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JP3960905B2 - Surface mount type circuit module - Google Patents
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JP3960905B2 - Surface mount type circuit module - Google Patents

Surface mount type circuit module Download PDF

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Publication number
JP3960905B2
JP3960905B2 JP2002327433A JP2002327433A JP3960905B2 JP 3960905 B2 JP3960905 B2 JP 3960905B2 JP 2002327433 A JP2002327433 A JP 2002327433A JP 2002327433 A JP2002327433 A JP 2002327433A JP 3960905 B2 JP3960905 B2 JP 3960905B2
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Japan
Prior art keywords
insulating thin
thin plate
circuit module
electrode
wiring pattern
Prior art date
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Expired - Fee Related
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JP2002327433A
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Japanese (ja)
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JP2004165305A (en
Inventor
芳清 渡辺
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Priority to JP2002327433A priority Critical patent/JP3960905B2/en
Priority to CN 200310115653 priority patent/CN1230048C/en
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Description

【０００１】
【発明の属する技術分野】
本発明は近距離無線機や携帯電話機等の電子機器に使用して好適な面実装型回路モジュールに関する。
【０００２】
【従来の技術】
従来の面実装型回路モジュールの構成を図７に基づいて説明すると、回路基板５１は、複数枚の絶縁薄板５２，５３，５４が積層されて形成されている。
【０００３】
また、最下面に位置する第１層目の絶縁薄板５２の下面には、複数の電極５５が形成され、第１層目の絶縁薄板５２と最下面から第２層目に位置する絶縁薄板５３との間には、配線パターン５６が設けられ、第２層目の絶縁薄板５３と最上部に位置する第３層目の絶縁薄板５４との間には、配線パターン５７が設けられ、更に、最上部に位置する第３層目の絶縁薄板５４の上面には、配線パターン５８が形成されている。
【０００４】
そして、第１層目の絶縁薄板５２の下面に形成された電極５５は、配線パターン５６，５７，５８等にスルーホール（接続導体）５９によって接続されると共に、最上部の絶縁薄板５４の上面に設けられた配線パターン５８には、電気部品６０が搭載されて、回路モジュールＭ２が形成されている。
【０００５】
積層基板からなるマザー基板６１の上面には、配線パターン６２が設けられており、この配線パターン６２上には、回路モジュールＭ２が載置された状態で、回路モジュールＭ２が配線パターン６２に半田６３付けされて、回路モジュールＭ２がマザー基板６１に面実装されている。（例えば、特許文献１参照）
【０００６】
しかしながら、面実装された回路モジュールＭ２とマザー基板６１との間の間隙、即ち、最下面の第１層目の絶縁薄板５２の下面に設けられた電極５５と配線パターン６２との間の間隙が小さいため、両者間を接続するために設けられた半田６３の状態を側方から目視によって検査する際、半田６３付けの状態が見づらく、目視検査が容易にできないものであった。
【０００７】
【特許文献１】
特開２００１−１３５９０４号公報
【０００８】
【発明が解決しようとする課題】
従来の回路モジュールは、最下面の第１層目の絶縁薄板５２の下面に設けられた電極５５とマザー基板６１に設けられた配線パターン６２とが半田６３付けされるため、電極５５と配線パターン６２との間隙が小さいため、両者間を接続するために設けられた半田６３の状態を側方から目視によって検査する際、半田６３付けの状態が見づらく、目視検査が容易にできず、検査に手間取るという問題がある。
【０００９】
そこで、本発明は半田付の目視検査が容易で、生産性の良好な面実装型回路モジュールを提供することを目的とする。
【００１０】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、複数枚の絶縁薄板が積層されると共に、上面に電気部品が搭載された回路基板を備え、前記回路基板は、最下面に位置する第１層目の前記絶縁薄板に設けられた複数の切り欠き部と、最下面から第２層目に位置する前記絶縁薄板の下面に設けられた複数の電極とを有し、前記切り欠き部は前記第１層目の前記絶縁薄板からなる壁部を有し、前記電極は前記切り欠き部内に前記壁部との間に空隙を有するように設けられると共に、前記切り欠き部は、前記第１層目の絶縁薄板の側面に達した状態で形成されて、前記電極は前記第１層目の絶縁薄板の前記側面を通して露出した構成とした。
【００１１】
また、第２の解決手段として、前記電極は、前記第２層目の絶縁薄板の側面近傍に位置した状態で、前記第２層目の絶縁薄板の前記側面に沿って配設された構成とした。
また、第３の解決手段として、前記電極には半田バンプが形成された構成とした。
【００１２】
【発明の実施の形態】
本発明の面実装型回路モジュールの図面を説明すると、図１は本発明の面実装型回路モジュールの第１実施例に係る平面図、図２は本発明の面実装型回路モジュールの第１実施例に係る下面図、図３は本発明の面実装型回路モジュールの第１実施例に係る正面図である。
【００１３】
また、図４は本発明の面実装型回路モジュールの第１実施例に係り、要部の拡大正面図、図５は本発明の面実装型回路モジュールの第１実施例に係り、回路モジュールをマザー基板に取り付けた状態を示す要部の拡大正面図、図６は本発明の面実装型回路モジュールの第２実施例に係り、要部の拡大正面図である。
【００１４】
本発明の面実装型回路モジュールの第１実施例の構成を図１〜図５に基づいて説明すると、四角形状の回路基板１は、複数枚、例えば３枚の絶縁薄板２，３，４が積層されて形成されている。
【００１５】
最下面に位置する第１層目の絶縁薄板２は、それぞれの側面２ａに沿って設けられた複数の切り欠き部２ｂを有し、この切り欠き部２ｂは、側面２ａに達した状態で形成されている。
【００１６】
最下面から第２層目に位置する絶縁薄板３の下面には、絶縁薄板３の側面３ａ近傍で、側面３ａに沿って配設された複数の電極５を有し、この電極５は、それぞれ切り欠き部２ｂ内に位置すると共に、この電極５は、第１層目の絶縁薄板２の側面３ａを通して露出した状態となっている。
【００１７】
そして、第１層目の絶縁薄板２と最下面から第２層目に位置する絶縁薄板３との間には、配線パターン６が設けられ、また、第２層目の絶縁薄板３と最上部に位置する第３層目の絶縁薄板４との間には、配線パターン７が設けられ、更に、最上部に位置する第３層目の絶縁薄板４の上面には、配線パターン８が形成されている。
【００１８】
また、第１層目の絶縁薄板２の下面に形成された電極５は、ここでは図示しないが、配線パターン６，７，８等にスルーホール（接続導体）によって接続されると共に、最上部の絶縁薄板４の上面に設けられた配線パターン８には、電気部品９が搭載されている。
【００１９】
金属板からなる箱形のカバー１０は、電気部品９を覆うように、回路基板１の上面に半田付け等によって取り付けられ、このような構成によって回路モジュールＭ１が形成されている。
【００２０】
積層基板等からなるマザー基板１１の上面には、配線パターン１２が設けられており、この配線パターン１２上には、回路モジュールＭ１の第１層目の絶縁薄板２の下面が載置された状態で、回路モジュールＭ１の電極５が配線パターン１２に半田１３付けされて、回路モジュールＭ１がマザー基板１１に面実装されている。
【００２１】
そして、面実装された回路モジュールＭ１の電極５とマザー基板１１の上面との間の間隙は、最下面の第１層目の絶縁薄板２の厚みの寸法となって、比較的大きな隙間となっており、このため、電極５と配線パターン１２とを接続する半田１３の状態を側方から目視によって検査する際、切り欠き部２ｂを通して、半田１３付けの状態が容易に目視できて、目視検査が容易にできる。
【００２２】
また、図６は本発明の面実装型回路モジュールの第２実施例を示し、この第２実施例は、電極５に予め半田バンプ１４を形成したものである。
そして、回路モジュールＭ１がマザー基板１１に面実装される際、半田バンプ１４を配線パターン１２上に載置した状態で、半田バンプ１４が加熱炉によって溶融され、回路モジュールＭ１の電極５が配線パターン１２に半田パンプ１４によって半田付けされて、回路モジュールＭ１がマザー基板１１に面実装されるようになっている。
【００２３】
その他の構成は、前記第１実施例と同様であるので、同一部品に同一番号を付し、ここではその説明を省略する。
【００２４】
なお、上記実施例では、回路基板１が３枚の絶縁薄板の積層によって形成されたもので説明したが、２枚、或いは４枚以上の絶縁薄板の積層によって回路基板を形成したものでも良い。
【００２５】
【発明の効果】
本発明の面実装型回路モジュールは、複数枚の絶縁薄板が積層されると共に、上面に電気部品が搭載された回路基板を備え、回路基板は、最下面に位置する第１層目の絶縁薄板に設けられた複数の切り欠き部と、最下面から第２層目に位置する絶縁薄板の下面に設けられた複数の電極とを有し、電極は切り欠き部内に位置すると共に、切り欠き部は、第１層目の絶縁薄板の側面に達した状態で形成されて、電極は第１層目の絶縁薄板の側面を通して露出したため、面実装された回路モジュールの電極とマザー基板の上面との間の間隙は、最下面の第１層目の絶縁薄板の厚みの寸法となって、比較的大きな隙間となっており、このため、電極と配線パターンとを接続する半田の状態を側方から目視によって検査する際、切り欠き部を通して、半田付けの状態が容易に目視できて、目視検査が容易にでき、生産性の良好なものが得られる。
【００２６】
また、電極は、第２層目の絶縁薄板の側面近傍に位置した状態で、第２層目の絶縁薄板の側面に沿って配設されたため、半田付けの状態が一層容易に目視できて、目視検査が一層容易にでき、生産性の一層良好なものが得られる。
【００２７】
また、電極には半田バンプが形成されたため、回路モジュールのマザー基板への搭載が容易となって、生産性の良好なものが得られる。
【図面の簡単な説明】
【図１】本発明の面実装型回路モジュールの第１実施例に係る平面図。
【図２】本発明の面実装型回路モジュールの第１実施例に係る下面図。
【図３】本発明の面実装型回路モジュールの第１実施例に係る正面図。
【図４】本発明の面実装型回路モジュールの第１実施例に係り、要部の拡大正面図。
【図５】本発明の面実装型回路モジュールの第１実施例に係り、回路モジュールをマザー基板に取り付けた状態を示す要部の拡大正面図。
【図６】本発明の面実装型回路モジュールの第２実施例に係り、要部の拡大正面図。
【図７】従来の面実装型モジュールの正面図。
【符号の説明】
１ 回路基板
２ 第１層目の絶縁薄板
２ａ 側面
２ｂ 切り欠き部
３ 第２層目の絶縁薄板
３ａ 側面
４ 第３層目（最上部）の絶縁薄板
５ 電極
６ 配線パターン
７ 配線パターン
８ 配線パターン
９ 電気部品
１０ カバー
Ｍ１ 回路モジュール
１１ マザー基板
１２ 配線パターン
１３ 半田
１４ 半田バンプ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface mount type circuit module suitable for use in electronic equipment such as a short-range wireless device and a mobile phone.
[0002]
[Prior art]
The configuration of a conventional surface mount circuit module will be described with reference to FIG. 7. The circuit board 51 is formed by laminating a plurality of insulating thin plates 52, 53, and 54.
[0003]
A plurality of electrodes 55 are formed on the lower surface of the first insulating thin plate 52 located on the lowermost surface, and the first thin insulating plate 52 and the insulating thin plate 53 located on the second lowermost layer. Is provided with a wiring pattern 56, and a wiring pattern 57 is provided between the second-layer insulating thin plate 53 and the third-layer insulating thin plate 54 positioned at the uppermost position. A wiring pattern 58 is formed on the upper surface of the third insulating thin plate 54 located at the top.
[0004]
The electrode 55 formed on the lower surface of the first insulating thin plate 52 is connected to the wiring patterns 56, 57, 58 and the like by through holes (connection conductors) 59 and the upper surface of the uppermost insulating thin plate 54. An electrical component 60 is mounted on the wiring pattern 58 provided in the circuit pattern M2, and the circuit module M2 is formed.
[0005]
A wiring pattern 62 is provided on the upper surface of the mother substrate 61 made of a laminated substrate. The circuit module M2 is soldered 63 to the wiring pattern 62 in a state where the circuit module M2 is placed on the wiring pattern 62. In addition, the circuit module M2 is surface-mounted on the mother board 61. (For example, see Patent Document 1)
[0006]
However, there is a gap between the surface-mounted circuit module M2 and the mother board 61, that is, a gap between the electrode 55 provided on the lower surface of the first insulating thin plate 52 on the lowermost surface and the wiring pattern 62. Due to the small size, when the state of the solder 63 provided to connect the two is visually inspected from the side, it is difficult to see the state of the solder 63 attached, and visual inspection cannot be easily performed.
[0007]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-135904
[Problems to be solved by the invention]
In the conventional circuit module, since the electrode 55 provided on the lower surface of the first insulating thin plate 52 on the lowermost surface and the wiring pattern 62 provided on the mother substrate 61 are soldered 63, the electrode 55 and the wiring pattern are connected. Since the gap with 62 is small, when visually inspecting the state of the solder 63 provided to connect the two from the side, it is difficult to see the state of the solder 63 attached, and the visual inspection cannot be easily performed. There is a problem of taking time and effort.
[0009]
SUMMARY OF THE INVENTION An object of the present invention is to provide a surface mount type circuit module that can be easily inspected by soldering and has good productivity.
[0010]
[Means for Solving the Problems]
As a first solving means for solving the above-described problem, a circuit board having a plurality of insulating thin plates stacked and electrical components mounted on the upper surface is provided, and the circuit board is located on the lowermost surface. A plurality of notches provided in the insulating thin plate of the layer, and a plurality of electrodes provided on the lower surface of the insulating thin plate located in the second layer from the bottom surface, the notch The first layer has a wall portion made of the insulating thin plate, the electrode is provided in the cutout portion so as to have a gap between the wall portion, and the cutout portion is formed in the first layer. The electrode is formed so as to reach the side surface of the insulating thin plate of the eye, and the electrode is exposed through the side surface of the first insulating thin plate.
[0011]
Further, as a second solving means, the electrode is disposed along the side surface of the second insulating thin plate in a state of being located near the side surface of the second insulating thin plate. did.
As a third solution, the electrode has a solder bump.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a plan view according to a first embodiment of a surface mount circuit module of the present invention, and FIG. 2 is a first embodiment of the surface mount circuit module of the present invention. FIG. 3 is a bottom view according to the example, and FIG. 3 is a front view according to the first embodiment of the surface-mounted circuit module of the present invention.
[0013]
FIG. 4 relates to a first embodiment of the surface-mounted circuit module of the present invention, and is an enlarged front view of the main part. FIG. 5 relates to the first embodiment of the surface-mounted circuit module of the present invention. FIG. 6 is an enlarged front view of the main part according to the second embodiment of the surface mount circuit module of the present invention, showing the main part attached to the mother board.
[0014]
The configuration of the first embodiment of the surface mount type circuit module according to the present invention will be described with reference to FIGS. 1 to 5. A rectangular circuit board 1 includes a plurality of, for example, three insulating thin plates 2, 3, 4. It is formed by stacking.
[0015]
The first-layer insulating thin plate 2 located on the lowermost surface has a plurality of cutout portions 2b provided along the respective side surfaces 2a, and the cutout portions 2b are formed in a state of reaching the side surface 2a. Has been.
[0016]
The lower surface of the insulating thin plate 3 located in the second layer from the lowermost surface has a plurality of electrodes 5 arranged along the side surface 3a in the vicinity of the side surface 3a of the insulating thin plate 3, The electrode 5 is located in the notch 2b and is exposed through the side surface 3a of the first insulating thin plate 2.
[0017]
A wiring pattern 6 is provided between the insulating thin plate 2 of the first layer and the insulating thin plate 3 positioned as the second layer from the lowermost surface, and the second insulating thin plate 3 and the uppermost portion. A wiring pattern 7 is provided between the third insulating thin plate 4 and the third insulating thin plate 4 located on the top, and a wiring pattern 8 is formed on the upper surface of the third insulating thin plate 4 located on the top. ing.
[0018]
The electrode 5 formed on the lower surface of the first insulating thin plate 2 is connected to the wiring patterns 6, 7, 8, etc. by through holes (connection conductors), although not shown here, and the uppermost part. An electrical component 9 is mounted on the wiring pattern 8 provided on the upper surface of the insulating thin plate 4.
[0019]
A box-shaped cover 10 made of a metal plate is attached to the upper surface of the circuit board 1 by soldering or the like so as to cover the electrical component 9, and the circuit module M1 is formed by such a configuration.
[0020]
A wiring pattern 12 is provided on the upper surface of the mother substrate 11 made of a laminated substrate, and the lower surface of the first insulating thin plate 2 of the circuit module M1 is placed on the wiring pattern 12. Thus, the electrode 5 of the circuit module M1 is soldered to the wiring pattern 12, and the circuit module M1 is surface-mounted on the mother board 11.
[0021]
The gap between the electrode 5 of the surface-mounted circuit module M1 and the upper surface of the mother board 11 is a dimension of the thickness of the first insulating thin plate 2 on the lowermost surface, which is a relatively large gap. Therefore, when the state of the solder 13 connecting the electrode 5 and the wiring pattern 12 is visually inspected from the side, the state of the solder 13 can be easily visually confirmed through the notch portion 2b. Can be easily done.
[0022]
FIG. 6 shows a second embodiment of the surface mount type circuit module according to the present invention. In the second embodiment, solder bumps 14 are formed on the electrodes 5 in advance.
When the circuit module M1 is surface-mounted on the mother substrate 11, the solder bumps 14 are melted by the heating furnace in a state where the solder bumps 14 are placed on the wiring patterns 12, and the electrodes 5 of the circuit module M1 are connected to the wiring patterns. The circuit module M1 is surface-mounted on the mother board 11 by being soldered to a solder bump 14.
[0023]
Since other configurations are the same as those of the first embodiment, the same parts are denoted by the same reference numerals, and the description thereof is omitted here.
[0024]
In the above embodiment, the circuit board 1 is described as being formed by stacking three insulating thin plates, but the circuit board may be formed by stacking two or four or more insulating thin plates.
[0025]
【The invention's effect】
The surface mount circuit module of the present invention includes a circuit board on which a plurality of insulating thin plates are stacked and electrical components are mounted on the upper surface, and the circuit board is a first insulating thin plate located on the lowermost surface. And a plurality of electrodes provided on the lower surface of the insulating thin plate located in the second layer from the lowermost surface, the electrodes are located in the notch portion, and the notch portion Is formed in a state of reaching the side surface of the first insulating thin plate, and the electrode is exposed through the side surface of the first insulating thin plate, so that the electrode of the surface mounted circuit module and the upper surface of the mother substrate are The gap between them is the dimension of the thickness of the first insulating thin plate on the lowermost surface, and is a relatively large gap. For this reason, the state of the solder connecting the electrode and the wiring pattern is changed from the side. When visually inspecting, through the notch, Able state easily visually marked, it can be easily visually inspected, having good productivity can be obtained.
[0026]
In addition, since the electrode is disposed along the side surface of the second insulating thin plate in the state of being located near the side surface of the second insulating thin plate, the soldering state can be more easily visually observed. Visual inspection can be performed more easily, and products with better productivity can be obtained.
[0027]
Further, since the solder bumps are formed on the electrodes, the circuit module can be easily mounted on the mother substrate, and a product with good productivity can be obtained.
[Brief description of the drawings]
FIG. 1 is a plan view according to a first embodiment of a surface-mounted circuit module of the present invention.
FIG. 2 is a bottom view according to the first embodiment of the surface-mounted circuit module of the present invention.
FIG. 3 is a front view according to a first embodiment of a surface-mounted circuit module of the present invention.
FIG. 4 is an enlarged front view of a main part according to the first embodiment of the surface-mounted circuit module of the present invention.
FIG. 5 is an enlarged front view of a main part showing a state in which the circuit module is attached to a mother board according to the first embodiment of the surface-mounted circuit module of the present invention.
FIG. 6 is an enlarged front view of a main part according to a second embodiment of the surface-mounted circuit module of the present invention.
FIG. 7 is a front view of a conventional surface mount module.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board 2 1st layer insulation thin plate 2a Side surface 2b Notch 3 2nd layer insulation thin plate 3a Side surface 4 3rd layer (topmost) insulation thin plate 5 Electrode 6 Wiring pattern 7 Wiring pattern 8 Wiring pattern 9 Electrical component 10 Cover M1 Circuit module 11 Mother board 12 Wiring pattern 13 Solder 14 Solder bump

Claims (3)

複数枚の絶縁薄板が積層されると共に、上面に電気部品が搭載された回路基板を備え、前記回路基板は、最下面に位置する第１層目の前記絶縁薄板に設けられた複数の切り欠き部と、最下面から第２層目に位置する前記絶縁薄板の下面に設けられた複数の電極とを有し、前記切り欠き部は前記第１層目の前記絶縁薄板からなる壁部を有し、前記電極は前記切り欠き部内に前記壁部との間に空隙を有するように設けられると共に、前記切り欠き部は、前記第１層目の絶縁薄板の側面に達した状態で形成されて、前記電極は前記第１層目の絶縁薄板の前記側面を通して露出したことを特徴とする面実装型回路モジュール。A plurality of insulating thin plates are stacked, and a circuit board having electrical components mounted on an upper surface thereof is provided. The circuit board has a plurality of notches provided in the first insulating thin plate located on the lowermost surface. And a plurality of electrodes provided on the lower surface of the insulating thin plate located in the second layer from the bottom surface, and the notch has a wall portion made of the first insulating thin plate. The electrode is provided in the notch so as to have a gap between the wall and the notch, and the notch is formed so as to reach a side surface of the first insulating thin plate. The surface mount type circuit module, wherein the electrode is exposed through the side surface of the first insulating thin plate. 前記電極は、前記第２層目の絶縁薄板の側面近傍に位置した状態で、前記第２層目の絶縁薄板の前記側面に沿って配設されたことを特徴とする請求項１記載の面実装型回路モジュール。2. The surface according to claim 1, wherein the electrode is disposed along the side surface of the second insulating thin plate in a state of being located in the vicinity of the side surface of the second insulating thin plate. Mounted circuit module. 前記電極には半田バンプが形成されたことを特徴とする請求項１、又は２記載の面実装型回路モジュール。3. The surface mount type circuit module according to claim 1, wherein solder bumps are formed on the electrodes.
JP2002327433A 2002-11-11 2002-11-11 Surface mount type circuit module Expired - Fee Related JP3960905B2 (en)

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JP2002327433A JP3960905B2 (en) 2002-11-11 2002-11-11 Surface mount type circuit module
CN 200310115653 CN1230048C (en) 2002-11-11 2003-11-10 Plane mounting circuit module

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CN114361730B (en) * 2021-12-28 2024-12-20 湖南海博瑞德电智控制技术有限公司 Busbar for battery cell module, battery cell module and manufacturing method thereof

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JPH10270819A (en) * 1997-03-28 1998-10-09 Ngk Spark Plug Co Ltd Electronic component for surface mounting and method of manufacturing the same
JP2000114415A (en) * 1998-09-30 2000-04-21 Nec Corp Electronic components
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