JP3953293B2 - Automatic wafer carrier cleaning equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance cleaning-work efficiency by realizing the best handling property while achieving minimization of a clean room in automating wafer- carrier cleaning. SOLUTION: A wafer carrier 1 comprises a front-opened container body 2 and a door 3 which is attached/detached to/from the container body 2 with a locking mechanism. In a clean room, the door 3 is detached from the container body 2, and the both are held in a cleaning machine 6 and are cleaned with a cleaning liquid. Then the door 3 is attached to the container body 2 with the locking mechanism, and the wafer carrier 1 is transferred to the outside of the clean room. The clean room is provided with a loader-unloader unit 10 that rotatively holds the wafer carrier, the cleaning machine 6, and a robot 20 installed between the both. The robot has a first hand part 23 for the container base body and a second hand part 30 for the door. The robot is capable of detaching/attaching the door 3 from/to the container body 2 in the loader- unloader unit 10, and simultaneously transfers the container body 2 and the door 3 between the loader-unloader unit and the cleaning machine.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an automatic wafer carrier cleaning facility used for storing, transporting, and storing a large number of wafers in the manufacture of semiconductor wafers, glass substrates and the like (hereinafter collectively referred to as wafers).
[0002]
[Prior art]
In wafer manufacturing, a target wafer is stored in a wafer carrier and transferred from the initial process to the next process in order or stored as necessary. The wafer carrier has been increased in size as the diameter of the wafer is increased, and is changing from an open cassette system to a front opening unified pod system that shields the wafer from the external atmosphere due to the minimal orientation of the clean room. The latter wafer carrier 1 is called FOUP, and is attached to and detached from the container main body 2 storing a large number of wafers and the front opening of the container main body 2 via a lock mechanism as indicated by the imaginary line in FIG. Door 3. The container body 2 has a grip portion 4 provided on the upper surface, and can be automatically conveyed using the grip portion 4 and the like while being sealed by a door 3. The door 3 has a lock hole 5 and a lock bar 3a constituting a lock mechanism, and is inserted into the lock hole 5 at two locations to be rotated and moved to the container body 2 via the lock bar 3. Detachable. The cleaning machine 6 is installed in a clean room and has a structure for cleaning and drying two wafer carriers 1 simultaneously. That is, in the cleaning operation, after the wafer carrier 1 is separated into the container main body 2 and the door 3, the main body holding portions 8 a and 8 b and the door holding portion 9 a at the fixed positions provided on the left and right sides in the tank of the cleaning machine 6. , 9b, with the upper cover 7 closed, the cleaning liquid is sprayed from a nozzle (not shown) to perform liquid cleaning, and is dried. After the cleaning process, the upper cover 7 is opened to take out the container main body 2 and the door 3, and the door 3 is mounted on the container main body 2, and is transferred from the clean room to the predetermined process as the original sealed wafer carrier 1.
[0003]
[Problems to be solved by the invention]
As described above, in the conventional structure, in the clean room in which the cleaning machine 6 is arranged, the operator separates the door 3 from the container body 2 with respect to the target wafer carrier 1, puts it in and out of the cleaning machine 6, and again opens the door 3. Since the container was mounted on the container body 2, the work time required for handling becomes longer than the actual cleaning time, making it difficult to reduce the overall processing time, and there is a risk of contamination due to manual work. There was also. In view of this background, the present applicants have conducted studies to make the unmanned cleaning of the wafer carrier (FOUP) possible, and as a result, have completed the present invention. . That is, an object of the present invention is to realize the best handling property while achieving further minimization of the clean room, particularly when automating the cleaning of the wafer carrier (FOUP), thereby improving the cleaning work efficiency and reducing the cost. There is.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, an automatic wafer carrier cleaning apparatus of the present invention includes a container body 2 having a wafer carrier 1 opened at the front side and a lock mechanism (door side) at the opening of the container body 2 as illustrated in the drawings. The lock bar 3a) is attached to and detached from the door 3 and the lock mechanism is released in the clean room C / R, and the door 3 is separated from the container body 2 and held in the washing machine 6 for washing with liquid. Thereafter, in the cleaning facility in which the door 3 is attached to the container body 2 via the lock mechanism so that the door 3 can be transported to a predetermined location, the clean room C • R includes a loader / unloader that rotatably holds the wafer carrier 1. Installed between a loader unit 10, the washing machine 6 disposed opposite to the loader / unloader unit 10, and between the loader / unloader unit 10 and the washing machine 6. And a robot 20 with four or more axes which (that drive shaft is not less than 4 axes), the robot 20, the container body comprising a clamping mechanism for attaching and detaching the grip portion 4 provided on the upper surface of the container main body 2 and use the first hand unit 23, and a second hand portion 30 door consisting of a holding mechanism for holding the door opening and closing mechanism and the door 3 to lock or release the locking mechanism is inserted into the lock hole 5 of the door 3 The loader / unloader unit 10 can separate or attach the door 3 to the container main body 2, and the container main body 2 and the door 3 (that is, the separated container main body and door) are simultaneously attached to the container main body 2. The loader / unloader unit 10 is transported between the washing machine 6.
[0005]
In the automatic cleaning equipment described above, the wafer carrier 1 to be cleaned is rotatably held with respect to the loader / unloader unit 10 (two of the holding tables 11A to 11D) with the door 3 attached to the container body 2. The For the wafer carrier 1 held on the loader / unloader unit 10, the robot 20 separates the door from the container body 2 by releasing the locking mechanism of the door 3 by the second hand unit 30 as in the embodiment. After holding, the container main body 2 is held by the first hand unit 23, and the door and the container main body are simultaneously moved to the fixed positions in the tank of the cleaning machine 6 (main body holding portions 8a and 8b and door holding portions 9a and 9b in FIG. 7). The container body 3 is set on the main body holding portion, and the door 3 is set on the holding portion. And the washing machine 6 performs a washing process automatically like the past. After cleaning, the robot 20 holds the door 3 with the second hand unit 30 and the container body 2 with the first hand unit 23 from the tank of the cleaning machine 6, and then simultaneously loads the door and the container body with the loader / unloader unit. 10, and the container body is rotatably held at a predetermined position of the loader / unloader unit (the vacant portion of the holding tables 11 </ b> A to 11 </ b> D), and then the door 3 is attached to the container body 2 via the lock mechanism. To do. Therefore, in the present invention, the time required for handling performed in the cleaning process can be greatly shortened. This is because the first and second hand portions 23 and 30 of the robot 20 separate the door 3 from the container main body 2, simultaneously transfer and set the door and container main body to the cleaning machine, and the door and container main body after cleaning. This is because the container body is held and the door is attached to the loader / unloader part at the same time.
[0006]
Further, in the present invention described above, the first hand portion 23 is composed of a clamping mechanism (24, 26) capable of attaching and detaching the grip portion 4 provided on the upper surface of the container main body 2, and the second hand portion 30 is formed of the door 3. It consists of a door opening / closing mechanism (35, 36, 40) for releasing or locking the locking mechanism by being inserted into the lock hole 5, and a holding mechanism (33 etc.) for holding the door 3. In particular, the second hand unit 30 is used for opening and closing the door. Since it has a mechanism, the lock mechanism of the door 3 (the lock bar 3a on the door side constituting the lock mechanism) can be released or locked, so that it can be automated including unlocking and locking the door. In addition, simply adopting the same structure as the locking mechanism between the door 3 and the container body 2 as the door holding portions 9a and 9b of the cleaning machine 6 allows the door to be held on the cleaning machine side (held by the locking mechanism) and simplified. There are advantages you can do. Further, the present invention is preferably embodied as in claims 2 and 3.
First, the second hand portion 30 has a holding plate 31 of the internal cavity, a piston 36 which the door opening and closing mechanism is swingably disposed in the holding plate, one end of the extendable rod 38 of the piston The key member 5 protrudes from the through hole of the holding plate 31, and is locked to the lock position via the telescopic rod 38 and the link 40. It is the structure which switches to a cancellation | release position. This is because in the type in which the lock mechanism between the door and the container body rotates the key member, the piston 36 and the ring 40 are used as the door opening / closing mechanism, so that the second hand portion can be easily miniaturized. It has been devised.
Second , the cleaning machine 6 can process two wafer carriers 1 at the same time, and the loader / unloader unit 10 can hold at least four wafer carriers. This is significant in that the automatic loader of the present invention is identified from the viewpoint of unitizing the loader / unloader unit 10 according to the processing capability of the cleaner 6.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be further described with reference to the drawings. FIG. 1 schematically shows the overall configuration of an automatic cleaning facility to which the present invention is applied, wherein (a) is a schematic view seen from above, and (b) is a schematic view seen from the side. FIG. 2 schematically shows a robot hand, where (a) is a side view, (b) is a view of (a) from above, and (c) is a view of (a) from below. is there. FIG. 3 schematically shows a state in which the door and the container main body are held in the hand of the robot. FIG. 3A is a side view, and FIG. 3B is a first hand portion shown along the line A-A in FIG. FIG. 4A and 4B show the second hand part, where FIG. 4A is a structural view in which a part of the holding plate is broken, FIG. 4B is an enlarged sectional view showing the main part, and FIGS. It is a figure which shows the action | operation of a mechanism. 5 and 6 schematically show an example of handling performed in the cleaning process as seen from above. In the embodiment, the cleaning machine and the wafer carrier are assumed to be the same type as that in FIG. In the following description, after describing the automatic cleaning equipment of the present invention together with the basic operation, reference is made to the details of handling performed in the cleaning process.
[0008]
(Cleaning facility) The automatic cleaning facility of the embodiment is located in the clean room CR as shown in FIG. 1, and is installed in a state where the loader / unloader unit 10 and the cleaning machine 6 face each other. A robot 20 is installed between the unloader unit 10 and the washing machine 6. The loader / unloader unit 10 includes three holding tables 11A to 11C provided on the lower side and one holding table 11D provided on the upper side, and the wafer carrier 1 is not shown by an automatic transfer machine. When it is sent through the load port, it is positioned and held on a holding table at an appropriate position, and the cleaned wafer carrier 1 (the container body 2 with the door 3 attached) is held outside the clean room 10 through the load port. It is a place to convey to. The holding tables 11A to 11D (11) can position and hold the container body 2 and are rotated at an arbitrary angle by a rotation mechanism. In this embodiment, the clean room C · R is minimized to (longitudinal) 2000 mm × (horizontal) 3000 mm × (height) 2800 mm, so that the holding table 11D is positioned one step higher than the holding tables 11A to 11C. It is arranged. Reference numeral 13 denotes an air conditioner installed on the ceiling 14 of the clean room CR.
[0009]
The cleaning machine 6 is a type capable of simultaneously cleaning two wafer carriers 1 (that is, two separated container bodies 2 and two doors 3), and the inside of the tank is divided into left and right cleaning units 6a and 6b. It is partitioned. Each cleaning unit 6a, 6b is provided with a body holding part 8a, 8b capable of positioning and holding the container body 2 and a door holding part 9a, 9b capable of positioning and holding the door 1, and the body holding parts 8a, 8b, Corresponding to the door holding portions 9a and 9b, a plurality of liquid injection nozzles (not shown), hot air injection means for drying, and the like are attached. Further, the door holding portions 9a and 9b have a structure in which the door 3 is attached and detached by a similar lock mechanism when the door 3 is attached to the container body 2 via the lock mechanism. The cleaning machine 6 only needs to be able to automatically process the two wafer carriers 1, and the cleaning mechanism itself may be one disclosed in Japanese Patent Laid-Open No. 2001-929. The wafer carrier 1 is, for example, a type that accommodates 25 wafers having a diameter of 300 mm.
[0010]
The robot 20 is installed at a substantially central portion of the clean room C • R, and the robot hand 21 has a first hand portion 23 and a second hand portion 30. As the robot body itself, for example, a clean robot (YR-CR20-A00) manufactured by Yaskawa Electric Co., Ltd. is used. The main operation is preferably one having five or more operating axes from the viewpoint of minimizing the clean room C / R. The structure shown in FIG. 1 has a vertical articulated 6-axis configuration, and the operating range is that the S axis is swiveled (± 180 °), the L axis is the lower arm (+ 120 °, −90 °), and the U axis is the upper arm ( + 90 °, −80 °), R-axis is wrist rotation (± 165 °), B-axis is wrist swing (+ 230 °, −50 °), and T-axis is wrist rotation (± 360 °). A first hand part 23 and a second hand part 30 are mounted as a robot hand 21 on the tip T-axis.
[0011]
As shown in FIGS. 2 and 3, the first hand unit 23 includes a clamping mechanism that can attach and detach the grip portion 4 provided on the upper surface of the container body 2. That is, in this structure, a pair of sandwiching plates 24 are pivotably coupled to a base portion 22 coupled to the T-axis, and both sandwiching plates 24 are separated from and connected by a piston 26. Each clamping plate 24 is formed with a U-shaped groove 24a on the opposite side surface and is pivotally supported on the base portion 22 via a pivot 25 composed of a bolt, a nut and the like on the base end side. In the state where the piston 26 is arranged on the base end side of both the sandwiching plates 24, the cylinder 27 is pivotally supported by one sandwiching plate 24 via an attachment member 29 a, and the distal end of the telescopic rod 28 is attached to the other sandwiching plate 24. It is pivotally supported via a member 29b. Accordingly, the first hand portion 23 described above is positioned directly below the second hand portion 30 in the state of FIG. 2A, and the both clamping portions 24 are connected to the piston 26 as shown by the solid line in FIG. In a non-parallel state (hereinafter, referred to as a non-holding state) with a space therebetween, the rectangular grip portion 4 that is lowered toward the container main body 2 and protrudes from the upper surface of the container main body 2 is positioned therebetween As shown by the imaginary line through the piston 26, the grip portion 4 is sandwiched in a state of being fitted into the U-shaped grooves 24a on both sides (hereinafter referred to as a holding state). The container main body 2 held by the first hand portion 23 is released from holding by controlling the piston 26, and is moved up and down with respect to the holding tables 11A to 11D and the main body holding portions 8a and 8b. It is designed to be attached and detached. However, as such a clamping mechanism, both clamping plates 24 can be detached and driven in parallel by a unitized piston mechanism to attach and detach the grip 4.
[0012]
As shown in FIGS. 2 to 4, the second hand unit 30 includes a door opening / closing mechanism that locks and unlocks the door 3 to the container body 2 (and the door holding portions 9 a and 9 b), and a door holding mechanism that holds the door 3. Is attached to the holding plate 31, and the holding plate 31 is connected to the T-axis of the robot 20 via the base portion 32. Here, the holding plate 31 has a flat plate shape with an internal cavity slightly smaller than the door 3. On the upper surface, there are provided four suction cups 33 and two key members 35 in the middle and projecting left and right. Among these, the suction cup 33 constitutes a door holding mechanism, and the central part is a tubular air supply / exhaust part 34. The air supply / exhaust part 34 protrudes into the holding plate 31 and is connected to a gas supply / exhaust hose (not shown) introduced from the base part 32 into the holding plate 31. In this structure, the door 3 separated from the container body 2 is sucked and held by the two suction cups 33 on the diagonal line together with the next door opening / closing mechanism. That is, two holes are provided diagonally on the outer surface of the door 3 along with the left and right key holes 5. Each suction cup 33 is provided corresponding to the hole of the door 3, and even if the wafer carrier 1 is arranged in different directions, the two suction cups 33 are always designed to overlap the hole.
[0013]
Each key member 35 constitutes a door opening / closing mechanism that releases or locks the locking mechanism of the door 3 with respect to the container body 2 by being inserted into the corresponding key hole 5 of the door 3 and rotated. This drive mechanism is a combination of a piston 36 and a link 40 as shown in FIG. That is, each piston 36 is disposed in the holding plate 31 in the left-right direction, and the cylinder 37 is pivotally supported by the rear end via the mounting member 39 so as to be swingable. A jig 38 a is coupled to the distal end of the telescopic rod 38, and one end of a link 40 is rotatably connected to the jig 38 a via a connection pin 41. A key member 35 projects from the other end of the link 40, and the key member 35 projects outward from a through hole 31b provided in the holding plate 31 and the auxiliary base portion 31a. That is, in this structure, the positions of the cylinder 37 and the key member 35 are restricted with respect to the holding plate 31, so that the telescopic rod 38 is expanded from the contracted state as shown in FIG. In the process of switching to, the link 40 is moved while the cylinder 37 swings, and the key member 35 is switched from the release position of FIG. 4C to the lock position of FIG. Further, when the operation control is performed so that the telescopic rod 38 of the cylinder 37 is contracted, the key member 35 is switched from the lock position to the release position by the movement of the telescopic rod 38 and the link 40. Such a door opening / closing mechanism can be applied to a driving mechanism such as a motor and a gear, but is excellent in that the method of the embodiment is simple and can suppress the thickness of the holding plate 31. Yes.
[0014]
(Handling example) An operation example of the automatic cleaning apparatus of the present invention described above will be described. 5 and 6 show an example in which the wafer carrier 1 on the loader / unloader unit 10 is set in each of the cleaning units 6 a and 6 b of the cleaning machine 6. In the loader / unloader unit 10, the wafer carrier 1 is held on two holding tables 11 by an AGV (automatic transfer machine) (not shown). In FIG. 5, in this handling, first, the holding table 11 is rotated 90 degrees clockwise from the initial state (a) to the state (b). At the same time, the robot 20 is driven, and the second hand portion 30 of the robot hand 21 is disposed to face the door 3. When the robot hand 21 approaches the door 3, the key member 35 is inserted into the key hole 7 (see FIG. 7) of the door 3. The door 3 is sucked and held by the holding plate 31 through the suction cup 34, and the piston 36 is operated to switch the key member 35 from the lock position to the release position. After the door 3 is moved away from the container body 2, the robot hand 21 is turned by 90 degrees in the direction of the arrow (b), that is, counterclockwise so as to be horizontal with the door 3 facing up. By this turning, the first and second hand portions 23 and 30 are horizontally arranged, and the holding table 11 is rotated 180 degrees from the state (b) to the state (c). Next, the first hand portion 23 is lowered, and the grip portion 4 of the container body 2 is positioned between the holding plates 24 in the non-holding state, and then switched to the holding state and gripped as shown in (d). Hold part 4. In this state, as shown in FIG. 3A, the door 3 is held by the second hand unit 30 on the upper side, and the container body 2 is held by the first hand unit 23 on the lower side. Next, the robot hand 21 is turned by 90 degrees in the arrow direction (d), that is, clockwise, so that the container body 2 is switched to the state (e) with the front opening down and the door 3 facing up. . Thereafter, the robot hand 21 is pivoted to the cleaning unit 6a of the cleaning machine 6, the container body 2 is held by the left body holding unit 8a, and the door 3 is held by the door holding unit 9a. The holding mechanism of the container main body 2 with respect to the main body holding portions 8a and 8b of the washing machine 6 and the holding mechanism of the door 3 with respect to the door holding portions 9a and 9b by the above-described lock bar 3a are the same as the conventional ones. However, in this structure, the container body 2 is held by the first hand portion 23 and is installed by the downward movement of the robot hand 21 with respect to the body holding portion 8a and the switching of the first hand portion 23 to the non-holding state. Retained. The door 3 is held by the second hand unit 30 and is positioned by the lateral movement of the robot hand 21 with respect to the door holding unit 9a, and the key member 35 is switched to the lock position to switch the door 3 to the door holding unit 9a. After the lock, the holding by the suction cup 33 of the door holding mechanism is released, and the key member 35 is pulled out from the key hole 5 by the movement of the robot hand 21.
[0015]
In FIG. 6, this handling is basically the same as FIG. 5, but the following points are changed. When holding the door 3, the holding table 11 is rotated 90 degrees (rotated counterclockwise) from the initial (a) to the (b) state opposite to the above. At the same time, the robot 20 is driven, and the second hand portion 30 of the robot hand 21 is disposed to face the door 3. When the robot hand 21 approaches the door 3, the key member 35 is inserted into the key hole 5 of the door 3 and is switched from the lock position to the release position as described above. After the door 3 is moved in the direction away from the container main body 2, the second hand unit 30 is turned by 90 degrees in the arrow direction (clockwise) opposite to (b). And the 1st hand part 23 is lowered | hung and hold | maintains the holding | grip part 4 between both the clamping plates 24 like (d) similarly to the above. Next, the robot hand 21 is turned by 90 degrees in the direction of the arrow (d) (counterclockwise) opposite to the above, so that the container body 2 has the front opening down and the door 3 has the side up. The state is switched to the state (e). The robot hand 21 is swung to the cleaning unit 6b of the cleaning machine 6, and the container main body 2 is held by the main body holding unit 8b and the door 3 is held by the door holding unit 9b as described above. As described above, after the container body 2 and the door 3 are set in both the cleaning sections 6a and 6b, the upper cover 7 of the cleaning machine 6 is closed, and the cleaning liquid is sprayed from the nozzles to wash off the deposits. The hot air is sprayed and dried. This cleaning process takes about 15 to 25 minutes.
[0016]
After the cleaning, the container body 2 and the door 3 of the cleaning units 6a and 6b are held in the reverse order to the handling at the time of setting, the door 3 is held by the second hand unit 30, and the container body 2 is held by the first hand unit 23. After the door 3 and the container main body 2 are transferred to the vacant holding table 11 by the turning movement of the robot hand 21, the container main body 2 is held on the holding table 11, and then the door 3 is the door described above. The wafer carrier 1 is assembled by being locked to the container body 2 by the operation of the opening / closing mechanism. The wafer carrier 1 is transferred from a loader / unloader unit 10 to a target location by an AGV (automatic transfer machine) (not shown).
[0017]
In addition, this invention is not restrict | limited to the said example of embodiment, It can change variously in the range which has the requirements specified by Claim 1. As an example, the robot 20 may have four or more operation axes or drive axes. This is to achieve the intended handling in the clean room CR with the minimum space. When the cleaning machine 6 has three cleaning units, at least six holding tables 11 of the loader / unloader unit 10 are installed. That is, the number of the holding tables 11 is configured to be more than twice that of the cleaning unit of the cleaning machine 6.
[0018]
【The invention's effect】
As described above, the wafer carrier automatic cleaning facility according to the present invention separates the door from the container main body by unlocking the door by the first and second hand portions of the robot when handling in the cleaning process is unmanned. After that, the door and container body can be transferred and set to the cleaning machine at the same time, the door and container body can be transferred to the loader / unloader at the same time after cleaning, and the door can be locked to the container body and assembled to the wafer carrier. As a result, it is possible to achieve the best handling while achieving further minimization of the clean room, improve the cleaning work efficiency and cleaning quality (this is due to the elimination of the risk of contamination due to unmanned operation), and reduce costs. Is easily possible.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of an automatic cleaning facility shown as an embodiment of the present invention.
2 is a configuration diagram showing the robot hand of FIG. 1; FIG.
FIG. 3 is a configuration diagram showing first and second hand portions of the robot hand.
FIG. 4 is a configuration diagram illustrating details of the second hand unit.
FIG. 5 is a schematic operation diagram showing an example of handling in the automatic cleaning equipment.
FIG. 6 is a schematic operation diagram showing an example of handling as in FIG.
FIG. 7 is a schematic view showing a wafer carrier and its cleaning machine.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Wafer carrier 2 ... Container main body (4 is a holding part)
3 ... Door (5 is a key hole)
6 ... Washing machine (7 is upper cover, 6a and 6b are washing parts)
8a, 8b ... main body holding part 9a, 9b ... door holding part 10 ... loader / unloader part (11, 11A to 11D are holding tables)
20 ... Robot (S, L, U, R, B, and T are driving axes)
21 ... Robot hand 23 ... First hand part (22 is a base part, 24 is a clamping plate, 26 is a piston)
30 ... 2nd hand part (31 is a holding plate, 32 is a base part)
33 ... Suction cup (door holding mechanism)
35 ... Key member (door opening / closing mechanism)
36 ... Piston (door open / close mechanism)
40 ... Link (door opening / closing mechanism)
CR: Clean room

Claims (3)

The wafer carrier is composed of a container body having a front opening, and a door that is attached to and detached from the opening of the container body via a lock mechanism. The lock mechanism is released in a clean room, and the door is separated from the container body to be cleaned. In the cleaning facility that holds the door and attaches the door to the container body via the lock mechanism, and enables transport to a predetermined location after the liquid washing treatment is performed,
The clean room includes a loader / unloader unit that rotatably holds the wafer carrier, the cleaning machine disposed opposite to the loader / unloader unit, and the loader / unloader unit and the cleaning machine. Equipped with a robot with 4 or more axes installed,
The robot includes a container body first hand portion including a clamping mechanism for attaching and detaching a grip portion provided on the upper surface of the container body, and a door opening / closing operation for releasing or locking the lock mechanism by being inserted into a lock hole of the door. and a second hand unit door comprising a holding mechanism for holding the mechanism and the door,
The loader / unloader part can separate or attach the door to the container main body by the second handle part, and the container main body and the door can be placed between the loader / unloader part and the washing machine at the same time. Wafer carrier automatic cleaning equipment characterized by transporting The second hand portion has a holding plate with an internal cavity, and the door opening and closing mechanism is pivotally disposed in the holding plate, and one end is pivotally supported on the telescopic rod of the piston, and the other end is 2. The wafer carrier according to claim 1 , wherein the wafer carrier comprises a link projecting from a key member, the key member projecting from a through hole of a holding plate, and rotating between a lock position and a release position via the telescopic rod and the link. Automatic cleaning equipment. The automatic wafer carrier cleaning apparatus according to claim 1 or 2 , wherein the cleaning machine can process two wafer carriers simultaneously, and the loader / unloader unit can hold at least four wafer carriers.

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