JP3979484B2 - Dicing machine - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a dicing apparatus, and a dicing apparatus for observing the pattern of the wafer surface which displays an image of the wafer surface by imaging, especially the wafer surface with a microscope camera.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there is known a wafer surface observation apparatus that observes the setting of processing standards and processing results by enlarging and imaging a workpiece mounted on a loading table with a microscope camera or the like. Since the display range on the wafer magnified by the conventional wafer surface observation device is limited to a very small area on the wafer, the user operates the axis drive button or joystick to change the observation position. Each axis is driven to move the relative position between the camera and the wafer, and the imaging range of the camera is moved to the target position.
[0003]
[Problems to be solved by the invention]
However, in the wafer surface observation apparatus that moves the observation position on the wafer surface using the conventional axis drive button or joystick as the input means, the input means is a means for inputting a velocity vector, so that it is formed on the wafer surface. There has been a problem that it is difficult to quickly position an observation position with respect to a fine pattern.
[0004]
The present invention has been made in view of such circumstances, and provides a wafer observation position specifying device and a wafer display position specifying method capable of quickly and easily moving a microscope camera to a desired observation position with a single touch. The purpose is that.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides an image pickup means for picking up an image of the surface of a wafer, a display means for displaying an image picked up by the image pickup means, and an arbitrary position displayed by the display means on the display. Shape detection that detects the reference information of the linear street pattern shape formed on the wafer surface based on the input means using the pointing device that specifies the position and inputs the position information and the image picked up by the image pickup means Storage means for storing the reference information of the street pattern shape detected by the shape detection means, and one or more reference positions of the street pattern shape formed on the wafer surface, and the input position the information, based on the reference information, the inputted among the street pattern detected by said shape detecting means located A position closest to the distribution, or a conversion means for converting the position closest to the first to the position information inputted among a plurality of reference positions of the street pattern formed on the wafer surface, the display on the converted position A moving means for moving the position, and after aligning the street pattern shape closest to the position specified by the input means with the center position of the image picked up by the image pickup means, the edge of the wafer is picked up The wafer is moved in the axial movement direction at the time of processing to the position imaged by the means, and in the position after the movement, the street closest to the position designated by the input means aligned with the center position of the image By determining the end position of the pattern shape and rotating it based on the rotation angle calculated from the center position and the end position, It is characterized by performing a manual alignment of adjusting in parallel by a manual operation of the moving direction at the time of processing and street pattern formed on the wafer surface.
[0006]
According to the present invention, an image pickup means for picking up an image of the surface of a wafer, a display means for displaying an image picked up by the image pickup means, and an arbitrary position displayed by the display means is designated as a position on the display. Input means for inputting position information, conversion means for converting the input position information into position information on the wafer surface, and movement means for moving a display position based on the converted position information on the wafer surface. Since the display means displays the image at the display position after the movement, it is possible to quickly move to the desired display position with a single touch.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of a dicing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0008]
Figure 1 is a perspective view of a holder Ishingu apparatus involved in the present invention, FIG. 2 is a plan view thereof.
[0009]
The dicing apparatus observes the surface of the wafer (work) W, cuts the wafer W in a direction orthogonal thereto, and finally cuts the cut wafer 10 like a grid, and cleans the cut wafer W. The cleaning unit 20, the cassette unit 30 for storing the wafer W before and after processing, and the wafer W before processing are pulled out from a desired position of the cassette unit 30 and pre-aligned on the stage, and set on the stage. The elevator unit 40 stores the processed wafer W in a desired position of the cassette unit 30 and the transfer device 50 that transfers the wafer through the above steps.
[0010]
As shown in FIG. 2, there are four positions P1, P2, P3, and P4 as the transfer positions of the wafer W by the transfer apparatus 50, and these positions P1 to P4 are arranged so as to be located at the vertices of the square. Has been. The position P1 is a position for preloading the wafer W, the position P2 is a position for loading and unloading the wafer W on the cutting table for transporting the wafer W to the cutting unit 10, and the position P3 is a spinner table for the cleaning unit 20. The position P4 is a position where the wafer W before processing is loaded and the wafer W after processing (after cleaning) is unloaded.
[0011]
The cutting unit 10 includes two spindles 16A and 16B provided with blades 14A and 14B, imaging means 18 and 19 for fine alignment by imaging a pattern on the wafer W and recognizing the image, and the captured image and various types. The display unit 12 includes information display and an input unit 11 represented by a touch panel. The spindles 16A and 16B and the imaging means 18 and 19 of the cutting unit 10 are movable in the directions of arrows A and B (Y-axis direction) in FIG. Further, since the cutting table on which the wafer W is mounted is movable in the directions of arrows C and D (X-axis direction) and is rotatable (θ direction), the surface of the wafer W is imaged and image processing is performed. Fine alignment for cutting can be performed.
[0012]
The wafer W finely aligned in this manner is cut by the blades 14A and 14B rotated by the spindles 16A and 16B as the cutting table moves. Then, by sequentially executing the above cutting, the wafer W is cut like a grid.
[0013]
The cleaning unit 20 cleans the cut wafer W. First, the spinner table on which the wafer W is mounted is lowered, cleaned with a spinner and clean water, dried by air blow after cleaning, and again the spinner table. To raise.
[0014]
Further, the transfer device 50 is attached to a slide arm that is movably attached to a rail guided in the Y-axis direction, a revolving arm that is turnably attached to the tip of the slide arm, and an end of the revolving arm. It is composed of a plurality of chuck portions. The slide arm is moved in the front-rear direction along the rail by a motor, and the position of the tip of the slide arm moves between the position P2 and the position P3. The turning arm is turned around its end by a motor, and the end of the turning arm is moved to positions P1, P2, P3 and P4 according to the position of the slide arm. The chuck portions are rotatably provided at the end portions of the swing arms, respectively, and hold the wafer W by four claws that move in the radial direction and the vertical direction.
[0015]
FIG. 3 shows a block diagram of the information processing unit of the dicing apparatus.
[0016]
According to the figure, in the information processing section of the dicing device, the input means 11 for the user to input commands such as start, stop, and movement of the observation position to the dicing device, and the dicing device processes the user. The display means 12 which displays the image which imaged the mode, the process condition, and the wafer surface, and the imaging means 18 and 19 are provided.
[0017]
In the information processing section of the dicing apparatus, the driving means X100 for driving the cutting table on which the wafer W is mounted in the X-axis direction, the spindles 16A and 16B and the imaging means 18 and 19 of the cutting section 10 are moved in the Y-axis direction. Driving means Y102 for driving, spindles 16A and 16B of the cutting section 10 and driving means Z104 for moving the imaging means 18 and 19 in the Z-axis direction, and driving means θ106 for rotationally driving the cutting table on which the wafer W is mounted in the θ direction. And the like, the control means 110 for outputting a drive command to each of the drive means and monitoring the drive position, drive speed and error information as necessary, the input means 11, the display means 12, and the image pickup means. 18, 19 and information for transmitting / receiving information to / from the control means 110 and controlling the entire dicing apparatus. And information processing means 112.
[0018]
The information processing unit 112 receives position information on a screen where a user inputs a position desired to move with respect to an image of the wafer surface displayed by the display unit 12, and the input position information Function of converting means for converting the position information of the wafer surface, function of moving means for moving the display position based on the converted position information of the wafer surface, and moving the display position to the reference position of the pattern shape of the wafer And a function of a moving means. Further, the information processing means 112 includes a function of a shape detecting means for detecting reference information of a street pattern shape formed on the wafer surface, and a storage means such as a hard disk or a nonvolatile memory for storing the reference information. Yes.
[0019]
Further, the information processing means 112 receives position information on the screen where the user inputs a position desired to move with respect to the image of the wafer surface displayed by the display means 12, and receives the position information on the most inputted position information. Function of position calculation means for calculating the position or reference position of the street pattern shape on the display existing at a close position, and the reference information of the street shape in which the storage means stores the information on the calculated street position on the display The function of the conversion means which converts into the positional information on the wafer surface based on is also provided.
[0020]
FIG. 4 shows a flowchart of a standard wafer W alignment model registration process by the dicing apparatus.
[0021]
When registration of the alignment model of the wafer W is required during the cutting process of the wafer W by the dicing apparatus, the processing program of the information processing means 112 is “step S100” of the alignment model registration processing routine shown in FIG. “Register Model” (hereinafter abbreviated as S100) is called. Then, the process proceeds to the next S102 “workload”.
[0022]
In S102, the elevator unit 40 sequentially pulls out the unprocessed wafers W stored in the cassette unit 30 and sets the wafers W at a position P4 shown in FIG. Then, the wafer W is placed on the work table (position P2) (not shown) by the transfer device 50 via the preload stage at the position P1, and is sucked and held.
[0023]
Here, the pattern of the surface of the wafer W transferred to the work table and held by suction is picked up by the image pickup means 18 or 19 that has automatically moved to the center of the work table and displayed on the display means 12. The image is recognized by the means 112. Then, the process proceeds to the next S104 “manual θ alignment”.
[0024]
In S104, the θ axis is aligned so that the street of the workpiece is parallel to the X axis. At this time, an instruction for rotational input of the θ-axis is performed according to the following procedure.
[0025]
The center of the imaging means 18 or 19 is aligned with the street edge or the like near the work center on the CH1 side (first channel indicating an axis parallel to the X axis) and registered in the internal memory of the information processing means 112 (center position is determined). According to the present invention, the display position designation method (“alignment method”) for aligning the center of the imaging means 18 or 19 with the street edge or the like in the vicinity of the center of the work is as follows. Simply touch the top position with your finger to specify.
[0026]
FIG. 5 shows the display contents of the initial display displayed on the display means 12, and FIG. 6 shows the display contents displayed in the direct touch mode.
[0027]
According to FIG. 5, the display unit 12 includes a start button 120 for inputting start of operation of the dicing apparatus, a stop button 122 for inputting stop of operation, and focus adjustment for adjusting the focus of the imaging units 18 and 19. A button 124, an illumination adjustment button 126 for adjusting the illumination brightness during imaging, an XY key 128 for inputting a movement vector when moving the imaging position, and a desired position (position on the display) of the displayed wafer W ) With a finger and a direct touch movement button 130 for instructing switching to a mode for specifying and matching.
[0028]
FIG. 6 shows a display that transitions when the direct touch movement button is pressed in the state of FIG. As shown in the figure, the display unit 12 newly displays a cancel button 132 for inputting an instruction to exit the direct touch movement mode and a wafer map display 134 indicating the entire shape of the wafer W. Instead of performing the wafer map display 134, an enlarged image obtained by imaging may be displayed.
[0029]
FIG. 7 shows a flowchart describing a method for designating a display position by screen touch.
[0030]
When the dicing device is set to the direct touch mode, the processing program of the dicing device is called by the processing routine shown in the moving diagram, and the process branches to step S200 “Start processing by screen touch”.
[0031]
When the user touches a desired position to move with the finger, the processing program proceeds to the next step S202 “Acquire touch coordinates (pixel size) (X coordinates / Y coordinates)”. In S202, the input position information on the screen of the touch panel (input means 11) (position information such as a pixel on the screen or a coordinate value based on the resolution of the touch panel) is processed via the communication means of the input means 11 as information processing means. 112, the information processing means 112 acquires touch coordinates.
[0032]
In the next step S204 “Convert touch coordinates into coordinates (pulse coordinates) of the dicer apparatus”, the information processing means 112 of the dicing apparatus converts the received position information into position information (the actual length of the wafer W being displayed). Unit or the number of driving unit pulses used for driving by the driving means). Here, the position information on the display is automatically converted according to the wafer size (size or shape such as 5 inches, 8 inches, etc.), so the user can use the same operation method without being conscious of the wafer size. It is sufficient to input the position.
[0033]
In the next step S206 “Calculate the relative amount (movement amount) of the current pulse coordinate of the dicer apparatus and the pulse coordinate converted above”, the information processing means 112 uses the converted position information of the surface of the wafer W as the X-axis, Y-axis, for example. It is converted into a relative driving amount (length information or driving pulse number of each axis) with respect to the current video position of the axis.
[0034]
In the next step S208 “output the movement amount of the X-axis motor and the movement amount of the Y-axis motor described above to each axis driver.”, The information processing means 112 outputs the information about the calculated driving amount to the control means 110. Perform the process.
[0035]
In the next S210 “Axis movement start & stop”, the control unit 110 sets acceleration conditions, deceleration conditions and driving speed conditions based on the received driving amount information, and drives each axis in synchronization. The control means 110 monitors the driving state of each axis and controls the driving speed of each axis. When the driving to the position designated by the information processing unit 112 is completed, the control unit 110 returns a response indicating that the driving is completed to the information processing unit 112.
[0036]
The position information on the screen input by the user is generally different from accurate street position information (position of a predetermined pattern shape) for reasons such as using a finger for input. In the dicing apparatus, for the purpose of use, when the position of the surface of the wafer W is designated, the street position is almost always designated. Therefore, in the present invention, even when an ambiguous position is designated, it exists in the vicinity obtained by image processing. The display position is moved to a reference position such as a street position.
[0037]
The position information on the screen input by the user is the position closest to the street shape detected by the shape detection function of the information processing means 112 or the pattern shape formed on the wafer surface stored in the storage means. It is converted to a position closest to one or more reference positions, and a command for driving to that position is output to the control means 110. Then, the display position is driven to a position where the street closest to the position input by the user exists.
[0038]
When the drive to the designated position is completed, the program of the information processing means is S212 “Reflecting the X and Y coordinate positions after movement on the screen. Camera image screen: Redisplaying the + character at the camera center Wafer map display screen: Camera Proceeding to "Redisplay icon", when the driving of each driving means is completed, the display means 12 displays the wafer surface at the designated display position. When the wafer map display 134 is displayed again, the camera icon indicating the imaging position is also displayed again. In addition, when displaying a captured enlarged image, a + mark is displayed at the imaging center position of the imaging means. In the case where the captured image has a wide imaging range and high resolution, the display position is determined using only the captured image data, instead of performing driving for moving the display position by the driving means. You may move.
[0039]
When the driving to the designated position and the redisplay are completed, the processing program proceeds to S214 “End processing” and returns to the original processing routine.
[0040]
As described above, when the “alignment” process by direct touch that moves the driving or display of the center of the imaging means 18 or 19 to the street edge near the center of the workpiece is completed, the X axis automatically moves to the left of the workpiece ( Or right) Move to the end position. Next, it is aligned with the edge of the same street as the position designated by the center position by direct touch, and the left (right) position is determined. Then, the rotation angle of the θ axis is calculated from the coordinates of the center position and the left (right) position, and the θ axis rotates and moves based on the angle.
[0041]
After the left (right) position is determined, the X axis automatically moves near the opposite work edge. Thereafter, similarly, the center of the imaging means 18 or 19 is aligned with the street edge by direct touch. After the right (left) position is determined, the rotation angle of θ is automatically calculated and the θ axis is rotated. The X axis automatically moves to the position on the opposite side of the workpiece. This process is repeated until the X axis and the street are parallel, and at the end of the scanning operation, the θ coordinate at this time is recorded in the internal memory.
[0042]
Thereafter, the θ-axis is automatically rotated by 90 °, and a state of waiting for an input of manual θ-alignment on the CH2 side (second channel indicating an axis perpendicular to the X-axis) is entered. Similarly, street and X-axis alignment is performed by direct touch to complete the operation of S104.
[0043]
In the next S106 “CH1 street cross position registration”, after θ alignment, the mode automatically switches to the model registration mode and moves to the vicinity of the imaging means work center. The process of aligning the imaging means 18 or 19 at the intersection (cross position) of the streets of both channels is performed by direct touch and registered.
[0044]
In the next S108 “CH1 first (high magnification) model registration”, after the cross position registration, the mode is switched to the model pattern input mode, and the model frame is displayed on the screen. The process of aligning the position of the model frame with the position deemed appropriate is performed by direct touch and registered.
[0045]
In the next S110 “CH2 second (low magnification) model registration”, the imaging magnification of the imaging means 18 or 19 is automatically switched to the low magnification, and the model registration is performed using the direct touch method as in the high magnification model. . After registration, the θ axis automatically rotates 90 °, and the imaging means 18 or 19 moves to the vicinity of the center of the workpiece.
[0046]
In the next S112 “CH2 street cross position registration”, the imaging magnification of the imaging means 18 or 19 is automatically switched to a high magnification, and as with CH1, a street intersection is registered as a cross position using a direct touch method.
[0047]
In the next S114 “CH2 first (high magnification) model registration”, the screen automatically switches to the model registration mode as in CH1, and registration of the CH2 side high magnification model is performed using the direct touch method. The procedure is the same as CH1.
[0048]
When the “CH2 first (high magnification) model registration” process is completed in S114, the process proceeds to S116 “model registration end”, and the alignment model registration process ends.
[0049]
When the alignment model of the wafer W is registered as described above, the alignment process is performed as follows and the cutting process is performed.
[0050]
The street pattern of the wafer W sucked and held on the work table is picked up by the image pickup means 18 and 19 and displayed on the display means 12, and image recognition is performed by the information processing means 112. Pattern matching processing is performed based on this image information and a reference pattern registered in advance in the storage means, and streets are detected to adjust cutting alignment. Then, the wafer W whose alignment has been adjusted has two streets at the same time due to the movement in the Y-axis direction indicated by arrows A and B shown in FIG. 2 and the movement in the X-axis direction indicated by arrows C and D on the work table. Disconnected. When the first two streets are cut, the spindles 16A and 16B of the cutting unit 10 move in the Y-axis direction by the street pitch. Then, the work table moves again in the X-axis direction, whereby the next two streets are cut. This cutting operation is repeated to cut a predetermined street in one direction (X direction).
[0051]
When the cutting of the predetermined street is completed, the cut groove is imaged by the imaging means 18 or 19, and the kerf check of the groove is automatically performed. In the kerf check, cutting results such as the degree of chipping (chip) of the cutting groove wall and the positional deviation of the cutting groove with respect to the street are inspected. When the chipping is large or the cutting groove is greatly deviated from the street, an operator call for notifying the user of the malfunction is performed. If the cutting groove is slightly shifted from the original groove, correct the cutting position automatically, or if the chipping is slightly observed, correct the cutting conditions. Thereafter, cutting is continued a predetermined number of times. Even in the case where the kerf check is performed manually, if the direct touch method is used as means for moving the display position to a desired observation position, the kerf check operation can be performed quickly.
[0052]
When all the streets in one direction (X direction) are cut, the work table is rotated 90 °, and the streets in the direction orthogonal to the cut streets are sequentially cut. Thereby, the wafer W is finally cut into a grid pattern.
[0053]
The wafer W that has been cut is returned to the position P2 by the work table, and then transferred to the spinner table of the cleaning unit 2 at the position P3 by the transfer device 50. And after washing | cleaning with washing water here, it dries by air blow. The wafer W that has been cleaned and dried is transferred to the position P4 by the transfer device 50, and then stored in the cassette unit 30 by the elevator unit 40.
[0054]
【The invention's effect】
As described above, according to the dicing apparatus of the present invention, the imaging unit that images the surface of the wafer, the display unit that displays the image captured by the imaging unit, and the arbitrary display that the display unit displays Input means using a pointing device that inputs position information by specifying the position on the display, and detects linear street pattern shape information formed on the wafer surface based on the image captured by the imaging means A shape detection unit that stores the reference information of the street pattern shape detected by the shape detection unit, and one or more reference positions of the street pattern shape formed on the wafer surface, and the input scan stored a reference position of the street pattern in the storage means present at a position closest to the position information Position calculating means for calculating, based on the reference information of the discrete pattern, the positional information inputted by specifying at a location on the display, and the calculated reference position and the wafer surface street pattern on the display Since conversion means for converting into position information and movement means for moving the display position based on the converted position information on the wafer surface are provided, it is possible to quickly move to a desired display position with one touch. Become.
[Brief description of the drawings]
1 is a perspective view of a dicing apparatus to which the present invention is applied. FIG. 2 is a plan view of a dicing apparatus to which the present invention is applied. FIG. 3 is a block diagram of an information processing unit of the dicing apparatus. Flowchart of alignment model registration process for wafer W [FIG. 5] A diagram showing display contents of initial display displayed on display means [FIG. 6] A diagram showing display contents displayed in direct touch mode [FIG. 7] A screen touch Flow chart showing how to specify the display position by [Description of sign]
DESCRIPTION OF SYMBOLS 10 ... Cutting part, 18, 19 ... Imaging means, 20 ... Washing part, 30 ... Cassette part, 40 ... Elevator part, 100 ... Driving means X, 102 ... Driving means Y, 104 ... Driving means Z, 106 ... Driving means θ , 110 ... control means, 112 ... information processing means, 130 ... direct touch movement button

Claims (2)

Imaging means for imaging the surface of the wafer;
Display means for displaying an image captured by the imaging means;
An input means using a pointing device for designating an arbitrary position displayed by the display means by a position on the display and inputting position information;
Shape detection means for detecting reference information of a linear street pattern shape formed on the wafer surface based on an image taken by the imaging means;
Storage means for storing street pattern shape reference information detected by the shape detection means and one or more reference positions of the street pattern shape formed on the wafer surface;
Based on the reference information, the input position information is a position closest to the input position information among the street pattern shapes detected by the shape detection means, or a street pattern shape formed on the wafer surface Conversion means for converting to a position closest to the input position information among one or a plurality of reference positions;
Moving means for moving the display position to the converted position;
After aligning the street pattern shape closest to the position specified by the input means to the center position of the image picked up by the image pickup means, the wafer edge is moved to the position picked up by the image pickup means. Move in the axial movement direction at the time of processing, and determine the end position of the street pattern shape closest to the position designated by the input means matched with the center position of the image at the position after the movement; Manual alignment that adjusts the street pattern shape formed on the wafer surface and the movement direction during processing in parallel by manual operation by rotating based on the rotation angle calculated from the center position and the end position. The dicing apparatus characterized by performing.   The conversion means, when the input position information is a position where a wafer does not exist, converts the position information into a position information of a wafer existing closest to the input position. Item 2. The dicing apparatus according to Item 1.

Images