JP3956200B2 - Thin film laser processing method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing method and apparatus for processing a thin film such as a semiconductor or a photoreceptor by irradiating a laser beam, and in particular, a thin film pattern such as a thin film solar cell in which a plurality of unit cells are connected in series on an electrically insulating substrate. The present invention relates to a laser processing method and apparatus for a thin film during formation.
[0002]
[Prior art]
In recent years, research and development of flexible solar cells using plastic films has been promoted and put into practical use in terms of weight reduction, workability, and mass productivity. Furthermore, the thing using the film substrate which carried out the insulation coating to the flexible metal material is also developed. Taking advantage of this flexibility, mass production became possible by a roll-to-roll method or a stepping roll method.
[0003]
The above thin film solar cell is a photoelectric conversion element (or cell) in which a first electrode (lower electrode), a photoelectric conversion layer made of a thin film semiconductor layer, and a second electrode (transparent electrode) are laminated on an electrically insulating film substrate. A plurality of are formed. By repeating electrically connecting the first electrode of a certain photoelectric conversion element and the second electrode of the adjacent photoelectric conversion element, the first electrode of the first photoelectric conversion element and the second electrode of the last photoelectric conversion element Can output the voltage required for For example, in order to obtain an alternating current of 100 V as a commercial power source by alternating current with an inverter, the output voltage of the thin-film solar cell is desirably 100 V or higher, and actually several tens or more elements are connected in series.
[0004]
Such a photoelectric conversion element and its series connection are formed by forming an electrode layer and a photoelectric conversion layer, patterning each layer, and a combination procedure thereof. Examples of the configuration and manufacturing method of the solar cell are described in, for example, Japanese Patent Application Laid-Open Nos. 10-233517, 2000-77690, and Japanese Patent Application No. 11-19306.
[0005]
FIG. 7 is a plan view schematically showing the configuration of the thin film solar cell described in JP-A-2000-77690. FIG. 7A is a plan view of the surface on which the photoelectric conversion unit is formed, and FIG. b) shows a plan view of the back side on which the connection electrode layer is formed.
[0006]
In FIG. 7A, 1 is a substrate, u is a transparent electrode layer, H is a common connection hole, and s is a patterned separation part. In FIG. 7B, e is a fourth electrode layer as a connection electrode layer, s is a patterned separation portion, and t1 and t2 are extraction electrodes at the end of the connection electrode layer. The connection electrode layer is composed of a first connection electrode layer (third electrode layer) and a second connection electrode layer (fourth electrode layer). Between these two electrode layers, there is an electric insulating layer not shown in FIG. Is formed.
[0007]
The details of the method for manufacturing the thin-film solar cell are described in the above-mentioned published patent publication, and the outline thereof is as follows. First, the first electrode layer is formed on the surface of the substrate 1 in which the connection holes H are opened, and the third electrode layer is formed on the back surface. The first electrode layer and the third electrode layer are overlapped with each other on the inner wall of the connection hole H to conduct. Next, after laser processing the first electrode layer into a predetermined shape and patterning the first electrode layer, the third electrode layer is similarly laser processed to pattern the third electrode layer.
[0008]
Next, an electrical insulating layer is formed on the third electrode layer. At this time, an electrical insulating layer is also formed on the inner wall of the connection hole H. A photoelectric conversion layer made of a-Si and a transparent electrode layer are formed on the first electrode layer, and a fourth electrode layer is formed on the electrical insulating layer on the back side. The transparent electrode layer u and the fourth electrode layer e are overlapped with each other on the inner wall of the connection hole H and are electrically connected. Next, the lamination of the transparent electrode layer and the fourth electrode layer is laser processed, and the transparent electrode layer u, the power extraction electrodes t1 and t2, and the fourth electrode layer e are patterned, respectively.
[0009]
Finally, a part of the patterning line between the third electrode layer and the fourth electrode layer is laser processed to remove a part of the electrical insulating layer, and the third electrode layer and the fourth electrode layer are removed by this insulating layer removal portion. The series connection of thin film solar cells is completed by electrical connection. In some cases, the third electrode layer and the fourth electrode layer are electrically connected without providing the above-described electrical insulating layer.
[0010]
Incidentally, a laser processing method and apparatus for forming a pattern of a thin film solar cell are described in, for example, Japanese Patent No. 283280. A schematic configuration of the apparatus described in this publication is shown in FIG.
[0011]
The apparatus shown in FIG. 6 includes a substrate transport apparatus having an unwinding roll 6a and a winding roll 7a, a laser patterning apparatus 5a having a laser emitting portion 3a and a substrate holder 4a, a transfer roll 9a, and an adhesive rubber roll 10a. A transfer roller hole (not shown) opened in the substrate 1 is detected by the photodetector 2a, and the substrate 1 is guided to a predetermined position of the laser patterning device 5a to fix the substrate flatly. After that, the thin film formed on the substrate is patterned by using a laser processing method, and thereafter, the adhesive rubber roll 10a is used downstream of the laser processing portion to adhere dirt (laser processing residue) attached to the substrate at the time of laser processing. ).
[0012]
According to the laser processing method and apparatus, by applying tension to a part of the flexible substrate to be conveyed and holding it flat, the holding part can be easily processed by irradiating the laser beam, and the processing strength In addition, laser processing with good processing reproducibility can be performed. In addition, the yield can be improved by providing a mechanism for removing dust generated by processing from the substrate surface. As a result, a laser processing apparatus that can be used effectively in the manufacture of thin film solar cells is obtained.
[0013]
By the way, the laser processing method and apparatus shown in FIG. 6 have the feature that high productivity, which is an advantage of roll-to-roll conveyance, and high-precision pattern formation, which is an advantage of single wafer conveyance, can be performed. Since the thin-film solar cell region has to be fixed flatly, the apparatus becomes large, and a lot of time is required for fixing the substrate, resulting in a problem that productivity is lowered. Also, a complicated fixing mechanism was necessary.
[0014]
For example, in order to perform laser processing for patterning a high-quality thin film on a flexible substrate, the substrate must be held with a flatness within ± 0.1 mm. Conventionally, such holding has been realized by vacuum suction of a substrate on a flat substrate holding table (processing stage). However, if the substrate with holes is vacuum-adsorbed, air leaks from the holes in the substrate, so that the substrate does not adhere to the processing stage, the flatness of the substrate deteriorates, the processing distance is large, and the processing distance is large. There was a problem that the width varied.
[0015]
In order to solve the above problems, the present applicant has applied for an improved laser processing method and apparatus by Japanese Patent Application No. 2001-305124. FIG. 4 is a schematic configuration diagram of the apparatus, and FIG. 5 is a schematic partial enlarged view of a substrate on which a patterning line is partially formed.
[0016]
The laser processing method and apparatus shown in FIGS. 4 and 5 are generally characterized as follows (for details, see Japanese Patent Application No. 2001-305124). That is, a substrate transport apparatus having an unwinding roll 6a, a winding roll 7a, and a substrate support roll 30a, a laser emitting unit 70, a marker 20a for positioning patterning, or a patterning line detection unit 60 as a reference, And a thin film pattern forming apparatus including a patterning apparatus having a control unit 50 that controls conveyance and patterning processing, and the roll-shaped long substrate is intermittently conveyed, and the conveyance distance is at least an interval between adjacent patterning lines. Although it is larger, it has a relatively short predetermined distance, and the thin film formed on the substrate supported by the substrate support roll is patterned by laser.
[0017]
According to the method, the substrate supported by the cylindrical roll is supported on a substantially flat surface. Thereby, highly accurate patterning can be performed even on the roll. Further, since the cylindrical support roll can be used also as the substrate transport roll, productivity can be improved.
[0018]
[Problems to be solved by the invention]
Incidentally, the improved laser processing method and apparatus also have the following problems.
[0019]
The cylindrical support roll in the apparatus is made of metal, and a processing stage made of metal such as stainless steel or aluminum alloy is damaged by laser light during laser processing, and unevenness is generated on the surface. The processing stage having such irregularities has a problem of easily damaging the film which is a flexible substrate and impairing the quality stability.
[0020]
In the conventional laser processing method (YAG laser), processing is performed by moving the laser beam emitting portion with an XY stage or the like. The laser beam emitting portion and the oscillator are formed using a fiber optical system or the like. As a result, the inertia load of the moving body becomes large, and a large power is required for speeding up, resulting in poor productivity.
[0021]
The present invention was made to solve the above problems, and the object of the present invention is to enable laser processing with good quality stability of a thin film supported by a cylindrical roll, and An object of the present invention is to provide a highly accurate and highly productive laser processing method and apparatus.
[0022]
[Means for Solving the Problems]
In order to solve the above-described problems, in the present invention, a roll-shaped flexible long substrate is transported to a predetermined substrate support, and a thin film formed on at least one main surface of the substrate is irradiated with laser light. In the laser processing method of the thin film to be processed,
The substrate support portion is a translucent hollow roll, and the substrate is transported to the outer peripheral portion of the translucent hollow roll and positioned in a state where tension is applied to the substrate, and then from the hollow side of the translucent hollow roll. The thin film is irradiated with laser light, the focal point of the laser light is formed in the laser processing portion of the thin film, and the focal point is processed by moving in the axial direction and / or the circumferential direction of the translucent hollow roll ( (Invention of Claim 1)
[0023]
According to the first aspect of the present invention, the flexible substrate to be conveyed is brought into close contact with the translucent hollow roll and held flat, and the thin film on the flexible substrate is processed by irradiating laser light from the inside. By doing so, highly accurate and highly stable laser processing can be performed .
[0024]
Moreover, since the said translucent hollow roll can also be used as the board | substrate conveyance roll and can be processed from an inner side without a fiber optical system, the further improvement of productivity can be aimed at. According to the above method, highly accurate patterning can be easily performed.
[0025]
Further, as an apparatus for carrying out the method, the inventions of the following claims 2 to 8 are preferable. That is, in a thin film laser processing apparatus that transports a roll-shaped flexible long substrate to a predetermined substrate support and processes the thin film formed on at least one main surface of the substrate by irradiating with a laser beam, Substrate transport means for sending the substrate to the outer peripheral portion of the translucent hollow roll as the substrate support portion, positioning the substrate in a tensioned state, and winding the processed substrate, and the translucent hollow The thin film is irradiated with laser light from the hollow side of the roll, the focal point of the laser light is formed on the laser processing portion of the thin film, and this focal point is moved in the axial direction and / or the circumferential direction of the translucent hollow roll. shall and a laser light irradiating means for processing by (the invention of claim 2).
[0026]
Further, in the processing apparatus according to claim 2 , the translucent hollow roll is made of a glass cylinder, and an antireflection coating is formed on the surface of the cylinder (invention of claim 3 ). . Thereby, absorption and reflection of laser light are suppressed, and energy efficiency of laser processing is improved.
[0027]
Furthermore, in the processing apparatus according to claim 2 or 3 , the contact length dimension in the substrate transport direction between the substrate when positioned and the outer peripheral portion of the translucent hollow roll is a laser processing length in the substrate transport direction. More than the dimension (Invention of Claim 4 ). Thereby, the laser processing of the desired length of a board | substrate conveyance direction can be implemented safely.
[0028]
As an embodiment of the laser beam irradiation means in the invention, the invention of claim 5 is preferable. That is, disposed in the processing apparatus according to any one of claims 2 to 4, the laser beam irradiation means includes a laser oscillator, is connected to the laser oscillator optically, and in the translucent hollow roll Beam emitting means for forming a focal point of laser light on a predetermined laser processing part of the thin film, and emitting part driving means for moving the focal point in the axial direction and / or circumferential direction of the translucent hollow roll Shall be provided.
[0029]
Further, as an embodiment of the beam emitting means in the invention, the inventions of the following claims 6 to 7 are preferable. That is, in the processing apparatus according to claim 5 , the laser oscillator is disposed at one central axis end portion of the translucent hollow roll, and the beam emitting means is a laser beam emitted from the laser oscillator. and a reflection mirror you reflected in the radius direction, it is assumed and a lens unit for the focal point formation (the invention of claim 6). Further, in the processing apparatus according to claim 6 , the beam emitting means includes a plurality of the lens units, a total reflection mirror provided in the last lens unit, and other lens unit parts excluding the last stage. And a half mirror provided in the invention (invention of claim 7 ).
[0030]
Furthermore, as an embodiment of the emitting part driving means in the above invention, the invention of the following claim 8 is preferable. That is, in the processing apparatus according to claim 6 or 7 , the emission unit driving means includes a projection unit mounting shaft mechanically connected to a projection unit main body for mounting the mirror and the lens unit, and the projection unit. A spy line rotary bearing that supports the part mounting shaft and a drive device for axially driving and / or rotationally driving the light projecting part mounting shaft are provided.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below with reference to FIGS.
[0032]
FIG. 1 is a schematic configuration diagram of a thin film laser processing apparatus according to an embodiment of the present invention, FIG. 2 is a schematic partial side sectional view of FIG. 1, and FIG. 3 is a schematic diagram of pattern formation.
[0033]
In the laser processing apparatus shown in FIGS. 1 and 2, the flexible substrate 1 in a state in which film formation has been completed on a flexible polyimide film material having a thickness of 50 μm is wound around a roll core having a diameter of 150 mm and sent out. 2, a thin film is formed on the translucent hollow roll 4 movably supported by the bearing 11 on the side plates 22 a and 22 b of the processing chamber 22 from the delivery roll 2 in the delivery means 21 through the marker detector 3. It is fed out with the surface inside, and is positioned and fixed with the marker hole la as a positioning reference.
[0034]
In the above description, when the film material transmits laser light and the thin film forming surface is on one side, the film material can be processed with the thin film forming surface outside. Further, since the light-transmitting hollow roll 4 needs to process the thin film on the flexible substrate 1 on the outside by transmitting the laser light from the inside of the hollow roll, the material is a glass tube that absorbs less laser light. It is desirable to use For example, when YAG second harmonic (wavelength: 532 nm) is used as the laser light, the transmittance of the laser light in the glass tube is 98 to 99%.
[0035]
Furthermore, it is desirable to reduce the reflection loss of the laser light by applying an antireflection coating (for example, MgF ₂ or SiO ₂ ) to the glass tube surface.
[0036]
As shown in FIG. 2, the laser beam irradiation means in this apparatus is a laser oscillator 15, optically connected to the laser oscillator 15, and disposed in the translucent hollow roll 4. A beam emitting means 40 for forming a focal point of laser light on the laser processing part, and an emitting part driving means 42 for moving the focal point in the axial direction and / or the circumferential direction of the translucent hollow roll 4 are provided.
[0037]
The emission unit driving means 42 includes a light projecting unit mounting shaft 6 mechanically connected to a light projecting unit main body 41 for mounting a mirror and a lens unit, which will be described later, and a spy line that supports the light projecting unit mounting shaft 6. A rotary bearing 5 and a driving device for driving and / or rotating the light projecting portion mounting shaft 6 are provided.
[0038]
That is, the light projecting portion mounting shaft 6 that can move and rotate in the axial direction from the side plate 22a of the processing chamber 22 via the spline rotary bearing 5 is mounted so as to be the same as the axial center of the translucent hollow roll 4. It has been. The receiving side timing pulley 7 attached to the rotating portion of the spline rotary bearing 5 is connected via a driving timing pulley 9 and a timing belt 10 attached to a rotational movement motor 8 supported by the side plate 22a of the processing chamber 22. The rotational movement of the light projecting portion mounting shaft 6 is controlled by the motor 8 for rotational movement.
[0039]
Further, a shaft 12 positioned on the opposite side of the light projecting portion mounting shaft 6 from the light projecting portion is provided with a bearing 12 that can rotate by restricting the light projecting portion mounting shaft 6 only in the axial direction. The bearing 12 is fixed to the moving stage 13a of the slide table 13, and the linear movement in the axial direction of the light projecting portion mounting shaft 6 is controlled by the feed moving motor 14 for driving the slide table 13.
[0040]
Further, the side plate 22b facing the side plate 22a to which the light projecting portion mounting shaft 6 of the processing chamber 22 is mounted is a laser oscillator whose position is adjusted so that the axis of the light projecting portion mounting shaft 6 is the optical axis. 15 is attached.
[0041]
Laser light emitted from the laser oscillator 15 is irradiated as parallel light through the lens unit 16 toward the axial center of the light projecting portion mounting shaft 6. The irradiated laser light is first guided to the half mirror 17 attached to the light projecting portion mounting shaft 6, and the laser light corresponding to the reflectance of the half mirror 17 is bent in a direction perpendicular to the axis of the light projecting portion mounting shaft 6. Then, the laser beam condensed through the lens unit 18 is irradiated onto the processed surface of the substrate of the translucent hollow roll 4. The irradiated laser light passes through the translucent hollow roll 4 and focuses on the thin film surface on the flexible substrate 1 fixed to the translucent hollow roll 4.
[0042]
In this state, an arbitrary pattern can be processed on the thin film on the flexible substrate 1 by controlling the rotational motion of the light projecting portion mounting shaft 6 and the linear motion in the axial direction in synchronization with the laser pulse.
[0043]
The laser light transmitted through the half mirror 17 is bent by the total reflection mirror 19 in a direction perpendicular to the axis of the light projecting portion mounting shaft 6, and the laser light condensed through the lens unit 20 is converted into a translucent hollow roll. The thin film is processed by focusing on the thin film surface on the flexible substrate 1 via 4.
[0044]
Although the above embodiment shows an example in which the laser beam is branched into two, it is also possible to change the transmittance of the half mirror and to provide a plurality of lens units 18 so that three or more branches are possible. Thereby, simultaneous processing of a plurality of rows can be performed, and the processing capability of the apparatus can be improved.
[0045]
After being processed as described above, as shown in FIG. 1, the flexible substrate 1 is attached to a winding roll 25 in the winding means 23 after passing through a film cleaner 24 to remove processing dust. Rolled around a rolled core. Also, the processing dust adhered on the translucent hollow roll 4 is washed after processing by the roll cleaner 26 in order to prevent the processing light from becoming a hindrance to the laser beam during the next processing. Do. As the substrate transport means, auxiliary means such as a guide roll and a tension roll for smoothly transporting the substrate and applying an appropriate tension to the substrate are provided as appropriate.
[0046]
Next, a pattern processing method will be described with reference to FIG. FIG. 3 is a schematic diagram of patterning formed on a thin film on the flexible substrate 1. A general pattern is formed in a lattice shape as shown in FIG.
[0047]
First, when forming the patterning line 30 in the roll feed direction, the linear movement in the axial direction of the light projecting portion mounting shaft 6 is controlled, and the lens unit 18 and the lens unit 20 are positioned in accordance with the patterning line. . Next, the rotational movement of the light projecting portion mounting shaft 6 is controlled by the rotational movement motor 8 to rotate the lens unit 18 and the lens unit 20, and the rotation angle necessary for patterning during the rotation is controlled by the laser oscillator 15. By irradiating only the laser beam, the desired patterning in the roll feed direction can be performed.
[0048]
Since the length that can be processed by this operation is only the portion where the flexible substrate 1 is in contact with the translucent hollow roll 4, the contact length 33 (not less than the feed direction patterning line length 32 (FIG. 3)) ( As shown in FIG. 1, when the outer diameter of the translucent hollow roll 4 is determined, efficient processing can be performed.
[0049]
As described above, the roll feeding direction patterning line 30 is processed by repeating the control of the linear motion and the rotational motion of the light projecting portion mounting shaft 6 in the axial direction.
[0050]
Next, when forming the roll width direction patterning line 31, first, the rotational movement of the light projecting portion mounting shaft 6 is controlled by the rotational movement motor 8 to rotate and process the lens unit 18 and the lens unit 20. Positioning is performed by adjusting the rotation angle according to the patterning line. Next, the linear movement in the axial direction of the light projecting portion mounting shaft 6 is controlled, moved and positioned to the patterning start position, and then moved to the patterning start position of the adjacent lens unit while irradiating the laser along the patterning line. In this embodiment, the laser irradiation is stopped when the lens unit 20 moves to the patterning start position of the lens unit 18.
[0051]
Thereby, the roll width direction patterning line 31 can be formed. As a matter of course, if the number of heads, that is, the number of lens units 18 is increased, the moving distance is shortened, so that the processing time can be shortened.
[0052]
【The invention's effect】
According to this invention, as described above, a roll-shaped flexible long substrate is conveyed to a predetermined substrate support portion, and a thin film formed on at least one main surface of the substrate is irradiated with laser light. In a thin film laser processing apparatus to be processed, a substrate for feeding the substrate to an outer peripheral portion of a translucent hollow roll as the substrate support portion, positioning the substrate in a tensioned state, and winding the processed substrate Laser light is applied to the thin film from the hollow side of the transporting means and the translucent hollow roll, and the focal point of the laser light is formed on the laser processing portion of the thin film, and this focal point is set in the axial direction of the translucent hollow roll And / or laser light irradiation means for processing by moving in the circumferential direction ,
The flexible substrate to be conveyed is closely attached to the translucent hollow roll and held flat, and the thin film on the flexible substrate is processed by irradiating laser light from the inside, thereby achieving high accuracy and stability. High laser processing was possible. In addition, by eliminating the fiber optic system that connects the laser irradiation unit and the laser oscillator that are moved during processing, the inertial load on the laser irradiation unit can be reduced, and the degree of freedom of movement can be increased. Processing became possible.
[Brief description of the drawings]
1 is a schematic configuration diagram of a laser processing apparatus according to an embodiment of the present invention. FIG. 2 is a partial side sectional view of the laser processing apparatus of FIG. 1. FIG. 3 is a schematic diagram of pattern formation according to an embodiment of the present invention. 4 is a schematic configuration diagram of a conventional improved laser processing apparatus. FIG. 5 is a schematic partial enlarged view of a substrate patterned by the apparatus of FIG. 4. FIG. 6 is a schematic configuration diagram of a conventional laser processing apparatus. FIG. 7 is a diagram showing an example of the configuration of a thin film solar cell.
1: Substrate, 2: Feeding roll, 3: Marker detector, 4: Translucent hollow roll, 5: Spline rotary bearing, 6: Projector mounting shaft, 15: Laser transmitter, 16, 18, 20: Lens Unit: 17: Half mirror, 19: Total reflection mirror, 21: Feeding means, 22: Processing chamber, 23: Winding means, 25: Winding roll, 30: Patterning line in roll feed direction, 31: Patterning line in roll width direction , 40: beam emitting means, 41: light projecting section main body, 42: emitting section driving means.

Claims (8)

In a thin film laser processing method of transporting a roll-shaped flexible long substrate to a predetermined substrate support and processing the thin film formed on at least one main surface of the substrate by irradiating with a laser beam,
The substrate support portion is a translucent hollow roll, and the substrate is transported to the outer peripheral portion of the translucent hollow roll and positioned in a state where tension is applied to the substrate, and then from the hollow side of the translucent hollow roll. Processing the laser beam by irradiating the thin film with a laser beam, forming a focal point of the laser beam at the laser processing portion of the thin film, and moving the focal point in the axial direction and / or circumferential direction of the translucent hollow roll. A thin film laser processing method characterized by the above. In a thin film laser processing apparatus for transporting a roll-shaped flexible long substrate to a predetermined substrate support and processing the thin film formed on at least one main surface of the substrate by irradiating laser light,
Substrate transport means for sending the substrate to the outer peripheral portion of the translucent hollow roll as the substrate support portion, positioning the substrate in a tensioned state, and winding the processed substrate, and the translucent hollow The thin film is irradiated with laser light from the hollow side of the roll, the focal point of the laser light is formed on the laser processing portion of the thin film, and this focal point is moved in the axial direction and / or the circumferential direction of the translucent hollow roll. thin laser processing apparatus characterized by comprising a laser light irradiating means for processing by. 3. The thin film laser processing apparatus according to claim 2 , wherein the translucent hollow roll is made of a glass cylinder, and an antireflection coating is formed on the cylindrical surface. In the processing apparatus according to claim 2 or 3, length contact of the substrate transport direction of the substrate and the translucent hollow roll outer portion of upon said positioning, laser processing length dimension in the transport direction of the substrate A thin film laser processing apparatus characterized by the above. In the processing apparatus according to any one of claims 2 to 4, the laser beam irradiation means includes a laser oscillator, is connected to the laser oscillator optically, and disposed in the translucent hollow roll, Beam emitting means for forming a focal point of laser light on a predetermined laser processing part of the thin film, and emitting part driving means for moving the focal point in the axial direction and / or circumferential direction of the translucent hollow roll A thin film laser processing apparatus comprising: 6. The processing apparatus according to claim 5 , wherein the laser oscillator is disposed at one central axis end portion of the translucent hollow roll, and the beam emitting means halfway the laser light emitted from the laser oscillator. a reflection mirror you reflected radially laser processing apparatus of a thin film, characterized in that it comprises a lens unit for the focal point formation. 7. The processing apparatus according to claim 6 , wherein the beam emitting means is provided in a plurality of the lens units, a total reflection mirror provided in a lens unit portion at the final stage, and a lens unit portion other than the final stage. A thin film laser processing apparatus comprising a half mirror. The processing device according to claim 6 or 7 , wherein the emitting unit driving means includes a projecting unit mounting shaft mechanically connected to a projecting unit main body for mounting the mirror and the lens unit, and the projecting unit mounting. A thin-film laser processing apparatus comprising: a spyline rotary bearing that supports a shaft; and a driving device that axially drives and / or rotationally drives the light projecting portion mounting shaft.

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