JP3922202B2 - Optical receptacle - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical receptacle connected to an optical plug including an optical transmission medium such as an optical fiber.
[0002]
[Prior art]
In recent years, optical communication has been introduced to enable high-speed data communication between electronic devices, and an optical transmission medium such as an optical fiber is provided to perform optical wiring between the electronic device and the outside. An optical connector comprising an optical plug and an optical receptacle connected to the optical plug is used.
[0003]
The optical receptacle is configured by housing optical element blocks 10a and 10b for transmission and reception as shown in FIGS. 5A and 5B in a housing (not shown) (see, for example, Patent Document 1).
[0004]
The optical element blocks 10a and 10b have substantially the same structure, and solid circuit molded parts (MID: Molded Interconnected Device) 11a and 11b having a rectangular parallelepiped shape are used as a base, and the front surfaces of the molded circuit molded parts 11a and 11b. Are respectively provided with cylindrical optical element mounting bases 12a and 12b protruding forward.
[0005]
In the three-dimensional circuit molded component 11a on the transmission side, a concave flat surface 13a that is open so as to spread in the front end direction is formed on the front end surface of the optical element mounting base 12a, and a light emitting diode LD is mounted on the bottom of the concave flat surface 13a. .
[0006]
In the three-dimensional circuit molded component 11b on the receiving side, the tip surface of the optical element mounting base 12b is formed as a flat surface, and the light receiving diode PD is mounted at the approximate center of the tip surface.
[0007]
In addition, recesses 15a and 15b for mounting circuit components are formed on the rear surfaces of the compatible circuit molded components 11a and 11b, respectively. In the three-dimensional circuit molded component 11a on the transmission side, circuit components such as an integrated circuit element IC1 in which a circuit for processing a drive signal to the light emitting diode LD is integrated at the bottom of the recess 15a, and a chip capacitor (not shown) for noise cut Is mounted, and in the three-dimensional circuit molded component 11b on the receiving side, an integrated circuit element IC2 in which a circuit (for example, an amplifier circuit) for processing an input signal from the light receiving diode PD is integrated at the bottom of the recess 15b, or a noise cutting chip Circuit components such as a capacitor (not shown) are mounted.
[0008]
On the surface of each three-dimensional circuit molded component 11a, 11b, a circuit pattern made of a metal plating film that electrically connects between the light emitting diode LD and the integrated circuit element IC1 and between the light receiving diode PD and the integrated circuit element IC2. (Not shown) is formed. The electrodes of the light emitting diode LD and the light receiving diode PD are electrically connected to a circuit pattern extending on the front end surfaces of the optical element mounting bases 12a and 12b through bonding wires 21a made of a thin metal wire such as aluminum. The electrodes of the integrated circuit elements IC1 and IC2 are electrically connected to a circuit pattern extending on the bottom surfaces of the recesses 15a and 15b through bonding wires 21b. Thus, between the light emitting diode LD and the integrated circuit element IC1, and between the light receiving diode PD and the integrated circuit element IC2 are electrically connected via circuit patterns formed on the surfaces of the three-dimensional circuit molded parts 11a and 11b, respectively. It is connected.
[0009]
The recesses 15a and 15b on the rear surfaces of the three-dimensional circuit molded parts 11a and 11b are filled with a sealing resin 17 to protect circuit parts such as the integrated circuit elements IC1 and IC2 and a bonding part of the bonding wire 21b.
[0010]
Further, lenses 14 and 14 facing the light emitting surface of the light emitting diode LD or the light receiving surface of the light receiving diode PD are formed on the front end surfaces of the respective optical element mounting bases 12a and 12b by a method called casting.
[0011]
Thus, when the optical plug is connected to the optical receptacle containing the optical element blocks 10a and 10b inside the housing, the two optical fibers held by the optical plug are respectively connected to the light emitting diode LD or the light receiving diode PD and the lens coupling method. Is optically coupled. Further, the lenses 14 and 14 protect the light emitting diode LD, the light receiving diode PD, the bonding portion of the bonding wire 21a, and the like.
[0012]
Here, the process of forming the lens 14 on the tip surface of the optical element mounting base 12a of the three-dimensional circuit molded component 11a will be described with reference to FIGS. In the figure, reference numeral 30 denotes a casting case (mold) of a resin molded product. A round hole 31 having a slightly larger diameter than the optical element mounting base 12a is opened on the upper surface of the casting case 30, and a lens is formed on the bottom surface of the round hole 31. A concave portion 31a having substantially the same shape as the surface shape of 14 is formed.
[0013]
When the lens 14 is formed, first, a lens resin 14a having translucency and thermosetting properties such as epoxy resin is injected into the round hole 31 of the casting case 30 (see FIG. 6B). The optical element mounting base 12a of the molded circuit molded component 11a is inserted into the round hole 31 of the casting case 30. Next, after pressing the upper part of the molded circuit molded component 11a with the jig 32 and applying pressure, the lens resin 14a is heated to the resin curing temperature to cure the lens resin 14a (see FIG. 6C). When the mold is released from the casting case 30 (see FIG. 6D), the lens 14 is formed on the tip surface of the optical element mounting base 12a. At the same time, the protective film 20 made of the lens resin 14a is formed on the front end surface and the peripheral surface of the optical element mounting base 12a to protect the circuit pattern formed on the front end surface and the peripheral surface of the optical element mounting base 12a. ing.
[0014]
[Patent Document 1]
JP 2002-164604 A (pages 3 to 4 and FIGS. 1 and 7)
[0015]
[Problems to be solved by the invention]
In the optical element block configured as described above, the lenses 14 and 14 are formed on the tip surfaces of the optical element mounting bases 12a and 12b by the casting method. However, a three-dimensional circuit molded component is formed in the round hole 31 of the casting case 30 when the lens is formed. When the optical element mounting bases 12a and 12b of 11a and 11b are inserted, the lens resin 14a injected into the round hole 31 overflows out of the round hole 31 and adheres to the front surface of the molded circuit molded parts 11a and 11b. Then, the adhered lens resin 14a is cured and a burr 14b is formed.
[0016]
Here, when the molded circuit molded components 11a and 11b are housed in the housing, the molded circuit molded components 11a and 11b are positioned by bringing the front surfaces of the molded circuit molded components 11a and 11b into contact with the inner wall of the housing. Therefore, if the burr 14b remains on the front surface of the molded circuit molded parts 11a and 11b, there is a problem that the positions of the molded circuit molded parts 11a and 11b vary. Therefore, the burr | flash 14b adhering to the front surface of the molded circuit molded components 11a and 11b has to be removed by post-processing, and workability is poor. Further, since it is difficult to completely remove the burr 14b attached to the front surfaces of the molded circuit molded parts 11a and 11b, the molded circuit molded parts 11a and 11b cannot be accurately positioned with respect to the housing.
[0017]
The present invention has been made in view of the above problems, and an object thereof is to provide an optical receptacle capable of accurately positioning an optical element block.
[0018]
[Means for Solving the Problems]
In order to achieve the above object, according to the first aspect of the present invention, there is provided an optical receptacle to which an optical plug having an optical transmission medium such as an optical fiber is connected, and an optical signal transmitted through the optical transmission medium; An optical element that performs photoelectric conversion with an electrical signal, a three-dimensional circuit molded component having a columnar optical element mounting base on which the optical element is mounted on the front end surface, and an optical element and an optical transmission medium A resin lens formed by a casting method on the front end surface of the optical element mounting base and a cylindrical sleeve communicating with the internal storage chamber protrude from the front surface so as to be positioned in the optical path between them. A housing in which the molded circuit molded component is mounted in the storage chamber with the optical element mounting base inserted, and for storing the resin forming the lens near the base of the optical element mounting base in front of the molded circuit molded component The recessed part of The features.
[0019]
According to a second aspect of the present invention, in the first aspect of the present invention, the concave portion is provided with an inclined surface that is inclined so as to recede from the front surface of the molded circuit molded component as the distance from the optical element mounting base increases.
[0020]
According to a third aspect of the present invention, there is provided an optical receptacle to which an optical plug having an optical transmission medium such as an optical fiber is connected, and photoelectric conversion between an optical signal transmitted through the optical transmission medium and an electric signal. And an optical element between the optical element and the optical transmission medium, and a three-dimensional circuit molded component having a columnar optical element mounting base on which the optical element is mounted on the front end surface. The resin lens formed by the casting method on the front end surface of the optical element mounting base, and the cylindrical sleeve communicating with the internal storage chamber project from the front, and the optical element mounting base is inserted into the sleeve And a housing in which the molded circuit molded component is housed in the storage chamber, and at least one of the front surface of the molded circuit molded component or the inner wall of the housing facing the front surface of the molded circuit molded component, and the other Standing by contact Characterized by comprising providing a positioning projection for positioning the circuit molded component with respect to the housing.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
[0022]
(Embodiment 1)
A first embodiment of the present invention will be described with reference to FIGS. 1 and 2. In the following description, unless otherwise specified, the vertical and horizontal directions are defined in the direction of FIG. 1A, and the front in FIG. Accordingly, the left end in FIG. 1B is the rear end.
[0023]
The optical receptacle A of the present embodiment is connected to an optical plug including an optical transmission medium such as an optical fiber. The optical receptacle A includes a housing 1 and an optical element block on the transmission side (inside the housing 1). And an optical element block 10b on the receiving side.
[0024]
The housing 1 has a substantially box shape with openings on the rear side and the rear side of the lower surface, and is made of a metal part, a molded product of conductive resin, or a plated synthetic resin molded product, and has a shielding effect. The interior of the housing 1 is divided into two storage chambers, left and right, by partition walls, and each storage chamber serves as a storage space for a transmission optical element block and a reception optical element block 10b. Two cylindrical sleeves 2 communicating with the respective storage chambers are projected side by side on the front surface of the housing 1 so that two optical fibers held by optical plugs are inserted into the respective sleeves 2. It has become.
[0025]
The optical element block 10b on the receiving side uses a solid circuit molded part (MID: Molded Interconncted Device) 11b whose outer shape is a rectangular parallelepiped shape as a base, protrudes forward on the front surface of the molded circuit molded part 11b, and enters the sleeve 2 A columnar optical element mounting base 12b to be inserted is integrally projected. The transmitting side optical element block has the same structure as the receiving side optical element block 10a except that a light emitting diode is mounted instead of the light receiving diode PD as an optical element. .
[0026]
A concave plane 13b that is open so as to extend in the direction of the distal end is formed on the distal end surface of the optical element mounting base 12b, and a light receiving diode PD is mounted on the bottom of the concave plane 13b.
[0027]
A recessed portion 15b for mounting circuit components is formed on the rear surface of the molded circuit molded component 11b, and a circuit (for example, an amplifier circuit) for processing an input signal from the light receiving diode PD is formed at the bottom of the recessed portion 15b. Circuit components such as an integrated integrated circuit element IC2 and a noise-cutting chip capacitor 19 are mounted.
[0028]
In addition, concave grooves 25a and 25b extending upward from the left and right side portions of the optical element mounting base 12b are formed on the front surface of the molded circuit molded component 11b, and on the left and right sides below the optical element mounting base 12b in plan view. The trapezoidal concave grooves 25c and 25d are formed, and the concave grooves 25a to 25d form the concave portions for storing the lens resin.
[0029]
Through holes 23a and 23b penetrating the three-dimensional circuit molded component 11b in the front-rear direction are formed in the upper ends of the concave grooves 25a and 25b, respectively, and the concave grooves 25a and 25b are formed from the peripheral portions of the through holes 23a and 23b. Circuit patterns 24a and 24b of metal plating films extending to the front end surface of the optical element mounting base 12b are formed through the bottom surface of the optical element mounting base 12b and the left and right flat surfaces 26a and 26b of the optical element mounting base 12b. One circuit pattern 24b extends to the bottom of the concave plane 13b of the optical element mounting base 12b, and a light-receiving diode PD is die-bonded on the circuit pattern 24b. The other circuit pattern 24a extends to the front end surface of the optical element mounting base 12b, and the circuit pattern 24a and the electrode of the light receiving diode PD are electrically connected via a bonding wire 21a made of a thin metal wire such as aluminum or gold. Has been.
[0030]
Further, a circuit pattern (not shown) is formed in the peripheral portion of the through holes 23a and 23b in the recess 15b of the molded circuit molded component 11b, and these circuit patterns extend to the vicinity of the integrated circuit element IC2. The electrodes of the integrated circuit element IC2 are electrically connected via bonding wires 21b.
[0031]
Thus, circuit patterns 24a and 24b and through holes are provided between the optical element (light receiving diode PD) mounted on the front end surface of the optical element mounting base 12b and the integrated circuit element IC2 mounted on the bottom of the recess 15b. Electrical connection is established via 23a, 23b and a circuit pattern formed on the bottom of the recess 15b. In addition, a plurality of terminal pins 16 are integrally provided at the bottom of the molded circuit molded component 11b by simultaneous molding, and the space between each terminal pin 16 and the circuit components is formed on the surface of the molded circuit molded component 11b. They are electrically connected via a circuit pattern (not shown).
[0032]
The recess 15b is filled with a sealing resin 17 to protect the circuit components such as the integrated circuit element IC2 and the bonding portion of the bonding wire 21b. In addition, the optical element block on the transmission side and the reception side is made to be sealed in the housing 1 by sealing the sealing resin 18 in the housing 1 in a state where the optical element block on the transmission side and the reception side are housed in the housing 1. Fixed inside.
[0033]
By the way, the concave flat surface 13b of the optical element mounting base 12b is filled with light-transmitting synthetic resin (lens resin) to seal the light-receiving diode PD, and the sealing resin is used to seal the light-receiving surface of the light-receiving diode PD. Opposing lenses 14 are formed. This lens 14 is formed by the casting method described in the prior art, and at the time of forming the lens, a protective film 20 covering the circuit pattern formed on the side peripheral surface of the optical element mounting base 12b is formed simultaneously with the lens resin.
[0034]
Here, in the casting method, after injecting the lens resin into the round hole 31 of the casting case 30 shown in FIG. 6, the optical element mounting base 12b is inserted into the round hole 31, and the optical element mounting base 12b is placed on the casting case 30 side. While pressing and applying pressure, the lens resin is cured by heating to the resin curing temperature of the lens resin. In the present embodiment, the concave grooves 25a to 25a that form resin pools near the base of the optical element mounting base 12b. 25d is formed, the lens resin overflowing from the round hole 31 when the optical element mounting base 12b is inserted into the round hole 31 enters the concave grooves 25a to 25d, and the lens is formed on the front surface of the molded circuit molded component 11b. Resin can be prevented from adhering and curing to remain.
[0035]
Therefore, when the optical element block 10b is housed in the housing 1, the burr of the lens resin attached to the front surface of the molded circuit molded component 11b interferes with the inner wall of the housing 1 as in the conventional optical element block 10b. Therefore, the optical element block 10b and the housing 1 can be accurately positioned. In addition, since there is no need to remove the burrs of the lens resin attached to the front surface of the molded circuit molded component 11b, there is an advantage that workability is improved.
[0036]
Further, as shown in FIG. 1 (c), an inclined surface 27 is formed on the bottom of the groove 25a so as to gradually recede from the front surface of the molded circuit molded component 11b as the distance from the optical element mounting base 12b increases. Therefore, the lens resin overflowing from the round hole 31 can easily enter the concave groove 25a, and it can be further prevented that the lens resin remains on the front surface of the molded circuit molded component 11b and burr is formed. Furthermore, since the circuit pattern 24a is formed on the inclined surface 27, the wiring length between the light receiving diode PD and the integrated circuit element IC2 can be shortened compared to the case where the inclined surface 27 is not formed, There is an advantage that noise resistance is improved.
[0037]
(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, in the optical receptacle A described in the first embodiment, two positioning protrusions 1 a that are in contact with the front surfaces of the optical element blocks on the transmission side and the reception side are provided on the back side of the front wall of the housing 1. Each of the four positioning protrusions 1a is in contact with the front surface of the optical element block on the transmitting side or the receiving side, thereby ensuring a clearance for the burr 14b to escape from the front surface of the optical element block. The optical element block is positioned. In addition, since it is the same as that of Embodiment 1 except the point which provided the positioning protrusion 1a in the housing 1, the same code | symbol is attached | subjected to a common component and the description is abbreviate | omitted.
[0038]
As described in the first embodiment, the lens 14 is formed on the front end surface of the optical element mounting base 12b by the casting method described in the related art. In the casting method, the round hole 31 of the casting case 30 shown in FIG. After injecting the lens resin, the optical element mounting base 12b is inserted into the round hole 31, and the optical element mounting base 12b is heated to the resin curing temperature of the lens resin while pressing and pressing the optical element mounting base 12b toward the casting case 30 side. Since the lens resin is cured, the lens resin overflowing from the round hole 31 when the optical element mounting base 12b is inserted into the round hole 31 adheres to the front surface of the molded circuit molded component 11b, and the adhered lens resin The burr 14b may be formed by curing.
[0039]
When the burr 14b remains on the front surface of the molded circuit molded component 11b when the optical element block 10b is housed in the housing 1, the burr 14b interferes with the inner wall of the housing 1 to position the molded circuit molded component 11b. However, in this embodiment, four positioning projections 1a are provided on the back side of the front wall of the housing 1, and these positioning projections 1a serve as front surfaces of the optical element block 10b (FIG. 4A). By contacting the portion D), a clearance enough to escape the burr 14b can be secured between the front surface of the optical element block 10b and the front wall of the housing 1 facing the front surface of the optical element block 10b. The optical element block 10b can be accurately positioned with respect to the housing 1 by the positioning protrusion 1a coming into contact with the front surface of the optical element block 10b.
[0040]
In this embodiment, the positioning projection 1a is formed on the inner wall portion of the housing 1 facing the front surface of the molded circuit molded component 11b. However, the positioning projection 1a is in contact with the inner wall of the housing 1 on the front surface of the molded circuit molded component 11b. Positioning protrusions for positioning the three-dimensional circuit molded component 11b may be formed, or positioning protrusions on both the inner wall portion of the housing 1 facing the front surface of the three-dimensional circuit molded component 11b and the front surface of the three-dimensional circuit molded component 11b. May be formed.
[0041]
【The invention's effect】
As described above, the invention of claim 1 is an optical receptacle to which an optical plug including an optical transmission medium such as an optical fiber is connected, and includes an optical signal and an electrical signal transmitted through the optical transmission medium. An optical element that performs photoelectric conversion between the optical element, a three-dimensional circuit molded component that is provided with a columnar optical element mounting base on which the optical element is mounted on the front end surface, and an optical path between the optical element and the optical transmission medium A resin lens formed by the casting method on the front end surface of the optical element mounting base and a cylindrical sleeve communicating with the internal storage chamber protrude from the front surface so that the optical element is mounted on the sleeve. And a housing for housing the molded circuit molded component in the storage room with the base inserted, and a recess for storing the resin forming the lens near the base of the optical element mounting table on the front surface of the molded circuit molded component. It is characterized by providing, When the lens is formed on the tip surface of the optical element mounting base by the casting method, the resin overflowing from the casting case enters the recess formed near the base of the optical element mounting base. Resin can be prevented from adhering and remaining. Therefore, when the optical element block is housed in the housing, the resin adhering to the front surface of the molded circuit molded part interferes with the inner wall of the housing like the conventional optical element block. There is an effect that the optical element block can be accurately positioned with respect to the housing.
[0042]
According to a second aspect of the present invention, in the first aspect of the invention, the concave portion is provided with an inclined surface that inclines so as to recede from the front surface of the molded circuit molded component as the distance from the optical element mounting base increases. By providing, the resin overflowing from the casting case can easily enter the recess, and the resin can be further prevented from remaining on the front surface of the molded circuit molded component.
[0043]
The invention according to claim 3 is an optical receptacle to which an optical plug having an optical transmission medium such as an optical fiber is connected, and photoelectric conversion between an optical signal transmitted through the optical transmission medium and an electric signal. And an optical element between the optical element and the optical transmission medium, and a three-dimensional circuit molded component having a columnar optical element mounting base on which the optical element is mounted on the front end surface. The resin lens formed by the casting method on the front end surface of the optical element mounting base, and the cylindrical sleeve communicating with the internal storage chamber project from the front, and the optical element mounting base is inserted into the sleeve And a housing in which the molded circuit molded component is housed in the storage chamber, and at least one of the front surface of the molded circuit molded component or the inner wall of the housing facing the front surface of the molded circuit molded component, and the other Solid by contacting It is characterized by providing positioning projections for positioning the road molding parts with respect to the housing, and when the lens is formed on the tip surface of the optical element mounting table by the casting method, the resin overflowing from the casting case is molded into a three-dimensional circuit Even if burrs are formed on the front surface of the component, a positioning projection is provided to provide a clearance for the burr to escape between the front surface of the optical element block and the inner wall of the housing facing the front surface of the optical element block. The optical element block can be accurately positioned with respect to the housing.
[Brief description of the drawings]
1A and 1B show an optical element block used in an optical receptacle according to Embodiment 1, wherein FIG. 1A is a front view, FIG. 1B is a side view, and FIG.
FIG. 2 is a side sectional view of the optical receptacle same as above.
FIG. 3 is a side sectional view of an optical receptacle according to a second embodiment.
4A and 4B show an optical element block used in the above, wherein FIG. 4A is a front view, FIG. 4B is a BB cross-sectional view, and FIG. 4C is a CC cross-sectional view.
5A and 5B show a conventional optical element block, in which FIG. 5A is a cross-sectional view of a transmission-side optical element block, and FIG. 5B is a cross-sectional view of a reception-side optical element block.
FIGS. 6A to 6D are explanatory views of a conventional lens forming process.
[Explanation of symbols]
10b Optical element block 11b Three-dimensional circuit molded component 12b Optical element mounting bases 25a to 25d

Claims (3)

An optical receptacle to which an optical plug having an optical transmission medium such as an optical fiber is connected, an optical element that performs photoelectric conversion between an optical signal transmitted through the optical transmission medium and an electrical signal, and The tip of the optical element mounting base is positioned so that the columnar optical element mounting base on which the optical element is mounted on the front end face is located in the optical path between the three-dimensional circuit molded component provided on the front surface and the optical element and the optical transmission medium. A plastic lens formed by casting on the surface and a cylindrical sleeve that communicates with the internal storage chamber project from the front, and a three-dimensional circuit is molded in the storage chamber with the optical device mounting base inserted in the sleeve An optical receptacle comprising a housing in which a component is housed, and a recess for storing a resin for forming a lens is provided in the vicinity of the base of the optical element mounting base on the front surface of the molded three-dimensional circuit component. 2. The optical receptacle according to claim 1, wherein an inclined surface that is inclined so as to recede from the front surface of the molded circuit molded component as the distance from the optical element mounting base is provided in the concave portion. An optical receptacle to which an optical plug having an optical transmission medium such as an optical fiber is connected, an optical element that performs photoelectric conversion between an optical signal transmitted through the optical transmission medium and an electrical signal, and The tip of the optical element mounting base is positioned so that the columnar optical element mounting base on which the optical element is mounted on the front end face is located in the optical path between the three-dimensional circuit molded component provided on the front surface and the optical element and the optical transmission medium. A plastic lens formed by casting on the surface and a cylindrical sleeve that communicates with the internal storage chamber project from the front, and a three-dimensional circuit is molded in the storage chamber with the optical device mounting base inserted in the sleeve 3D circuit molding by contacting with the other side of at least one of the front surface of the 3D circuit molded component or the inner wall of the housing facing the front surface of the 3D circuit molded component. How to parts Optical receptacle, characterized by comprising providing a positioning projection for positioning against ring.

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