JP3948261B2 - Coil parts manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a coil component used in various electronic devices, communication devices, and the like.
[0002]
[Prior art]
Coil parts are widely used in various electronic devices and communication devices. In recent years, there is an increasing demand for small, thin, and multi-functional coil components. In addition, high-frequency circuits, high-speed signals, and digitization are required. Along with this, coil parts as noise countermeasure parts have become increasingly important.
[0003]
Conventionally, as a method of manufacturing a coil component that satisfies these demands, a method of alternately laminating a ferrite magnetic layer and a coil conductor layer, or forming a coil conductor layer on a ferrite magnetic layer and laminating these layers Various methods have been proposed, such as a method of obtaining a coil component by forming a conductor layer on a ceramic body and cutting it into a spiral.
[0004]
As a method of obtaining a coil component by using a ferrite core as a ceramic body and forming a helical conductor layer on the surface of the ferrite core, a method using a ferrite core formed by adding glass to ferrite, A method of forming a glass layer and further forming a conductor layer has been proposed. In particular, in the method of forming a coil by forming a helical conductor layer on the surface of a ferrite core, it is necessary to make the material of the ferrite core specific or make the conductor underlayer specific.
[0005]
Further, in the method of using a plate-like ceramic substrate as the ceramic body and forming a spiral or spiral coil pattern on the ceramic substrate, for example, first, a conductor layer having a whole surface covering pattern is formed on the ceramic substrate; Spiral fold, spiral, and comb-shaped pattern reverse pattern is formed in the insulator layer (spell-fold, spiral, comb-shaped pattern forming an insulating layer), and thirdly on the conductor layer It was necessary to form a conductor, fourthly remove the insulator layer, and fifthly remove the conductor of the overall coating pattern, and form the desired conductor pattern on the ceramic substrate.
[0006]
[Problems to be solved by the invention]
According to the above configuration, a method of using a ferrite core formed by adding glass to ferrite as a method of obtaining a coil component by forming a helical conductor layer on the surface while using a ferrite core as a ceramic body, There is a method of forming a glass layer on a ferrite core and further forming a conductor layer, but there is a problem that a specific thing must be formed as a conductor underlayer due to the material of the ferrite core. It was.
[0007]
Furthermore, in order to form a desired coil pattern on this ceramic substrate while using a plate-shaped ceramic substrate as the ceramic element body, the conductor of the entire surface covering pattern formed on the ceramic substrate is deleted and the desired coil pattern is removed. There was also a problem that had to be formed.
[0008]
The present invention solves the above problems, and even if a ceramic body having a specific material or shape is used, a desired conductor underlayer is not formed or the conductor of the entire coating pattern is not removed. It aims at providing the manufacturing method of the coil component which obtains the coil component which formed this coil pattern.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, the present invention has the following configuration.
[0010]
The invention according to claim 1 of the present invention includes a first conductor layer forming step of forming a first conductor layer on a ceramic body, next, A second conductor layer forming step of forming a second conductor layer on the first conductor layer; next, A coil forming step of forming a coil portion in the second conductor layer, next, In this method, an insulation process is performed in which the first conductor layer is heat-insulated after the coil formation process.
[0011]
By the above method, an excellent coil component having a helical conductor layer on the surface of the ceramic body can be obtained.
[0012]
And even if a ceramic body with a specific material or shape is used, a coil in which a desired coil pattern is formed without forming a specific conductor underlayer or deleting the conductor of the entire surface covering pattern Parts can be obtained.
[0013]
The invention according to claim 2 of the present invention is the invention according to claim 1, in particular, After the insulating step, In this method, an electrode forming step for forming an external electrode is provided.
[0014]
By the above method, a coil component having an external electrode with excellent mountability can be obtained.
[0015]
The invention according to claim 3 of the present invention is the invention according to claim 1, in particular, After the insulating step, This is a method of providing an exterior forming step of covering the second conductor layer with an exterior material to form an exterior part.
[0016]
By the above method, a coil component with excellent insulation can be obtained.
[0017]
The invention described in claim 4 of the present invention is the method of the invention described in claim 3, in particular, the exterior material is a mixture of glass and ceramic.
[0018]
By the above method, a coil component with excellent strength can be obtained.
[0019]
The invention according to claim 5 of the present invention is the method according to claim 3, in which the exterior material is a magnetic body made of a ferrite magnetic material.
[0020]
By the above method, a coil component having a large inductance can be obtained.
[0021]
The invention according to claim 6 of the present invention is the invention according to claim 1, in particular, the ceramic body is TiO 2. ₂ This is a method of forming a dielectric made of a dielectric material containing
[0022]
By the above method, a coil component having a capacitor function can be obtained.
[0023]
The invention according to claim 7 of the present invention is the method according to claim 1, wherein the ceramic body is a magnetic body made of a ferrite magnetic material.
[0024]
By the above method, a coil component having a large inductor can be obtained.
[0025]
The invention according to claim 8 of the present invention is the invention according to claim 1, in particular, the ceramic body is made of Al. ₂ O _Three It is the method made into the insulator which consists of an insulating material containing this.
[0026]
By the above method, a coil component having excellent high frequency characteristics can be obtained.
[0027]
The invention described in claim 9 of the present invention is the method of the invention described in claim 1, particularly, wherein the ceramic body is a mixture of glass and ceramic.
[0028]
By the above method, a coil component having excellent high frequency characteristics can be obtained.
[0029]
The invention according to claim 10 of the present invention is the invention according to claim 1, in particular, the first conductor layer is a Ni-based metal layer made of Ni-based metal, and the second conductor layer is made of Ag-based metal. This is an Ag-based metal layer.
[0030]
By the above method, a coil component having excellent adhesion to the ceramic body can be obtained.
[0031]
According to an eleventh aspect of the present invention, in the invention according to the first aspect, particularly in the first conductor layer forming step, the first layer is formed on the ceramic body and the first layer is formed on the first layer. Forming a second layer to provide a first conductor layer, wherein the first layer is a Ni-based metal layer made of a Ni-based metal, and the second layer is a Cu-based metal layer made of a Cu-based metal; The conductor layer is an Ag-based metal layer made of an Ag-based metal.
[0032]
By the above method, a coil component with excellent matching of the first conductor layer or the second conductor layer can be obtained.
[0033]
According to a twelfth aspect of the present invention, in the invention according to the first aspect, in particular, in the coil forming step, the second conductor layer is cut into a spiral shape by laser irradiation to form a coil portion on the second conductor layer. It is the method made into the process of forming.
[0034]
By the said method, it can be set as the method excellent in productivity.
[0035]
The invention according to claim 13 of the present invention provides A first conductor layer forming step of forming a first conductor layer on the ceramic body, an insulator forming step of forming an insulator layer having a void on the first conductor layer, and then And a second conductor forming step of forming the second conductor layer on the first conductor layer so that the second conductor layer is disposed in the gap, and after the second conductor layer is formed by heat treatment, An insulation process for simultaneously performing insulation of the first conductor layer and disappearance of the insulator layer; This is a method provided.
[0036]
By the above method, a coil component with excellent productivity can be obtained.
[0037]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the invention described in all claims of the present invention will be described with reference to the drawings with reference to FIGS. 1 and 2.
[0038]
1 (a) to 1 (f) are cross-sectional views showing a manufacturing process of a coil component according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the coil component.
[0039]
First, as shown in FIG. 1A, a rectangular parallelepiped ceramic body 1 is formed. Next, as shown in FIG. 1B, the first conductor layer 2 is formed on the entire surface of the ceramic body 1. Further, as shown in FIG. 1C, the second conductor layer 3 is formed on the surface of the first conductor layer 2. The cross section after the formation has the first conductor layer 2 on the surface of the ceramic body 1, and the second conductor layer 3 covers them. Next, as shown in FIG. 1D, a part of the second conductor layer 3 is spirally cut to form a spiral coil portion 4 on a part of the second conductor layer 3. Next, heat treatment is performed on the spiral coil portions 4 to insulate the first conductor layer 1. For the heat-treated one, an exterior material 5 is formed on the surface of the coil portion 4 as shown in FIG. Further, as shown in FIG. 1 (f), the external electrode 6 is formed on the exposed portion of the surface of the second conductor layer 3 where the exterior material 5 is not formed.
[0040]
As shown in FIG. 2, the cross-section of the coil component of the present invention obtained by the above method has the first conductor layer 2 insulated on the surface of the ceramic body 1, and further the insulated first conductor. The layer 2 is covered with the second conductor layer 3, the helical coil portion 4 of the second conductor layer 3 is covered with the exterior material 5, and the external conductor 6 is not covered with the portion of the second conductor layer 3 not covered with the exterior material 5. Is formed.
[0041]
As is generally known, the external electrode 6 generally has a multilayer structure such as a nickel electrode layer and a solder electrode layer or a tin electrode layer, and the formation method is usually widely used by a wet plating method. ing. When the exterior member 5 is formed, it is advantageous to form the external electrode 6 by this wet plating method, but other methods include dry electrode forming methods such as application of electrode paste, vapor deposition, sputtering, or ion plating. is there.
[0042]
The above method (the first conductor layer 2 is formed on the surface of the ceramic body 1, the second conductor layer 3 is further formed on the first conductor layer 2, and then at least a part of the second conductor layer 3 is spiraled. The method of performing heat treatment after cutting into a shape) is the lowest basic manufacturing method of the present invention, and particularly important is the ceramic generated after cutting the second conductor layer 3 in a spiral shape. An object of the present invention is to secure important electrical characteristics as a coil component by subjecting the element body 1, the first conductor layer 2 and the second conductor layer 3 to single or thorough processing and the like.
[0043]
In addition, if at least the second conductor layer 3 is formed in the portion to be cut in a spiral shape, the first conductor layer 2 is made into an insulator by this heat treatment, and is changed to a sufficient insulator as a coil component. In addition, in the case of the above-mentioned process-affected zone, a substance having a small insulation resistance may be generated in some cases, and the insulation resistance can be restored to a level that does not cause a problem before processing by performing heat treatment.
[0044]
For example, NiZnCu-based ferrite is used as the ceramic body 1, a nickel electrode layer is used as the first conductor layer 2, a silver electrode layer is used as the second conductor layer 3, and a YAG laser is used as a method of cutting in a spiral shape. In this case, the heat treatment temperature is restored to the insulation resistance level necessary for obtaining the coil component at a temperature of 200 ° C. or higher. Furthermore, in order to ensure a sufficient insulation resistance, such as between transformer coils, it is possible to recover, for example, to a level before YAG laser processing by performing heat treatment at a higher temperature. When a silver electrode is used, the limit temperature for heat treatment is limited to a temperature up to about 960 ° C., which is the melting point of silver.
[0045]
That is, what is important in the manufacturing method of the present invention is that the second conductor layer 3 is cut into a spiral shape to form a spiral coil portion 4 and then subjected to a heat treatment to cause insulation deterioration due to spiraling and the second. The purpose is to facilitate spiraling by insulating the first conductor layer 2 and to secure the adhesion of the second conductor layer 3.
[0046]
As a method for obtaining the ceramic body 1, a method by a powder molding method, a method of cutting a ceramic green sheet or a laminate, and the like are generally used. The paste or slurry for forming the ceramic body 1 includes each powder and a solvent such as butyl carbitol, terpineol, alcohol, a binder such as ethyl cellulose, polyvinyl butyral, polyvinyl alcohol, polyethylene oxide, ethylene-vinyl acetate, Sintering aids such as various oxides or glasses may be added, and plasticizers such as butylbenzyl phthalate, dibutyl phthalate, and glycerin, or dispersants may be added.
[0047]
Each layer is formed using the kneaded material which mixed these. As a slurry for producing a green sheet, various solvents having excellent evaporability, such as butyl acetate, methyl ethyl ketone, toluene, alcohol, etc., are preferable instead of the above-mentioned solvents. The firing temperature range when forming the ceramic body 1 is in the range of about 800 ° C. to 1600 ° C.
[0048]
The first conductor layer 2 and the second conductor layer 3 can be formed by plating, vapor deposition, sputtering, ion plating, coating, transfer, printing, dipping, spraying, spraying, etc., and patterning into a spiral Can be performed using cutting, masking, etching or the like. Furthermore, the surface shape of the ceramic body 1 is formed into a screw shape, a conductor is formed on the surface, and the surface of the ceramic body 1 is scraped off to a degree that eliminates the thread, thereby forming a coil made of a spiral conductor on a part of the surface of the ceramic body 1. It is also possible to form
[0049]
The method of making at least a part of the second conductor layer 3 into a spiral shape as a spiral coil portion 4 includes cutting using a laser, cutting using a grindstone or a knife, and applying abrasive grains to a workpiece at high speed. There are various methods such as, but considering the productivity, a method using a laser is desirable. As a method of forming a conductor in a spiral shape, there is a method of removing a portion of a conductor that has not been masked and masked, in addition to a method of cutting the entire surface formed into a spiral shape. Further, as another method, the external electrode 6 and the portion where the coil is not formed are masked, and a conductor layer is formed on the portion where no masking is performed, or the conductor is formed only on the portion where the external electrode 6 and the coil portion 4 are formed. There is also a method of directly forming a layer. Furthermore, as a method of forming a spiral, a conductor formed in advance in a predetermined shape by a mold, plating, or the like, such as pattern formation by spraying water, carbon dioxide gas, abrasive grains, or the like, pattern formation using a blade or a grindstone, etc. Or a method such as dropping onto a masked material, potting or spraying.
[0050]
By providing the exterior material 5 so as to cover the coil part 4 processed into the spiral shape of the second conductor layer 3, the spiral coil part 4 can be protected and insulated. When the exterior material 5 is a resin, the strength of the exterior material 5 is improved when ceramic powder is contained in the resin. Further, if the ceramic powder is a magnetic powder, it is possible to improve magnetic shielding properties and electrical characteristics. Naturally, when the heat treatment is performed after forming the exterior material 5 using the resin-based exterior material 5, the limit temperature of the heat treatment temperature is the heat resistant temperature. In the method of heat treatment after forming the exterior material 5, for example, a ferrite magnetic body is used for the ceramic body 1, and a ferrite magnetic body is also used for the exterior material 5, so that both the heat treatment and the sintering of the exterior material 5 can be performed. In addition, after the exterior material 5 is formed, the magnetic circuit has a closed magnetic circuit configuration, and a coil component having excellent electrical characteristics can be obtained. In addition, in this case, the magnetic shielding properties are further improved.
[0051]
The ceramic body 1 and the exterior material 5 may be either non-magnetic materials or magnetic materials. What is necessary is just to select suitably in order to ensure a required coil component characteristic. Of course, these require insulation. Nonmagnetic materials include electrically insulating materials such as organic insulating materials such as epoxy and polyimide, and inorganic insulating materials such as glass, glass ceramics, ceramics such as CuZn ferrite and alumina. Anything may be used. Examples of the magnetic material include NiZn-based, NiZnCu-based, and MnZn-based spinel-based and hexagonal-based ferrite materials.
[0052]
By configuring the ceramic body 1 and the exterior material 5 with a low dielectric constant, the stray capacitance between the coils can be reduced, and the self-resonance frequency of the coils can be increased and the high-frequency characteristics of the coils can be improved. It becomes possible.
[0053]
As a material for the first conductor layer 2, nickel, copper, and the like are common and desirable. A method of forming these by a wet plating method is well established. The first conductor layer 2 may be a single layer or a return layer. On the other hand, the material of the second conductor layer 3 may be anything as long as it is an electrically good conductor, but silver, an alloy of silver and palladium, an alloy of silver and platinum, or platinum that can maintain a metal even when fired in the atmosphere. Is desirable. That is, even if the heat treatment is performed in the air, it can be maintained as a metal, and the first conductor layer 2 is preferably oxidized or diffused into the ceramic body 1.
[0054]
When these first conductor layers 2 are formed by a wet plating method, a base conductor layer is first formed thinly on the ceramic body 1 by an electroless plating method, and other electrode materials are electroplated using this conductor layer as an electrode. A plurality of conductor layers can be easily formed by a method such as Further, since various solution treatments are indispensable for the electroless plating method, the base electrode may be formed by a dry method.
[0055]
As described above, the external electrode 6 may be made of a conductive material, but it is generally desirable that the external electrode 6 is composed of a plurality of layers instead of a single layer. When it is used for surface mounting, it is necessary to consider mounting strength when mounting on a printed wiring board, solder wettability during mounting, solder breakage, and the like. Specifically, the lowermost layer is the second conductor layer 3. The same conductive material is used, a nickel electrode for preventing solder biting is used for the intermediate layer, and a solder electrode or a tin electrode having good wettability with respect to the solder is used for the outermost layer.
[0056]
However, this is only an example, and it is not always necessary to adopt this configuration, and a conductive resin material, an alloy of silver and platinum, an alloy of silver and palladium, or the like may be used in addition to a material having excellent conductivity such as metal.
[0057]
By integrating the second conductor layer 3 and a part of the external electrode 6 together, the connection reliability between the second conductor layer 3 and the external electrode 6 can be improved. For example, as in the method shown in FIGS. 1A to 1F, the second conductor layer 3 is made of, for example, silver on the entire surface of the ceramic body 1, and the second conductor layer 3 is continuous. Composed of silver. The external electrode 6 is made of silver as a base, and further has a laminated structure of nickel and tin, so that the connection reliability is improved and the coil component is excellent in mountability as a chip component.
[0058]
Further, a predetermined wiring pattern is formed on a ceramic substrate such as alumina or ferrite, a window is provided on the ceramic substrate, a coil component is inserted, and the wiring pattern and the external electrode 6 of the coil component are connected, and a thick film forming process is used. May be fired and electrically connected.
[0059]
The external electrode 6 may be formed after the exterior material 5 is formed, or the coil portion of the second conductor layer 3 may be masked, and the exposed portion may be subjected to nickel plating, solder plating, or tin plating. As described above, it is desirable to use the exterior material 5 for masking.
[0060]
Next, another typical method of the present invention will be described with reference to FIGS. 3 (a) to 3 (f) and FIG.
[0061]
3A to 3F are cross-sectional views of the coil component manufacturing process, and FIG. 4 is a perspective view of the coil component.
[0062]
In this method, a coil component having the spiral second conductor layer 3 on one surface of the ceramic body 1 can be obtained.
[0063]
A specific manufacturing method is as follows.
[0064]
First, as shown in FIG. 3A, the ceramic body 1 is formed. Next, the first conductor layer 2 is formed on the surface of the ceramic body 1 as shown in FIG. Further, as shown in FIG. 3C, the first insulator layer 7 is formed on a part of the first conductor layer 2. The pattern of the first insulator layer 7 is the reverse pattern of the second conductor layer 3 to be formed next (the first insulator layer 7 has the same gap as the pattern of the second conductor layer 3). ). Next, as shown in FIG. 3 (d), the second conductor layer 3 is applied to the exposed portion (the void portion of the first insulator layer 7) where the first insulator layer 7 of the first conductor layer 2 is not formed. Form. The ceramic body 1 on which the first conductor layer 2, the first insulator layer 7, and the second conductor layer 3 are formed is heat treated. As an example after the heat treatment, as shown in FIG. 3E, the first conductor layer 2 becomes an insulator or diffuses and disappears by the heat treatment, and the first insulator layer 7 disappears. Next, as shown in FIG. 3F, the second insulator layer 9 is formed so as to cover the second conductor layer 3 and the like. Then, by forming an opening for connection in the second insulator layer 9 shown in FIG. 3 (f) and forming the external electrode 6, a coil component as shown in FIG. 4 can be obtained. .
[0065]
As described in the above example, the second conductor layer 3 of the first conductor layer 2 is formed on at least a part of the surface of the ceramic body 1, and at least the second conductor layer 3 is spirally cut to form a coil. After that, heat treatment is performed, or the first conductor layer 2 is formed on at least a part of the surface of the ceramic body 1, and the first insulator layer 7 is formed on a part of the first conductor layer 2, After the second conductor layer 3 is formed in the reverse pattern of the first insulator layer 7, a heat treatment is performed to make a ceramic body as known in the past or to have a specific bottom under the conductor layer. There is no need to use a ground layer, or there is no need to separately remove the conductor layer, and a coil component having a desired conductor pattern can be obtained. Furthermore, the configuration of an open magnetic circuit or a closed magnetic circuit can be easily made.
[0066]
In the above embodiment, only the surface mount type in which the external electrodes 6 are provided at both ends and the like have been described. However, the ceramic element body 1 in which the pin terminals are embedded or the external electrodes 6 are provided with terminals. A lead-type coil component in which the gap electrode is fitted and coupled to both ends of the ceramic body 1 can be easily obtained.
[0067]
Next, examples of the more specific manufacturing method of the present invention will be described.
[0068]
Example 1
8 g of butyral resin, 4 g of butyl benzyl phthalate, 24 g of methyl ethyl ketone and 24 g of butyl acetate are mixed with 100 g of NiZnCu ferrite powder and kneaded using a pot mill to prepare a magnetic slurry.
[0069]
Using this slurry, a magnetic green sheet having a thickness of 0.2 mm is produced using a coater after drying. The green sheet is formed on a PET film.
[0070]
Using an insulating green sheet, it is molded and cut to form a ceramic body having the shape shown in FIG. 1, and press molding is performed at room temperature, and the molding pressure is 1000 kgf / cm. ² It is said.
[0071]
The ceramic body produced by this molding is fired at 900 ° C. for 2 hours. A nickel electrode is formed as the first conductor layer 2 on the entire surface of the fired ceramic body 1 by wet plating, and a silver electrode is formed as the second conductor layer 3 on the nickel electrode. Further, a spiral groove 10 as shown in FIG. 5 is formed in the silver electrode. A YAG laser is used to form the groove 10. And it heat-processes in the temperature range of 200 to 900 degreeC.
[0072]
The coil component obtained by the above method does not cause defects such as peeling, cracking, and warping. In particular, in the temperature range of 200 ° C. to 900 ° C., the above effect can be obtained at any temperature. Moreover, even if the coil characteristic is measured using an impedance analyzer, it has excellent characteristics.
[0073]
(Example 2)
3 g of ethyl cellulose and 40 g of α-terpineol are mixed with 100 g of NiZnCu ferrite powder, and kneaded using three rolls to produce a ferrite paste.
[0074]
The ferrite paste is applied as the exterior material 5 to the portion where the spiral groove 10 as shown in FIG. 5 formed in Example 1 is formed and dried. The ceramic body 1 on which the exterior material 5 is formed is subjected to heat treatment under the condition of holding at 900 ° C. for 2 hours.
[0075]
Defects such as peeling, cracking, and warping do not occur in the coil component manufactured by the above method. Further, even when various electrical characteristics are measured using an impedance analyzer or the like in the same manner as in Example 1, it has excellent characteristics.
[0076]
(Example 3)
6 g of butyral resin, 4 g of butyl benzyl phthalate, 24 g of methyl ethyl ketone and 24 g of butyl acetate are mixed with 100 g of NiZnCu ferrite powder and kneaded using a pot mill to prepare a magnetic slurry.
[0077]
Using this slurry, a magnetic green sheet having a thickness of 0.2 mm was prepared after drying using a coater. The green sheet is formed on a PET film.
[0078]
Using a magnetic green sheet, press forming was performed so as to form a substrate-like ceramic body 1. Press molding is performed at room temperature and the molding pressure is 1000 kgf / cm. ² To do.
[0079]
The ceramic body 1 produced by this molding is fired under the condition of holding at 900 ° C. for 2 hours. The fired ceramic body 1 has a plate shape as shown in FIG. 3A and a thickness of 0.8 mm.
[0080]
A nickel electrode is formed as the first conductor layer 2 on the fired ceramic body 1 by the wet plating method as shown in FIG. 3 (b), and the first insulator layer 7 is formed as shown in FIG. 3 (c). Then, as shown in FIG. 3D, a silver electrode is formed as the second conductor layer 3 on the nickel electrode using the nickel electrode as an electrode. Next, the heat processing hold | maintained for 30 minutes at the temperature of 850 degreeC is performed. When heat treatment is performed, the first insulator layer 7 disappears as shown in FIG.
[0081]
Next, the second insulator layer 9 is formed on the second conductor layer 3 as shown in FIG. The second insulator layer 9 is provided with an opening for connecting the conductor. The conductor is connected through the opening to form an extraction electrode for drawing out the electrode, and further insulated so as to cover them. A body layer is formed to obtain a coil component as shown in FIG.
[0082]
Defects such as peeling, cracking and warping do not occur in the coil component obtained by the above method, and the first conductor layer 2 is made into an insulator by heat treatment. Further, even if the coil characteristic is measured using an impedance analyzer, it has excellent characteristics.
[0083]
Thus, even if the first conductor layer 2 is not deleted by etching or the like, a coil component having a desired coil pattern can be obtained by heat treatment.
[0084]
【The invention's effect】
As described above, according to the present invention, the first conductor layer forming step of forming the first conductor layer on the ceramic body, Next, the above A second conductor layer forming step of forming a second conductor layer on the first conductor layer; Next, the above A coil forming step for forming a coil portion on the second conductor layer, and an insulating step for heat-insulating the first conductor layer is provided, so that the surface of the ceramic body has a spiral conductor layer. An excellent coil component can be obtained.
[0085]
And even if a ceramic material with a specific material or shape is used, a coil component in which a desired coil pattern is formed without forming a specific conductor underlayer or removing the conductor of the entire surface covering pattern The manufacturing method of can be provided.
[Brief description of the drawings]
FIGS. 1A to 1F are cross-sectional views of a manufacturing process showing a method of manufacturing a coil component according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the coil component
FIGS. 3A to 3F are cross-sectional views of a manufacturing process showing a method for manufacturing another coil component according to an embodiment of the present invention.
FIG. 4 is a perspective view of the coil component.
FIG. 5 is a perspective view of a coil component having a helical coil portion according to an embodiment of the present invention.
[Explanation of symbols]
1 Ceramic body
2 First conductor layer
3 Second conductor layer
4 Coil part
5 Exterior materials
6 External electrode
7 First insulator layer
9 Second insulator layer
10 Groove

Claims (13)

A first conductive layer forming step of forming a first conductive layer on the ceramic body, the next, a second conductive layer forming step of forming a second conductive layer on the first conductive layer, the next, A coil forming step of forming a coil portion on the second conductor layer, and a method of manufacturing a coil component including an insulating step of heat-insulating the first conductor layer after the coil forming step. The manufacturing method of the coil component of Claim 1 which provided the electrode formation process which forms an external electrode after the said insulation process . The manufacturing method of the coil components of Claim 1 which provided the exterior formation process which coat | covers an exterior material on the 2nd conductor layer and forms an exterior part after the said insulation process .   The method for manufacturing a coil component according to claim 3, wherein the exterior material is a mixture of glass and ceramic.   The method for manufacturing a coil component according to claim 3, wherein the exterior material is a magnetic body made of a ferrite magnetic material. _{2. The} method of manufacturing a coil component according to claim 1, wherein the ceramic body is a dielectric made of a dielectric material containing TiO2.   The method of manufacturing a coil component according to claim 1, wherein the ceramic body is a magnetic body made of a ferrite magnetic material. The method of manufacturing a coil component according to claim 1, wherein the ceramic body is an insulator made of an insulating material containing Al ₂ O ₃ .   The method of manufacturing a coil component according to claim 1, wherein the ceramic body is a mixture of glass and ceramic.   The method for manufacturing a coil component according to claim 1, wherein the first conductor layer is a Ni-based metal layer made of a Ni-based metal, and the second conductor layer is an Ag-based metal layer made of an Ag-based metal.   In the first conductor layer forming step, the first layer is formed on the ceramic body, the second layer is formed on the first layer, and the first conductor layer is provided. The first layer is made of a Ni-based metal. 2. The coil component manufacturing method according to claim 1, wherein the second layer is a Cu-based metal layer made of a Cu-based metal, and the second conductor layer is an Ag-based metal layer made of an Ag-based metal. Method.   The method of manufacturing a coil component according to claim 1, wherein the coil forming step is a step of forming a coil portion in the second conductor layer by cutting the second conductor layer in a spiral shape by laser irradiation. A first conductor layer forming step of forming a first conductor layer on the ceramic body, an insulator forming step of forming an insulator layer having a void on the first conductor layer, and then And a second conductor forming step of forming the second conductor layer on the first conductor layer so that the second conductor layer is disposed in the gap, and after the second conductor layer is formed by heat treatment, A method for manufacturing a coil component, comprising: an insulation process for simultaneously performing insulation of the first conductor layer and elimination of the insulator layer.

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