JP3940652B2 - Electronic component mounting board and disk device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting board that can be incorporated into various electronic devices and a disk device having the electronic component mounting board .
[0002]
[Prior art]
In a magnetic disk device, a management label on which a production lot number, a barcode, or the like is printed is often affixed in order to manage member lots. At this time, the management label is usually attached to a flexible substrate assembly having a connection between the carriage and the main printed circuit board.
[0003]
8 and 9 show the configuration of a conventional flexible substrate assembly 8.
[0004]
The flexible substrate assembly 8 includes a first substrate portion 21 and a second substrate portion 22 each having a structure in which a flexible substrate is bonded on a reinforcing plate, and the first substrate portion 21 and the second substrate portion 22. Are connected by a bendable connecting portion 23 therebetween.
[0005]
The reinforcing plate 35 of the second substrate portion 22 is integrally provided with a movable portion support portion 24. The movable portion support portion 24 has the other end of the movable portion 25 of the flexible board connected to the carriage side. Is supported.
[0006]
Further, a connector 26 connected to the connector of the main printed circuit board is attached on the flexible substrate of the first substrate unit 21. Various chip components 28 such as a head amplifier IC 27 are mounted on the flexible substrate of the second substrate unit 22.
[0007]
When the flexible substrate assembly 8 is assembled to a magnetic disk device, first, the first substrate portion 21 and the second substrate portion 22 are bent at the connecting portion 23 and overlapped in the state shown in FIG. At this time, the substrate portions 21 and 22 are restrained in the folded state shown in FIG. 9 by bending the hook-like protrusions 29 of the first substrate portion 21 and fitting them into the protrusions 30 provided on the other substrate portion 22. Is done. Moreover, the movable part support part 24 is bent so as to stand up with respect to the substrate surface.
[0008]
Next, the flexible board assembly 8 in the form in which the board portions 21 and 22 are folded in this manner is assembled in the case with the mounting surface of the connector 26 facing the main printed board. At this time, the flexible board assembly 8 The connector 26 is connected to the connector of the main printed circuit board.
[0009]
By the way, since the flexible substrate assembly 8 is cleaned before or after assembly, the management label attached to the flexible substrate assembly 8 is required to have an adhesive force that does not peel or drop off due to cleaning. In addition, a polyimide film is usually used as the material for the coverlay that covers the surface of the flexible substrate, and since this has a low affinity with the adhesive generally used in labels, it may be peeled off by the cleaning. There is.
[0010]
Under such circumstances, as shown in FIG. 9, the management label 33 is stuck on the head amplifier IC 27 on the flexible substrate.
[0011]
[Problems to be solved by the invention]
However, if the data transfer speed at the time of reading / writing is improved, the influence of noise that gets on the signal between the driver IC and the head element becomes a serious problem.
[0012]
Therefore, as shown in FIG. 10, a chip-on-carriage method or a chip-on-suspension method in which the head amplifier IC 27 that has been mounted on the flexible substrate assembly 8 is mounted on the carriage 5 or the suspension 17 has been adopted. ing.
[0013]
As a result, the head amplifier IC 27 is not mounted on the flexible board assembly 8, and therefore, there is a problem that a region for attaching the management label 33 is lost from the flexible board assembly 8.
[0014]
The present invention solves such problems, and the electronic component mounting substrate and magnetic disk device suitable for attaching a label such as a management label, particularly when a chip-on-carriage method or a chip-on-suspension method is adopted. An object of the present invention is to provide an electronic component mounting substrate and a magnetic disk device suitable for label sticking.
[0015]
[Means for Solving the Problems]
To achieve the above object, an electronic component mounting board according to the invention of claim 1 includes a flexible substrate, and a reinforcing plate for reinforcing the flexible substrate attached to overlap on one surface of the flexible substrate, wherein A reinforcing plate exposed portion formed on the flexible substrate so that a part of the reinforcing plate is exposed, and a label attached to the surface of the reinforcing plate exposed through the reinforcing plate exposed portion It is characterized by that. Thereby, a label can be affixed with a big adhesive force with respect to the reinforcement board exposed part, Therefore Therefore, it can prevent reliably that a management label peels and drops | omits by washing | cleaning etc. in a production line.
[0016]
The electronic component mounting board according to the invention of claim 2 includes a flexible substrate, and a reinforcing plate for reinforcing the flexible substrate attached to overlap on one surface of the flexible substrate, the pasted the reinforcement A reinforcing plate exposing part formed on each of the reinforcing plate and the flexible substrate so that a part of the reinforcing plate is exposed by folding and overlapping the plate and the flexible substrate; And a label attached to the surface of the reinforcing plate exposed through the section. Thereby, a label can be affixed with a big adhesive force with respect to the reinforcement board | substrate exposed part, and it can prevent reliably that a management label peels off by the washing | cleaning in a manufacturing line, etc.
[0017]
According to a third aspect of the present invention, there is provided a disk device that supports a head element that reads / writes signals from / to a disk-shaped storage medium and moves the head element relative to the storage medium, and a circuit that controls the carriage section. electrically and an electronic component mounting board to connect the electronic component mounting board, previously end electrically connected to the carriage and the circuit board which is provided, and said printed circuit board and the carriage portion A flexible board having a possible extension, a reinforcing plate that is attached to overlap one surface of the flexible board to reinforce the flexible board, and a part of the reinforcing board is exposed on the flexible board. The reinforcing plate exposed part formed and the label affixed on the surface of the said reinforcing board exposed through the said reinforcing plate exposed part are comprised.
[0018]
As a result, the adhesive strength of the management label to the electronic component mounting substrate can be made sufficiently strong, the management label can be prevented from being peeled off during the manufacturing process of the magnetic disk device, and the management of production lots, etc. is accurate. Can be implemented reliably. In addition, it is possible to easily control the positioning of the manufacturing machine or the assembly machine using the exposed portion as a management label attaching portion or as an information reading position on the label. Further, by adopting a chip-on-carriage method or a chip-on-suspension method, when the head amplifier IC is excluded from the electronic component mounting substrate, it is possible to secure a management label attaching position in place of the head amplifier IC surface. it can.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0020]
FIG. 7 is a perspective view showing a configuration of a magnetic disk device according to an embodiment of the present invention. As shown in FIG. 7, this magnetic disk device includes a rectangular box-like case 1 having an upper surface opened, and And a top cover (not shown) that is screwed to the upper end opening of the case 1.
[0021]
In the case 1 are two magnetic disks 2 as magnetic recording media, a spindle motor 3 that supports and rotates these magnetic disks 2, a plurality of magnetic heads 4 that read and write information from and to the magnetic disk 2, and each magnetic head A carriage 5 that supports the magnetic disk 2 movably, a voice coil motor 6 that rotates and positions the carriage 5, a ramp load mechanism 7 that holds the magnetic head 4 at a position spaced from the magnetic disk 2, and A flexible substrate assembly 8 is accommodated.
[0022]
On the outer surface of the bottom 13 of the case 1, a main printed circuit board 31 mounted with a CPU, a memory, an HDD controller, and other circuits for controlling the spindle motor 3, the voice coil motor 6, and the magnetic head 4 is screwed. ing.
[0023]
The magnetic disk 2 is fitted to a hub (not shown) of the spindle motor 3 and is held by a clamp spring 9. The magnetic disk 2 is rotationally driven by the spindle motor 3 at a predetermined speed.
[0024]
The carriage 5 has a bearing assembly 10 fixed to the upper surface of the bottom 13 of the case 1. The bearing assembly 10 has a pivot 11 standing on the upper surface of the bottom 13 of the case 1, and a bearing on the pivot 11. And a cylindrical hub 12 that is rotatably supported therethrough.
[0025]
The carriage 5 has a plurality of arms 14 extending from the bearing assembly 10 attached to the hub 12, a support frame 15 attached to the bearing assembly 10 and extending to the opposite side of the arm 14, and supported by each arm 14. The head arm assembly 16 is provided. Each arm 14 extends in parallel to each other at a predetermined interval from the hub 12 in the same direction.
[0026]
The head arm assembly 16 has an elongated plate-like suspension 17 that can be elastically deformed, and a magnetic head 4 fixed to the tip of the suspension. The suspension 17 is fixed to the tip of the arm 14 by welding. A voice coil 18 is integrally provided on the support frame 15 of the carriage 5, and is positioned between a pair of yokes 19 fixed on the case 1.
[0027]
The voice coil 18 forms a voice coil motor 6 together with a magnet 20 attached to one or both of the yokes 19. When the voice coil 18 is energized, the carriage 5 rotates about the pivot 11, and the magnetic head 4 is moved and positioned on a predetermined track of the magnetic disk 2.
[0028]
1 is a perspective view showing a state before the flexible substrate assembly 8 is folded in FIG. 7, FIG. 2 is a perspective view showing a state in which the flexible substrate assembly 8 is folded, and FIG. 3 is a detailed sectional view of FIG. It is.
[0029]
As shown in these drawings, the flexible substrate assembly 8 includes a first substrate portion 21 and a second substrate portion 22 each having a structure in which a flexible substrate 34 and a reinforcing plate 35 are bonded to each other. The portion 21 and the second substrate portion 22 are connected by a bendable connecting portion 23. The connecting part 23 is a part composed only of the flexible substrate 34.
[0030]
The reinforcing plate 35 may be made of a material having high rigidity such as aluminum and can be attached and fixed with the flexible substrate 34.
[0031]
The flexible substrate 34 includes layers of a base film 38, a conductive metal foil 39, an adhesive 40, and a cover lay 41, and is attached to the reinforcing plate 35 with an adhesive 36.
[0032]
The reinforcing plate 35 of the second substrate part 22 is integrally provided with a movable part support part 24. The movable part support part 24 is a flexible board having one end connected to the carriage 5 shown in FIG. The other end of the movable part 25 is connected.
[0033]
On the flexible substrate 34 of the first substrate unit 21, a connector 26 connected to the connector 32 of the main printed circuit board 31 shown in FIG. Various chip components 28 excluding, for example, a head amplifier IC are mounted on the flexible substrate 34 of the second substrate unit 22. That is, the head amplifier IC is mounted on the carriage 5 and the suspension 17 shown in FIG.
[0034]
When the flexible substrate assembly 8 is assembled to a magnetic disk device as shown in FIG. 7, for example, first, the first substrate portion 21 and the second substrate portion 22 are bent at the connecting portion 23 to obtain the state shown in FIG. Overlapping. At this time, the substrate portions 21 and 22 are restrained in the folded state shown in FIG. 2 by bending the hook-like protrusions 29 of the first substrate portion 21 and fitting them into the protrusions 30 provided on the other substrate portion 22. Is done. Moreover, the movable part support part 24 is bent so as to stand up with respect to the substrate surface.
[0035]
Next, the flexible board assembly 8 in such a manner that the board portions 21 and 22 are folded in this manner is assembled in the case 1 with the mounting surface of the connector 26 facing the main printed board 31. At this time, the flexible board assembly is assembled. 8 connector 26 is connected to connector 32 of main printed circuit board 31.
[0036]
When the chip-on-carriage method or the chip-on-suspension method shown in FIG. 10 is employed, the mounting position of the head amplifier IC is moved from the flexible board assembly 8 to the carriage 5 or the suspension 17. In view of this, the flexible substrate assembly 8 uses the exposed portion 37 of the reinforcing plate 35 as a management label attaching portion instead of the surface of the head amplifier IC.
[0037]
That is, in the second substrate portion 21, the flexible substrate 34 is not formed so as to overlap the entire surface of the reinforcing plate 35, but is formed in a shape that exposes the minimum part necessary for attaching the management label 33. The portion 37 where the reinforcing plate 35 is exposed is used as a management label attaching portion.
[0038]
Since the management label 33 can be attached to the exposed portion 37 of the reinforcing plate 35 in this way, high adhesion reliability can be obtained as in the case where the management label 33 is attached to the surface of the head amplifier IC. In this production process, it is possible to prevent the management label 33 from peeling off or dropping off.
[0039]
Further, the edge of the cutout portion 22a, which is the reinforcing plate exposing portion provided on the flexible substrate 34 in order to expose a part of the reinforcing plate 35, is set as a target position for determining the attachment position of the management label 33. Therefore, the positional accuracy when the labeling operation is automatically mechanized can be improved. In addition, when reading the printed contents of the label using an optical reader or the like, it is possible to easily position the label reading range and improve the reading accuracy.
[0040]
Next, another embodiment of the present invention will be described.
[0041]
4 and 5 show the configuration of a flexible substrate assembly 8 according to another embodiment.
[0042]
In the previous embodiment, the outer shapes of the reinforcing plates 35 of the respective board portions 21 and 22 are designed to be exactly overlapped. Therefore, the management label attaching portion of the reinforcing plate 35 is the upper and lower overlapping reinforcing plate 35. Will be secured on top.
[0043]
The flexible substrate assembly 8 shown in FIGS. 4 and 5 is provided with a cutout portion 22b which is a reinforcing plate exposing portion so as to be continuous with the flexible substrate 34 belonging to the second substrate portion 22 and the reinforcing plate 35. The surface of the reinforcing plate 35 belonging to the first substrate part 21 is exposed at the position of the notch part 22b and used as a part where the management label 33 is attached.
[0045]
The present invention is not limited to any of the above-described embodiments, and can be implemented with appropriate modifications within the scope of the technical idea of the present invention.
[0046]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an electronic component mounting board suitable for attaching a label such as a management label. In addition, it is possible to provide an electronic component mounting substrate suitable for label sticking when a chip-on-carriage method or a chip-on-suspension method is employed in a magnetic disk device.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a flexible substrate assembly according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a state in which the substrate portion shown in FIG. 1 is folded.
3 is a cross-sectional view of the substrate portion taken along line XX in FIG.
FIG. 4 is a perspective view showing a flexible substrate assembly according to another embodiment of the present invention.
FIG. 5 is a perspective view showing a state in which the substrate portion shown in FIG. 4 is folded.
6 is a cross-sectional view taken along line YY of the substrate portion in FIG.
FIG. 7 is a perspective view of the magnetic disk device using the flexible substrate assembly according to the present invention when the lid is opened.
FIG. 8 is a perspective view showing a conventional flexible substrate assembly.
9 is a perspective view showing a state in which the substrate portion shown in FIG. 8 is folded. FIG.
FIG. 10 is a perspective view showing a mounting position of a head amplifier IC by a conventional chip-on-carriage method.
[Explanation of symbols]
8 ... Flexible substrate assembly 27 ... Head amplifier IC
33 ... Management label 34 ... Flexible substrate 35 ... Reinforcing plate 37 ... Display part

Claims (5)

A flexible substrate ;
A reinforcing plate for reinforcing the flexible substrate attached to overlap on one surface of the flexible substrate,
A reinforcing plate exposed portion formed on the flexible substrate so that a part of the reinforcing plate is exposed;
An electronic component mounting board comprising: a label attached to a surface of the reinforcing plate exposed through the reinforcing plate exposing portion. A flexible substrate ;
A reinforcing plate for reinforcing the flexible substrate attached to overlap on one surface of the flexible substrate,
The pasted the reinforcing plate and the reinforcing plate exposed portion respectively formed on the flexible substrate and the reinforcing plate so as to expose a portion of the reinforcing plate by overlapping both bent and the flexible substrate When,
An electronic component mounting board comprising: a label attached to a surface of the reinforcing plate exposed through the reinforcing plate exposing portion. A carriage unit that supports a head element that reads and writes signals from and on a disk-shaped storage medium, and moves the carriage relative to the storage medium;
A printed circuit board provided with a circuit for controlling the carriage unit;
An electronic component mounting board for electrically connecting the carriage part and the printed board;
The electronic component mounting board is:
A flexible substrate-edge has an electrically connectable extending portion and the carriage portion,
A reinforcing plate that is attached so as to overlap one surface of the flexible substrate and reinforces the flexible substrate;
A reinforcing plate exposed portion formed on the flexible substrate so that a part of the reinforcing plate is exposed;
And a label affixed to a surface of the reinforcing plate exposed through the reinforcing plate exposing portion. A carriage unit that supports a head element that reads and writes signals from and on a disk-shaped storage medium, and moves the carriage relative to the storage medium;
A printed circuit board provided with a circuit for controlling the carriage unit;
An electronic component mounting board for electrically connecting the carriage part and the printed board;
The electronic component mounting board is:
A flexible substrate ;
A reinforcing plate for reinforcing the flexible substrate attached to overlap on one surface of the flexible substrate,
The pasted the reinforcing plate and the reinforcing plate exposed portion respectively formed on the flexible substrate and the reinforcing plate so as to expose a portion of the reinforcing plate by overlapping both bent and the flexible substrate When,
And a label attached to the surface of the reinforcing plate exposed through the reinforcing plate exposing portion.   5. The disk device according to claim 3, wherein a drive circuit for driving the head element is mounted on the carriage unit.

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