hot melt sheets 120a and 120b constituting the hot melt layers 20a and 20b are overlapped (step S11) (FIG. 6A).
[0046]
Next, a hole 140 that penetrates from the surface of the hot melt sheet 120a to the surface of the hot melt sheet 120b is formed at a predetermined position of the superimposed inlet sheet 110 and hot melt sheets 120a and 120b (step S12) (step S12). FIG. 6 (b)).
[0047]
The inlet sheet 110 and the hot melt sheets 120a and 120b and the relationship between these and the holes 140 are the same as those described in the first embodiment.
[0048]
Next, an embedding material 150 made of the same material as that constituting the top sheets 130a and 130b is embedded in the holes 140 formed in the inlet sheet 110 and the hot melt sheets 120a and 120b (step S13) (FIG. 6). (C)).
[0049]
Next, the surface sheets 130a and 130b constituting the surface layers 30a and 30b are overlapped so as to sandwich the inlet sheet 110 and the hot melt sheets 120a and 120b (step S14) (FIG. 6D).
[0050]
Next, in the surface sheets 130a and 130b, in the portion where the hole 140 is formed in the superposed hot melt sheets 120a and 120b, the embedding material 150 embedded in the hole 140 and the surface sheets 130a and 130b are welded. (Step S15) (FIG. 6E). The topsheets 130a and 130b are made of, for example, PVC, PET-G, or PET. When the topsheets 130a and 130b are made of PVC or PET-G, thermocompression bonding or ultrasonic waves are used. When the embedding material 150 and the surface sheets 130a and 130b are welded by pressure bonding, and the surface sheets 130a and 130b are made of PET, the embedding material 150 and the surface sheets 130a and 130b are welded by ultrasonic pressure bonding. As a result, the top sheet 130 a and the top sheet 130 b are bonded via the embedding material 150.
[0051]
Next, heat is applied at a predetermined temperature while pressing the stacked inlet sheet 110, hot melt sheets 120a, 120b, and top sheets 130a, 130b (step S16) to melt the hot melt sheets 120a, 120b. . At this time, in the portions where the holes 140 of the hot melt sheets 120a and 120b are formed, the embedding material 150 and the surface sheets 130a and 130b are welded to each other. Since the sheet is fixed to the sheets 130a and 130b, the inlet sheet 110 is prevented from being displaced with respect to the top sheets 130a and 130b.
[0052]
Next, while maintaining the pressurized state, the stacked inlet sheet 110, hot melt sheets 120a, 120b and top sheet 130a, 130b are cooled (step S17), and the melted hot melt sheets 120a, 120b are cured, Thus, the inlet sheet 110 and the top sheets 130a and 130b are bonded (FIG. 6 (f)).
[0053]
Thereafter, the inlet sheet 110 and the top sheets 130a and 130b bonded to each other by the hot melt sheets 120a and 120b are cut for each inlet 10 to complete the non-contact type IC card 1 (step S18). The top sheet 130a is printed with information for cutting the inlet sheet 110 and the top sheets 130a, 130b bonded to each other for each inlet 10, and according to this information, the inlet sheet 110 and the top sheets 130a, 130b, Cut 130b.
[0054]
In this embodiment, an embedding material 150 made of the same material as that constituting the surface sheets 130a and 130 is embedded in the holes 140 formed in the inlet sheet 110 and the hot melt sheets 120a and 120b. Since the inlet sheet 110 is fixed to the surface sheets 130a and 130b by welding the sheets 130a and 130b to each other, even when the thickness of the inlet sheet 110 is thick, the surface of the surface sheets 130a and 130b Flatness can be ensured, and the surface sheet 130a and the surface sheet 130b can be securely bonded without reducing the area for bonding the surface sheet 130a and the surface sheet 130b.
[0055]
In this embodiment, an embedding material 150 made of the same material as that constituting the topsheets 130a and 130 is embedded in the holes 140 formed in the inlet sheet 110 and the hot melt sheets 120a and 120b. The topsheet 130a and the topsheet 130b are welded to each other to bond the topsheet 130a and the topsheet 130b, but before the topsheet 130a and 130b are overlaid on the inlet sheet 110 and the hot melt sheets 120a and 120b. It is also conceivable that the hole 140 formed in the inlet sheet 110 and the hot melt sheets 120a and 120b is filled with an adhesive, and the topsheet 130a and the topsheet 130b are bonded with this adhesive. However, in that case, as an adhesive to be filled in the hole 140, when the heat at a predetermined temperature is subsequently applied to the inlet sheet 110, the hot melt sheets 120a and 120b, and the top sheets 130a and 130b, the adhesive does not melt It is necessary to use such a heat-resistant adhesive.
[0056]
In the above-described embodiment, the non-contact type IC card has been described as an example of the RF-ID medium capable of writing and reading information in a non-contact state. Not limited to the card manufacturing method, any non-contact IC tag, non-contact IC label, or the like can be used as long as a plurality of layers are configured to be bonded to each other via an adhesive layer made of a thermally activated adhesive. be able to.
[0057]
【The invention's effect】
As described above, in the present invention, after overlapping the base sheet including the base substrate and the adhesive sheet constituting the adhesive layer, through holes are formed in the superimposed base sheet and adhesive sheet, After that, the two surface sheets constituting the surface layer are overlapped so as to sandwich the base sheet and the adhesive sheet, and the two surface sheets are relatively fixed through the through holes. The base sheet sandwiched between the two surface sheets relatively fixed to each other is fixed to the surface sheet at the portion where the through hole is formed, thereby melting the subsequent adhesive sheet It can suppress shifting with respect to a surface sheet in a process.
[Brief description of the drawings]
FIG. 1 is a view showing an embodiment of a structure of a non-contact type IC card by an electromagnetic induction method manufactured by an RF-ID media manufacturing method of the present invention, (a) is a view showing an internal structure; (B) is sectional drawing.
FIG. 2 is a flowchart for explaining a first embodiment of a method for manufacturing the non-contact type IC card shown in FIG. 1;
FIG. 3 is a schematic diagram for explaining the first embodiment of the method for manufacturing the non-contact type IC card shown in FIG. 1;
4 is a diagram showing the configuration of the inlet sheet shown in FIG. 3 and the relationship between the inlet sheet and holes. FIG.
FIG. 5 is a flowchart for explaining a second embodiment of the method for manufacturing the non-contact type IC card shown in FIG. 1;
6 is a schematic diagram for explaining a second embodiment of the method of manufacturing the non-contact type IC card shown in FIG. 1. FIG.
7A and 7B are diagrams showing a structure of a non-contact type IC card using an electromagnetic induction method, wherein FIG. 7A is a diagram showing an internal structure, and FIG. 7B is a cross-sectional view.
8 is a flowchart for explaining a method of manufacturing the non-contact type IC card shown in FIG.
9 is a schematic view for explaining a method of manufacturing the non-contact type IC card shown in FIG.
10 is a diagram showing a configuration of the inlet sheet shown in FIG. 9. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Non-contact-type IC card 10 Inlet 11 IC module 12 Antenna 13 Contact 20a, 20b Hot-melt layer 30a, 30b Surface layer 110 Inlet sheet 120a, 120b Hot-melt sheet 130a, 130b Surface sheet 140 Hole 150 Embedding material

Claims (4)

An IC module capable of writing and reading information; and a base substrate connected to the IC module and formed with an antenna for writing and reading information to and from the IC module in a non-contact state; A base including at least one base substrate, an RF-ID medium configured by being bonded to a surface layer configured to sandwich the base substrate via an adhesive layer made of a thermally activated adhesive A sheet, two surface sheets having a size sufficient to cover all the base substrates included in the base sheet, and constituting the surface layer, and all the base substrates included in the base sheet. A method of manufacturing an RF-ID medium, which has a size sufficient to cover and is manufactured using two adhesive sheets constituting the adhesive layer,
Superposing the two adhesive sheets on the base sheet so as to sandwich the base sheet;
Forming a through-hole in a predetermined region of the base sheet and the adhesive sheet superimposed;
Superimposing the two top sheets so as to sandwich the base sheet and the adhesive sheet in which the through holes are formed;
Fixing the two surface sheets relative to each other through the through hole;
Melting and cooling the adhesive sheet while applying pressure so as to sandwich the base sheet, the adhesive sheet and the surface sheet;
A method of cutting the base sheet, the adhesive sheet, and the top sheet for each base substrate; In the manufacturing method of RF-ID media of Claim 1,
A method for producing an RF-ID medium, wherein the two surface sheets are relatively fixed to each other by welding the two surface sheets to each other through the through hole. In the manufacturing method of RF-ID media of Claim 1,
Having a step of embedding an embedding material made of the same material as the material constituting the surface sheet into the through-hole,
A method of manufacturing an RF-ID medium, wherein the two surface sheets are relatively fixed to each other by welding the two surface sheets and the embedding material, respectively. In the manufacturing method of RF-ID media of Claim 1,
Filling the through hole with a heat-resistant adhesive;
An RF-ID media manufacturing method, wherein the two surface sheets are relatively fixed to each other by adhering the two surface sheets to each other via the adhesive.

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