JP3935406B2 - Mold release method for resin molded products - Google Patents
Mold release method for resin molded products Download PDFInfo
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- JP3935406B2 JP3935406B2 JP2002234245A JP2002234245A JP3935406B2 JP 3935406 B2 JP3935406 B2 JP 3935406B2 JP 2002234245 A JP2002234245 A JP 2002234245A JP 2002234245 A JP2002234245 A JP 2002234245A JP 3935406 B2 JP3935406 B2 JP 3935406B2
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- 229920005989 resin Polymers 0.000 title claims description 64
- 239000011347 resin Substances 0.000 title claims description 64
- 238000000034 method Methods 0.000 title claims description 22
- 238000005266 casting Methods 0.000 claims description 40
- 238000000465 moulding Methods 0.000 claims description 20
- 230000000694 effects Effects 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 2
- RDYMFSUJUZBWLH-UHFFFAOYSA-N endosulfan Chemical compound C12COS(=O)OCC2C2(Cl)C(Cl)=C(Cl)C1(Cl)C2(Cl)Cl RDYMFSUJUZBWLH-UHFFFAOYSA-N 0.000 description 2
- 238000004512 die casting Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、樹脂成形品の離型方法に関し、更に詳しくは接着効果のある樹脂を成形する金型についての樹脂成形品の離型方法に関する。
【０００２】
【従来の技術】
従来、エポキシ樹脂などの接着効果のある樹脂を用いて製品を成形する場合、成形品が金型と密着してしまうために離型が困難であり、金型に離型剤を塗布する方法と、樹脂に離型剤を混入する方法とがあった。また、離型剤を使わずに離型する方法として、振動子を組み込んだ金型を利用して、離型時にこの振動子を駆動して成形品の離型を容易にしようとする様々な考案も成されていた。
【０００３】
例えば、特公昭６０−８９２９号の「成形品の離型方法」は、キャビティ金型と係合するコア金型に摺動可能にコア部を取り付け、このキャビティ内面を構成するコア部に振動子を取り付けて、離型中又は離型開始前にこの振動子を加振して成形品を離型しようとするものである。
【０００４】
また、特開平３−１０６５５５号の「金型鋳造機の入子付金型」は、固定金型とこの固定金型に当接する可動金型と、これら金型の少なくとも一方に装着された入子とを備えた金型鋳造機の入子付金型において、前記入子の外表面に微小の振動を発生する振動発生装置を装着し、この振動発生装置を離型前に作動させるようにしたことを特徴とするものである。
【０００５】
【発明が解決しようとする課題】
しかしながら、従来の技術では、接着効果のあるエポキシ樹脂等の樹脂成形品を成形する金型に離型剤を塗布する方法も、樹脂に離型剤を混入する方法も、何れの場合にも樹脂と金型との間に離型剤が入り込んで邪魔をするために、成形品への金型の転写性が悪くなった。また、振動を利用する方法においては、従来は金型に直接振動装置を設置して金型を振動させる方法であったために、成形品が複雑な形状の場合や、接着性の強い樹脂を使用するような場合には、離型が不十分であった。
【０００６】
上記発明は、このような従来の問題を解決するためになされたものであり、その目的は、接着効果のある樹脂成型品の離型を容易にする成形品の離型方法を提供することである。
【０００７】
【課題を解決するための手段】
前述した目的を達成するための本発明の手段は、振動子から発生する振動を用いて樹脂成形品を成形金型から離型する樹脂成形品の離型方法において、前記成形金型は大気開放の注形型であり、前記振動子は音波又は超音波の振動を発生させる平板状振動子であり、前記注形型のキャビティ内で硬化した樹脂成形品の平面部に直接面で接触するように前記振動子を配設して該樹脂成形品を離型することを特徴とする。
【０００８】
音波又は超音波の振動を発生させる第二の平板状振動子を前記注形型に直接面で接触するように配設して前記樹脂成形品を離型することを特徴とする。
【０００９】
また、前記樹脂成形品に接触する前記振動子と前記注形型に接触する前記第二の振動子とが発生させる振動の周波数が互いに異なることを特徴とする。
【００１０】
また、前記樹脂成形品に接触する前記振動子と前記注形型に接触する前記第二の振動子とが発生させる振動の周波数が同一であり、かつ互いに位相が異なることを特徴とする。
【００１１】
また、前記位相の差は１８０度であることを特徴とする。
【００１２】
また、前記注形型と前記樹脂成形品とを半波の振動で交互に振動させることを特徴とする。
【００１３】
また、前記振動の周波数は前記樹脂成形品又は前記注形型との共振周波数であることを特徴とする。
【００１５】
【発明の実施の形態】
以下、本発明の実施の形態を図面に基づいて詳細に説明する。図１は本発明の第一の実施の形態である樹脂成形金型を示す断面模式図である。
【００１６】
まず、図１により、本発明の第一の実施の形態である樹脂成形金型の構成について説明する。図１において、１は樹脂成形金型であるキャビティ１ａを有する大気開放の注形型である。２は注形型１へ充填された接着効果のあるエポキシ樹脂等の樹脂が加熱されて硬化した例えばレンズなどの樹脂成形品である。３は平板形状をした振動子であり、成形後の成形品２の上面に振動子３の自重又は気体圧力やバネ圧力で直接接触するように配設されている。４は振動子３に配線されて、音波又は超音波の振動を発生する超音波発振器である。
【００１７】
次に、第一の実施の形態の注形型１で成形品２を成形して離型するまでの作用・効果について説明する。まず、注形型１のキャビティ１ａに、エポキシ樹脂等の樹脂を注形型１のキャビティ１ａへ注入する。樹脂が所定時間の加熱により硬化して成形品２が成形された後、振動子３を成形品２の上面に配設し、超音波発振器４を起動する。すると、信号が伝わって振動子３を駆動するので、振動子３が接している成形品２に振動が伝わる。振動は直接には成形品２のみに伝わるが、成形品２と接している注形型１にも間接的に伝わる。この振動により成形品２は離型が容易になった。そして、これに伴い成形品２のキャビティ１ａからの転写性もよくなった。
【００１８】
図２は、本発明の第二の実施の形態である樹脂成形金型を示す断面模式図である。図２により、本発明の第二の実施の形態である樹脂成形金型の構成について説明する。図２において、５は平板形状をした第二の振動子であり、注形型１の下面に注形型１の自重又は気体圧力やバネ圧力で直接接触するように配設されている。６は第二の振動子５に配線されて、音波又は超音波の振動を発生する超音波発振器である。その他の構成は第一の実施の形態と同様であるから、同じ構成要素には同じ符号と名称を用いて詳細な説明は省略する。
【００１９】
次に、第二の実施の形態の注形型１で成形品２を成形して離型するまでの作用・効果について説明する。まず、注形型１のキャビティ１ａに、エポキシ樹脂等の樹脂を注形型１のキャビティ１ａへ注入する。樹脂が所定時間の加熱により硬化して成形品２が成形された後、振動子３を成形品２の上面に、第二の振動子５を注形型１の下面にそれぞれ配設し、超音波発振器４及び第二の超音波発振器６を起動する。すると、信号が振動子３及び第二の振動子５に伝わり、振動子３及び振動子５を駆動するので、振動子３の振動は成形品２に、振動子５の振動は注形型１に伝わる。この振動により成形品２は注形型１との離型が容易になる。
【００２０】
図３は、本発明の第三の実施の形態である樹脂成形金型を示す断面模式図である。図３により、本発明の第三の実施の形態である樹脂成形金型の構成について説明する。図３において、一台の共通の超音波発振器４が振動子３と共に第二の振動子５にも接続されている。また、７は駆動信号の位相を変換する位相器であり、振動子３と超音波発振器４との間に接続されている。したがって、振動子３と振動子５には同一の周波数で異なる位相を持つ振動が発生するようになっている。その他の構成は第二の実施の形態と同様なので、同じ構成要素には同じ符号と名称を用いて、詳細な説明は省略する。
【００２１】
次に、第三の実施の形態の注形型１で成形品２を成形して離型するまでの作用・効果について説明する。まず、注形型１のキャビティ１ａに、エポキシ樹脂等の樹脂を注形型１のキャビティ１ａへ注入する。樹脂が所定時間の加熱により硬化して成形品２が成形された後、振動子３を成形品２の上面に、第二の振動子５を注形型１の下面にそれぞれ配設し、超音波発振器４及び位相器７を起動する。すると、同一の周波数の振動が振動子３及び振動子５に発生し、振動子３の振動の位相が振動子５のものとは異なる。振動子３の振動が成形品２に、振動子５の振動が注形型１に伝わる。これらの振動の位相が異なっているので、成形品２は注形型１から容易に離型する。
【００２２】
図４は、本発明の第四の実施の形態である樹脂成形金型を示す断面模式図である。図４により、本発明の第四の実施の形態である樹脂成形金型の構成について説明する。図４において、８は、超音波発振器４の信号の位相を１８０度変換する１８０度位相器である。第三の実施の形態と異なるところは、位相器７が１８０位相器８に置き換わっている点のみである。その他の構成は第三の実施の形態と同様なので、同じ構成要素には同じ符号と名称を用いて、詳細な説明は省略する。
【００２３】
次に、第四の実施の形態の注形型１で成形品２を成形して離型するまでの作用・効果について説明する。樹脂が所定時間の加熱により硬化して成形品２が成形された後、超音波発振器４及び１８０度位相器８を起動する。すると、同一の周波数の振動が振動子３及び第二の振動子５に発生し、振動子３の振動の位相は第二の振動子５の振動の位相と１８０度異なっているので、成形品２と注形型１とには１８０度異なる位相の振動が伝わる。この振動により成形品２は注形型１との離型が容易になる。
【００２４】
図５は、本発明の第五の実施の形態である樹脂成形金型を示す断面模式図である。図５により、本発明の第五の実施の形態である樹脂成形金型の構成について説明する。図５において、９は、超音波発振器４の信号の波形を整形する波形整形器であり、超音波発振器４の出力信号を入力し、その信号波形を半波で互いに位相が１８０度異なる二つの信号に分割して出力するものである。一方の信号は振動子３へ、他方の信号は振動子５へと交互に入力される。その他の構成は第三の実施の形態と同様なので、同じ構成要素には同じ符号と名称を用いて、詳細な説明は省略する。
【００２５】
次に、第五の実施の形態の注形型１で成形品２を成形して離型するまでの作用・効果について説明する。樹脂が所定時間の加熱により硬化して成形品２が成形された後、超音波発振器４及び波形整形器９を起動する。すると、同一の周波数であり、波形が半波の信号が１８０度位相を変えて二つの信号線へ出力される。従って振動子３及び第二の振動子５には、交互に半波信号が入力されることになる。こうして成形品２と注形型１とには交互に振動が伝わる。この振動により成形品２は注形型１との離型が容易になる。
【００２６】
以上の実施形態の説明において、周波数の値は特に限定しないが、注形型１又は成形品２の共振周波数とした場合に、特に良好な効果を奏する。
【００２７】
【発明の効果】
以上説明したように、本発明によれば、振動子から発生する振動を用いて樹脂成形品を成形金型から離型する樹脂成形品の離型方法において、成形金型は大気開放の注形型であり、成形品そのものに直接振動が伝わるように、前記振動子を直接前記成形品に接触するように配設したので、接着効果のある樹脂成形品の離型が容易になり、成形品の転写性が良くなった。
【００２８】
また、振動子を金型の方にも直接接触するように設置して、成形品と金型とをそれぞれ振動させたので、成形品の離型が更に容易になった。
【００２９】
また、金型と成形品とに加える各々の振動モードを、周波数を異ならせること、位相を異ならせること、半波信号で交互に振動させることなど様々に工夫することで成形品の離型を更に容易にすることができた。
【００３０】
また、振動の周波数を、樹脂成形品又は注形型の共振周波数にすることにより、一層良好な効果が得られた。
【図面の簡単な説明】
【図１】本発明の第一の実施の形態である樹脂成形金型の模式断面図である。
【図２】本発明の第二の実施の形態である樹脂成形金型の模式断面図である。
【図３】本発明の第三の実施の形態である樹脂成形金型の模式断面図である。
【図４】本発明の第四の実施の形態である樹脂成形金型の模式断面図である。
【図５】本発明の第五の実施の形態である樹脂成形金型の模式断面図である。
【符号の説明】
１ 注形型
１ａ キャビティ
２ 成形品
３ 振動子
４ 超音波発振器
５ 第二の振動子
６ 第二の超音波発振器
７ 位相器
８ １８０度位相器
９ 波形整形器[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for releasing a resin molded product, and more particularly to a method for releasing a resin molded product for a mold for molding a resin having an adhesive effect.
[0002]
[Prior art]
Conventionally, when a product is molded using a resin having an adhesive effect such as an epoxy resin, it is difficult to release because the molded product is in close contact with the mold, and a method of applying a release agent to the mold There was a method of mixing a release agent into the resin. In addition, as a method of releasing without using a release agent, there are various methods for easily releasing a molded product by using a die incorporating a vibrator and driving the vibrator at the time of release. The idea was also made.
[0003]
For example, Japanese Patent Publication No. 60-8929 discloses a “mold release method” in which a core portion is slidably attached to a core die that engages with a cavity die, and a vibrator is attached to the core portion constituting the inner surface of the cavity. Is attached, and the vibrator is vibrated during mold release or before mold release starts to release the molded product.
[0004]
Japanese Patent Application Laid-Open No. 3-106555 discloses a “molded die for a die casting machine” which is a fixed mold, a movable mold that comes into contact with the fixed mold, and an insert mounted on at least one of these molds. In a mold with a insert of a mold casting machine having a child, a vibration generator for generating minute vibrations is mounted on the outer surface of the insert, and this vibration generator is operated before mold release. It is characterized by that.
[0005]
[Problems to be solved by the invention]
However, in the conventional technique, in both cases, a method of applying a release agent to a mold for molding a resin molded product such as an epoxy resin having an adhesive effect, and a method of mixing a release agent into the resin Since the mold release agent enters between the mold and the mold, the transferability of the mold to the molded product deteriorated. Also, in the method using vibration, the conventional method is to directly install a vibration device on the mold and vibrate the mold, so if the molded product has a complicated shape or a resin with strong adhesiveness is used. In such a case, the mold release was insufficient.
[0006]
The present invention has been made to solve such a conventional problem, and an object thereof is to provide a method for releasing a molded product that facilitates release of a resin molded product having an adhesive effect. is there.
[0007]
[Means for Solving the Problems]
The means of the present invention for achieving the above-described object is the method for releasing a resin molded product from the mold using vibration generated from a vibrator, wherein the molding die is opened to the atmosphere. The vibrator is a flat-plate vibrator that generates sonic or ultrasonic vibrations, and is in direct contact with the flat portion of the resin molded product cured in the cavity of the casting mold. Wherein the vibrator is disposed to release the resin molded product.
[0008]
The resin molded product is released by disposing a second flat plate-like vibrator for generating a sonic or ultrasonic vibration so as to be in direct contact with the casting mold.
[0009]
The vibration frequency generated by the vibrator contacting the resin molded product and the second vibrator contacting the casting mold may be different from each other.
[0010]
Further, the vibration frequency generated by the vibrator contacting the resin molded product and the second vibrator contacting the casting mold are the same, and the phases are different from each other.
[0011]
The phase difference is 180 degrees.
[0012]
Further, the casting mold and the resin molded product are vibrated alternately by half-wave vibration.
[0013]
The frequency of the vibration is a resonance frequency with the resin molded product or the casting mold.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic sectional view showing a resin mold according to the first embodiment of the present invention.
[0016]
First, referring to FIG. 1, the structure of a resin molding die according to the first embodiment of the present invention will be described. In FIG. 1, reference numeral 1 denotes a casting mold open to the atmosphere having a cavity 1a which is a resin mold. Reference numeral 2 denotes a resin molded product such as a lens in which a resin such as an epoxy resin having an adhesive effect filled in the casting mold 1 is heated and cured. 3 is a vibrator having a flat plate shape, and is arranged so as to be in direct contact with the upper surface of the molded article 2 after molding by its own weight, gas pressure or spring pressure. Reference numeral 4 denotes an ultrasonic oscillator that is wired to the vibrator 3 and generates a sound wave or an ultrasonic vibration.
[0017]
Next, operations and effects until the molded product 2 is molded and released from the casting mold 1 of the first embodiment will be described. First, a resin such as an epoxy resin is injected into the cavity 1 a of the casting mold 1 into the cavity 1 a of the casting mold 1. After the resin is cured by heating for a predetermined time and the molded product 2 is molded, the vibrator 3 is disposed on the upper surface of the molded product 2 and the ultrasonic oscillator 4 is activated. Then, since the signal is transmitted to drive the vibrator 3, the vibration is transmitted to the molded product 2 with which the vibrator 3 is in contact. The vibration is directly transmitted only to the molded product 2 but is also indirectly transmitted to the casting mold 1 in contact with the molded product 2. Due to this vibration, the molded product 2 can be easily released. As a result, the transferability of the molded product 2 from the cavity 1a also improved.
[0018]
FIG. 2 is a schematic cross-sectional view showing a resin molding die according to the second embodiment of the present invention. With reference to FIG. 2, the structure of the resin mold which is the second embodiment of the present invention will be described. In FIG. 2, reference numeral 5 denotes a flat plate-like second vibrator, which is disposed so as to be in direct contact with the lower surface of the casting mold 1 by its own weight, gas pressure or spring pressure. Reference numeral 6 denotes an ultrasonic oscillator that is wired to the second vibrator 5 and generates a sound wave or an ultrasonic vibration. Since other configurations are the same as those of the first embodiment, the same reference numerals and names are used for the same components, and detailed description thereof is omitted.
[0019]
Next, operations and effects until the molded product 2 is molded and released from the casting mold 1 of the second embodiment will be described. First, a resin such as an epoxy resin is injected into the cavity 1 a of the casting mold 1 into the cavity 1 a of the casting mold 1. After the resin is cured by heating for a predetermined time to form the molded product 2, the vibrator 3 is disposed on the upper surface of the molded product 2, and the second vibrator 5 is disposed on the lower surface of the casting mold 1. The sonic oscillator 4 and the second ultrasonic oscillator 6 are activated. Then, the signal is transmitted to the vibrator 3 and the second vibrator 5 to drive the vibrator 3 and the vibrator 5, so that the vibration of the vibrator 3 is in the molded product 2 and the vibration of the vibrator 5 is in the casting mold 1. It is transmitted to. This vibration facilitates release of the molded product 2 from the casting mold 1.
[0020]
FIG. 3 is a schematic cross-sectional view showing a resin molding die according to the third embodiment of the present invention. With reference to FIG. 3, the structure of the resin molding die which is 3rd embodiment of this invention is demonstrated. In FIG. 3, one common ultrasonic oscillator 4 is connected to the second vibrator 5 together with the vibrator 3. A phase shifter 7 converts the phase of the drive signal and is connected between the vibrator 3 and the ultrasonic oscillator 4. Therefore, vibrations having different phases at the same frequency are generated in the vibrator 3 and the vibrator 5. Since other configurations are the same as those of the second embodiment, the same reference numerals and names are used for the same components, and detailed description thereof is omitted.
[0021]
Next, operations and effects until the molded product 2 is molded and released from the casting mold 1 of the third embodiment will be described. First, a resin such as an epoxy resin is injected into the cavity 1 a of the casting mold 1 into the cavity 1 a of the casting mold 1. After the resin is cured by heating for a predetermined time to form the molded product 2, the vibrator 3 is disposed on the upper surface of the molded product 2, and the second vibrator 5 is disposed on the lower surface of the casting mold 1. The sound wave oscillator 4 and the phase shifter 7 are activated. Then, vibrations of the same frequency are generated in the vibrator 3 and the vibrator 5, and the vibration phase of the vibrator 3 is different from that of the vibrator 5. The vibration of the vibrator 3 is transmitted to the molded product 2, and the vibration of the vibrator 5 is transmitted to the casting mold 1. Since the phases of these vibrations are different, the molded product 2 is easily released from the casting mold 1.
[0022]
FIG. 4 is a schematic sectional view showing a resin mold according to the fourth embodiment of the present invention. With reference to FIG. 4, the structure of a resin molding die according to a fourth embodiment of the present invention will be described. In FIG. 4, 8 is a 180 degree phase shifter which converts the phase of the signal of the ultrasonic oscillator 4 by 180 degrees. The only difference from the third embodiment is that the phase shifter 7 is replaced with a 180 phase shifter 8. Since other configurations are the same as those of the third embodiment, the same reference numerals and names are used for the same components, and detailed description thereof is omitted.
[0023]
Next, operations and effects until the molded product 2 is molded and released from the casting mold 1 of the fourth embodiment will be described. After the resin is cured by heating for a predetermined time and the molded product 2 is molded, the ultrasonic oscillator 4 and the 180-degree phase shifter 8 are activated. Then, vibrations with the same frequency are generated in the vibrator 3 and the second vibrator 5, and the vibration phase of the vibrator 3 is 180 degrees different from the vibration phase of the second vibrator 5. 2 and the casting mold 1 are transmitted with vibrations having a phase different by 180 degrees. This vibration facilitates release of the molded product 2 from the casting mold 1.
[0024]
FIG. 5 is a schematic cross-sectional view showing a resin molding die according to a fifth embodiment of the present invention. With reference to FIG. 5, the structure of a resin molding die according to a fifth embodiment of the present invention will be described. In FIG. 5, 9 is a waveform shaper for shaping the waveform of the signal of the ultrasonic oscillator 4, and the output signal of the ultrasonic oscillator 4 is inputted, and the signal waveform is a half wave and has two phases different from each other by 180 degrees. The signal is divided and output. One signal is input to the vibrator 3 and the other signal is input to the vibrator 5 alternately. Since other configurations are the same as those of the third embodiment, the same reference numerals and names are used for the same components, and detailed description thereof is omitted.
[0025]
Next, operations and effects until the molded product 2 is molded and released from the casting mold 1 according to the fifth embodiment will be described. After the resin is cured by heating for a predetermined time and the molded product 2 is molded, the ultrasonic oscillator 4 and the waveform shaper 9 are activated. Then, a signal having the same frequency and a half-wave shape is output to the two signal lines with a phase difference of 180 degrees. Accordingly, half-wave signals are alternately input to the vibrator 3 and the second vibrator 5. In this way, vibration is alternately transmitted to the molded product 2 and the casting mold 1. This vibration facilitates release of the molded product 2 from the casting mold 1.
[0026]
In the above description of the embodiment, the value of the frequency is not particularly limited. However, when the resonance frequency of the casting mold 1 or the molded product 2 is used, a particularly good effect is achieved.
[0027]
【The invention's effect】
As described above, according to the present invention, in the mold release method for a resin molded product in which the resin molded product is released from the molding die using vibration generated from the vibrator, the molding die is cast into the atmosphere. Since the vibrator is disposed so as to directly contact the molded product so that vibration is directly transmitted to the molded product itself, it is easy to release the resin molded product having an adhesive effect, and the molded product. Improved transferability.
[0028]
In addition, since the vibrator was installed so as to be in direct contact with the mold, and the molded product and the mold were vibrated, it was easier to release the molded product.
[0029]
In addition, the molds and molds can be separated from each other by variously devising various vibration modes, such as making the frequency different, making the phase different, and alternately vibrating with half-wave signals. It could be made easier.
[0030]
Further, a better effect was obtained by setting the vibration frequency to the resonance frequency of the resin molded product or the casting mold.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a resin molding die according to a first embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of a resin molding die according to a second embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view of a resin molding die according to a third embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view of a resin molding die according to a fourth embodiment of the present invention.
FIG. 5 is a schematic cross-sectional view of a resin molding die according to a fifth embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Casting type | mold 1a Cavity 2 Molded article 3 Vibrator 4 Ultrasonic oscillator 5 Second vibrator 6 Second ultrasonic oscillator 7 Phaser 8 180 degree phaser 9 Waveform shaper
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002234245A JP3935406B2 (en) | 2002-08-12 | 2002-08-12 | Mold release method for resin molded products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002234245A JP3935406B2 (en) | 2002-08-12 | 2002-08-12 | Mold release method for resin molded products |
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| JP2004074445A JP2004074445A (en) | 2004-03-11 |
| JP3935406B2 true JP3935406B2 (en) | 2007-06-20 |
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| JP2002234245A Expired - Fee Related JP3935406B2 (en) | 2002-08-12 | 2002-08-12 | Mold release method for resin molded products |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8701441B2 (en) | 2006-08-21 | 2014-04-22 | 3M Innovative Properties Company | Method of making inorganic, metal oxide spheres using microstructured molds |
| JP2012045713A (en) * | 2010-08-24 | 2012-03-08 | Toshiba Mach Co Ltd | Mold releasing method |
| JP5154674B2 (en) | 2011-06-08 | 2013-02-27 | シャープ株式会社 | Resin molding apparatus and resin molding method |
| CN103958150B (en) | 2012-11-09 | 2017-09-19 | 夏普株式会社 | Shape material producing device and molding manufacture method |
| CN109591236B (en) * | 2018-12-24 | 2020-12-15 | 佛山市悦勇塑料包装有限公司 | Vibration form removal device for production of cast plastic products |
| CN114454398A (en) * | 2022-02-14 | 2022-05-10 | 浙江伊鲁博生物科技有限公司 | Nose line wheel mould for medical mask machine |
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