JP3869613B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a board processing unit Ru is immersed in the treatment liquid substrates for electronic components manufacture of a glass substrate of a semiconductor wafer or a liquid crystal device for the production.
[0002]
[Prior art]
As a substrate processing method for immersing the substrate in the processing solution, for example, there is a method of immersing the substrate in the organic stripping solution in order to remove unnecessary matter on the substrate with the organic stripping solution.
[0003]
[Problems to be solved by the invention]
Depending on the composition of such an organic stripping solution, it is not always easy to become familiar with the substrate surface, and it may not be possible to remove unnecessary materials on the substrate, and the processing may be uneven. Such a defect tends to occur more frequently, particularly in recent substrates with a large aspect ratio.
[0004]
Such a defect is caused by, for example, a portion of the substrate surface where the opening area is small and the depth is deep, even if the substrate is immersed in an organic stripping solution, It is presumed that the peeling liquid cannot enter, and unnecessary substances on the substrate adhering to the substrate surface cannot be brought into contact with the organic peeling liquid. In such a case, even if the substrate is immersed in the organic stripping solution, the inside of the opening is in a state where air bubbles are clogged in combination with the fact that the organic stripping solution is not necessarily familiar with the substrate surface. It is estimated to be.
[0005]
The present invention has been made in view of such circumstances, and when the substrate is immersed in a processing solution, even if the substrate has a large aspect ratio, it is stable and uniform over the entire surface of the substrate. and to provide an immersion board processor that Ru can be made.
[0006]
[Means for Solving the Problems]
[0007]
In order to achieve such an object, the present invention has the following configuration.
[0008]
[0009]
That is, the invention according to claim 1 is a substrate processing apparatus for processing a substrate by immersing the substrate in a processing solution, storing a processing solution and immersing the substrate in the processing solution; and A chamber surrounding the processing tank with a space for waiting for the substrate above, a lid for opening and closing the substrate into and out of the chamber, and a substrate in the chamber are stored in the processing tank. A substrate lifting and lowering means for moving up and down between a pulling position above the liquid level of the processing liquid and a dipping position below the liquid level of the processing liquid stored in the processing tank; Vapor is blown to the surface of the processing liquid to promote evaporation of the processing liquid, and the space above the processing tank in which the substrate stands by contains at least a part of the processing liquid and is at a higher temperature than the substrate Generate Characterized in that it comprises a vaporization accelerator nozzle.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described in detail with reference to the drawings.
[0011]
FIG. 1 is a longitudinal front view showing a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a longitudinal side view. In these drawings, reference numeral 1 denotes a chamber, and a processing tank 2 is provided below the chamber 1. The processing tank 2 is configured by adding an overflow tank 4 around the upper part thereof.
[0012]
A pipe-like evaporation promoting nozzle 5 is provided at a position close to the upper portion of the treatment tank 2 to blow nitrogen gas or the like toward the liquid surface of the treatment liquid, for example, the organic stripping liquid, to promote evaporation from the liquid surface.
[0013]
In addition, as an organic stripping solution, 1-methyl-2pyrrolidone, tetrahydrothiophene 1.1-dioxide, isopropanolamine, dimethylsulfoxide, monoethanolamine, 2- (2aminoethoxy) ethanol, hydroxyamine, catechol, N -Chemicals based on methylpyrrolidone, aromatic diol, perfrene and phenol are used.
[0014]
More specific examples include a mixed liquid of 1-methyl-2pyrrolidone, tetrahydrothiophene 1.1-dioxide and isopropanolamine (first example), or a mixed liquid of dimethylsulfoxide and monoethanolamine (first 2 examples), a mixed solution of 2- (2aminoethoxy) ethanol, hydroxyamine and catechol (third example), or a mixed solution of 2- (2 aminoethoxy) ethanol and N-methylpyrrolidone (fourth example). ), A mixed solution of monoethanolamine, water, and an aromatic diol (fifth example), or a mixed solution of perfrene and phenol (sixth example).
[0015]
The chamber 1 is provided with an upper shutter 7, which is a lid that opens and closes an opening for taking a substrate into and out of the chamber 1 at the uppermost position, and is located at an upper position near the evaporation promoting nozzle 5 in the middle in the vertical direction of the chamber 1. An intermediate shutter 8 is provided. Then, both the shutters 7 and 8 are closed so that a drying zone is formed between them.
[0016]
In the drying zone, a panel heater 9 as a heating device and a vapor supply nozzle 10 for supplying isopropyl alcohol vapor are provided on the side wall of the chamber 1. Although not shown, the steam supply nozzle 10 is connected to a steam supply source of isopropyl alcohol.
[0017]
In the upper part of the chamber 1, that is, in the state where the organic stripping solution is stored in the processing tank 2, the lifting position above the liquid level of the organic stripping liquid, and in the processing tank 2, that is, the immersion below the liquid level of the organic stripping liquid A substrate lifter 11 that holds a large number of substrates W in a standing posture in a horizontal direction at a predetermined interval is provided so as to be movable up and down between the positions. The substrate lifter 11 and an elevating device 12 provided outside the chamber 1 are connected to each other via a lift rod 13 provided in the chamber 1 so as to be slidable in the vertical direction so that the substrate lifter 11 is driven up and down. It is configured.
[0018]
Next, the immersion process in the organic stripping solution by the substrate processing apparatus of the above embodiment will be described.
[0019]
First, as shown in the schematic configuration diagram of FIG. 3, the substrate W is held on the substrate lifter 11 (see FIG. 1), and the substrate W is put on standby in the lifting position in the chamber 1, that is, above the processing tank 2. Let In this state, the organic stripping solution is stored in the processing tank 2, and vapor of the organic stripping liquid is generated from the processing tank 2. Since the processing tank 2 is surrounded by the chamber 1, the vapor of the organic stripping solution drifts in the chamber 1 at a high concentration. At the pulling position, the substrate W is vaporized of the high concentration organic stripping solution. It is in the state exposed to.
[0020]
The temperature of the organic stripping solution stored in the processing tank 2 is higher than that of the substrate. Normally, the substrate is at the same temperature as the room temperature while being transported from the processing apparatus in the previous process into the clean room, and the organic stripping solution is higher than the room temperature.
[0021]
The temperature of the organic stripping solution that is higher than the substrate may be a temperature at which the vapor of the organic stripping solution evaporating from the organic stripping solution stored in the processing tank 2 is in contact with the substrate and is condensed. It is sufficient if there is a temperature difference of 10 ° C. or more between the temperature. In addition, if the substrate is cooled in advance, the organic stripping solution is condensed even at a low temperature. Therefore, the temperature of the organic stripping solution does not necessarily need to be higher than room temperature.
[0022]
In order to promote the evaporation of the organic stripping solution from the treatment tank 2, an appropriate gas such as high-temperature nitrogen gas may be sprayed from the evaporation promoting nozzle 5 toward the surface of the organic stripping solution.
[0023]
Further, the vapor of the organic stripping solution may be generated at a high concentration outside the chamber 1 so that the vapor is efficiently supplied to the substrate surface, and the vapor may be positively supplied from the vapor supply nozzle 10. .
[0024]
When supplying the vapor of the organic stripping solution from the steam supply nozzle 10 in this way, the intermediate shutter 8 is closed, the space around the substrate is narrowed, and the vapor of the high concentration organic stripping solution is applied to the substrate. It is desirable to be provided.
[0025]
When the above-mentioned vapor is brought into contact with the substrate surface, since the vapor is a gas, it is much more fluid than a liquid and has an active molecular motion. Easily penetrates and forms dew inside.
[0026]
Subsequently, as shown by the solid line in FIG. 1, the substrate lifter 11 is lowered to the immersion position, and the substrate W is immersed in the organic stripping solution stored in the processing tank 2. Thereby, contaminants such as unnecessary films attached on the substrate W are washed away.
[0027]
At this time, since the organic stripping solution is securely attached to the substrate surface to the inside of the microscopic openings on the substrate surface, the entire substrate surface is reliably in contact with the organic stripping solution when immersed, Contaminants such as unnecessary films attached on the substrate W can be uniformly washed away.
[0028]
Thereafter, the upper shutter 7 is opened, the lifting device 12 is driven, the substrate lifter 11 is pulled upward from the upper shutter 7, the substrate W is carried out of the chamber 1, and the substrate is cleaned by another device (not shown). .
[0029]
In the above embodiment, a large number of substrates W are processed. However, the present invention can also be applied to the case where the substrates W are processed one by one.
[0030]
Moreover, in the said embodiment, although it is the process which immerses a board | substrate in organic peeling liquid, in addition to this, as this process liquid which immerses a board | substrate, for example, various chemical | medical solutions which etch a board | substrate, and chemical cleaning of the substrate surface The treatment liquid that can be applied to various liquids such as a cleaning chemical liquid to be immersed in the substrate is not limited to the organic stripping liquid of the above embodiment.
[0031]
In the above embodiment, the substrate is brought into contact with the vapor of the organic stripping solution itself before the substrate is immersed in the organic stripping solution. However, the vapor that is brought into contact with the substrate before being immersed in the organic stripping solution is not necessarily organic stripping. It is not necessary for the vapor to contain all the components that make up the liquid. For example, it may be the vapor of some of the components that make up the organic stripping solution such as the solvent component of the organic stripping solution.
[0032]
【The invention's effect】
As is apparent from the above description, in the substrate processing apparatus according to claim 1, before the substrate is immersed in the processing liquid stored in the processing tank, the substrate is moved above the liquid level of the processing liquid by the substrate lifting / lowering means. The space where the substrate is waiting and the processing tank are surrounded by the chamber, so that the substrate comes into contact with the vapor of the processing liquid, and then the substrate lifting means is lowered. Thus, the substrate can be immersed in the processing liquid. Therefore, before the substrate is immersed in the treatment liquid, vapor containing at least a part of the treatment liquid in which the substrate is immersed is condensed on the surface of the substrate. Because of its high fluidity and active molecular motion, it easily penetrates into the back of a microscopic opening or a stepped portion on the surface of the substrate and covers the surface of the substrate with a small amount without fail. For this reason, when the substrate is immersed in the processing solution, even a substrate having a large aspect ratio can be reliably brought into contact with the processing solution, including the inside of the minute opening and the stepped portion, over the entire surface of the substrate. On the other hand, the immersion treatment can be performed stably and uniformly. And this substrate processing apparatus is a compact operation that makes effective use of the vapor evaporating from the processing tank without escaping, and is a simple operation for lowering the substrate from the pulling position to the dipping position, and effectively utilizing the space above the processing tank. The above effects can be achieved by the structure.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional front view showing a substrate processing apparatus according to an embodiment of the present invention.
2 is a longitudinal side view of FIG. 1. FIG.
FIG. 3 is a schematic configuration diagram for explaining the substrate processing in the substrate processing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 2 ... Processing tank 4 ... Overflow tank 5 ... Evaporation promotion nozzle 7 ... Upper shutter 8 ... Intermediate shutter 10 ... Steam supply nozzle 11 ... Substrate lifter W ... Substrate

Claims (1)

In a substrate processing apparatus for processing by immersing a substrate in a processing solution,
A treatment tank in which the treatment liquid is stored, and the substrate is immersed in the treatment liquid;
A chamber surrounding the processing tank with a space for waiting for the substrate above the processing tank;
A lid for freely opening and closing an opening for taking the substrate into and out of the chamber;
In the chamber, the substrate is moved up and down between a pulling position above the liquid level of the processing liquid stored in the processing tank and an immersion position below the liquid level of the processing liquid stored in the processing tank. Substrate lifting and lowering means,
A gas is blown to the liquid level of the processing liquid stored in the processing tank to promote the evaporation of the processing liquid, and the space above the processing tank that waits for the substrate includes at least a part of the processing liquid. An evaporation promoting nozzle that generates steam at a higher temperature than the substrate;
A substrate processing apparatus, characterized in that it comprises a.

Images