JP3965735B2 - Microwave equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a microwave device, and to a mounting structure of a circuit board such as an LNB (low noise frequency converter).
[0002]
[Prior art]
Microwave devices such as LNB include, for example, signal amplification circuits such as 12 GHz band, high frequency circuit sections (RF blocks) such as filters and mixers, and intermediate frequency circuits such as down-converted 1 GHz band signal amplification circuits and power supply circuits. When these are arranged on a single substrate, the substrate material should be a ceramic substrate having a low high-frequency loss so as not to impair the performance of the high-frequency circuit unit. There is a problem that it is necessary and costs increase, and the ceramic substrate is hard and brittle, so it is easy to break with screws, it must be fixed to the housing with a conductive adhesive, and it is difficult to mount a large substrate There is a problem. In order to deal with this problem, the high frequency circuit section and the intermediate frequency circuit section are divided into a high frequency circuit section using a ceramic substrate, etc., and a large area intermediate frequency circuit section using a glass resin substrate, etc. However, there is a problem that a connector or a wire is required for connection between the two substrates, and the assembly work becomes complicated.
[0003]
[Problems to be solved by the invention]
In view of these points, the present invention is to arrange a plurality of substrates made of different materials side by side and perform circuit connection without using a connector or a wire so that the assembly can be easily and inexpensively configured. With the goal.
[0004]
[Means for Solving the Problems]
To achieve the above object, a micro NamiSo location of the present invention, there is provided a microwave apparatus comprising a first circuit board and a second circuit board disposed on the chassis and the chassis, the first circuit board The second circuit board is provided at a step portion provided on the bottom surface of the chassis, and the second circuit board includes a protrusion formed to overlap the first circuit board, and a lower surface of the protrusion is formed on the first circuit board. It is arrange | positioned at the bottom face of the said chassis so that an upper surface may be touched, and it comprises so that the conductor provided in the said protrusion part and the conductor provided in the upper surface of the said 1st circuit board may be connected.
[0005]
In addition, a conductor portion connected to the conductor on the upper surface is formed on the end surface of the protruding portion of the second circuit board, and the conductor portion is connected to the conductor provided on the upper surface of the first circuit board.
[0006]
The conductor portion is formed by subjecting the end surface of the projecting portion of the second circuit board formed of a double-sided conductor substrate to conductor plating over the upper conductor and the lower conductor.
[0007]
Further, the second circuit board is constituted by a double-sided conductor board, a through hole is formed in the conductor provided in the protruding portion, and the conductor provided in the protruding portion via the through hole and the upper surface of the first circuit board It connects so that the conductor provided in may be connected.
[0008]
[0009]
[0010]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the invention will be described based on examples with reference to the drawings. 1A and 1B are configuration diagrams of a main part of an embodiment of a microwave device according to the present invention. FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along the line AA 'in FIG. In the figure, 1 is an LNB chassis, 2 is a partition wall, 3 is a notch, 4 and 5 are substrates, and the substrate 4 is a substrate for a high-frequency circuit such as a signal amplifying circuit such as a 12 GHz band, a filter and a mixer (first in the circuit board), using less ceramic substrate or the like having a high-frequency loss, is formed in a minimum size. The substrate 5 is a substrate (second circuit substrate) of an intermediate frequency circuit unit including a down-converted 1 GHz band signal amplifier circuit and a power supply circuit, and a glass resin substrate or the like is used. Reference numeral 6 denotes a protruding portion of the substrate 5, and reference numeral 7 denotes a shield case. The chassis 1 is formed in a box shape by die-casting such as aluminum, and the interior is divided into two chambers by a partition wall 2, and a substrate 4 is disposed on one side and a substrate 5 is disposed on the other side. A connecting portion with the substrate 4 is led out to the protruding portion 6 of the substrate 5, and the protruding portion 6 is overlaid on the substrate 4. For this purpose, the partition wall 2 is provided with a cutout portion 3 for allowing the protruding portion 6 of the substrate 5 to pass therethrough, and a stepped portion is provided on the bottom surface of the chassis 1 as shown in FIG. The height is in contact with the upper surface of the substrate 4. Since the substrate 4 and the substrate 5 are partitioned by the partition wall 2 and the upper case opening of the chassis 1 is covered with a shield case 7 and screwed, the substrate 4 and the substrate 5 are electromagnetically almost completely shielded, and the high frequency circuit The local oscillation wave or the like of the part hardly penetrates into the intermediate frequency circuit part.
[0011]
Then, as shown in FIG. 2, the conductor 12 on the upper surface of the protruding portion 6 of the substrate 5 and the conductor 11 on the upper surface of the substrate 4 are soldered (13) to make circuit connection. In order to ensure this soldering, for example, as shown in FIG. 3, the substrate 5 is composed of a double-sided conductor substrate, conductor plating is applied to the end surface of the protruding portion 6 to form the conductor portion 21, This conductor portion 21 is soldered (22) to the conductor 11 on the upper surface of the substrate 4. Alternatively, as shown in FIG. 4, drilled a small hole in the protruding portion 6, it forms a Suruho Le 3 1 into the hole, so as to soldered to the substrate 4 by pouring solder into the hole (32) .
[0012]
Since the substrate 4 is equipped with a high frequency circuit portion, a ceramic substrate with low high frequency loss is used, and the ceramic substrate is hard and brittle and is easily broken by screwing, so that it is fixed to the chassis 1 using a conductive adhesive. On the other hand, since the intermediate frequency circuit portion mounted on the substrate 5 is a glass resin substrate that is inferior in high frequency characteristics but easier to handle than a ceramic substrate, it is fixed to the chassis 1 by screwing or the like. To do.
[0013]
【The invention's effect】
As described above, according to the microwave device according to the present invention, the ceramic substrate is used only for the high frequency circuit portion, and the glass resin substrate that is easier to handle than the ceramic substrate is used for the intermediate frequency circuit portion. The area of the ceramic board that is difficult to attach to the chassis can be reduced, and the connection between the boards is done by directly soldering the conductor part of both boards, so the connection work by connectors or wires This eliminates the need for an inexpensive and workable product.
[Brief description of the drawings]
1A and 1B are configuration diagrams of a main part of an embodiment of a microwave device according to the present invention, in which FIG. 1A is a plan view and FIG.
FIG. 2 is an explanatory diagram of an example of soldering between substrates.
FIG. 3 is an explanatory diagram of another example of soldering between substrates.
FIG. 4 is an explanatory diagram of another example of soldering between substrates.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Chassis 2 Partition wall 3 Notch part 4 1st circuit board (high frequency circuit part)
5 Second circuit board (intermediate frequency circuit)
6 Protruding part 7 Shield case
11, 12 conductors
21 Conductor plating
31 Suruho Le
13, 22, 32 Soldering

Claims (4)

A microwave device comprising a chassis and a first circuit board and a second circuit board disposed in the chassis,
The first circuit board is disposed in a step provided on the bottom surface of the chassis, and the second circuit board includes a protrusion formed so as to overlap the first circuit board, and a lower surface of the protrusion is Disposed on the bottom surface of the chassis so as to be in contact with the top surface of the first circuit board;
A microwave device comprising: a conductor provided on the projecting portion and a conductor provided on an upper surface of the first circuit board. Said second circuit to form a conductor portion connected to the end face on the upper surface of the conductive protrusions of the substrate, of claim 1, wherein the conductor portions to be connected to a conductor provided on the upper surface of the first circuit board Microwave device. The conductor portion includes a microwave apparatus as claimed in claim 1, wherein comprising in those having been subjected to conductive plating spanning the second circuit upper surface to the end surface of the projecting portion of the substrate conductor and the lower surface of the conductor constituted with double-sided conductor substrate. Said second circuit board constituted by double-sided conductor substrate, wherein a scan Ruho Le is formed on the conductor provided in the projecting portion, the upper surface of the first circuit board and a conductor provided on the projecting portion via the same Suruho Le Microwave apparatus according to claim 1, wherein provided and the conductor were to be connected.

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