JP3940831B2 - Heat treatment apparatus and method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat treatment apparatus and method for heating and cooling an object to be processed such as a glass substrate, a semiconductor substrate, and a printed board. Specifically, the present invention relates to a heat treatment apparatus and method for heating and lowering a plate-like object to be processed in a horizontal state on a heat treatment plate.
[0002]
[Prior art]
As a conventional heat treatment apparatus, a first heat treatment zone and a second heat treatment zone are provided as in a continuous furnace, for example, and the object to be treated is unloaded from the first heat treatment zone through the second heat treatment zone. There is one that causes a stepwise temperature change (hereinafter simply referred to as heat treatment) to an object. The stepwise temperature change includes a combination of heating and cooling as well as two-step heating such as preheating and main heating.
[0003]
[Problems to be solved by the invention]
In the above-described conventional heat treatment apparatus, vibration during conveyance of the workpiece is inevitable. For this reason, for example, when the film is baked on the substrate as the object to be processed by the heat treatment apparatus, the baked film thickness is not uniform, or the bump shape is distorted or uneven when the solder bump is formed. The problem arises.
[0004]
In addition, there is a problem of heat loss from the transfer device provided in the heat treatment apparatus and the opening at both ends, and a problem of enlargement of the heat treatment apparatus. Some objects to be processed have shapes that are not suitable for conveyance.
[0005]
It is an object of the present invention to provide a heat treatment apparatus and method in which an object to be processed does not vibrate during heat treatment. It is another object of the present invention to provide a heat treatment apparatus and method that are small in heat loss, small in size, and capable of performing heat treatment with high accuracy regardless of the shape of the workpiece.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, the heat treatment apparatus of the present invention comprises:
A heat treatment plate having a heat treatment plate on which a work piece is placed is provided, two flow paths are provided inside the heat treatment plate, and heat media having different temperatures are passed through one flow path and the other flow path. The object to be processed placed thereon is subjected to heat treatment.
[0007]
According to this heat treatment apparatus, since the heat treatment can be performed without transporting the object to be treated, the object to be treated does not vibrate during the heat treatment. In addition, since heat treatment is not performed while the object to be processed is being conveyed, a space for conveying the object to be processed is not required, the apparatus is downsized, and heat loss is reduced. In addition, a workpiece having a shape that is not suitable for transport can be heat-treated with high accuracy. In addition, since there are two flow paths through which the heat medium flows, the heat medium is not mixed, and the selection range of the heat medium to be used is widened.
[0008]
In this heat treatment apparatus,
The heat treatment plate is hollow, a plate-like partition member that partitions the inside of the heat treatment plate in two is provided movably in a direction perpendicular to the partition member, and two flow paths are formed in the heat treatment plate, When the heat medium flows in one flow path, the plate-shaped partition member moves to close the other flow path, and when the heat medium flows in the other flow path, the plate-shaped partition member moves. Then, one flow path may be closed.
[0009]
According to this apparatus, when the heat medium flows in the heat treatment plate, the plate-like partition member moves up and down or back and forth so that the entire heat treatment plate is filled with one kind of heat medium. Can be changed quickly. Therefore, the object to be processed can be heated or cooled quickly and uniformly.
[0010]
Also,
When the heat treatment plate is hollow and two flow paths are formed in the heat treatment plate by the film-shaped partition member that divides the heat treatment plate into two, and when the heat medium is flowed into one flow path, the film-shaped partition member Is deformed and the other channel is closed, and when the heat medium is caused to flow through the other channel, the membrane-shaped partition member may be deformed to close the other channel.
[0011]
Also in this apparatus, when the heat medium flows through the heat treatment plate, the membrane partition member is deformed and one of the two flow paths is closed, so that the same effect as described above can be obtained.
[0012]
In addition, the heat treatment method of the present invention allows the object to be processed to be processed by the first heat medium flowing in one channel with respect to the object to be processed placed on the object heat treatment plate in which the two channels are formed. After the temperature change, the inflow of the heat medium into one flow path is stopped, and the second heat medium is flowed into the other flow path to further change the temperature of the object to be processed.
[0013]
According to this method, heat treatment can be performed without conveying the workpiece.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0015]
The heat treatment apparatus (1) according to the first embodiment shown in FIG. 1 includes a processing chamber (2) formed by a heat insulating wall and a plurality of processing chambers (2) arranged at intervals in the vertical direction. A heat insulating horizontal partition wall (3) and a heat treatment plate (4) to be processed disposed on the partition wall (3) are provided. ) Is arranged.
[0016]
Note that a plurality of workpiece loading / unloading ports (2a) are formed on the front wall of the processing chamber (2) at intervals in the vertical direction, and a door (5) for opening and closing each loading / unloading port (2a) is provided. . Furthermore, an atmosphere gas supply pipe (6) and an atmosphere gas discharge pipe (7) penetrating the rear wall of the processing chamber (2) are provided, and an atmosphere gas can be introduced into the heat treatment chamber as necessary. In addition, the atmospheric gas can be discharged from the processing chamber. Although not shown, a known object carrying-in / out apparatus is arranged in front of the heat treatment apparatus (1), and the object (P) is carried in / out by the carrying-in / out apparatus.
[0017]
FIG. 2 shows details of the heat treatment plate (4). The heat treatment plate (4) is hollow, the heat medium introduction pipe (8) and the heat medium outlet pipe (9) are connected to each other, and the hollow part (4a) serves as a first heat medium flow path. The heat medium introduction pipe (8) and the heat medium lead-out pipe (9) are connected to a first heat medium storage tank (not shown) via valves (B1) and (B2), respectively, and a hollow portion (4a ) Is collected and reused.
[0018]
Further, in the hollow portion (4a), a pipe (10) extending in a meandering manner as viewed from above is disposed, and this pipe (10) serves as a second flow path. Each end of the pipe (10) penetrates the rear wall of the heat treatment plate (4) and protrudes to the outside. The pipe (10) is also connected to a second heat medium storage tank (not shown) via valves (B3) and (B4) so that the heat medium flowing through the pipe (10) is recovered and reused as described later. It has become.
[0019]
In addition, although illustration was abbreviate | omitted, the piping part which connects each heat-medium storage tank and the heat processing board (4) is covered with the heat insulating material.
[0020]
In this heat treatment apparatus, heat treatment is performed as follows. The procedure for placing the object to be treated (P) on the heat treatment plate (4) and taking it out after the heat treatment is a known procedure, and hence the object to be treated (P The procedure for performing the heat treatment will be described.
[0021]
First, the valves (B1) and (B2) are opened from the state where the valves (B1), (B2), (B3) and (B4) are closed, so that the first heat medium having a predetermined temperature flows through the hollow portion (4a). The heat medium flowing through the hollow portion (4a) returns to the first heat medium storage tank. Thus, the heat medium circulates between the first heat medium storage tank and the heat treatment plate (4), and the heat medium whose temperature has been lowered is returned to the predetermined temperature again in the storage tank. Heat is not wasted. In this way, the workpiece (P) on the heat treatment plate (4) is brought to a predetermined temperature. Note that the first heat medium may flow after the object to be processed (P) is placed on the heat treatment plate (4), or on the heat treatment plate (4) on which the first heat medium is flowing. A processed product (P) may be placed.
[0022]
Next, the valves (B1) and (B2) are closed. Thereafter, the valves (B3) and (B4) are opened so that the second heat medium having a predetermined temperature (a temperature different from the first heat medium) flows through the pipe (10). Similarly to the above case, the second heat medium circulates between the second storage tank and the heat treatment plate (4).
In this way, the workpiece (P) is brought to a predetermined temperature by heat transfer through the first heat medium.
[0023]
What is necessary is just to select suitably the heat medium sent through a hollow part (4a) and piping (10) with use temperature. For example, water is preferable if the operating temperature is 10 to 80 ° C., methanol is preferable if the operating temperature is up to 130 ° C., silicon oil or fluorocarbon is preferable if the operating temperature is 50 to 230 ° C., and naphthalene is preferable if the operating temperature is 200 to 350 ° C.
[0024]
What is necessary is just to select a heating time and temperature fall time suitably.
[0025]
The heat treatment plate (4) and the pipe (10) preferably have good thermal conductivity. Specifically, aluminum or copper is preferable.
[0026]
Next, a heat treatment apparatus according to another embodiment of the present invention will be described with reference to FIG. Note that the heat treatment apparatus described below has the same configuration as the heat treatment apparatus (1) described above except for the portions shown in the drawing, and a description thereof will be omitted.
[0027]
FIG. 3 shows an enlarged cross-sectional view of the heat treatment plate portion. In this hollow heat treatment plate (11), a horizontal plate-like partition member (12) is arranged so as to be movable in a direction perpendicular thereto, that is, in an up-and-down direction, and the heat treatment plate (11) is arranged by this horizontal plate-like partition member (12). The interior is divided up and down. FIG. 3 shows a state in which equal amounts of the first and second heat media are contained in the heat treatment plate (11). The horizontal plate-like partition member (12) is positioned at the heat treatment plate (11). It changes with the quantity of the 1st, 2nd heat carrier of the inside. The first heat medium introduction pipe (16) and the first heat medium outlet pipe (15) are connected to the lowermost part of the heat treatment plate (11). In addition, a second heat medium introduction pipe (13) and a second heat medium outlet pipe (14) are connected to the top. Each pipe (13) (14) (15) (16) is provided with a valve (B5) (B6) (B7) (B8).
[0028]
In this heat treatment plate (11), the valves (B5) and (B8) are closed, and the valves (B8) are opened from the state in which the valves (B6) and (B7) are opened, and the first heat medium introduction pipe (16) is opened. The first heat medium having a predetermined temperature flows into the heat treatment plate (11). Then, the first heat medium flows out from the first heat medium outlet pipe (15) to the outside of the heat treatment plate (11). At this time, since the horizontal plate-like partition member (12) is movable up and down, it is pushed up by the pressure of the first heat medium flowing into the heat treatment plate (11), and the heat treatment plate (11) is in the first position. Filled with heat medium. In this way, the workpiece (P) on the heat treatment plate (11) is brought to a predetermined temperature.
[0029]
After the workpiece (P) on the heat treatment plate (11) is heated to a predetermined temperature, the valve (B8) is closed and the flow of the first heat medium into the heat treatment plate (11) is stopped. At the same time, the valve (B5) is opened. Then, a second heat medium having a predetermined temperature (different from the temperature of the first heat medium) flows into the heat treatment plate (11). At this time, since the valve (B8) is already closed and no pressure is applied to the first heat medium in the heat treatment plate (11), the horizontal plate-like partition is formed as the second heat medium flows into the heat treatment plate (11). The member (12) moves downward, and the first heat medium in the heat treatment plate (11) is pushed out of the heat treatment plate (11). The horizontal plate-like partition member (12) is located at the lowest position in the heat treatment plate (11), and the heat treatment plate (11) is filled with the second heat medium. In this way, the workpiece (P) is brought to a predetermined temperature.
[0030]
Next, a heat treatment apparatus according to still another embodiment of the present invention will be described with reference to FIG. In the heat treatment plate (20), a film-like partition member (21) is provided instead of the horizontal plate-like partition member (12). The membrane-like partition member (21) has elasticity, and as shown by a solid line in FIG. 4, the peripheral end is fixed to the center of the inner surface of the peripheral wall of the heat treatment plate (20), and the heat treatment plate (20) is fixed. It is divided vertically. The state of the membrane partition member (21) varies depending on the amounts of the first and second heat media in the heat treatment plate (20).
[0031]
In this heat treatment plate (20), when the valves (B5) and (B8) are closed and the valves (B6) and (B7) are opened, the valve (B8) is opened, and the first heat medium introduction pipe (16) opens the first. The heat medium flows into the heat treatment plate (20), and the film-like partition member (21) swells upward as shown by a two-dot chain line in FIG. The membrane partition member (21) has a shape along the upper half of the inner surface of the peripheral wall and the inner surface of the upper wall, and the heat treatment plate (20) is filled with the first heat medium.
[0032]
Next, the valve (B8) is closed, and the flow of the first heat medium into the heat treatment plate (20) is stopped. At the same time, the valve (B5) is opened. Then, the second heat medium flows into the heat treatment plate (20). At this time, since the valve (B8) has already been closed and no pressure is applied to the first heat medium in the heat treatment plate (20), the first heat medium flows as the second heat medium flows into the heat treatment plate (20). Is pushed out of the heat treatment plate (20), and the membrane partition member (21) swells downward. The membrane partition member (21) has a shape along the lower half of the inner surface of the peripheral wall and the inner surface of the lower wall, and the heat treatment plate (20) is filled with the second heat medium.
[0033]
In addition, the heat processing apparatus of this invention is not limited to the structure of the said embodiment, It can change suitably. For example, the pipe (10) may have a spiral shape when viewed from the plane. Further, instead of the horizontal plate-like partition member (12), a vertical plate-like partition member may be provided so that the vertical plate-like partition member moves in a direction perpendicular thereto, that is, back and forth. In this case, the positions of the heat medium introducing pipe and the outlet pipe are appropriately changed.
[0034]
In addition, you may replace the flow path of a 1st and 2nd heat carrier. In the above-described embodiment, the specific temperatures of the first heat medium and the second heat medium are not described in any case, and the heat treatment performed by both heat mediums is not mentioned. However, by appropriately selecting the temperatures of the first heat medium and the second heat medium, the object to be processed can be heated stepwise or cooled after the heating.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a heat treatment apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view of a heat treatment plate portion of the heat treatment apparatus.
FIG. 3 is an enlarged cross-sectional view of a heat treatment plate portion in a heat treatment apparatus according to another embodiment.
FIG. 4 is an enlarged cross-sectional view of a heat treatment plate portion in a heat treatment apparatus according to another embodiment.
[Explanation of symbols]
(1) Heat treatment equipment
(4) Heat treatment plate
(4a) Flow path (hollow part)
(10) Flow path (pipe)
(11) Heat treatment plate
(12) Plate partition member
(20) Heat treatment plate
(21) Membrane partition member
(P) Workpiece

Claims (2)

  A heat treatment plate having a heat treatment plate on which a work piece is placed is provided, two flow paths are provided inside the heat treatment plate, and heat media having different temperatures are passed through one flow path and the other flow path. A heat treatment apparatus, wherein a heat treatment is performed on an object to be processed placed thereon.   The temperature of the object to be processed is changed by the first heat medium flowing in one of the flow paths with respect to the object to be processed placed on the heat treatment plate for the object to be processed in which the two flow paths are formed. A heat treatment method characterized by stopping the inflow of the heat medium into the channel and flowing the second heat medium into the other channel to further change the temperature of the object to be treated.

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