JP3974585B2 - Plastic injection molded products - Google Patents

Description

  The present invention relates to a resin injection molded product in which a part of a terminal (also referred to as “bus bar” or “lead frame”) made of a conductive material such as a metal body is embedded in a resin case made of an insulating material.

  Such a resin injection-molded product is used after it is built into which a wiring board, electronic and / or electrical components (mounting components) are incorporated, and is electrically connected to the terminals with solder or the like. In the use state of the resin case described above, heat is generated when the internal device is activated, so the internal temperature rises to a higher temperature than when it is not activated (which means a temperature higher than normal temperature), and when the operation stops, heat is generated. It stops and the temperature drops. As described above, when the high temperature and low temperature use conditions are repeated, there is a problem in that a crack occurs due to stress generated in the solder joint. The cause of the crack is that the linear expansion coefficient of the metal terminal and the linear expansion coefficient of the resin case are different, and therefore the difference in expansion and contraction due to the temperature change is caused by the difference between the two linear expansion coefficients. Generally, the linear expansion coefficient of the resin case is larger than the linear expansion coefficient of the metal terminal.

  As one means for solving the above problems, the invention disclosed in Patent Document 1 is proposed. The invention disclosed in Patent Document 1 states that “an uneven portion is formed along the plate thickness direction on the surface of a solder-bonded portion of a plate-shaped metal terminal, and a part of the solder is formed on the uneven portion of the terminal in the solder bonding step. It is a structure in which the bonding force between the terminal and the solder is increased by allowing it to enter.

  In the invention disclosed in Patent Document 1, (1) an uneven portion is formed in a portion where a terminal is to be bonded in a solder bonding portion between a wiring board (printed circuit board) and a metal terminal, and the solder is connected to the uneven portion of the terminal in a solder bonding step There has been proposed an attempt to increase the bonding strength between the terminal and the solder by entering the portion. In addition to the above attempts, the above invention also proposes (2) bending or punching an intermediate portion of a metal terminal into a U shape and using the U shape portion as a “stress relief portion”.

However, in the above invention, (1) is based on the premise that stress is generated and increases the bonding strength to prevent solder peeling and the like even when stress is generated. The gist is to prevent the peeling of solder by relaxing the stress generated by creating a bent part.
Japanese Patent No. 3321420

  According to the present invention, a wiring board (printed board) and electrical and / or electronic equipment (mounting parts) are mounted on the board and housed in a case, and the wiring of the wiring board or the electronic equipment and terminals are When electrically connected with a conductive connection member such as solder and used in this state, even if the temperature changes and the resin molded product such as a case expands or contracts, it tries to break this connection at the connection part. An object is to provide a resin molded product such as a case in which no tensile, compressive or bending stress is generated.

The invention of claim 1 for solving the above-mentioned problem is that at least a part of a terminal made of a metal conductor in a resin case in which a wiring board and a device that generates heat during operation are housed are contained. Is a resin injection molded product embedded integrally, and the resin injection molded product protrudes toward the wiring board side integrally from the base part and the base part, and the wiring board is separated from the board part by a predetermined distance. A wiring board supporting portion that can be supported and a terminal supporting protruding portion that integrally protrudes from the base portion toward the wiring board side and is flush with the wiring board supporting portion and supports the terminal. The terminal is integrally formed from a resin material having a larger linear expansion coefficient than the material, and the terminal is embedded in the base portion and fixed to the base portion during injection molding of the molded product, and the embedded portion From the wiring board side A protrusion that protrudes, the protrusion rises along the terminal support protrusion, and rises continuously from the terminal support protrusion and the terminal support protrusion. A fixed portion that is integrally embedded in the terminal support protruding portion and fixed to the terminal support protruding portion at the time of injection molding, and a connection planned portion that extends from the distal end side of the fixed portion and can be connected to the wiring board. provided by said projecting direction due to the cooling of the terminal support protrusions shrinkage during injection molding of the resin injection molded article generates a deflection between the stationary portion and the embedded portion to the rising portion of the terminal The terminal support protrusion is prevented from changing in relative position with respect to the terminal support projecting portion, which is caused by the contraction, and the tip of the terminal is bent in two opposite directions at a predetermined interval. Connected to the riser Bent portion connecting the portion to be is characterized in that it is fixed by embedding into the terminal support protrusions.

According to the first aspect of the present invention, since the resin terminal support protrusion has a larger linear expansion coefficient than the metal conductor forming the terminal, the rising portion of the terminal bends when the temperature decreases . On the other hand, when the temperature rises, the bending of the terminal becomes smaller. That is, when a temperature change occurs, the terminal made of a metal conductor, the wiring board support part made of a resin material, and the terminal support protrusion part both expand and contract along the protruding direction of the terminal support protrusion part. Since the tip end side of the terminal is fixed to the terminal support protrusion, expansion and contraction of the terminal is blocked by the terminal support protrusion at the fixing portion at the tip of the rising part, and the tip of the rising part of the terminal is at the same position as the terminal support protrusion. Displacement in the expansion and contraction direction while maintaining For this reason, the relative position of the terminal connection planned portion with respect to the terminal support protruding portion of the molded product hardly changes. As a result, when the terminal connection planned part is connected to the wiring board with solder etc. and used for later use, even if there is a large temperature change, that is, the terminal connection planned part and the wiring board at both high and low temperatures. Since no “positional deviation” occurs between the two, it is possible to prevent an excessive stress from being generated in the connection portion. As a result, a resin injection molded article such as a case in which connection failure such as solder cracking does not occur even when used in an environment exposed to temperature changes. Further, since the bent portion of the terminal can be embedded in the terminal support protruding portion of the molded product at the time of injection molding of the molded product, a structure for separately fixing the leading end portion of the rising portion of the terminal to the terminal support protruding portion becomes unnecessary.

The invention of claim 2 is a resin injection molded product in which at least a part of a terminal made of a metal conductor is embedded, and the resin injection molded product is a resin having a larger linear expansion coefficient than the material of the terminal. Formed of a material, a base part, a wiring board support part that integrally protrudes from the base part and can be supported by separating the wiring board by a predetermined distance, and the same height as the wiring board support part toward the wiring board side And a terminal support projecting portion that integrally projects from the base portion and supports the terminal, and the terminal is embedded in the base portion and exposed from the base portion to the wiring board. consists of a protrusion protruding toward the protrusion of the terminal, the terminal supporting protrusions rising toward the wiring board along, is fixed to the terminal supporting protrusion at least in part on the distal side a rising portion having a fixing portion that, Provided continuously to the tip of the serial rising portion consists of a connecting portion to be connectable to the wiring substrate, the fixing portion of the terminal biting portion in which the terminal supporting protrusions bite is formed It is characterized by that.

The effect of the invention of claim 2 is substantially the same as the effect of the invention of claim 1, but the terminal fixing portion is firmly fixed to the terminal support protruding portion of the molded product by biting. Fixing of the connection portion of the terminal to the tip of the protruding portion is further stabilized.

According to a third aspect of the present invention, in the second aspect of the present invention, the tip end portion of the terminal is bent in two opposite directions at a predetermined interval so as to connect the rising portion and the planned connection portion. Is embedded and fixed in the terminal support protrusion. According to the third aspect of the invention, in addition to the above-described effects of the second aspect of the invention , the bent portion of the terminal can be embedded in the terminal support protrusion of the molded product at the time of injection molding of the molded product. The structure which fixes the front-end | tip part of a part to a terminal support protrusion part separately becomes unnecessary.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the rising portion of the terminal is held in a non-attached state with the terminal support protruding portion. According to the invention of claim 4, in addition to the above-described effect of the invention of any one of claims 1 to 3, when the rising portion of the terminal is deformed due to a temperature change, the deformation of the rising portion is not restricted and is easy. It becomes.

  According to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, the rising portion of the terminal is arcuate at room temperature and separated from the terminal support protrusion, and is higher than normal temperature. It is characterized by being displaced in a direction approaching and contacting the side surface of the terminal support protrusion at a high temperature. According to the invention of claim 5, in addition to the above-described effects of the invention of any one of claims 1 to 4, when the use environment changes from room temperature to high temperature, the extension amount of the terminal support protrusion is the rise of the terminal. Although it becomes larger than the amount of extension of the part, the rising part of the bow-shaped terminal at room temperature is deformed substantially linearly at the time of high temperature, so that it easily follows the extension of the terminal support protruding part.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects of the present invention, the terminal support protruding portion that supports the terminal and the wiring substrate support portion that supports the wiring substrate are made of the same material as the base portion. It is characterized by being molded in one piece. According to the invention of claim 7, in addition to the above-described effects of the invention of any one of claims 1 to 5 , the amount of expansion / contraction between the terminal support protruding portion and the wiring board support portion of the molded product is changed over a wide range of temperature changes. Since they are the same, the positional deviation between the terminal connection scheduled portion and the wiring board is least likely to occur.

In the present invention, the expansion and contraction of the terminal due to the temperature change is limited by the terminal support protrusion at the fixed part at the tip of the rising part, and the linear expansion coefficient of the resin terminal support protrusion is higher than that of the metal conductor forming the terminal. Therefore, when the temperature decreases, the rising portion of the terminal is bent. On the other hand, when the temperature rises, the bending of the terminal is eliminated. As a result, the relative position of the terminal connection planned portion with respect to the terminal support protruding portion of the molded product hardly changes. For this reason, when the terminal connection planned part is connected to the wiring board with solder etc. and used for later use, even if there is a large temperature change, the relative position between the terminal connection planned part and the wiring board does not change, Since it is displaced while maintaining the same position, it is possible to prevent the stress from being generated between the two, and even when used in an environment exposed to a temperature change, a connection failure does not occur. Further, since the bent portion of the terminal can be embedded in the terminal support protruding portion of the molded product at the time of injection molding of the molded product, a structure for separately fixing the leading end portion of the rising portion of the terminal to the terminal support protruding portion becomes unnecessary.

  Hereinafter, the present invention will be described in more detail with reference to the best mode for carrying out the present invention and other forms.

FIG. 1 is a perspective view of the connector case (hereinafter also referred to as “case”) C according to the first embodiment of the present invention with the upper lid 8 removed, and FIG. 2 is a plan view of the same state. FIG. 3 is a cross-sectional view taken along the line XX of FIG. 2 and shows a temperature state higher than normal temperature in use. First, the outline of the case C will be described, and then the support structure for the terminal T ₁ of the first embodiment will be described in detail. A case C excluding an upper lid 8 and a bottom lid 9, which will be described later, is a resin injection-molded product made of a non-conductive thermoplastic resin having a rectangular box shape with an open top surface. A plurality of (two in the embodiment) strips connected to a connector (not shown) of the device at a specific position of the side wall 2. It is integrally formed rectangular tube-shaped connector portion 3 which accommodation space 3a is provided in the connector terminal T ₁₀ protrudes outwardly. The base portion 1 of the case C has at least one substrate support protrusion 4 for supporting the wiring board P disposed in the case C at a predetermined distance from the base portion 1. It is formed to project integrally toward the opening of C. In the first embodiment, one substrate support protrusion 4 is formed at a position close to each corner of the case C, and a total of four are formed. The connector terminal T ₁₀ is embedded in a connector terminal embedded portion 5 integrally formed inside the side wall portion 2 of the case C, except for both ends, so that the connector side end portion T ₁₀ at one end of the connector terminal T ₁₀ is embedded. a enters into the housing space 3a of the connector part 3, and the other end is bent at a substantially right angle in the case C and penetrates the wiring board P in the use state and protrudes toward the upper lid 8 side. The portion is a connection side end portion T ₁₀ b. The wiring board P is supported by a plurality of substrate support protrusions 4 and is fixed to the case C by being fixed to the substrate support protrusions 4 by tapping screws 6 at each portion.

FIG. 4 is a half-sectional perspective view of the terminal support protruding portion 7 integrally formed by protruding from the base portion 1 of the case C toward the wiring board P side, and FIG. 5 is a view taken in the direction of the arrow Q in FIG. 6 is a view taken in the direction of arrow R in FIG. 4, and FIG. 7 is a cross-sectional view taken along line YY in FIG. 4 to 7 show the use state at the same high temperature as in FIG. As shown in FIG. 3, the terminal T ₁ blanked in a strip shape other than the connector terminal T ₁₀ is partially embedded in the base portion 1 of the case C by insert injection molding. It is arranged so that it is bent at a substantially right angle in the middle of the embedded portion and the other end protrudes toward the opening side of the case C. As shown in FIGS. 4 to 7, the projecting portion T ₁₁ of the terminal T ₁ includes a rising portion T ₁₁ a that rises along the terminal support projecting portion 7 of the case C, and a tip portion of the terminal support projecting portion 7. A fixed portion T ₁₁ b fixed to the terminal, and a terminal connection that penetrates the wiring board P and protrudes from the mounting surface and is connected to the wiring L and the like via solder S (both see FIGS. 1 to 3). consisting of a portion to be T ₁₁ c. The side surface of the rising portion T ₁₁ a of each terminal T ₁ is in contact with the terminal support protruding portion 7. Predetermined mounting components (not shown) are mounted on the wiring board P, and these mounting components and the terminal connection scheduled portion T ₁₁ c of each terminal T ₁ are connected by wiring L (see FIGS. 1 and 2). Although connected, the wiring L and the terminal connection scheduled portion T ₁₁ c of the terminal T ₁ are connected by solder S. The opening of the case C is closed with the upper lid 8, and the outside of the base portion 1 of the case C is used in a state covered with the bottom lid 9. The terminal support protrusions 7, so as to have a sufficient force to curved elastic force generated along with the temperature change compresses the rising portion T ₁₁ a terminal T ₁ in the longitudinal direction (deflect) The cross-sectional shape, size, etc. are set.

A part of the terminal T ₁ is embedded and the case C is resin injection molded by insert injection molding. After the case C is cooled to room temperature, each terminal T ₁ is partially a base portion as described above. 1 and is bent at a substantially right angle toward the opening side of the case C in the middle, and the protruding portion T ₁₁ mainly composed of the rising portion T ₁₁ a is substantially linear along the terminal support protruding portion 7 of the case C. The tip of the protrusion T ₁₁ is embedded and fixed in the terminal support protrusion 7. The terminal supporting protrusion 7 of the case C, the groove 11 is substantially parallel to the protruding portion T ₁₁ on one side. Protrusions T ₁₁ of the terminal T ₁ has a tip portion is bent in a crank shape. The “crank shape” refers to a shape that is bent in opposite directions to each other at two predetermined intervals. The rising portion T ₁₁ a constituting most of the projecting portion T ₁₁ is partly embedded in the terminal support projecting portion 7 so as to be detachable from the bottom of the concave groove 11. Further, the fixing portion T ₁₁ b which is bent at a substantially right angle near the tip of the protruding portion T ₁₁ is fixed by penetrating the terminal supporting protruding portion 7 and partially embedded in the terminal supporting protruding portion 7. . A portion of the protrusion T ₁₁ that penetrates the terminal support protrusion 7 and protrudes to the opposite side of the groove 11 of the terminal support protrusion 7 is further bent at a substantially right angle and directed toward the opening of the case C. This is a terminal connection scheduled portion T ₁₁ c. The cross-section of the strip-shaped terminal T ₁ has a rectangular shape, and when the rising portion T ₁₁ a of the terminal T ₁ is detachably embedded in the bottom surface of the concave groove 11, the rising portion T ₁₁ a The surface is flush with the bottom surface 11a of the concave groove 11 (see FIGS. 4 and 7). As described above, the rising portion T ₁₁ a is disposed inside the concave groove 11, so that the rising portion T ₁₁ a is protected and prevented from being damaged or deformed by contact with other metal parts or jigs. it can. The width of the projecting portion T ₁₁ of the strip-like terminal T ₁ is changed so as to gradually decreases in the connection portion between the fixed portion T ₁₁ b and the rising portion T ₁₁ a on the boundary. That is, as shown in FIG. 5, the width (W ₂ ) of the portion from the connection portion to the tip of the terminal connection scheduled portion T ₁₁ c is narrower than the width (W ₁ ) of the other portion, Since the width of the connecting portion between the rising portion T ₁₁ a and the fixed portion T ₁₁ b is changed, it is a biting portion T ₁₁ d that bites into the terminal support protruding portion 7.

Thus, the upper end portion of the protruding portion T ₁₁ of the terminal T ₁ is being cranked, by fixing unit T ₁₁ b is an intermediate portion of the bent is penetrated into the terminal support protrusion 7, the terminal T The upper end portion of the _one projecting portion T ₁₁ is fixed to the terminal support projecting portion 7. For this reason, the protruding portion T ₁₁ is firmly and integrally fixed to the upper end portion of the terminal support protruding portion 7. Further, since the bent connection portion between the rising portion T ₁₁ a and the fixed portion T ₁₁ b is formed with a biting portion T ₁₁ d that bites into the terminal support protrusion portion 7, the terminal support protrusion portion fixing protrusions T ₁₁ of the terminal T ₁ is the more firmly against 7.

3, 4, 7, etc., in which the terminal support protrusion 7 is vertically cut, 12 is for holding the position of the buried portion of the terminal T ₁ when the case C is resin injection molded. 13 is a hole (trace hole) in the holding portion of the mold for holding the terminal connection planned portion T ₁₁ c of the terminal T ₁ . As described above, the base portion 1 of the case C is formed with a plurality of holes 12 and 13 opened to the bottom surface, and each opening is later covered with the bottom cover 9 attached to the bottom surface of the base portion 1.

Figures 8 (a) to 8 (c) show that when cooled after cooling to room temperature after demolding, the equipment is mounted inside and operated, when the internal temperature is higher than normal temperature, and when it is not operating FIG. 6 is a longitudinal sectional view of the portion of the terminal support protrusion 7 of the case C when the inside is used at a low temperature below room temperature, and the coefficient of thermal expansion between the resin forming the terminal support protrusion 7 and the metal forming the terminal T _1. The rising portion T ₁₁ a of the terminal T ₁ is mainly deformed between a linear shape and an arcuate shape due to the difference. Further, it is assumed that the temperature during low-temperature use is substantially the same as the temperature during demolding cooling. In FIGS. 8A to 8C, the deformation of the terminal T ₁ is illustrated in an enlarged manner as compared with the actual deformation in order to make the illustration possible and to facilitate understanding. Immediately after the case C is molded in the injection mold, the shape approximated to FIG. 8B is maintained, but the terminal support protrusion 7 contracts due to resin molding shrinkage. On the other hand, the rising portion T ₁₁ a of the terminal T ₁ is not molded and contracted, and the upper end portion is fixed to the terminal support protruding portion 7, so that an excess portion is added to the rising portion T ₁₁ a as the terminal supporting protruding portion 7 is cooled and contracted. It is generated, as shown in FIG. 8 (b), the rising portion T ₁₁ a is curved and deformed away from the terminal support protrusion 7 (bends). 8 (a) to 8 (c), H ₁ , H ₂ , and H ₃ are the heights of the terminal support protrusions 7 of the case C at the time of cooling after demolding, use at high temperature, and use at low temperature, respectively. Therefore, since the resin as the molding material thermally expands and contracts, the relationship of [H ₂ > H ₃ (≈H ₁ )] is maintained. Here, FIG. 3 is a schematic view in which thermal expansion and contraction due to temperature change are not taken into consideration, and the height of the terminal support protrusion 7 of the case C is indicated by (H), and the height (H). Is equal to the height of the board support protrusion 4 that supports the wiring board P.

When the internal temperature becomes higher than when the case C is not in operation due to the operation of the internal device during use of the case C, the thermal expansion coefficient of the resin forming the terminal support protrusion 7 is the thermal expansion of the metal forming the terminal T _1. is greater than the coefficient, the rising portion T ₁₁ a terminal T ₁ which has flexed arcuately at low temperatures at a distance from the terminal support protrusion 7 as shown in FIG. 8 (c) is in FIG. 8 (b) As shown in the figure, the deformation of the terminal support protrusion 7 and the rising portion T ₁₁ a of the terminal T ₁ are deformed substantially linearly following the extension of the terminal support protrusion 7, thereby reducing the difference in deformation due to thermal expansion. Absorbs. Conversely, the inside is the terminal support protrusions 7 when stop using the case C that were used in a high temperature shrinkage, the excess portion to the rising portion T ₁₁ a terminal T ₁ which has substantially a straight at high temperature The difference in deformation due to thermal contraction between the terminal support protruding portion 7 and the rising portion T ₁₁ a of the terminal T ₁ due to the rising portion T ₁₁ a being bent like an arc and being separated from the terminal support protruding portion 7. Is absorbed. In this way, the fixed portion T ₁₁ b and the connection scheduled portion T ₁₁ c which are near the tip of the protruding portion T ₁₁ of the metal terminal T ₁ are fixed to the terminal support protruding portion 7, and the portion of the rising portion T ₁₁ a is fixed. By deforming between a substantially linear shape and an arcuate shape, the amount of thermal expansion and contraction caused by the difference in thermal expansion coefficient between the resin forming the terminal support protrusion 7 and the metal forming the terminal T ₁ can be reduced. The structure absorbs the difference and allows the terminal T ₁ to smoothly follow the thermal expansion and contraction of the terminal support protrusion 7. Since the rising portion T ₁₁ a of the terminal T ₁ has a strip-like shape, the deflection in the thickness direction when deflected with temperature drop, does not flex plate width direction. Rising unit T ₁₁ a In other words, since flex in one direction only, can predict the deflection range, it is possible to prevent interference or contact other terminals T ₁ and equipment by arranging removed from said deflection range.

8A to 8C, P ₁ , P ₂ , and P ₃ are terminals from the front end surface 7a of the terminal support protrusion 7 of the case C during demolding cooling, high temperature use, and low temperature use, respectively. The distance to the tip of the terminal connection scheduled portion T ₁₁ c of T ₁ is indicated. H ₁₁ , H ₁₂ , and H ₁₃ represent the base portion 1 of the case C during demolding cooling, high temperature use, and low temperature use, respectively. shows the distance to the tip of the terminal connecting portion to be T ₁₁ c of the terminal T ₁ from the top surface 1a. As described above, when the internal temperature becomes high during use of the case C, or when the use of the case C is stopped from a state where the internal temperature is high and the internal temperature becomes room temperature, the distances H ₁₁ , H ₁₂ , H ₁₃ changes as [H ₁₂ > H ₁₃ (≈H ₁₁ )]. However, the protruding portions T ₁₁ of the terminal T _1, because they are fixed to the terminal supporting protrusion 7 in the fixed part T ₁₁ b close to the leading end of the terminal support protrusions 7, the rising portion of the terminal T ₁ T ₁₁ a The expansion / contraction of is blocked by the fixing portion T ₁₁ b and does not affect the terminal connection scheduled portion T ₁₁ c. Therefore, the tip of the terminal connecting portion to be T ₁₁ c of the terminal T ₁ is displaced while maintaining the same position together with the front end portion of the terminal support protrusions 7, the relationship of _{(P 1 ≒ P 2 ≒ P} 3) To maintain. In other words, even if the terminal support protrusion 7 of the case C and the protrusion T ₁₁ of the terminal T _{1 having} different linear expansion coefficients are expanded or contracted, the terminal T ₁ is scheduled to be connected to the tip of the terminal support protrusion 7. The relative position of the portion T ₁₁ c is the same. Note that in FIG. 8 (b) the same (c), D ₁ is the difference in the amount of extension of the terminal supporting protrusion 7 (displacement difference of the position of the front end surface 7a of the terminal support protrusions 7) at high temperature and low temperature A indicates the position of the bottom surface of the wiring board P.

Therefore, the terminal connection scheduled portion of the terminal T ₁ after T ₁₁ c even if a large change in temperature when subjected to use is connected to the wiring board P by soldering S, i.e. even at low temperature terminal T even at high temperatures and the wiring board P ₁ of the terminal connecting portion to be T ₁₁ c, kept to follow the thermal expansion and contraction of the terminal support protrusions 7 relative position with respect to the distal end face 7a of the terminal support protrusions 7 substantially constant base It is displaced with respect to part 1. As a result, it is possible to prevent the occurrence of stress due to the “position shift” between the terminal connection planned portion T ₁₁ c of the terminal T ₁ and the wiring board P. As a result, the case C is used in an environment where the case C is exposed to a temperature change. However, the solder S is not cracked and connection failure is less likely to occur.

In Example 1, the tip portion of the protruding portion T ₁₁ of the terminal T ₁ is being cranked, the fixed portion T ₁₁ b forming the center of the crank-shaped portion is thermal expansion and contraction of the terminal support protrusion 7 Of the fixed portion T ₁₁ b of a predetermined length (refers to a portion extending along the direction perpendicular to the protruding direction of the terminal support protruding portion 7 of the protruding portion T ₁₁ of the terminal T ₁ ). Thermal expansion and contraction do not affect the change in the relative position of the terminal connection scheduled portion T ₁₁ c with respect to the tip of the terminal support protrusion 7. The terminal connection planned portion T ₁₁ c which is the free end side of the crank shape portion has a predetermined length, and the free end side of the crank shape portion thermally expands and contracts due to temperature change. Strictly speaking, the relative position of the terminal connection scheduled portion T ₁₁ c of the terminal T ₁ with respect to the distal end portion of the portion 7 slightly changes, but if the terminal T ₁ has the shape of the first embodiment, it can be ignored practically. It is a range.

In addition, the case C is formed by resin injection molding from one kind of heat-melted resin with the terminals T ₁ and T ₁₀ inserted therein, and the substrate support protrusion 4 and the terminal support protrusion 7 are made of the same material. For this reason, since the thermal expansion amount and thermal contraction amount of the substrate support protrusion 4 and the terminal support protrusion 7 are the same over a wide range of temperature changes, the terminal connection planned portion T ₁₁ c of the terminal T ₁ and the wiring substrate P It becomes a structure in which the positional deviation from the least occurs.

Next, a second embodiment of the present invention will be described. Figure 9 (b), the (b), the (c), the fixed portion T ₂₁ b of the respective terminal T ₂ through T ₄ having different fixing structure for the terminal supporting protrusions 7 ', T ₃₁ b, the T ₄₁ b a partial perspective view showing the portion, FIG. 10 (b), the (b) is that the change is bent terminal T ₂ at high temperature and low temperature terminal T ₂ each having a fixed portion T ₂₁ b FIG. 11 is a longitudinal sectional view of a terminal support protrusion 7 ′ shown as a main body, and FIG. 11 is a sectional view taken along line ZZ of FIG. The protruding portions T ₂₁ , T ₃₁ , and T ₄₁ of the terminals T _{2 to} T ₄ are all linear having no bent portion in the middle, and the fixing portion T ₂₁ b of the terminal T ₂ is a circular fixing hole 21. It is configured. As shown in FIGS. 10 and 11, enters a portion of the resin forming the terminal supporting protrusion 7 'into the fixing hole 21 at the time of injection molding, the rising portion of the terminal T ₂ T ₂₁ a and the terminal connecting portion to be The fixing portion T ₂₁ b connecting the T ₂₁ c is fixed to the tip portion of the terminal support protruding portion 7 ′. Further, a hollow portion 22 is formed along the protruding direction of the terminal support protruding portion 7 ′ between the base portion 1 of the case C and the tip end portion of the terminal supporting protruding portion 7 ′, and the rising portion T ₂₁ a of the terminal T ₂ is The hollow portion 22 is exposed in the hollow portion 22 so that the surface thereof is flush with the inner wall surface 22a of the hollow portion 22 (see FIG. 10A), and the terminal support protruding portion 7 ' It is buried so that it can be detached.

In this way, the portion embedded in the terminal support protrusion 7 ′ near the tip of the terminal T ₂ is securely fixed to the terminal support protrusion 7 ′ by the fixing portion T ₂₁ b. When the temperature of the terminal T ₂ changes from a low temperature to a high temperature, the rising portion T ₂₁ a of the terminal T ₂ bends in an arc shape following the extension of the terminal support protrusion 7 ′ in the hollow portion 22 of the terminal support protrusion 7 ′. However, it is deformed from the state shown in FIG. Conversely, when the temperature around the case C changes from high to low, the rising portion T ₂₁ a of the terminal T ₂ , which has been linear in FIG. 10 (a), bends into the bow shape of FIG. 10 (b). absorb the excess part amount due to shrinkage. Therefore, the difference in thermal expansion and contraction of the rising portion T ₂₁ a and the terminal support protrusion 7 of the terminal T ₂ 'caused by the temperature change is absorbed by the bending deformation of the rising portion T ₂₁ a. Therefore, the tip of the 'even is a difference with the thermal expansion or contraction of the expansion amount or shrinkage amount, the terminal supporting protrusion 7' overhang T ₂₁ and the terminal support protrusions 7 of the terminal T ₂ by the temperature change The relative position of the terminal connection planned portion T ₂₁ c of the terminal T ₂ with respect to the terminal T ₂ c hardly changes as in the first embodiment, and stress is applied between the terminal connection planned portion T ₂₁ c of the terminal T ₂ and the wiring board P. It does not occur and connection failure is less likely to occur. In FIG. 10, D ₂ indicates the amount of expansion / contraction of the terminal support protrusion 7 (displacement difference in the position of the tip end surface 7 a of the terminal support protrusion 7) between the high temperature and the low temperature.

Further, as shown in FIG. 9B, the fixing portion T ₃₁ b of the terminal T ₃ is composed of a pair of V grooves 23 formed to face each other along the width direction. At this time, a part of the resin forming the terminal support protruding portion 7 ′ is filled in the pair of V grooves 23 to form the fixing portion T ₃₁ b. Accordingly, FIG. 9 (b) of the rising portion T ₃₁ a and the terminal support protrusions 7 of the fixed portion T ₂₁ b and the terminal T ₃ by a temperature change as well 'even if thermal expansion or contraction, of the terminal T ₃ The fixing portion T ₃₁ b hardly moves relative to the terminal support protruding portion 7 ′. Furthermore, as shown in FIG. 9C, the fixed portion T ₄₁ b of the terminal T ₄ is _located between the rising portion T ₄₁ a and the terminal connection planned portion T ₄₁ c on the side of the terminal connection planned portion T ₄₁ c. The taper step portion 24 is formed so as to be narrow, and when the resin injection molding of the case C, a part of the resin forming the terminal support protruding portion 7 ′ is filled around the taper step portion 24 to fix the fixing portion T. ₄₁ b. In both of the terminals T ₃ and T ₄ , the tips of the protruding portions T ₃₁ and T ₄₁ are fixed to the terminal support protruding portions 7 ′ in the same manner as the terminal T _1. The relative positions of the terminal connection scheduled portions T ₃₁ c and T ₄₁ c of the terminals T ₃ and T ₄ with respect to the portion hardly change as in the first embodiment. For this reason, no stress is generated between the terminal connection scheduled portions T ₃₁ c and T ₄₁ c of the terminals T ₃ and T ₄ and the wiring board P, and connection failure does not occur. Further, the rising portion T ₂₁ a terminal _{T 2 ~T 4, T 31 a} , since the T ₄₁ a is accommodated in the hollow portion 22, the rising portion T ₂₁ a, the T ₃₁ a, T ₄₁ a bent However, it has the advantage of preventing accidental contact with other terminals and devices.

Of the three types of fixing structures of the projecting portions T ₂₁ , T ₃₁ , T ₄₁ of the terminals T ₂ , T ₃ , T ₄ with respect to the tip portion of the substrate support projecting portion 7 ′, the larger fixing is achieved when a plurality of fixing structures are used in combination. Force is obtained and it is fixed more firmly.

Reference example

Figure 12 (b), the (b), the (c) is, before fixed near the tip of the terminal T ₅ demolding cooling of terminal T _5, each having a fixed portion T ₅₁ b, also after fixation, and high temperature service FIG. 7 is a longitudinal sectional view of the terminal support protrusion 7 ″ at the time. The shape of the protrusion T ₅₁ of the terminal T ₅ is substantially the same shape as the terminal T ₁ of the first embodiment, and the protrusion direction of the terminal support protrusion 7 ″. A rising portion T ₅₁ a arranged along the terminal, a fixing portion T ₅₁ b fixed to the tip end surface 7 a ″ of the terminal support protruding portion 7 ″ with a screw 25, and a terminal whose tip protrudes from the upper surface of the wiring board P It consists of three parts with the connection scheduled part T ₅₁ c. The fixing portion T ₅₁ b of the terminal T ₅ screw insertion hole 26 in which the screw 25 is inserted is formed. As shown in FIG. 12 (b), at the time of demolding cooling, terminal supporting protrusion 7 "height (H _1), the height of the rising portion T ₅₁ a terminal T ₅ by the molding shrinkage (H ₁₀ ) By (D ₀ ).

Therefore, after demolding cooling "of the tip surface 7a 'terminal supporting protrusion 7 to abut against the fixed portion T ₅₁ b of the terminal T _5, the terminal supporting protrusion 7" fixed portion T ₅₁ b with screws 25 When fixed to the distal end surface 7a ″, as shown in FIG. 12 (b), the straight rising portion T _51a of the terminal T ₅ is bent into a substantially arcuate shape and separated from the terminal support protruding portion 7 ″. The state in which the rising portion T _51a of the terminal T ₅ is bent in an arc is during demolding cooling and at a low temperature. When the temperature around the case C increases and becomes high, the state shown in FIG. Thus, the rising portion T ₅₁ a of the terminal T ₅ that has been bent into an arcuate shape is substantially linear. Also in the reference example, the thermal expansion between the rising portion T ₅₁ a of the terminal T ₅ and the terminal support protruding portion 7 ″. and the difference in thermal shrinkage, any influence on the change in the relative position of the terminal connecting portion to be T ₅₁ c for the tip portion of the terminal supporting protrusion 7 " The URN of no structure. In addition, (D ₅₎ in FIG. 12 "expansion of (terminal supporting protrusion 7" in the terminal supporting protrusion 7 at high temperature and low temperature displacement difference of the position of the tip surface 7a 'of) Indicates.

  In the reference example, the terminal support protrusion 7 ″ may be formed in a simple prismatic solid prism shape, so that the mold structure of the portion of the terminal support protrusion 7 ″ of the molding die for resin injection molding the case C There is an advantage that can be easily.

  In any of Examples 1 and 2 and the reference example, the resin material used when the case C is injection-molded is a powdery filler such as non-conductive talc and / or a fibrous filler such as short glass fiber. It is preferable to use one mixed with% to several tens% (wt). When such a resin material is used, the linear expansion coefficient can be reduced in addition to the improvement of the mechanical strength compared to the unfilled material, so that the terminal support protrusions 7, 7 ', 7 " It is not necessary to excessively increase the shape and dimensions, and the amount of expansion / contraction associated with temperature changes can be reduced.

It is a perspective view of the state which removed the upper cover 8 of connector case C of Example 1 of this invention. It is also a plan view. FIG. 3 is a sectional view taken along line XX in FIG. 2. 6 is a half sectional perspective view of a terminal support protrusion 7 of a case C. FIG. It is Q arrow line view of FIG. It is R arrow line view of FIG. It is the YY sectional view taken on the line of FIG. (A), (b) and (c) are respectively cooled when cooled to room temperature after demolding, when the equipment is mounted inside, and when the internal temperature is higher than normal temperature, and when not used It is a longitudinal cross-sectional view of the portion of the terminal support protrusion 7 of the case C when operating at a low temperature below the room temperature during operation. (A), (b), (c), the fixed portion T ₂₁ b of the respective terminal T ₂ through T ₄ having different fixing structure for the terminal supporting protrusions 7 ', T ₃₁ b, only the portion of the T ₄₁ b Table FIG. (A), (b) is a longitudinal sectional view of the terminal support protrusion 7 'that indicates that changes is bent terminal T ₂ in each high temperature and low temperature terminal T ₂ having a fixing portion T ₂₁ b mainly It is. It is ZZ sectional view taken on the line of FIG. (Reference Example) (a), (b), (c) is, prior to fixation of the tip vicinity of the terminal T ₅ after demolding cooling of terminal T _5, each having a fixed portion T ₅₁ b, also after fixation, and high temperature It is a longitudinal cross-sectional view of the terminal support protrusion part 7 '' at the time of use.

Explanation of symbols

C: Connector case (resin injection molded product)
P: wiring board T ₁ through T _5: terminals _{T 11, T 21, T 31} , T 41, T 51: protruding portion T ₁₁ a of the _{terminal, T 21 a, T 31 a} , T 41 a, T 51 a: rising unit T ₁₁ b of the _{terminal, T 21 b, T 31 b} , T 41 b, T 51 b: fixing section T ₁₁ c of the _{terminal, T 21 c, T 31 c} , T 41 c, T 51 c: terminal Terminal connection planned portion T ₁₁ d: Terminal biting portion (fixed portion)
1: Base part of connector case 4: Board support protrusion (wiring board support part)
7, 7 ′, 7 ″: terminal support protrusions 7a, 7a ′, 7a ″: tip surface of the terminal support protrusions

Claims (6)

A resin injection molded product in which at least a part of a terminal made of a metal conductor is integrally embedded in a resin of a resin case in which a device that generates heat during operation with a wiring board is housed,
The resin injection-molded product includes: a base part; a wiring board support part that protrudes integrally from the base part toward the wiring board side and is spaced apart from the board part by a predetermined distance; The terminal support protrusion that integrally protrudes toward the wiring board and is the same height as the wiring board support and supports the terminal is integrally formed from a resin material having a larger linear expansion coefficient than the material of the terminal. ,
The terminal is composed of an embedded portion that is integrally embedded in the base portion and fixed to the base portion at the time of injection molding of a molded product, and a protruding portion that protrudes from the embedded portion toward the wiring board side,
The protrusion rises along the terminal support protrusion and rises from the terminal support protrusion in a non-fixed state and continuously extends from the rising part, and supports the terminal during injection molding of a molded product. A fixed portion that is integrally embedded in the protruding portion and fixed to the terminal support protruding portion; and a connection planned portion that extends from the distal end side of the fixed portion and can be connected to the wiring board,
Due to shrinkage in the protruding direction accompanying cooling of the terminal support protruding portion during injection molding of the resin injection molded product, the rising portion of the terminal is caused to bend between the embedded portion and the fixed portion , It is configured to prevent a change in the relative position of the planned connection portion with respect to the terminal support protruding portion that occurs with contraction,
The tip of the terminal is bent in two opposite directions at a predetermined interval, and the bent portion that connects the rising portion and the planned connection portion is embedded and fixed in the terminal support protruding portion. A resin injection molded product characterized by A resin injection molded product in which at least a part of a terminal made of a metal conductor is embedded,
The resin injection-molded product is formed of a resin material having a larger linear expansion coefficient than the material of the terminal, and is a wiring that can be supported by separating the wiring board by a predetermined distance by projecting integrally from the base portion. A board support part, and a terminal support protrusion part that integrally protrudes from the base part to support the terminal so as to be flush with the wiring board support part toward the wiring board side,
The terminal is composed of an embedded portion embedded in the base portion and a protruding portion that is exposed from the base portion and protrudes toward the wiring board.
The projecting portion of the terminal, the terminal supporting protrusions rising toward the wiring board along a rising portion having a fixing portion fixed to the terminal supporting protrusion to a portion of at least the tip side, wherein Consecutively provided at the tip of the rising portion, and composed of a connection planned portion connectable to the wiring board,
A resin injection-molded article, wherein the terminal fixing portion is formed with a biting portion into which the terminal support protrusion bites. The tip of the terminal is bent in two opposite directions at a predetermined interval, and the bent portion that connects the rising portion and the planned connection portion is embedded and fixed in the terminal support protruding portion. The resin injection molded product according to claim 2 . 4. The resin injection molded product according to claim 1, wherein the rising portion of the terminal is held in a non-attached state with the terminal support protruding portion. The rising portion of the terminal is arcuate at room temperature and separated from the terminal support protrusion, and is displaced in a direction approaching and contacting the side surface of the terminal support protrusion at a high temperature higher than normal temperature. The resin injection molded product according to any one of claims 1 to 4. A terminal support protrusions for supporting the terminal, and the wiring board support portion for supporting the wiring board, claims 1, characterized in that it is integrally formed of the same material as the base portion according to any one of 5 Resin injection molded products.

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