JP3961475B2 - C / C composite plate - Google Patents
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- JP3961475B2 JP3961475B2 JP2003398526A JP2003398526A JP3961475B2 JP 3961475 B2 JP3961475 B2 JP 3961475B2 JP 2003398526 A JP2003398526 A JP 2003398526A JP 2003398526 A JP2003398526 A JP 2003398526A JP 3961475 B2 JP3961475 B2 JP 3961475B2
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- 239000002131 composite material Substances 0.000 title claims description 10
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 18
- 239000004917 carbon fiber Substances 0.000 claims description 18
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 230000000052 comparative effect Effects 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 102000009027 Albumins Human genes 0.000 description 1
- 108010088751 Albumins Proteins 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- RPOCFUQMSVZQLH-UHFFFAOYSA-N furan-2,5-dione;2-methylprop-1-ene Chemical compound CC(C)=C.O=C1OC(=O)C=C1 RPOCFUQMSVZQLH-UHFFFAOYSA-N 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Description
本発明は、高可撓性と高電導性を有するC/Cコンポジットプレートに関するものである。 The present invention relates to a C / C composite plate having high flexibility and high conductivity.
炭素繊維強化炭素複合材料いわゆるC/Cコンポジット(以下、C/Cと略記する)はカーボンファイバーを骨材とし、炭素をマトリクスとした複合材料であって、耐熱性、耐薬品性、摩擦特性に優れ、かつ高強度で軽量なためロケットノズルや航空機のブレーキディスク・パッドなどに使用されている。このC/Cには、可撓性を有するものや、電導性を有するものなどもある。 Carbon fiber reinforced carbon composite material, so-called C / C composite (hereinafter abbreviated as C / C), is a composite material that uses carbon fiber as an aggregate and carbon as a matrix, and has excellent heat resistance, chemical resistance, and friction characteristics. It is used for rocket nozzles and aircraft brake discs and pads because of its excellent strength, high strength and light weight. This C / C includes a flexible one and a conductive one.
しかし、従来のC/Cは、可撓性の高いものは電導性が低く、電導性の高いものは可撓性が低くなってしまい、高可撓性または高電導性どちらか一方の特性を備えさせることしかできないものであった。 However, the conventional C / C has a high flexibility and a low conductivity, and a high conductivity has a low flexibility and has either high flexibility or high conductivity. It could only be prepared.
そこで、本発明の目的は、高可撓性及び高電導性の両方を有するC/Cプレートを提供することである。 Accordingly, an object of the present invention is to provide a C / C plate having both high flexibility and high conductivity.
上記目的を達成するために本発明によれば、一方向に面状に引き揃えられたカーボンファイバーを骨材とし、黒鉛化する物質をマトリックスとするUDプリプレグを2枚以上重ね、2000℃以上で熱処理してなるC/Cプレートであって、厚みが0.18以上0.19mm以下、曲げ弾性係数が59GPa以上63GPa以下、固有抵抗が17μΩ・m以上18μΩ・m以下の高可撓性、高電導性のC/Cプレートが提供される。 In order to achieve the above object, according to the present invention, two or more UD prepregs each having a carbon fiber aligned in a plane in one direction as an aggregate and a graphitized substance as a matrix are stacked at 2000 ° C. or higher. A heat-treated C / C plate having a thickness of 0.18 to 0.19 mm, a flexural modulus of 59 GPa to 63 GPa, and a specific resistance of 17 μΩ · m to 18 μΩ · m A highly conductive C / C plate is provided.
ここで、前記UDプリプレグの一枚の目付け重量は、90g/m2以上であることが好ましい。 Here, the weight per unit of the UD prepreg is preferably 90 g / m 2 or more.
また、前記カーボンファイバーの引張弾性率は、200GPa以上であることが好ましい。 Moreover, it is preferable that the tensile elasticity modulus of the said carbon fiber is 200 GPa or more.
さらに、前記UDプリプレグを2枚以上は、真空パック成形により重ねられることが好ましい。 Furthermore, it is preferable that two or more UD prepregs are stacked by vacuum pack molding.
本発明は以上のように構成されているので、高可撓性及び高電導性を有するC/Cプレートを提供できる。 Since this invention is comprised as mentioned above, the C / C plate which has high flexibility and high electroconductivity can be provided.
次に、実施形態について説明する。本発明のC/Cプレートを構成する基材は、カーボンファイバーが一方向に面状に引き揃えられた一方向配向材である。黒鉛化する物質としてはアミノ樹脂、フェノール樹脂、フラン樹脂、エポキシ樹脂、ポリイミド樹脂などの熱硬化性樹脂、タール、ピッチのような熱可塑性物質を用いることができる。C/Cプレートの製造方法としては、例えば前記炭素繊維を前記黒鉛化する物質の含浸、塗布などの方法によりプリプレグ化し、積層加圧成形等によって成形体とする。この成形体は2000℃以上の熱処理によって黒鉛化することによりC/Cプレートとする。 Next, an embodiment will be described. The base material constituting the C / C plate of the present invention is a unidirectionally oriented material in which carbon fibers are aligned in a plane in one direction. As the material to be graphitized, a thermosetting resin such as an amino resin, a phenol resin, a furan resin, an epoxy resin or a polyimide resin, or a thermoplastic material such as tar or pitch can be used. As a method for producing the C / C plate, for example, the carbon fiber is prepreg by a method such as impregnation and coating of the graphitizing substance, and is formed into a molded body by lamination pressure molding or the like. This compact is graphitized by a heat treatment at 2000 ° C. or higher to form a C / C plate.
本発明に用いる黒鉛化する物質として、詳細には、ゼラチン、アルブミン、セルロースなどの天然物接着剤、酢酸ビニル系、アクリル系、タール、ピッチなどの熱可塑性樹脂、アミノ樹脂、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂などの熱硬化性樹脂、ポリクロロプレン系、ニトリルゴム系などのゴム系接着剤、シアノアクリレートなどの瞬間接着剤、ポリビニルアルコール、イソブテン−無水マレイン酸重合体などの合成水溶性樹脂、合成ゴムラテックス、ポリ酢酸ビニル系、ポリ塩化ビニル系などのエマルジョン系接着剤などを単独または併用して用いることができる。 As the graphitizing substance used in the present invention, in detail, natural product adhesives such as gelatin, albumin and cellulose, vinyl acetate, acrylic, tar, pitch and other thermoplastic resins, amino resins, phenol resins, epoxy resins , Thermosetting resins such as polyimide resins, rubber adhesives such as polychloroprene and nitrile rubber, instant adhesives such as cyanoacrylate, synthetic water-soluble resins such as polyvinyl alcohol and isobutene-maleic anhydride polymer, synthesis Emulsion adhesives such as rubber latex, polyvinyl acetate, and polyvinyl chloride can be used alone or in combination.
本発明の実施形態に係るC/Cプレートは、一方向に面状に引き揃えられたカーボンファイバーを骨材とし、黒鉛化する物質をマトリックスとするUDプリプレグを2枚重ね、2000℃以上、好ましくは2200℃以上で熱処理してなるC/Cプレートであって、0.18以上0.19mm以下、曲げ弾性係数が59GPa以上63GPa以下、固有抵抗が17μΩ・m以上18μΩ・m以下のもので、高可撓性及び高電導性を有するものである。 The C / C plate according to the embodiment of the present invention is composed of two UD prepregs, each of which has a carbon fiber aligned in a plane in one direction as an aggregate and a graphitized substance as a matrix. is a C / C plates made of heat-treated at 2200 ° C. or more, 0.18 or more 0.19 mm or less, flexural modulus 63 GPa and not more than 59GPa, resistivity or 17μΩ · m 18 μΩ · m or less of It has high flexibility and high electrical conductivity.
前記UDプリプレグの一枚の目付け重量は、90g/m2以上であることが好ましい。90g/m2未満では、一枚あたりの厚みが薄くなるため、製造が困難となるためである。 The basis weight of one UD prepreg is preferably 90 g / m 2 or more. This is because if the thickness is less than 90 g / m 2 , the thickness per sheet becomes thin, making the production difficult.
前記カーボンファイバーの引張弾性率は、200GPa以上であることが好ましい。カーボンファイバーの電気抵抗は引張弾性率の上昇とともに低下することが知られており、本発明においては、高電導性であることが必要であるため、カーボンファイバーの電気抵抗が低い方がよいからである。カーボンファイバーの引張弾性率が200GPa未満では、カーボンファイバーの電気抵抗が高いため、C/Cプレートの固有抵抗が高くなり好ましくない。 The carbon fiber preferably has a tensile modulus of 200 GPa or more. It is known that the electrical resistance of carbon fibers decreases with an increase in tensile elastic modulus, and in the present invention, it is necessary to have high electrical conductivity. is there. When the tensile elastic modulus of the carbon fiber is less than 200 GPa, the electric resistance of the carbon fiber is high, so that the specific resistance of the C / C plate is high, which is not preferable.
前記2枚のUDプリプレグは、真空バッグ成形により重ねられるものであることが好ましい。真空バッグ成形によれば、重ねられたUDプリプレグを均一に押圧することができ、どの部位においても略均一に変位させたC/Cプレートを成形できる。
なお、UDプリプレグは、2枚に限られず、3枚以上重ねられて、C/Cプレートを形成するものであってもよい。
The two UD prepregs are preferably stacked by vacuum bag molding. According to the vacuum bag forming, the stacked UD prepregs can be pressed uniformly, and a C / C plate displaced substantially uniformly at any part can be formed.
Note that the UD prepreg is not limited to two sheets, and three or more UD prepregs may be stacked to form a C / C plate.
上記構成により、高可撓性及び高電導性のC/Cプレートを提供できる。 With the above configuration, a highly flexible and highly conductive C / C plate can be provided.
以下、本発明を実施例によって具体的に説明するが、本発明はこれら実施例にのみ限定されるものではない。 EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited only to these Examples.
エポキシ樹脂を添着させたUDプリプレグ(カーボンファイバーの引張弾性率230GPa、目付け重量100g/m2)2枚を重ねて真空バッグ成形し、カーボンファイバーが一方向に面状に引き揃えられた一方向配向材の成形体を作製した。さらに、2200℃で熱処理し、黒鉛化させ、C/Cプレートを得た。
熱処理後、幅5mm、長さ(繊維方向)60mmの試験片に加工し、これを実施例1の試料とした。以下の実施例及び比較例においても試験片の大きさは同様である。
Unidirectional orientation in which two UD prepregs (carbon fiber tensile elastic modulus 230 GPa, weight per unit weight 100 g / m 2 ) coated with epoxy resin are stacked in a vacuum bag, and the carbon fibers are aligned in a plane. A molded body of the material was produced. Furthermore, it heat-processed at 2200 degreeC and graphitized, and the C / C plate was obtained.
After the heat treatment, it was processed into a test piece having a width of 5 mm and a length (fiber direction) of 60 mm, and this was used as a sample of Example 1. The size of the test piece is the same in the following examples and comparative examples.
熱処理温度を2000℃とした以外は、実施例1と同様の方法でC/Cプレートを作製した。これを実施例1と同様の試験片に加工し、実施例2の試料とした。 A C / C plate was produced in the same manner as in Example 1 except that the heat treatment temperature was 2000 ° C. This was processed into the same test piece as in Example 1 to obtain a sample of Example 2.
熱処理温度を1000℃とした以外は、実施例1と同様の方法でC/Cプレートを作製した。これを実施例1と同様の試験片に加工し、比較例1の試料とした。 A C / C plate was produced in the same manner as in Example 1 except that the heat treatment temperature was 1000 ° C. This was processed into a test piece similar to that of Example 1 to obtain a sample of Comparative Example 1.
エポキシ樹脂を添着させたUDプリプレグ(カーボンファイバーの引張弾性率230GPa、目付け重量150g/m2)を用いた以外は、実施例2と同様の方法でC/Cプレートを作製した。これを実施例1と同様の試験片に加工し、比較例2の試料とした。 A C / C plate was produced in the same manner as in Example 2, except that a UD prepreg (carbon fiber tensile elastic modulus 230 GPa, basis weight 150 g / m 2 ) to which an epoxy resin was attached was used. This was processed into a test piece similar to that of Example 1 to obtain a sample of Comparative Example 2.
エポキシ樹脂を添着させたUDプリプレグ(カーボンファイバーの引張弾性率380GPa、目付け重量90g/m2)を用いた以外は、実施例1と同様の方法でC/Cプレートを作製した。これを実施例1と同様の試験片に加工し、比較例3の試料とした。 A C / C plate was produced in the same manner as in Example 1, except that a UD prepreg (carbon fiber tensile elastic modulus 380 GPa, weight per unit area 90 g / m 2 ) to which an epoxy resin was attached was used. This was processed into the same test piece as in Example 1 to obtain a sample of Comparative Example 3.
エポキシ樹脂を添着させたUDプリプレグ(カーボンファイバーの引張弾性率55GPa、目付け重量100g/m2)を用いた以外は、実施例1と同様の方法でC/Cプレートを作製した。これを実施例1と同様の試験片に加工し、比較例4の試料とした。 A C / C plate was produced in the same manner as in Example 1, except that a UD prepreg (carbon fiber tensile elastic modulus 55 GPa, basis weight 100 g / m 2 ) impregnated with an epoxy resin was used. This was processed into the same test piece as in Example 1 to obtain a sample of Comparative Example 4.
UDプリプレグを一枚とした以外は、実施例1と同様の方法でC/Cプレートを作製した。これを実施例1と同様の試験片に加工し、比較例5の試料とした。 A C / C plate was produced in the same manner as in Example 1 except that only one UD prepreg was used. This was processed into the same test piece as in Example 1 to obtain a sample of Comparative Example 5.
上記実施例1、2及び比較例1〜5について、厚み、曲げ弾性係数、固有抵抗の測定及びC/Cプレート表面外観の評価を行った。なお、曲げ弾性係数は、45mm支点から突き出した試験片の先端に10gのおもりを吊り下げ、そのときの撓み量より算出した。また、固有抵抗の測定は、電圧降下法によって行った。これらの測定結果を表1に示す。 About the said Examples 1, 2 and Comparative Examples 1-5, the measurement of thickness, a bending elastic modulus, a specific resistance, and evaluation of the C / C plate surface appearance were performed. The bending elastic modulus was calculated from the amount of deflection at that time when a 10 g weight was suspended from the tip of a test piece protruding from a 45 mm fulcrum. The specific resistance was measured by the voltage drop method. These measurement results are shown in Table 1.
表1より、実施例1、2の試料は、可撓性及び高電導性の両方の機能を高い値で実現できることがわかる。これに対し、比較例1の試料は固有抵抗値が高く電導性に劣り、比較例2の試料は厚みが厚く可撓性に欠け、比較例3の試料は曲げ弾性係数が大きく可撓性に欠け、比較例4の試料は固有抵抗値が高く電導性に劣るものであることがわかる。比較例5の試料に至っては、熱処理時に繊維方向に沿って割れが発生し、曲げ弾性係数及び固有抵抗を測定することができなかった。 From Table 1, it can be seen that the samples of Examples 1 and 2 can realize both functions of flexibility and high conductivity at high values. In contrast, the sample of Comparative Example 1 has a high specific resistance value and poor conductivity, the sample of Comparative Example 2 is thick and lacks flexibility, and the sample of Comparative Example 3 has a large flexural modulus and flexibility. It can be seen that the sample of chipping and comparative example 4 has a high specific resistance value and poor conductivity. In the sample of Comparative Example 5, cracks occurred along the fiber direction during the heat treatment, and the flexural modulus and specific resistance could not be measured.
このように本実施例により、可撓性及び高電導性を有するC/Cプレートを提供できることが確認できた。 Thus, according to this example, it was confirmed that a C / C plate having flexibility and high conductivity could be provided.
このC/Cプレートは、線材、帯状製品の走行体の通電加熱装置に利用できる。この通電加熱装置は、走行体の上流と下流とに、この線材に接して回転する低温側電極輪と高温側電極輪とを配置し、低温側電極輪から走行体、走行体から高温側電極輪へと通電することにより、線材並びに帯状製品を通電過熱するものである。具体的な利用の仕方は、回転可能且つ集電可能なホイールの外周に、上記実施形態のC/Cプレートを間隔を隔てて植生したものを上記通電加熱装置の電極輪とするものである。これらのC/Cプレートが走行体に接触すると、C/Cプレートは高可撓性及び高電導性であることから、走行体の走行方向に屈曲自在となって、電流密度を増大させることができる。また、多数のC/Cプレートが走行体に接触しているため、走行体に接触しているC/Cプレートの数が確保され、スパークの発生も抑制される。
This C / C plate can be used for an electric heating device for a traveling body of a wire or a strip product. In this energization heating device, a low temperature side electrode wheel and a high temperature side electrode wheel that rotate in contact with the wire are arranged upstream and downstream of the traveling body, the traveling body from the low temperature side electrode wheel, and the high temperature side electrode from the traveling body. By energizing the ring, the wire rod and the strip-shaped product are energized and overheated. Specifically, the electrode wheel of the energization heating device is formed by vegetating the C / C plate of the above-described embodiment at an interval on the outer periphery of a rotatable and current collecting wheel. When these C / C plates come into contact with the traveling body, the C / C plates are highly flexible and highly conductive, so that they can be bent in the traveling direction of the traveling body and increase the current density. it can. Moreover, since many C / C plates are contacting the traveling body, the number of C / C plates which are contacting the traveling body is ensured, and generation | occurrence | production of a spark is also suppressed.
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| JP2003398526A JP3961475B2 (en) | 2003-11-28 | 2003-11-28 | C / C composite plate |
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| JP2003398526A JP3961475B2 (en) | 2003-11-28 | 2003-11-28 | C / C composite plate |
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| JP2005154231A JP2005154231A (en) | 2005-06-16 |
| JP3961475B2 true JP3961475B2 (en) | 2007-08-22 |
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