JP3951082B2 - Solid state relay device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for enabling a large capacity of a socket-mounted solid state relay in which a semiconductor power element is accommodated in a synthetic resin case.
[0002]
[Prior art]
Normally, a solid state relay (hereinafter referred to as SSR) is mainly composed of a photocoupler and a semiconductor switch, and is used for load on / off control. Its characteristics are that the input and output are electrically separated by a photocoupler, so it is strong against noise, and has no moving parts and no wear, so it is quiet without generating noise, and has high reliability, long life, and high performance. While it has various advantages such as being able to open and close frequently, it is composed of semiconductors, so it has a drawback that it consumes a large amount of power corresponding to the on-resistance of the relay contacts and generates heat, so it requires heat dissipation. .
[0003]
Therefore, conventionally, as shown in FIG. 16, the SSR case 1 containing a semiconductor power element, a control circuit, and the like has a high heat resistance such as copper or aluminum in order to prevent damage due to heat and prolong the life of the parts. Generally, it is mounted on the DIN rail 4 through a heat sink 2 made of a conductive metal. In the figure, reference numeral 3 denotes an attachment member for direct attachment to the bottom surface of the control panel without using the DIN rail 4.
[0004]
By the way, recently, there is a demand for a socket-mounted SSR as an alternative to a normal electromagnetic relay. As shown in FIG. 17, this socket-mountable SSR is detachably attachable to a resin socket 5 attached to the DIN rail 4 via a plug pin (not shown). It is configured so that it can be attached to.
[0005]
[Problems to be solved by the invention]
Since the existing control panel has standardized sockets and surrounding space, as shown in FIG. 16, the heat sink 2 is interposed between the SSR case 1 and the DIN rail 4 to promote the heat dissipation effect. The structure cannot be adopted. Therefore, in the case of the socket mounting type SSR accommodated in the resin case 1 shown in FIG. 17, since there is no escape place for heat, it is difficult to realize it unless it is about several amperes.
[0006]
An object of the present invention is to increase the capacity of a socket-mounted SSR in which a semiconductor power element is accommodated in a synthetic resin case, and to improve compatibility with existing electromagnetic relays.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 of the present application is that a semiconductor power element is accommodated in a rectangular parallelepiped synthetic resin case having a bottom plate from which a plug pin protrudes, four side plates, and a top plate. Including a socket-mounted solid state relay and a heat sink that can be detachably attached to the solid-state relay,
The heat sink is formed by integrally projecting a thick insertion plate portion on the surface opposite to the heat radiation fin of the heat sink base portion having a plurality of heat radiation fins,
On the top plate of the synthetic resin case, an elongated window for inserting the insertion plate of the heat sink is opened,
In the synthetic resin case, there is provided a spring material made of a high heat conductive material mounted with a heat sink of the semiconductor power element thermally coupled,
The spring material is disposed along the inner wall surfaces of the top plate, the side plate, and the bottom plate of the case, and is folded inward with an interval corresponding to the width of the window so as to correspond to the window of the top plate. While having a pair of plate-shaped support portions formed in a curved shape, these support portions are spring-biased in a direction approaching each other,
As a result, the heat transfer path from the semiconductor power element to the heat radiating fins is obtained by receiving and holding the insertion plate portion of the heat sink inserted from the window of the case top plate with a pair of support portions of the spring material. It is characterized by being formed.
[0008]
Therefore, according to the first aspect of the present invention, the insertion plate portion of the heat sink inserted from the window of the case top plate is received and sandwiched by the pair of support portions of the spring material, so that the semiconductor power element The heat dissipation part, which is thermally coupled to the semiconductor power element that forms a heat transfer path to the heatsink fins of the heat sink, communicates with the outside air through the window of the case. Is radiated to the outside and a high-capacity SSR can be realized. In addition, since the heat sink is mounted on the top plate of the case, there is no restriction on the space for mounting the heat sink even when the sockets are arranged closely adjacent to each other.
[0009]
The invention according to claim 2 of the present application, each of the contact surface between the insertion plate portion and the pair of support portions, having excellent thermal conductivity paint is co pos- sesses, and characterized in that To do.
[0010]
Therefore, according to the second aspect of the present invention, the heat resistance of the heat transfer path can be reduced and the heat radiation efficiency can be improved while maintaining the ease of insertion and removal of the heat sink and the ease of attachment and detachment.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, reference examples created by the present inventors in the course of reaching the present invention and embodiments of the SSR according to the present invention will be described in detail with reference to the accompanying drawings.
[0012]
1 and 2 show a first reference example for explaining the SSR created by the present inventors in the course of reaching the present invention , and FIG. 1 is a perspective view showing a state in which the SSR is attached. These are principal part sectional drawings which show the structure of the thermal radiation part of SSR.
[0013]
In FIG. 1, a SSR 10 includes a semiconductor power element 12 and a control circuit (not shown) incorporated in a synthetic resin case 11, and is detachably mounted on a socket 20. The socket 20 is provided on the back surface. It is attached to the rail 30 by a mounting bracket (not shown).
[0014]
More specifically, as the rail 30, a DIN rail whose shape and dimensions are standardized is used. The rail 30 is fixed by tightening screws 31 at intervals in the longitudinal direction on a wall surface of a control panel or the like. Is provided with a plurality of screw terminals 21 on the upper and lower sides, and electric wires (not shown) are connected to the screw terminals 21.
[0015]
By the way, the SSR 10 in the present embodiment has a rectangular window 13 in the center of the top plate 11a of the synthetic resin case 11 and an aluminum alloy for the semiconductor power element 12 housed in the synthetic resin case 11. A heat radiating plate 40 having excellent heat conduction characteristics such as the above is thermally coupled to the semiconductor power element 12, and this heat radiating plate 40 faces the outside through the window 13 of the synthetic resin case 11. Reference numeral 121 denotes a terminal pin of the semiconductor power element 12.
[0016]
Here, the thermal coupling between the heat sink 40 and the semiconductor power element 12 may be fixed with an epoxy adhesive, but as shown in FIG. 2, the silicone base material is filled with particles such as aluminum oxide. The interface material 41 is preferably interposed. Further, other heat coupling means, for example, a method of fixing with a clip or a screw with a heat conductive pad interposed therebetween, or a method of using a heat conductive double-sided tape may be adopted.
[0017]
As described above, according to the first reference example , since the heat sink 40 thermally coupled to the semiconductor power element 12 faces the outside through the window 13 of the case 11, the heat radiation from the heat sink 40 causes the components of the SSR 10. In addition to prolonging the service life, the SSR 10 can be prevented from being damaged.
[0018]
Therefore, the SSR 10 can be used as an alternative to the electromagnetic relay by using the existing rail 30 and socket 20, and the window 13 is opened in the case 11 as a countermeasure for heat generation, which is a disadvantage inherent to the SSR. The heat radiation plate 40 thermally coupled to the element 12 is exposed to the outside through the window 13, whereby an excellent heat radiation action can be obtained and compatibility with the electromagnetic relay can be achieved.
[0019]
The inside of the synthetic resin case 11 may be resin-sealed or may have a hollow structure, and the semiconductor power element 12 is supported and fixed in the case 11 by a support mechanism (not shown). .
[0020]
Next, FIG. 3 to FIG. 5 show a second reference example created by the present inventors in the course of reaching the present invention . FIG. 3 is a perspective view of the inside of the case showing the state where the SSR is mounted on the socket. 4 is an overall view seen through the inside of the case showing a state where the SSR with further improved heat dissipation effect is mounted on the socket, and FIG. 5 is a cross-sectional view showing the structure of the heat dissipation portion.
[0021]
First, in the SSR 10 shown in FIG. 3, windows 13 are opened on both side plates 11 b of the synthetic resin case 11, and a heat radiating plate 40 thermally coupled to the semiconductor power element 12 corresponding to both windows 13 is provided in this window. 13 is configured to face outside.
[0022]
Accordingly, in the first embodiment, the windows 13 are opened on the top plate 11a of the synthetic resin case 11, but in the second embodiment, the windows 13 are formed on both side plates 11b of the synthetic resin case 11. By opening and increasing the heat dissipation area of the heat sink 40, a more excellent heat dissipation action can be expected, and it can be applied to the SSR 10 having a larger capacity than that of the first embodiment. In addition, since the same structure as 1st Embodiment mentioned above can be used about the structure inside the synthetic resin case 11, the attachment structure with respect to the rail 30 and the socket 20, and a thermal coupling means, detailed description is abbreviate | omitted.
[0023]
4 and 5 show a modification of the second reference example of the SSR 10 according to the present invention. A heat sink 50 is thermally coupled to the outer surface of the heat radiating plate 40 to achieve a more efficient heat radiating action. It is a feature.
[0024]
That is, as shown in FIGS. 4 and 5, the heat sink 40 made of aluminum alloy or the like is thermally coupled to the semiconductor power element 12 via the interface material 41, and the window 13 provided on the side plate 11 b of the synthetic resin case 11. that it faces the heat radiating plate 40 to the outside from is the reference example of the same configuration shown in FIG. 3, in this modification, the window 13 is formed as a large window 13 over the outer shape of the heat radiating plate 40 The heat sink 50 is fixed to the outside of the side plate 11b of the synthetic resin case 11 by bonding or screwing, and the heat sink base 51 of the heat sink 50 and the heat radiating plate 40 are thermally coupled.
[0025]
In this embodiment, the heat sink 40 and the heat sink base 51 of the heat sink 50 are thermally coupled via the interface material 42 in which aluminum oxide is filled in a silicone base material having excellent thermal conductivity. Note that the heat sink 50 is formed by integrally forming a thick heat sink base portion 51 and a plurality of radiating fins 52 by extrusion, forging or the like using an aluminum alloy as a raw material, and reference numeral 53 in FIG. Show screw.
[0026]
Therefore, according to this reference example , the heat generated by the power loss of the semiconductor power element 12 is efficiently transmitted to the heat radiating plate 40 and further transmitted to the heat sink 50 that is thermally coupled to the heat radiating plate 40. The heat radiation according to the envelope volume of the heat radiation fin 52 of the heat sink 50 can be promoted, and the heat radiation of the SSR 10 can be achieved more effectively. In particular, it can be applied to a large capacity type SSR 10 of 5 amps or more. .
[0027]
6 to 10 show a third reference example created by the present inventors in the course of reaching the present invention . FIG. 6 is a front view showing a state in which the SSR is mounted on the socket, and FIG. FIG. 8 is an explanatory view showing the internal configuration of the SSR, FIG. 9 is a side view of the case before the heat sink is attached, and FIG. 10 is a state of attaching the heat sink and the heat sink to the case. It is explanatory drawing.
[0028]
In implementation form of this, the SSR10 socket-mounted, which has further to promote the heat dissipation effect of SSR10 large capacity, as shown in FIGS. 6 and 7, the socket 20 is attached to the rail 30 The SSR 10 is detachably attached to the SSR 10, but a U-shaped heat sink that is thermally coupled to the heat generating part in the case 11 along the three surfaces of the top plate 11 a and the side plate 11 b of the synthetic resin case 11 as a radiator of the SSR 10. 50 is a feature. As for a specific configuration, first, in the case 11, the windows 13 are respectively opened in the side plate 11b, and the locking grooves 14 for engaging the heat sink 50 are formed on the top plate 11a and the end plates 11b of the case 11. It is formed in an elongated shape at a location.
[0029]
In FIG. 9, reference numeral 15 denotes a plurality of plug pins, and reference numeral 16 denotes a positioning center column.
[0030]
The case 11 has a hollow structure, is not sealed with resin, and accommodates a spring material 60 having excellent thermal conductivity along the inner surfaces of the top plate 11a and the side plate 11b of the case 11. (See FIG. 8). The spring material 60 is also preferably an aluminum alloy having excellent thermal conductivity, but the material is not particularly limited as long as it has spring properties and high thermal conductivity. The spring material 60 is not limited to the window 13 of the case 11. The protrusions 61 are provided on the left and right sides so that the portion corresponding to is protruded to the outside, and the heat radiating plate 40 thermally coupled to the semiconductor power element 12 is fixed to the inner surface side of the protrusion 61 by thermal coupling. ing.
[0031]
Further, since the spring member 60 is spring-biased in the direction of the arrow shown in FIG. 8, the portion (projection 61) where the heat sink 40 attached to the semiconductor power element 12 is always protruded outward. Will be biased in the direction.
[0032]
Next, the heat sink 50 fitted into the top plate 11a and the side plate 11b of the case 11 surrounds the three surfaces of the case 11 with the heat sink base portion 51 having a U-shaped cross section as shown in FIGS. 10 (a) and 10 (b). The heat sink base portion 51 is formed with a heat dissipating fin 52 so as to ensure a desired envelope volume, and the locking groove 14 provided on the top plate 11a and the side plate 11b of the case 11 is provided. A protrusion 54 is provided at a position corresponding to the above. This heat sink 50 is also formed into a required shape by extrusion, forging or the like. In this embodiment, as shown in FIG. 10C, the heat sink 50 is enclosed so as to surround the top plate 11a and the side plate 11b of the case 11. If attached, the protrusion 54 provided in three places of the heat sink 50 fits into the locking groove 14 of the case 11 and can be attached with one touch.
[0033]
When the heat sink 50 is attached to the outer surface of the case 11, the protrusion 61 of the spring material 60 comes into contact with the heat sink base portion 51 of the heat sink 50 through the window 13 of the case 11, and the spring pressure of the spring material 60 is increased. Therefore, the heat sink 50 and the protrusion 61 of the spring material 60 are in a strong contact state, and the heat generated by the heat generated by the semiconductor power element 12 is transmitted to the heat radiating plate 40 and the spring material 60 and then effectively transmitted to the heat sink 50. When heated, a large heat dissipation effect can be expected by the envelope volume of the heat sink 50 in this embodiment.
[0034]
Therefore, according to this embodiment, although the heat sink space is slightly required to secure the envelope volume of the heat sink 50, the heat generated by the SSR 10 can be effectively radiated to the outside, and the heat sink 50 can be attached with one touch. The practical value of being able to do it is great. If the contact surface is coated with a heat conductive paint or the like so that the connection surface between the spring member 60 and the heat sink 50 is thermally coupled, heat dissipation can be promoted more efficiently.
[0035]
Next, FIGS. 11 to 15 shows the implementation form of SSR10 according to the present invention, FIG. 11 is a front view of mounting the SSR in the socket, FIG. 12 is a side view of mounting the SSR in the socket, FIG. 13 FIG. 14A is a front view of the case, FIG. 14B is a side view of the case, and FIG. 15 is an explanatory view showing a state where a heat sink is attached to the case.
[0036]
In the fourth embodiment, as shown in FIGS. 11 and 12, after the SSR 10 is mounted on the socket 20 mounted on the rail 13, the heat sink 50 is mounted on the top plate 11a of the case 11 of the SSR 10. It is.
[0037]
First, the structure of the case 11 will be described with reference to FIG. 13 and FIG. 14. An elongated window 13 is opened along the vertical direction substantially at the center of the top plate 11 a of the case 11. A spring material 60 is provided along the inner wall surface of the top plate 11a, the side plate 11b, and the bottom plate 11c of the case 11, and the heat dissipation plate 40 attached to the semiconductor power element 12 is provided on the spring material 60. A pair of plate-like support portions 62 which are thermally coupled to the inner surface side and have a distance equal to the width of the window 13 so as to correspond to the window 13 of the case 11 are bent inward. The spring material 60 is characterized in that the pair of support portions 62 are spring-biased in a direction approaching each other, as indicated by the arrow direction in FIG.
[0038]
On the other hand, in the heat sink 50 attached to the case 11, a thick insertion plate portion 55 is integrally formed at substantially the center of the side opposite to the heat radiation fin of the heat sink base portion 51 having a plurality of heat radiation fins 52. The heat sink 50 may be formed by either extrusion molding or forging.
[0039]
When the insertion plate portion 55 is inserted into the window 13 provided on the top plate 11 a of the case 11, both surfaces of the thick insertion plate portion 55 are sandwiched by the support portions 62 of the spring material 60, and the heat sink 50 The insertion plate portion 55 acts as a heat receiving base piece, and the support portion 62 of the spring material 60 acts as a heat radiating portion.
[0040]
As a result, heat of the power semiconductor device 12 inside the case 11 is heat radiating plate 40, joined to the spring member 60, is transmitted to the insertion plate portion 5 5 support portion 62 and strength in contact with and heat sink 50 of the spring member 60, Heat is effectively radiated to the outside through the heat sink 50, so that efficient heat radiation can be performed. Even in this embodiment, if the contact surface between the insertion plate portion 55 and the support portion 62 is coated with a paint having excellent thermal conductivity, the heat dissipation effect can be further improved by thermal coupling.
[0041]
Therefore, according to the fourth embodiment, there is an advantage that the space for the heat sink 50 can be reduced and the mounting structure of the heat sink 50 can be simplified.
[0042]
【The invention's effect】
As is apparent from the above description, in a socket-mounted SSR in which a semiconductor power element is housed in a synthetic resin case, a heat dissipation window is provided in the case and thermally coupled to the semiconductor power element. Adopting a heat dissipation structure that has a heat dissipation function by bringing it into the outside from the window and thermally connecting with this heat dissipation part to further increase the heat dissipation effect, so the capacity of the socket-mounted SSR can be increased. In addition, the compatibility with the electromagnetic relay can be enhanced.
[Brief description of the drawings]
FIG. 1 is an overall view showing a first reference example of an SSR created by the present inventors in the process leading to the present invention .
2 is a partial cross-sectional view illustrating a configuration of a heat dissipation unit in the SSR in FIG. 1;
FIG. 3 is an overall perspective view of the inside of a case showing a second reference example of an SSR created by the present inventors in the course of reaching the present invention .
FIG. 4 is an overall view seen through a case showing a modified example of the SSR shown in FIG. 3;
5 is a partial cross-sectional view showing a structure of a heat dissipation part in the SSR shown in FIG. 4;
FIG. 6 is a front view showing a third reference example of the SSR created by the present inventors in the course of reaching the present invention, and showing a state in which the SSR is mounted on the socket.
7 is a side view showing a state in which the SSR shown in FIG. 6 is mounted on a socket. FIG.
8 is an explanatory diagram showing a state seen through a case in the SSR shown in FIG. 6;
9 is a side view showing the SSR shown in FIG. 6. FIG.
10A is a front view of a heat sink attached to the SSR shown in FIG. 6, FIG. 10B is a plan view of the heat sink, and FIG. 10C is an explanatory view showing a state where the heat sink is attached to the SSR.
[Figure 11] shows the implementation form of SSR according to the present invention, is a front view showing a state of mounting the SSR in the socket.
12 is a side view showing a state where the SSR shown in FIG. 11 is attached to the socket. FIG.
13 is an explanatory view showing a state in which the inside of the case of the SSR shown in FIG. 11 is seen through. FIG.
14A is a front view and FIG. 14B is a side view of the SSR shown in FIG.
15 is a side view showing a state in which a heat sink is attached to the SSR shown in FIG. 11. FIG.
FIG. 16 is a perspective view showing a conventional SSR.
FIG. 17 is a perspective view showing a conventional socket-mounted SSR.
[Explanation of symbols]
10 SSR
11 Synthetic resin case
11a Top plate
11b Side plate
11c Bottom plate 12 Semiconductor power element 13 Window 14 Locking groove 20 Socket 21 Screwed terminal 30 Rail 31 Screw 40 Heat radiation plate 41, 42 Interface material 50 Heat sink 51 Heat sink base portion 52 Heat radiation fin 55 Plug plate portion 60 Spring material 61 Protrusion portion 62 Support Department

Claims (2)

A semiconductor power element (12) is accommodated in a rectangular parallelepiped synthetic resin case (11) having a bottom plate (11c) from which a plug pin (15) protrudes, four side plates (11b), and a top plate (11a). A socket-mounted solid state relay (10), and a heat sink (50) detachably mounted on the solid-state relay (10),
The heat sink is formed by integrally projecting a thick insertion plate portion (55) on the surface opposite to the heat radiation fin of the heat sink base portion (51) having a plurality of heat radiation fins (52),
On the top plate (11a) of the synthetic resin case, an elongated window (13) for inserting the insertion plate portion (55) of the heat sink is opened,
In the synthetic resin case, there is provided a spring material (60) made of a high heat conductive material mounted with a heat sink (40) of the semiconductor power element thermally coupled thereto,
The spring material (60) is disposed along the inner wall surface of the top plate (11a), side plate (11b), and bottom plate (11c) of the case, and corresponds to the window (13) of the top plate (11a). And a pair of plate-like support portions (62, 62) bent inwardly at intervals corresponding to the width of the window (13), and these support portions (62, 62). ) Are spring-biased in the direction of approaching each other,
Thereby, the insertion plate portion (55) of the heat sink inserted from the window (13) of the case top plate is received and sandwiched by the pair of support portions (62, 62) of the spring material, so that the semiconductor power device A solid state relay device characterized in that a heat transfer path is formed from (12) to the heat radiating fin (52) of the heat sink. Claims wherein each of the contact surface between the plug plate portion (55) and said pair of support portions (62, 62) has a thermal conductivity excellent in the paint is co pos- sesses, characterized in that The solid state relay device according to 1.

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