JP3979697B2

JP3979697B2 - Component mounting substrate and manufacturing method thereof

Info

Publication number: JP3979697B2
Application number: JP07636097A
Authority: JP
Inventors: 英信西川; 浩一熊谷; 隆広松尾
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1997-03-28
Filing date: 1997-03-28
Publication date: 2007-09-19
Anticipated expiration: 2017-03-28
Also published as: JPH10270810A

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体素子等の電子部品を実装するための部品実装用基板およびその製造方法に関するものである。
【０００２】
【従来の技術】
従来から、テレビ受信機などの家電製品を含む電子機器では、金属製の基板からなる配線用パターン部を有する部品実装用基板を用いて、その配線用パターン部に電子回路に対応させて電子部品を実装して金属立体配線モジュールを形成し、その金属立体配線モジュールを絶縁基板上に貼り付けて構成した電子回路基板が広く利用されている。
【０００３】
上記のように金属立体配線モジュールを形成する際に用いる従来の部品実装用基板について、その使用状態を示す一構成例を挙げて説明する。
図６は従来の部品実装用基板の使用状態の一例を示す構成図である。図６において、金属製の平面基板で作成した配線用パターン部６０を有する部品実装用基板６１を用い、その部品実装用基板６１上に、例えばテレビ受信機などの電子回路を構成する複数の電子部品６２を実装し、それらの電子部品６２間を部品実装用基板６１上の配線用パターン部６０で接続して配線することにより、金属立体配線モジュール６３を形成し、その金属立体配線モジュール６３を絶縁基板６４上に貼り付けて電子回路基板６５を構成している。このようにして部品実装用基板６１上に実装された複数の電子部品６２のうち、作動中に熱を発生するような例えば大容量トランジスタなどの電子部品６２ｈに対しては、その発生熱を放熱するために、この電子部品６２ｈの発生熱に対応した放熱容量をもつ放熱器６６を、当該電子部品６２ｈに取り付けビス６７や接着剤により取り付けて用いている。
【０００４】
なお、部品実装用基板６１の配線用パターン部６０は、金属製の平面基板を用いて、例えば打ち抜き工法などにより作成される。
【０００５】
【発明が解決しようとする課題】
しかしながら上記のような従来の部品実装用基板では、作動中に熱を発生するような実装部品である大容量トランジスタなどの電子部品６２ｈに対しては、その発生熱を放熱するために、この部品実装用基板６１とは別部品であり当該電子部品６２ｈの発生熱に対応した放熱容量をもつ放熱器を当該電子部品６２ｈに取り付けて用いる必要があり、このような電子部品６２ｈの実装数に応じて多くの放熱器６６を部品実装用基板６１に対して別途供給しなければならないという問題点を有していた。
【０００６】
そのため、生産品の構成部品としての点数が増加し、生産工程において、部品実装に必要な工数の増大や部品実装工程における作業性の悪化および部品管理の繁雑化などにより、生産工程全体の作業工数も増大しその作業効率が低下するという問題点も有していた。
【０００７】
また、この部品実装用基板６１に対して放熱器６６が別部品として別途供給され、これらの放熱器６６の固定方法としては、放熱器６６を取り付けビス６７や接着剤などにより当該電子部品６２ｈのみに固定するか当該電子部品６２ｈおよび部品実装用基板６１の両方に固定するかなどがあるが、機械的な振動など外力に対して、前者の場合は当該電子部品６２ｈの破損につながり、後者の場合でも、その固定力が時間経過と共に弱くなり、結果的に、生産品の機械的振動に対する信頼性が低下するという問題点をも有していた。
【０００８】
本発明は、上記従来の問題点を解決するもので、実装部品内における発生熱を、その放熱のための部品である放熱器を別途供給して用いることなく且つその放熱効果の低下を抑えて放熱することができるとともに、部品点数を削減し部品実装工程における作業性を改善することができ、さらに機械的振動に対する信頼性を向上することができる部品実装用基板およびその製造方法を提供する。
【０００９】
【課題を解決するための手段】
上記の課題を解決するために、本発明の部品実装用基板およびその製造方法は、金属製の基板により配線用パターン部と一体的に成形して配線用パターン部面から曲げ起こした金属板部を、配線用パターン部への実装部品内における発生熱を放熱するための放熱器として利用可能とすることを特徴とする。
【００１０】
以上により、実装部品内における発生熱を、その放熱のための部品である放熱器を別途供給して用いることなく且つその放熱効果の低下を抑えて放熱することができるとともに、部品点数を削減し部品実装工程における作業性を改善することができ、さらに機械的振動に対する信頼性を向上することができる。
【００１１】
【発明の実施の形態】
本発明の請求項１に記載の部品実装用基板は、金属製の基板により形成された配線用パターン部を有し、その配線用パターン部に電子回路を構成する複数の電子部品が実装され、それらの電子部品間を前記配線用パターン部により接続して配線する部品実装用基板であって、前記配線用パターン部を形成する金属製基板により、前記配線用パターン部と一体的に成形した金属板部を備え、前記金属板部を、前記配線用パターン部面に対する曲げ起こし加工により、作動中に発熱する前記電子部品の放熱用として用いられるように構成し、曲げ起こし状態の金属板部に、その放熱対象である電子部品に対する放熱効果を増大させるように、前記金属板部をさらに屈曲させてフィン形状の折り曲げ部を形成する。
【００１２】
請求項２に記載の部品実装用基板は、金属製の基板により形成された配線用パターン部を有し、その配線用パターン部に電子回路を構成する複数の電子部品が実装され、それらの電子部品間を前記配線用パターン部により接続して配線する部品実装用基板であって、前記配線用パターン部を形成する金属製基板により、前記配線用パターン部と一体的に成形した金属板部を備え、前記金属板部を、前記配線用パターン部面に対する曲げ起こし加工により、作動中に発熱する前記電子部品の放熱用として用いられるように構成し、曲げ起こし状態の金属板部に、その放熱対象である電子部品に対する放熱効果を増大させるように、前記金属板部とは別部材で形成した複数のフィン状体を取り付けた構成とする。
【００１３】
請求項３に記載の部品実装用基板は、金属製の基板により形成された配線用パターン部を有し、その配線用パターン部に電子回路を構成する複数の電子部品が実装され、それらの電子部品間を前記配線用パターン部により接続して配線する部品実装用基板であって、前記配線用パターン部を形成する金属製基板により、前記配線用パターン部と一体的に成形した金属板部を備え、前記金属板部を、前記配線用パターン部面に対する曲げ起こし加工により、作動中に発熱する前記電子部品の放熱用として用いられるように構成し、曲げ起こし状態の金属板部に、その放熱対象である電子部品に対する放熱効果を増大させるように、前記金属板部とは別部材で形成した複数のピン状体を取り付けた構成とする。
【００１４】
請求項４に記載の部品実装用基板は、請求項１に記載の曲げ起こし状態の金属板部に、その放熱対象である電子部品に対する放熱効果を増大させるように、前記金属板部とは別部材で折り曲げ加工により形成したフィン形状の折り曲げ部を有する折り曲げフィンを取り付けた構成とする。
【００１６】
請求項５に記載の部品実装用基板の製造方法は、金属製の基板により、電子回路を構成する複数の電子部品が実装され前記複数の電子部品間を接続して配線する配線用パターン部を形成するに際し、作動中に発熱する前記電子部品の放熱用として用いるために、前記配線用パターン部面に対して曲げ起こし加工される金属板部を、前記金属製基板により前記配線用パターン部と一体的に成形し、金属板部を曲げ起こし状態とし、その金属板部の放熱対象である電子部品に対する放熱効果を増大させるように、前記金属板部をさらに屈曲させてフィン形状の折り曲げ部を前記金属板部に形成する方法とする。
【００１８】
請求項６に記載の部品実装用基板の製造方法は、金属製の基板により、電子回路を構成する複数の電子部品が実装され前記複数の電子部品間を接続して配線する配線用パターン部を形成するに際し、作動中に発熱する前記電子部品の放熱用として用いるために、前記配線用パターン部面に対して曲げ起こし加工される金属板部を、前記金属製基板により前記配線用パターン部と一体的に成形し、金属板部を曲げ起こし状態とし、その金属板部の放熱対象である電子部品に対する放熱効果を増大させるように、前記金属板部とは別部材で形成した複数のフィン状体を前記金属板部に取り付ける方法とする。
【００１９】
請求項７に記載の部品実装用基板の製造方法は、金属製の基板により、電子回路を構成する複数の電子部品が実装され前記複数の電子部品間を接続して配線する配線用パターン部を形成するに際し、作動中に発熱する前記電子部品の放熱用として用いるために、前記配線用パターン部面に対して曲げ起こし加工される金属板部を、前記金属製基板により前記配線用パターン部と一体的に成形し、金属板部を曲げ起こし状態とし、その金属板部の放熱対象である電子部品に対する放熱効果を増大させるように、前記金属板部とは別部材で形成した複数のピン状体を前記金属板部に取り付ける方法とする。
【００２０】
請求項８に記載の部品実装用基板の製造方法は、請求項５に記載の金属板部を曲げ起こし状態とし、その金属板部の放熱対象である電子部品に対する放熱効果を増大させるように、前記金属板部とは別部材で折り曲げ加工により形成したフィン形状の折り曲げ部を有する折り曲げフィンを前記金属板部に取り付ける方法とする。
【００２１】
これらの構成および方法によると、金属製の基板により配線用パターン部と一体的に成形して配線用パターン部面から曲げ起こした金属板部を、配線用パターン部への実装部品内における発生熱を放熱するための放熱器として利用可能とする。
【００２２】
以下、本発明の実施の形態を示す部品実装用基板およびその製造方法について、図面を参照しながら具体的に説明する。
図１は本実施の形態の部品実装用基板を用いた金属立体配線モジュールの構成を示す斜視図である。図１に示すように、この金属立体配線モジュールに用いられる部品実装用基板Ｋ１は、金属製の基板により形成された配線用パターン部１００を有し、その配線用パターン部１００に電子回路を構成する複数の電子部品１０１が実装され、それらの電子部品１０１間を金属製の配線用パターン部１００により接続して配線するように構成されている。そして、この部品実装用基板Ｋ１は、配線用パターン部１００を形成する基板と同一の金属製基板により、配線用パターン部１００と一体的に成形した金属板部１０２ａを備えており、その金属板部１０２ａは、配線用パターン部１００面に対して矢印Ｙ１で示すように曲げ起こし加工することにより、複数の電子部品１０１のうち作動中に発熱する大容量トランジスタなどの電子部品の放熱用である放熱用金属板部１０２として用いられる。
【００２３】
以上のように構成される部品実装用基板Ｋ１は、金属製の基板により、複数の電子部品１０１が実装される配線用パターン部１００を形成する際に、上記の大容量トランジスタなどの放熱用である放熱用金属板部１０２として用いるために配線用パターン部１００面から曲げ起こし加工される金属板部１０２ａを、配線用パターン部１００と一体的に成形する方法を用いて製造される。
【００２４】
以上のようにして製造された部品実装用基板Ｋ１において、その配線用パターン部１００などの必要な部分に補強用シート１０３を貼り付けた状態で半田印刷し、その後、配線用パターン部１００面の半田印刷部分に電子部品１０１を自動装着して実装し、金属板部１０２ａを矢印Ｙ１に示すように折り曲げ加工することにより、図１に示すような金属立体配線モジュールが製造される。
【００２５】
図１に示す金属立体配線モジュールの具体的な製造方法について、その製造工程の一例を用いて以下に説明する。
図２は本実施の形態の部品実装用基板を用いた金属立体配線モジュールの製造方法の一例を示す工程説明図であり、図３は図２に示す製造工程のＡ点における部品実装用基板Ｋ１の平面図である。ただし、図２に示す全ての製造工程により、そのＢ点である最終点では通常、図１に示すように、すでに配線用パターン部１００に複数の電子部品１０１が実装された状態の金属立体配線モジュールが製造される。
【００２６】
図２に示すように、全製造工程の前半である部品実装用基板Ｋ１の製造工程において、ステップ＃１では、ロール状に巻かれた金属製の原板２０２に対して、図１に示す配線用パターン部１００として必要な配線パターンが形成されるように打ち抜き加工する。この打ち抜きの際に、金属板部１０２ａも配線用パターン部１００と同時に一体的に成形する。また、このステップでは、配線用パターン部１００の各配線パターンがばらけないように、それらの配線パターン間および配線用パターン部１００と外周部２００との間につなぎ部２０１を形成する。ここでは、金属製の原板２０２として、例えば、板幅が２〜７ｃｍで板厚が０．１〜０．５ｍｍのリン青銅などが用いられる。
【００２７】
ステップ＃２では、ロール状に巻かれた樹脂製のシート２０３を、ステップ＃１で打ち抜いた配線用パターン部１００を覆う補強用シート１０３として、配線用パターン部１００面に貼り付ける。ここでは、樹脂製シート２０３として、例えば、絶縁抵抗が１０¹⁰オームを超え耐熱が２６０℃×３０秒を超え厚みが０．０５ｍｍ未満で紙基材により形成され、ＵＶ光や熱などの照射により硬化するＵＶ・熱硬化樹脂などが用いられる。
【００２８】
ステップ＃３では、ステップ＃１で形成したつなぎ部２０１を切断して、配線用パターン部１００を外周部２００から分離し、部品実装用基板Ｋ１の原形を作成し、ステップ＃４では、ステップ＃２で補強用シート１０３として配線用パターン部１００面に貼り付けた樹脂製シート２０３を、さらに圧着した後にＵＶ光や熱などを照射して硬化させる。
【００２９】
このようにして進められた製造工程におけるＡ点では、図３に示すように、配線用パターン部１００および金属板部１０２ａに補強用シート１０３が貼り付けられた部品実装用基板Ｋ１が製造され、次に、全製造工程の後半である部品実装工程に進められる。
【００３０】
この部品実装工程において、ステップ＃５では、配線用パターン部１００に対して、その必要箇所に電子部品１０１を配線用パターン部１００面に接着するための導電性接着剤やクリーム半田などを印刷し、ステップ＃６では、配線用パターン部１００に対して、その配線パターン面に電子部品１０１を装着することにより、それらの電子部品１０１を、ステップ＃５で印刷した導電性接着剤やクリーム半田などによって接着して実装する。ここでは、電子部品１０１の装着装置として、例えば、電子部品１０１を一点毎に装着するロボットタイプ装着装置や電子部品１０１を何点か一括して装着する一括装着装置などが用いられる。
【００３１】
ステップ＃７では、ステップ＃６で電子部品１０１を実装した部品実装用基板Ｋ１に対して、加熱することによりリフローを行い、ステップ＃５で印刷した導電性接着剤を硬化させたりクリーム半田を溶融させて、ステップ＃６で実装した電子部品１０１を配線用パターン部１００に固着する。ここでは、部品実装用基板Ｋ１への加熱方式として、例えば、瞬間リフロー用のプリヒートレス方式やトラブル時の焼け防止用の瞬間加熱停止方式や赤外線により部分的に加熱する赤外線部分加熱方式などが用いられる。
【００３２】
ステップ＃８では、ステップ＃７でのリフローが終了した部品実装用基板Ｋ１の金属板部１０２ａに対して曲げ起こし加工して、配線用パターン部１００と一体構造の放熱用金属板部１０２を形成する。
【００３３】
このようにして、図１に示す金属立体配線モジュールが製造される。
以上のようにして製造される金属立体配線モジュールの使用状態について、その使用状態例を用いて以下に説明する。
【００３４】
図４は本実施の形態の部品実装用基板を用いた金属立体配線モジュールにおける放熱用金属板部の形状を示す断面構成図である。
図４（ｂ）に示すように、放熱用金属板部１０２は、部品実装用基板Ｋ１の構成要素である配線用パターン部１００と一体的に成形された金属板部１０２ａを矢印Ｙ２のように曲げ起こしして形成される。
【００３５】
このようにして形成された放熱用金属板部１０２を有する部品実装用基板Ｋ１に対して、図２に示す製造工程の部品実装工程に従って電子部品実装などが行われ、最終的に製造された金属立体配線モジュールは、図４（ａ）に示すように、絶縁基板４００に貼り付けられて電子回路基板Ｋ２を構成する。
【００３６】
この電子回路基板Ｋ２において、その放熱用金属板部１０２には、図４（ａ）に示すように、放熱対象である例えば作動中の発熱量の大きな大容量トランジスタなどの電子部品１０１ｈが、放熱用金属板部１０２の表面に密着するように、取り付けビス４０１などによって取り付けられる。
【００３７】
以上により、実装部品内における発生熱を、その放熱のための部品である放熱器を別途供給して用いることなく且つその放熱効果の低下を抑えて放熱することができるとともに、部品点数を削減し部品実装工程における作業性を改善することができ、さらに機械的振動に対する信頼性を向上することができる。
【００３８】
なお、上記の実施の形態の部品実装用基板において、図５（ａ）に示すように、配線用パターン部５００から曲げ起こしした放熱用金属板部５０１に、その放熱用金属板部５０１とは別部材で形成した複数のフィン状体５０２を取り付けることにより、それらの放熱対象である電子部品に対する放熱効果を増大させることができる。この複数のフィン状体５０２は、放熱用金属板部５０１と同様な放熱効果を有する金属であれば、放熱用金属板部５０１と同種金属でも異種金属でもどちらでもよく、それらの取り付け方法としては、例えば半田付けや溶接や接着剤による接着などが挙げられ、放熱用金属板部５０１およびフィン状体５０２の材料の組み合わせによって適切な方法を用いればよい。
【００３９】
また、図５（ｂ）に示すように、配線用パターン部５０３から曲げ起こしした放熱用金属板部５０４に、その放熱用金属板部５０４を折り曲げ加工によりさらに屈曲させてフィン形状の折り曲げ部５０５を形成することにより、それらの放熱対象である電子部品に対する放熱効果を増大させることができる。
【００４０】
また、図５（ｃ）に示すように、配線用パターン部５０６から曲げ起こしした放熱用金属板部５０７に、その放熱用金属板部５０７とは別部材で形成した複数のピン状体５０８を取り付けることにより、それらの放熱対象である電子部品に対する放熱効果を増大させることができる。この複数のピン状体５０８は、放熱用金属板部５０７と同様な放熱効果を有する金属であれば、放熱用金属板部５０７と同種金属でも異種金属でもどちらでもよく、それらの取り付け方法としては、例えば半田付けや溶接や接着剤による接着やねじによるねじ込みなどが挙げられ、放熱用金属板部５０７およびピン状体５０８の材料の組み合わせによって適切な方法を用いればよい。
【００４１】
また、図５（ｄ）に示すように、図５（ｂ）のように構成した放熱用金属板部５０４に、その放熱用金属板部５０４とは別部材で折り曲げ加工により形成したフィン形状の折り曲げ部５０９を有する折り曲げフィン５１０を取り付けることにより、それらの放熱対象である電子部品に対する放熱効果を増大させることができる。この折り曲げフィン５１０は、放熱用金属板部５０４と同様な放熱効果を有する金属であれば、放熱用金属板部５０４と同種金属でも異種金属でもどちらでもよく、それらの取り付け方法としては、例えば半田付けや溶接や接着剤による接着などが挙げられ、放熱用金属板部５０４および折り曲げフィン５１０の材料の組み合わせによって適切な方法を用いればよい。
【００４２】
【発明の効果】
以上のように本発明によれば、金属製の基板により配線用パターン部と一体的に成形して配線用パターン部面から曲げ起こした金属板部を、配線用パターン部への実装部品内における発生熱を放熱するための放熱器として利用することができる。
【００４３】
そのため、実装部品内における発生熱を、その放熱のための部品である放熱器を別途供給して用いることなく且つその放熱効果の低下を抑えて放熱することができるとともに、部品点数を削減し部品実装工程における作業性を改善することができ、さらに機械的振動に対する信頼性を向上することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態の部品実装用基板の構成を示す斜視図
【図２】同実施の形態の部品実装用基板の製造工程を示す工程説明図
【図３】同実施の形態の製造工程により製造される部品実装用基板の形状図
【図４】同実施の形態における放熱用金属板部の形状図
【図５】別の実施の形態の部品実装用基板における放熱用金属板部の形状図
【図６】従来の部品実装用基板の使用状態例を示す説明図
【符号の説明】
１００配線用パターン部
１０２放熱用金属板部
１０２ａ金属板部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting board for mounting an electronic component such as a semiconductor element and a method for manufacturing the same.
[0002]
[Prior art]
Conventionally, in electronic devices including household appliances such as television receivers, an electronic component is used by using a component mounting board having a wiring pattern portion made of a metal substrate and corresponding to the electronic circuit in the wiring pattern portion. 2. Description of the Related Art Electronic circuit boards configured by forming a metal solid wiring module by mounting a metal solid wiring module on an insulating substrate are widely used.
[0003]
The conventional component mounting board used when forming the metal three-dimensional wiring module as described above will be described with reference to a configuration example showing its use state.
FIG. 6 is a block diagram showing an example of a usage state of a conventional component mounting board. In FIG. 6, a component mounting board 61 having a wiring pattern portion 60 made of a metal flat board is used, and a plurality of electrons constituting an electronic circuit such as a television receiver is formed on the component mounting board 61. The component 62 is mounted, and the electronic component 62 is connected and wired by the wiring pattern portion 60 on the component mounting board 61 to form a metal three-dimensional wiring module 63. The electronic circuit board 65 is configured by being affixed on the insulating substrate 64. Of the plurality of electronic components 62 mounted on the component mounting board 61 in this way, the generated heat is radiated to an electronic component 62h such as a large-capacity transistor that generates heat during operation. For this purpose, a radiator 66 having a heat radiation capacity corresponding to the heat generated by the electronic component 62h is attached to the electronic component 62h with a mounting screw 67 or an adhesive.
[0004]
Note that the wiring pattern portion 60 of the component mounting board 61 is created by, for example, a punching method using a metal flat board.
[0005]
[Problems to be solved by the invention]
However, in the conventional component mounting board as described above, in order to dissipate the generated heat to the electronic component 62h such as a large-capacity transistor which is a mounted component that generates heat during operation, It is necessary to attach and use a heatsink that is a separate component from the mounting substrate 61 and has a heat dissipation capacity corresponding to the heat generated by the electronic component 62h, depending on the number of electronic components 62h mounted. In other words, a large number of radiators 66 must be separately supplied to the component mounting board 61.
[0006]
As a result, the number of production components increases, and the number of man-hours for the entire production process increases due to the increase in man-hours required for component mounting in the production process, the deterioration of workability in the component mounting process, and the complexity of part management. However, it also has a problem that the working efficiency decreases.
[0007]
Further, a radiator 66 is separately supplied as a separate component to the component mounting board 61. As a fixing method for these radiators 66, only the electronic component 62h is attached using a mounting screw 67 or an adhesive. To the electronic component 62h and the component mounting board 61. In the former case, the electronic component 62h is damaged by an external force such as mechanical vibration. Even in this case, the fixing force is weakened with time, and as a result, there is a problem that the reliability of the product against mechanical vibration is lowered.
[0008]
The present invention solves the above-described conventional problems, and does not use heat generated in a mounted component by separately supplying a radiator that is a component for radiating the heat and suppressing a decrease in the radiating effect. Provided are a component mounting board and a manufacturing method thereof, which can dissipate heat, reduce the number of components, improve workability in a component mounting process, and improve reliability against mechanical vibration.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, the component mounting board and the manufacturing method thereof according to the present invention include a metal plate portion formed integrally with a wiring pattern portion by a metal substrate and bent up from the wiring pattern portion surface. Can be used as a heat radiator for dissipating the heat generated in the component mounted on the wiring pattern portion.
[0010]
As described above, the generated heat in the mounted component can be dissipated without separately supplying and using a radiator that is a component for radiating heat, and the heat radiation effect can be suppressed, and the number of components can be reduced. Workability in the component mounting process can be improved, and reliability with respect to mechanical vibration can be improved.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
The component mounting board according to claim 1 of the present invention has a wiring pattern portion formed of a metal substrate, and a plurality of electronic components constituting an electronic circuit are mounted on the wiring pattern portion, A component mounting board for connecting and wiring between the electronic components by the wiring pattern portion, and a metal formed integrally with the wiring pattern portion by a metal substrate forming the wiring pattern portion A plate part, and the metal plate part is configured to be used for heat dissipation of the electronic component that generates heat during operation by bending and raising the pattern part surface for wiring. The metal plate portion is further bent to form a fin-shaped bent portion so as to increase the heat dissipation effect for the electronic component that is the heat dissipation target .
[0012]
The component mounting board according to claim 2 has a wiring pattern portion formed of a metal substrate, and a plurality of electronic components constituting an electronic circuit are mounted on the wiring pattern portion. A component mounting substrate for connecting and wiring between components by the wiring pattern portion, wherein a metal plate portion integrally formed with the wiring pattern portion is formed by a metal substrate forming the wiring pattern portion. And the metal plate portion is configured to be used for heat dissipation of the electronic component that generates heat during operation by bending and raising the pattern portion surface for wiring, and the metal plate portion in the bent and raised state has its heat dissipation It is set as the structure which attached the some fin-like body formed with the member different from the said metal plate part so that the heat dissipation effect with respect to the electronic component which is object could be increased.
[0013]
The component mounting board according to claim 3 has a wiring pattern portion formed of a metal substrate, and a plurality of electronic components constituting an electronic circuit are mounted on the wiring pattern portion. A component mounting substrate for connecting and wiring between components by the wiring pattern portion, wherein a metal plate portion integrally formed with the wiring pattern portion is formed by a metal substrate forming the wiring pattern portion. And the metal plate portion is configured to be used for heat dissipation of the electronic component that generates heat during operation by bending and raising the pattern portion surface for wiring, and the metal plate portion in the bent and raised state has its heat dissipation It is set as the structure which attached the some pin-shaped body formed with the member different from the said metal plate part so that the heat dissipation effect with respect to the electronic component which is object could be increased.
[0014]
The component mounting board according to claim 4 is different from the metal plate portion so that the bent metal plate portion according to claim 1 increases a heat dissipation effect on the electronic component which is a heat dissipation target. A folding fin having a fin-shaped bent portion formed by bending with a member is attached.
[0016]
According to a fifth aspect of the present invention, there is provided a method for manufacturing a component mounting board, wherein a plurality of electronic components constituting an electronic circuit are mounted on a metal substrate, and the wiring pattern portion for connecting and wiring the plurality of electronic components is provided. When forming, a metal plate part that is bent and raised with respect to the wiring pattern part surface is used as the wiring pattern part by the metal substrate to be used for heat dissipation of the electronic component that generates heat during operation. The metal plate portion is bent and raised, and the metal plate portion is further bent so that the heat dissipation effect of the metal plate portion on the heat radiation target electronic component is increased, thereby forming a fin-shaped bent portion. It is set as the method of forming in the said metal plate part .
[0018]
According to a sixth aspect of the present invention, there is provided a method for manufacturing a component mounting board, wherein a plurality of electronic components constituting an electronic circuit are mounted on a metal substrate, and the wiring pattern portion for connecting and wiring the plurality of electronic components is provided. When forming, a metal plate part that is bent and raised with respect to the wiring pattern part surface is used as the wiring pattern part by the metal substrate to be used for heat dissipation of the electronic component that generates heat during operation. A plurality of fins formed as a separate member from the metal plate portion so as to be integrally formed and bent to raise the metal plate portion, and to increase the heat dissipation effect of the metal plate portion to the heat radiation target electronic component The body is attached to the metal plate portion.
[0019]
The method for manufacturing a component mounting board according to claim 7 , wherein a plurality of electronic components constituting an electronic circuit are mounted by a metal substrate, and a wiring pattern portion for connecting and wiring between the plurality of electronic components is provided. When forming, a metal plate part that is bent and raised with respect to the wiring pattern part surface is used as the wiring pattern part by the metal substrate to be used for heat dissipation of the electronic component that generates heat during operation. A plurality of pin shapes formed by separate members from the metal plate portion so as to be integrally formed and bent to raise the metal plate portion, and to increase the heat dissipation effect for the electronic component that is the heat dissipation object of the metal plate portion The body is attached to the metal plate portion.
[0020]
The method for manufacturing a component mounting board according to claim 8 is configured such that the metal plate portion according to claim 5 is bent and raised, and the heat dissipation effect on the electronic component that is the heat dissipation target of the metal plate portion is increased. A method of attaching a bent fin having a fin-shaped bent portion formed by bending with a member different from the metal plate portion to the metal plate portion is used.
[0021]
According to these configurations and methods, the heat generated in the mounting part on the wiring pattern portion is generated by bending the metal plate portion formed integrally with the wiring pattern portion by a metal substrate and bending from the wiring pattern portion surface. It can be used as a radiator to dissipate heat.
[0022]
Hereinafter, a component mounting board and a method for manufacturing the same according to an embodiment of the present invention will be specifically described with reference to the drawings.
FIG. 1 is a perspective view showing a configuration of a metal three-dimensional wiring module using a component mounting board according to the present embodiment. As shown in FIG. 1, a component mounting board K1 used in this metal three-dimensional wiring module has a wiring pattern portion 100 formed of a metal substrate, and an electronic circuit is configured in the wiring pattern portion 100. A plurality of electronic components 101 are mounted, and the electronic components 101 are connected and wired by a metal wiring pattern portion 100. The component mounting board K1 includes a metal plate portion 102a formed integrally with the wiring pattern portion 100 by using the same metal substrate as the substrate on which the wiring pattern portion 100 is formed. The portion 102a is for heat dissipation of an electronic component such as a large-capacity transistor that generates heat during operation among the plurality of electronic components 101 by bending and processing the surface of the wiring pattern portion 100 as indicated by an arrow Y1. Used as the heat dissipating metal plate 102.
[0023]
The component mounting board K1 configured as described above is used for heat dissipation of the above-described large capacity transistor or the like when the wiring pattern portion 100 on which the plurality of electronic components 101 are mounted is formed of a metal board. The metal plate portion 102a that is bent and raised from the surface of the wiring pattern portion 100 for use as a heat radiating metal plate portion 102 is manufactured using a method of integrally forming with the wiring pattern portion 100.
[0024]
In the component mounting board K1 manufactured as described above, solder printing is performed in a state where the reinforcing sheet 103 is attached to a necessary portion such as the wiring pattern portion 100, and then the surface of the wiring pattern portion 100 is printed. The electronic three-dimensional wiring module as shown in FIG. 1 is manufactured by automatically mounting and mounting the electronic component 101 on the solder printing portion and bending the metal plate portion 102a as indicated by the arrow Y1.
[0025]
A specific method for manufacturing the metal three-dimensional wiring module shown in FIG. 1 will be described below using an example of the manufacturing process.
FIG. 2 is a process explanatory view showing an example of a manufacturing method of a metal three-dimensional wiring module using the component mounting board of the present embodiment, and FIG. 3 is a component mounting board K1 at point A of the manufacturing process shown in FIG. FIG. However, in all the manufacturing processes shown in FIG. 2, the final point, which is point B, is usually a metal three-dimensional wiring with a plurality of electronic components 101 already mounted on the wiring pattern portion 100 as shown in FIG. 1. Modules are manufactured.
[0026]
As shown in FIG. 2, in the manufacturing process of the component mounting board K1, which is the first half of the entire manufacturing process, in step # 1, the wiring original shown in FIG. Punching is performed so that a wiring pattern necessary for the pattern unit 100 is formed. At the time of this punching, the metal plate portion 102 a is also integrally formed simultaneously with the wiring pattern portion 100. Further, in this step, a connecting portion 201 is formed between the wiring patterns and between the wiring pattern portion 100 and the outer peripheral portion 200 so that the wiring patterns of the wiring pattern portion 100 are not dispersed. Here, as the metal original plate 202, for example, phosphor bronze having a plate width of 2 to 7 cm and a plate thickness of 0.1 to 0.5 mm is used.
[0027]
In Step # 2, the resin sheet 203 wound in a roll shape is attached to the surface of the wiring pattern portion 100 as a reinforcing sheet 103 that covers the wiring pattern portion 100 punched out in Step # 1. Here, as the resin sheet 203, for example, the insulation resistance exceeds 10 ¹⁰ ohms, the heat resistance exceeds 260 ° C. × 30 seconds, and the thickness is less than 0.05 mm. Curing UV / thermosetting resin or the like is used.
[0028]
In Step # 3, the connecting portion 201 formed in Step # 1 is cut to separate the wiring pattern portion 100 from the outer peripheral portion 200, and the original shape of the component mounting board K1 is created. In Step # 4, Step # 4 2, the resin sheet 203 affixed to the wiring pattern portion 100 surface as the reinforcing sheet 103 is further pressure-bonded and then cured by irradiation with UV light or heat.
[0029]
At point A in the manufacturing process thus advanced, as shown in FIG. 3, the component mounting board K1 in which the reinforcing sheet 103 is bonded to the wiring pattern portion 100 and the metal plate portion 102a is manufactured. Next, the process proceeds to a component mounting process which is the latter half of the entire manufacturing process.
[0030]
In this component mounting process, in Step # 5, a conductive adhesive or cream solder for bonding the electronic component 101 to the surface of the wiring pattern portion 100 is printed on the wiring pattern portion 100 at a necessary position. In step # 6, by attaching the electronic component 101 to the wiring pattern surface of the wiring pattern portion 100, the electronic component 101 is printed on the conductive adhesive or cream solder printed in step # 5. Glue and mount by. Here, as the mounting device for the electronic components 101, for example, a robot type mounting device for mounting the electronic components 101 one by one or a batch mounting device for mounting several electronic components 101 at once is used.
[0031]
In step # 7, the component mounting board K1 on which the electronic component 101 is mounted in step # 6 is reflowed by heating, and the conductive adhesive printed in step # 5 is cured or the cream solder is melted. Then, the electronic component 101 mounted in step # 6 is fixed to the wiring pattern portion 100. Here, as a heating method for the component mounting board K1, for example, a preheatless method for instantaneous reflow, an instantaneous heating stop method for preventing burning at the time of trouble, an infrared partial heating method for partially heating with infrared rays, or the like is used. It is done.
[0032]
In step # 8, the metal plate portion 102a of the component mounting board K1 that has been reflowed in step # 7 is bent and raised to form the heat dissipating metal plate portion 102 that is integrated with the wiring pattern portion 100. To do.
[0033]
In this way, the metal three-dimensional wiring module shown in FIG. 1 is manufactured.
The usage state of the metal three-dimensional wiring module manufactured as described above will be described below using an example of the usage state.
[0034]
FIG. 4 is a cross-sectional configuration diagram showing the shape of the heat dissipating metal plate portion in the metal three-dimensional wiring module using the component mounting board of the present embodiment.
As shown in FIG. 4B, the heat radiating metal plate portion 102 is formed by replacing the metal plate portion 102a formed integrally with the wiring pattern portion 100, which is a component of the component mounting board K1, as indicated by an arrow Y2. It is formed by bending.
[0035]
The component mounting board K1 having the heat radiating metal plate portion 102 formed in this manner is subjected to electronic component mounting or the like according to the component mounting process of the manufacturing process shown in FIG. As shown in FIG. 4A, the three-dimensional wiring module is attached to an insulating substrate 400 to constitute an electronic circuit board K2.
[0036]
In the electronic circuit board K2, as shown in FIG. 4A, an electronic component 101h such as a large-capacity transistor having a large calorific value during operation is dissipated on the metal plate 102 for heat dissipation. It attaches with the attachment screw | thread 401 etc. so that it may closely_contact | adhere to the surface of the metal plate part 102 for an object.
[0037]
As described above, the generated heat in the mounted component can be dissipated without separately supplying and using a radiator that is a component for radiating heat, and the heat radiation effect can be suppressed, and the number of components can be reduced. Workability in the component mounting process can be improved, and reliability with respect to mechanical vibration can be improved.
[0038]
In the component mounting board of the above-described embodiment, as shown in FIG. 5A, the heat radiating metal plate portion 501 is bent from the wiring pattern portion 500. By attaching a plurality of fin-like bodies 502 formed of different members, it is possible to increase the heat dissipation effect on the electronic components that are the heat dissipation targets. The plurality of fin-like bodies 502 may be either the same metal or different metals as the heat dissipating metal plate portion 501 as long as they have a heat dissipating effect similar to that of the heat dissipating metal plate portion 501. For example, soldering, welding, adhesion by an adhesive, and the like can be cited, and an appropriate method may be used depending on a combination of materials of the metal plate for heat dissipation 501 and the fin-like body 502.
[0039]
Further, as shown in FIG. 5B, the heat dissipating metal plate portion 504 bent from the wiring pattern portion 503 is further bent by bending so that the fin-shaped bent portion 505 is bent. By forming the radiating effect, it is possible to increase the heat radiation effect for the electronic components that are the heat radiation targets.
[0040]
Further, as shown in FIG. 5C, a plurality of pin-shaped bodies 508 formed of a member different from the metal plate for heat dissipation 507 are formed on the metal plate for heat dissipation 507 bent from the wiring pattern portion 506. By attaching, the heat radiation effect with respect to the electronic components which are those heat radiation objects can be increased. The plurality of pin-like bodies 508 may be either the same metal or different metals as the metal plate for heat dissipation 507 as long as the metal has a heat dissipation effect similar to that of the metal plate for heat dissipation 507. For example, soldering, welding, bonding with an adhesive, screwing with a screw, or the like may be used, and an appropriate method may be used depending on the combination of materials of the metal plate for heat dissipation 507 and the pin-shaped body 508.
[0041]
Further, as shown in FIG. 5 (d), the fin-shaped metal plate 504 formed as shown in FIG. 5 (b) is formed by bending with a member separate from the heat radiating metal plate 504. By attaching the bending fins 510 having the bent portions 509, it is possible to increase the heat dissipating effect on the electronic components that are the heat dissipating targets. The bent fin 510 may be either the same metal or a different metal as the heat dissipating metal plate portion 504 as long as it is a metal having a heat dissipating effect similar to that of the heat dissipating metal plate portion 504. For example, an appropriate method may be used depending on a combination of materials of the heat radiating metal plate portion 504 and the bending fin 510.
[0042]
【The invention's effect】
As described above, according to the present invention, the metal plate portion formed integrally with the wiring pattern portion by the metal substrate and bent up from the surface of the wiring pattern portion is mounted in the mounting component on the wiring pattern portion. It can be used as a radiator for dissipating generated heat.
[0043]
Therefore, the heat generated in the mounted component can be dissipated without supplying and using a heatsink, which is a component for heat dissipation, while suppressing the decrease in the heat dissipation effect, and the number of components can be reduced. The workability in the mounting process can be improved, and the reliability against mechanical vibration can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a component mounting board according to an embodiment of the present invention. FIG. 2 is a process explanatory view showing a manufacturing process of the component mounting board according to the embodiment. FIG. 4 is a diagram of a heat dissipation metal plate portion in the same embodiment. FIG. 5 is a heat dissipation metal plate in a component mounting substrate of another embodiment. Fig. 6 is an explanatory diagram showing an example of the usage state of a conventional component mounting board.
DESCRIPTION OF SYMBOLS 100 Pattern part for wiring 102 Metal plate part for heat dissipation 102a Metal plate part

Claims

It has a wiring pattern portion formed of a metal substrate, and a plurality of electronic components constituting an electronic circuit are mounted on the wiring pattern portion, and the electronic pattern is connected by the wiring pattern portion. A component mounting board to be wired, comprising a metal plate portion integrally formed with the wiring pattern portion by a metal substrate forming the wiring pattern portion, wherein the metal plate portion is connected to the wiring pattern. It is configured to be used for heat dissipation of the electronic component that generates heat during operation by bending and raising the part surface, so that the heat dissipation effect for the electronic component that is the heat dissipation target is increased in the bent metal plate part. A component mounting board in which the metal plate portion is further bent to form a fin-shaped bent portion .

It has a wiring pattern portion formed of a metal substrate, and a plurality of electronic components constituting an electronic circuit are mounted on the wiring pattern portion, and the electronic pattern is connected by the wiring pattern portion. A component mounting board to be wired, comprising a metal plate portion integrally formed with the wiring pattern portion by a metal substrate forming the wiring pattern portion, wherein the metal plate portion is connected to the wiring pattern. It is configured to be used for heat dissipation of the electronic component that generates heat during operation by bending and raising the part surface, so that the heat dissipation effect for the electronic component that is the heat dissipation target is increased in the bent metal plate part. And a component mounting board on which a plurality of fin-like bodies formed of different members from the metal plate portion are attached .

It has a wiring pattern portion formed of a metal substrate, and a plurality of electronic components constituting an electronic circuit are mounted on the wiring pattern portion, and the electronic pattern is connected by the wiring pattern portion. A component mounting board to be wired, comprising a metal plate portion integrally formed with the wiring pattern portion by a metal substrate forming the wiring pattern portion, wherein the metal plate portion is connected to the wiring pattern. It is configured to be used for heat dissipation of the electronic component that generates heat during operation by bending and raising the part surface, so that the heat dissipation effect for the electronic component that is the heat dissipation target is increased in the bent metal plate part. And a component mounting board on which a plurality of pin-like bodies formed of different members from the metal plate portion are attached.

A bending fin having a fin-shaped bent portion formed by bending with a member different from the metal plate portion is attached to the bent metal plate portion so as to increase the heat dissipation effect for the electronic component that is the heat dissipation target. The component mounting board according to claim 1.

When a plurality of electronic components constituting an electronic circuit are mounted on a metal substrate and a wiring pattern portion is formed to connect and wire between the plurality of electronic components, the electronic component generates heat during operation. In order to use as a metal plate portion that is bent and raised with respect to the wiring pattern portion surface, the metal substrate portion is integrally formed with the wiring pattern portion, and the metal plate portion is bent and raised. A method for manufacturing a component mounting board, wherein the metal plate portion is further bent to form a fin-shaped bent portion in the metal plate portion so as to increase the heat dissipation effect of the metal plate portion on the heat dissipation target electronic component.

When a plurality of electronic components constituting an electronic circuit are mounted on a metal substrate and a wiring pattern portion is formed to connect and wire between the plurality of electronic components, the electronic component generates heat during operation. In order to use as a metal plate portion that is bent and raised with respect to the wiring pattern portion surface, the metal substrate portion is integrally formed with the wiring pattern portion, and the metal plate portion is bent and raised. to increase the heat dissipation effect for the electronic component is a heat radiation target of the metal plate, manufacturing of the substrate to install them component mounting a plurality of fin-like body to the metal plate portion formed of a separate member from the metal plate portion Method.

When a plurality of electronic components constituting an electronic circuit are mounted on a metal substrate and a wiring pattern portion is formed to connect and wire between the plurality of electronic components, the electronic component generates heat during operation. In order to use as a metal plate portion that is bent and raised with respect to the wiring pattern portion surface, the metal substrate portion is integrally formed with the wiring pattern portion, and the metal plate portion is bent and raised. as a heat radiation target of the metal plate portions so as to increase the heat dissipation effect for the electronic component, the metal plate part and Keru substrate mounting components Installing multiple pin-shaped body to the metal plate formed by separate members Production method.

The metal plate portion is bent and raised, and the metal plate portion has a fin-shaped bent portion formed by bending with a member separate from the metal plate portion so as to increase the heat dissipation effect on the electronic component that is the heat dissipation target. The manufacturing method of the component mounting board | substrate of Claim 5 which attaches a bending fin to the said metal plate part.