JP3931018B2 - Manufacturing method of flat wiring body - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a wiring body used for mutual wiring of electrical equipment, and more particularly to a method for manufacturing a flat wiring body.
[0002]
[Prior art]
As a wiring body used for mutual wiring of electrical equipment, a flat wiring body (Flexible Flat Circuit) is known (see Japanese Patent No. 2821733). The flat wiring body includes a wiring layer having a plurality of wirings between a pair of insulating films. In the flat wiring body described in the above-mentioned patent publication, a copper foil pattern is provided between a pair of laminate films, and a relatively large current can flow. This flat wiring body is used in place of wiring for electronic control of a door panel of an automobile, for example.
[0003]
Said flat wiring body was produced by the method containing each process of the following processes a to process e. Step a is a step of bonding the carrier tape and the copper foil. Step b is a step of cutting only the copper foil to form a copper foil pattern. Step c is a step of transferring the copper foil pattern to the first laminate tape. In step d, the first laminate tape formed in step c and the second laminate tape having the adhesive layer on the side of the first laminate tape on which the copper foil pattern is provided are overlapped to form a laminate, In this step, the laminate is heated and pressed so as to be sandwiched between two heating rolls, and the first laminate tape, the copper foil pattern, and the second laminate tape are thermally fused. Step e is a step of removing the outer shape of the heat-sealed laminate.
[0004]
[Problems to be solved by the invention]
However, in the above-described method, since the laminate in which the copper foil pattern is provided between the first and second laminate tapes is heat-sealed using a heating roll, the laminate tape may be wrinkled. In particular, when a second laminate tape having an opening is used, the tension applied to the second laminate tape is not uniform in the vicinity of the opening. Due to such wrinkles, the first laminate tape, the copper foil pattern, and the second laminate tape may be bonded at positions shifted from each other. Moreover, when the 2nd laminate tape which has an opening part was used, it was also a problem that the adhesive agent of the contact bonding layer of a 2nd laminate tape protruded from an opening part.
[0005]
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a flat wiring body in which a pair of insulating films and a wiring layer are heat-fused without shifting.
[0006]
[Means for Solving the Problems]
The manufacturing method of the flat wiring body of this invention prepares the 1st process which prepares the 1st film provided with the wiring layer which has several wiring, and the 2nd film which has the contact bonding layer comprised with the hot-melt material. The wiring layer in which the second film and the adhesive layer of the second film are provided on the first film by conveying the second film while being adsorbed to the adsorption unit by a conveying unit including the adsorption unit. The second film is superposed on the first film so as to face the first film, and the second film is temporarily bonded to the first film by partially melting the adhesive layer, and the first film and the first film A third step of forming a laminate having the wiring layer between two films, heating the laminate in a region corresponding to the wiring layer to melt the adhesive layer , and using a flat plate, Territory By pressing the serial laminate, include, a fourth step of heat sealing the second film to the first film and the wiring layer by the adhesive force of the adhesive layer, the object is achieved by the Is done.
[0007]
The fourth step is preferably performed under reduced pressure.
[0008]
The first step preferably includes a step of forming the wiring layer with a conductive foil and transferring the wiring layer to the first film having an adhesive layer.
[0009]
In the second step, the second film having a plurality of openings is prepared, and in the third step, the plurality of openings of the second film expose a predetermined portion of the wiring layer. In addition, the first film and the second film are overlapped.
[0010]
The first step is a step of transferring the wiring layer formed of a conductive foil to the tape-like first film having an adhesive layer. The first step, the third step, and the fourth step Is preferably carried out on a line through which the tape-like first film is fed.
[0011]
In the third step, it is preferable that the second film is formed in a rectangular shape, and the temporary adhesion is performed at four corners of the second film.
[0012]
In the third step, in the third step, the suction unit moves the second film in the first film while moving the second film in a direction perpendicular to the first film surface while sucking the second film. It is preferable to superimpose.
[0013]
Hereinafter, the operation of the present invention will be described.
[0014]
According to the flat wiring body manufacturing method of the present invention, the laminated body in the region corresponding to the wiring layer is heated. The adhesive layer in this region becomes molten by heating. Since it presses using a flat plate, the laminated body of said area | region is pressed with a uniform pressure, and a wrinkle does not generate | occur | produce in the 2nd film of said area | region. In this state, the second film is heat-sealed to the first film and the wiring layer via the adhesive layer that is in a molten state. Accordingly, it is possible to produce a flat wiring body in which the second film is thermally fused to the first film and the wiring layer without being displaced.
[0015]
By performing the fourth step under a reduced pressure state, air bubbles are suppressed / prevented from being enclosed between the first film and the wiring layer and the second film.
[0016]
A flat wiring body that is suitably used for the application of a relatively large current by including a step of forming the wiring layer with a conductive foil and transferring the wiring layer to a first film having an adhesive layer. Can be produced efficiently.
[0017]
Generation of wrinkles and bubbles is suppressed / prevented and the second film is heat-sealed to the first film and the wiring layer without shifting, so the second film provided with an opening for exposing the wiring layer is provided. In this configuration, a flat wiring body can be obtained in which a plurality of exposed portions of the wiring layer are accurately formed at positions where the openings are designed.
[0018]
The first step is a step of transferring the wiring layer formed of the conductive foil to a tape-like first film having an adhesive layer, and the first step, the third step, and the fourth step are the tape-like steps. The production efficiency of the flat wiring body can be increased by adopting a configuration in which the first film is carried on each line.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Below, the embodiment of the manufacturing method of the flat wiring body used for the wiring of the rear combination lamp of a motor vehicle using the manufacturing method of the flat wiring body of the present invention is described. The wiring of a rear combination lamp of an automobile is provided in a narrow space and is relatively complicated. For such wiring, a flexible flat wiring body is preferably used.
[0020]
A flowchart of a method for manufacturing a flat wiring body according to an embodiment of the present invention is shown in FIG. FIG. 2 is a schematic view of the method for manufacturing the flat wiring body 100 according to the present embodiment.
[0021]
As shown in FIG. 1, the flat wiring body 100 according to the present embodiment includes a step of preparing a laminate tape provided with a copper foil pattern, a step of preparing a perforated laminate tape, a temporary bonding step, a vacuum fusing step, It is formed through each step of the outer shape removing step. As shown in FIG. 2C, the flat wiring body 100 has a copper foil exposed portion as a connection terminal at a predetermined position.
[0022]
As shown in FIG. 1, in the manufacturing method of the flat wiring body 100 of this embodiment, the laminate tape 11 provided with the copper foil pattern 13 as shown to Fig.2 (a) is prepared. FIG. 2A shows a part of the laminate tape 11, and a plurality of copper foil patterns 13 are provided on the entire laminate tape 11. The material of the laminating tape 11 is not particularly limited as long as it is an insulating film, and an adhesive layer for adhering the copper foil pattern 13 to the laminating tape 11 may be provided. The adhesive layer is formed using, for example, a hot melt material. In the present embodiment, the laminate tape 11 has a PET (polyethylene terephthalate resin) base film and an adhesive layer (not shown, polyolefin adhesive) formed thereon. The laminate tape 11 provided with the copper foil pattern 13 is prepared by a known method. In particular, it is preferable to form a wiring layer with a conductor foil such as a copper foil, since it is possible to automate the transfer of a plurality of copper foil patterns 13 to the laminate tape 11 (see Japanese Patent No. 2821733). In this embodiment, copper foil is used as the material for the wiring layer, but the material for the wiring layer is not particularly limited as long as it is a conductor, and is selected according to the application in consideration of electrical resistance, thermal conductivity, and the like. The In particular, forming the wiring layer with a conductive foil such as a copper foil is suitable for applications in which a relatively large current flows.
[0023]
As shown in FIG. 1, a perforated laminate tape 12 is prepared. The perforated laminate tape 12 is not particularly limited as long as it is an insulating film having an adhesive layer (not shown). The adhesive layer and the insulating film are formed of a known material, and it is preferable that the adhesive layer and the insulating film are formed of the same material as the laminate tape 11 provided with the copper foil pattern 13 because the manufacturing cost can be reduced. In this embodiment, as shown in FIG. 2A, the perforated laminate tape 12 is cut to a predetermined size corresponding to the copper foil pattern 13. The holes 14 are opened so that the copper foil pattern is exposed at a predetermined position, and a plurality of (for example, 6 to 9) copper foil patterns 13 are aligned per one hole-laminated laminate tape 12. Open. In this embodiment, the hole 14 is formed using a Victoria blade. Using a substrate provided with a plurality of Victoria blades so as to form the holes 14 at predetermined positions, the holes can be efficiently punched into the laminate tape used in this embodiment.
[0024]
Next, the laminate tape 11 provided with the copper foil pattern 13 and the perforated laminate tape 12 are temporarily bonded. As shown in FIG. 2 (a), the laminate tape 11 provided with the copper foil pattern 13 and the perforated laminate tape 12 are overlapped so that the copper foil pattern 13 is sandwiched between the respective laminate tapes 11 and 12. . At this time, the perforated laminate tape 12 is superposed while being aligned so that the hole 14 forms the copper foil exposed portion 16 at a predetermined position, and is temporarily bonded by heating and pressing at the time of superposition. . Thereby, the laminated body 15 which has the copper foil pattern 13 between each laminate tape 11 and 12 is formed (refer FIG.2 (b)). Temporary adhesion is performed by heating and pressing the laminate tape 11 and, for example, the four corners of the perforated laminate tape 12 and bonding them together. The part to be temporarily bonded of the laminated body 15 is arbitrarily selected, and it is only necessary that the respective laminated tapes are bonded so that there is no slack or tension so as not to deviate from a predetermined position.
[0025]
Subsequently, the laminate 15 described above is heated and pressed under reduced pressure conditions. The region of the laminated body 15 to be heated and pressed is a region 17 corresponding to the copper foil pattern 13 indicated by a dotted line in FIG. The region 17 includes a region where the copper foil pattern 13 exists between the laminate tape 11 and the perforated laminate tape 12 and a region having a width of about several mm from the edge of the copper foil pattern 13, and is heated using a heating flat plate. Then, the laminated tape 11 and the copper foil pattern 13 are heat-sealed. Thus, the sticking out of the adhesive layer of the adhesive layer of the laminate tape from the hole, which is seen when the heating roll is used by pressing with a flat plate, is suppressed / prevented. If necessary, in order to form fixing ears 18 or the like for fixing the flat wiring body, a desired portion of the laminate tape 11 and the perforated laminate tape 12 not including the wiring layer of the laminated body are heat-melted with each other. You may wear it.
[0026]
As shown in FIG. 2 (c), the heat-sealed laminate 15 has its outer shape removed by a known method using, for example, an outer shape cutter, etc., so as to have a predetermined shape, and is placed at a predetermined position. The flat wiring body 100 in which the copper foil exposed portion 16 is formed as a connection terminal is obtained.
[0027]
Next, the configuration of the production line for the flat wiring body 100 according to the present embodiment will be described with reference to FIGS. 3, 4, and 5.
[0028]
As shown in FIG. 3, the production line of the flat wiring body 100 according to the present embodiment includes a copper foil pattern transfer device, a temporary bonding device, and a vacuum fusing device arranged on the line where the laminate tape 11 is sent, This process is performed on the line through which the laminate tape 11 is fed.
[0029]
The laminating tape delivery machine sends out each laminating tape by a certain size. The copper foil pattern transfer device transfers the copper foil pattern 13 to the laminate tape 11. The laminating tape punching device opens holes 14, and the fixed size cutting device cuts the perforated laminating tape 12 to a certain size. A well-known thing is used for a laminate tape sending machine and a copper foil pattern transfer apparatus. Further, the laminating tape punching device is a device capable of making a hole in the laminating tape, and the fixed size cutting device is not particularly limited as long as it is a device capable of cutting the laminating tape into a certain size.
[0030]
The temporary bonding process is performed by, for example, the temporary bonding apparatus 400 illustrated in FIG. As shown in FIG. 4, the laminating tape 11 provided with the copper foil pattern 13 is fixed by the clamp 410 of the temporary bonding apparatus 400. The perforated laminating tape 12 is adsorbed by suction to the adsorbing part 420 attached to the biaxial conveying robot 440 and conveyed onto the laminating tape 11 provided with the copper foil pattern 13, and the hole 14 is predetermined. The copper foil exposed portion 16 is aligned at the position. Next, the pedestal 470 is vertically raised by the cylinder 450, and the suction portion 420 is vertically lowered by the cylinder 460. Laminate tape 11 and perforated laminate tape 12 are overlaid, and the four corners of perforated laminate tape 12 are heated by temporary adhesive heater 430. The respective laminate tapes are temporarily bonded to each other at the four corners to form a laminate 15.
[0031]
The vacuum fusion process is performed by, for example, the vacuum fusion apparatus 500 shown in FIG. The laminate 15 is heated and pressed under reduced pressure. When the region of the laminate 15 to be heated and pressed enters the vacuum fusing device 500, the lower plate 520 is lifted vertically by the cylinder 510. At this time, the laminate 15 is sandwiched and fixed by the opening edge 520a of the lower board and the elastic sheet 550 provided on the upper board 540, and the inside of the chamber 570 is sealed. Next, the vacuum pump 580 is activated, and the inside of the chamber 570 is decompressed through the pipe 581. After the pressure in the chamber 570 is sufficiently reduced, the hot plate 530 and the heated pressing plate 530a are lifted vertically by the cylinder 560. The heat pressing flat plate 530a presses the region 17 of the laminated body 15 corresponding to the copper foil pattern 13 shown by the dotted line in FIG. As described above, the perforated laminate tape 12 is heat-sealed to the laminate tape 11 and the copper foil pattern 13. The heat-sealed laminate 15 is wound up by a winder after passing through a fixed-size feeder.
[0032]
Each process of the above-mentioned production line is carried out by sending the laminate tape 11 by a certain size, and the outer shape is removed in a subsequent process, whereby the flat wiring body 100 is manufactured. Furthermore, an apparatus for preventing meandering of the laminate tape, an apparatus for trimming both ends of the heat-sealed laminate 15, and the like may be used in the above production line as necessary.
[0033]
As described above, by carrying out the copper foil pattern transfer process, the temporary bonding process, and the vacuum fusing process on the line where the laminate tape 11 is sent, each automated process can be operated simultaneously and integrated production can be performed. The production efficiency of the flat wiring body can be increased.
[0034]
Conventionally, when it is necessary to form a copper foil exposed portion, a mask tape is previously applied to a portion of the copper foil pattern on which the copper foil exposed portion is to be formed, and after heat sealing using a heating roll, the mask The copper foil exposed part was formed by peeling the tape. However, in applications where the copper foil exposed part used for the connection terminal is small and high positional accuracy is required to form the copper foil exposed part, the mask tape should be made small and carefully masked after heat sealing. It had to peel off and the production efficiency was low.
[0035]
According to the flat wiring body manufacturing method of the present embodiment, the generation of wrinkles and bubbles is suppressed / prevented, and the laminate tape and the copper foil are heat-sealed without deviating from a predetermined position. Therefore, in a configuration where the copper foil exposed portion needs to be formed with high accuracy as a connection terminal, a plurality of holes of the laminate tape are predetermined in the copper foil pattern using a laminate tape provided with a plurality of holes. By superimposing the respective laminate tapes so as to expose the portions, it is possible to obtain a flat wiring body in which the holes are accurately exposed at the positions as designed. Further, since the work of peeling the mask tape is unnecessary, the production efficiency is high.
[0036]
【The invention's effect】
According to the method for manufacturing a flat wiring body of the present invention, in the region corresponding to the wiring layer, the second film heat-sealed to the first film and the wiring layer is suppressed / prevented from wrinkling. Accordingly, it is possible to manufacture a flat wiring body in which the second film is heat-sealed to the first film and the wiring layer without shifting.
[0037]
According to the method for producing a flat wiring body of the present invention, for example, a flat wiring body in which a copper foil pattern is heat-sealed with high positional accuracy can be efficiently produced by suppressing or preventing generation of wrinkles and bubbles between laminate tapes. Can be manufactured. The method for manufacturing a flat wiring body of the present invention is suitably used for manufacturing a flat wiring body that is required to form a plurality of contact portions with high positional accuracy.
[Brief description of the drawings]
FIG. 1 is a flowchart of a method for manufacturing a flat wiring body 100 according to an embodiment of the present invention.
FIG. 2 is a schematic diagram of a method for manufacturing the flat wiring body 100 according to the present embodiment.
FIG. 3 is a diagram illustrating a configuration of a production line of the flat wiring body 100 according to the present embodiment.
FIG. 4 is a side view of the temporary bonding apparatus according to the present embodiment.
FIG. 5 is a side view of the vacuum fusing apparatus according to the present embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Laminate tape 12 Hole-laminated laminate tape 13 Copper foil pattern 14 Hole 15 Laminated body 16 Copper foil exposed part 17 Area | region 18 Fixing ear 100 Flat wiring body 400 Temporary bonding apparatus 410 Clamp 420 Adsorption part 430 Temporary adhesion heater 440 Conveying robot 450, 460 Cylinder 470 Base 500 Vacuum fusion device 510, 560 Cylinder 520 Lower plate 520a Open edge of lower plate 530 Hot plate 530a Heating press plate 540 Upper plate 550 Elastic sheet 570 Chamber 580 Vacuum pump 581 Tube

Claims (7)

A first step of preparing a first film provided with a wiring layer having a plurality of wirings;
A second step of preparing a second film having an adhesive layer made of a hot-melt material ;
The second film is transported while being attracted to the suction portion by a transport means having a suction portion so that the adhesive layer of the second film faces the wiring layer provided on the first film. The second film is superposed on the first film, and the adhesive film is partially melted to temporarily bond the second film to the first film, and between the first film and the second film. A third step of forming a laminate having the wiring layer in
By heating the laminated body in a region corresponding to the wiring layer to melt the adhesive layer , and pressing the laminated body in the region using a flat plate, the first adhesive layer has an adhesive force . A fourth step of thermally fusing the second film to the film and the wiring layer;
The manufacturing method of the flat wiring body including this.   The flat wiring body manufacturing method according to claim 1, wherein the fourth step is performed under a reduced pressure state.   3. The method of manufacturing a flat wiring body according to claim 1, wherein the first step includes a step of forming the wiring layer with a conductive foil and transferring the wiring layer to the first film having an adhesive layer. . In the second step, preparing the second film having a plurality of openings,
In the third step, the first film and the second film are overlapped so that the plurality of openings of the second film expose a predetermined portion of the wiring layer. 4. A method for producing a flat wiring body according to any one of 3 above. The first step is a step of transferring the wiring layer formed of a conductive foil to the tape-like first film having an adhesive layer,
The said 1st process, the said 3rd process, and the said 4th process are the manufacturing methods of the flat wiring body of Claim 3 or 4 each implemented by the line through which the said tape-shaped said 1st film is sent. In the said 3rd process, the said 2nd film is formed in the rectangular shape, The manufacturing method of the flat wiring body in any one of Claim 1 to 5 which performs the said temporary adhesion to the four corners of the said 2nd film. . The said 3rd process WHEREIN: The said adsorption | suction part overlaps the said 2nd film on the said 1st film by moving to a perpendicular direction with respect to the said 1st film surface, adsorb | sucking the said 2nd film. The manufacturing method of the flat wiring body in any one of 1-6.

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