JP3965148B2 - Printed wiring board for mounting electronic components, method for manufacturing the same, and semiconductor device - Google Patents

Description

  The present invention provides an electronic component mounting printed wiring board (for example, TAB (Tape Automated Bonding) that can mount a semiconductor chip such as an IC or LSI and a passive component such as a capacitor or a register on both sides of one printed wiring board. ) Tape, COF (Chip On Film), CSP (Chip Size Package), BGA (Ball Grid Array) film carrier tape for mounting electronic components, FPC (Flexible Printed Circuit) and PWB (Printed) using rigid substrates Wiring Board) and the like, a manufacturing method thereof, and a semiconductor device formed using the printed wiring board for mounting electronic components.

  Various printed wiring boards are used when electronic parts are mounted for personal computers, mobile phone liquid crystal devices, printers, and the like. These printed wiring boards form a conductive metal layer on at least one surface of a flexible insulating film such as a polyimide film or a glass epoxy, and then a photosensitive resin is formed on the conductive metal layer. The photosensitive resin is applied to form a desired pattern, and the conductive metal layer is etched using the photosensitive resin as a masking material to form a wiring pattern made of a conductive metal. Then, a solder resist is applied and cured on the wiring pattern, leaving a terminal (inner lead) part in contact with the electronic component to be mounted and a terminal (outer lead) part for connecting to the terminal, and connecting to the outside, It is manufactured by plating the inner lead and the outer lead with tin or the like.

  The bump electrode formed on the semiconductor chip is placed in contact with the inner lead of the printed wiring board for mounting electronic components manufactured in this way, and the bump electrode and the inner lead are electrically connected using a bonding tool or the like. By doing so, an electronic component is mounted on the printed wiring board.

  Recently, a semiconductor device in which a passive component such as a capacitor or a register is mounted on a printed wiring board together with a semiconductor chip such as an IC or LSI on the printed wiring board is used (for example, see Patent Document 1). reference).

As electronic devices become smaller and lighter, there is a need to improve the mounting density of electronic components. However, in such a semiconductor device, wiring between mounting components crosses when trying to increase the mounting density. Cannot connect. In order to solve such problems, for example, both sides of a so-called two-metal TAB tape, two-metal FPC, in which wiring patterns are formed on both sides of an insulating film, and the patterns on both sides are connected through vias to form a three-dimensional intersection. A printed wiring board is used.
JP 2003-124601 A

  However, in the double-sided printed wiring board, the cost increases because the wiring pattern is formed on each side in the manufacturing process. For this reason, the wiring pattern is formed only on one side of the insulating film, and for mounting parts where the crossing of connections is inevitable, the mounting density is increased by mounting on the surface opposite to the surface on which the wiring pattern is formed through vias. The method can be considered.

However, in an etching process for forming a wiring pattern, or in a plating process such as tin plating or gold plating, an etching solution, a plating solution, or a cleaning solution thereof enters the gap between the filled via and the insulating film. If an acidic plating solution or the like exudes from the gap or heat is applied during bonding of a semiconductor chip, the residual solution vaporizes and expands, resulting in a small explosion.

  The present invention has been made in order to solve the problems in the prior art described above, and a wiring pattern is formed on one side of an insulating film, and a surface opposite to the surface on which the wiring pattern is formed through filled vias. In addition, when obtaining a printed wiring board for mounting electronic components on which electronic components can be mounted, a printed wiring board for mounting electronic components in which a wet processing solution such as an etching solution or a plating solution does not enter the gap between the filled via and the insulating film, and An object of the present invention is to provide a manufacturing method thereof and a semiconductor device formed using the printed wiring board.

In order to achieve the above-described object, the printed wiring board for mounting an electronic component of the present invention is
A printed wiring board for mounting electronic components in which a wiring pattern made of a conductive metal is formed on one side of an insulating film,
At least the printed wiring board for mounting electronic components is
An insulating film;
A wiring pattern provided on one side of the insulating film;
Filled vias in which one exposed end portion is connected to the wiring pattern by filling a conductive material for implant into a hole penetrating the film and the wiring pattern;
A terminal plating layer provided at the center of the other exposed end of the filled via, after covering the boundary between the filled via and the insulating film in advance with a plating resist on the other exposed end of the filled via,
It is characterized by comprising. The terminal plating layer may be formed on a surface of a covering plating layer formed at a central portion of the exposed end portion of the filled via.

  The printed wiring board for mounting electronic parts according to the present invention is characterized in that a covering plating layer is formed on the exposed end portion of the filled via on the wiring pattern side so as to cover at least the boundary between the filled via and the wiring pattern.

  A semiconductor device according to the present invention is formed using the printed wiring board for mounting electronic components described above. In this semiconductor device, the semiconductor chip and / or the passive component can be mounted on the surface opposite to the surface on which the wiring pattern is formed.

  In the semiconductor device of the present invention, at the end of the filled via to which the semiconductor chip and / or the passive component is bonded, the outer peripheral side of the central portion where the terminal plating layer is formed has at least the boundary between the filled via and the insulating film. It is characterized by being covered with solder so as to cover.

The method for manufacturing a printed wiring board for mounting electronic components of the present invention is a method for manufacturing a printed wiring board for mounting electronic components in which a wiring pattern made of a conductive metal is formed on one side of an insulating film,
Drilling an insulating film and a wiring pattern or a conductive metal layer for forming the wiring pattern and filling a conductive material for implant to form a filled via; and
Forming a plating resist at least at the boundary between the filled via and the insulating film at the exposed end of the filled via opposite to the side on which the wiring pattern or conductive metal layer is formed;
Performing terminal plating on the exposed end of the filled via in which the plating resist is formed;
And a step of removing the plating resist.

  In the method for manufacturing a printed wiring board for mounting electronic components according to the present invention, the exposed end of the filled via on the wiring pattern side or the conductive metal layer side covers at least the boundary between the filled via and the wiring pattern or the conductive metal layer. It is characterized by performing.

  The printed wiring board for mounting electronic components according to the present invention can prevent wet processing liquid such as etching liquid and plating liquid and cleaning water thereof from entering the gap between the filled via and the insulating film, so that the quality is good. A semiconductor device can be obtained with high yield.

  The semiconductor device of the present invention has a wiring pattern formed only on one side and can mount electronic components on both sides, so that it can be manufactured at low cost and has a high mounting density. In addition, the peripheral portion of the exposed end portion of the filled via connected to the semiconductor chip and the insulating film are covered with solder so that the implant material is reinforced so as not to be extracted from the via.

  According to the method for manufacturing a printed wiring board for mounting electronic parts of the present invention, it is possible to prevent wet processing liquids such as an etching liquid and a plating liquid and their cleaning water from entering the gap between the filled via and the insulating film. .

  Hereinafter, the present invention will be described in detail with reference to the drawings. The printed wiring board for mounting electronic components obtained by the method of the present invention is for mounting electronic components such as TAB (Tape Automated Bonding) tape, COF (Chip On Film), CSP (Chip Size Package), BGA (Ball Grid Array), etc. Including film carrier tape, FPC (Flexible Printed Circuit) and PWB (Printed Wiring Board) using rigid board, mainly on one printed wiring board, IC, LSI and other semiconductor chips as well as capacitors and registers For mounting passive components, etc., multiple wiring patterns made of conductive metal are formed on one side of a long, sheet, or plate-like insulating film in the longitudinal direction or width direction of the insulating film. Has been.

  FIG. 1 is a sectional view showing a part of a printed wiring board for mounting electronic components according to the present invention. As described above, the wiring pattern 3 is formed on one surface of the insulating film 2 on which a semiconductor chip, a passive component, and the like are mounted. A filled via 4 in which a hole penetrating the insulating film 2 and the wiring pattern 3 is filled with a conductive material for implant is formed at a predetermined position of the printed wiring board 1 for mounting electronic components, and the wiring pattern 3 is formed through the filled via 4. Electronic components are also mounted on the opposite side of the surface. Reference numeral 6 denotes a covering plating layer plated with a conductive metal so as to cover at least the boundary between the filled via 4 and the wiring pattern 3, and 8 denotes a solder resist layer.

  One exposed end of the filled via 4 is electrically connected to the wiring pattern 3. A terminal plating layer 5 on which terminal plating such as tin plating is performed is formed at the center of the other exposed end portion. A terminal such as a semiconductor chip is connected to this portion.

  Since the insulating film 2 used in the present invention is in contact with an acid or the like during etching, it has chemical resistance that is not affected by such chemicals and heat resistance that does not change due to heating during bonding. It is desirable that Examples of the material forming the insulating film 2 include glass epoxy, bismaleimide-triazine, polyester, liquid crystal polymer, polyamide, and polyimide. In particular, in the present invention, it is preferable to use a flexible film made of polyimide.

  Examples of this polyimide resin include wholly aromatic polyimide synthesized from pyromellitic dianhydride and aromatic diamine, and wholly aromatic having biphenyl skeleton synthesized from biphenyltetracarboxylic dianhydride and aromatic diamine. Group polyimide can be mentioned. The thickness of the insulating film 2 usable in the present invention is usually 12.5 to 125 μm, preferably 25 to 75 μm.

  In such an insulating film 2, in the case of a film carrier tape, necessary through holes such as sprocket holes and slits can be formed by a punching device or the like.

  The wiring pattern 3 is formed by applying a photosensitive resin to a conductive metal layer laminated on one surface of the insulating film 2 and exposing the photosensitive resin to form a desired pattern. The masking material is formed by etching the conductive metal layer. The masking material is removed by alkali cleaning or the like. A pattern can also be formed by a semi-additive method or the like. Such wiring pattern formation may be performed before implanting a conductive metal into the via, or may be performed after forming a plating resist to be described later and performing plating.

  The wiring pattern 3 is made of a conductive metal, and examples thereof include copper and aluminum. The conductive metal layer may be formed by, for example, depositing an electrolytic copper foil or a rolled copper foil, or forming a metal vapor deposition layer on the surface of a roughened insulating film by sputtering or the like, and then performing copper plating by electrolytic copper plating or the like. Can be obtained by thickening. After the wiring pattern is formed, electroless tin plating may be applied to the front surface of the wiring pattern for the purpose of preventing oxidation of the conductive wiring.

  The filled via 4 can be formed, for example, by pressing using a mold having an upper mold in which a punch is formed and a lower mold in which a die hole is formed at a position corresponding to the punch (Japanese Patent No. 3250988). See the specification). That is, as shown in FIG. 2, on the insulating film 2 on which the wiring pattern 3 is formed (or a laminate before forming a pattern in which the conductive metal layer is laminated on the insulating film 2), copper A conductive metal sheet 11 made of a conductive material for implants such as is superposed and supplied to the lower mold 12 (FIG. 2A), and then the upper mold 13 is lowered and the conductive metal sheet 11 and the insulating film are punched by the punch 13a. 2 is punched out (FIG. 2B).

  At this time, the stroke of the upper mold 13 is controlled so that the lower end of the punch 13 a is lowered until it substantially coincides with the lower surface of the conductive metal sheet 11, and is not further lowered and penetrates only the conductive sheet 11. As a result, the insulating film 2 is punched out by a small piece of the conductive sheet 11 pushed downward by the punch 13a, and a punched hole is formed. At the same time, the small piece is positioned in the punched hole, and the filled via 4 is formed. Next, the upper mold 13 is raised and the conductive metal sheet 11 is removed. The insulating film 2 and the wiring pattern 3 (conductive metal layer) are punched in advance, and then the conductive sheet 11 is overlaid, and a small piece of the conductive sheet 11 is punched and filled in the vacant via. You can also.

  The filled via 4 is formed by punching the insulating film 2 with a mold as described above to form a through hole, and then conductively by screen printing using a metal mask having an opening corresponding to the through hole and a squeegee. It can also be formed by pushing the paste into the through hole. It can also be formed by penetrating the insulating film 2 with a conical protrusion formed on the copper foil surface.

  The width of the filled via 4 in the cross-sectional direction is usually 20 to 2000 μm, preferably 70 to 1000 μm, and more preferably 80 to 200 μm. Moreover, the horizontal cross-sectional shape of the filled via is arbitrary, and may be any of a square shape such as a circle, an ellipse, a square, and a hexagon.

The exposed end of the filled via opposite to the side on which the wiring pattern or conductive metal layer is formed is subjected to terminal plating such as tin plating or gold plating. In order to prevent a plating solution such as a solution from entering the gap between the filled via and the insulating film or other acidic wet processing solution such as an etching solution, as shown in FIGS. A plating resist 7 is formed at the boundary between 4 and the insulating film 2.

  The plating resist 7 is applied at a predetermined position by a method such as screen printing, and at least the boundary between the filled via 4 and the insulating film 2 in order to prevent the plating solution from entering the gap between the filled via 4 and the insulating film 2. And is formed in an arbitrary shape so as to leave a part of the end surface of the filled via 4 for terminal plating. Usually, it is formed so that the end of a filled via for terminal plating is exposed inside surrounded by the plating resist 7. For example, when the filled via 4 has a circular cross section, the plating resist 7 is formed in a donut shape.

  As the plating resist, for example, various commercially available resists that can be screen-printed can be used, but it is necessary to select an acid wet processing solution such as a plating solution or an etching solution and a solution that does not dissolve during treatment with cleaning water. There is. The plating resist is removed after the wet process is completed, for example, after terminal plating.

  The covering plating layer 6 is formed by forming a conductive metal of the same type as the wiring pattern 3, such as copper, on the wiring pattern 3 or on the surface of the conductive metal layer by electrolytic plating or electroless plating. The boundary with the pattern 3 or the conductive metal layer is surely sealed. The thickness of the overlay plating layer 6 is usually 0.1 to 20 μm, preferably 1 to 6 μm. In order to make the thickness of the covered plating layer 6 uniform, a manufacturing method of a procedure of forming the wiring pattern 3 after forming the covered plating layer 6 is preferable.

  Hereinafter, an example of a method for manufacturing an electronic component mounting wiring board according to the present invention will be described in the order of steps. First, by the method described above, the insulating film 2 and the conductive metal layer 3 ′ for forming the wiring pattern 3 are formed by etching and filled with the implant conductive material to form the filled via 4 (FIG. 3). ). At this time, when the filled via 4 is formed by the method using the conductive metal sheet 11 shown in FIG. 2, as shown in FIG. 6A, punching is performed at positions corresponding to the plurality of filled vias formed. The caulking punch 14 provided with is driven into the end portion of the filled via 4 on the side of the conductive metal layer 3 ′ to spread the end portion outward, or as shown in FIG. The conductive material for implant slightly protruding from the through hole is caulked to form the caulking portion 15 at the end portion, thereby ensuring the connection between the filled via 4 and the conductive metal layer 3 ′ and tin plating at the boundary between them. It is preferable to prevent wet processing liquids such as liquid and gold plating liquid from entering.

  Next, as shown in FIG. 3, a metal mask having a hole formed at a position corresponding to the filled via 4 is disposed above the insulating film, and a squeegee is moved over the metal mask so that the resist coating solution is placed on the filled via 4. The end of the filled via 4 opposite to the side where the conductive metal layer 3 ′ is formed is covered with a terminal plating so as to cover the boundary between the filled via 4 and the insulating film 2. A plating resist 7 is formed so that the end of the filled via is exposed.

  After forming the plating resist 7, the surface of the conductive metal layer 3 ′ is subjected to electrolytic copper plating or electroless copper plating to form a covering plating layer 6. At this time, copper is also plated on the exposed end portion of the filled material on the side opposite to the wiring pattern surface. Next, a wiring pattern is formed from the conductive metal layer 3 ′ by photolithography, and tin plating is performed on the entire surface of the wiring pattern by electroless tin plating as necessary.

In general, before the terminal plating process, a solder resist is applied and cured except for the terminal portion in order to protect the wiring pattern. FIG. 4 shows a state in which the covering plating layer 6 is formed on the wiring pattern 3 and the solder resist layer 8 is formed thereon.

  Next, as shown in FIG. 5, the covering plating layer on the end surface of the filled via 4 exposed inside the predetermined position not covered with the solder resist layer 8 on the wiring pattern 3 and surrounded by the plating resist 7. A terminal plating layer 5 such as tin plating is formed on 6 for the purpose of providing a stable bonding property by, for example, forming a eutectic between the lead portion and a terminal such as a semiconductor chip.

  The terminal plating layer 5 formed here can be variously selected so as to correspond to the subsequent bonding process. For example, examples of plating that can be formed here include tin plating, gold plating, lead-free solder plating, nickel plating, and composite plating layers thereof. For the plating treatment, either electrolytic plating or electroless plating may be selected depending on the conditions. The thickness of the plating layer formed here is usually 0.1 to 10 μm, preferably 0.2 to 7 μm. If necessary, gold bumps may be formed on the surface of the tin plating layer.

  After the terminal plating layer 5 is formed, the plating resist 7 is removed by alkali cleaning or the like, whereby the printed wiring board for mounting electronic components of the present invention is manufactured. Next, the semiconductor chip and the passive component are mounted on the wiring pattern 3 and mounted on the surface opposite to the surface on which the wiring pattern 3 is formed by connecting the terminals of the semiconductor chip and the passive component to the plating portion. A semiconductor device is manufactured.

  As shown in FIG. 7, at the end of the filled via 4 to which the semiconductor chip 9 is bonded, the outer peripheral side of the central portion where the terminal plating layer 5 is formed covers at least the boundary between the filled via 4 and the insulating film 2. Thus, by covering with solder 10, preferably lead-free solder, the implant material can be reinforced so as not to be extracted from the via.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples.

  A two-layer type COF base material in which a Ni alloy seed layer is formed on a 38 μm thick polyimide film by sputtering and copper of 8 μm thickness is laminated thereon by plating is used with the mold shown in FIG. Then, filled vias (cross-sectional width 200 μm) were formed at 50 locations so that one end portion was connected to the copper layer on the polyimide film surface using the copper sheet as the implant conductive material.

  Using a thermal drying type plating resist (trade name, MA-830, manufactured by Taiyo Ink Manufacturing Co., Ltd.) as a resist, the boundary with the surrounding polyimide film on the filled via on the side opposite to the wiring pattern surface side by screen printing. A coating resist was formed so as to seal the gap between the filled via and the polyimide film and dried. Next, copper plating is applied to the entire surface of the conductive metal layer (copper layer) embedded with the implant material so as to cover the boundary between the filled via and the wiring pattern by electrolytic copper plating, and at the same time, a plating resist on the opposite surface A copper plating was applied to the end surface of the filled via exposed inside.

  Next, a photoresist was applied onto the copper-plated conductive metal layer, dried, exposed and developed with a photomask having a pattern formed thereon, and then etched using an acidic copper chloride aqueous solution to form a wiring pattern.

  After the solder resist is applied and cured in the region excluding the terminal portion of the obtained wiring pattern, the terminal portion and the plating on the wiring pattern are plated by an electroless plating bath containing tin borofluoride, alkanesulfonic acid, hypophosphorous acid, etc. Tin plating was performed on the surface of the copper plating covered at the end of the inner filled via surrounded by the resist. Next, the plating resist around the formed tin plating was removed.

  The film carrier tape for mounting electronic parts manufactured in this way was left for 5 days at room temperature in a state of being wound on a reel, and then the appearance of the terminal portion opposite to the wiring pattern forming surface was inspected. No abnormalities were detected. Thereafter, 100 pieces of the film carrier were cut out from the film carrier tape and placed on a hot plate heated to 300 ° C. for 10 seconds, but no abnormality was detected in particular for these film carriers.

  Capacitors and resistors are mounted on the side of the film carrier thus formed on which the wiring pattern is formed, and IC chip bumps are connected to the filled vias on the side opposite to the plated tin. The semiconductor device was manufactured by resin sealing.

  Photoresist is applied onto a substrate film in which a 12 μm thick electrolytic copper foil is laminated on a polyimide film with a thickness of 25 μm, dried, then exposed and developed with a photomask having a pattern formed thereon, and then an acidic copper chloride aqueous solution is used. Etching was performed to form a wiring pattern. Using the mold shown in FIG. 2, a filled via (cross-sectional width: 200 μm) was formed so that one end of the copper sheet was connected to the wiring pattern using a copper sheet as an implant conductive material.

  Using the same resist as that used in Example 1, a gap between the filled via and the polyimide film was formed on the filled via opposite to the wiring pattern surface side by a screen printing method along the boundary with the surrounding polyimide film. It apply | coated so that it might seal, and it dried and formed the plating resist. Next, copper plating was applied to the surface of the wiring pattern by electrolytic copper plating.

  Next, after applying and curing a solder resist on the region excluding the terminal portion of the wiring pattern, the inner filled via end surface surrounded by the terminal portion on the wiring pattern and the plating resist by electroless plating as in Example 1 Was tin-plated.

  The film carrier tape for mounting electronic parts manufactured in this way was left for 5 days at room temperature in a state of being wound on a reel, and then the appearance of the terminal portion opposite to the wiring pattern forming surface was inspected. No abnormalities were detected. Thereafter, 100 pieces of the film carrier were cut out from the film carrier tape and placed on a hot plate heated to 300 ° C. for 10 seconds, but no abnormality was detected in particular for these film carriers.

A capacitor and a resistor are mounted on the surface side where the wiring pattern of the film carrier manufactured in this way is formed, and a bump of the IC chip is connected to the filled via portion on which the tin plating on the opposite surface side is applied, A semiconductor device was manufactured by resin sealing.
[Comparative Example 1]
A film carrier tape for mounting electronic components was manufactured in the same manner as in Example 1 except that tin plating was performed without forming a plating resist. When 100 pieces of film carrier pieces were cut out from this film carrier tape and subjected to appearance inspection in the same manner as in Example 1, corrosion marks were observed in 4 out of 100 pieces. Subsequently, the remaining 96 pieces were sequentially placed on the hot plate in the same manner as in Example 1, and 10 pieces caused a small explosion that was considered to be a steam explosion.
[Comparative Example 2]
A film carrier tape for mounting electronic parts was manufactured in the same manner as in Example 2 except that tin plating was performed without forming a plating resist. When 100 pieces of film carrier pieces were cut out from the film carrier tape and subjected to appearance inspection in the same manner as in Example 2, corrosion marks were observed in 2 out of 100 pieces. Subsequently, the remaining 98 pieces were sequentially placed on the hot plate in the same manner as in Example 2, and 10 pieces caused a small explosion that was considered to be a steam explosion.

FIG. 1 is a sectional view showing a part of a printed wiring board for mounting electronic components according to an embodiment of the present invention. 2A and 2B are diagrams for explaining a process of forming a filled via using a mold. FIG. 2A shows a state before filling an implant conductive material with a punch, and FIG. 2B shows a state after filling. Yes. FIG. 3 is a cross-sectional view showing a state in which a plating resist is formed on the end portion of the filled via formed through the insulating film and the conductive metal layer on the insulating film side. FIG. 4 is a cross-sectional view showing a state in which a cover plating is further formed from the state of FIG. 3 and a wiring pattern is formed, and a solder resist is applied and cured. FIG. 5 is a cross-sectional view showing a state in which terminal plating is formed inside the plating resist at the end of the filled via. 6A shows a state in which a caulking punch is driven into the end of the filled via wiring pattern side, and FIG. 5B shows a caulking portion 15 formed at the end of the filled via wiring pattern side. It is the figure which showed the state. FIG. 7 is a view showing a state in which solder is coated on the end portion of the filled via to which the semiconductor chip is bonded.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed wiring board for electronic component mounting 2 Insulation film 3 Wiring pattern 3 'Conductive metal layer 4 Filled via 5 Terminal plating layer 6 Cover plating layer 7 Plating resist 8 Solder resist layer 9 Semiconductor chip 10 Solder 11 Conductive metal sheet 12 Lower mold 13 Upper mold 13a Punch 14 Caulking punch 15 Caulking part

Claims (8)

  A printed wiring board for mounting electronic components in which a wiring pattern made of a conductive metal is formed on one side of an insulating film,
  At least the printed wiring board for mounting electronic components is
  An insulating film;
  A wiring pattern provided on one side of the insulating film;
  Filled vias in which one exposed end portion is connected to the wiring pattern by filling a conductive material for implant into a hole penetrating the film and the wiring pattern;
  A terminal plating layer provided at the center of the other exposed end of the filled via, after covering the boundary between the filled via and the insulating film in advance with a plating resist on the other exposed end of the filled via,
  A printed wiring board for mounting electronic components, comprising: The terminal plating layer is
The printed wiring board for mounting electronic components according to claim 1, wherein the printed wiring board is mounted on a surface of a covering plating layer formed at a central portion of an exposed end portion of the filled via.   The printed wiring board for mounting an electronic component according to claim 2, wherein a covering plating layer is formed at an exposed end portion of the filled via on the wiring pattern side so as to cover at least a boundary between the filled via and the wiring pattern. .   A semiconductor device formed using the printed wiring board for mounting an electronic component according to claim 1. Semiconductor chips and / or passive components
The semiconductor device according to claim 4, wherein the semiconductor device is mounted on a surface opposite to the surface on which the wiring pattern is formed. The outer peripheral side of the central portion where the terminal plating layer is formed at the end of the filled via where the semiconductor chip and / or the passive component is bonded,
6. The semiconductor device according to claim 5, wherein the semiconductor device is covered with solder so as to cover at least a boundary between the filled via and the insulating film. A method of manufacturing a printed wiring board for mounting electronic components in which a wiring pattern made of a conductive metal is formed on one side of an insulating film,
Drilling an insulating film and a wiring pattern or a conductive metal layer for forming the wiring pattern and filling a conductive material for implant to form a filled via; and
Forming a plating resist at least at the boundary between the filled via and the insulating film at the exposed end of the filled via opposite to the side on which the wiring pattern or conductive metal layer is formed;
Performing terminal plating on the exposed end of the filled via in which the plating resist is formed;
And a step of removing the plating resist. A method of manufacturing a printed wiring board for mounting electronic components. On the exposed end of the filled via on the wiring pattern side or conductive metal layer side,
8. The method of manufacturing a printed wiring board for mounting electronic components according to claim 7, wherein covering plating is performed so as to cover at least a boundary between the filled via and the wiring pattern or the conductive metal layer.

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