JP3897016B2 - High output voltage controlled oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high output voltage controlled oscillator to make production of a cellular phone or the like easy for a set maker. <P>SOLUTION: The high output voltage controlled oscillator is provided with: an input terminal 211 to which a control voltage is inputted; a voltage controlled oscillation part 214 to which the control voltage inputted to the input terminal 211 is supplied; a power amplifying part 217 to which an output of the voltage controlled oscillation part 214 is supplied and which is formed by serially connecting a plurality of amplifier circuits; and an output terminal 218 for power amplifying signals to which an output of the power amplifying part 217 is supplied. The voltage controlled oscillation part 214 and an amplifier circuit 219 on the first stage of the power amplifying part 217 at least are formed from balanced amplifier circuits and within the power amplifying part 217, a balanced/unbalanced transforming circuit is provided. An unbalanced signal is outputted from the power amplifying part 217, and the oscillator is housed within one multi-layer substrate capable of surface mounting. thereby, the objective oscillator is obtained. <P>COPYRIGHT: (C)2004,JPO

Description

  The present invention relates to a high output voltage controlled oscillator used for a mobile phone or the like.

  The conventional banknote identification device has the following configuration. A mobile phone using a conventional voltage controlled oscillator will be described below. As shown in FIG. 24, a cellular phone using a conventional voltage-controlled oscillator has an antenna 1, an antenna switch 2 connected to the antenna 1, and a surface elasticity connected to one terminal of the antenna switch 2. A demodulator and modulator 5 including a wave (hereinafter referred to as SAW) filter 3 and a low noise amplifier (hereinafter referred to as LNA) 4 to which an output of the SAW filter 3 is connected, and connected to the demodulator and modulator 5 A control circuit 6 of the mobile phone, a voltage controlled oscillator 7 connected to the output of the demodulator and modulator 5, a power amplifier 8 connected to the output of the voltage controlled oscillator 7, and the power amplifier 8 and antenna The low-pass filter 9 is connected between the other terminal of the switch 2.

  The operation of the mobile phone configured as described above will be described below. A signal input from the antenna 1 passes through the SAW filter 3, is amplified by the LNA 4, and is demodulated by the demodulator and the demodulator of the modulator 5. The output was controlled by the control circuit 6 and displayed on the display unit, and also output as an audio output.

  In addition, a signal input from the keyboard and a sound input input from the microphone are input to the control circuit 6 and controlled, and the output is modulated by the demodulator and the modulation unit of the modulator 5. The output is converted into a carrier wave by the voltage controlled oscillator 7, and the output is power amplified by the power amplifier 8 and input to the low pass filter 9. In the low-pass filter 9, harmonics are removed, and the output is emitted from the antenna 1 through the antenna switch 2.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-4-234230

  However, with the recent spread of mobile phones, mobile phone parts that are easy to manufacture have been demanded by set manufacturers. The antenna switch 2, the SAW filter 3, and the low-pass filter 9 are already integrated using a single substrate because they can be manufactured using low-temperature fired substrate technology. Further, since the demodulator and the modulator 5 are also formed by the SiGe technology, a technology realized by a one-chip integrated circuit has been developed. The control circuit 6 is also realized by a one-chip CMOS technology.

  Therefore, as a set maker, a mobile phone can be easily manufactured by arranging these integrated components. Here, the integration of the voltage controlled oscillator 7 and the power amplifier 8 is technically a manufacturing method. Are different fields, and their integration is difficult and has not yet been integrated.

  The present invention has been made to solve such problems, and an object of the present invention is to provide a high output voltage controlled oscillator that makes it easy for a set maker to manufacture a mobile phone or the like.

In order to achieve this object, a high output voltage controlled oscillator according to the present invention includes an input terminal to which a control voltage is input, a voltage controlled oscillator to which the control voltage input to the input terminal is supplied, and the voltage controlled oscillation. A power amplification unit formed by connecting a plurality of amplifier circuits connected in series and an output terminal of a power amplification signal to which an output of the power amplification unit is supplied, the voltage control A balanced amplifier circuit is used for the oscillation unit , a balanced / unbalanced conversion circuit is used for the first stage amplifier circuit of the power amplifier unit to which the output of the balanced amplifier circuit is supplied, and an unbalanced signal is output from the power amplifier unit. The voltage-controlled oscillation unit and the power amplification unit are housed in a single multilayer substrate that can be surface-mounted.

  Thereby, it is possible to provide a high output voltage controlled oscillator that facilitates the manufacture of a mobile phone or the like.

According to the first aspect of the present invention, an input terminal to which a control voltage is input, a voltage control oscillation unit to which a control voltage input to the input terminal is supplied, and an output of the voltage control oscillation unit are supplied. a plurality of amplifier circuit power amplifier that is formed by connecting in series, and an output terminal of the power amplified signal with an output of the power amplifier is supplied, a balanced amplifier circuit to the voltage controlled oscillator A balanced / unbalanced conversion circuit is used for the first stage amplifier circuit of the power amplifier unit to which the output of the balanced amplifier circuit is supplied, and an unbalanced signal is output from the power amplifier unit; The power amplifier is a high output voltage controlled oscillator housed in a single surface mountable multi-layer board. Since it is housed in a single surface mountable board, the set manufacturer can carry it as it is. For sets such as telephones Can do so, it is easy to manufacture in the set manufacturer.

  Further, since the output of the final power amplifier circuit is output as an unbalanced signal, there is no need to connect a balanced / unbalanced conversion circuit to the output of the power amplifier. Therefore, there is no power loss due to the balanced / unbalanced conversion circuit, and power saving can be achieved.

  Furthermore, since the voltage controlled oscillation unit and at least the first stage amplifier circuit of the power amplifier unit are formed by balanced amplifier circuits, they are less likely to be disturbed by external signals.

The invention according to claim 2 is the high output voltage controlled oscillator according to claim 1 , wherein the power amplifying unit is formed by a three-stage amplifier circuit, and a balanced / unbalanced conversion circuit is provided in the first stage amplifier circuit. Since the balance / unbalance conversion is performed in the state of a small signal, power loss is small and power saving can be achieved.

  The invention described in claim 3 is the high output voltage controlled oscillator according to claim 1, wherein the voltage controlled oscillator and the power amplifying unit are integrated in one package, and are integrated in one package. It becomes easy to handle and manage. Further, the size can be reduced.

  The invention described in claim 4 is the high output voltage controlled oscillator according to claim 3 having two series of voltage controlled oscillators and power amplifiers, and becomes a multi-band high output voltage controlled oscillator, It can be used for a mobile phone or the like.

  The invention according to claim 5 is the high output voltage controlled oscillator according to claim 3, which has a heat dissipation plate thermally connected to the power amplifying unit, and the heat dissipation plate is led out as a terminal of the package. Since a large heat radiating plate can be attached to the outside via this terminal, the heat radiating characteristics can be improved, and as a result, power saving can be achieved.

  According to a sixth aspect of the present invention, in the high output voltage controlled oscillator according to the fifth aspect, the terminal led out from the heat sink is formed on the side surface of the package and the size thereof is larger than the other terminals. Yes, the terminal itself can also have heat dissipation characteristics. Further, since the terminals are formed on the side surface of the package, surface mounting is possible.

  The invention according to claim 7 is the high output voltage controlled oscillator according to claim 6, wherein the ground signal of the power amplifying unit is connected to the terminal derived from the heat sink, and the number of terminals can be omitted. This terminal is less susceptible to external noise.

  The invention according to claim 8 has a heat sink thermally connected to the power amplifier, and the heat sink is provided on the bottom surface of the package so as to be solderable from the outside. Since it is a controlled oscillator and a large heat sink is attached, the heat dissipation characteristics are improved. Further, since the heat radiating plate is provided so as to be solderable from the outside, a second heat radiating plate can be provided outside, and the heat radiation characteristics are further improved.

  The invention according to claim 9 is the high output voltage controlled oscillator according to claim 8, wherein the ground signal of the power amplifying unit is connected to the heat sink provided on the bottom surface of the package, and the number of terminals is omitted. As a result, this terminal is less susceptible to external noise.

  The invention according to claim 10 is the high output voltage controlled oscillator according to claim 3, wherein the ground of the voltage controlled oscillator and the ground of the power amplifying unit are independently led out of the package, and the ground is separated. Therefore, it is difficult to be affected by each other, and each performance can be sufficiently exhibited.

  The invention described in claim 11 is the high output voltage controlled oscillator according to claim 1, wherein the power amplifying unit can control the amplification degree from the outside, and the output power can be controlled by the difference in communication distance. For example, in the case of short-range communication, the power amplification can be reduced to save power.

  The invention described in claim 12 is the high output voltage controlled oscillator according to claim 1, wherein the voltage controlled oscillator and the power amplifying unit are formed of SiGe, which is substantially less than that of a conventional gallium arsenide. Despite having the same performance, a significantly lower cost can be realized.

  According to a thirteenth aspect of the present invention, the voltage controlled oscillator and the power amplifier are integrated in separate packages, the voltage controlled oscillator is formed of SiGe, and the power amplifier is formed of GaP. The high output voltage controlled oscillator according to claim 1, wherein the voltage controlled oscillation unit and the power amplification unit can be produced by different technologies, so that the yield is good and the productivity is improved. Moreover, since the yield is good, the price can be reduced.

  According to a fourteenth aspect of the present invention, two series of voltage-controlled oscillation units and power amplification units are integrated in each package, and these packages are mounted on a single printed circuit board. The voltage controlled oscillator is a multi-band high output voltage controlled oscillator and can be used for a multi-band mobile phone or the like.

As described above, according to the present invention, the input terminal to which the control voltage is input, the voltage control oscillation unit to which the control voltage input to the input terminal is supplied, and the output of the voltage control oscillation unit are supplied. And a power amplifier formed by connecting a plurality of amplifier circuits in series, and an output terminal of a power amplification signal to which the output of the power amplifier is supplied, and the voltage controlled oscillator includes a balanced amplifier circuit The output of the balanced amplifier circuit is used, a balanced / unbalanced conversion circuit is used for the first stage amplifier circuit of the power amplifier, and an unbalanced signal is output from the power amplifier, and the voltage controlled oscillator And the power amplifying unit is a high output voltage controlled oscillator housed in one surface-mountable multi-layer board, and is housed in one surface-mountable board. Set a mobile phone Can be implemented, it is easy to manufacture in the set manufacturer.

  Further, since the output of the final power amplifier circuit is output as an unbalanced signal, there is no need to connect a balanced / unbalanced conversion circuit to the output of the power amplifier. Therefore, there is no power loss due to the balanced / unbalanced conversion circuit, and power saving can be achieved.

  Furthermore, since the voltage controlled oscillation unit and at least the first stage amplifier circuit of the power amplifier unit are formed by balanced amplifier circuits, they are less likely to be disturbed by external signals.

(Embodiment 1)
Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 11 denotes an input terminal to which a control voltage is input, and is connected to the voltage controlled oscillator 12. The output of the voltage controlled oscillator 12 is connected to a monitor terminal 13 for the oscillation frequency oscillated by the voltage controlled oscillator 12 and to the inspection means 14. This inspection means 14 is controlled by a signal from the inspection terminal 15. The output of the inspection means 14 is connected to the power amplifier 16, and the output is connected to the output terminal 18 via the matching circuit 17.

  Reference numeral 19 denotes a power control terminal, which controls the power amplification degree of the power amplifying unit 16 from the power control terminal 19. This is for controlling the output power based on the difference in communication distance. For example, in the case of short-distance communication, the power amplification is reduced to save power. Reference numeral 20 denotes a heat radiating means connected to the power control unit 16, which releases heat generated from the power amplification unit 16 to increase power.

  Reference numeral 49 denotes interference prevention means provided so that the signal of the power amplifying unit 16 does not interfere with the voltage controlled oscillation unit 12. Each of these circuits is housed in a single multilayer board 21 made of resin.

  The inspection unit 14 adjusts or inspects the voltage controlled oscillation unit 12 and the power amplification unit 16 independently. Since this inspection means 14 is provided, adjustment and inspection can be easily performed. Further, since it is housed on one multilayer substrate 21, it can be easily mounted on the set manufacturer side.

  The matching circuit 17 is for connecting the output of the power amplifier 16 to the LPF on the set side without loss.

  2 to 6 show various correspondences of the inspection means. In FIG. 2, the output of the voltage controlled oscillator 12 is led to the side electrode 22 of the multilayer substrate 21 by a 50 ohm strip line 24. Reference numeral 23 denotes an independent side electrode adjacent to the side electrode 22, which is connected to the input of the power amplifier 16 by a 50 ohm strip line 25. As described above, since the output of the voltage controlled oscillator 12 and the input of the power amplifying unit 16 are led out to the outside independently, adjustment and inspection can be easily performed.

  That is, by applying a control voltage to the input terminal 11 and observing the oscillation frequency with the side electrode 22 (also serving as the monitor terminal 13), the pattern inductance that forms the resonance circuit in the voltage-controlled oscillation unit 12 is formed by laser light. Adjust trimming. In addition, the pattern inductance of the power amplifier 16 and the matching circuit 17 is trimmed and adjusted with laser light while applying a signal to the side electrode 23 and observing the output at the output terminal 18.

  When adjustment and inspection are completed, the external (on the set side) side electrodes 22 and 23 are connected by a 50 ohm line. Further, the side electrodes 22 and 23 may be directly connected.

  FIG. 3 is a second example of the inspection means 14. In FIG. 3, a jumper resistor connection 26 is provided between the output of the voltage controlled oscillator 12 and the input of the power amplifier 16. Accordingly, when the adjustment / inspection is completed, a zero ohm jumper resistor is attached to the connection portion 26. This eliminates the need to connect the side electrodes 22 and 23 externally on the set side.

  Reference numeral 27 denotes an open stub provided on the strip line 24, which is set to a quarter wavelength of the third harmonic of the output frequency of the voltage controlled oscillator 12, and attenuates the third harmonic. Reference numeral 28 denotes an open stub provided on the strip line 25, which is set to a quarter wavelength of the second harmonic of the output frequency of the voltage controlled oscillator 12, and attenuates the second harmonic.

  FIG. 4 is a third example of the inspection means 14. In FIG. 4, the output of the voltage controlled oscillator 12 is connected to a 50 ohm strip line 30 via a coupling capacitor (approximately 5 PF chip capacitor) 29. The strip line 30 is connected to a 50 ohm strip line 32 via a switch diode 31, and the strip line 32 is connected to the input of the power amplifier 16.

  The strip line 30 is connected to the side electrode 22 and is connected to one end of a pattern inductance 34 via a resistor (a chip resistor of about 470 ohms) 33. The other end of the pattern inductance 34 is connected to a power source 35. The pattern inductance 34 is set to a quarter wavelength of the oscillation frequency of the voltage controlled oscillator 12 and is open as viewed from the resistor 33 side. The value of the resistor 33 is set to about 10 times that of the strip line 30 so that the characteristic impedance of the strip line 30 is not affected.

  Similarly, the strip line 32 is connected to the side electrode 23 and is connected to one end of a pattern inductance 37 via a resistor (a chip resistor of about 470 ohms) 36. The other end of the pattern inductance 37 is connected to the ground. The pattern inductance 37 is set to a quarter wavelength of the oscillation frequency of the voltage controlled oscillator 12 and is open as viewed from the resistor 36 side. The value of the resistor 36 is set to about 10 times that of the strip line 32 so that the characteristic impedance of the strip line 32 is not affected.

  Reference numeral 38 denotes a contact pin of the inspection apparatus 40 provided for observing the oscillation frequency of the voltage controlled oscillation unit 12. The signal on this pin 38 is guided to the inspection device 40 via the capacitor 39. The contact pin 38 is connected to a negative power source (approximately -15V) 42 via a resistor (approximately 470 ohms) 41. Reference numeral 43 denotes a contact pin of the inspection device 45 for giving a signal to the power amplifier 16. A signal is given to the pin 43 from the inspection device 45 via the capacitor 44.

  By bringing the contact pin 38 into contact with the side electrode 22, the negative power source 42 reversely biases the switching diode 31 and turns off the switching diode 31. Therefore, in this state, the voltage controlled oscillator 12 and the power amplifier 16 are separated and can be adjusted and inspected independently. When the contact pin 38 is separated from the side electrode 22, the power source 35 turns on the switching diode 31. Therefore, the voltage controlled oscillator 12 and the power amplifier 16 are connected.

  FIG. 5 shows open stubs 51 and 52 provided on the strip line 50. When the stubs 51 and 52 are set to a quarter wavelength of the frequency supplied to the strip line 50, the frequency is removed. FIG. 6 shows the characteristics. The vertical axis 53 is the attenuation amount, and the horizontal axis 54 is the frequency. For example, if the stub 51 is set to a quarter wavelength that is twice the oscillation frequency of the voltage controlled oscillator 12, the second harmonic of the voltage controlled oscillator 12 is attenuated 55. Similarly, if the stub 52 is set to a quarter wavelength that is three times the oscillation frequency of the voltage controlled oscillator 12, the third harmonic of the voltage controlled oscillator 12 is attenuated 56. Therefore, by providing such stubs 51 and 52 at the output of the voltage-controlled oscillation unit 12, it is possible to remove harmonics that cause interference.

  7 to 10 show various correspondences of the interference prevention means. In FIG. 7, the mounting side 60 of the voltage controlled oscillator 12 of the multilayer substrate 21 is covered with a metal shield case 61. This prevents an interference wave from the power amplifier 16 side from entering the voltage controlled oscillator 12.

  In FIG. 8, the mounting side 62 of the power amplifying unit 16 is also covered with a metal shield case 63 to prevent an interference wave emitted from the power amplifying unit 16 to the voltage controlled oscillation unit 12 side.

  In FIG. 9, the mounting side 60 of the voltage controlled oscillation unit 12 and the mounting side 62 of the power amplification unit 16 are covered with an integrated shield case 64. A part of the shield case 64 is cut and raised between the mounting side 60 and the mounting side 62 and bent by 90 degrees to form a partition plate 65. The partition plate 65 allows the mounting side 60 and the mounting side 62 to be connected to each other at high frequency. Thus preventing interference to the voltage-controlled oscillator 12 side. In addition, it is important to provide the hole 66 generated at the time of cutting and raising on the mounting side 62 of the power amplifying unit 16. That is, the heat dissipation of the power amplifying unit 16 is improved. The lower end of the partition plate 65 is soldered to a through hole 67 provided in the multilayer substrate 21 and connected to the ground.

  The shield cases 61, 63, 64 are punched with a die, bent 90 degrees in this punching direction, and the end portions thereof are connected to the ground with side electrodes of the multilayer substrate 21. As a result, the shield cases 61, 63, and 64 can be grounded, so that they are not easily disturbed. Further, since the burr generated when punching with the mold comes into contact with the side electrode, a gap is formed between the end of the burr and the side electrode. Accordingly, since the entire space is filled with solder by capillary action, reliable soldering can be performed in a large area.

  Therefore, the high frequency shielding performance is improved. The heat of the power amplifying unit 16 connected to the ground is radiated from the shield cases 61, 63, 64 via the side electrodes.

  In FIG. 10, the voltage controlled oscillation unit 12 and the power amplification unit 16 may be both formed of a balanced circuit formed of SiGe, and the voltage controlled oscillation unit 70 and the power amplification unit 71 formed of a balanced circuit may be used. As a result, measures against electric interference from the outside are taken in the electric circuit. The output of the power amplifying unit 71 is output as an unbalanced signal via the balanced / unbalanced converter 72. The power amplifying unit 71 and the power amplifying unit 16 described above are both formed by three amplifiers 73, 74, and 75 so as to obtain an amplification factor of approximately 1300 times. That is, an input of about 3 mW is output after being amplified to about 4 W. By amplifying the power in this way, the output impedance becomes several milliohms.

  11 to 15 show various correspondences of the heat dissipating means. In FIG. 11, the power amplifying unit 16 is mounted on the multilayer substrate 21, and is led out to the lower surface 81 of the multilayer substrate 21 through the through hole 80 from the heat generating unit 16 a on the bottom surface. In the present embodiment, nine through holes 80 are formed, and each diameter is 1 mm. 82 is a copper foil formed on the upper surface of the multilayer substrate 21, and 83 is a copper foil formed on the lower surface of the multilayer substrate 21, and is connected to the ground.

  The through holes 80 are connected to the copper foils 82 and 83 to conduct heat efficiently. This copper foil 83 is further connected to the main body of the mobile phone to dissipate heat. Moreover, you may connect to the case which covers heat-resistant components, ie, a chip component, and a main-body part. Moreover, it may be connected to the antenna through an electrically insulating material as well as a heat conducting material. Reference numeral 84 denotes a ground plane formed in the second layer of the multilayer substrate 21, and reference numeral 85 denotes a ground plane formed in the fourth layer of the multilayer substrate 21. The ground planes 84 and 85 are both connected to the through hole 80 and contribute to the heat generation of the power amplifier 16.

  Here, the multilayer substrate 21 will be described with reference to FIG. The multilayer substrate 21 is formed of glass epoxy resin and has a five-layer structure. The second and fourth layers are ground planes 84 and 85, respectively, and a strip line 86 and an inductance 87 are provided in the third layer therebetween. Accordingly, since the strip line 86 is sandwiched between the ground planes 84 and 85, the cues (Q) of the strip line 86 are increased.

  The lower surface 81 side is not provided except for the side electrodes and the copper foil 83 for heat dissipation. The outer dimensions of the copper foil 83 are substantially the same as the outer dimensions of the power amplifier 16. This improves the degree of freedom of pattern wiring on the main body side. That is, the multilayer substrate 21 is placed on the printed circuit board on the set side, but the lower surface 81 of the multilayer substrate 21 has no wiring and is in an insulated state. Therefore, the printed circuit board on the set side can be freely routed without worrying about a short circuit and is easy to use.

  FIG. 12 is a plan view of FIG. As shown in FIG. 12, nine through holes 80 are provided at equal intervals in the outer shape of the lower surface of the power amplifying unit 16.

  In FIG. 13, one large through hole 88 is provided. The through hole 88 is filled with solder, and the heat generated by the power amplifier 16 is released to the lower surface 81 of the multilayer substrate 21. In this case, since the through hole 88 is large, when the power amplifying unit 16 is exchanged, the large through hole 88 can be easily exchanged. In the present embodiment, the through hole 88 has a diameter of approximately 2.5 mm. This size is preferably about 80% of the bottom surface of the power amplifier 16.

  In FIG. 14, the upper surface of the multilayer substrate 21 is covered with a metal shield case 90, and a part thereof is cut and raised to form a contact portion 91. The abutting portion 91 is brought into contact with the top surface of the power amplifying unit 16 placed on the multilayer substrate 21 to release heat generated from the power amplifying unit 16. Reference numeral 92 denotes a partition plate integrally formed with the shield case 90, which separates the voltage control oscillation unit 12 and the power amplification unit 16 in terms of high frequency, and the harmonics from the power amplification unit 16 are generated by the voltage control oscillation unit 12. Is not disturbed.

  FIG. 15 is a plan view thereof. A contact portion 91 having the same shape as the substantially power amplification portion 16 is cut and raised from the shield case 90, and a plurality of small-diameter heat radiation holes 93 (14 in the present embodiment) are formed around the contact portion 91. ing.

  16 to 19 show various correspondences of the matching circuit. FIG. 16 shows a basic type of the matching circuit 17. The output impedance of the power amplifying unit 16 is several ohms, and this is made a 50 ohm system to reduce transmission signal loss. In FIG. 16, the collector of the power transistor 100 is connected to the output 102 via the capacitor 101. An inductor 103 is inserted between the output 102 and the ground. The emitter of the power transistor 100 is connected to the ground.

  Then, the output impedance of the power transistor 100 is increased to the characteristic impedance (50 ohms) of the strip line by the ratio of the capacitance C0 between the collector and emitter of the power transistor 100 and the capacitance C1 of the capacitor 101. Further, a tuning circuit is formed by the combined capacitance of the capacitances C0 and C1 and the inductance of the inductor 103, and the output from the power transistor 100 is efficiently guided to the output 102.

  In FIG. 17, the inductor 103 is formed by connecting a pattern inductor 104 and a pattern inductor 105 in series. The pattern inductor 104 is formed in the third layer of the multilayer substrate 21 and is led out to the upper surface 82 of the multilayer substrate 21 through a through hole to form the pattern inductor 105. The pattern inductor 105 is trimmed 106 with laser light to adjust the frequency.

  In FIG. 18, the capacitor 101 is formed by connecting three laser trimming capacitors 107, 108, and 109 in parallel. These laser trimming capacitors 107, 108, 109 are trimmed 110 with laser light as necessary to adjust the output impedance.

  The matching circuit 17 can also be adjusted with a control voltage using a varicap capacitor. FIG. 19 shows an example. In FIG. 19, a series connection body of a capacitor 112 and a varicap diode 111 is connected between the collector of the power transistor 100 and the ground. The capacitance of the varicap diode 111 is adjusted as follows. That is, the control circuit 114 is controlled by a signal from the control terminal 113, and the contents of the memory 115 are set to a predetermined value. The value in the memory 115 is converted into an analog voltage by the D / A converter 116 and applied to the cathode of the varicap diode 111 via the resistor 117 to adjust the capacitance of the varicap diode 111. Reference numeral 118 denotes a smoothing capacitor connected between the output of the D / A converter 116 and the ground.

  In FIG. 20, a high output voltage controlled oscillator for GSM that outputs a frequency of 900 MHz and a high output voltage controlled oscillator for DCS that outputs a frequency of 1800 MHz are mounted on one multilayer substrate 120. Therefore, a two-band mobile phone can be easily realized by using this high output voltage controlled oscillator.

  The configuration will be described below. Reference numeral 121 denotes an input terminal to which a GSM control voltage is input. This input terminal 121 is connected to an input terminal of the voltage controlled oscillator 122. Reference numeral 123 denotes an output terminal of the voltage controlled oscillator 122. This output is connected to the input of the power amplifier 126 via the inspection means 124 and the matching circuit 125. Reference numeral 127 denotes a power control terminal of the power amplifier 126. The output of the power amplifier 126 is connected to the GSM output terminal 129 via the matching circuit 128.

  Reference numeral 131 denotes an input terminal to which a DCS control voltage is input. This input terminal 131 is connected to an input terminal of the voltage controlled oscillator 132. Reference numeral 133 denotes an output terminal of the voltage controlled oscillator 132. This output is connected to the input of the power amplifier 136 via the inspection means 134 and the matching circuit 135. Reference numeral 137 denotes a power control terminal of the power amplifier 136. The output of the power amplifier 136 is connected to the DCS output terminal 139 via the matching circuit 138.

  The outputs of the voltage controlled oscillator 122 and the voltage controlled oscillator 132 are led to the PLL terminal 141 via the OR circuit 140.

  As shown in FIG. 20, terminal electrodes to the outside of the high output voltage controlled oscillator for GSM and the high output voltage controlled oscillator for DCS are provided at symmetrical positions on the multilayer substrate 120. By arranging in this way, the pattern can be easily routed on the set side.

  In FIG. 20, the interference prevention means 49 and the heat dissipation means 20 are not shown, but are provided as in the other embodiments. The matching circuits 125 and 135 are provided between the voltage controlled oscillators 122 and 132 and the power amplifying means 126 and 136, respectively, and perform transmission with less loss by matching impedance. Similarly, the power amplifying means 126 and 136 are each constituted by three amplifiers as described with reference to FIG. 10, and a matching circuit is provided in each coupling path in order to reduce the loss by matching the impedance.

  FIG. 21 is a circuit diagram of the sheet 150 attached to the lower surface of the multilayer substrate 21. That is, the sheet 150 is provided with capacitors 152, 153, and 154 for forming a bypass capacitor 151 for power supplied to the high output voltage controlled oscillator and a lag / lead filter 149 for generating a control voltage. In particular, by using this filter capacitor for the capacitor 153 that requires a large capacity, the filter can be made thin and stable against an impact caused by an external force. That is, it is possible to obtain the lag / lead filter 149 that does not generate noise even when an impact is applied. The reason is that the film capacitor has no piezoelectric effect.

  The input 155 of the sheet 150 is connected to the input terminal 11 of the high output voltage controlled oscillator 157 via the lag / lead filter 149 and the low pass filter 156. The output terminal 18 of the high output voltage controlled oscillator 157 is output from the terminal 158 as it is. The terminal 159 is connected to the ground by a bypass capacitor 151 and directly connected to the power supply terminal of the high output voltage controlled oscillator 157.

(Embodiment 2)
FIG. 22 is a block diagram of a high output voltage controlled oscillator in the second embodiment. In FIG. 22, reference numeral 211 denotes an input terminal to which a control voltage is input, and is connected to the balanced amplifier circuit 213 via the resonance circuit 212. The output of the balanced amplifier circuit 213 is connected to the output terminal 215 as the output of the voltage controlled oscillator 214 and is also connected to the power amplifier 217 via the matching circuit 216. The output of the power amplification unit 217 is connected to the output terminal 218.

  In the power amplifier 217, amplifier circuits 219, 220, and 221 are connected in series in this order. The amplifier circuit 219 amplifies a signal of approximately +5 dBm (approximately 3 mW) to approximately 20 dBm. The next increase circuit 220 amplifies the signal to about 30 dBm, amplifies it to about 36 dBm (about 4 mW) by the next amplification circuit 221, and outputs it to the output terminal 218. In the conventional device, the output of about 1.0 dBm has been reduced by the balanced / unbalanced conversion circuit from the final output of 36 dBm amplified to high power. However, in the present invention, since the first stage amplifier circuit 219 is provided with a balanced / unbalanced conversion circuit, a signal of approximately 36 dBm output from the output terminal 218 needs to be attenuated by the balanced / unbalanced conversion circuit as in the prior art. There is no. Accordingly, a signal of approximately 36 dBm is output as it is from an antenna of a mobile phone or the like.

  A power control terminal 222 controls the amplification degree of the amplifier circuit 219, the amplifier circuit 220, or the amplifier circuit 221 with a signal input from the power control terminal 222. As a result, the output power of the power amplifying unit 217 is arbitrarily controlled. This is to control the output power based on the difference in communication distance. For example, in the case of short-distance communication, power consumption can be reduced by lowering the power output level and reducing the current consumption of the amplifier circuit 221.

  In this embodiment, the amplifier circuit 219 includes a balanced / unbalanced conversion circuit. Therefore, the amplifier circuits 220 and 221 after the amplifier circuit 219 are unbalanced amplifier circuits. By configuring in this way, the output from the output terminal 218 becomes an unbalanced signal, so that it is not necessary to insert a balanced / unbalanced conversion circuit having a loss of about 1.0 dBm as in the prior art.

  The voltage controlled oscillator 214 is formed by a balanced resonance circuit 212 and a balanced amplifier circuit 213. In addition, the matching circuit 216 and the first stage amplifier circuit 219 are also formed by balanced circuits.

  Further, when the voltage controlled oscillation unit 214 and the power amplification unit 217 are formed by SiGe (silicon germanium) technology, a low-cost one having substantially the same performance as that formed by conventional gallium arsenide can be realized. .

  The input terminal 211, the output terminals 215 and 218, and the power control terminal 222 are led out to the side surface of the package 223 to enable surface mounting.

(Embodiment 3)
FIG. 23 is a block diagram of a high output voltage controlled oscillator according to the third embodiment of the present invention, and a high output voltage controlled oscillator for GSM that outputs a frequency of 900 MHz and a high output voltage for DCS that outputs a frequency of 1800 MHz. A controlled oscillator is mounted on one package 230. Accordingly, a two-band mobile phone can be easily realized by using this high output voltage controlled oscillator.

  The configuration will be described below. Reference numeral 231 denotes a GSM band phase detector, and its output is input to a control voltage input terminal 233 common to GSM and DCS provided in the package 230 via a low-pass filter 232. The control voltage input to the input terminal 233 is connected to the balanced amplifier circuit 235 via the resonance circuit 234. The output of the balanced amplifier circuit 235 is input to the phase detector 231 via the output terminal 236 as the output of the voltage controlled oscillator. The output of the balanced oscillator 235 is connected to the power amplifier 238 via the matching circuit 237. The output of the power amplifier 238 is connected to an output terminal 239 of GSM. The power amplifying unit 238 has three amplifier circuits 240, 241, and 242 connected in series as in the second embodiment, and the amplifier circuit 240 performs balanced amplification. The balanced amplifier circuit 240 includes a balanced / unbalanced conversion circuit.

  Reference numeral 243 denotes a DCS band phase detector, and its output is input via a synthesizer 232 to an input terminal 233 of a control voltage common to GSM and DCS provided in the package 230. Hereinafter, since the configuration is the same as that of GSM, the subscript a is added to simplify the description.

  Reference numeral 244 denotes a power control circuit. The output of the power control circuit 244 is connected to the amplifier circuits 240 and 240a or 241 and 241a, and further connected to 242 and 242a to control the amplification degree. The amplification degree of the power amplifying units 238 and 238a can be controlled from the power control terminal 245 as in the second embodiment. Couplers 246 and 246a provided on output lines derived from the output terminals 239 and 239a monitor output power.

  Reference numerals 247 and 247a denote heat dissipating units that are thermally connected to the power amplifying units 238 and 238a and connected to the ground of the power amplifying units 238 and 238a. The heat radiating portions 247 and 247 a are led out to the side surface of the package 230. The heat radiation portions 247 and 247a may be provided on the bottom surface of the package 230 and connected to the parent substrate.

  Terminals to the outside of the high output voltage controlled oscillator for GSM and the high output voltage controlled oscillator for DCS are provided at symmetrical positions of the package 230 as shown in FIG. By arranging in this way, the pattern can be easily routed on the parent substrate.

(Embodiment 4)
Further, the voltage controlled oscillation unit and the power amplification unit may be integrated in separate packages. In this case, the voltage controlled oscillation unit SiGe (silicon germanium) technology may be used, and the power amplification unit may be formed using GaP (gallium phosphorus) or GaN (gallium nitrogen) technology.

  By using such a technique, the voltage controlled oscillation unit and the power amplifying unit can be produced by separate techniques, so that the yield is good and the productivity is improved. Moreover, since the yield is good, a low price can be realized.

  In addition, two series of voltage controlled oscillators and power amplifiers are integrated in each package, and when these packages are mounted on a single printed circuit board, a multi-band high output voltage controlled oscillator is obtained. Can be used.

  The high output voltage controlled oscillator according to the present invention can be easily manufactured on a set such as a mobile phone as well as easily manufactured on the set maker side. Thus, it is useful for a mobile phone or a wireless communication device having a high output voltage controlled oscillator.

1 is a block diagram of a high output voltage controlled oscillator according to a first embodiment of the present invention. The same, the circuit diagram which shows the 1st example of inspection means A circuit diagram showing a second example of the inspection means The same, the circuit diagram which shows the 3rd example of inspection means Same as above, Harmonic Rejection Circuit Pattern Same as above, characteristic diagram of harmonic elimination circuit Sectional drawing which shows the 1st example of an interference prevention means Sectional drawing which shows the 2nd example of an interference prevention means Sectional drawing which shows the 3rd example of an interference prevention means A circuit diagram showing a fourth example of the interference prevention means Sectional drawing which shows the 1st example of a thermal radiation means Same as above, top view The top view which shows the 2nd example of a thermal radiation means same as the above Sectional drawing which shows the 3rd example of a heat radiating means Same as above, top view Same basic circuit of matching circuit A circuit diagram showing a first example of the matching circuit A circuit diagram showing a second example of the matching circuit A circuit diagram showing a third example of the matching circuit A block diagram in which two high power voltage controlled oscillators are provided. Same as above, the circuit diagram of the sheet affixed to the lower surface of the high power voltage controlled oscillator Block diagram of a high power voltage controlled oscillator according to a second embodiment of the present invention The block diagram of the high power type voltage controlled oscillator according to the third embodiment Block diagram of a mobile phone using a conventional voltage controlled oscillator

Explanation of symbols

211 Input Terminal 214 Voltage Control Oscillator 217 Power Amplifier 218 Output Terminal

Claims (14)

An input terminal to which a control voltage is input, a voltage controlled oscillation unit to which the control voltage input to the input terminal is supplied, an output of the voltage controlled oscillation unit and a plurality of amplifier circuits connected in series And a power amplification signal output terminal to which the output of the power amplification unit is supplied. The voltage controlled oscillation unit uses a balanced amplification circuit, and the output of the balanced amplification circuit is A balanced / unbalanced conversion circuit is used for the first stage amplifier circuit of the supplied power amplification unit, an unbalanced signal is output from the power amplification unit, and the voltage controlled oscillation unit and the power amplification unit are surface-mounted. High output voltage controlled oscillator housed in one possible multilayer board. 2. The high output voltage controlled oscillator according to claim 1, wherein the power amplifying unit is formed of a three-stage amplifier circuit. The high output voltage controlled oscillator according to claim 1, wherein the voltage controlled oscillator and the power amplifying unit are integrated in one package. 4. The high output voltage controlled oscillator according to claim 3, comprising two series of voltage controlled oscillators and a power amplifier. 4. The high output voltage controlled oscillator according to claim 3, further comprising a heat sink thermally connected to the power amplifying unit, wherein the heat sink is led to the outside as a terminal of the package. 6. The high output voltage controlled oscillator according to claim 5, wherein the terminal led out from the heat radiating plate is formed on a side surface of the package and has a larger size than other terminals. The high output voltage controlled oscillator according to claim 6, wherein a ground signal of the power amplifying unit is connected to a terminal derived from the heat sink. 4. The high output voltage controlled oscillator according to claim 3, further comprising a heat sink thermally connected to the power amplifying unit, and the heat sink is provided on the bottom surface of the package so as to be solderable from the outside. 9. The high output voltage controlled oscillator according to claim 8, wherein a ground signal of the power amplifying unit is connected to a heat radiating plate provided on the bottom surface of the package. 4. The high output voltage controlled oscillator according to claim 3, wherein the ground of the voltage controlled oscillator and the ground of the power amplifying unit are led out of the package independently of each other. The high output voltage controlled oscillator according to claim 1, wherein the power amplifying unit can control the amplification degree from the outside. The high output voltage controlled oscillator according to claim 1, wherein the voltage controlled oscillator and the power amplifying unit are formed of SiGe. 2. The high output according to claim 1, wherein the voltage controlled oscillation unit and the power amplification unit are integrated in separate packages, the voltage controlled oscillation unit is formed of SiGe, and the power amplification unit is formed of GaP. Voltage controlled oscillator. 14. The high output voltage controlled oscillator according to claim 13, wherein two series of voltage controlled oscillators and power amplifiers are integrated in each package, and these packages are mounted on one printed circuit board.

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