JP3953797B2 - Reflow soldering equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a reflow soldering apparatus including means for transporting a board on which electronic components are mounted, and a heating chamber for heating solder provided on the board being transported by the transport means.
[0002]
[Prior art]
The reflow soldering apparatus is an apparatus that heats a substrate on which electronic components are mounted in a heating chamber while being conveyed by a conveyor, melts cream solder, and solders the electronic components onto the substrate.
[0003]
This reflow soldering apparatus includes a blower and a heater in a heating chamber, and heats and melts the solder on the substrate with circulating circulating gas. This type of reflow soldering apparatus generally has a preheating chamber, a reflow chamber, and a cooling chamber in order along the conveying direction of the conveyor. The preheating chamber and the reflow chamber are each provided with a blower, a heater, and a wind guide device, so that the solder on the substrate is heated and melted by the heating gas circulating in the heating chamber, and then cooled in the cooling chamber. Has been.
[0004]
[Problems to be solved by the invention]
In the above reflow soldering apparatus, an opening for passing a substrate carrying electronic components and a conveyor for conveying the substrate is formed in the substrate conveyance path portion of the wall of the heating chamber. Therefore, if there are multiple preheating chamber inlet walls, preheating chamber and reflow chamber partition walls, preheating chambers and reflow chambers, electronic components are mounted on the respective partition walls and reflow chamber outlet walls. An opening is formed for the substrate and conveyor to pass through. Therefore, the heating gas circulating in the preheating chamber and reflow chamber flows out through the opening to the adjacent cooling chamber, preheating chamber, reflow chamber, or external atmosphere, so the flow rate and temperature of the heating gas fluctuate. A large amount of heat is required in the room and the reflow chamber on the exit side, which increases power consumption.
[0005]
On the other hand, there are various types of substrates and electronic components to be soldered to the substrates, and their height dimensions are not constant and vary. Accordingly, the height of the opening is set so as to correspond to the thickness of the substrate and the height dimensions of various electronic components. Therefore, an unnecessary portion is generated in the opening for transporting the substrate on which the electronic component is mounted, and the heated gas tends to flow out from this portion. The size of the unnecessary opening varies depending on the thickness of the substrate and the height of the electronic component mounted on the substrate. For example, when the height dimension of the electronic component is small, the size of the portion unnecessary for substrate transport in the opening becomes large. On the other hand, when the height dimension of the electronic component is large, the size of the portion unnecessary for substrate conveyance in the opening is small.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to prevent gas from flowing out through an opening formed in a substrate transfer path portion of a wall portion of a heating chamber in a reflow soldering apparatus. To do. Another object of the present invention is to appropriately prevent the outflow of gas through the opening in accordance with the thickness of the substrate and the height dimension of the electronic component mounted on the substrate.
[0007]
[Means for Solving the Problems]
The present invention employs the following means for solving the above problems.
That is, the present invention relates to a reflow soldering apparatus for performing soldering while transporting a substrate on which electronic components are mounted in a heating chamber partitioned by a partition wall into a plurality of chambers by a transporting means. A plurality of shielding members for shielding the openings formed in the substrate conveying path portion are provided in the conveying direction of the conveying means, and these shielding members extend in the heating chamber along the conveying direction of the conveying means. The shielding position changing mechanism is operated by a drive unit that drives the shielding position changing mechanism, and the plurality of shielding members are moved together in the vertical position. It is characterized by being changed .
It is preferable that a pair of left and right shielding position changing mechanisms are provided to support the shielding member .
[0008]
According to the said structure, the outflow of the gas through the opening formed in the wall part of the said heating chamber can be blocked | prevented by the shielding member. At this time, the shielding member is a position where the shielding position changing means shields an opening portion unnecessary for transporting the board on which the electronic component is mounted according to the thickness of the board and the height dimension of the electronic part mounted on the board. Therefore, the outflow of gas through the opening can be appropriately prevented according to the thickness of the substrate and the height dimension of the electronic component mounted on the substrate.
[0009]
The Te smell, that pre SL driver is configured to be controlled by the control means using the computer preferred.
[0010]
In this way, by inputting the thickness of the board and the maximum height of the electronic components mounted on the board, the driving unit is appropriately driven by the control means using a computer, thereby driving The shielding member is arranged at a predetermined height position by the shielding position changing mechanism operated by the unit.
[0011]
The shielding member includes an inlet wall of the preheating chamber, a partition wall between the preheating chamber and the reflow chamber, and a plurality of preheating chambers and reflow chambers, and each wall such as a partition wall of each chamber and an outlet wall of the reflow chamber. Or selectively placed on these walls.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
[0014]
As shown in FIG. 1, the reflow soldering apparatus has a heating chamber 2 and a cooling chamber 3 in order along the conveying direction of the conveyor 1, and a printed circuit board 5 on which electronic components 4 are mounted is transferred to each chamber by the conveyor 1. 2 and 3 are conveyed.
[0015]
The heating chamber 2 is partitioned into three chambers by a partition wall 6, and includes two preheating chambers 7 and one reflow chamber 8 in order along the conveying direction of the conveyor 1. In each of the chambers 7 and 8 of the heating chamber 2, a blower 9, a heater 10, and a wind guide device 11 are arranged at positions above and below the conveyor 1 so that the heated gas circulates in the chambers 7 and 8. It has become. As a gas for heating the solder, air, nitrogen gas or the like is used.
[0016]
The preheating chamber 7 is a chamber for gradually heating the cream solder to a predetermined preheating temperature with a circulating heating gas. In the printed circuit board 5 on which the electronic component 4 is mounted, the cream solder is heated to a predetermined preheating temperature in the preheating chamber 7. The reflow chamber 8 is a chamber in which cream solder is melted by the circulating heating gas and the electronic component 4 is soldered. The printed circuit board 5 on which the electronic component 4 is mounted is melted by heating the cream solder to a predetermined heating temperature in the reflow chamber 8. The cooling chamber 3 is a portion for cooling the heat-melted solder and is provided adjacent to the heating chamber 2.
[0017]
As shown in FIG. 2, a pair of conveyors 1 is provided with a gap left and right, and conveys the printed circuit board 5 while supporting the left and right ends of the lower surface of the printed circuit board 5 on which the electronic component 4 is mounted. The conveyor 1 is disposed horizontally from the entrance side of the heating chamber 2 through the heating chamber 2 to the cooling chamber 3, and the return path is disposed below the cooling chamber 3 and the heating chamber 2.
[0018]
As shown in FIG. 1, the left and right conveyors 1 pass through the inlet wall 12 and outlet wall 13 of the heating chamber 2, the partition wall 6 of the heating chamber 2, and the outlet wall 14 of the cooling chamber 3. Openings 15, 16, 17, and 18 through which the printed circuit board 5 carrying the electronic components 4 conveyed by the conveyor 1 pass are formed. As shown in FIG. 2, these openings 15, 16, 17, and 18 have a substantially rectangular shape, and the thickness of the printed circuit board 5 and various electronic components 4 mounted on the printed circuit board 5. The height dimension is set so as to correspond to the height dimension.
[0019]
Next, a shielding member for shielding a part of the openings 15, 16, and 17 formed in the heating chamber 2 and a shielding position changing means for the shielding member will be described with reference to FIGS.
[0020]
As shown in FIG. 2, the shielding member 19 is made of a rectangular plate member, has a size that can shield the upper portions of the openings 15, 16, and 17 of the heating chamber 2. The height position can be changed in the vertical direction in conjunction with.
[0021]
The shielding position changing means includes a shielding position changing mechanism and a driving unit that operates the shielding position changing mechanism, and the driving unit is configured to be controlled by a control means using a computer.
[0022]
The shielding position changing mechanism (see FIGS. 3 to 6) is configured as follows. That is, the fixed guide rail 20 is an elongated plate member having a rectangular cross section, and penetrates the walls 12, 6, 13 of the heating chamber 2 from the entrance side of the heating chamber 2 along the conveying direction of the conveyor 1 on the outside of the conveyor 1. Thus, the cooling chamber 3 is arranged and fixed. A plurality of guide pieces 21 having a U-shaped cross section are fixed to the outer surface of the fixed guide rail 20 at intervals in the longitudinal direction, whereby a plurality of guide holes 21 a are formed along the longitudinal direction on the outer surface of the fixed guide rail 20. Is formed. The slide rails 22 are inserted into the guide holes 21 a, and the slide rails 22 are arranged on the outer surface of the fixed guide rail 20. The slide rail 22 is an elongated plate member having a rectangular cross section, and is disposed from the inlet side of the heating chamber 2 to the cooling chamber 3 through the wall portions 12, 6, 13 of the heating chamber 2. It is made slidable along.
[0023]
A link 23 is supported on the support portion protruding from the upper surface of the fixed guide rail 20 so as to be rotatable in the vertical direction, and one end portion of the shielding member 19 in the left-right direction is fixed to the distal end portion of the link 23. Accordingly, the shielding member 19 is moved in the vertical direction in conjunction with the pivoting operation of the link 23 and the height position is changed in the vertical direction. An engaging pin 24 is provided at the tip of the link 23 so as to protrude outward, and the engaging pin 24 is inserted into an inclined hole 25 formed in the slide rail 22. The inclined hole 25 of the sliding rail 22 is formed along the longitudinal direction at a portion protruding from the upper surface of the sliding rail 22, and is gradually inclined downward toward the inlet side of the heating chamber 2.
[0024]
Therefore, when the slide rail 22 slides in the longitudinal direction, the engagement pin 24 of the link 23 connected to the fixed guide rail 20 relatively moves in the inclined hole 25 of the slide rail 22, and the engagement pin 24 Since the height position in the vertical direction changes, the height position in the vertical direction of the shielding member 19 changes accordingly.
[0025]
The fixed guide rail 20, the guide piece 21, the slide rail 22, the link 23, the engagement pin 24, and the inclined holes 25 of the slide rail 22 are provided outside the left and right conveyors 1, respectively. The left and right end portions are fixed and held at the tip portions of the left and right links 23.
[0026]
The shielding member 19 is provided in each of the openings 15, 16, and 17 of the inlet wall 12 and the outlet wall 13 of the heating chamber 2 and the partition wall 6 of the heating chamber 2. The link 23, the engagement pin 24, and the inclined hole 25 of the slide rail 22 are provided in corresponding portions of the fixed guide rail 20 and the slide rail 22 so that the position can be changed.
[0027]
Therefore, when the slide rail 22 slides in the longitudinal direction, the respective engagement pins 24 of the four links 23 connected to the fixed guide rail 20 at intervals in the longitudinal direction are in contact with the slide rail 22 in the longitudinal direction. Each of the engaging pins 24 is moved relative to each other in the four inclined holes 25 formed at intervals, and the vertical position of each engagement pin 24 changes accordingly. Each certain shielding member 19 changes the height position in the vertical direction together.
[0028]
The drive unit uses a motor. That is, the left and right slide rails 22 are configured to be slid by the drive motor. Racks 26 are respectively formed on the upper surfaces of the end portions of the left and right sliding rails 22 on the inlet side of the heating chamber 2, and pinions 27 that mesh with these racks 26 are provided, respectively, and the pinions 27 are drive motors (not shown). ).
[0029]
Further, the drive motor is configured to be controlled by control means using a computer, and is configured to be operated on an operation panel provided on the outer surface of the apparatus. That is, when the drive motor inputs the data of the thickness of the printed circuit board 5 and the maximum height dimension of the electronic components 4 mounted on the printed circuit board 5 on the operation panel, a predetermined amount is obtained by a control means using a computer. It is designed to be rotated.
[0030]
Next, the operation of the present invention will be described.
[0031]
The shielding member 19 is set to a height position in the vertical direction according to the thickness of the printed circuit board 5 and the height dimension of the electronic component 4 mounted on the printed circuit board 5, and is set at the set height position by the shielding position changing means. Is done.
[0032]
That is, when data on the thickness of the printed circuit board 5 and the maximum height dimension of the electronic components 4 mounted on the printed circuit board 5 are input on the operation panel, the drive motor is rotated by a predetermined amount by control means using a computer. Is done. When the drive motor is rotated by the control means, the pinion 27 rotates, so that the slide rail 22 including the rack 26 that meshes with the pinion 27 slides along the fixed guide rail 20 for a predetermined length. When the slide rail 22 slides, the engagement pin 24 at the tip of the link 23 connected to the fixed guide rail 20 moves relative to the inside of the inclined hole 25 of the slide rail 22, and the height position thereof is determined. Quantitative change. As a result, the shielding member 19 is moved by a predetermined height in the vertical direction and set at the set height position. Since the height positions of the shielding members 19 are changed together by sliding of the slide rails 22, the shielding members 19 are formed on the inlet wall 12 and the outlet wall 13 of the heating chamber 2 and the partition wall 6 of the heating chamber 2. In each of the openings 15, 16, and 17, an opening portion above the upper surface of the electronic component 4 mounted on the printed circuit board 5, that is, an opening portion that is unnecessary for transporting the printed circuit board 5 mounted with the electronic component 4 is formed by each shielding member 19. It is shielded by.
[0033]
The printed circuit board 5 on which the electronic component 4 is mounted is placed on the conveyor 1 on the entrance side of the heating chamber 2, and the heated solder gas in which the cream solder on the printed circuit board 5 circulates in the preheating chamber 7 while being conveyed by the conveyor 1. Is heated gradually by the heating gas melted by the heated gas circulating in the reflow chamber 8 and then cooled in the cooling chamber 3.
[0034]
At this time, the heating gas circulating in the preheating chamber 7 and the reflow chamber 8 is adjacent through the openings 15, 16 and 17 formed in the inlet wall 12 and outlet wall 13 of the heating chamber 2 and the partition wall 6 of the heating chamber 2. Each shielding member 19 that shields a part of the openings 15, 16, 17 prevents the air from flowing into the chamber or the outside atmosphere.
[0035]
As described above, in the present invention, the shielding member 19 is moved by the shielding position changing unit according to the thickness of the printed circuit board 5 and the height dimension of the electronic component 4 mounted on the printed circuit board 5. Since the opening portion unnecessary for the conveyance of the substrate on which the substrate is mounted can be positioned so as to be shielded, the outflow of gas through the openings 15, 16, and 17 is mounted on the thickness of the printed substrate 5 and the printed substrate 5. According to the height dimension of the electronic component 4, it can prevent appropriately. As a result, fluctuations in the flow rate and temperature of the heating gas in the preheating chamber 7 and the reflow chamber 8 can be suppressed as much as possible, leading to a reduction in power consumption.
[0036]
The present invention is not limited to that described in the above embodiment, and may be configured as described below, for example.
[0037]
In the above embodiment, the inclined hole 25 provided in the slide rail 22 may be an inclined groove. Furthermore, instead of the inclined hole 25 and the inclined groove, an inclined surface may be formed on the upper surface of the slide rail 22 and the engaging pin 24 may be engaged with the inclined surface.
[0038]
Moreover, in the said embodiment, although the shielding member 19 was provided in each opening 15,16,17 of the heating chamber 2, what is necessary is just to select the opening location which provides the shielding member 19 suitably.
[0039]
The shielding position changing mechanism for moving the shielding member 19 in the vertical direction is not limited to the mechanism shown in the above embodiment. For example, an engagement pin provided on the link 23 is fixed to a rotation operation shaft rotated by a drive motor. Various configurations may be employed such as moving the shielding member 19 in the vertical direction by a link mechanism that is engaged with the cam or moved up and down in conjunction with a rotary operation shaft rotated by a drive motor.
[0040]
Further, in the above embodiment, using the motor drive unit, Ru can also be configured to slide the slide rail 22 by using the drive cylinder as a power source.
[0042]
In the above embodiment, the reflow soldering apparatus that performs soldering with the circulating heating gas is shown. However, the present invention is also applicable to a reflow soldering apparatus that uses a far infrared heater in addition to using the heating gas. Needless to say, you can.
[0043]
【The invention's effect】
As described above, according to the reflow soldering apparatus of the present invention, it is possible to prevent gas from flowing out through the opening formed in the substrate transfer path portion of the wall portion of the heating chamber. Furthermore, the outflow of gas through the opening can be appropriately prevented according to the thickness of the substrate and the height dimension of the electronic component mounted on the substrate. As a result, power consumption can be reduced.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing a reflow soldering apparatus (a shielding member is shown but a shielding position changing mechanism is omitted) according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing an opening portion cut at right angles to a conveying direction.
FIGS. 3A and 3B are front views showing a part of the shielding position changing mechanism, in which FIG. 3A shows a state in which the shielding member is at the maximum height position, and FIG. 3B shows a state in which the shielding member has moved slightly downward; Is shown.
4 is a cross-sectional view taken along line AA in FIG.
FIG. 5 is a front view showing a shielding position changing mechanism near an opening position in a heating chamber.
FIG. 6 is a front view showing a shielding position changing mechanism.
[Explanation of symbols]
1 ... Conveyor 2 ... Heating room 3 ... Cooling room 4 ... Electronic parts 5 ... Printed circuit board 6 ... Heating room partition wall 7 ... Preheating room 8 ... Reflow room 9 .. Blower, 10 .. Heater, 11 .. Air guide device, 12 .. Inlet wall of heating chamber, 13 .. Outlet wall of heating chamber, 14 .. Outlet wall of cooling chamber, 15, 16, 17. · Opening of heating chamber, 18 · · Opening of cooling chamber, 19 · · Shield member, 20 · · Fixed guide rail, 21 · · Guide piece, 21a · · Guide hole, 22 · · Sliding rail, 23 · · Link , 24 .. engaging pin, 25 .. inclined hole, 26 .. rack, 27 .. pinion.

Claims (3)

In a reflow soldering apparatus that performs soldering while transporting a substrate on which electronic components are mounted in a heating chamber partitioned by a partition wall into a plurality of chambers by a transport means, formed on the substrate transport path portion of the wall of the heating chamber A shielding position changing mechanism is provided in which a plurality of shielding members for shielding the opened openings are provided in the conveying direction of the conveying means, and these shielding members extend in the heating chamber along the conveying direction of the conveying means. The plurality of shielding members are changed together in the vertical position by operating the shielding position changing mechanism by a drive unit that is connected and supported and drives the shielding position changing mechanism. A reflow soldering device. The reflow soldering apparatus according to claim 1, wherein a pair of left and right shielding positions are provided to support the shielding member . The reflow soldering apparatus according to claim 1, wherein the driving unit is controlled by a control unit using a computer .

Images