JP3968461B2 - Work shooter device and product processing / unloading method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a work shooter apparatus having a cutting plate for dropping small products processed by a plate material processing machine such as a laser processing machine, and a product processing / unloading method using the work shooter apparatus.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a plate processing machine, for example, a laser processing machine, is provided with a work shooter device for carrying out products as shown in FIG.
[0003]
In this work shooter apparatus, a shooter 54 that can be freely opened and closed is provided by cutting out a processing table 57 around the processing point P where the laser light L emitted from the processing head 58 irradiates the work W. ing.
[0004]
The shooter 54 is hinged to the frame 50 via a vertical movement mechanism 51, and a swing driving cylinder 53 is provided below the shooter 54.
[0005]
A cutting plate 55 is provided on the shooter 54 and immediately below the processing head 58.
[0006]
With this configuration, during laser processing, generated dust is collected through a dust collection duct 56 attached to the lower surface of the shooter 54, and a product processed from the workpiece W is a cylinder for a large product (large product). By driving 53, it is carried out to the outside through the opened shooter 54, and small products (small products) are naturally dropped from the gap of the cutting plate 55 to the accumulation box 57 and carried out.
[0007]
[Problems to be solved by the invention]
However, in the prior art described above (FIG. 9), the gap between the cutting plates 55 is fixed, so that there are the following problems with small products before, during and after processing.
[0008]
(1) Issues before processing.
Before processing, the workpiece W may bend.
[0009]
That is, there are various sizes of small products processed by the laser processing machine. In order to drop even a large size product, the gap between the cutting plates 55 should be as large as possible. preferable.
[0010]
In this case, when the workpiece W is a thick plate, even if the cutting plate 55 having a large interval is used, the workpiece W remains flat and predetermined laser processing is performed.
[0011]
However, when the workpiece W is a thin plate, if the cutting plate 55 having a large interval as described above is used, the workpiece W may be bent.
[0012]
As a result, even if laser processing is performed on the bent workpiece W, a product with poor accuracy is produced.
[0013]
That is, conventionally, since the gap of the cutting plate 55 is fixed, depending on the thickness of the workpiece W, predetermined laser processing cannot be performed, and processing becomes extremely unstable.
[0014]
(2) Issues during processing.
During processing, the cutting plate 55 may be affected by heat.
[0015]
That is, when a small product is processed using a laser processing machine, the workpiece W is heated by the heat of the laser light L emitted from the processing head 55.
[0016]
In this case, if the workpiece W is a thin plate, less heat is required for processing the workpiece W and the irradiation time of the laser beam L is short, so that there is almost no influence of the heat on the cutting plate 55. It's okay.
[0017]
However, when the workpiece W is a thick plate, a large amount of heat is required when processing a small product, and therefore the irradiation time of the laser beam L on the workpiece W also becomes long.
[0018]
Therefore, if the gap between the cutting plates 55 is small, the distance between the heating area of the workpiece W and the cutting plate 55 is close, and therefore heat from the heating area is easily applied to the cutting plate 55. May be adversely affected.
[0019]
For example, the cutting plate 55 may be burned out by being affected by the heat and damaged, so that subsequent processing cannot be performed.
[0020]
(3) Issues after processing.
[0021]
(3)-(1) The processing time for small products may become longer.
[0022]
As described above, the shooter 54 is originally opened to carry out a large product.
[0023]
However, small products that do not fall from the gaps in the cutting plate 55 are carried out with the shooter 54 opened.
[0024]
Alternatively, the small product is left jointed to the workpiece W, and after the workpiece W is unloaded via the shooter 54, the joint is cut to separate the small product.
[0025]
Therefore, in order to process small products, the opening / closing time of the shooter 54 or the time obtained by adding the joint cut time to the opening / closing time is required.
[0026]
As a result, for small products, the overall processing time becomes very long and the efficiency is clearly reduced.
[0027]
(3)-(2) The shooter 54 may perform useless opening / closing operations.
[0028]
Depending on the state of the small product after processing, it may be delicate whether it falls from the gap of the cutting plate 55 or not.
[0029]
For example, after processing, dross or the like may adhere to the small product, and the small product may be caught in the gap of the cutting plate 55 due to the dross.
[0030]
In such a case, it is often impossible to determine in advance whether or not the small product is dropped.
[0031]
Therefore, conventionally, even if a small product falls from the gap of the cutting plate 55, the shooter 54 is opened every time for safety.
[0032]
That is, as described above, although the shooter 54 is originally opened for carrying out a large product, the shooter 54 is opened each time a small product is processed, and the shooter 54 is opened after carrying out the small product. A very useless operation such as closing is performed.
[0033]
As a result, the total opening / closing time of the shooter 54 from the start to the end of the processing for one workpiece W becomes longer, and the entire processing time is increased accordingly.
[0034]
The object of the present invention is to stabilize the processing by eliminating the bending of the workpiece due to the plate thickness and reducing the influence of heat on the cutting plate in relation to the cutting plate for small products, and after the processing, By dropping the small product reliably, the processing time of the small product is shortened, and it is possible to perform unnecessary opening / closing operation of the shooter by making a judgment in the subtle case whether the small product is dropped from the gap of the cutting plate. It is to lose.
[0035]
[Means for Solving the Problems]
In order to solve the above problems, the present invention, as shown in FIGS.
In the work shooter device of plate processing machine,
The processing table 11 (FIG. 2) has a shooter 1 provided by cutting out a part thereof, and a cutting plate 4 provided on the shooter 1, and a gap D between the cutting plates 4 is made variable.In the gap between the cutting plates 4, the touch sensor 21 A , 21 B ProvidedA work shooter device, characterized by
In the product processing / unloading method using the workshooter device,
It is then determined whether the product to be processed is a large product or a small product Q (step 102 in FIG. 7). When processing a large product (step 102 in FIG. 7), the processing is performed as it is. If the small product Q is to be processed (step 102 in FIG. 7), the gap D of the cutting plate 4 is determined according to the size S and the plate thickness of the small product Q. 7 (automatic change in step 104 if NO in step 103 in FIG. 7 and manual change in parentheses in case of YES) is performed (step 105 in FIG. 7), and a large product is processed If the small product Q is processed (step 106 in FIG. 7), the large product is unloaded by opening the shooter 1 (step 109 in FIG. 7). Down arrow), the small product Q (in the parenthesis of the down arrow) Unloaded by passing through a gap distance D described above change of the cutting plate 4,Alternatively, when the small product Q is processed (down arrow in step 106 in FIG. 7), and it is determined that the processed small product is caught in the gap of the cutting plate via the touch sensor (FIG. 7). Of step 107 YES (Step 107 in FIG. 8 A of YES ⇒ Step 107 B of YES ) Open the shooter (step 109 in FIG. 7), and carry out the small product through the shooter.The technical means of product processing and unloading methods characterized by the above.
[0036]
In this case, when it is delicate whether a small product falls from the gap of the cutting plate 4, the touch sensor 21A provided on the first plate 4A and the second plate 4B constituting the cutting plate 4 (FIG. 6). 21B, and after a certain time has elapsed (YES in step 107A in FIG. 8 showing details of step 107 in FIG. 7), when the touch sensors 21A and 21B are reacting (YES in step 107B in FIG. 8). Assuming that the small product is caught in the gap between the cutting plates 4 (YES in step 107 in FIG. 7), the shooter 1 is opened (step 109 in FIG. 7) to carry out the small product.
[0037]
According to the configuration of the present invention, the gap D of the cutting plate 4 is changed in accordance with the size S of the small product and the thickness (FIG. 3) (FIGS. 4B and 4C). Therefore, it is possible to stabilize the processing by eliminating the bending of the workpiece due to the plate thickness and reducing the influence of heat on the cutting plate, and by collecting the processed small product securely, it is integrated in the integration box 9. The processing time of the small product can be shortened.
[0038]
Furthermore, as described above, since the cutting plate 4 is provided with the touch sensors 21A and 21B (FIG. 6), the small product is detected from being caught in the gap of the cutting plate 4, so that the processed small product is By making a subtle judgment as to whether or not to drop from the gap in the cutting plate, the shooter can be opened only when a small product is caught rather than every time as in the past, and unnecessary shooter opening and closing operations can be eliminated. it can.
[0039]
Therefore, according to the present invention, with respect to small products, in relation to the cutting plate, the work is stabilized by eliminating the bending of the work due to the plate thickness and reducing the influence of heat on the cutting plate. Reduces the processing time of small products by reliably dropping small products, and makes it possible to open and close the shooter unnecessarily by determining whether or not the small products will fall through the gaps in the cutting plate. Each operation can be eliminated.
[0040]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described with reference to the accompanying drawings by embodiments.
FIG. 1 is a diagram showing an embodiment of the present invention.
[0041]
The work shooter apparatus shown in FIG. 1 is used in, for example, a laser processing machine, particularly a workpiece moving type laser processing machine.
[0042]
As is well known, the laser processing machine is positioned at a processing point P by moving the workpiece W gripped by the clamp 15 on the processing table 11, and then the laser beam is transferred from the processing head 14 to the positioned workpiece W. Predetermined laser processing is performed by irradiating the light L.
[0043]
In this case, as shown in FIG. 2, a shooter 1 is provided by cutting out the periphery of the processing point P, which is a part of the processing table 11. A cutting plate 4 is provided.
[0044]
The shooter 1 is normally opened (step 109 in FIG. 7) when the workpiece W is processed from the workpiece W (step 109 in FIG. 7), and the large product passes through the shooter 1. Are carried out (in parentheses at step 109 in FIG. 7).
[0045]
However, when the shooter 1 is a small product processed from the workpiece W (down arrow in step 106 in FIG. 7), the small product is also caught in the gap of the cutting plate 4 (FIG. 7). (Step 107 in FIG. 7) is opened (Step 109 in FIG. 7), and the small product is carried out through the shooter 1 (in parentheses in FIG. 7).
[0046]
The shooter 1 has a free bear or the like embedded in the upper surface thereof to make the work W easy to slide, and is hinged to the frame 10 (FIG. 1) via a vertical movement mechanism including a ball spline 12 and a spring 13. .
[0047]
A driving cylinder 5 is hinged to the lower front part of the shooter 1, and the cylinder 5 is hinged to an accumulation box 9 described later.
[0048]
With this configuration, the shooter 1 is supported in parallel with the pass line PL during processing (FIG. 1).
[0049]
However, after processing the shooter 1, as described above, when carrying out large products and small products, when the driving cylinder 5 is operated, the vertical movement mechanism comprising the ball spline 12 and the spring 13 described above is used. Once it is sunk horizontally, it is tilted by rotating and opening about a fulcrum G by a predetermined angle θ.
[0050]
As a result, the large product and the small product descend while sliding on the inclined shooter 1 and are carried out via, for example, an external belt conveyor (not shown).
[0051]
The shooter 1 (FIG. 1) is provided with a dust collection duct 8 connected to a dust collector (not shown) so as to collect dust generated during processing.
[0052]
Further, an accumulation box 9 is installed below the dust collection duct 8.
[0053]
As a result, as will be described later, when the small product Q is naturally dropped from the gap (FIG. 5) of the cutting plate 4 and carried out, the small product Q is accumulated in the accumulation box 9.
[0054]
On the other hand, when the cutting plate 4 is a small product Q processed from the workpiece W (down arrow of step 106 in FIG. 7), the small product Q is changed to a predetermined value as described above (FIG. 5). The sheet is unloaded by being naturally dropped into the stacking box 9 through the gap between the cutting plates 4 opened by an interval.
[0055]
In this case, the cutting plate 4 includes a first plate 4A and a second plate 4B as shown in FIG.
[0056]
Both the first plate 4A and the second plate 4B are slidably coupled to the X-axis guides 23 and 24, and are movable in the X-axis direction.
[0057]
As shown in the figure, a drive shaft 6 having a normal screw 6A and a reverse screw 6B is provided on one side of the first plate 4A and the second plate 4B, and a normal screw 7A and a reverse screw 7B are provided on the other side. Each of the driven shafts 7 is arranged.
[0058]
The nuts 17 and 16 on both sides of the first plate 4A are provided with the positive screws 6A and 7A of both shafts 6 and 7, and the nuts 19 and 18 on both sides of the second plate 4B are provided on both sides of the shafts 6 and 7. The reverse screws 6B and 7B are screwed together.
[0059]
One end of the drive shaft 6 is coupled to, for example, a servo motor M, the other end is supported by the bearing 2, and one end and the other end of the driven shaft 7 are both supported by the bearing 2. , 7 are connected by a chain 3 or a belt as a rotational force transmitting means.
[0060]
With this configuration, if the servo motor M is driven and controlled by a cutting plate control unit 20G (FIG. 1), which will be described later, the first plate 4A and the second plate 4B that constitute the cutting plate 4 are moved toward and away from each other. Thus, the gap distance D can be changed in accordance with the size S of the small product Q and the thickness (FIG. 3) (FIGS. 4B and 4C).
[0061]
In this case, the size S and the plate thickness of the small product Q, and the gap distance D of the cutting plate 4 in that case have a relationship as shown in FIG. 3, FIG. 4 (B), FIG. 4 (C), for example. This relationship is stored in advance in the memory 20H of the NC device 20 (FIG. 1) described later.
[0062]
In FIG. 3, the size S of the small product Q is a large size b, a medium size m, and a small size s, and the small product Q to be processed is a small product Q of a large size b._bSmall product Q of medium size m_mSmall product Q of small size s_sIn this case, the gap distance D of the cutting plate 4 to be changed₁, D₂, D_ThreeAre shown respectively.
[0063]
Therefore, after the workpiece W is loaded into the laser processing machine (FIG. 1) and positioned (step 101 in FIG. 7), the CPU 20A (FIG. 1) of the NC device 20 searches the processing conditions stored in the memory 20H. For example, it is detected that the size S of the small product Q to be processed from now on is the size m in FIG. 3, and the contents of FIG. 3 stored in the memory 20H are similarly searched, The gap D of the cutting plate 4 corresponding to the size m is D₂Suppose that it is detected.
[0064]
In that case, the CPU 20A (FIG. 1) sets the gap interval D of the cutting plate 4 to the detected interval D.₂The servo motor M is controlled (FIG. 2) via the cutting plate control unit 20G.
[0065]
FIG. 4 shows gap intervals of the cutting plate 4 to be changed when the workpiece W is a thin plate W1 and a thick plate W2.
[0066]
For example, small product Q of medium size m_mEven in the case of the small product Q_mThe case where the space | interval D of the clearance gap of the cutting plate 4 differs with whether the workpiece | work W which processes is thin plate W1 or thick plate W2 is illustrated.
[0067]
That is, as shown in FIG._m, As described above, the gap interval D of the cutting plate 4 is D₂It is.
[0068]
However, this small product Q of medium size m_mWhen the workpiece W to be machined is a thin plate W1, as shown in FIG. 4B, both plates 4A and 4B of the cutting plate 4 are further moved inward.₁By moving only the gap distance D,₂It is smaller.
[0069]
Thereby, according to this invention, the instability of the process by plate | board thickness is eliminated by eliminating the bending of the workpiece | work by plate | board thickness, and the process is stabilized.
[0070]
On the contrary, the small product Q of medium size m_mWhen the workpiece W to be machined is a thick plate W2, as shown in FIG. 4 (C), both plates 4A and 4B of the cutting plate 4 are d outward.₂By moving only the gap distance D,₂It is bigger.
[0071]
Thus, according to the present invention, by reducing the influence of the heat of the laser beam L during the processing on the cutting plate 4, the processing instability due to the thickness of the workpiece is eliminated, and the processing is stabilized. Moreover, damage to the cutting plate 4 can be prevented.
[0072]
Therefore, the CPU 20A (FIG. 1) of the NC device 20 searches the processing conditions stored in the memory 20H, and as described above, detects the size S of the small product Q to be processed (FIG. 3). The thickness of the workpiece W in that case is also detected.
[0073]
For example, when the CPU 20A detects that the plate thickness in that case is the thin plate W1 (FIG. 4B), the interval D of the gap between the cutting plates 4 is set to the detected interval D.₂Even more than d₁In order to make it as small as possible, the servo motor M is controlled via the cutting plate controller 20G.
[0074]
Further, for example, when the CPU 20A detects that the plate thickness in that case is the thick plate W2 (FIG. 4C), the interval D of the gap of the cutting plate 4 is set to the detected interval D.₂Even more than d₂The servo motor M is controlled via the cutting plate control unit 20G so as to increase the size only.
[0075]
Thus, in the present invention, the gap distance D of the cutting plate 4 is changed according to the size S and the plate thickness of the small product Q (step 104 in FIG. 7).
[0076]
As a result, according to the present invention, as described above, the bending of the workpiece due to the plate thickness is eliminated and the influence of the heat on the cutting plate is reduced, so that the machining is stabilized, and the small product Q is further improved (FIG. 5). It is possible to reduce the processing time of the small product by being surely dropped and accumulating in the accumulation box 9.
[0077]
In this case, the gap D of the cutting plate 4 is normally changed automatically by the cutting plate controller 20G constituting the NC device 20 (FIG. 1) as described above. When is pressed (YES in step 103 in FIG. 7), the operator can make the same change manually (in parentheses in step 103 in FIG. 7).
[0078]
Further, touch sensors 21A and 21B are attached to the inside of the first plate 4A and the second plate 4B constituting the cutting plate 4 (FIG. 6), and the processed small product Q is caught in the gap between the cutting plates 4. Is detected.
[0079]
Thus, according to the present invention, the shooter is opened only when the small product is caught, and the shooter is opened and closed unnecessarily by ensuring the subtle judgment of whether or not the small product falls from the gap of the cutting plate. Operation can be eliminated.
[0080]
For example, the processed small product Q is a small product Q of medium size m as described above._mHowever, when the workpiece W is the thin plate W1, as described above (FIG. 4B), the gap interval D of the cutting plate 4 is the predetermined interval D.₂It is smaller than (FIG. 4 (A)).
[0081]
Thus, in the case of the thin plate W1, the gap interval D of the cutting plate 4 is the predetermined interval D.₂(Fig. 4 (A)) Not only smaller but also small product Q_m(FIG. 6), dross 22 and the like generated during processing adhere to the small product Q through the dross 22._mMay be caught in the narrow gap between the plates 4A and 4B constituting the cutting plate 4.
[0082]
Therefore, as described above, the touch sensors 21A and 21B are attached to the inner sides of the first plate 4A and the second plate 4B, and after a certain time has elapsed after processing (step 107A in FIG. 8 showing details of step 107 in FIG. 7). YES), when the touch sensors 21A and 21B are responding (YES in step 107B in FIG. 8), the small product Q_mIs caught in the gap of the cutting plate 4 (YES in step 107 in FIG. 7), the shooter 1 is opened (step 109 in FIG. 7), and the small product Q_mWas taken out (in parentheses).
[0083]
The control device of the present invention having such a configuration is configured by, for example, an NC device 20 (FIG. 1), and the NC device 20 includes a CPU 20A, an input unit 20B, an output unit 20C, a clock unit 20D, and a processing unit. The controller 20E, the shooter controller 20F, the cutting plate controller 20G, the memory 20H, and the open / close switch 20J.
[0084]
The CPU 20A, for example, determines whether the object to be processed is a large product or a small product (step 102 in FIG. 7) according to the operation procedure of the present invention (for example, corresponding to FIG. 7), and based on that, the processing control unit 20E ( The entire apparatus shown in FIG. 1, such as FIG. 1), shooter control unit 20F, cutting plate control unit 20G, is controlled.
[0085]
The input unit 20B is, for example, a keyboard, a mouse, a touch panel, and the like. The processing process, the type of the product processed at that time, the large product, the small product, the size of the small product (FIG. 3), The processing conditions such as the processing speed such as the thin plate W1 and the thick plate W2 (FIG. 4B, FIG. 4C) and the processing speed are input.
[0086]
The output unit 20C is, for example, a CRT, and confirms the input result of the processing conditions by the input unit 20B.
[0087]
The clock unit 20D measures time.
[0088]
For example, as described above (FIG. 6), the small product Q_mIs determined to be caught in the gap of the cutting plate 4 (step 107 in FIG. 7), the passage of a certain time is set as a condition (step 107A in FIG. 8). Measure.
[0089]
The machining control unit 20E performs control related to machining of the workpiece W, for example, performs positioning control of the workpiece W by moving the clamp 15 that grips the workpiece W in the X-axis direction and the Y-axis direction, and also performs Z control of the machining head 14. The output of the laser beam L is adjusted (control signal SG1) by controlling the movement in the axial direction and further by controlling a laser oscillator (not shown).
[0090]
The cutting plate control unit 20G controls the movement of the first plate 4A and the second plate 4B constituting the cutting plate 4 in the X-axis direction by controlling the servo motor M (control signal SG2), as described above. Then, the gap interval D of the cutting plate 4 is changed according to the size S and the plate thickness of the small product Q (step 106 in FIG. 6).
[0091]
As described above, the memory 20H stores in advance the relationship between the size S and thickness of the small product Q and the gap between the cutting plates 4.
[0092]
As described above, when the open / close switch 20J is pressed (YES in step 103 of FIG. 7), the gap D is not automatically changed by the cutting plate control unit 20G. Can be changed manually by the operator.
[0093]
The operation of the present invention having the above configuration will be described below with reference to FIG.
[0094]
(1) Operation before processing.
[0095]
(1) -A Determination of whether a large product is processed or a small product Q is processed.
[0096]
In step 101 of FIG. 7, the workpiece W is positioned, and in step 102, it is determined whether the product to be processed is a large product or a small product Q.
[0097]
That is, the CPU 20A constituting the NC device 20 (FIG. 1) moves the clamp 15 for gripping the workpiece W in the X-axis direction and the Y-axis direction via the machining control unit 20E, thereby moving the workpiece W to the machining point. After positioning to P, the memory 20H is searched to determine whether the product to be processed is a large product or a small product Q.
[0098]
(1) -B Operation when large products are processed.
[0099]
If a large product is to be processed (the right arrow in step 102 in FIG. 7), the process proceeds to step 105 and laser processing is performed.
[0100]
(1) -C Operation when the small product Q is processed.
[0101]
When a small product is processed (down arrow in step 102 in FIG. 7), first, in step 103 in FIG. 7, it is determined whether or not the opening / closing switch 20J has been pressed. NO), in step 104, the gap interval D of the cutting plate 4 is changed according to the size S and the plate thickness of the small product Q, and when pressed (YES), the operator manually makes the same change. Do (in parentheses).
[0102]
That is, in this case, the CPU 20A first determines whether or not the open / close switch 20J is pressed. If not, the CPU 20A searches the memory 20H and performs cutting according to the size S and thickness of the small product Q. The gap D between the plates 4 is detected (FIG. 3, FIG. 4B, FIG. 4C).
[0103]
Next, the CPU 20A controls the drive of the servo motor M via the cutting plate control unit 20G, and configures the cutting plate 4 (FIG. 2) so that the gap of the cutting plate 4 becomes the detected distance D. The first plate 4A and the second plate 4B are moved closer to and away from each other.
[0104]
Further, even when the CPU 20A determines that the small product Q is to be processed (FIG. 1), when the open / close switch 20J is pressed, the servo motor M is in a free state via the cutting plate control unit 20G. As described above, the operator can manually change the gap distance D of the cutting plate 4.
[0105]
(2) Processing operation.
[0106]
Next, in step 105 of FIG. 7, laser processing is performed.
[0107]
That is, the CPU 20A (FIG. 1), when the product to be processed from now on is a large product (right arrow of step 102 in FIG. 7), the state is left as it is, and the product to be processed from now is a small product Q (Down arrow in step 102 in FIG. 7), as described above, after the gap distance D of the cutting plate 4 is changed (automatic change in step 104 in FIG. 7 or manual change in parentheses), the machining is performed. A laser oscillator (not shown) is activated via the control unit 20E (FIG. 1), and a predetermined laser processing is performed by irradiating the workpiece W with the laser light L from the processing head 14.
[0108]
In this case, when the small product Q is processed, as described above, the size S of the small product Q and the thickness (FIG. 3) are already set before the processing (FIGS. 4B and 4C). )) The gap interval D of the cutting plate 4 is changed accordingly.
[0109]
Accordingly, the workpiece W is not bent due to the plate thickness, and the influence of heat on the cutting plate 4 is reduced, thereby stabilizing the machining.
[0110]
(3) Operation after processing.
[0111]
(3) -A Normal operation.
[0112]
In step 106 of FIG. 7, it is determined whether the processed product is a large product or a small product Q. If the product is a large product (right arrow), the shooter 1 is opened in step 109, whereby the large product is When the product is slid out on the shooter 1 (in the parenthesis of the lower arrow in step 109 in FIG. 7) and is a small product Q (the lower arrow in step 106 in FIG. 7), the small product Q becomes the cutting plate 4. It is naturally dropped from the gap (in the parenthesis of the down arrow in step 106 in FIG. 7) and carried out.
[0113]
In this case, for the small product Q, as described above, the gap distance D between the cutting plates 4 has already been changed according to the size S and the plate thickness of the small product Q (automatic operation in step 104 in FIG. 7). Change or manual change in parentheses).
[0114]
Therefore, according to the present invention, the small product can be surely dropped from the gap of the cutting plate 4, thereby shortening the processing time of the small product.
[0115]
(3) -B Operation when the small product Q is caught in the gap of the cutting plate 4.
[0116]
In step 107 after step 106 in FIG. 7, it is determined whether or not the small product Q is caught in the gap of the cutting plate 4. If not (NO), the process proceeds to step 108 and is caught. If yes (YES), the shooter 1 is opened in step 109.
[0117]
The details in this case are shown in FIG. 8 as described above. In step 107A, it is determined that a fixed time has elapsed after processing (YES). In step 107B, the touch sensors 21A and 21B are activated. If it is determined that the reaction has occurred (YES), it is assumed that a small product has been caught (YES in step 107 in FIG. 7).
[0118]
That is, the CPU 20A (FIG. 1) first determines whether or not a certain time has elapsed after processing (step 107A in FIG. 8) via the clock unit 20D. If the certain time has elapsed (YES). Next, it is determined whether or not the touch sensors 21A and 21B attached to the first plate 4A and the second plate 4B constituting the cutting plate 4 (FIG. 6) are reacting (step 107B in FIG. 8).
[0119]
Then, the CPU 20A (FIG. 1), when the touch sensors 21A and 21B are reacting (YES in step 107B in FIG. 8), for example, the small product Q_m(FIG. 6) Since the dross 22 or the like has caught the gap in the cutting plate 4 (YES in step 107 in FIG. 7), the shooter 1 is opened via the shooter control unit 20F (FIG. 1) (FIG. 7). Step 109).
[0120]
As a result, the small product Q caught in the gap of the cutting plate 4 (FIG. 6)._mIs slid out on the opened shooter 1 (in the parenthesis of the down arrow in step 109 in FIG. 7).
[0121]
Therefore, according to the present invention, it is possible to open the shooter only when the small product is caught by ensuring the determination of whether or not the small product is dropped from the gap of the cutting plate, and useless opening / closing operation of the shooter Can be eliminated.
[0122]
After the operations (1) to (3), it is determined in step 108 in FIG. 7 whether or not all machining has been completed. If not (NO), the process returns to step 101 and the same operation is performed. If the operation is repeated (YES), all the operations are completed (END).
[0123]
In addition, in the said embodiment, although the case where this invention was applied to a laser processing machine was explained in full detail, this invention is not limited to this, For example, it applies also to the punch press which is another board | plate material processing machine, Of course, the effects of
[0124]
【The invention's effect】
As described above, according to the configuration of the present invention, with respect to small products, in relation to the cutting plate, the processing is stabilized by eliminating the bending of the workpiece due to the plate thickness and reducing the influence of heat on the cutting plate. The processing time of the small product is shortened by dropping the product reliably, and the unnecessary opening / closing operation of the shooter is eliminated by ensuring the judgment of whether or not the small product is dropped from the gap of the cutting plate. There is an effect.
[0125]
[Brief description of the drawings]
FIG. 1 is an overall view showing an embodiment of the present invention.
FIG. 2 is a plan view of a work shooter device according to the present invention.
FIG. 3 is a diagram showing the relationship between the size S of the small product Q according to the present invention and the gap distance D between the cutting plates 4;
4 is a diagram showing the relationship between the thickness of a workpiece W according to the present invention and the gap distance D of the cutting plate 4; FIG.
FIG. 5 is a diagram showing a normal carry-out operation of a small product according to the present invention.
FIG. 6 is a diagram showing an operation when a small product according to the present invention is caught in a gap of the cutting plate 4;
FIG. 7 is a flowchart illustrating the operation of the present invention.
8 is a detailed view of FIG.
FIG. 9 is an explanatory diagram of a prior art.
[Explanation of symbols]
1 Shuta
2 Bearing
3 Chain
4 Cutting plate
4A 1st plate
4B 2nd plate
5 Cylinder for driving Shuta 1
6 Drive shaft
6A Positive screw of drive shaft 6
6B Reverse screw of drive shaft 6
7 Driven shaft
7A Positive screw of driven shaft 7
7B Reverse screw of driven shaft 7
8 Dust collection duct
9 Collection box
10 frames
11 Processing table
12 Ball spline
13 Spring
14 Processing head
15 Clamp
16, 17, 18, 19 Nut
20 NC unit
20A CPU
20B input section
20C output section
20D clock
20E Machining control unit
20F Shuta control unit
20G cutting plate controller
20H memory
20J Open / close switch
21A, 21B Touch sensor
22 dross
23, 24 X-axis guide
D Gap spacing of cutting plate 4
L Laser light
P Machining point
Q Small products
S Size of small product Q
W Work
W1 sheet
W2 plank

Claims (4)

In the work shooter device of the plate material processing machine,
A shooter provided by cutting out a part of the processing table, and a cutting plate provided on the shooter. The gap of the cutting plate can be changed, and a touch sensor is provided in the gap of the cutting plate. A work shooter device characterized by being provided .  The cutting plate comprises a first plate and a second plate, a drive shaft having a normal screw and a reverse screw on one side of the first plate and the second plate, and a normal screw and a reverse screw on the other side. The work shooter device according to claim 1, wherein driven shafts having a plurality of shafts are respectively disposed, and the positive screw portions of both shafts are screwed to both sides of the first plate, and the reverse screw portions are screwed to both sides of the second plate. 3. The work shooter apparatus according to claim 2, wherein the drive shaft is coupled to a motor, and the drive shaft and the driven shaft are connected by a rotational force transmitting means such as a chain. In a product processing / unloading method using the work shooter device according to claim 1,
It is determined whether the product to be processed is a large product or a small product. When processing a large product, the product is processed as it is. When processing a small product, the size and thickness of the small product are processed. If the large product is processed after opening the shooter when the large product is processed, the small plate is processed when the large product is processed. When a small product passes through the gap at the above-mentioned changed interval of the cutting plate and is carried out, or the small product is processed, the processed small product is caught in the gap of the cutting plate via the touch sensor. A product processing / unloading method comprising: opening a shooter when it is determined that a small product is unloaded via the shooter .

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