JP3871761B2 - IC card and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC card and a manufacturing method thereof, and more particularly to an IC card that can be easily manufactured and a manufacturing method thereof.
[0002]
[Prior art]
A conventional IC card manufacturing method is shown in FIG. As shown in FIG. 6, first, the base film 11 is supplied, and the base film 11 is punched to form through holes 11a and bonding holes 11b in the base film 11 (step (1). )). In this case, a glass epoxy film, a polyimide film, a PET film or the like is used as the base film 11 and has a thickness of 0.05 to 0.2 mm.
[0003]
Next, a Cu foil 12 is laminated on one side of the base film 11 and a predetermined pattern including a terminal layer is formed on the Cu foil 12 by etching. Then, Ni plating and Au plating are electroless plating or A terminal layer is fabricated by sequentially performing electrolytic plating (step (2)).
[0004]
Thereafter, the IC chip 13 is mounted in the through hole 11a of the base film 11 by die bonding (step (3)).
[0005]
Next, the IC chip 13 and the terminal layer made of the Cu foil 12 are connected by the bonding wire 14 passing through the bonding hole 11b (step (4)).
[0006]
Thereafter, the IC chip 13 and the bonding wire 14 are resin-sealed to form the resin portion 15 (step (5)). Next, when it is necessary to reduce the thickness of the resin portion 15, the surface 15a of the resin portion 15 is formed. Is polished (step (6)). Next, an appearance inspection and an electrical inspection are performed on the resin portion 15 in which the IC chip 13 is resin-sealed (step (7)).
[0007]
Next, the hot melt tape 20 in which the opening 21 is formed in advance is attached to the resin part 15 side of the base film 11 (steps (8) and (9)). This hot melt tape 20 is composed of a release paper 20a and an adhesive sheet 22 that is disposed on the side surface of the base film 11 of the release paper 20a and has an adhesive layer on both sides, and only the adhesive sheet 22 is removed by peeling the release paper 20a. Is left around the resin portion 15 of the base film 11 (step (10)). Next, in the base film 11, the periphery of the resin portion 15 is punched to produce the IC module 10.
[0008]
On the other hand, as shown in FIG. 6, a card substrate sheet 35 is supplied (step (11)), and the card substrate sheet 35 is punched into a card shape to produce a card substrate 31 (step (12)). . Next, a counterbore process is performed on the card substrate 31 to form a recess 32 in the card substrate 31 (step 13)). Thereafter, the IC module 10 is mounted in the recess 32 of the card substrate 31 to obtain the IC card 30 (step (14)). As a mounting method of the IC module 10, a mounting method by sticking with an adhesive sheet or applying an adhesive may be considered.
[0009]
[Problems to be solved by the invention]
As described above, conventionally, the IC module 10 is manufactured by mounting the IC chip 13 on the base film 11, and the IC module 10 is mounted in the recess 32 of the card substrate 31 to obtain an IC card. It is done.
[0010]
However, first, the IC module 10 is manufactured, and the operation of manufacturing the IC card by mounting the IC module 10 in the recess 32 of the card substrate 31 is complicated and takes a long time.
[0011]
The present invention has been made in view of such points, and an object thereof is to provide an IC card that can be easily and easily manufactured and a method for manufacturing the same.
[0012]
[Means for Solving the Problems]
The present invention relates to a printed circuit board having a card substrate having a through hole, an IC chip disposed in the through hole of the card substrate, and a bonding hole provided in a portion corresponding to the through hole on one side of the card substrate. And a terminal layer or a coil provided on the printed layer, on which the IC chip is placed , and a connecting portion for connecting the IC chip and the terminal layer or the coil through a bonding hole of the printed layer, and a card. Of the substrate and the printed layer, the terminal or coil side printed layer on which the IC chip is placed is made of PVC or PET, and the card substrate is made of PVC, PC, PET, ABS, and the thickness of the card substrate is the printed layer. It is an IC card characterized by being larger than the thickness of the card .
The present invention includes a step of supplying a printing layer film made of PVC or PET , a step of punching the printing layer film to form a bonding hole, and a terminal layer or a coil on one side of the printing layer film. A step of providing a card substrate sheet made of PVC, PC, PET, and ABS, in which a through hole is formed in advance, on the other side of the printed layer film; and a step in the through hole from the other side of the card substrate sheet . An IC chip is disposed on the terminal layer or the coil, and the step of connecting the IC chip and the terminal layer or the coil through the bonding hole of the printing layer film and the resin in the through hole of the card substrate sheet and a step of resin-sealing the IC chip is filled with, the thickness of the sheet for card substrate is greater than the thickness of the film printing layer An IC card manufacturing method according to claim and.
[0013]
According to the present invention, it is not necessary to separately prepare a base film for an IC module and a card substrate, and an IC module punching step is not required. Further, not only the adhesive sheet sticking step or the adhesive applying step for mounting the IC module on the card substrate is required, but also the IC module adhering step to the card substrate is not required. Therefore, an IC card can be manufactured easily and simply.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the invention will be described with reference to the drawings.
[0015]
1 to 5 are diagrams showing an embodiment of the present invention. First, the IC card will be described with reference to FIG. As shown in FIG. 4, the IC card 30 includes a card substrate 31 having a through hole 36 and an IC chip 13 disposed in the through hole 36 of the card substrate 31. A printed layer 51a having a bonding hole 52 is provided on the lower side (one side) of the card substrate 31 so as to cover the through hole 36, and a terminal layer 12a is laminated on the printed layer 51a. Further, the IC chip 13 enters the bonding hole 52 of the printed layer 51a and is in contact with the terminal layer 12a.
[0016]
The IC chip 13 and the terminal layer 12a are connected by a bonding wire 14 that passes through a bonding hole 52 in the printing layer 51a. Furthermore, the resin portion 15 is formed by filling the through hole 36 of the card substrate 31 with resin.
[0017]
In addition, printed sheets 39 and 38 that have been pre-printed are stacked on the lower side (one side) of the printing layer 51a, the lower side (one side), and the upper side (the other side) of the card substrate 31. The printing sheet 39 on the side is provided with an opening 47 at a portion corresponding to the terminal layer 12a.
[0018]
Next, the material of each part will be described. The card substrate 31 is made of PVC, PC, PET, ABS or the like and has a thickness of about 0.78 to 0.82 mm. The terminal layer 12a is composed of a Cu foil 12 to be described later, and Ni plating and Au plating applied on the Cu foil 12. Further, the printing layer 51a is made of a printing layer film 51 described later, and the printing layer film 51 and the printing sheets 38 and 39 are made of PVC or PET. The thickness of the printing layer film 51 is 0.12 mm, and the thickness of the printing sheets 38 and 39 is 0.18 mm and 0.05 mm, respectively.
[0019]
Next, a method for manufacturing the IC card 30 will be described with reference to FIG. First, as shown in FIG. 1, a printing layer film 51 is supplied, and the printing layer film 51 is punched to form bonding holes 52 (step (A)). This print layer film 51 constitutes the print layer 51 a of the IC card 30. Next, the Cu foil 12 is laminated on the lower side (one side) of the printing layer film 51, and the bonding hole 52 of the printing layer film 51 is covered with the Cu foil 12 (step B)). Next, after a predetermined pattern including the terminal layer 12a is formed by pattern etching on the Cu foil 12, Ni plating and Au plating are formed by electroless plating or electrolytic plating, and terminals are formed from the Cu foil 12, Ni plating and Au plating. Layer 12a is formed.
[0020]
Next, on the upper side (the other side) of the printed layer film 51, a card substrate sheet 35 having a thickness of 0.5 mm, in which a through hole 36 is formed in advance, is stacked (process (C) )).
[0021]
Next, the IC chip 13 is disposed in the through hole 36 of the card substrate sheet 35 from above, and the IC chip 13 enters the bonding hole 52 of the printing layer film 51 and contacts the terminal layer 12a (step (step (2)). D)).
[0022]
Next, the IC chip 13 and the terminal layer 12 a are connected by the bonding wire 14 that passes through the bonding hole 52 of the printing layer film 15. (Step (E)).
[0023]
Next, the inside of the through hole 36 of the card substrate sheet 35 is filled with epoxy resin or UV resin, and the epoxy resin or UV resin seals the IC chip 13 and the bonding wire 14 to form the resin portion 15 (process) (F)). Next, when it is necessary to reduce the thickness of the resin portion 15, the surface 15 a of the resin portion 15 is polished and smoothed by the abrasive 42 (step (G)), and then printed on both sides of the card substrate sheet 35. The printing sheet 38 having 38a and the printing sheet 39 are stacked and arranged (step (H)). In this case, the lower printing sheet 39 can be removed.
[0024]
Next, the card substrate sheet 35, the printing layer film 51, and the printing sheets 38 and 39 are punched out into a card shape by a punching machine 43. Thus, the card substrate 31 and the IC chip 13 built in the card substrate 31 are cut. Is obtained (step (I)). In this case, the printing layer 51 a is formed from the printing layer film 51.
[0025]
In the above-described IC card manufacturing method, the example in which the terminal layer 12a is provided on the lower side of the printed layer 51a has been shown. However, even if a non-contact IC card is manufactured by providing a coil instead of the terminal layer 12a. Good.
[0026]
In addition, the thickness of the card substrate 31 and the thickness of the printed sheets 38 and 39 are determined based on an IC card conforming to ISO7816 or JISX6303, but these thicknesses can be arbitrarily changed.
[0027]
In addition, the Cu foil 12 is laminated on the lower side of the printing film 51, and the terminal layer 12 a is formed by performing Ni plating and Au plating, but the plated Cu lead frame 45 is formed on the printing film 51. You may form the terminal layer 12a by affixing on the lower side (refer FIG. 2).
[0028]
Furthermore, the resin sealing into the through hole 36 may be performed by a potting method, a printing method, or a transfer mold method.
[0029]
Moreover, although the example which stamped the card | curd board sheet | seat 35 in card shape after laminating | stacking the card | curd board | substrate sheet | seat 35 on the printing sheets 38 and 39 was shown, not only this but the grinding | polishing process (process (G)) of the resin part 15 Thereafter, as shown in FIG. 3A, the card substrate sheet 35 and the printed layer film 51 may be punched out to produce the IC card 30 having the card substrate 31 (step (H ′)). In this case, as shown in FIG. 3B, printing 31a may be further performed on both the upper side and the lower side of the card substrate 31 of the IC card 30.
[0030]
Thus, when the printing 31a is applied instead of providing the printing sheets 38 and 39 on both sides of the card substrate 31, an IC card 30 as shown in FIG. 5 is obtained.
[0031]
Furthermore, a step of stacking and arranging the printing sheets 38 and 39 (step (H)), and a step of punching out the card substrate sheet 35, the printing layer film 51, and the printing sheets 38 and 39 (step (I)). May also come immediately after the step of laminating the printed layer film 51 and the card substrate sheet 35 (step (C)). In this case, the process (D) to the process (G) are performed on each card board sheet 35 punched out in a card shape. At this time, after directly printing on the upper side and the lower side of the card substrate sheet 35, the card substrate sheet 35 may be punched out into a card shape. In this case, the lamination process of the printing sheets 38 and 39 becomes unnecessary. Also, instead of punching into a card shape, the sheet is cut in the width direction with a size larger than the card shape, and after performing steps (C)-(H) for each sheet to be separated, it is further punched into a card shape. Also good.
[0032]
Furthermore, instead of punching out the card substrates 31 one by one from the card substrate sheet 35, the card substrates 31 in each row may be punched out.
[0033]
As described above, according to this embodiment, an IC card can be manufactured easily and easily.
[0034]
【The invention's effect】
As described above, according to the present invention, it is not necessary to separately prepare a base film for an IC module and a card substrate, and an IC module punching step is not required. Further, not only is an adhesive sheet sticking step or an adhesive applying step for attaching the IC module to the card substrate unnecessary, but also the IC module adhering step to the card substrate is not required. Therefore, an IC card can be manufactured easily and simply. Further, since it is not necessary to consider the adhesion of the IC module, the problem of peeling of the IC module due to insufficient adhesion of the IC module is eliminated.
[Brief description of the drawings]
FIG. 1 is a process chart showing an IC card manufacturing method according to the present invention.
FIG. 2 is a process diagram showing a modification of the IC card manufacturing method.
FIG. 3 is a process diagram showing a modification of the IC card manufacturing method.
FIG. 4 is a side sectional view showing an IC card according to the present invention.
FIG. 5 is a side sectional view showing a modification of the IC card.
FIG. 6 is a process chart showing a conventional IC card manufacturing method.
[Explanation of symbols]
12 Cu foil 12a Terminal layer 13 IC chip 14 Bonding wire 15 Resin portion 30 IC card 31 Card substrate 35 Card substrate sheet 36 Through hole 38, 39 Print sheet 51 Print layer film 51a Print layer 52 Bonding hole

Claims (5)

A card substrate having a through hole;
An IC chip disposed in the through hole of the card substrate;
A printed layer having a bonding hole provided on one side of the card substrate and corresponding to the through hole;
A terminal layer or a coil provided on the printed layer and on which the IC chip is placed ;
A connection part for connecting the IC chip and the terminal layer or the coil through the bonding hole of the printed layer ,
Of the card substrate and the printed layer, the terminal or coil side printed layer on which the IC chip is placed is made of PVC or PET, and the card substrate is made of PVC, PC, PET, ABS, and the thickness of the card substrate is printed. An IC card characterized by being larger than the thickness of the layer . Supplying a printed layer film made of PVC or PET ;
Forming a bonding hole by punching the printed layer film; and
Providing a terminal layer or coil on one side of the printed layer film;
A step of superimposing a card substrate sheet made of PVC, PC, PET, and ABS, in which through holes are formed in advance, on the other side of the printed layer film;
A step of arranging an IC chip on the terminal layer or coil in the through hole from the other side of the card substrate sheet, and connecting the IC chip and the terminal layer or coil through the bonding hole of the printing layer film by the connecting portion. When,
A step of filling the through hole of the card substrate sheet with resin and sealing the IC chip with resin ,
A method for producing an IC card, wherein the thickness of the card substrate sheet is larger than the thickness of the printed layer film .   3. The method of manufacturing an IC card according to claim 2, further comprising a step of producing an IC card by punching a card substrate sheet into a card shape after the step of resin-sealing the IC chip.   4. The method of manufacturing an IC card according to claim 3, further comprising a step of laminating a printed sheet on at least the other surface of the card substrate sheet before punching out the card substrate sheet.   3. The IC card manufacturing method according to claim 2, further comprising a step of punching the card substrate sheet into a card shape after the step of superimposing the card substrate sheet on the printed layer film.

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