JP3901866B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention rotates a glass substrate for a liquid crystal display device, a substrate for a color filter, a printed wiring board, a substrate for a plasma display panel, a semiconductor substrate, a glass substrate for a photomask, a reticle (hereinafter simply referred to as “substrate”). The present invention relates to a substrate processing apparatus that performs a predetermined process such as a resist coating process.
[0002]
[Prior art]
In general, a series of substrate processing is achieved by sequentially performing resist coating processing, exposure processing, development processing, and heat treatment associated therewith on the above-described substrates. The series of substrate processing is performed by transporting a substrate by a transport mechanism between substrate processing apparatuses that perform each processing such as resist coating processing.
[0003]
2. Description of the Related Art Conventionally, a transport mechanism that travels above a plurality of substrate processing apparatuses arranged in series has been used. When performing a series of substrate processing, it is necessary to perform a substrate delivery operation between the substrate processing apparatus and the transport mechanism, and when the transport mechanism does not have a vertical movement mechanism, the substrate processing apparatus moves the substrate up and down. By doing so, the delivery operation is performed.
[0004]
FIG. 11 is a schematic diagram of a main part of a conventional substrate processing apparatus. The substrate holding unit 110 that holds the substrate in a horizontal posture is supported by a rotating shaft 115 provided along the vertical direction, and performs a rotating operation as the rotating shaft 115 rotates. The rotating shaft 115 is connected to the air cylinder 120 via a support member 121. Thereby, in accordance with the expansion and contraction operation of the air cylinder 120, a rotation processing position (a solid line position in the drawing) for performing the rotation processing of the substrate, and a delivery position (a two-dot chain line position in the drawing) for delivering the substrate to the transport mechanism. The substrate holder 110 moves up and down.
[0005]
That is, the substrate holder 110 that has received the substrate from the transport mechanism at the delivery position is lowered to the rotation processing position. When the rotation processing of the substrate is completed, the substrate holding unit 110 rises from the rotation processing position to the delivery position, and transfers the substrate to the transport mechanism. By repeating such operations, the substrates are sequentially processed.
[0006]
[Problems to be solved by the invention]
However, conventionally, the raising / lowering operation is performed by the air cylinder 120, and the raising / lowering operation pattern of the substrate holder 110 is always constant. For this reason, the following problems have arisen.
[0007]
First, since the lifting / lowering operation pattern of the substrate holding unit 110 is constant and the substrate holding unit 110 moves up and down at high speed even in the vicinity of the rotation processing position, the particles attached to the cup 130 or the like are held by the substrate holding unit 110 or the same. A problem arises in that the substrate is wound up by an air flow generated by the vertical movement of the substrate and adheres to the substrate and the substrate holding unit 110 and is contaminated. In order to avoid this, a method of lowering the lifting / lowering speed of the substrate holding unit 110 is conceivable, but in this case, it takes a long time for the lifting / lowering operation of the substrate, which in turn increases the time required for the entire substrate processing. Become.
[0008]
Further, for example, in an apparatus that performs a liquid coating process such as resist coating, in addition to the rotation processing position and the delivery position described above, a coating position for performing a coating process by a slit nozzle is provided as the stop position of the substrate holding unit 110. There is. In such a case, as shown in FIG. 12, another air cylinder 125 is connected in series with the air cylinder 120, and the two air cylinders are driven independently, so that the substrate holding portion 110 has three height positions. It was made to stop at (rotation processing position, delivery position, application position). However, when two air cylinders are connected, the mechanism becomes complicated, and adjustment of the stop position of the substrate holding part 110 becomes extremely difficult.
[0009]
In the apparatus for performing the liquid coating process, the liquid is supplied to the substrate by the slit nozzle 140 scanning in the horizontal direction while discharging the liquid above the substrate held by the substrate holding unit 110. In this case, it is necessary for the slit nozzle 140 to perform scanning while maintaining a certain distance from the substrate in order to maintain processing uniformity. However, since the raising / lowering operation pattern of the substrate holding unit 110 is constant, the stop position of the substrate holding unit 110 is also always constant, and when the thickness of the substrate to be processed is changed, the slit nozzle 140 and the substrate In order to keep the distance constant, a complicated operation such as using a stopper member to change the stop position of the air cylinder 120 is required.
[0010]
Further, a plurality of air driving units (for example, air cylinders) driven by air are often used in one substrate processing apparatus, and many are used in other substrate processing apparatuses. Always. Depending on the operation timing of these many air drive units, the flow rate of the air supplied to the air cylinder 120 may fluctuate and the operation of the air cylinder 120 may become unstable. May affect.
[0011]
The present invention has been made in view of the above problems, and provides a substrate processing apparatus capable of preventing particles from adhering to a substrate or the like while suppressing an increase in operating time when the substrate holding unit is moved up and down. The purpose is to provide.
[0012]
It is another object of the present invention to provide a substrate processing apparatus that can easily adjust the position of the substrate holding unit without performing complicated operations.
[0013]
Furthermore, an object of the present invention is to provide a substrate processing apparatus that can stably move the substrate holding unit up and down without being affected by changes in the air flow rate.
[0014]
[Means for Solving the Problems]
In order to solve the above problems, the invention of claim 1 After the coating process Rotate the board Let rotate A substrate processing apparatus for performing (a) a substrate The water A substrate holding unit that holds the substrate in a flat posture and performs a rotation operation; and (b) the substrate holding unit, Below the delivery position The slit nozzle scans the substrate Said Application position for application processing and Below the application position Elevating means for elevating between rotation processing positions for rotating the substrate while being surrounded by a cup; and (c) Below the application position and above the rotation processing position The raising / lowering speed of the substrate holding part in the region from the height position of the upper end of the cup to the rotation processing position is made slower than the raising / lowering speed in the other region, and the substrate holding part in the application position Control means for controlling the elevating means so that the stop position can be changed.
[0016]
Claims 2 The invention of claim 1 The substrate processing apparatus according to the present invention further includes (d) an input unit that inputs an elevation operation pattern of the substrate holding unit, and the control unit elevates the substrate holding unit according to the input elevation operation pattern. The elevating means is controlled as described above.
[0017]
Claims 3 The invention of Claim 1 or claim 2 In the substrate processing apparatus according to the invention, a motor is included in the lifting means.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0019]
<First Embodiment>
FIG. 1 is a schematic configuration diagram of an essential part of a first embodiment of a substrate processing apparatus according to the present invention. This apparatus is an apparatus for supplying a photoresist to a substrate and rotating it to perform a resist coating process.
[0020]
The substrate processing apparatus according to the first embodiment includes a substrate holding unit 10 that holds a substrate W, a pulse control type motor 20 that moves up and down the substrate W and the substrate holding unit 10, and a control unit that controls the operation of the apparatus. 12 and an operation panel 13 as input means for inputting a lifting operation pattern of the substrate holder 10.
[0021]
The substrate holding unit 10 holds the substrate W in a horizontal posture by vacuum suction. The board | substrate holding | maintenance part 10 is supported by the rotating shaft 15 provided along the perpendicular direction. The rotating shaft 15 is rotationally driven by the rotating mechanism 14. That is, the substrate holding unit 10 performs the rotation operation by the rotation mechanism 14 while holding the substrate W in a horizontal posture.
[0022]
The bottom of the rotating shaft 15 is rotatably supported by the chuck support portion 11. The chuck support 11 is screwed to the ball screw 21 of the pulse control motor 20 via a plurality of balls. When the pulse control type motor 20 rotates the ball screw 21 in the forward or reverse direction, the chuck support 11 moves up and down accordingly. That is, the pulse control type motor 20 moves the chuck support part 11 and the substrate holding part 10 up and down by a so-called ball screw mechanism.
[0023]
In the first embodiment, a servo motor or a stepping motor is applied as the pulse control type motor 20. Each of the motors is a motor driven by giving a pulse signal, and is a motor capable of controlling the rotation speed and the rotation angle by adjusting the interval and the number of pulses. However, the servo motor is different from the stepping motor in that it includes a feedback circuit based on the measurement result by the encoder.
[0024]
The control unit 12 is configured using a computer and is electrically connected to the rotation mechanism 14 and the pulse control type motor 20 to control these operations. Therefore, the rotation speed and rotation angle of the pulse control type motor 20 are controlled by the control unit 12.
[0025]
The operation panel 13 is a panel for an operator to input a lifting / lowering operation pattern of the substrate holding unit 10 from the outside of the apparatus. The lifting / lowering operation pattern input from the operation panel 13 is transmitted to the control unit 12. And the control part 12 controls the pulse control type motor 20 based on the transmitted raising / lowering operation pattern.
[0026]
The operation of the substrate processing apparatus according to the first embodiment having the above configuration will be briefly described. First, an unprocessed substrate W is received from a transport mechanism (not shown) in a state where the substrate holding unit 10 is raised to the delivery position TP. When the substrate holding unit 10 receives the substrate W, the pulse-controlled motor 20 rotates the ball screw 21 based on a signal from the control unit 12. As the ball screw 21 rotates, the chuck support portion 11, the substrate holding portion 10, and the substrate W are lowered.
[0027]
At this time, the control unit 12 controls the pulse control type motor 20 based on the lifting / lowering operation pattern of the substrate holding unit 10 input from the operation panel 13 in advance. Then, the control unit 12 controls the pulse control type motor 20 so that the substrate holding unit 10 stops the descent at the application position CP.
[0028]
When the substrate holding unit 10 stops descending at the application position CP, the slit nozzle 18 starts to move in the horizontal direction, scans the substrate W while discharging the photoresist, and supplies the photoresist to the substrate W. When the supply of the photoresist to the substrate W is finished, the pulse control type motor 20 lowers the substrate holding unit 10 and the substrate W again based on the signal from the control unit 12.
[0029]
Also at this time, the control unit 12 controls the pulse control type motor 20 based on the lifting / lowering operation pattern of the substrate holding unit 10 input from the operation panel 13. FIG. 8 is a diagram illustrating an example of a lifting / lowering operation pattern of the substrate holding unit 10. As shown by the solid line portion in the figure, the descent speed of the substrate holding unit 10 is accelerated at a constant acceleration from the movement start position, that is, the application position CP, and when the predetermined speed is reached, the substrate holding unit 10 is temporarily moved at the descent speed. Is lowered. Thereafter, before the movement stop position, that is, before the rotation processing position RP, the lowering speed of the substrate holding unit 10 is decelerated at a constant acceleration, and the substrate holding unit 10 is eventually stopped at the rotation processing position RP. Further, as the up-and-down movement pattern of FIG. 8, for example, as shown by the dotted line portion of the graph, after the descent speed is decelerated at a constant acceleration before the rotation processing position RP, the deceleration is temporarily stopped and the rotation processing position RP is stopped. It is good also as the raising / lowering operation pattern which decelerates with a fixed acceleration to a stop position again after maintaining constant speed for the predetermined time in the vicinity. Furthermore, the raising / lowering operation pattern in FIG. 8 is not limited to these, and the raising / lowering speed at least when the substrate holding unit 10 is located in the vicinity of the rotation processing position RP is slower than the raising / lowering speed at the time other than the vicinity of the rotation processing position RP. What is necessary is just to set it as the raising / lowering operation pattern which becomes.
[0030]
When the substrate holding unit 10 is lowered to the rotation processing position RP, the rotation mechanism 14 rotates the substrate holding unit 10 and the substrate W based on an instruction from the control unit 12. As the substrate W rotates, the photoresist supplied thereon is spread by centrifugal force and uniformly applied onto the surface of the substrate W. Note that the photoresist scattered by the rotation of the substrate W is collected in a cup 16 disposed around the substrate holding unit 10 at the rotation processing position RP.
[0031]
When the rotation processing of the substrate W is completed, the pulse control type motor 20 raises the substrate holding unit 10 and the substrate W from the rotation processing position RP to the delivery position TP based on a signal from the control unit 12. Also at this time, the control unit 12 controls the pulse control type motor 20 based on the lifting / lowering operation pattern of the substrate holding unit 10 as shown in FIG. That is, the ascending speed of the substrate holding unit 10 is accelerated at a constant acceleration from the movement start position (rotation processing position RP), and when reaching a predetermined speed, the substrate holding unit 10 is temporarily raised at the rising speed. Thereafter, before the movement stop position (delivery position TP), the ascending speed of the substrate holder 10 is decelerated at a constant acceleration, and the substrate holder 10 is eventually stopped at the delivery position TP. In addition, as shown in the dotted line portion of the graph, for example, as shown in the dotted line portion of the graph, the vertical movement pattern shown in FIG. 9 is a constant acceleration after maintaining a constant speed at a low speed in the vicinity of the rotation processing position RP. It is good also as a speed pattern which accelerates the raising speed of the board | substrate holding | maintenance part 10 and reaches the speed of the continuous line part shown in FIG. Furthermore, this lifting / lowering operation pattern is not limited to these, and the lifting / lowering speed at least when the substrate holding unit 10 is positioned in the vicinity of the rotation processing position RP is slower than the lifting / lowering speed when it is positioned outside the rotation processing position RP. What is necessary is just like the above-mentioned raising / lowering operation pattern.
[0032]
Thereafter, the substrate W is transferred from the substrate holder 10 to the transport mechanism, and the resist coating process is completed.
[0033]
As described above, the substrate processing apparatus according to the first embodiment uses the pulse control type motor 20 capable of controlling the rotation speed and the rotation angle as the substrate holding unit 10 and the lifting means for the substrate W, and the control unit 12 rotates the rotation. Controls speed and rotation angle. The rotational speed of the pulse control type motor 20 becomes the rotational speed of the ball screw 21 as it is, and defines the elevation speed of the substrate holder 10. Further, the rotation angle of the pulse control type motor 20 becomes the rotation angle of the ball screw 21 as it is, and defines the raising / lowering stop position of the substrate holding unit 10. In other words, in the substrate processing apparatus of the first embodiment, the control unit 12 controls the pulse control type motor 20 to change the ascending / descending speed of the substrate holding unit 10 and to arbitrarily stop the substrate holding unit 10. It stops at the position.
[0034]
Accordingly, if the control unit 12 controls the rotation speed of the pulse control type motor 20 based on the lifting / lowering operation pattern as shown in FIG. 8 or FIG. 9, at least when the substrate holding unit 10 is located in the vicinity of the rotation processing position RP. The ascending / descending speed is slower than the ascending / descending speed when the position is located near the rotation processing position RP. In the vicinity of the rotation processing position RP, the substrate holding unit 10 moves up and down at a relatively low speed, so that the generation of airflow due to the vertical movement of the substrate holding unit 10 or the substrate W held by the substrate holding unit 10 is suppressed, and particles adhering to the cup 16 and the like Winding is prevented. As a result, it is possible to prevent particles from adhering to the substrate W or the like when the substrate holding unit 10 is moved up and down. The vicinity of the rotation processing position RP means a region from the height position of the upper end of the cup 16 to the rotation processing position RP.
[0035]
On the other hand, since the substrate holding part 10 moves up and down at a relatively high speed except in the vicinity of the rotation processing position RP, it is possible to prevent the substrate W from being moved up and down for a long time. That is, it is possible to prevent the particles from adhering to the substrate W or the like while suppressing the operation time from being extended when the substrate holding unit 10 is moved up and down.
[0036]
Further, since the control unit 12 controls the rotation angle of the pulse control type motor 20 so that the substrate holding unit 10 stops at an arbitrary stop position, the substrate holding unit 10 has three height positions (that is, In order to stop the rotation processing position RP, delivery position TP, application position CP), it is not necessary to provide two air cylinders as in the prior art (see FIG. 11), and a simple mechanism is sufficient.
[0037]
Furthermore, as described above, it is necessary to scan the slit nozzle 18 while keeping the distance between the slit nozzle 18 and the substrate W constant at the coating position CP. In the apparatus, since the substrate holding unit 10 is stopped at an arbitrary stop position by the control unit 12, even if the thickness of the substrate W to be processed is changed, another driving mechanism (for example, The distance between the slit nozzle 18 and the substrate W can be easily maintained constant by changing the stop position of the substrate holding unit 10 without providing the vertical mechanism of the slit nozzle 18. Specifically, for example, it can be performed simply by changing the lifting / lowering operation pattern input from the operation panel 13.
[0038]
That is, in the substrate processing apparatus of the first embodiment, the pulse control type motor 20 capable of controlling the rotation angle is used as the control means, and the control unit 12 controls the rotation angle of the pulse control type motor 20 to hold the substrate. Since the unit 10 stops at an arbitrary stop position, the position of the substrate holding unit 10 can be easily adjusted without providing a complicated mechanism or performing a complicated operation.
[0039]
In addition, since the pulse control type motor 20 is used as the raising / lowering means of the substrate holding unit 10, the substrate holding unit 10 can be stably supplied without being affected by the change in the air flow rate caused by the operation timing of other air driving units. The raising / lowering operation can be performed.
[0040]
In the first embodiment, the so-called ball screw mechanism using the ball screw 21 is used to convert the rotation of the pulse control type motor 20 into the raising and lowering of the substrate holding unit 10, but a feed screw shaft is used instead of the ball screw 21. And a so-called feed screw shaft mechanism in which the chuck support 11 is screwed directly to the feed screw shaft may be used.
[0041]
<Second Embodiment>
FIG. 2 is a schematic configuration diagram of a main part of a second embodiment of the substrate processing apparatus according to the present invention. This apparatus is an apparatus for supplying a photoresist to a substrate and rotating it to perform a resist coating process.
[0042]
The difference between the substrate processing apparatus of the second embodiment and the substrate processing apparatus of the first embodiment is the lifting mechanism of the substrate holding unit 10, and the substrate processing apparatus of the first embodiment holds the rotation of the pulse control type motor 20 on the substrate. Whereas a so-called ball screw mechanism using a ball screw 21 is used to convert the movement of the unit 10 into the elevation, the substrate processing apparatus of the second embodiment uses pulse-controlled motors 30 and 35 using pulleys and wires. Is transmitted to the substrate holder 10.
[0043]
The pulse control type motors 30 and 35 are the same as the pulse control type motor 20 of the first embodiment, and a servo motor or a stepping motor is applied. However, while the pulse control type motor 20 of the first embodiment is rotating about the vertical direction, the pulse control type motors 30 and 35 of the second embodiment are horizontal (perpendicular to the paper surface of FIG. 2). Direction) as an axis.
[0044]
A driving pulley 31 is fixed to the rotating shaft of the pulse control type motor 30. A drive pulley 32 is fixed to the rotating shaft of the pulse control type motor 35. A wire 33 is wound between the drive pulley 31 and the drive pulley 32. The chuck support 11 is tied to the wire 33. Accordingly, when the pulse control type motor 30 winds the wire 33 downward, the chuck support part 11, the substrate holding part 10 and the substrate W are lowered accordingly, and the pulse control type motor 35 winds the wire 33 upward. If it takes, the chuck | zipper support part 11, the board | substrate holding | maintenance part 10, and the board | substrate W will raise with it.
[0045]
Since the remaining points other than the lifting mechanism of the substrate holding unit 10 are the same as those of the substrate processing apparatus of the first embodiment, the same reference numerals are given and description thereof is omitted. The operation of the substrate processing apparatus of the second embodiment is the same as that of the substrate processing apparatus of the first embodiment.
[0046]
Even in this case, the substrate processing apparatus of the second embodiment is a pulse control type capable of controlling the rotation speed and the rotation angle as the means for lifting and lowering the substrate holding unit 10 and the substrate W, similarly to the substrate processing apparatus of the first embodiment. The motors 30 and 35 are used, and their rotational speed and rotational angle are controlled by the control unit 12. The rotation speed of the pulse control type motors 30 and 35 is the winding speed of the wire 33 and defines the ascending / descending speed of the substrate holder 10. Further, the rotation angle of the pulse control type motors 30 and 35 becomes the winding length of the wire 33, and defines the raising / lowering stop position of the substrate holding unit 10. In other words, in the substrate processing apparatus of the second embodiment, the control unit 12 controls the pulse control type motors 30 and 35 to change the ascending / descending speed of the substrate holding unit 10 and the substrate holding unit 10 is optional. It stops at the stop position.
[0047]
Therefore, as in the first embodiment, it is possible to prevent particles from adhering to the substrate W or the like while suppressing a long operating time during the raising / lowering operation of the substrate holding unit 10. Further, the position of the substrate holder 10 can be easily adjusted without providing a complicated mechanism or performing complicated operations. Furthermore, the substrate holding unit 10 can be moved up and down stably without being affected by changes in the air flow rate due to the operation timing of other air driving units.
[0048]
Note that a steel belt may be used instead of the wire 33.
[0049]
<Third Embodiment>
FIG. 3 is a schematic configuration diagram of a main part of a third embodiment of the substrate processing apparatus according to the present invention. This apparatus is an apparatus for supplying a photoresist to a substrate and rotating it to perform a resist coating process.
[0050]
The difference between the substrate processing apparatus of the third embodiment and the substrate processing apparatus of the first embodiment is the lifting mechanism of the substrate holding unit 10, and the substrate processing apparatus of the first embodiment holds the rotation of the pulse control type motor 20 on the substrate. Whereas the so-called ball screw mechanism using the ball screw 21 is used for conversion to the raising and lowering of the portion 10, in the substrate processing apparatus of the third embodiment, a pulse control type motor 40 is used by using a timing belt and a timing pulley. Is transmitted to the substrate holder 10.
[0051]
The pulse control type motor 40 is the same as the pulse control type motor 20 of the first embodiment, and a servo motor or a stepping motor is applied. However, the pulse control type motor 20 of the first embodiment rotates around the vertical direction, whereas the pulse control type motor 40 of the third embodiment uses the horizontal direction (the direction perpendicular to the paper surface of FIG. 3). Rotate around the axis.
[0052]
A driving pulley 41 using a timing pulley is fixed to the rotating shaft of the pulse control type motor 40. Further, a timing belt 43 is wound around a driven pulley 42 and a driving pulley 41 that are rotatably provided. The chuck support 11 is fixed to the timing belt 43. Accordingly, when the pulse control type motor 40 rotates the driving pulley 41 in the forward or reverse direction and rotates the timing belt 43, the chuck support portion 11, the substrate holding portion 10 and the substrate W are moved up and down accordingly.
[0053]
Since the remaining points other than the lifting mechanism of the substrate holding unit 10 are the same as those of the substrate processing apparatus of the first embodiment, the same reference numerals are given and description thereof is omitted. The operation of the substrate processing apparatus of the third embodiment is the same as that of the substrate processing apparatus of the first embodiment.
[0054]
Even in this case, the substrate processing apparatus of the third embodiment is similar to the substrate processing apparatus of the first embodiment, and is capable of controlling the rotation speed and the rotation angle as the substrate holding unit 10 and the substrate W elevating means. The motor 40 is used, and the rotation speed and rotation angle are controlled by the controller 12. The rotation speed of the pulse control type motor 40 is the revolving speed of the timing belt 43 and defines the ascending / descending speed of the substrate holder 10. Further, the rotation angle of the pulse control type motor 40 becomes the revolving distance of the timing belt 43 and defines the lifting / lowering stop position of the substrate holder 10. In other words, also in the substrate processing apparatus of the third embodiment, the control unit 12 controls the pulse control type motor 40 to change the ascending / descending speed of the substrate holding unit 10 and to arbitrarily stop the substrate holding unit 10. It stops at the position.
[0055]
Therefore, similarly to the first embodiment, it is possible to prevent particles from adhering to the substrate W or the like while suppressing the operation time from being extended when the substrate holding unit 10 is moved up and down. Further, the position of the substrate holder 10 can be easily adjusted without providing a complicated mechanism or performing complicated operations. Furthermore, the substrate holding unit 10 can be moved up and down stably without being affected by changes in the air flow rate caused by the operation timing of other air driving units.
[0056]
<Fourth embodiment>
FIG. 4 is a schematic configuration diagram of a main part of a fourth embodiment of the substrate processing apparatus according to the present invention. This apparatus is an apparatus for supplying a photoresist to a substrate and rotating it to perform a resist coating process.
[0057]
The difference between the substrate processing apparatus of the fourth embodiment and the substrate processing apparatus of the first embodiment is the lifting mechanism of the substrate holding unit 10, and the substrate processing apparatus of the first embodiment holds the rotation of the pulse control type motor 20 on the substrate. In contrast to the conversion to the elevation of the unit 10, in the substrate processing apparatus of the fourth embodiment, the substrate holding unit 10 is elevated by the linear pulse motor 50.
[0058]
The linear pulse motor 50 is a linear motor in which the linear guide unit 51 is driven by giving a pulse signal, and a motor capable of controlling the moving speed and moving distance of the linear guide unit 51 by adjusting the interval and number of pulses. It is. Further, the linear pulse motor 50 has an encoder section 52, measures the moving speed and moving distance of the linear guide section 51, and transmits them to the control section 12. That is, the control unit 12 controls the moving speed and moving distance of the linear guide unit 51 by feedback control.
[0059]
The chuck support portion 11 is fixed to the linear guide portion 51. Therefore, when the linear pulse motor 50 drives the linear guide portion 51 up and down, the chuck support portion 11, the substrate holding portion 10, and the substrate W are raised and lowered accordingly.
[0060]
Since the remaining points other than the lifting mechanism of the substrate holding unit 10 are the same as those of the substrate processing apparatus of the first embodiment, the same reference numerals are given and description thereof is omitted. The operation of the substrate processing apparatus of the fourth embodiment is the same as that of the substrate processing apparatus of the first embodiment.
[0061]
Even in this case, the substrate processing apparatus of the fourth embodiment can control the moving speed and the moving distance of the linear guide unit 51 as the substrate holding unit 10 and the lifting means for the substrate W, similarly to the substrate processing apparatus of the first embodiment. A possible linear pulse motor 50 is used, and its moving speed and moving distance are controlled by the controller 12. The moving speed of the linear guide part 51 defines the ascending / descending speed of the substrate holding part 10 as it is. Further, the movement distance of the linear guide portion 51 directly defines the lifting / lowering stop position of the substrate holding portion 10. In other words, also in the substrate processing apparatus of the fourth embodiment, the control unit 12 controls the linear pulse motor 50 that is the lifting means, thereby making the lifting / lowering speed of the substrate holding part 10 variable and the substrate holding part 10 optional. It stops at the stop position.
[0062]
Therefore, similarly to the first embodiment, it is possible to prevent particles from adhering to the substrate W or the like while suppressing the operation time from being extended when the substrate holding unit 10 is moved up and down. Further, the position of the substrate holder 10 can be easily adjusted without providing a complicated mechanism or performing complicated operations. Furthermore, the substrate holding unit 10 can be moved up and down stably without being affected by changes in the air flow rate caused by the operation timing of other air driving units.
[0063]
<Fifth embodiment>
Next, a fifth embodiment of the substrate processing apparatus according to the present invention will be described. The substrate processing apparatus of the fifth embodiment is also an apparatus for supplying a photoresist to a substrate and rotating it to perform a resist coating process, but the lifting mechanism is different from the substrate processing apparatuses of the first to fourth embodiments. That is, in the substrate processing apparatus of the first to fourth embodiments, the lifting mechanism uses an electric driving force using a motor, but the substrate processing apparatus of the fifth embodiment uses a pneumatic pressure. Mechanism.
[0064]
FIG. 5 is a diagram showing a schematic configuration of the lifting mechanism of the substrate processing apparatus according to the fifth embodiment. Since points other than the lifting mechanism are the same as those of the substrate processing apparatus of the first to fourth embodiments, the description thereof is omitted. The overall operation of the substrate processing apparatus of the fifth embodiment is the same as that of the substrate processing apparatuses of the first to fourth embodiments.
[0065]
The lifting mechanism of the substrate processing apparatus according to the fifth embodiment is a lifting mechanism using a pneumatic servo system 60. The pneumatic servo system 60 is a system that can control the operating speed and the moving distance of the piston rod 61 by feedback controlling the amount of air that the control unit 12 supplies to the cylinder 62 based on the position information from the position sensor 66. .
[0066]
A chuck support portion 11 that supports the substrate holding portion 10 is fixed to the piston rod 61. Further, the position of the piston rod 61 is measured by the position sensor 66. For example, a potentiometer may be used as the position sensor 66. The position information of the piston rod 61 measured by the position sensor 66 is transmitted to the control unit 12.
[0067]
The control unit 12 drives the servo valves 64 and 65 based on the transmitted position information of the piston rod 61 to control the amount of air supplied to both sides of the piston 63 in the cylinder 62. Then, the piston 63 is driven by the air pressure difference between both sides of the piston 63 in the cylinder 62, and the piston rod 61, the chuck support portion 11, the substrate holding portion 10 and the substrate W are moved up and down accordingly.
[0068]
In the pneumatic servo system 60, the control unit 12 adjusts the pneumatic pressure difference between both sides of the piston 63 in the cylinder 62 based on the position information from the position sensor 66, so that the operating speed and the moving distance of the piston rod 61 can be controlled. It is.
[0069]
That is, the substrate processing apparatus of the fifth embodiment is also a pneumatic servo capable of controlling the operating speed and the moving distance of the piston rod 61 as the substrate holding unit 10 and the lifting means for the substrate W, similarly to the substrate processing apparatus of the first embodiment. The system 60 is used to control the operation speed and the moving distance by the control unit 12. The operating speed of the piston rod 61 defines the ascending / descending speed of the substrate holding part 10 as it is. Further, the moving distance of the piston rod 61 directly defines the lifting / lowering stop position of the substrate holding unit 10. In other words, also in the substrate processing apparatus of the fifth embodiment, the control unit 12 controls the pneumatic servo system 60 that is the lifting means, thereby changing the lifting speed of the substrate holding part 10 and the substrate holding part 10. It stops at an arbitrary stop position.
[0070]
Therefore, similarly to the first embodiment, it is possible to prevent particles from adhering to the substrate W or the like while suppressing the operation time from being extended when the substrate holding unit 10 is moved up and down. Further, the position of the substrate holder 10 can be easily adjusted without providing a complicated mechanism or performing complicated operations.
[0071]
As described above, in the fifth embodiment, the pneumatic servo system 60 is applied as an elevating mechanism using pneumatic pressure, but an electropneumatic stepping cylinder may be applied instead. The electropneumatic stepping cylinder is an air cylinder that can precisely adjust the air pressure in the cylinder by driving an air pressure switching valve by a servo motor or a stepping motor. Therefore, even if a stepping cylinder is used, the raising / lowering speed and raising / lowering stop position of the board | substrate holding | maintenance part 10 can be controlled, and the effect similar to the above can be acquired. The stepping cylinder is not limited to the electropneumatic type, and may be an electrohydraulic type.
[0072]
<Sixth Embodiment>
Next, a sixth embodiment of the substrate processing apparatus according to the present invention will be described. FIG. 6 is a schematic configuration diagram of an essential part of a sixth embodiment of the substrate processing apparatus according to the present invention.
[0073]
The substrate processing apparatus of the sixth embodiment is different from the substrate processing apparatus of the first embodiment in the lifting mechanism of the substrate holding unit 10, and the substrate processing apparatus of the first embodiment uses the pulse control type motor 20 and the substrate holding unit 10. In contrast, the substrate processing apparatus of the sixth embodiment uses a general air cylinder 70 as the lifting drive source of the substrate holding unit 10.
[0074]
As another difference, the substrate processing apparatus of the sixth embodiment includes a cam switch 71 and a three-way valve 75. The cam switch 71 is a switch that switches on / off between a state in which the chuck support 11 is in contact with the cam body 72 and a state in which the chuck support portion 11 is separated from the cam body 72. The cam switch 71 is configured such that when the substrate holding part 10 is located in the vicinity of the rotation processing position RP, that is, the chuck support part 11 is located in the vicinity of the solid line position in the figure, and the chuck support part 11 contacts the cam body 72. When 72 is pushed to the solid line position in the figure, the presence of the chuck support portion 11 is detected and the fact is transmitted to the control portion 12. That is, the cam switch 71 serves as a detection unit that detects that when the substrate holding unit 10 is located in the vicinity of the rotation processing position RP.
[0075]
When the control unit 12 receives a detection signal from the cam switch 71, the three-way valve 75 is controlled to connect the air cylinder 70 and the low pressure air line (or low flow rate air line). Conversely, when the control unit 12 does not receive a detection signal from the cam switch 71, the three-way valve 75 is controlled to connect the air cylinder 70 and the high pressure air line (or high flow rate air line).
[0076]
Therefore, when the substrate holding part 10 is located in the vicinity of the rotation processing position RP, the chuck support part 11 is in contact with the cam body 72, and the cam body 72 is pushed to the position indicated by the solid line in FIG. The air line is connected. As a result, the driving speed of the air cylinder 70 becomes low, and the substrate holding unit 10 moves up and down at a relatively low speed in the vicinity of the rotation processing position RP. Therefore, the air flow caused by the vertical movement of the substrate holding unit 10 or the substrate W held thereby. Occurrence is suppressed, and rolling up of particles adhering to the cup 16 and the like is prevented. As a result, it is possible to prevent particles from adhering to the substrate W or the like when the substrate holding unit 10 is moved up and down.
[0077]
On the other hand, when the substrate holding part 10 is located outside the rotation processing position RP, the chuck support part 11 is separated from the cam body 72, and the cam body 72 returns to the position indicated by the two-dot chain line in FIG. And a high-pressure air line are connected. As a result, the driving speed of the air cylinder 70 is higher than when the substrate holding unit 10 is positioned in the vicinity of the rotation processing position RP, and the substrate holding unit 10 moves up and down at a relatively high speed except in the vicinity of the rotation processing position RP. Further, it is possible to prevent the substrate W from moving up and down for a long time. The overall operation of the substrate processing apparatus of the sixth embodiment is the same as that of the substrate processing apparatuses of the first to fifth embodiments.
[0078]
As described above, in the substrate processing apparatus of the sixth embodiment, the general air cylinder 70 is used as the substrate holding unit 10 and the substrate W elevating means, but based on the detection signal from the cam switch 71. The controller 12 controls the driving speed of the air cylinder 70. The driving speed of the air cylinder 70 defines the ascending / descending speed of the substrate holding unit 10. In other words, in the substrate processing apparatus of the sixth embodiment, the control unit 12 indirectly controls the air cylinder 70 as the lifting means via the three-way valve 75, thereby changing the lifting speed of the substrate holding unit 10. It can be said that.
[0079]
Accordingly, the substrate processing apparatus according to the sixth embodiment also prevents particles from adhering to the substrate W or the like while suppressing an increase in operating time when the substrate holding unit 10 is raised and lowered, as in the first embodiment. be able to. Note that the cam switch 71 itself may be provided in the vicinity of the rotation processing position RP so that the substrate holding unit 10 directly operates it. Further, it is preferable to use a shock absorber together in order to reduce the impact when the substrate holder 10 stops at the rotation processing position RP.
[0080]
Of course, in the substrate processing apparatus of the sixth embodiment, the elevation stop position of the substrate holding unit 10 cannot be controlled by the cam switch 71, but the cam switch 71 and the three-way valve 75 are added to the conventional substrate processing apparatus (see FIG. 10). Since the particles can be prevented from adhering to the airflow simply by providing the cost, the cost can be kept low.
[0081]
<Seventh embodiment>
Next, a seventh embodiment of the substrate processing apparatus according to the present invention will be described. FIG. 7 is a schematic configuration diagram of an essential part of a seventh embodiment of the substrate processing apparatus according to the present invention.
[0082]
The substrate processing apparatus according to the seventh embodiment is different from the substrate processing apparatus according to the first embodiment in the lifting mechanism of the substrate holding unit 10, and the substrate processing apparatus according to the first embodiment uses the pulse control type motor 20 and the substrate holding unit 10. In contrast, the substrate processing apparatus of the seventh embodiment uses a reversible type speed control motor 80 as the lifting drive source of the substrate holding unit 10. The so-called ball screw mechanism using the ball screw 81 is used to convert the rotation of the speed control motor 80 into the raising and lowering of the substrate holding unit 10 as in the first embodiment.
[0083]
As another difference, the substrate processing apparatus according to the seventh embodiment includes an optical sensor 82. The sensor 82 detects the chuck support portion 11 when the substrate holding portion 10 is located in the vicinity of the rotation processing position RP, that is, when the chuck support portion 11 is located in the vicinity of the solid line position in the drawing, and controls that fact. Transmitted to the unit 12. That is, the sensor 82 serves as a detecting unit that detects that when the substrate holding unit 10 is located in the vicinity of the rotation processing position RP.
[0084]
When the control unit 12 receives a detection signal from the sensor 82, the speed control motor 80 is controlled to reduce its operating speed. Conversely, when the control unit 12 has not received a detection signal from the sensor 82, the speed control motor 80 is controlled to increase its operating speed.
[0085]
Therefore, when the substrate holding unit 10 is located in the vicinity of the rotation processing position RP, the rotation speed of the ball screw 81 is low, and in the vicinity of the rotation processing position RP, the substrate holding unit 10 moves up and down at a relatively low speed. The generation of airflow due to the vertical movement of the portion 10 or the substrate W held thereon is suppressed, and the particles adhering to the cup 16 and the like are prevented from being rolled up. As a result, it is possible to prevent particles from adhering to the substrate W or the like when the substrate holding unit 10 is moved up and down.
[0086]
On the other hand, when the substrate holding part 10 is located in the vicinity of the rotation processing position RP, the rotation speed of the ball screw 81 is higher than that in the vicinity of the rotation processing position RP. Since the substrate 10 moves up and down at a relatively high speed, it is possible to prevent the substrate W from moving up and down for a long time. The overall operation of the substrate processing apparatus of the seventh embodiment is the same as that of the substrate processing apparatus of the first to sixth embodiments.
[0087]
As described above, in the substrate processing apparatus of the seventh embodiment, the speed control motor 80 capable of controlling the rotation speed is used as the substrate holding unit 10 and the lifting means for the substrate W, and the control is performed based on the detection signal from the sensor 82. The unit 12 controls the rotation speed. The rotational speed of the speed control motor 80 becomes the rotational speed of the ball screw 81 as it is, and defines the elevation speed of the substrate holder 10. In other words, in the substrate processing apparatus of the seventh embodiment, the control unit 12 controls the speed control motor 80 to change the ascending / descending speed of the substrate holding unit 10.
[0088]
Accordingly, the substrate processing apparatus according to the seventh embodiment also prevents particles from adhering to the substrate W or the like while suppressing the lengthening of the operation time during the raising / lowering operation of the substrate holding unit 10 as in the first embodiment. be able to. Note that the sensor 82 may be provided in the vicinity of the rotation processing position RP to directly detect the substrate holder 10.
[0089]
Further, since the speed control motor 80 is used as the lifting / lowering means of the substrate holding unit 10, the substrate holding unit 10 can be lifted and lowered stably without being affected by the change in the air flow rate caused by the operation timing of other air driving units. The action can be performed.
[0090]
Since the rotation angle of the speed control motor 80 cannot be controlled, the lift stop position of the substrate holder 10 cannot be controlled as in the sixth embodiment.
[0091]
<Modification>
While the embodiments of the present invention have been described above, the present invention is not limited to the above examples. For example, in the first to fifth embodiments, the lifting / lowering operation pattern of the substrate holding unit 10 is not limited to that shown in FIGS. 8 and 9, and is as shown by the solid line and the dotted line in FIG. 10. Also good. The raising / lowering operation pattern of the board | substrate holding | maintenance part 10 shown in FIG. 10 is an raising / lowering operation pattern which has a curvilinear change. Also in this modified example, if the raising / lowering operation pattern is such that the raising / lowering speed at least when the substrate holding part 10 is located in the vicinity of the rotation processing position RP is slower than the raising / lowering speed at the time other than the vicinity of the rotation processing position RP. It ’s good.
[0092]
Moreover, although the substrate processing apparatus demonstrated in the said embodiment was an apparatus which supplies and rotates a photoresist to a board | substrate and performs a resist coating process, the substrate processing apparatus concerning this invention is rotating a board | substrate. Any apparatus that performs a predetermined process may be used. For example, a substrate processing apparatus that supplies a developing solution to a substrate and rotates the substrate to perform a developing process may be used.
[0093]
【The invention's effect】
As described above, according to the invention of claim 1 The lifting / lowering means is controlled so that the lifting / lowering speed of the substrate holder in the region from the height position of the upper end of the cup to the rotation processing position is slower than the lifting / lowering speed in other regions. Because it has control means , Group Airflow generation due to the vertical movement of the plate holding portion or the substrate held by the plate holding portion is suppressed, and particles and the like are prevented from being rolled up.
[0094]
Also, In order to control the elevating means so that the stop position of the substrate holding part at the application position can be changed, It is possible to easily adjust the position of the substrate holding portion without providing a complicated mechanism or performing complicated operations.
[0095]
Claims 2 According to the invention, the substrate holding unit is provided with the input unit for inputting the lifting operation pattern of the substrate holding unit, and the lifting unit is controlled so that the substrate holding unit is lifted and lowered according to the lifting operation pattern input to the control unit. The raising / lowering speed and stop position of the unit can be easily set / changed.
[0096]
Claims 3 According to this invention, since the elevating means includes the motor, the elevating operation of the substrate holding unit can be performed stably without being affected by the change in the air flow rate caused by the operation timing of the other air driving unit.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of an essential part of a substrate processing apparatus according to a first embodiment of the present invention.
FIG. 2 is a schematic configuration diagram of a main part of a second embodiment of a substrate processing apparatus according to the present invention.
FIG. 3 is a schematic configuration diagram of an essential part of a third embodiment of a substrate processing apparatus according to the present invention.
FIG. 4 is a schematic configuration diagram of an essential part of a substrate processing apparatus according to a fourth embodiment of the present invention.
FIG. 5 is a diagram showing a schematic configuration of a lifting mechanism of a substrate processing apparatus according to a fifth embodiment.
FIG. 6 is a schematic configuration diagram of an essential part of a sixth embodiment of a substrate processing apparatus according to the present invention.
FIG. 7 is a schematic configuration diagram of an essential part of a seventh embodiment of a substrate processing apparatus according to the present invention.
FIG. 8 is a diagram illustrating an example of a lifting / lowering operation pattern of a substrate holding unit.
FIG. 9 is a diagram illustrating an example of an ascending / descending operation pattern of a substrate holder.
FIG. 10 is a diagram illustrating another example of the lifting / lowering operation pattern of the substrate holding unit.
FIG. 11 is a schematic view of a main part of a conventional substrate processing apparatus.
FIG. 12 is a schematic view of a main part of another example of a conventional substrate processing apparatus.
[Explanation of symbols]
10 Substrate holder
12 Control unit
13 Operation panel
20, 30, 35, 40 Pulse controlled motor
50 Linear pulse motor
60 Pneumatic servo system
70 Air cylinder
71 Cam switch
80 Speed control motor
82 sensors
W substrate

Claims (3)

A substrate processing apparatus for performing a rotation process by rotating a substrate after a coating process ,
(a) a substrate held at horizontal position, and the substrate holding portion for rotating operation,
(b) the substrate holder, the delivery position of the substrate, surrounded by the cup at below the coating position and the application position slit nozzle at lower than the delivery position performs the coating process scanning the substrate Elevating means for elevating and lowering between rotation processing positions for performing the rotation processing of the substrate,
(c) The ascending / descending speed of the substrate holder in the region from the height position of the upper end of the cup below the application position and above the rotation processing position to the rotation processing position is in another region. Control means for controlling the elevating means so as to be slower than the elevating speed and to change the stop position of the substrate holding portion at the application position;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
(d) input means for inputting a lifting / lowering operation pattern of the substrate holder;
Further comprising
The substrate processing apparatus, wherein the control means controls the raising / lowering means so that the substrate holding part moves up and down according to the inputted raising / lowering operation pattern. In the substrate processing apparatus of Claim 1 or Claim 2,
The substrate processing apparatus, wherein the elevating means includes a motor.

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