JP3900440B2 - Method of forming ceramics film by anode spark discharge - Google Patents
Method of forming ceramics film by anode spark discharge Download PDFInfo
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- JP3900440B2 JP3900440B2 JP12163596A JP12163596A JP3900440B2 JP 3900440 B2 JP3900440 B2 JP 3900440B2 JP 12163596 A JP12163596 A JP 12163596A JP 12163596 A JP12163596 A JP 12163596A JP 3900440 B2 JP3900440 B2 JP 3900440B2
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- Prior art keywords
- film
- spark discharge
- lithium
- silicate
- potassium
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- 238000000034 method Methods 0.000 title claims description 19
- 239000000919 ceramic Substances 0.000 title claims description 13
- 239000007864 aqueous solution Substances 0.000 claims description 12
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 11
- 235000012239 silicon dioxide Nutrition 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910001414 potassium ion Inorganic materials 0.000 claims description 6
- 229910001415 sodium ion Inorganic materials 0.000 claims description 6
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 5
- 229910001416 lithium ion Inorganic materials 0.000 claims description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 42
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 17
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- 239000004111 Potassium silicate Substances 0.000 description 7
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 7
- 229910052913 potassium silicate Inorganic materials 0.000 description 7
- 235000019353 potassium silicate Nutrition 0.000 description 7
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004115 Sodium Silicate Substances 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 4
- 229910052912 lithium silicate Inorganic materials 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229910052911 sodium silicate Inorganic materials 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- PQVSTLUFSYVLTO-UHFFFAOYSA-N ethyl n-ethoxycarbonylcarbamate Chemical compound CCOC(=O)NC(=O)OCC PQVSTLUFSYVLTO-UHFFFAOYSA-N 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- GLXDVVHUTZTUQK-UHFFFAOYSA-M lithium hydroxide monohydrate Substances [Li+].O.[OH-] GLXDVVHUTZTUQK-UHFFFAOYSA-M 0.000 description 3
- 229940040692 lithium hydroxide monohydrate Drugs 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 2
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- WFPITHWLTIRLJL-UHFFFAOYSA-N dilithium 3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane pentahydrate Chemical compound [Li+].[Li+].O.O.O.O.O.[O-]B1OB2OB([O-])OB(O1)O2 WFPITHWLTIRLJL-UHFFFAOYSA-N 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- RKGLUDFWIKNKMX-UHFFFAOYSA-L dilithium;sulfate;hydrate Chemical compound [Li+].[Li+].O.[O-]S([O-])(=O)=O RKGLUDFWIKNKMX-UHFFFAOYSA-L 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- SNKMVYBWZDHJHE-UHFFFAOYSA-M lithium;dihydrogen phosphate Chemical compound [Li+].OP(O)([O-])=O SNKMVYBWZDHJHE-UHFFFAOYSA-M 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003578 releasing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、アルミニウム金属基体表面に陽極火花放電によりセラミックス皮膜を形成させる方法に関するものである。
【従来の技術】
陽極火花放電により基体表面に形成されるセラミックス皮膜は、電気絶縁性、超高真空でのガス放出特性、耐食性、可尭性及び密着性に優れる等種々の特徴を有するので、該火花放電法は近年注目を集める皮膜形成技術となっている。
従って、火花放電を用いて皮膜を形成する方法については、すでに多くの特許が出願されている。例えば、米国特許第3,822,293 号公報、第3,834,999 号公報及び第4,082,626 号公報には、アルカリ金属珪酸塩、アルカリ金属水酸化物と酸素酸触媒等を組み合わせたり、又は単独で水に溶解し、これらの液中で火花放電を行って皮膜を形成する方法が開示されている。又、特公昭58-17278号公報には特殊な電流波形を用いることにより上記米国特許に開示の方法に比べてアルミニウム材表面に効率よく保護皮膜を形成できる方法が開示されている。又、特公昭59-28636号公報及び同59-45722号公報には、電解浴に金属塩などを添加して様々な色調の着色保護皮膜をアルミニウム基材上に形成する方法が開示されている。
さらに特公平3-94077号公報にはセラミックス微粒子を共析し、硬質の皮膜を形成する方法が開示されている。
【0002】
ところが、これらの方法では、先に述べた特徴ある皮膜が形成される反面、得られる皮膜は硬度が低く、さらに電解浴種によっては皮膜表面粗さが大きい、皮膜形成速度が遅くて実用的でない等種々の問題がある。
【発明が解決しようとする課題】
本発明は、硬度、平滑性及び密着性に優れた特性を有するセラミックス皮膜をアルミニウム金属基材表面に効率よく形成できる方法を提供することを目的とする。
【課題を解決するための手段】
本発明は、珪酸根及び/又はコロイド状珪酸、リチウムイオン、及びナトリウムイオン及び/又はカリウムイオンを含有するアルカリ性陽極火花放電用電解浴を用いると、より緻密なセラミックス皮膜を形成することができ、上記課題を効率よく解決できるとの知見に基づいてなされたのである。
すなわち、本発明は、電解浴中で火花放電によりアルミニウム基体表面にセラミックス皮膜を形成させる方法であって、電解浴が、(a) 珪酸根及び/又はコロイド状珪酸、(b) リチウムイオン、及び(c) ナトリウムイオン及び/又はカリウムイオンを含有するアルカリ性水溶液であることを特徴とするセラミックス皮膜形成方法を提供する。
【0003】
【発明の実施の形態】
本発明で用いる電解浴中に珪酸根を提供できる化合物としては、水溶性珪酸又はその塩があげられる。具体的には、一般式M2 О・nSiO2 (Mはアルカリ金属を示し、nは0.5乃至100 の正数を示す)で表される水溶性塩、例えば、珪酸リチウム、珪酸カリウム、珪酸ナトリウムなどがあげられる。本発明では、又、コロイド状珪酸を用いることもできる。
電解浴中の珪酸根の濃度は、珪酸として4g/l以上が好ましく、より好ましくは15〜130g/lである。
本発明で用いる電解浴中にリチウムイオンを提供できる化合物としては、水酸化リチウム、硫酸リチウム、4ホウ酸リチウム、珪酸リチウム、硝酸リチウム、リン酸2水素リチウム等の水溶性リチウム化合物があげられる。これらのうち、水酸化リチウムが好ましい。
電解浴中のリチウムイオンの濃度は、リチウムとして0.5〜50g/lが好ましく、より好ましくは1〜30g/lである。
【0004】
本発明で用いる電解浴中にナトリウムイオン及び/又はカリウムイオンを提供できる化合物としては、水酸化ナトリウム、水酸化カリウム、珪酸ナトリウム、珪酸カリウム、リン酸ナトリウム、リン酸カリウム、ホウ酸ナトリウム、ホウ酸カリウムなどの各種水溶性ナトリウム塩及びカリウム塩があげられる。これらのうち、特に水酸化ナトリウム及び/又は水酸化カリウムが好ましい。
電解浴中のナトリウムイオン及び/又はカリウムイオンの濃度は、それぞれナトリウムやカリウムとして、0.5〜100g/lが好ましく、より好ましくは1〜50g/lである。
本発明では、さらに上記成分を含有する電解浴をアルカリ性水溶液に調製する。PHは13〜14の範囲が特に好ましい。
本発明では、上記成分を必須とするが、この他に、Ni、Co、Zn、Ca、Ba、Mg、Pb、Cr、W等の金属イオンを可溶性の塩の形で、1種ないし2種以上添加することができる。
【0005】
通常これらの金属基材に火花放電皮膜を形成する場合、特に前処理を行わなくともよいが、脱脂、エッチング、酸洗等により充分に清浄化しておくのが望ましい。
本発明の電解浴を用いて、金属基材に火花放電皮膜を形成する場合、陰極に、鉄、ステンレス鋼、Ni、カーボン等不溶性電極を用いるのがよく、陽極を対象とする金属基体とする。火花放電を行う際の浴温は、5〜90℃が好ましく、より好ましくは15〜60℃である。低温では火花放電による皮膜の形成速度が遅くなり、一方高温では形成された皮膜が不均一となり易いためである。
電流密度が低いと皮膜の形成速度が遅く高すぎると高電流部の皮膜表面粗さが増すため、0.2〜20A/dm2 で行うのがよく、より好ましくは1〜5A/dm2 である。
整流器の出力は任意の波形の直流でよいが、パルス波形(矩形波波形)、ノコギリ波形又は直流半波波形が好ましい。
電解時間は希望する膜厚により決定するが、膜厚が薄い場合には皮膜本来の性能が発揮されないため、5分以上電解するのが好ましい。通常、10〜60分の電解で実用的な皮膜、例えば5〜80μm厚の皮膜が得られる。
【0006】
【発明の効果】
本発明によれば、硬度が高く、平滑性に優れ、ヒートサイクルに強いセラミックス皮膜を有するアルミニウム金属材を効率よく製造することができる。
従って、本発明の方法により半導体製造装置の上部電極、反応容器のシュラウド或いはチャンバー等にセラミックス皮膜を施すとガス放出性及び耐食性に優れる装置にすることができる。
さらに、アルミニウム製ヒーターにセラミックス皮膜を施すと遠赤外放射特性に優れ、かつ打痕等に堅牢な遠赤外放射体とすることができる。
次に実施例により本発明を説明する。
【0007】
【実施例】
実施例1
アルミニウム板を脱脂、アルカリエッチング、活性化処理して清浄化した後、陽極として用い、ステンレス鋼板を陰極とし、珪酸リチウム35(日本化学工業(株)製)を80g/l、水酸化リチウム1水和物5g/l、水酸化カリウム15g/lの水溶液(pH13.1)中で火花放電させた。20℃、1A/dm2 で20分間の火花放電により、20μmの皮膜が得られた。
実施例2
実施例1と同様の陽極と陰極をもちい、A珪酸カリウム(日本化学工業(株)製)120g/l、水酸化リチウム1水和物20g/l、水酸化カリウム15g/lの水溶液(pH13.4)中で浴温15℃、2A/dm2 の電流を10分間通電させた。その結果、陽極板上に火花放電が生じ、平均膜厚25μmの皮膜が得られた。
【0008】
実施例3
実施例1と同様の陽極と陰極を用い、J珪酸ナトリウム3号(日本化学工業(株)製)60g/l、水酸化リチウム1水和物20g/l、水酸化ナトリウム5g/lの水溶液(pH13.2)中で浴温30℃、1A/dm2 の電流を20分間通電させた。その結果、陽極板上に火花放電が生じ、平均膜厚15μmの皮膜が得られた。
【0009】
実施例4
実施例1と同様の陽極と陰極をもちい、A珪酸カリウム(日本化学工業(株)製)60g/l、硫酸リチウム1水和物5g/l、水酸化カリウム15g/lの水溶液(pH13.0)中で浴温25℃、1A/dm2 の電流を30分間通電させた。その結果、陽極板上に火花放電が生じ、平均膜厚10μmの皮膜が得られた。
実施例5
実施例1と同様の陽極と陰極をもちい、A珪酸カリウム(日本化学工業(株)製)60g/l、4ホウ酸リチウム5水和物5g/l、水酸化カリウム20g/lの水溶液(pH13.2)中で浴温25℃、0.5A/dm2 の電流を40分間通電させた。その結果、陽極板上に火花放電が生じ、平均膜厚15μmの皮膜が得られた。
【0010】
比較例1
実施例1と同様の陽極と陰極をもちい、A珪酸カリウム(日本化学工業(株)製)200g/lの水溶液(pH11.5)中で浴温30℃、1A/dm2 の電流を20分間通電させた。その結果、陽極板上に火花放電が生じ、平均膜厚40μmの皮膜が得られた。
比較例2
実施例1と同様の陽極と陰極をもちい、珪酸リチウム35(日本化学工業(株)製)90g/l及び水酸化リチウム1水和物15g/lの水溶液(pH12.9)中で浴温30℃、1A/dm2 の電流を20分間通電させた。その結果、陽極板上に火花放電が生じ、平均膜厚20μmの皮膜が得られた。
【0011】
比較例3
実施例1と同様の陽極と陰極をもちい、J珪酸ナトリウム3号(日本化学工業(株)製)60g/l、水酸化カリウム5g/lの水溶液(pH12.3)中で浴温25℃、1A/dm2 の電流を30分間通電させた。その結果、陽極板上に火花放電が生じ、平均膜厚20μmの皮膜が得られた。
上記の方法で得られた皮膜の特性を次の方法で求めた。結果をまとめて表−1に示す。
比較例4
実施例1と同様の陽極と陰極をもちい、A珪酸カリウム(日本化学工業(株)製)90g/l、水酸化カリウム20g/lの水溶液(pH13.1)中で浴温25℃、1A/dm2 の電流で30分間通電させた。その結果、陽極板上に火花放電は発生したが、皮膜は形成しなかった。
膜厚
渦電流方式厚み計、パーマスコープE110B 型(Fischer製)で測定した。
【0012】
硬度
試験板を110℃で1時間乾燥、放冷した後、先端を平に研ぎ、角を鋭くした鉛筆を基板に対して45度の角度で皮膜に強く押しつけ均一な早さで(3cm/秒)動かした。5回試験を繰り返し、4回以上破れなかった場合の鉛筆の硬さで示した。
平滑性
表面粗さ試験機、サーフコーダSE-30H(株式会社小坂研究所製)で測定した。密着性
ヒートサイクル試験により下記の基準で密着性を測定した。条件は、200 ℃(30min)−放冷−液体窒素(30min)を3サイクルである。
○ 剥離が生じない。
× 若干でも剥離した。
【0013】
【表1】
表−1
珪酸塩 濃度 リチウム 濃度 Na又はK 濃度 基板
(g/l) (g/l) (g/l) 種類
1 珪酸Li35 80 LiOH・H2O 5 KOH 15 Al
2 A珪酸K 120 LiOH・H2O 20 KOH 15 Al
3 J珪酸Na3号 60 LiOH・H2O 20 NaOH 5 Al
4 A珪酸K 60 Li2SO4・H2O 5 KOH 15 Al
5 A珪酸K 60 Li 2 B 4 O 7 ・ 5H 2 O 5 KOH 20 Al
6* A珪酸K 200 ─── ── ─── ── Al
7* 珪酸Li35 90 LiOH・H2O 15 ─── ── Al
8* J珪酸Na3号 60 ─── ── KOH 5 Al
9 * A珪酸K 90 ─── ── KOH 20 Al
上記1〜5は、それぞれ実施例1〜5に対応し、6*〜9* は、それぞれ比較例1〜4に対応する(以下、同じ)。
【0014】
【表2】
表−1(続き)
電流密度 電解時間 浴温 皮膜厚さ 硬度 表面粗さ 密着性
(A/dm 2 ) (min) ( ℃ ) ( μ m) (H) Ra ( μ m)
1 1 20 20 20 7 2.0 ○
2 2 10 15 25 7 2.2 ○
3 1 20 30 15 6 1.7 ○
4 1 30 25 10 6 2.4 ○
5 0.5 40 25 15 7 2.2 ○
6* 1 20 30 40 3 5.2 ○
7* 1 20 30 20 5 2.5 ×
8* 1 30 25 20 3 2.7 ○
9* 1 30 25 皮膜形成 ── ── −
せず
表−1の結果から明らかなように、実施例1〜5の方法によればリチウムを加えない比較例1(6* )や比較例3(8* )に比べて、得られる皮膜の硬さと平滑性が優れており、ナトリウムイオンやカリウムイオンを用いない比較例2(7* )に比べて、得られる皮膜の密着性が優れることがわかる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for forming a ceramic film on the surface of an aluminum metal substrate by anodic spark discharge.
[Prior art]
The ceramic film formed on the substrate surface by anode spark discharge has various characteristics such as excellent electrical insulation, gas release characteristics in ultra-high vacuum, corrosion resistance, flexibility and adhesion. In recent years, it has become a film formation technology that has attracted attention.
Therefore, many patents have already been filed for methods of forming a film using spark discharge. For example, in U.S. Pat.Nos. 3,822,293, 3,834,999, and 4,082,626, alkali metal silicates, alkali metal hydroxides and oxyacid catalysts are combined or dissolved alone in water. A method for forming a film by spark discharge in liquid is disclosed. Japanese Patent Publication No. 58-17278 discloses a method of forming a protective film on the surface of an aluminum material more efficiently by using a special current waveform as compared with the method disclosed in the above US patent. Japanese Patent Publication Nos. 59-28636 and 59-45722 disclose a method for forming a colored protective film of various colors on an aluminum substrate by adding a metal salt or the like to an electrolytic bath. .
Further, Japanese Patent Publication No. 3-94077 discloses a method for forming a hard film by eutectoid ceramic fine particles.
[0002]
However, in these methods, the characteristic film described above is formed, but the film obtained is low in hardness, and depending on the type of electrolytic bath, the film surface roughness is large, and the film formation rate is slow, which is not practical. There are various problems.
[Problems to be solved by the invention]
An object of this invention is to provide the method of forming efficiently the ceramic membrane | film | coat which has the characteristic excellent in hardness, smoothness, and adhesiveness on the surface of an aluminum metal base material.
[Means for Solving the Problems]
The present invention can form a denser ceramic film using an alkaline anodic spark discharge electrolytic bath containing silicate radicals and / or colloidal silicic acid, lithium ions, and sodium ions and / or potassium ions, It was made based on the knowledge that the above problems can be solved efficiently.
That is, the present invention is a method of forming a ceramic film on the surface of an aluminum substrate by spark discharge in an electrolytic bath, the electrolytic bath comprising (a) silicate radicals and / or colloidal silicic acid, (b) lithium ions, and (c) Provided is a method for forming a ceramic film, which is an alkaline aqueous solution containing sodium ions and / or potassium ions.
[0003]
DETAILED DESCRIPTION OF THE INVENTION
Examples of the compound capable of providing a silicate radical in the electrolytic bath used in the present invention include water-soluble silicic acid or a salt thereof. Specifically, a water-soluble salt represented by the general formula M 2 O · nSiO 2 (M represents an alkali metal and n represents a positive number of 0.5 to 100), for example, lithium silicate, potassium silicate, Examples include sodium silicate. In the present invention, colloidal silicic acid can also be used.
The concentration of the silicate radical in the electrolytic bath is preferably 4 g / l or more, more preferably 15 to 130 g / l as silicic acid.
Examples of the compound capable of providing lithium ions in the electrolytic bath used in the present invention include water-soluble lithium compounds such as lithium hydroxide, lithium sulfate, lithium tetraborate, lithium silicate, lithium nitrate, and lithium dihydrogen phosphate. Of these, lithium hydroxide is preferred.
The concentration of lithium ions in the electrolytic bath is preferably 0.5 to 50 g / l, more preferably 1 to 30 g / l as lithium.
[0004]
Examples of the compound capable of providing sodium ion and / or potassium ion in the electrolytic bath used in the present invention include sodium hydroxide, potassium hydroxide, sodium silicate, potassium silicate, sodium phosphate, potassium phosphate, sodium borate, boric acid. Examples include various water-soluble sodium salts and potassium salts such as potassium. Of these, sodium hydroxide and / or potassium hydroxide are particularly preferable.
The concentration of sodium ions and / or potassium ions in the electrolytic bath is preferably 0.5 to 100 g / l, more preferably 1 to 50 g / l, as sodium or potassium, respectively.
In the present invention, an electrolytic bath further containing the above components is prepared in an alkaline aqueous solution. PH is particularly preferably in the range of 13-14.
In the present invention, the above components are essential, but in addition to these, one or two kinds of metal ions such as Ni, Co, Zn, Ca, Ba, Mg, Pb, Cr, and W in the form of soluble salts. More can be added.
[0005]
In general, when a spark discharge film is formed on these metal substrates, pretreatment is not particularly required, but it is desirable that the metal substrate is sufficiently cleaned by degreasing, etching, pickling, or the like.
When a spark discharge film is formed on a metal substrate using the electrolytic bath of the present invention, an insoluble electrode such as iron, stainless steel, Ni, or carbon is preferably used for the cathode, and the anode is used as a metal substrate. . The bath temperature at the time of spark discharge is preferably 5 to 90 ° C, more preferably 15 to 60 ° C. This is because at low temperatures, the rate of film formation by spark discharge is slow, whereas at high temperatures, the formed film tends to be non-uniform.
If the current density is low, the film formation rate is too slow, and if the current density is too high, the film surface roughness of the high current portion increases, so it is preferable to carry out at 0.2 to 20 A / dm 2 , more preferably 1 to 5 A / dm 2 . is there.
The output of the rectifier may be a direct current having an arbitrary waveform, but a pulse waveform (rectangular waveform), a sawtooth waveform, or a direct current half wave waveform is preferable.
The electrolysis time is determined by the desired film thickness, but when the film thickness is thin, the original performance of the film is not exhibited, and it is preferable to perform electrolysis for 5 minutes or more. Usually, a practical film, for example, a film having a thickness of 5 to 80 μm, is obtained by electrolysis for 10 to 60 minutes.
[0006]
【The invention's effect】
According to the present invention, it is possible to efficiently produce an aluminum metal material having a ceramic film having high hardness, excellent smoothness, and strong heat cycle.
Therefore, when a ceramic film is applied to the upper electrode of the semiconductor manufacturing apparatus, the shroud of the reaction vessel, the chamber, or the like by the method of the present invention, the apparatus can be made excellent in gas releasing properties and corrosion resistance.
Furthermore, when a ceramic film is applied to an aluminum heater, a far-infrared radiator excellent in far-infrared radiation characteristics and robust to dents or the like can be obtained.
Next, an example explains the present invention.
[0007]
【Example】
Example 1
After degreasing, alkaline etching, activation treatment and cleaning of the aluminum plate, it was used as an anode, a stainless steel plate as a cathode, lithium silicate 35 (manufactured by Nippon Chemical Industry Co., Ltd.) 80 g / l, lithium hydroxide 1 water Spark discharge was carried out in an aqueous solution (pH 13.1) of 5 g / l of a Japanese product and 15 g / l of potassium hydroxide. A 20 μm film was obtained by spark discharge at 20 ° C. and 1 A / dm 2 for 20 minutes.
Example 2
The same anode and cathode as in Example 1 were used. A potassium silicate (manufactured by Nippon Chemical Industry Co., Ltd.) 120 g / l, lithium hydroxide monohydrate 20 g / l, potassium hydroxide 15 g / l in an aqueous solution (pH 13. 4) A bath temperature of 15 ° C. and a current of 2 A / dm 2 were applied for 10 minutes. As a result, spark discharge occurred on the anode plate, and a film having an average film thickness of 25 μm was obtained.
[0008]
Example 3
Using the same anode and cathode as in Example 1, an aqueous solution of J sodium silicate 3 (manufactured by Nippon Chemical Industry Co., Ltd.) 60 g / l, lithium hydroxide monohydrate 20 g / l, sodium hydroxide 5 g / l ( In pH 13.2), a bath temperature of 30 ° C. and a current of 1 A / dm 2 were applied for 20 minutes. As a result, spark discharge occurred on the anode plate, and a film having an average film thickness of 15 μm was obtained.
[0009]
Example 4
Using the same anode and cathode as in Example 1, A aqueous solution of potassium silicate (Nihon Kagaku Kogyo Co., Ltd.) 60 g / l, lithium sulfate monohydrate 5 g / l, potassium hydroxide 15 g / l (pH 13.0) ), A bath temperature of 25 ° C. and a current of 1 A / dm 2 were applied for 30 minutes. As a result, spark discharge occurred on the anode plate, and a film having an average film thickness of 10 μm was obtained.
Example 5
The same anode and cathode as in Example 1 were used. A potassium silicate (manufactured by Nippon Chemical Industry Co., Ltd.) 60 g / l, lithium borate pentahydrate 5 g / l, potassium hydroxide 20 g / l in aqueous solution (pH 13) In 2), a bath temperature of 25 ° C. and a current of 0.5 A / dm 2 were applied for 40 minutes. As a result, spark discharge occurred on the anode plate, and a film having an average film thickness of 15 μm was obtained.
[0010]
Comparative Example 1
Using the same anode and cathode as in Example 1, a potassium silicate (Nihon Kagaku Kogyo Co., Ltd.) 200 g / l aqueous solution (pH 11.5) with a bath temperature of 30 ° C. and a current of 1 A / dm 2 for 20 minutes. Energized. As a result, spark discharge occurred on the anode plate, and a film having an average film thickness of 40 μm was obtained.
Comparative Example 2
Using the same anode and cathode as in Example 1, the bath temperature was 30 in an aqueous solution (pH 12.9) of 90 g / l of lithium silicate 35 (manufactured by Nippon Chemical Industry Co., Ltd.) and 15 g / l of lithium hydroxide monohydrate. A current of 1 A / dm 2 at 20 ° C. was applied for 20 minutes. As a result, spark discharge occurred on the anode plate, and a film having an average film thickness of 20 μm was obtained.
[0011]
Comparative Example 3
Using the same anode and cathode as in Example 1, sodium silicate No. 3 (manufactured by Nippon Chemical Industry Co., Ltd.) 60 g / l, potassium hydroxide 5 g / l in an aqueous solution (pH 12.3), bath temperature 25 ° C., A current of 1 A / dm 2 was applied for 30 minutes. As a result, spark discharge occurred on the anode plate, and a film having an average film thickness of 20 μm was obtained.
The characteristics of the film obtained by the above method were determined by the following method. The results are summarized in Table 1.
Comparative Example 4
Using the same anode and cathode as in Example 1, a potassium silicate (manufactured by Nippon Chemical Industry Co., Ltd.) 90 g / l, potassium hydroxide 20 g / l in an aqueous solution (pH 13.1), bath temperature 25 ° C., 1 A / An electric current of dm 2 was applied for 30 minutes. As a result, spark discharge occurred on the anode plate, but no film was formed.
Film thickness Measured with an eddy current method thickness meter, Permascope E110B type (Fischer).
[0012]
Hardness The test plate was dried at 110C for 1 hour and allowed to cool, then the tip was sharpened flatly and a sharpened corner was strongly pressed against the film at a 45 degree angle with respect to the substrate at a uniform speed. Moved (3 cm / sec). The test was repeated 5 times, and it was shown by the hardness of the pencil when it was not broken more than 4 times.
Smoothness Measured with a surface roughness tester, Surfcorder SE-30H (manufactured by Kosaka Laboratory Ltd.). Adhesiveness Adhesiveness was measured according to the following criteria by a heat cycle test. The conditions are three cycles of 200 ° C. (30 min) -cooling-liquid nitrogen (30 min).
○ No peeling occurs.
X Even a little peeled.
[0013]
[Table 1]
Table-1
Silicate concentration Lithium concentration Na or K concentration Substrate
(g / l) (g / l) (g / l) type
1 Silicic acid Li35 80 LiOH ・ H 2 O 5 KOH 15 Al
2 A Silicic acid K 120 LiOH ・ H 2 O 20 KOH 15 Al
3 J Silicic acid Na3 60 LiOH ・ H 2 O 20 NaOH 5 Al
4 A Silica K 60 Li 2 SO 4・ H 2 O 5 KOH 15 Al
5 A Silica K 60 Li 2 B 4 O 7 ・ 5H 2 O Five KOH 20 Al
6 * A Silica K 200 ─── ── ─── ── Al
7 * Silicic acid Li35 90 LiOH ・ H 2 O 15 ─── ── Al
8 * J Silicate No.3 60 ─── ── KOH 5 Al
9 * A Silicic acid K 90 ─── ── KOH 20 Al
The 1-5 respectively correspond to Examples 1 5 6 * to 9 * correspond to the respective Comparative Examples 1-4 (hereinafter, the same).
[0014]
[Table 2]
Table 1 (continued)
Current density Electrolysis time Bath temperature Film thickness Hardness Surface roughness Adhesion
(A / dm 2 ) (min) ( ° C ) ( μm ) (H) Ra ( μm )
1 1 20 20 20 7 2.0 ○
2 2 10 15 25 7 2.2 ○
3 1 20 30 15 6 1.7 ○
4 1 30 25 10 6 2.4 ○
5 0.5 40 twenty five 15 7 2.2 ○
6 * 1 20 30 40 3 5.2 ○
7 * 1 20 30 20 5 2.5 ×
8 * 1 30 25 20 3 2.7 ○
9 * 1 30 25 Film formation ── ── −
Without
As is apparent from the results in Table 1, according to the methods of Examples 1 to 5 , the hardness of the obtained film is higher than that of Comparative Example 1 ( 6 *) and Comparative Example 3 ( 8 *) in which lithium is not added. It can be seen that the smoothness is excellent and the adhesiveness of the resulting film is excellent as compared with Comparative Example 2 ( 7 *) which does not use sodium ion or potassium ion.
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12163596A JP3900440B2 (en) | 1996-05-16 | 1996-05-16 | Method of forming ceramics film by anode spark discharge |
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|---|---|---|---|
| JP12163596A JP3900440B2 (en) | 1996-05-16 | 1996-05-16 | Method of forming ceramics film by anode spark discharge |
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